[go: up one dir, main page]

KR950700677A - 내열성이 양호한 고전도성 혼성물질 - Google Patents

내열성이 양호한 고전도성 혼성물질

Info

Publication number
KR950700677A
KR950700677A KR1019940702783A KR19940702783A KR950700677A KR 950700677 A KR950700677 A KR 950700677A KR 1019940702783 A KR1019940702783 A KR 1019940702783A KR 19940702783 A KR19940702783 A KR 19940702783A KR 950700677 A KR950700677 A KR 950700677A
Authority
KR
South Korea
Prior art keywords
hybrid structure
core material
mechanical properties
thermal conductivity
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1019940702783A
Other languages
English (en)
Inventor
제이. 키블러 존
지. 카씬 토마스
Original Assignee
비. 월터 로젠
머티어리얼스 사이언시스 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=25271318&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR950700677(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 비. 월터 로젠, 머티어리얼스 사이언시스 코포레이션 filed Critical 비. 월터 로젠
Publication of KR950700677A publication Critical patent/KR950700677A/ko
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/16—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer formed of particles, e.g. chips, powder or granules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/16—Layered products comprising a layer of metal next to a particulate layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/041—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12486—Laterally noncoextensive components [e.g., embedded, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12625—Free carbon containing component

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Thermal Sciences (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

본 발명은 높은 열전도성과 인접한 재료들과 조화될 수 있는 소정의 기계적 특성을 갖는 혼성구조물(10)에 대한 것이다. 상기 혼성구조물(10)은 다음 3가지의 요소로 구성되어 있다 ; (1) 혼성구조물의 열전도성을 결정하는 비구조성으로서 높은 열전도성을 갖는 심재(20) ; (2) 혼성구조물의 양 표면들을 형성하고 혼성구조물의 기계적 특성을 결정하는, 심재의 양 측면에 위치하여 면판-심재-면판으로 이루어지는 적층형 구조를 형성하는 1쌍의 면판(30,40) ; (3) 심재를 감싸고 있으며 면판들에 접착되어 혼성구조물의 기계적 특성(면판들을 따라)을 결정하는 것을 돕는 프레임(50). 면판들과 심재사이의 계면(70,80)은 면판들과 심재사이의 물리적 접촉은 허용하나 구조적 상호작용은 방지하는 역할을 하게 된다. 따라서, 혼성구조물은 심재의 열팽창 계수의 상당부분을 수계하는 한편 면판들 및 프레임의 열팽창 특성(및 다른 기계적 특성)을 유지하게 된다.

Description

내열성이 양호한 고전도성 혼성물질
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도는 고전도성 및 조절된 기계적 특성을 갖는 본 발명에 따른 혼성구조물의 사시도이다.

Claims (18)

