200949462 九、發明說明： '【發明所屬之技術領域】 • 本發明涉及一模仁之製造方法，特別係涉及一用於紫 外線成型壓印製程之模仁製造方法。 【先前技術】 紫外線成型壓印技術（請參見Liang Ying-xin，Wang Tai-hong, “ A New Technique for Fabrication of Nanodevices — Nanoimprint Lithography ” ， © Micronanoelectronic Technology，2003，Vol. 4-5)係採用紫 外光照射室溫之聚合物實現固化成型之壓印技術，特別適 用於大批量、重複性、精確製備微結構。紫外線成型壓印 技術為先製造具有微結構之模仁，然後利用該模仁進行壓 印過程，最後進行圖形轉移。 先前技術中用於壓印製程之模仁製造方法包括如下步 驟：提供一透光基底；於該透光基底一表面塗覆光阻層； 經由光罩曝光及顯影等作業於光阻層表面形成微結構；於 ❹ 微結構表面上形成晶種層；對該基底進行電鑄；脫模，形 成模仁。 惟，這種製造方法中脫模後之模仁之表面會保留有晶 種層，而該晶種層與模仁相互之間之結合度不如一體成型 材料理想，故，於使用過程中，模仁表面之晶種層極易剝 離，從而增加了模仁之表面粗糙度，降低了成型品之良率。 【發明内容】 有鑒於此，提供一表面粗糙度較低之模仁製備方法實 5 200949462 為必要。 一模仁製造方法，其包括以下步 提供一基板； 於該基板之一表面上形成一薄膜層； 於該薄膜層上設置一光阻層；θ200949462 IX. Description of the invention: '[Technical field to which the invention pertains] The present invention relates to a method for manufacturing a mold core, and more particularly to a method for manufacturing a mold core for an ultraviolet forming embossing process. [Prior Art] UV-forming imprinting technology (see Liang Ying-xin, Wang Tai-hong, "A New Technique for Fabrication of Nanodevices - Nanoimprint Lithography", © Micronanoelectronic Technology, 2003, Vol. 4-5) The light-irradiated room temperature polymer realizes the imprinting technology of solidification molding, and is particularly suitable for mass, reproducibility, and precise preparation of microstructures. The UV forming embossing technique is to first manufacture a mold having a microstructure, and then use the mold to perform an imprint process, and finally perform a pattern transfer. The method for manufacturing a mold core used in an embossing process in the prior art includes the steps of: providing a light-transmitting substrate; coating a surface of the light-transmitting substrate with a photoresist layer; forming a surface of the photoresist layer by exposure and development of the mask; a microstructure; a seed layer is formed on the surface of the microstructure; the substrate is electroformed; and the mold is removed to form a mold. However, in the manufacturing method, the surface of the mold core after mold release retains the seed layer, and the degree of bonding between the seed layer and the mold core is not as good as that of the integrally formed material. Therefore, during use, the mold core The seed layer on the surface is easily peeled off, which increases the surface roughness of the mold core and reduces the yield of the molded product. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a method for preparing a mold having a low surface roughness. A mold manufacturing method comprising the steps of: providing a substrate; forming a film layer on a surface of the substrate; and providing a photoresist layer on the film layer;
得光阻層具有複對:光阻層顯影使該 阻層下面之該薄膜層部分露出；L，該孔使得位於該光 以電鎿方式藉由露出之部分薄膜 於該微結構之表面上 層形成一電鑄層； 去除該光阻層； 將該電鑄層與該基板分離，以獲得模仁，該模仁具有 複數與該微結構相匹配之成型面。 與先前技術相比，本發明之模仁製造方法中，該薄膜 層與該電鑄層之間存於一光阻層，使得該模仁之成型面與 ❿該薄膜層並不相接觸，故，本發明之模仁製造方法使得模 仁之表面粗輪度較低。 【實施方式】 請參閲圖1，本發明實施例中模仁 之製造方法包括以下 步驟： 提供一基板； 於該基板之一表面上形成一薄膜層； 於該薄膜層上設置一光阻層； 採用直寫技術對該光阻層曝光，對該光陴層顯影使得 6 200949462 該光阻層具有複數微結構及至少一孔，該孔使得位於該光 阻層下面之該薄膜層部分露出； 於該微結構之表面上以電铸方式藉由露出之部分薄膜 層形成一電鎊層； 去除該光阻層； 將該電鑄層與該基板分離，以獲得模仁，該模仁具有 複數與該微結構相匹配之成型面。 下面將以製造微小鏡片模仁60為例對本發明實施例中 ❺之模仁製造方法進行詳細說明。 如圖2所示，首先提供一潔淨過之基板1〇。該基板1〇 可為透光基板，由玻璃、石英等可透光材料製成，亦可為 不透光基板，由鋁、鐵、金、銀等不透光材料製成。本實 施例中，該基板1〇由玻璃製成。 如圖3所示，於基板10上形成一薄膜層2〇。該薄膜層 20用來作為後續電鑄工序中用來幫助電鑄金屬物附著及長 ❹晶之晶種層。