KR970010866A - 에폭시-함유 수계 광영상화 조성물 - Google Patents
에폭시-함유 수계 광영상화 조성물 Download PDFInfo
- Publication number
- KR970010866A KR970010866A KR1019960030552A KR19960030552A KR970010866A KR 970010866 A KR970010866 A KR 970010866A KR 1019960030552 A KR1019960030552 A KR 1019960030552A KR 19960030552 A KR19960030552 A KR 19960030552A KR 970010866 A KR970010866 A KR 970010866A
- Authority
- KR
- South Korea
- Prior art keywords
- weight
- epoxy
- weight percent
- water
- molecular weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/106—Binder containing
- Y10S430/111—Polymer of unsaturated acid or ester
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Materials For Photolithography (AREA)
- Paints Or Removers (AREA)
- Epoxy Resins (AREA)
Abstract
Description
Claims (1)
- 하기 (A) 내지 (F) 성분을 포함하는 광영상화 조성물로서, 이 조성물은 수성매체중에 포함되며, 기판으로서 한 층에 도포되는 경우 알칼리성 수용액중에 현상가능하며, 현상 후 경질로 영구적으로 경화되는 광영상화 조성물(하기 중량%는 (A) 내지 (F)의 총중량을 기준으로 함); A) 약 125 내지 약 200의 산가, 약 20,000 내지 약 80,000의 수평균 분자량을 갖는 라텍스 아크릴 결합제 중합체 약 25 내지 약 40중량%; B) 약 100 내지 약 700의 에폭시 당량을 갖는 수계 에폭시 수지 약 13 내지 약 30중량%; C) 광중합가능하며, 다작용성이고, 약 500 내지 약 2000의 분자량을 갖는 α,β-에틸렌계 불포화 단량체 및/또는 단쇄 올리고머 약 20 내지 약 25중량%; D) 자유-라디칼 발생 화학 시스템 약 4 내지 약 20중량%; E) 에폭시 경화제 및/또는 경화 촉매 약 0.5 내지 약 10중량%; 및 F) 계면 활성제(들) 약 3 내지 약 12중량%.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/509,887 US5925499A (en) | 1995-08-01 | 1995-08-01 | Epoxy-containing waterborne photoimageable composition |
| US8/509,887 | 1995-08-01 | ||
| US08/509,887 | 1995-08-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR970010866A true KR970010866A (ko) | 1997-03-27 |
| KR100211200B1 KR100211200B1 (ko) | 1999-07-15 |
Family
ID=24028506
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019960030552A Expired - Fee Related KR100211200B1 (ko) | 1995-08-01 | 1996-07-26 | 에폭시-함유 수계 광영상화 조성물 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US5925499A (ko) |
| EP (1) | EP0762209A1 (ko) |
| JP (1) | JP2966350B2 (ko) |
| KR (1) | KR100211200B1 (ko) |
| CN (1) | CN1145480A (ko) |
| CA (1) | CA2182463A1 (ko) |
| IL (1) | IL118896A0 (ko) |
| SG (1) | SG55221A1 (ko) |
| TW (1) | TW350931B (ko) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102247821B1 (ko) * | 2021-03-18 | 2021-05-06 | (주)와이앤피홀딩스 | 기능성 석탄첨가제 및 석탄첨가제 제조방법 |
| WO2025178145A1 (ko) * | 2024-02-20 | 2025-08-28 | 주식회사 에너지파워 | 기능성 석탄첨가제 및 석탄첨가제 제조방법 |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000002091A1 (fr) * | 1998-07-07 | 2000-01-13 | Kansai Paint Co., Ltd. | Composition de resist de soudage a base d'eau |
| DE69906195T2 (de) * | 1998-07-31 | 2003-10-09 | Dai Nippon Printing Co., Ltd. | Fotoempfindliche Harzzusammensetzung und Farbfilter |
| JP2001222103A (ja) * | 1999-08-05 | 2001-08-17 | Nippon Paint Co Ltd | 水性フォトソルダーレジスト組成物 |
| US6784024B2 (en) * | 2000-01-18 | 2004-08-31 | Micron Technology, Inc. | Die attach curing method for semiconductor device |
| DE10119127A1 (de) * | 2001-04-19 | 2002-10-24 | Cognis Deutschland Gmbh | Wäßrige Beschichtungszusammensetzungen auf Basis von Epoxidharzen |
| JP4175079B2 (ja) * | 2002-10-17 | 2008-11-05 | 日立化成工業株式会社 | 感光性樹脂組成物およびこれを用いた感光性エレメント |
| PL2078063T3 (pl) * | 2006-10-24 | 2010-09-30 | Whitford B V | Kompozycja powłoki nieprzywierającej |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3929743A (en) * | 1972-10-10 | 1975-12-30 | Johnson & Son Inc S C | Polyampholytes |