  1. 높은 열전도성과 인접재료와 조화될 수 있는 소정의 기계적 특성을 갖는 혼성구조물에 있어서, 상기 혼성구조물의 열전도성을 결정하는 비 구조적이며 높은 열전도성을 갖는 심재 ; 쌍으로 이루어지되 그중 하나는 상기 심재의 일측면에 위치하고 다른 하나는 상기 심재의 반대편 측면에 위치하며 면판-심재-면판의 형상으로 되어지는 적층 구조물이 형성되도록 하는, 상기 혼성구조물의 양 측면을 이루며 상기 혼성구조물의 기계적 특성을 결정하는데 도움을 주는 1쌍의 면판들 ; 및 상기 심재를 완전히 감싸며 상기 면판들에 접착되어 상기 혼성구조물의 기계적 특성을 결정하는데 도움을 주는 프레임으로 구성되는 것을 특징으로 하는 혼성구조물.
  2. 제 1 항에 있어서, 상기 심재가 고급 열분해성 흑연, 압축 및 풀림처리된 열분해성 흑연 및 합성 다이아몬드 중에서 선택되는 것을 특징으로 하는 혼성구조물.
  3. 제 2 항에 있어서, 상기 심재가 압축되고 풀림처리된 열분해성 흑연(CAPG)인 것을 특징으로 하는 혼성구조물.
  4. 제 1 항에 있어서, 상기 면판들이 흑연 강화 알루미늄인 것을 특징으로 하는 혼성구조물.
  5. 제 4 항에 있어서, 상기 면판들이 알루미늄기제 내의 피치 120섬유들인 것을 특징으로 하는 혼성구조물.
  6. 제 1 항에 있어서, 상기 프레임이 알루미늄인 것을 특징으로 하는 혼성구조물.
  7. 제 1 항에 있어서, 상기 프레임이 상기 면판들에 융착에 의해서 결합되는 것을 특징으로 하는 혼성구조물.
  8. 제 1 항에 있어서, 상기 프레임이 상기 혼성구조물의 열흐름 방향으로 연장된 다수의 리브들을 갖는 것을 특징으로 하는 혼성구조물.
  9. 제 1 항에 있어서, 상기 심재가 상기 면판들과 상기 심재들 사이에 물리적 접촉이 이루어지도록 약간 압축되는 것을 특징으로 하는 혼성구조물.
  10. 높은 열전도성과 인접 재료와 조화될 수 있는 소정의 기계적 특성을 갖는 혼성구조물에 있어서, 상기 혼성구조물의 열전도성을 결정하는 비 구조적이며 높은 열전도성을 갖은 심재 ; 쌍으로 이루어지되 그중 하나는 상기 심재의 일측면에 위치하고 다른 하나는 상기 심재의 반대편 측면에 위치하여 면판-심재-면판의 형상으로 되어지는 적층 구조물이 형성되도록 하는, 상기 혼성구조물의 양 측면을 이루며 상기 혼성구조물의 기계적 특성을 결정하는데 도움을 주는 1조의 면판들 ; 상기 제 1 면판과 상기 심재 사이에 위치하여 상기 제 1 면판과 상기 심재사이에 물리적 접촉은 허용하나 구조적 상호작용은 방지하는데 제 1 계면 ; 상기 제 2 면판과 상기 심재 사이에 위치하여 상기 제2면판과 상기 심재사이에 물리적 접촉은 허용하나 구조적 상호작용은 방지하는 제2계면; 상기 심재를 완전히 감싸며 상기 면판들에 접착되어 상기 혼성구조물의 기계적 특성을 결정하는데 도움을 주는 프레임으로 구성되는 것을 특성으로 하는 혼성구조물.
  11. 제10항에 있어서, 상기 심재가 고급 열분해성 흑연, 압축 및 풀림처리된 열 분해성 흑연 및 합성 다이아몬드 중에서 선택되는 것을 특성으로 하는 혼성구조물.
  12. 제11항에 있어서, 상기 심재가 압축되고 풀림처리된 열분해성 흑연(CAPG)인 것을 특징으로 하는 혼성구조물.
  13. 제10항에 있어서, 상기 면판들이 흑연 강화 알루미늄인 것을 특징으로 하는 혼성구조물.
  14. 제13항에 있어서, 상기 면판들이 알루미늄 기제 내의 피치 120섬유들인 것을 특징으로 하는 혼성구조물.
  15. 제10항에 있어서, 상기 프레임이 알루미늄인 것을 특징으로 하는 혼성구조물.
  16. 제10항에 있어서, 상기 프레임이 상기 면판들에 융착에 의해서 결합되는 것을 특징으로 하는 혼성구조물.
  17. 제10항에 있어서, 상기 프레임이 상기 혼성구조물의 열흐름 방향으로 연장된 다수의 리브들을 갖는 것을 특징으로 하는 혼성구조물.
  18. 제10항에 있어서, 상기 심재가 상기 면판들과 상기 심재들 사이에 물리적 접촉이 이루어지도록 약간 압축되는 것을 특징으로 하는 혼성구조물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019940702783A 1992-02-14 1992-12-14 내열성이 양호한 고전도성 혼성물질 Ceased KR950700677A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US07/836,130 US5296310A (en) 1992-02-14 1992-02-14 High conductivity hydrid material for thermal management
US07/836,130 1992-02-14
PCT/US1992/010813 WO1993016579A1 (en) 1992-02-14 1992-12-14 High conductivity hybrid material for thermal management

Publications (1)

Publication Number Publication Date
KR950700677A true KR950700677A (ko) 1995-01-16

Family

ID=25271318

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940702783A Ceased KR950700677A (ko) 1992-02-14 1992-12-14 내열성이 양호한 고전도성 혼성물질

Country Status (8)

