SG11201901065TA - Imprint material - Google Patents
Imprint materialInfo
- Publication number
- SG11201901065TA SG11201901065TA SG11201901065TA SG11201901065TA SG11201901065TA SG 11201901065T A SG11201901065T A SG 11201901065TA SG 11201901065T A SG11201901065T A SG 11201901065TA SG 11201901065T A SG11201901065T A SG 11201901065TA SG 11201901065T A SG11201901065T A SG 11201901065TA
- Authority
- SG
- Singapore
- Prior art keywords
- imprint material
- component
- group
- compound
- independently
- Prior art date
Links
- 239000000463 material Substances 0.000 title abstract 4
- 150000001875 compounds Chemical class 0.000 abstract 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 abstract 1
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical group C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 abstract 1
- 125000002723 alicyclic group Chemical group 0.000 abstract 1
- 125000002947 alkylene group Chemical group 0.000 abstract 1
- 229910052799 carbon Inorganic materials 0.000 abstract 1
- 125000004432 carbon atom Chemical group C* 0.000 abstract 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 abstract 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 abstract 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 abstract 1
- 239000003999 initiator Substances 0.000 abstract 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 abstract 1
- UMRZSTCPUPJPOJ-KNVOCYPGSA-N norbornane Chemical group C1C[C@H]2CC[C@@H]1C2 UMRZSTCPUPJPOJ-KNVOCYPGSA-N 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/30—Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
- C08F220/303—Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety and one or more carboxylic moieties in the chain
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7042—Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/20—Esters of polyhydric alcohols or phenols, e.g. 2-hydroxyethyl (meth)acrylate or glycerol mono-(meth)acrylate
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Polymerisation Methods In General (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Abstract
IMPRINT MATERIAL There is provided a novel imprint material. An imprint material comprising the following components (A), (B), and (C): 5 Component (A): a compound of the following formula (1): 04 0 R * *** X L *0 (1) (wherein two Rs are each independently a hydrogen atom or a methyl group), Component (B): a compound having a linear alkylene group having a carbon atom number of 6 to 10 and/or an alicyclic structure selected from the group consisting of a 10 cyclopentane structure, a cyclohexane structure, a norbornane structure, an isobornyl structure, and an adamantane structure, and at least one polymerizable group, and Component (C): a photopolymerization initiator.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016157321 | 2016-08-10 | ||
| PCT/JP2017/028619 WO2018030351A1 (en) | 2016-08-10 | 2017-08-07 | Imprint material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201901065TA true SG11201901065TA (en) | 2019-03-28 |
Family
ID=61162334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201901065TA SG11201901065TA (en) | 2016-08-10 | 2017-08-07 | Imprint material |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP6802532B2 (en) |
| KR (1) | KR102401727B1 (en) |
| CN (1) | CN109563194B (en) |
| SG (1) | SG11201901065TA (en) |
| TW (1) | TWI729185B (en) |
| WO (1) | WO2018030351A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2018155013A1 (en) * | 2017-02-22 | 2019-12-12 | 日産化学株式会社 | Photo-curable composition for imprint |
| WO2022075162A1 (en) | 2020-10-08 | 2022-04-14 | Dic株式会社 | Active energy ray curable composition, cured product, lens, and camera module |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2537644B2 (en) * | 1987-11-05 | 1996-09-25 | 日本化薬株式会社 | Overcoat composition for optical disk |