| US4092443A (en) * | 1976-02-19 | 1978-05-30 | Ciba-Geigy Corporation | Method for making reinforced composites |
| JPS568146A (en) * | 1979-07-03 | 1981-01-27 | Kansai Paint Co Ltd | Manufacture of screen plate material |
| US5364736A (en) * | 1987-12-07 | 1994-11-15 | Morton International, Inc. | Photoimageable compositions |
| JP2694037B2 (ja) * | 1987-12-07 | 1997-12-24 | モートン サイオコール,インコーポレイティド | 光画像形成組成物,ドライフィルムの調製方法及び光画像形成要素 |
| US5045435A (en) * | 1988-11-25 | 1991-09-03 | Armstrong World Industries, Inc. | Water-borne, alkali-developable, photoresist coating compositions and their preparation |
| US5229252A (en) * | 1989-06-09 | 1993-07-20 | Morton International, Inc. | Photoimageable compositions |
| DE3931467A1 (de) * | 1989-09-21 | 1991-04-04 | Hoechst Ag | Durch strahlung polymerisierbares gemisch und verfahren zur herstellung einer loetstopmaske |
| DE59108989D1 (de) * | 1990-12-18 | 1998-06-25 | Ciba Geigy Ag | Strahlungsempfindliche Zusammensetzung auf Basis von Wasser als Lösungs- bzw. Dispersionsmittel |
| DE4234072A1 (de) * | 1992-10-09 | 1994-04-14 | Morton Int Inc | Durch Strahlung polymerisierbares Gemisch und Verfahren zur Herstellung einer Lötstoppmaske |
| US5439779A (en) * | 1993-02-22 | 1995-08-08 | International Business Machines Corporation | Aqueous soldermask |
| DE69502741T2 (de) * | 1994-01-10 | 1998-10-01 | Du Pont | Lichtempfindliche wässrige Emulsion, lichtempfindlicher Film und Verfahren zur Herstellung |
| US5364737A (en) * | 1994-01-25 | 1994-11-15 | Morton International, Inc. | Waterbone photoresists having associate thickeners |
| AU660881B1 (en) * | 1994-01-25 | 1995-07-06 | Morton International, Inc. | Waterborne photoresists having binders neutralized with amino acrylates |
| TW353158B (en) * | 1994-03-09 | 1999-02-21 | Nat Starch Chem Invest | Aqueous photoresist composition, method for preparing the same and circuit board comprising thereof |
| US5458921A (en) * | 1994-10-11 | 1995-10-17 | Morton International, Inc. | Solvent system for forming films of photoimageable compositions |
-
1995
- 1995-08-01 US US08/509,887 patent/US5925499A/en not_active Expired - Fee Related
-
1996
- 1996-07-21 IL IL11889696A patent/IL118896A0/xx unknown
- 1996-07-26 SG SG1996010381A patent/SG55221A1/en unknown
- 1996-07-26 KR KR1019960030552A patent/KR100211200B1/ko not_active Expired - Fee Related
- 1996-07-31 CA CA002182463A patent/CA2182463A1/en not_active Abandoned
- 1996-07-31 EP EP96305608A patent/EP0762209A1/en not_active Ceased
- 1996-08-01 JP JP8203772A patent/JP2966350B2/ja not_active Expired - Lifetime
- 1996-08-01 CN CN96110910A patent/CN1145480A/zh active Pending
- 1996-08-27 TW TW085110420A patent/TW350931B/zh active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102247821B1 (ko) * | 2021-03-18 | 2021-05-06 | (주)와이앤피홀딩스 | 기능성 석탄첨가제 및 석탄첨가제 제조방법 |
| WO2025178145A1 (ko) * | 2024-02-20 | 2025-08-28 | 주식회사 에너지파워 | 기능성 석탄첨가제 및 석탄첨가제 제조방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| US5925499A (en) | 1999-07-20 |
| CN1145480A (zh) | 1997-03-19 |
| IL118896A0 (en) | 1996-10-31 |
| EP0762209A1 (en) | 1997-03-12 |
| TW350931B (en) | 1999-01-21 |
| KR100211200B1 (ko) | 1999-07-15 |
| JPH09120161A (ja) | 1997-05-06 |
| CA2182463A1 (en) | 1997-02-02 |
| JP2966350B2 (ja) | 1999-10-25 |
| SG55221A1 (en) | 1998-12-21 |
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