Country Link
US (1) US5296310A (ko)
EP (1) EP0786196B1 (ko)
JP (1) JPH07503813A (ko)
KR (1) KR950700677A (ko)
AT (1) ATE190460T1 (ko)
CA (1) CA2128872C (ko)
DE (1) DE69230771T2 (ko)
WO (1) WO1993016579A1 (ko)

Families Citing this family (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5981085A (en) * 1996-03-21 1999-11-09 The Furukawa Electric Co., Inc. Composite substrate for heat-generating semiconductor device and semiconductor apparatus using the same
US5863467A (en) * 1996-05-03 1999-01-26 Advanced Ceramics Corporation High thermal conductivity composite and method
IL129448A (en) * 1996-10-25 2003-05-29 Yuzhi Qu Superconducting heat transfer medium
US5876831A (en) * 1997-05-13 1999-03-02 Lockheed Martin Corporation High thermal conductivity plugs for structural panels
US5958572A (en) * 1997-09-30 1999-09-28 Motorola, Inc. Hybrid substrate for cooling an electronic component
US6102112A (en) * 1998-02-17 2000-08-15 Lockheed Martin Corporation Thermally conductive support structure
GB9814835D0 (en) 1998-07-08 1998-09-09 Europ Org For Nuclear Research A thermal management board
US5949650A (en) * 1998-09-02 1999-09-07 Hughes Electronics Corporation Composite heat sink/support structure
US6075701A (en) * 1999-05-14 2000-06-13 Hughes Electronics Corporation Electronic structure having an embedded pyrolytic graphite heat sink material
US6207904B1 (en) 1999-06-02 2001-03-27 Northrop Grumman Corporation Printed wiring board structure having continuous graphite fibers
US6340796B1 (en) 1999-06-02 2002-01-22 Northrop Grumman Corporation Printed wiring board structure with integral metal matrix composite core
CN1178297C (zh) * 1999-12-24 2004-12-01 日本碍子株式会社 散热材料及其制造方法
US6462410B1 (en) 2000-08-17 2002-10-08 Sun Microsystems Inc Integrated circuit component temperature gradient reducer
US6460598B1 (en) 2000-11-27 2002-10-08 Ceramic Process Systems Corporation Heat exchanger cast in metal matrix composite and method of making the same
US7006354B2 (en) * 2001-10-26 2006-02-28 Fujikura Ltd. Heat radiating structure for electronic device
US6661317B2 (en) 2002-03-13 2003-12-09 The Boeing Co. Microwave monolithic integrated circuit assembly with multi-orientation pyrolytic graphite heat-dissipating assembly
JP2003309292A (ja) * 2002-04-15 2003-10-31 Citizen Electronics Co Ltd 表面実装型発光ダイオードのメタルコア基板及びその製造方法
US7141310B2 (en) * 2002-04-17 2006-11-28 Ceramics Process Systems Corporation Metal matrix composite structure and method
US6884522B2 (en) * 2002-04-17 2005-04-26 Ceramics Process Systems Corp. Metal matrix composite structure and method
WO2004097934A2 (en) * 2003-05-01 2004-11-11 Queen Mary & Westfield College An encased thermal management device and method of making such a device
CN1826288A (zh) 2003-09-02 2006-08-30 株式会社钟化 薄膜状石墨及其制造方法
US7220485B2 (en) * 2003-09-19 2007-05-22 Momentive Performance Materials Inc. Bulk high thermal conductivity feedstock and method of making thereof
US7329024B2 (en) * 2003-09-22 2008-02-12 Permlight Products, Inc. Lighting apparatus
US7102172B2 (en) * 2003-10-09 2006-09-05 Permlight Products, Inc. LED luminaire
US20050243556A1 (en) * 2004-04-30 2005-11-03 Manuel Lynch Lighting system and method
US8188503B2 (en) * 2004-05-10 2012-05-29 Permlight Products, Inc. Cuttable illuminated panel
US7918591B2 (en) * 2005-05-13 2011-04-05 Permlight Products, Inc. LED-based luminaire
US20060266496A1 (en) * 2005-05-31 2006-11-30 Sensis Corporation Method and apparatus for dissipating heat
US20070107551A1 (en) * 2005-11-15 2007-05-17 Klett James W Kish-derived graphitic heat spreaders and foils
GB2432830A (en) * 2005-12-02 2007-06-06 Morganite Elect Carbon Formation of thermally anisotropic carbon material
US20070181065A1 (en) * 2006-02-09 2007-08-09 General Electric Company Etch resistant heater and assembly thereof
US20070289730A1 (en) * 2006-06-06 2007-12-20 Chang-Hsin Wu Combination heat-transfer plate member
US20080085403A1 (en) * 2006-10-08 2008-04-10 General Electric Company Heat transfer composite, associated device and method
US7995344B2 (en) * 2007-01-09 2011-08-09 Lockheed Martin Corporation High performance large tolerance heat sink
JP4430112B2 (ja) * 2007-03-28 2010-03-10 古河電気工業株式会社 熱伝導膜、熱伝導膜を備える半導体デバイスおよび電子機器
US8043703B2 (en) * 2007-09-13 2011-10-25 Metal Matrix Cast Composites LLC Thermally conductive graphite reinforced alloys
US8085531B2 (en) * 2009-07-14 2011-12-27 Specialty Minerals (Michigan) Inc. Anisotropic thermal conduction element and manufacturing method
JP4684354B2 (ja) * 2010-04-02 2011-05-18 株式会社カネカ フィルム状グラファイト
US9417013B2 (en) * 2010-11-12 2016-08-16 Toyota Motor Engineering & Manufacturing North America, Inc. Heat transfer systems including heat conducting composite materials
JP5361852B2 (ja) * 2010-12-17 2013-12-04 株式会社カネカ フィルム状グラファイトとその製造方法
US8816220B2 (en) * 2011-01-28 2014-08-26 Raytheon Company Enclosure cooling apparatus
US10347559B2 (en) 2011-03-16 2019-07-09 Momentive Performance Materials Inc. High thermal conductivity/low coefficient of thermal expansion composites
JP5837754B2 (ja) * 2011-03-23 2015-12-24 Ｄｏｗａメタルテック株式会社 金属−セラミックス接合基板およびその製造方法
US11105567B2 (en) 2012-09-25 2021-08-31 Momentive Performance Materials Quartz, Inc. Thermal management assembly comprising bulk graphene material
US9941185B2 (en) 2013-09-20 2018-04-10 GE Intelligent Platforms, Inc Variable heat conductor
FR3042065B1 (fr) * 2015-10-06 2017-12-01 Thales Sa Procede de fabrication d'un drain thermique et drain thermique associe
US11335621B2 (en) * 2016-07-19 2022-05-17 International Business Machines Corporation Composite thermal interface objects
CN111587210A (zh) 2017-12-29 2020-08-25 空中客车防务和空间公司 高传导性热连结件
CN117096105A (zh) * 2018-01-30 2023-11-21 京瓷株式会社 电子元件搭载用基板、电子装置以及电子模块
US10955433B2 (en) 2018-03-23 2021-03-23 Rosemount Aerospace Inc. Hybrid material aircraft sensors having an encapsulated insert in a probe wall formed from a higher conductive material than the probe wall
KR102807539B1 (ko) * 2020-02-25 2025-05-13 현대자동차주식회사 양면 냉각형 파워모듈
EP4114250B1 (en) 2020-03-02 2025-09-10 Tallinn University of Technology Method for cuff-less beat-to-beat blood pressure estimation using two relative blood volume sensors on different applied pressures
US20220192005A1 (en) * 2020-12-16 2022-06-16 Bae Systems Information And Electronic Systems Integration Inc. Highly optimized electronic module design
US12200910B2 (en) 2022-01-14 2025-01-14 Raytheon Company Clamped pyrolytic graphite sheets for heat spreading