| US5772905A (en) | 1995-11-15 | 1998-06-30 | Regents Of The University Of Minnesota | Nanoimprint lithography |
| JP3918991B2 (en) * | 2002-01-16 | 2007-05-23 | 日本化薬株式会社 | Polymerizable compound, resin composition containing the same, and cured product thereof |
| JP2003206323A (en) * | 2002-01-16 | 2003-07-22 | Nippon Kayaku Co Ltd | Resin composition for light guide and its cured product |
| JP4655840B2 (en) * | 2004-10-07 | 2011-03-23 | Jsr株式会社 | Radiation-sensitive resin composition for microlens formation, microlens and method for forming the same, and liquid crystal display element |
| JP2008202022A (en) | 2007-01-23 | 2008-09-04 | Fujifilm Corp | Curable composition for optical nanoimprint lithography and pattern forming method using the same |
| KR20080105414A (en) | 2007-05-31 | 2008-12-04 | (주)티에이치엔 | Cutting / peeling edge |
| WO2009001629A1 (en) * | 2007-06-26 | 2008-12-31 | Konica Minolta Opto, Inc. | Clear hard coat film, and antireflection film, polarizing plates and displays, made by using the same |
| EP2436704A4 (en) * | 2009-05-29 | 2012-12-05 | Nissan Chemical Ind Ltd | Highly branched fluorinated polymer and resin composition containing same |
| WO2011132616A1 (en) * | 2010-04-19 | 2011-10-27 | 日産化学工業株式会社 | Highly abrasion-resistant imprint material |
| KR101615795B1 (en) * | 2010-07-02 | 2016-04-26 | 가부시끼가이샤 도꾸야마 | Photocurable composition for imprint and method for formation of pattern using the composition |
| JP2012130863A (en) * | 2010-12-22 | 2012-07-12 | Kansai Paint Co Ltd | Multilayer coating film forming method and coated article |
| JP6061073B2 (en) * | 2012-09-27 | 2017-01-18 | 日産化学工業株式会社 | Imprint material |
| WO2014171302A1 (en) * | 2013-04-18 | 2014-10-23 | 日産化学工業株式会社 | Imprint material |
| KR102440445B1 (en) * | 2013-08-02 | 2022-09-06 | 쇼와덴코머티리얼즈가부시끼가이샤 | photosensitive resin composition |
| US9920227B2 (en) * | 2014-01-29 | 2018-03-20 | Hitachi Chemical Company, Ltd. | Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging element |
| JP6477504B2 (en) * | 2014-01-29 | 2019-03-06 | 日立化成株式会社 | Adhesive composition, method for manufacturing semiconductor device using adhesive composition, and solid-state imaging device |
| JP6234864B2 (en) * | 2014-03-28 | 2017-11-22 | 富士フイルム株式会社 | Photosensitive resin composition, laminate, semiconductor device manufacturing method, semiconductor device |
| TWI514073B (en) * | 2014-06-11 | 2015-12-21 | Chi Mei Corp | Photosensitive resin composition and its application |
| JP2016035042A (en) * | 2014-07-31 | 2016-03-17 | 太陽インキ製造株式会社 | Curable resin composition, dry film, cured product, and printed wiring board |
| JP6704701B2 (en) * | 2014-12-15 | 2020-06-03 | キヤノン株式会社 | Adhesion layer forming composition, adhesion layer production method, cured product pattern production method, optical component production method, circuit board production method, imprint mold production method, and device component |
-
2017
- 2017-08-07 SG SG11201901065TA patent/SG11201901065TA/en unknown
- 2017-08-07 JP JP2018533460A patent/JP6802532B2/en active Active
- 2017-08-07 CN CN201780048171.3A patent/CN109563194B/en active Active
- 2017-08-07 WO PCT/JP2017/028619 patent/WO2018030351A1/en not_active Ceased
- 2017-08-07 KR KR1020197001499A patent/KR102401727B1/en active Active
- 2017-08-10 TW TW106127064A patent/TWI729185B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| CN109563194B (en) | 2021-06-22 |
| TW201825534A (en) | 2018-07-16 |
| TWI729185B (en) | 2021-06-01 |
| KR102401727B1 (en) | 2022-05-25 |
| CN109563194A (en) | 2019-04-02 |
| KR20190039082A (en) | 2019-04-10 |
| JPWO2018030351A1 (en) | 2019-06-13 |
| WO2018030351A1 (en) | 2018-02-15 |
| JP6802532B2 (en) | 2020-12-16 |
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