SG11201707558SA - Gaas thin film grown on si substrate, and preparation method for gaas thin film grown on si substrate - Google Patents
Gaas thin film grown on si substrate, and preparation method for gaas thin film grown on si substrateInfo
- Publication number
- SG11201707558SA SG11201707558SA SG11201707558SA SG11201707558SA SG11201707558SA SG 11201707558S A SG11201707558S A SG 11201707558SA SG 11201707558S A SG11201707558S A SG 11201707558SA SG 11201707558S A SG11201707558S A SG 11201707558SA SG 11201707558S A SG11201707558S A SG 11201707558SA
- Authority
- SG
- Singapore
- Prior art keywords
- substrate
- thin film
- film grown
- gaas thin
- preparation
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title 2
- 239000010409 thin film Substances 0.000 title 2
- 238000002360 preparation method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02494—Structure
- H01L21/02496—Layer structure
- H01L21/02505—Layer structure consisting of more than two layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/14—Shape of semiconductor bodies; Shapes, relative sizes or dispositions of semiconductor regions within semiconductor bodies
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/10—Heating of the reaction chamber or the substrate
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/18—Epitaxial-layer growth characterised by the substrate
- C30B25/183—Epitaxial-layer growth characterised by the substrate being provided with a buffer layer, e.g. a lattice matching layer
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/42—Gallium arsenide
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02381—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/02433—Crystal orientation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02455—Group 13/15 materials
- H01L21/02463—Arsenides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/02546—Arsenides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02658—Pretreatments
- H01L21/02661—In-situ cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02694—Controlling the interface between substrate and epitaxial layer, e.g. by ion implantation followed by annealing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
- H01L21/3245—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering of AIIIBV compounds
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/127—The active layers comprising only Group III-V materials, e.g. GaAs or InP
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/127—The active layers comprising only Group III-V materials, e.g. GaAs or InP
- H10F71/1276—The active layers comprising only Group III-V materials, e.g. GaAs or InP comprising growth substrates not made of Group III-V materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/128—Annealing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/12—Active materials
- H10F77/124—Active materials comprising only Group III-V materials, e.g. GaAs
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/544—Solar cells from Group III-V materials
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Recrystallisation Techniques (AREA)
- Chemical Vapour Deposition (AREA)
- Photovoltaic Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510466401.0A CN105023962B (en) | 2015-07-30 | 2015-07-30 | A kind of GaAs thin film grown on Si substrate and preparation method thereof |
| PCT/CN2016/095921 WO2017016527A2 (en) | 2015-07-30 | 2016-08-18 | Gaas thin film grown on si substrate, and preparation method for gaas thin film grown on si substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201707558SA true SG11201707558SA (en) | 2017-10-30 |
Family
ID=54413787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201707558SA SG11201707558SA (en) | 2015-07-30 | 2016-08-18 | Gaas thin film grown on si substrate, and preparation method for gaas thin film grown on si substrate |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US10541133B2 (en) |
| CN (1) | CN105023962B (en) |
| SG (1) | SG11201707558SA (en) |
| WO (1) | WO2017016527A2 (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105023962B (en) * | 2015-07-30 | 2017-03-08 | 华南理工大学 | A kind of GaAs thin film grown on Si substrate and preparation method thereof |
| CN105624792B (en) * | 2016-03-24 | 2019-07-05 | 中国科学院半导体研究所 | A kind of silicon substrate GaAs monocrystal thin films and preparation method thereof |
| CN105938856B (en) * | 2016-06-27 | 2018-02-09 | 山东浪潮华光光电子股份有限公司 | A kind of Si substrates GaAs unijunction solar cell structures and preparation method thereof |
| CN106435721A (en) * | 2016-09-22 | 2017-02-22 | 东莞市联洲知识产权运营管理有限公司 | A kind of preparation method of GaAs/Si epitaxial material |
| CN107293611A (en) * | 2017-07-04 | 2017-10-24 | 上海集成电路研发中心有限公司 | Short-wave infrared diode and forming method thereof |
| TWI725418B (en) * | 2019-04-24 | 2021-04-21 | 行政院原子能委員會核能研究所 | Structure of epitaxial on heterogeneous substrate and preparation method |