其中，該薄膜層2〇之形成方式可採用濺鍍、 蒸鍍、喷鍍等方式。本實施例中，採用濺鍍方式將銅鍍於 基板10上以形成薄膜層2〇。當然，該薄膜層2〇之材料亦 可為鎳。 如圖4所示，於薄膜層20上設置一光阻層3〇。光阻層 30之設置方法可採用旋塗方法，亦可採用喷塗方法或層壓 方法。光阻層30之厚度可根據實際所需而設計。本實施例 中’採用層愿機將光阻層30設置於薄膜層20上。 如圖5所示’利用直寫技術對該光阻層30曝光。該直 7 200949462 寫技術可為雷射直寫技術’亦可為電子束直寫技術。該直 .寫技術利用能量受調制之雷射光束或電子束對光阻層30曝 光。 曝光後，該光阻層30具有複數第一曝光區3〇1及兩第 二曝光區303。該第一曝光區301沒有穿透該光阻層3〇, 而該第二曝光區3〇3中至少有一部分穿透該光阻層3〇。本 實施例中，採用能量受調制之雷射光束對光阻層3〇曝光， ❹使得該光阻層30具有複數第一曝光區3〇1及兩第二曝光區 〇3且該複數第一曝光區301位於兩第二曝光區3〇3之間。 為了使第一曝光區301及兩第二曝光區3〇3更好地溶 解於顯影液中’將基板1()烘烤。供烤可利用烤箱之孰 對流、紅外線輻射錢墊板之熱料來進行。本實施例中、， =熱墊板之熱傳導來進行，其中，烘烤溫度為7㈣〇攝 2 ’供烤相為4〜8分鐘。當然，村於曝光之後不對 基板10進行烘烤。 ❹ =圖6所不’烘烤後進行顯影，第一曝光區域紐被 移去传到微結構3G5及第二曝光區域期被移去得到一孔 3^。該孔撕使得位於光阻層3()τ面之薄膜層⑼部分露 露出形m305之表面上以電鱗方式藉由 40之材料為;/成一電轉層4〇。本實施例中，該電鑄層 如圖8所示，去除光阻 方法腺冰a。 本實鉍例中，採用化學 方法將先阻層30溶解以去除光阻層30。 8 200949462 、制t圖9所示，將電鑄層40與基板分離，得到模仁 子时50。該杈仁初製品5〇具有複數與微結構 305相匹配 =型* 4〇1。該成型面4〇1用來成型微小鏡片（圖未 ，微::：片可為非球面鏡片，亦可為球面鏡片。本實施例 型面401用來成型球面微小鏡片，且以餘刻方式 將材料為銅之薄膜層2〇去除 分 云除從而將電鑄層40與基板10 ❹ 广、'’若該薄膜層2〇之材料為鎳亦可採用雷射切 方法將材料為錦之電鑷層40與基板10分離。 該模仁初製品5〇具有一前 背面5的兮、备机4 則面501及與前面501相對之 3。該複數成型面401設於前面5〇1上。 如圖10所示，研磨模仁初製品 :3/:將模仁初製品5。之前…二^ 微小鏡片模仁60。 傲卞仔到 將模Γ理Γ模仁初製品50之前面501亦可不用研磨，僅 ❹The photoresist layer has a complex pair: the photoresist layer is developed to expose a portion of the film layer under the resist layer; L, the hole is formed in the upper layer of the surface of the microstructure by the exposed portion of the light in an electric manner An electroformed layer; removing the photoresist layer; separating the electroformed layer from the substrate to obtain a mold core having a plurality of molding faces matching the microstructure. Compared with the prior art, in the mold manufacturing method of the present invention, a photoresist layer is disposed between the film layer and the electroformed layer, so that the molding surface of the mold core is not in contact with the film layer, so The mold manufacturing method of the present invention makes the surface of the mold core have a coarse roundness. [Embodiment] Please refer to FIG. 1 , a method for manufacturing a mold core according to an embodiment of the present invention includes the following steps: providing a substrate; forming a film layer on a surface of the substrate; and providing a photoresist layer on the film layer; Exposing the photoresist layer by direct writing, and developing the pupil layer to make the photoresist layer have a plurality of microstructures and at least one hole, the hole partially exposing the film layer under the photoresist layer; Forming an electric pound layer on the surface of the microstructure by electroforming by exposing a portion of the thin film layer; removing the photoresist layer; separating the electroformed layer from the substrate to obtain a mold core having a plurality of The microstructure matches the molding surface. Hereinafter, a method for manufacturing a mold core according to an embodiment of the present invention will be described in detail by taking a micro lens mold core 60 as an example. As shown in FIG. 2, a clean substrate 1 is first provided. The substrate 1〇 may be a light-transmitting substrate made of a light-transmitting material such as glass or quartz, or an opaque substrate made of an opaque material such as aluminum, iron, gold or silver. In this embodiment, the substrate 1 is made of glass. As shown in FIG. 3, a thin film layer 2 is formed on the substrate 10. The film layer 20 is used as a seed layer for assisting electroforming of metal adhesion and long twinning in a subsequent electroforming process. The film layer 2 can be formed by sputtering, vapor deposition, sputtering or the like. In this embodiment, copper is plated on the substrate 10 by sputtering to form a thin film layer 2 . Of course, the material of the film layer 2 can also be nickel. As shown in FIG. 4, a photoresist layer 3 is disposed on the thin film layer 20. The method of disposing the photoresist layer 30 may be a spin coating method, or a spraying method or a lamination method. The thickness of the photoresist layer 30 can be designed according to actual needs. In the present embodiment, the photoresist layer 30 is disposed on the thin film layer 20 by a layering machine. The photoresist layer 30 is exposed by a direct writing technique as shown in FIG. The straight 7 200949462 writing technology can be laser direct writing technology' can also be electron beam direct writing technology. The direct write technique utilizes an energy modulated laser beam or electron beam to expose the photoresist layer 30. After exposure, the photoresist layer 30 has a plurality of first exposure regions 3〇1 and two second exposure regions 303. The first exposed region 301 does not penetrate the photoresist layer 3〇, and at least a portion of the second exposed region 3〇3 penetrates the photoresist layer 3〇. In this embodiment, the energy-modulated laser beam is used to expose the photoresist layer 3, such that the photoresist layer 30 has a plurality of first exposure regions 3〇1 and two second exposure regions 〇3 and the first plurality The exposure area 301 is located between the two second exposure areas 3〇3. In order to better dissolve the first exposure region 301 and the two second exposure regions 3〇3 in the developer, the substrate 1 () is baked. It can be used for baking. It can be used as a hot material for convection and infrared radiation money pad. In this embodiment, = heat conduction of the thermal pad is performed, wherein the baking temperature is 7 (four) 〇 2 ’ for the baking phase is 4 to 8 minutes. Of course, the village does not bake the substrate 10 after exposure. ❹ = Fig. 6 does not perform development after baking, the first exposure area is removed and transferred to the microstructure 3G5 and the second exposure area is removed to obtain a hole 3^. The hole tearing is performed on the surface of the film layer (9) of the photoresist layer 3 (), which is exposed on the surface of the m305, by means of a material of 40; or an electrical conversion layer. In this embodiment, the electroformed layer is removed as shown in Fig. 8, and the photoresist ice g is removed. In this embodiment, the first resist layer 30 is chemically dissolved to remove the photoresist layer 30. 