201016087 九、發明說明： 【發明所屬之技術領域】 。。本發明係有關於植錫球之方法，且特別是有關於一種 早一電路板植锡球之方法。 【先前技術】 +現今通訊、網路双及電腦等各式電子產品蓬勃發展， 為符口輕薄短小的需求，許多可縮小積體電路(Integrated Circuit，1C)的封裝技術也隨之發展。一般完成電路佈線之 電路板進行封裝製程時，須藉由錫球凸塊(s〇lder bump)與 電路板上之電性連接墊相連接，以作為與外界電子裝置連 接之橋襟，因此，隨著電路板微小化的設計，錫球凸塊與 電性連接墊之間的間距亦隨之縮小。 目前業界常使用的植錫球技術，係先將電路板全板完 成電路佈線，接著在全板内特定位置土形成錫球凸塊，之 後依據客戶需求切割成單一電路板，最後對單一電路板作 ❹ 電性測試，以確定電性連接是否正常。然而，隨著電性連 接墊尺寸以及間距逐漸縮小時，全板一起形成錫球凸塊的 製程會變得難以控制，往往於最後電性測試時’才發現許 多電路板的電性連接出錯，因而將之報廢，如此以來，會 造成製程成本的提高。 因此，業界亟需找到一解決之道，以因應錫球凸塊與 電性連接墊間距縮小之趨勢。 【發明内容】 本發明提供一種單一電路板植錫球之方法，包括下列 201016087 ：供—完成電路佈線之電路板全板，該電路板全板 具=一第-表面與對應之第二表面；於該第—表面與該第 二-面之上形成複數個電性接觸焊墊；㈣第—表面、該 ^一，面與該些電性接觸焊墊之上坦覆性地覆蓋一絕緣 雷Mt二巾該絕緣層巾料複數侧口，該些開^曝露該些 =接觸焊墊；切_電路板全板以形成複數個獨立之單 ❹ 此时^板，對該些早一電路板進行一電性測試；以及於該 二早一電路板之開口中形成複數個錫球凸塊。 讓本發明之上述和其他目的、特徵、和優點能更明 下文特舉出較佳實施例，並配合所附圖式，作 細說明如下： 【實施方式】 ^下將配合所附圖式詳細揭露本發財提魏錫球良 率^法之實_。此處該㈣是該些赋均為簡化之 ^圖’其㈣㈣方式制本翻之基核構，因此其 ，顯不與本制有社構成，且所_ =時之數目、形狀'與尺寸比製，其扣實施= :、形狀與尺寸比例為一種選擇性之設計，且其構成佈 局型態可能更為複雜。 、月參閱第1圖至第6圖將詳細說明本發明中植錫球之 八法明參見第1圖，首先提供一完成電路佈線之電路板 王板100 ’其由許多小單位的單一電路板102所組成，全 板之尺寸一般例如為1〇〇xl〇〇mm〜7〇〇x7〇〇mm，但電路板 的尺寸並非以此為限，實際上之尺寸可依製程上之需要作 201016087 調整。 接者請參見第2圖將電路板全板loo進行切割，切 割成複數個獨立之單一電路板200，其中單一電路板200 之尺寸例如為10x10 mm〜70x70 mm的範圍。切割的方法可 利用電腦數值控制（computer numerical control, CNC)程 式，將切割的程式輸入電腦中，再藉由電腦操作切割機台 以完成切割步驟，切割機台、刀具、切割時間與轉速的選 擇’皆為此技藝人士所熟知，在此不再贅述。此處需注意 ® 的是，習知係直接將電路板全板一起形成錫球凸塊，接著 再進行電性測試，雨本發明與習知技術最大的不同之處， 在於先將電路板全板切割成獨立之單一電路板，再針對單 一電路板形成錫球凸塊，由於切割後的單一電路板之座標 軸定位能較電路板全板定位更加準確，因而能因應錫球凸 塊間距縮小之趨勢，因此，切割後之單一電路板有助於後 續植錫球之步驟。 _ 請參見第3圖，將單一電路板200置入一承載盤3〇〇 中’此承載盤300係由金屬材質所組成，其作用在於承載 多片單一電路板200，以利後續植錫球製程的進行，而承 载電路板的數目並非僅限於六片，圖中所緣製之數目僅用 以舉例說明，實際上可依電路板之尺寸作調整。 請參見第4圖為對單一電路板進行電性測試的剖面 圖，此電路板200具有一第一表面402a與對應之第二表面 402b，於第一表面4〇2a上與第二表面4〇2b上形成複數個 電性接觸焊墊404，其係由金屬材料(例如銅）所組成，這些 7 201016087 電性接觸焊墊404電性連接至電路板200中之複數個導電 結構，導電結構例如導電盲孔4〇5或電鍍導通孔4〇6。應 注意的是，適用於本發明之電路板形式並非以此為限，另 可為雙層板或多層板，且有關於電路板之製程技術繁多， 其乃業界所週知之製程技術，並非本案技術特徵，故在此 不予贅述。 於第一表面402a、第二表面4〇2b與電性接觸焊墊4〇4 之上坦覆性地形成一絕緣層408，絕緣層408為一種防焊 • 材料所組成，例如為綠漆。絕緣層408係利用印刷、旋塗 及貼合之任一方式塗覆於電路板2〇〇的表面，再藉由圖案 化製程以使得絕緣層408中形成複數個開口 41〇，以曝露 電性接觸焊墊404，其中每-開口 41〇中係作為之後形成 錫球，塊之位置。第4圖中係利用一電性測試機台45〇, 測量母一電性接觸焊墊404與電路板内部線路之間電性連 接疋否正常，若電性連接無誤，再進入植錫球之步驟，若 疋發現有電性連接錯誤時，可以先將錯誤的單一電路板挑 出，以減少製程上的浪費。 明參見第5a圖為形成錫球凸塊之一實施例，此實施例 係利用微_球之方法，首先塗佈助焊师ux)5G2於開口 410中，塗佈的方法包括靜電吸附、喷附、製具沾附或製 具滴落。助焊劑之作用在於去除焊接表面的氧化物，使後 續銲錫與電性接觸焊墊404有較佳的電性接觸效果。助焊 劑之材料包括樹脂、活化、溶劑及流變控制 劑(rheological control agent)等。接著利用一填充銲錫機台 201016087 530於助焊劑502上填入銲錫材料504,銲錫材料5〇4包括 鉛、錫、銀、銅、叙、銻、鋅、鎳、銼、鎂、銦、鎵或上 述之組合，而填入銲錫材料5〇4之方法包括製具置入、靜 電吸附、真空吸附或電磁吸附。接著在足以使銲錫熔融之 條件下進行回焊製程(refl〇w)。接著如第6囷所示，於開口 41〇中形成複數個踢球凸塊600,其中該踢球凸塊6〇〇電性 連接該些電性接觸焊塾404。利用本發明之微植錫球的方 法，可使錫球凸魂之間距約小於120 μιη，較佳可達8〇·1〇〇 μιη ’相較於一般將全板一起植錫球方法（間距最低達 μιη)可達更低的間距。 參見第5ΐ>圖為形成錫球凸塊之另一實施例，此實施 例係利用模板印刷（stenci〗 printing)之方法，首先提供一具 有複數個開孔之模板.550，模板板材例如為鋼板，接著將 模板置於該單一電路板之絕緣層408之上，之後利用滚輪 在模板550上來回滚動，或利用噴灑(spraying)方式，使銲 ❿錫材料504填入模板550開孔中，其中銲錫材料5〇4包括 錯、錫、銀、銅、祕、録、辞、鎳、鍅、鎂、銦、鎵或上 述之組合。當模板550移除之後，進行回焊步驟，如第6 圖所示，使單一電路板之開口 410中形成錫球凸塊6〇〇， 其中錫球凸塊600電性連接該些電性捿觸焊塾404。 本發明先將電路板全板切割成獨立之單一電路板後， 針辦單一電路板進行電性測試’接著再進行微植錫球方法 或是模板印刷方法以形成錫球凸塊’本發明具有下述優點： 201016087 (i)單一電路板之座標定位較電路板全板對位 確’能降低製程上的失誤率。 更加準 連接(=:電== 球凸塊之 錫球_距縮小之趨；。較‘了達8(MG—’以因應 ❹ 用以發明已以數個較佳實_揭露如上，㈣並非 在不脫::=之:;可:屬麵，㈣ 餾，田“精砷和範圍内，當可作任意之更動與潤 定者為準。發明之贿範當視㈣之中請專利範圍所界 ❹ 10 201016087 【圖式簡單說明】 第1〜3圖為一系列俯視圖，用以說明本發明將電路板 全板切割成單一電路板的流程。 第4圖為一剖面圖，用以說明本發明對單一電路板進 行電性測試。 第5a、5b圖為一剖面圖，用以說明本發明植錫球之兩 種實施例。201016087 IX. Description of the invention: [Technical field to which the invention pertains]. . The present invention relates to a method of implanting a solder ball, and more particularly to a method of soldering a solder ball on a circuit board. [Prior Art] + Today, various electronic products such as communication, network dual and computer are booming. For the light and thin requirements of the mouth, many packaging technologies that can reduce the integrated circuit (1C) have also developed. Generally, when the circuit board of the circuit board is packaged, it is connected to the electrical connection pad on the circuit board by a solder bump to serve as a bridge to the external electronic device. With the miniaturization of the board, the spacing between the solder bumps and the electrical pads is also reduced. At present, the solder ball technology commonly used in the industry is to complete the circuit wiring of the whole board, and then form a solder ball bump at a specific position in the whole board, and then cut into a single circuit board according to customer requirements, and finally to a single circuit board. As an electrical test to determine if the electrical connection is normal. However, as the size and spacing of the electrical pads become smaller, the process of forming the solder ball bumps together becomes difficult to control, and often the electrical connection of many boards is found to be in error during the final electrical test. Therefore, it will be scrapped, which will result in an increase in process costs. Therefore, the industry needs to find a solution to reduce the distance between solder bumps and electrical pads. SUMMARY OF THE INVENTION The present invention provides a single circuit board solder ball method, including the following 201016087: a complete circuit board for supplying and completing circuit wiring, the circuit board full board having a first surface and a corresponding second surface; Forming a plurality of electrical contact pads on the first surface and the second surface; (4) a first surface, the surface, and the electrical contact pads are covered with an insulating lightning Mt two towels, the insulating layer of the plurality of side of the insulating material, the opening ^ exposed the = contact pad; the cutting board - the whole board to form a plurality of independent single ❹, the board, the early one board Performing an electrical test; and forming a plurality of solder ball bumps in the opening of the circuit board. The above and other objects, features, and advantages of the present invention will become more apparent from the description of the preferred embodiments illustrated herein Expose the wealth of this wealthy Wei Xiqiu yield ^ method of reality _. Here, the (4) is that the assignments are all simplified. The (4) (4) method of the system is based on the core structure, so it does not have a social composition with the system, and the number, shape, and size of the _ = Compared with the system, the buckle implementation = :, the shape and size ratio is a selective design, and its layout pattern may be more complicated. Referring to Figures 1 through 6, a detailed description of the eight methods of the solder ball in the present invention will be described. Referring to Figure 1, firstly, a circuit board for completing circuit wiring 100' is provided, which is composed of a plurality of small units of a single circuit board. The composition of 102, the size of the whole board is generally 1〇〇xl〇〇mm~7〇〇x7〇〇mm, but the size of the circuit board is not limited to this, the actual size can be made according to the needs of the process 201016087 Adjustment. Referring to Figure 2, the entire board loo is cut and cut into a plurality of independent single boards 200, wherein the size of the single board 200 is, for example, in the range of 10 x 10 mm to 70 x 70 mm. The cutting method can use the computer numerical control (CNC) program to input the cutting program into the computer, and then use the computer to operate the cutting machine to complete the cutting step, cutting machine, tool, cutting time and speed selection. 'All are familiar to the skilled person, and will not be repeated here. It should be noted here that the conventional system directly forms the solder ball bumps together with the entire board, and then conducts electrical testing. The biggest difference between the rain and the prior art is that the board is fully integrated. The board is cut into separate single circuit boards, and then the solder ball bumps are formed for a single circuit board. Since the positioning of the coordinate axis of the single circuit board after cutting can be more accurate than the whole board positioning of the circuit board, the pitch of the solder ball bumps can be reduced. The trend, therefore, the single board after cutting helps the subsequent step of soldering the ball. _ See Fig. 3, a single circuit board 200 is placed in a carrier tray 3'. This carrier tray 300 is made of a metal material, and functions to carry a plurality of single circuit boards 200 for subsequent soldering balls. The process is carried out, and the number of carrying circuit boards is not limited to six. The number of edges in the figure is only for illustration, and can actually be adjusted according to the size of the circuit board. 4 is a cross-sectional view showing electrical testing of a single circuit board. The circuit board 200 has a first surface 402a and a corresponding second surface 402b on the first surface 4〇2a and the second surface. A plurality of electrical contact pads 404 are formed on 2b, which are composed of a metal material (such as copper). These 7 201016087 electrical contact pads 404 are electrically connected to a plurality of conductive structures in the circuit board 200, such as conductive structures. Conductive blind via 4〇5 or plated via 4〇6. It should be noted that the form of the circuit board suitable for the present invention is not limited thereto, and may be a double-layer board or a multi-layer board, and has various manufacturing techniques related to the circuit board, which is a well-known process technology in the industry, and is not the case. Technical features, so I won't go into details here. An insulating layer 408 is formed over the first surface 402a, the second surface 4?2b and the electrical contact pads 4?4. The insulating layer 408 is composed of a solder resist material such as green lacquer. The insulating layer 408 is applied to the surface of the circuit board 2 by any method of printing, spin coating and bonding, and then a plurality of openings 41 are formed in the insulating layer 408 by a patterning process to expose the electrical properties. Contact pads 404, wherein each of the openings 41 is in the position to form a solder ball, the block. In Fig. 4, an electrical test machine 45 is used to measure whether the electrical connection between the mother-electric contact pad 404 and the internal circuit of the circuit board is normal. If the electrical connection is correct, then the ball is inserted. Steps, if you find that there is an electrical connection error, you can first pick out the wrong single board to reduce waste on the process. See Fig. 5a for an example of forming a solder ball bump. This embodiment uses a micro-ball method to first coat a welder ux) 5G2 in the opening 410. The coating method includes electrostatic adsorption and spraying. Attached, made with applicator or drip. The role of the flux is to remove oxides from the soldered surface, resulting in better electrical contact between the solder and the electrical contact pads 404. Materials for fluxes include resins, activation, solvents, and rheological control agents. Then, a soldering material 504 is filled on the flux 502 by using a soldering pad machine 201016087 530. The solder material 5〇4 includes lead, tin, silver, copper, arsenide, antimony, zinc, nickel, bismuth, magnesium, indium, gallium or The combination of the above, and the method of filling the solder material 5〇4 includes preparation, electrostatic adsorption, vacuum adsorption or electromagnetic adsorption. The reflow process (refl〇w) is then carried out under conditions sufficient to melt the solder. Next, as shown in FIG. 6, a plurality of kick bumps 600 are formed in the opening 41, wherein the kick bumps 6 are electrically connected to the electrical contact pads 404. By using the micro-sand ball method of the invention, the distance between the tin ball and the convex soul can be less than about 120 μηη, preferably up to 8〇·1〇〇μιη ' compared to the general method of implanting the ball together with the whole plate (pitch) A minimum of μιη) can reach a lower pitch. See Fig. 5, another embodiment of forming a solder ball bump. This embodiment uses a stencil printing method to first provide a template 550 having a plurality of openings, such as a steel plate. Then, the template is placed on the insulating layer 408 of the single circuit board, and then the roller 305 is rolled back and forth on the template 550 by using a roller, or the soldering tin material 504 is filled into the opening of the template 550 by spraying. The solder material 5〇4 includes erroneous, tin, silver, copper, secret, recorded, remarked, nickel, bismuth, magnesium, indium, gallium or a combination thereof. After the template 550 is removed, a reflow step is performed. As shown in FIG. 6, a solder ball bump 6 is formed in the opening 410 of the single circuit board, wherein the solder ball bump 600 is electrically connected to the electrical bumps. Contact welding 404. The invention firstly cuts a full board of the circuit board into a single single circuit board, and then performs a single circuit board for electrical testing. Then, a micro solder ball method or a stencil printing method is used to form a solder ball bump. The invention has The following advantages: 201016087 (i) The coordinate positioning of a single board is better than the full board of the board can reduce the error rate on the process. More accurate connection (=: electricity == ball ball _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ In the absence of::=:: can be: genus, (four) distillation, Tian "fine arsenic and within the scope, when it can be used for any change and run. The invention of the bribe is considered (four) in the patent scope界❹ 10 201016087 [Simple description of the drawings] Figures 1 to 3 are a series of top views for explaining the process of cutting a full board of a circuit board into a single circuit board. Fig. 4 is a cross-sectional view for explaining The present invention performs electrical testing on a single circuit board. Figures 5a and 5b are cross-sectional views for explaining two embodiments of the tin ball of the present invention.
第6圖為一剖面圖，用以說明本發明單一基板形成錫 球凸塊之完成圖。 【主要元件符號說明】 100〜電路板全板 102〜單一電路板 200〜切割後之單一電路板 300〜承載盤 402a ~第一表面 402b〜第二表面 404〜電性連接焊墊 405〜導電盲孔 406〜電鍍導通孔 408〜絕緣層 410〜開口 450〜電性測試機台 502〜助焊劑 504〜銲錫材料 11 201016087 530〜填充銲錫機台 550〜模板 600〜錫球凸塊Fig. 6 is a cross-sectional view for explaining the completion of forming a solder ball bump of a single substrate of the present invention. [Main component symbol description] 100 to circuit board full board 102 to a single circuit board 200 to a single board 300 to the carrier disk 402a to the first surface 402b to the second surface 404 to electrically connect the solder pads 405 to conductive blind Hole 406 ~ plating via 408 ~ insulating layer 410 ~ opening 450 ~ electrical testing machine 502 ~ flux 504 ~ solder material 11 201016087 530 ~ filling soldering machine 550 ~ template 600 ~ solder ball bump