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2820751A (en) * 1952-12-01 1958-01-21 Henry A Saller Process for producing jacketed bodies
US3328642A (en) * 1964-06-08 1967-06-27 Sylvania Electric Prod Temperature control means utilizing a heat reservoir containing meltable material
US3427706A (en) * 1964-11-13 1969-02-18 Douglas Aircraft Co Inc Sandwich structures and method
US3616115A (en) * 1968-09-24 1971-10-26 North American Rockwell Lightweight ballistic armor
US3678995A (en) * 1970-06-22 1972-07-25 Rca Corp Support for electrical components and method of making the same
JPS5317970A (en) * 1976-08-04 1978-02-18 Fujitsu Ltd Copper stacking board
JPS57130441A (en) * 1981-02-06 1982-08-12 Hitachi Ltd Integrated circuit device
JPS5922399B2 (ja) * 1981-10-14 1984-05-26 日本電気株式会社 多層セラミツク基板
JPS6083831A (ja) * 1983-10-14 1985-05-13 三菱電機株式会社 熱伝導性銅張り積層板
JPS60170287A (ja) * 1984-02-14 1985-09-03 信越化学工業株式会社 銅張積層基板
DE3566483D1 (en) * 1984-06-30 1988-12-29 Akzo Gmbh Flexible polyimide multilayer laminate
US4601941A (en) * 1984-09-07 1986-07-22 Shell Oil Company High heat metal-polymer laminate
US4640065A (en) * 1985-10-07 1987-02-03 Owens-Corning Fiberglas Corporation Structural member
US4888247A (en) * 1986-08-27 1989-12-19 General Electric Company Low-thermal-expansion, heat conducting laminates having layers of metal and reinforced polymer matrix composite
FR2616997B1 (fr) * 1987-06-16 1989-08-25 Thomson Csf Support pour circuit imprime, formant drain thermique a dilatation controlee, et procede de fabrication
JPS649882A (en) * 1987-07-02 1989-01-13 Kobe Steel Ltd High-thermal conductivity part and production thereof
AT389832B (de) * 1988-08-01 1990-02-12 Plansee Metallwerk Loetverbindung
CA1316303C (en) * 1988-12-23 1993-04-20 Thijs Eerkes Composite structure
FR2654387B1 (fr) * 1989-11-16 1992-04-10 Lorraine Carbone Materiau multicouche comprenant du graphite souple renforce mecaniquement, electriquement et thermiquement par un metal et procede de fabrication.
US4996116A (en) * 1989-12-21 1991-02-26 General Electric Company Enhanced direct bond structure
US5039577A (en) * 1990-05-31 1991-08-13 Hughes Aircraft Company Hybrid metal matrix composite chassis structure for electronic circuits
EP0471552B1 (en) * 1990-08-14 1997-07-02 Texas Instruments Incorporated Heat transfer module for ultra high density and silicon on silicon packaging applications

Also Published As

Publication number Publication date
EP0786196B1 (en) 2000-03-08
DE69230771D1 (de) 2000-04-13
EP0786196A4 (ko) 1997-07-30
CA2128872C (en) 2003-09-16
DE69230771T2 (de) 2000-10-19
CA2128872A1 (en) 1993-08-19
US5296310A (en) 1994-03-22
JPH07503813A (ja) 1995-04-20
ATE190460T1 (de) 2000-03-15
WO1993016579A1 (en) 1993-08-19
EP0786196A1 (en) 1997-07-30

Similar Documents

Publication Publication Date Title
KR950700677A (ko) 내열성이 양호한 고전도성 혼성물질
KR870010641A (ko) 압전 소자(Piezo Electric Device)
KR890013829A (ko) 접착성 열융착형 인터커넥터 및 그 제조방법
DK0635088T3 (da) Bygningsplade og bygning dannet deraf
DK272887A (da) Kraftige sandwichelementer
DK409483D0 (da) Flerdobbelt plade med forbindelsesvaegge mellem pladerne
KR920700107A (ko) 복합재료 기포질 샌드위치 구조
KR870005801A (ko) 단열판넬 구조물
ES283405U (es) Dispositivo para partes de construccion de gran superficie en forma de placa
DE3862495D1 (de) Bauelement, insbesondere verkleidungselement mit integrierter waermedaemmung.
BR0105024A (pt) Folha composta
JP2000073605A (ja) 粘弾性壁
KR860007087A (ko) 적층판(plywood)의 제조방법
EP0081010A3 (en) Interrupted cell honeycomb structure
CN223384068U (zh) 蜂窝板
JPS55152397A (en) Plate type heat exchanger
KR840007936A (ko) 철근 구조물
JP3014260U (ja) 窓ガラス用断熱ボード板
JPS57147287A (en) Manufacture of radiation thermocouple
Shimodaira et al. Fiber Reinforced Plastic Reflector
JPH10235762A (ja) ハニカムパネルおよびその製造方法
JPH042041Y2 (ko)
KR970075702A (ko) 온돌배관판
JPS56121995A (en) Manufacture of heat exchanger
JPS5986790A (ja) 断熱スペ−サ

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 19940812

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 19971203

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20000428

Patent event code: PE09021S01D

E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20001031

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20000428

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I