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KR970030708A - Method and apparatus for manufacturing semiconductor chip package using in-line capable tap process - Google Patents

Method and apparatus for manufacturing semiconductor chip package using in-line capable tap process Download PDF

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Publication number
KR970030708A
KR970030708A KR1019950041031A KR19950041031A KR970030708A KR 970030708 A KR970030708 A KR 970030708A KR 1019950041031 A KR1019950041031 A KR 1019950041031A KR 19950041031 A KR19950041031 A KR 19950041031A KR 970030708 A KR970030708 A KR 970030708A
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KR
South Korea
Prior art keywords
semiconductor chip
bonding
lead frame
chip package
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1019950041031A
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Korean (ko)
Inventor
진호태
노재기
조경복
최희국
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019950041031A priority Critical patent/KR970030708A/en
Publication of KR970030708A publication Critical patent/KR970030708A/en
Withdrawn legal-status Critical Current

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Abstract

본 발명은 웨이퍼로부터 반도체 칩을 선택하는 픽업 단계와 반도체 칩의 전기적인 연결 단자인 본딩 패드와 와이어 본딩 방법으로 전도성 금속을 이용하여 금속 범프를 형성하는 와이어 범핑 단계 및 리드 프레임의 리드 또는 전도성 테이프에 반도체 칩의 범프를 직접 접착시키는 탭 단계가 하나의 공정 라인에서 진행되도록 함으로써 생산성 향상과 원가 절감에 기여하기 위한 것으로서, 반도체 칩 픽업 단계와 칩과 리드 프레임을 접착하는 단계 사이에 본드 헤드를 하나 또는 두개 이상 설치하는 것을 특징으로 한다.The present invention relates to a picking step of selecting a semiconductor chip from a wafer, a wire bumping step of forming a metal bump using a conductive metal, and a bonding pad and a wire bonding method, which are electrically connecting terminals of the semiconductor chip, and a lead or conductive tape of a lead frame. The tap step of directly bonding the bumps of the semiconductor chip is performed in one process line to contribute to productivity and cost reduction. A bond head is connected between the semiconductor chip pick-up step and the step of bonding the chip and the lead frame. It is characterized by installing two or more.

Description

인-라인이 가능한 탭 공정을 이용한 반도체 칩 패키지 제조 방법 및 장치Method and apparatus for manufacturing semiconductor chip package using in-line capable tap process

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제 3도는 본 발명에 따른 다이 픽-업 후 와이어 범프를 형성하고 탭 단계를 진행하는 탭 공정을 설명하기 위한 개략도.3 is a schematic diagram illustrating a tap process of forming a wire bump after a die pick-up and proceeding a tap step according to the present invention.

제 4도는 제 3도의 탭 공정에서 금속 범프 형성 과정을 설명하기 위한 부분 확대도.4 is a partially enlarged view for explaining a metal bump forming process in the tap process of FIG.

제 5a도 내지 제5d도는 본 발명에 따른 와이어 범프를 형성하는 단계를 설명하기 위한 공정 흐름도.5a to 5d are process flow diagrams for explaining the step of forming a wire bump according to the present invention.

Claims (6)

복수의 본딩 패드를 갖는 반도체 칩이 복수개 형성되어 있는 웨이퍼로부터 반도체 칩을 선택하여 집어 올리는 다이 픽업 단계와, 상기 반도체 칩을 히트 스테이지에 올려 놓고 본딩 패드에 와이어 볼을 형성하는 단계와, 상기 반도체 칩을 리드 프레임과 정렬시키는 단계와, 상기 반도체 칩의 본딩 패드에 형성되어 있는 와이어 볼과 상기 리드 프레임의 내부 리드를 압착하여 접착시키는 탭(TAB) 단계를 구비하는 반도체 칩 패키지 제조방법에 있어서, 상기 단계들은 하나의 공정 라인에서 진행되는 것을 특징으로 하는 반도체 칩 패키지 제조방법.A die pick-up step of selecting and picking up a semiconductor chip from a wafer on which a plurality of semiconductor chips having a plurality of bonding pads are formed; forming a wire ball on a bonding pad by placing the semiconductor chip on a heat stage; And a tab (TAB) for pressing and bonding the wire ball formed on the bonding pad of the semiconductor chip and the internal lead of the lead frame, wherein the tab is aligned with the lead frame. Wherein the steps are performed in one process line. 제 1항에 있어서, 상기 히트 스테이지는 모터에 의해 직선 운동과 회전 운동을 하는 것을 특징으로 하는 반도체 칩 패키지 제조방법.The method of claim 1, wherein the heat stage performs linear motion and rotational motion by a motor. 반도체 칩 패키지 제조 장치로서, 웨이퍼로부터 소정의 반도체 칩을 선택하여 이송하는 칩 이송 기구와, 이송된 반도체 칩을 고정시키고 일정한 온도로 가열하는 히트 스테이지와, 상기 반도체 칩에 형성되어 있는 본딩 패드에 와이어 볼을 형성하기 위해 캐필러리, 클램프를 갖는 본드 헤드와, 와이어 볼과 리드 프레임의 내부 리드를 압착하기 위한 접착 헤드를 구비하는 것을 특징으로 하는 반도체 칩 패키지 제조 장치.A semiconductor chip package manufacturing apparatus comprising: a chip transfer mechanism for selecting and transferring a predetermined semiconductor chip from a wafer, a heat stage for fixing and heating the transferred semiconductor chip to a constant temperature, and a bonding pad formed on the semiconductor chip. An apparatus for manufacturing a semiconductor chip package, comprising: a bond head having a capillary and a clamp to form a ball; and an adhesive head for pressing the wire ball and an internal lead of the lead frame. 제 3항에 있어서, 상기 히트 스테이지는 상기 반도체 칩을 진공에 의해 고정하는 것을 특징으로 하는 반도체 칩 패키지 제조 장치.The apparatus of claim 3, wherein the heat stage fixes the semiconductor chip by vacuum. 제 3항에 있어서, 상기 캐필러리는 와이어와 연결되어 있고, 상기 클램프는 와이어 볼이 형성된 다음 그 끝부분을 절단하는 것을 특징으로 하는 반도체 칩 패키지 제조 장치.The apparatus of claim 3, wherein the capillary is connected to a wire, and the clamp cuts an end portion thereof after the wire ball is formed. 제 3항에 있어서, 상기 본딩 헤드는 적어도 2개 이상 설치되어 있는 것을 특징으로 하는 반도체 칩 패키지 제조 장치.4. The semiconductor chip package manufacturing apparatus according to claim 3, wherein at least two bonding heads are provided. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950041031A 1995-11-13 1995-11-13 Method and apparatus for manufacturing semiconductor chip package using in-line capable tap process Withdrawn KR970030708A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950041031A KR970030708A (en) 1995-11-13 1995-11-13 Method and apparatus for manufacturing semiconductor chip package using in-line capable tap process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950041031A KR970030708A (en) 1995-11-13 1995-11-13 Method and apparatus for manufacturing semiconductor chip package using in-line capable tap process

Publications (1)

Publication Number Publication Date
KR970030708A true KR970030708A (en) 1997-06-26

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950041031A Withdrawn KR970030708A (en) 1995-11-13 1995-11-13 Method and apparatus for manufacturing semiconductor chip package using in-line capable tap process

Country Status (1)

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KR (1) KR970030708A (en)

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Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 19951113

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid