TW200610615A - Grindstone tool - Google Patents
Grindstone toolInfo
- Publication number
- TW200610615A TW200610615A TW094123952A TW94123952A TW200610615A TW 200610615 A TW200610615 A TW 200610615A TW 094123952 A TW094123952 A TW 094123952A TW 94123952 A TW94123952 A TW 94123952A TW 200610615 A TW200610615 A TW 200610615A
- Authority
- TW
- Taiwan
- Prior art keywords
- grindstone tool
- grindstone
- tool
- tag
- workpiece
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/04—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the shape
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Machine Tool Sensing Apparatuses (AREA)
- Automatic Tool Replacement In Machine Tools (AREA)
Abstract
A grindstone tool for perform predetermined processing on a workpiece, wherein a radio IC tag from, and to, which information can be read, and written, without contact is embedded in the grindstone tool.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004208585 | 2004-07-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200610615A true TW200610615A (en) | 2006-04-01 |
Family
ID=35600076
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094123952A TW200610615A (en) | 2004-07-15 | 2005-07-14 | Grindstone tool |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20060014475A1 (en) |
| CN (1) | CN1721137A (en) |
| DE (1) | DE102005033253A1 (en) |
| TW (1) | TW200610615A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI758436B (en) * | 2017-03-31 | 2022-03-21 | 日商荏原製作所股份有限公司 | Elastic film, retaining ring and substrate processing device |
| TWI809493B (en) * | 2021-09-02 | 2023-07-21 | 中國砂輪企業股份有限公司 | Grinding tool capable of providing operation instructions and grinding system comprising the same |
| TWI834238B (en) * | 2021-08-11 | 2024-03-01 | 南韓商瑞宇科技股份有限公司 | Semiconductor strip grinding apparatus |
| TWI873179B (en) * | 2019-10-02 | 2025-02-21 | 日商迪思科股份有限公司 | Dressing tools |
Families Citing this family (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1975985A4 (en) * | 2006-01-25 | 2011-08-10 | Jsr Corp | Chemical mechanical polishing pad and method for manufacturing same |
| DE102006008395A1 (en) * | 2006-02-21 | 2007-08-30 | Reishauer Ag | Machine tool e.g. tooth flank grinding machine, has writing and/or reading head provided for contact less reading and/or writing data of electronic data carrier during operating process with rotating roller |
| US7840305B2 (en) * | 2006-06-28 | 2010-11-23 | 3M Innovative Properties Company | Abrasive articles, CMP monitoring system and method |
| US8388410B2 (en) * | 2007-11-05 | 2013-03-05 | P.R. Hoffman Machine Products, Inc. | RFID-containing carriers used for silicon wafer quality |
| US20090137187A1 (en) * | 2007-11-21 | 2009-05-28 | Chien-Min Sung | Diagnostic Methods During CMP Pad Dressing and Associated Systems |
| JP5551479B2 (en) * | 2010-03-19 | 2014-07-16 | ニッタ・ハース株式会社 | Polishing apparatus, polishing pad and polishing information management system |
| DE102010054744A1 (en) * | 2010-12-16 | 2012-06-21 | Witech GmbH | Cutting tool i.e. circular saw blade, for use with electronic drain valve system for cutting workpieces, has software installed in drain valve system to store master data of chips, where data are linked with tool data in form of updates |
| DE102013007275A1 (en) * | 2013-04-26 | 2014-11-13 | Weber Maschinenbau Gmbh Breidenbach | Food slicing knife with a radio transponder |
| CN105706116B (en) * | 2013-09-12 | 2019-02-15 | 雷肖尔股份公司 | RFID tags for metal replacement parts for machine tools |
| BR112017003056A2 (en) | 2014-08-15 | 2017-11-21 | Baron Invest Llc | data collection, transfer and feedback in work tools |
| US12208480B2 (en) | 2014-08-15 | 2025-01-28 | Baron Investments, Llc | Data collection, transfer and feedback in working tools |
| JP6406956B2 (en) * | 2014-09-25 | 2018-10-17 | 株式会社ディスコ | Cutting equipment |
| US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
| US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
| JP6545261B2 (en) | 2014-10-17 | 2019-07-17 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | CMP pad structure with composite properties using an additive manufacturing process |
