[go: up one dir, main page]

TW200700735A - Movement amount operation correction method for prober, computer-readable recording media for recording a movement amount operation correction processing program, and prober - Google Patents

Movement amount operation correction method for prober, computer-readable recording media for recording a movement amount operation correction processing program, and prober

Info

Publication number
TW200700735A
TW200700735A TW095112150A TW95112150A TW200700735A TW 200700735 A TW200700735 A TW 200700735A TW 095112150 A TW095112150 A TW 095112150A TW 95112150 A TW95112150 A TW 95112150A TW 200700735 A TW200700735 A TW 200700735A
Authority
TW
Taiwan
Prior art keywords
probe
movement amount
prober
operation correction
amount operation
Prior art date
Application number
TW095112150A
Other languages
Chinese (zh)
Other versions
TWI302985B (en
Inventor
Masatomo Takahashi
Takahiro Hokida
Ken Kamikariya
Tetsuo Hata
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Publication of TW200700735A publication Critical patent/TW200700735A/en
Application granted granted Critical
Publication of TWI302985B publication Critical patent/TWI302985B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

A movement amount operation correction method of a prober capable of easily performing an error measurement for the movement distance, as conventionally performed by a skilled specialist, has been disclosed. In the method, the position of a probe of a probe card is detected by a probe position detection means, the position of an electrode is detected by a wafer alignment means, the position of the probe trace is detected by bringing the electrode into contact with the probe and processing an image of a probe trace on the electrode touched by the wafer alignment means, the image of the probe trace and a probe trace mark indicating the detected position of the probe are displayed on a display device, and an operator confirms or corrects the position of the probe trace mark on the image, calculates a shift of the position of the probe trace mark from a predetermined position, and corrects a movement amount operation correction value based on the calculated shift.
TW095112150A 2005-05-31 2006-04-06 Movement amount operation correction method for prober, computer-readable recording media for recording a movement amount operation operation correction processing program, and prober TWI302985B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005158613A JP2006339196A (en) 2005-05-31 2005-05-31 Method of computing/calibrating movement quantity of prober, program of computing/calibrating movement quantity and prober

Publications (2)

Publication Number Publication Date
TW200700735A true TW200700735A (en) 2007-01-01
TWI302985B TWI302985B (en) 2008-11-11

Family

ID=37462553

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095112150A TWI302985B (en) 2005-05-31 2006-04-06 Movement amount operation correction method for prober, computer-readable recording media for recording a movement amount operation operation correction processing program, and prober

Country Status (4)

Country Link
US (1) US7501843B2 (en)
JP (1) JP2006339196A (en)
KR (1) KR100785110B1 (en)
TW (1) TWI302985B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI794324B (en) * 2017-11-24 2023-03-01 日商日本電產理德股份有限公司 Substrate inspection device, inspection position correction method, position correction information generation method, and position correction information generation system

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070075589A (en) * 2006-01-13 2007-07-24 삼성전자주식회사 How to Check Probe Card Failure
JP4950719B2 (en) * 2007-03-23 2012-06-13 東京エレクトロン株式会社 Probe tip position detection method, alignment method, needle tip position detection device, and probe device
JP5018183B2 (en) * 2007-03-30 2012-09-05 東京エレクトロン株式会社 PROBE DEVICE, PROBING METHOD, AND STORAGE MEDIUM
JP4997127B2 (en) * 2008-01-23 2012-08-08 東京エレクトロン株式会社 Inspection method and program recording medium recording this inspection method
JP5197145B2 (en) * 2008-05-14 2013-05-15 株式会社東京精密 Probe position correcting method and prober
DE202008013982U1 (en) * 2008-10-20 2009-01-08 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Measuring system for determining scattering parameters
JP5335391B2 (en) * 2008-12-04 2013-11-06 日置電機株式会社 Inspection apparatus and inspection method
KR20100089131A (en) 2009-02-03 2010-08-12 삼성전자주식회사 Method of correcting positions of a prober and apparatus for performing the same
JP2012204695A (en) 2011-03-25 2012-10-22 Tokyo Electron Ltd Probe card detection device, positioning device for wafer, and positioning method for wafer
TWI437393B (en) * 2011-05-06 2014-05-11 Fu Lai Yao A method and apparatus for correcting the coordinate position of a complex image sensor
TWI416144B (en) * 2011-05-06 2013-11-21 Fu Lai Yao The method and device for detecting the touch point of the substrate line with the probe
JP5953118B2 (en) * 2012-05-22 2016-07-20 日置電機株式会社 Editing apparatus and editing method
US10365323B2 (en) * 2015-11-25 2019-07-30 Formfactor Beaverton, Inc. Probe systems and methods for automatically maintaining alignment between a probe and a device under test during a temperature change
JP2019160937A (en) * 2018-03-09 2019-09-19 東京エレクトロン株式会社 Position correction method, inspection device, and probe card
JP7382888B2 (en) * 2020-04-06 2023-11-17 東京エレクトロン株式会社 Inspection device and method of controlling the inspection device
CN113589134A (en) * 2020-04-30 2021-11-02 迈柯博科技(上海)有限公司 Wafer testing apparatus and method
JP7632973B2 (en) * 2021-05-31 2025-02-19 東京エレクトロン株式会社 Alignment method and inspection device
CN116256544B (en) * 2023-01-05 2023-12-05 苏州斯尔特微电子有限公司 Wafer test probe station with offset correction function

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2928331B2 (en) * 1990-05-14 1999-08-03 東京エレクトロン株式会社 Prober alignment device and method
JPH0763068B2 (en) * 1992-02-12 1995-07-05 東京エレクトロン株式会社 Wafer prober
JPH06349907A (en) * 1993-06-08 1994-12-22 Toshiba Corp Probe card
US5644245A (en) * 1993-11-24 1997-07-01 Tokyo Electron Limited Probe apparatus for inspecting electrical characteristics of a microelectronic element
JPH07147304A (en) 1993-11-24 1995-06-06 Tokyo Electron Ltd Automatic setup probing
JPH07312382A (en) 1994-05-17 1995-11-28 Tokyo Electron Ltd Probe device
JP2984541B2 (en) * 1994-04-18 1999-11-29 東京エレクトロン株式会社 Probing method and probe device
JP3328148B2 (en) 1996-11-15 2002-09-24 株式会社東京精密 Probing method and prober
JP2002170855A (en) 2000-11-30 2002-06-14 Tokyo Seimitsu Co Ltd Prober
JP3795373B2 (en) * 2001-10-29 2006-07-12 松下電器産業株式会社 Inspection apparatus and inspection method for semiconductor device
JP2004063877A (en) * 2002-07-30 2004-02-26 Tokyo Seimitsu Co Ltd Wafer-positioning correction method
JP2004079733A (en) 2002-08-15 2004-03-11 Tokyo Seimitsu Co Ltd Method for measuring prober precision
JP4339631B2 (en) * 2003-06-20 2009-10-07 東京エレクトロン株式会社 Inspection method and inspection apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI794324B (en) * 2017-11-24 2023-03-01 日商日本電產理德股份有限公司 Substrate inspection device, inspection position correction method, position correction information generation method, and position correction information generation system

Also Published As

Publication number Publication date
TWI302985B (en) 2008-11-11
KR20060124559A (en) 2006-12-05
JP2006339196A (en) 2006-12-14
US20060267613A1 (en) 2006-11-30
KR100785110B1 (en) 2007-12-12
US7501843B2 (en) 2009-03-10

Similar Documents

Publication Publication Date Title
TW200700735A (en) Movement amount operation correction method for prober, computer-readable recording media for recording a movement amount operation correction processing program, and prober
US8074497B2 (en) Indentation testing instrument and indentation testing method
ATE539399T1 (en) DISPLAY CONTROL DEVICE, DISPLAY CONTROL METHOD AND COMPUTER PROGRAM
JP2008243860A5 (en)
WO2011154343A3 (en) Method and device for detecting an incorrect representation of image data on a display unit
TW200623232A (en) Alignment information display method, program thereof, alignment method, exposure method, device manufacturing method, display system, display device, program, and measurement/inspection device
TWI416144B (en) The method and device for detecting the touch point of the substrate line with the probe
RU2010113367A (en) INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING METHOD AND PROGRAM
EP2040081A3 (en) Sample analyzer and error information displaying method
JP2009252853A5 (en)
PH12016500937A1 (en) Diagnostic device and diagnostice method for plant
EP2600308A3 (en) Information processing apparatus, information processing method, program and computer-readable storage medium
EP2118810A4 (en) System and method for optimizing location estimate of mobile unit
EP2244173A3 (en) Position detecting method for touchscreen panel, touchscreen panel, and electronic apparatus
ATE472110T1 (en) SENSOR DEVICE AND METHOD FOR DETECTING MAGNETIC PARTICLES
WO2006109280A3 (en) Method and apparatus for detection of abnormal traces during electrochemical analyte detection
EP2104023A3 (en) Method and apparatus at a touch sensitive device
CN108871185B (en) Method, apparatus, apparatus, and computer-readable storage medium for part inspection
EP2587224A3 (en) Displacement detecting device, scale calibrating method and scale calibrating program
WO2008081524A1 (en) Taste recognizing device and taste recognizing system using same
WO2013132081A3 (en) Lithography system and method for processing a target, such as a wafer
TW200644145A (en) Method and apparatus for inspecting marking of semiconductor package
EP2570898A3 (en) Electronic apparatus and method for controlling display screen of electronic apparatus
CN104457631A (en) Pneumatic hole depth detection device
KR101744483B1 (en) Electronics test jig