| CN112420511A (en) * | 2020-11-23 | 2021-02-26 | 陕西科技大学 | Annealing treatment method of GaAs substrate |
| US20240177990A1 (en) * | 2022-11-29 | 2024-05-30 | Applied Materials, Inc. | Oxidation conformality improvement with in-situ integrated processing |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6316680A (en) * | 1986-07-08 | 1988-01-23 | Mitsubishi Electric Corp | GaAs solar cell and its manufacturing method |
| US5238869A (en) * | 1988-07-25 | 1993-08-24 | Texas Instruments Incorporated | Method of forming an epitaxial layer on a heterointerface |
| JP3364696B2 (en) | 1994-02-28 | 2003-01-08 | 三洋電機株式会社 | Method for producing group III-V compound thin film |
| TWI221001B (en) | 2003-07-28 | 2004-09-11 | Univ Nat Chiao Tung | A method for growing a GaAs epitaxial layer on Ge/GeSi/Si substrate |
| US8299351B2 (en) * | 2009-02-24 | 2012-10-30 | Hong Kong Applied Science And Technology Research Institute Co., Ltd. | Epitaxial growth of III-V compounds on (111) silicon for solar cells |
| CN103762256B (en) * | 2014-01-15 | 2016-03-02 | 华南理工大学 | InGaAs film grown on Si substrate and its preparation method |
| CN204834639U (en) * | 2015-07-30 | 2015-12-02 | 华南理工大学 | GaAs film of growth on si substrate |
| CN105023962B (en) | 2015-07-30 | 2017-03-08 | 华南理工大学 | A kind of GaAs thin film grown on Si substrate and preparation method thereof |
-
2015
- 2015-07-30 CN CN201510466401.0A patent/CN105023962B/en active Active
-
2016
- 2016-08-18 WO PCT/CN2016/095921 patent/WO2017016527A2/en active Application Filing
- 2016-08-18 US US15/563,599 patent/US10541133B2/en active Active
- 2016-08-18 SG SG11201707558SA patent/SG11201707558SA/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CN105023962A (en) | 2015-11-04 |
| WO2017016527A3 (en) | 2017-06-22 |
| WO2017016527A2 (en) | 2017-02-02 |
| CN105023962B (en) | 2017-03-08 |
| US20180090316A1 (en) | 2018-03-29 |
| US10541133B2 (en) | 2020-01-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP3497715B8 (en) | Backside semiconductor growth | |
| SG11201707558SA (en) | Gaas thin film grown on si substrate, and preparation method for gaas thin film grown on si substrate | |
| EP3228733A4 (en) | Method for producing silicon carbide single crystal, and silicon carbide single crystal substrate | |
| EP3208828A4 (en) | Method for bonding substrates together, and substrate bonding device | |
| EP3288063A4 (en) | Pre-alignment device and method for wafer | |
| EP3564340A4 (en) | Quantum dot material, preparation method therefor, and semiconductor device | |
| SG11201710300SA (en) | Substrate holding device, film deposition device, and substrate holding method | |
| EP3282475A4 (en) | Substrate holding method, substrate holding device, processing method and processing device | |
| EP3007209A4 (en) | Method for manufacturing sic single-crystal substrate for epitaxial sic wafer, and sic single-crystal substrate for epitaxial sic wafer | |
| EP3103899A4 (en) | Method for producing group-iii nitride crystal, group-iii nitride crystal, semiconductor device, and device for producing group-iii nitride crystal | |
| SG11201605743UA (en) | Ingaas film grown on si substrate and method for manufacturing same | |
| EP3125297A4 (en) | Silicon carbide semiconductor device, and method for manufacturing same | |
| EP3255181A4 (en) | GaN SINGLE CRYSTAL AND METHOD FOR MANUFACTURING GaN SINGLE CRYSTAL | |
| EP3219833A4 (en) | Device for manufacturing group-iii nitride single crystal, method for manufacturing group-iii nitride single crystal using same, and aluminum nitride single crystal | |
| EP3223303A4 (en) | Etching method for sic substrate and holding container | |
| EP3128047A4 (en) | METHOD FOR REMOVING WORK-AFFECTED LAYER ON SiC SEED CRYSTAL, SiC SEED CRYSTAL, AND SiC SUBSTRATE MANUFACTURING METHOD | |
| EP3257811A4 (en) | Smooth-surfaced graphite film and method for producing same | |
| EP3255658A4 (en) | Method for manufacturing semiconductor device, and underfill film | |
| EP3193357A4 (en) | Method for processing semiconductor wafer, method for manufacturing bonded wafer, and method for manufacturing epitaxial wafer | |
| EP3239100A4 (en) | Composite substrate, method for forming nanocarbon film, and nanocarbon film | |
| SG10201705697RA (en) | Dicing-tape-integrated film for semiconductor back surface, and method for producing semiconductor device | |
| EP3260581A4 (en) | Method for producing silicon carbide single crystal epitaxial wafer and silicon carbide single crystal epitaxial wafer | |
| EP3242157A4 (en) | Colour film substrate, preparation method therefor and display device | |
| EP3171390A4 (en) | Thin substrate, method for manufacturing same, and method for transporting substrate | |
| EP3366817A4 (en) | Base substrate, method for manufacturing base substrate, and method for manufacturing group 13 nitride crystal |