| US9776361B2 (en) | 2014-10-17 | 2017-10-03 | Applied Materials, Inc. | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
| US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
| US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
| US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
| US10207379B2 (en) * | 2016-01-21 | 2019-02-19 | Colibri Spindles Ltd. | Live tool collar having wireless sensor |
| US20170337402A1 (en) * | 2016-05-18 | 2017-11-23 | Hand Held Products, Inc. | Tool verification systems and methods for a workflow process |
| WO2018160658A2 (en) * | 2017-02-28 | 2018-09-07 | 3M Innovative Properties Company | Abrasive product for communication with abrading tool |
| DE102017114866B4 (en) * | 2017-07-04 | 2021-07-15 | Euromicron Werkzeuge Gmbh | Method for polishing optical fibers and polishing plate for a polishing machine |
| US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
| CN111684571A (en) | 2018-02-05 | 2020-09-18 | 应用材料公司 | Piezo Endpoint Indication for CMP Pads for 3D Printing |
| US20200039027A1 (en) * | 2018-08-02 | 2020-02-06 | Saint-Gobain Abrasives, Inc. | Abrasive article including a wear detection sensor |
| EP3843947B1 (en) * | 2018-08-27 | 2025-04-09 | 3M Innovative Properties Company | Embedded electronic circuit in grinding wheels and methods of embedding |
| JP7299970B2 (en) | 2018-09-04 | 2023-06-28 | アプライド マテリアルズ インコーポレイテッド | Formulations for improved polishing pads |
| BR112021019580A2 (en) | 2019-03-29 | 2021-12-14 | Saint Gobain Abrasifs Sa | Performance of grinding solutions |
| BR112021019766A2 (en) | 2019-04-03 | 2021-12-07 | Saint Gobain Abrasifs Sa | Abrasive article, abrasive system and method for use and formation thereof |
| EP4414136A3 (en) * | 2019-09-19 | 2024-11-13 | Husqvarna AB | Wireless identification tags and corresponding readers |
| SE545981C2 (en) * | 2019-09-19 | 2024-04-02 | Husqvarna Ab | Wireless identification tags and corresponding readers |
| SE545998C2 (en) * | 2019-09-19 | 2024-04-09 | Husqvarna Ab | Wireless identification tags and corresponding readers |
| JP7547017B2 (en) * | 2020-12-25 | 2024-09-09 | 株式会社ディスコ | Blade Changer |
| JP7657524B2 (en) * | 2021-04-02 | 2025-04-07 | 株式会社ディスコ | Judgment method and writing method |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5494698A (en) * | 1994-11-07 | 1996-02-27 | Xerox Corporation | Teflon filled resinoid dicing blades for fabricating silicon die modules |
| IT1312407B1 (en) * | 1999-06-16 | 2002-04-17 | Blm S A S Di L Bareggi & C | IMPROVED TOOL FOR CLAMPING, WITH INTERCHANGEABLE INSERTS |
| US20030102970A1 (en) * | 2001-11-15 | 2003-06-05 | Creel Myron Dale | Tool or implement storage system using wireless devices to facilitate tool control |
| US6989749B2 (en) * | 2003-11-21 | 2006-01-24 | The United States Of America As Represented By The Secretary Of The Navy | Electronic check out system |
| JP5016496B2 (en) * | 2004-12-17 | 2012-09-05 | ミルウォーキー・エレクトリック・トゥール・コーポレーション | Smart accessories for power tools |
-
2005
- 2005-07-14 TW TW094123952A patent/TW200610615A/en unknown
- 2005-07-14 US US11/180,737 patent/US20060014475A1/en not_active Abandoned
- 2005-07-15 CN CNA2005100846389A patent/CN1721137A/en active Pending
- 2005-07-15 DE DE102005033253A patent/DE102005033253A1/en not_active Withdrawn
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI758436B (en) * | 2017-03-31 | 2022-03-21 | 日商荏原製作所股份有限公司 | Elastic film, retaining ring and substrate processing device |
| US11969858B2 (en) | 2017-03-31 | 2024-04-30 | Ebara Corporation | Substrate processing apparatus |
| TWI873179B (en) * | 2019-10-02 | 2025-02-21 | 日商迪思科股份有限公司 | Dressing tools |
| TWI834238B (en) * | 2021-08-11 | 2024-03-01 | 南韓商瑞宇科技股份有限公司 | Semiconductor strip grinding apparatus |
| TWI809493B (en) * | 2021-09-02 | 2023-07-21 | 中國砂輪企業股份有限公司 | Grinding tool capable of providing operation instructions and grinding system comprising the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1721137A (en) | 2006-01-18 |
| DE102005033253A1 (en) | 2006-04-13 |
| US20060014475A1 (en) | 2006-01-19 |
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