8 200949462, as shown in Fig. 9, the electroformed layer 40 is separated from the substrate to obtain 50 when the mold is obtained. The 杈仁初品5〇 has a complex number with the microstructure 305 = type * 4 〇 1. The molding surface 4〇1 is used to form a micro lens (Fig. 1, the micro:: sheet may be an aspherical lens or a spherical lens. The profile 401 of this embodiment is used to form a spherical lens, and in a timely manner The material is a thin film layer of copper, and the electroforming layer 40 and the substrate 10 are widened. If the material of the thin film layer 2 is nickel, the material can be made into a laser by a laser cutting method. The ruthenium layer 40 is separated from the substrate 10. The mold core product 5 〇 has a front back surface 5, a standby machine 4 surface 501, and a front surface 501 opposite to the front surface 501. The plurality of molding surfaces 401 are provided on the front surface 5〇1. As shown in Figure 10, the first product of the grinding die: 3/: will be the first product of the mold. 5. Before... 2^ The tiny lens mold core 60. The proud 卞 到 将 将 将 Γ Γ Γ 初 初 初 初 初 初 初No need to grind, only ❹
Γ 之背面5G3磨平。㈣可理解，模仁J 口口刈之别Φ5〇1及背面5〇3均不用磨平 初製 亦可作為模仁。 17模仁初製时50 可理解，該第二曝光區3〇3之個數亦可二 四個或複數個，該複數第一 *'、、 、二個、 光區303之龍 亦可分佈於第二曝 分薄膜層20露出即可。 要顯影後’使得部 综上所述，本發明確已符合發明專利 … :出專利申請。惟’以上所述者僅為本發明之依法 式，自不能以此限制本宰之申_專利ρ 實施方 冬栗之申°月專利範圍。舉凡熟悉本案 9 200949462 技藝之人士援依本發明之精神所作之等效修飾或變化，皆 應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 圖1係本發明實施例中模仁製造方法之流程圖。 圖2係本發明實施例中提供之基板之示意圖。 圖3係於基板上形成薄膜層之示意圖。 圖4係於薄膜層上設置光阻層之示意圖。5 The back of the 5G3 is smoothed. (4) It can be understood that the Φ5〇1 and the back 5〇3 of the M-mouth mouth are not required to be ground. When the initial state of the mold is 50, it can be understood that the number of the second exposure zone 3〇3 can also be two or four or plural, and the plural first *', ,, two, and the light zone 303 can also be distributed. The second exposed film layer 20 may be exposed. After the development is made, the invention has indeed met the invention patent ...: a patent application. However, the above is only the legal form of the present invention, and it is not possible to limit the scope of the application of the patent. Equivalent modifications or variations made by those skilled in the art in the light of the present invention are intended to be included in the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a flow chart showing a method of manufacturing a mold core in an embodiment of the present invention. 2 is a schematic view of a substrate provided in an embodiment of the present invention. Figure 3 is a schematic view showing the formation of a thin film layer on a substrate. Figure 4 is a schematic view showing the arrangement of a photoresist layer on a thin film layer.
圖5係對光阻層曝光之示意圖。 圖ό係對光阻層顯影後得到之微結構之示意 圖7係於微結構之表面上形成一電鑷層之示 圖8去除光阻層之示意圖。 ® 圖9將電鑄層與基板分離獲得之模仁之示意圏 圖10將模仁之剛面及背面磨平之示音圖 、 主要元件符號說明】 微小鏡片模仁 60 基板 10 薄膜層 20 光阻層 30 第一曝光區 301 第—曝光區 303 微結構 305 孔 307 電鑄層 40 模仁初製品 50 200949462 成型面 401 前面 501 背面 503Figure 5 is a schematic illustration of exposure of a photoresist layer. Figure 7 is a schematic diagram of the microstructure obtained after development of the photoresist layer. Fig. 7 is a schematic diagram showing the formation of an electroconductive layer on the surface of the microstructure. Fig. 9 shows the schematic diagram of the mold obtained by separating the electroformed layer from the substrate. Fig. 10 shows the sound map of the front and back of the mold core, and the main component symbols. Micro lens mold core 60 substrate 10 film layer 20 photoresist layer 30 First exposure zone 301 First exposure zone 303 Microstructure 305 Hole 307 Electroformed layer 40 Molded core preliminary product 50 200949462 Molded surface 401 Front 501 Back 503
G ❹ 11G ❹ 11