TW200609296A - Epoxy resin composition and cured product thereof - Google Patents
Epoxy resin composition and cured product thereofInfo
- Publication number
- TW200609296A TW200609296A TW094126227A TW94126227A TW200609296A TW 200609296 A TW200609296 A TW 200609296A TW 094126227 A TW094126227 A TW 094126227A TW 94126227 A TW94126227 A TW 94126227A TW 200609296 A TW200609296 A TW 200609296A
- Authority
- TW
- Taiwan
- Prior art keywords
- epoxy resin
- cured product
- resin composition
- integer
- curing agent
- Prior art date
Links
- 239000003822 epoxy resin Substances 0.000 title abstract 4
- 229920000647 polyepoxide Polymers 0.000 title abstract 4
- 239000000203 mixture Substances 0.000 title abstract 3
- 125000001624 naphthyl group Chemical group 0.000 abstract 3
- 229920005989 resin Polymers 0.000 abstract 3
- 239000011347 resin Substances 0.000 abstract 3
- 238000002835 absorbance Methods 0.000 abstract 2
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract 2
- 238000002329 infrared spectrum Methods 0.000 abstract 1
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
This invention is to provide an epoxy resin composition that has excellent curability and provides a cured product having excellent moisture resistance and heat resistance and the cured product thereof. The epoxy resin composition comprises an epoxy resin and a curing agent. A polyhydric hydroxy resin having the ratio of peak absorbance at about 1,654 cm<SP>-1</SP>to peak absorbance at about 1,510 cm<SP>-1</SP>of ≤ 0.8 in infrared spectra and a naphthalene structure is used as a curing agent component. A resin comprising a main component represented by general formula (1) (A is a naphthalene ring; m is an integer of 1 or 2; n is an integer of 1-10) is exemplified as the polyhydric hydroxy resin having the naphthalene structure.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004239281A JP2006056969A (en) | 2004-08-19 | 2004-08-19 | Epoxy resin composition and cured product thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200609296A true TW200609296A (en) | 2006-03-16 |
| TWI399403B TWI399403B (en) | 2013-06-21 |
Family
ID=36080019
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094126227A TWI399403B (en) | 2004-08-19 | 2005-08-02 | Epoxy resin composition and hardened product thereof |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2006056969A (en) |
| KR (1) | KR20060053098A (en) |
| CN (1) | CN1737055A (en) |
| TW (1) | TWI399403B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5166232B2 (en) * | 2008-12-26 | 2013-03-21 | 新日鉄住金化学株式会社 | Naphthol resin, epoxy resin, epoxy resin composition and cured product thereof |
| CN101955629B (en) * | 2009-07-16 | 2011-12-07 | 中芯国际集成电路制造(上海)有限公司 | Epoxy resin composition capable of being used as semiconductor encapsulating material |
| JP5462559B2 (en) * | 2009-09-08 | 2014-04-02 | 新日鉄住金化学株式会社 | Polyvalent hydroxy compounds, production method thereof, epoxy resin composition and cured product thereof |
| JP5209660B2 (en) * | 2010-03-29 | 2013-06-12 | 新日鉄住金化学株式会社 | Polyvalent hydroxy resin, epoxy resin, production method thereof, epoxy resin composition and cured product using them |
| JP5906550B2 (en) * | 2011-07-28 | 2016-04-20 | 株式会社Moresco | Encapsulant with high barrier properties |
| TWI697521B (en) * | 2014-10-22 | 2020-07-01 | 日商味之素股份有限公司 | Resin composition |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH039129A (en) * | 1989-06-02 | 1991-01-17 | Akebono Brake Res & Dev Center Ltd | Excellent-durability in-oil friction material |
| JPH0390075A (en) * | 1989-09-01 | 1991-04-16 | Nippon Steel Chem Co Ltd | Epoxy resin, its intermediate and production thereof |
| JP2866747B2 (en) * | 1990-12-21 | 1999-03-08 | 三井化学株式会社 | Method for producing phenolic polymer |
| JPH04264117A (en) * | 1991-02-19 | 1992-09-18 | Nippon Kayaku Co Ltd | New high-performance resin, epoxy resin composition, and its cured article |
| JP2579405B2 (en) * | 1992-07-17 | 1997-02-05 | 新日鐵化学株式会社 | Epoxy resin curing agent |
| JP3422808B2 (en) * | 1992-10-20 | 2003-06-30 | 新日鐵化学株式会社 | Epoxy resin curing agent and method for producing the same |
| JP5165816B2 (en) * | 2000-03-14 | 2013-03-21 | 新日鉄住金化学株式会社 | Epoxy resin composition and cured product thereof |
-
2004
- 2004-08-19 JP JP2004239281A patent/JP2006056969A/en active Pending
-
2005
- 2005-08-02 TW TW094126227A patent/TWI399403B/en not_active IP Right Cessation
- 2005-08-18 KR KR1020050075632A patent/KR20060053098A/en not_active Withdrawn
- 2005-08-19 CN CNA2005100926449A patent/CN1737055A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN1737055A (en) | 2006-02-22 |
| TWI399403B (en) | 2013-06-21 |
| JP2006056969A (en) | 2006-03-02 |
| KR20060053098A (en) | 2006-05-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |