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TW201712472A - Solid-state memory device with plurality of memory devices - Google Patents

Solid-state memory device with plurality of memory devices Download PDF

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Publication number
TW201712472A
TW201712472A TW104141784A TW104141784A TW201712472A TW 201712472 A TW201712472 A TW 201712472A TW 104141784 A TW104141784 A TW 104141784A TW 104141784 A TW104141784 A TW 104141784A TW 201712472 A TW201712472 A TW 201712472A
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Taiwan
Prior art keywords
memory
controller
stick
sticks
devices
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TW104141784A
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Chinese (zh)
Inventor
希瑞里詹姆士T
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2419265安大略公司
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Priority claimed from US14/858,552 external-priority patent/US20160011810A1/en
Priority claimed from US14/934,817 external-priority patent/US20160062696A1/en
Application filed by 2419265安大略公司 filed Critical 2419265安大略公司
Publication of TW201712472A publication Critical patent/TW201712472A/en

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    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F12/00Accessing, addressing or allocating within memory systems or architectures
    • G06F12/02Addressing or allocation; Relocation
    • G06F12/0223User address space allocation, e.g. contiguous or non contiguous base addressing
    • G06F12/023Free address space management
    • G06F12/0238Memory management in non-volatile memory, e.g. resistive RAM or ferroelectric memory
    • G06F12/0246Memory management in non-volatile memory, e.g. resistive RAM or ferroelectric memory in block erasable memory, e.g. flash memory
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2212/00Indexing scheme relating to accessing, addressing or allocation within memory systems or architectures
    • G06F2212/10Providing a specific technical effect
    • G06F2212/1016Performance improvement
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2212/00Indexing scheme relating to accessing, addressing or allocation within memory systems or architectures
    • G06F2212/72Details relating to flash memory management
    • G06F2212/7201Logical to physical mapping or translation of blocks or pages
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C5/00Details of stores covered by group G11C11/00
    • G11C5/02Disposition of storage elements, e.g. in the form of a matrix array
    • G11C5/04Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Techniques For Improving Reliability Of Storages (AREA)

Abstract

A solid-state memory device has memory devices and memory sticks. Each memory stick is coupled to a subset of the memory devices. A controller provides parallel access to the memory devices through the memory sticks to provide a virtualized memory device and to present to a host a single non-volatile storage unit with a total capacity based on capacities of the memory devices. The controller operates according to a memory mapping that map memory requests from the host to the memory devices. The memory devices, memory sticks, and the controller can be disposed within a rack unit housing that is shaped and sized to fit a data-center rack or cabinet. One or more wireless interfaces can connect the controller to a memory stick and connect a memory device to a memory stick for wireless communications of instructions and data within the solid-state memory device.

Description

具有複數個記憶體裝置的固態記憶體裝置 Solid state memory device with a plurality of memory devices

本發明係關於電子裝置,更特定言之,係關於電子記憶體裝置。 The present invention relates to electronic devices, and more particularly to electronic memory devices.

對於電腦記憶體的需求穩定地增加。現今的硬碟機有許多問題。移動部件(例如,旋轉盤)會使硬碟機不可靠。熱的產生與噪音也是一個問題。已經開發出固態硬碟,但是許多這些固態硬碟缺乏低成本的能力來有效地取代硬碟機。此外,整理較小的儲存裝置的一些已知技術仍然效率不足或者常常會有資料遺失的事件。 The demand for computer memory has steadily increased. Today's hard drives have many problems. Moving parts (for example, rotating disks) can make the hard drive unreliable. Heat generation and noise are also a problem. Solid state hard drives have been developed, but many of these solid state hard drives lack the low cost capability to effectively replace hard drives. In addition, some known techniques for organizing smaller storage devices are still inefficient or often have data loss events.

根據本發明的一態樣,固態記憶體裝置包括:機架單元殼體,機架單元殼體係塑形且設計尺寸成適於資料中心機架或機櫃;複數個記憶體裝置,複數個記憶體裝置設置在機架單元殼體內;以及複數個記憶棒,複數個記憶棒設置在機架單元殼體內。複數個記憶棒的每一記憶棒耦接至複數個記憶體裝置的一子集的記憶體裝置。固態記憶體裝置進一步包括控制器,控制器係配置成透過複數個記憶棒來平行存取複數個記憶體裝置,以存取複數個記憶體裝置作為虛擬記憶體裝置,並 且呈現給主機為具有基於複數個記憶體裝置的容量之總容量的單一非揮發性儲存單元。控制器進一步配置成根據記憶體映射來操作,以映射來自主機的記憶體請求至複數個記憶體裝置。記憶體映射界定記憶體區,記憶體區用於存取複數個記憶棒的每一記憶棒。記憶體區映射至主機所界定的複數個主機區。複數個主機區的每一主機區映射至每一記憶棒的不同記憶體裝置。複數個記憶體區的每一記憶體區係映射至不同的記憶棒,用於平行地寫入與讀取複數個記憶體區,以增加記憶體存取的速度。 According to an aspect of the present invention, a solid state memory device includes: a rack unit housing, the rack unit housing is shaped and designed to be suitable for a data center rack or cabinet; a plurality of memory devices, a plurality of memories The device is disposed in the rack unit housing; and a plurality of memory sticks, and the plurality of memory sticks are disposed in the rack unit housing. Each memory stick of the plurality of memory sticks is coupled to a memory device of a subset of the plurality of memory devices. The solid state memory device further includes a controller configured to access the plurality of memory devices in parallel through the plurality of memory sticks to access the plurality of memory devices as the virtual memory device, and And presented to the host as a single non-volatile storage unit having a total capacity based on the capacity of the plurality of memory devices. The controller is further configured to operate in accordance with the memory map to map memory requests from the host to the plurality of memory devices. The memory map defines a memory area for accessing each of the memory sticks of the plurality of memory sticks. The memory area is mapped to a plurality of host areas defined by the host. Each host area of the plurality of host areas is mapped to a different memory device of each memory stick. Each memory region of a plurality of memory regions is mapped to a different memory stick for writing and reading a plurality of memory regions in parallel to increase the speed of memory access.

控制器可包括無線介面,且複數個記憶棒的至少一記憶棒可包括無線介面。控制器的無線介面與至少一記憶棒的無線介面可配置來在控制器與至少一記憶棒之間無線通訊指令與資料。 The controller can include a wireless interface, and the at least one memory stick of the plurality of memory sticks can include a wireless interface. The wireless interface of the controller and the wireless interface of the at least one memory stick are configurable to wirelessly communicate commands and data between the controller and the at least one memory stick.

複數個記憶棒的至少一記憶棒可包括無線介面,且複數個記憶體裝置的至少一記憶體裝置可包括無線介面。至少一記憶棒的無線介面與至少一記憶體裝置的無線介面可配置來在至少一記憶棒與至少一記憶體裝置之間無線通訊指令與資料。 The at least one memory stick of the plurality of memory sticks can include a wireless interface, and the at least one memory device of the plurality of memory devices can include a wireless interface. The wireless interface of the at least one memory stick and the wireless interface of the at least one memory device are configurable to wirelessly communicate commands and data between the at least one memory stick and the at least one memory device.

固態記憶體裝置可進一步包括電源供應器,電源供應器設置在機架單元殼體內,用於提供電力給固態記憶體裝置。 The solid state memory device can further include a power supply disposed within the rack unit housing for providing power to the solid state memory device.

複數個記憶體裝置的每一記憶體裝置可包括固態硬碟。 Each memory device of the plurality of memory devices can include a solid state hard disk.

複數個記憶棒的每一記憶棒可為記憶卡棒,且複數個記憶體裝置的每一記憶體裝置可包括記憶卡。 Each of the memory sticks of the plurality of memory sticks may be a memory card, and each memory device of the plurality of memory devices may include a memory card.

該子集的記憶體裝置的每一記憶體裝置可從每一記憶棒熱插拔。 Each memory device of the subset of memory devices can be hot swapped from each memory stick.

固態記憶體裝置可進一步包括可滑動托盤,可滑動托盤支撐機架單元殼體內的複數個記憶體裝置與複數個記憶棒。可滑動托盤係配置來滑入機架單元殼體中以及滑出機架單元殼體,以檢查與熱插拔複數個記憶體裝置與複數個記憶棒的至少一者。 The solid state memory device can further include a slidable tray that supports a plurality of memory devices and a plurality of memory sticks within the frame unit housing. The slidable tray is configured to slide into the rack unit housing and slide out of the rack unit housing to inspect and thermally insert at least one of the plurality of memory devices and the plurality of memory sticks.

一種資料中心機架或機櫃可包括上述的複數個固態記憶體裝置。 A data center rack or cabinet can include the plurality of solid state memory devices described above.

根據本發明的另一態樣,固態記憶體裝置包括複數個記憶體裝置與複數個記憶棒。複數個記憶棒的每一記憶棒耦接至複數個記憶體裝置的一子集的記憶體裝置。固態記憶體裝置進一步包括控制器,控制器係配置成透過複數個記憶棒來平行存取複數個記憶體裝置,以存取複數個記憶體裝置作為虛擬記憶體裝置,並且呈現給主機為具有基於複數個記憶體裝置的容量之總容量的單一非揮發性儲存單元。控制器包括無線介面,且複數個記憶棒的至少一記憶棒包括無線介面。控制器的無線介面與至少一記憶棒的無線介面係配置來在控制器與至少一記憶棒之間無線通訊指令與資料。複數個記憶體裝置的至少一記憶體裝置包括無線介面。至少一記憶棒的無線介面與至少一記憶體裝置的無線介面係配置來在 至少一記憶棒與至少一記憶體裝置之間無線通訊指令與資料。 In accordance with another aspect of the invention, a solid state memory device includes a plurality of memory devices and a plurality of memory sticks. Each memory stick of the plurality of memory sticks is coupled to a memory device of a subset of the plurality of memory devices. The solid state memory device further includes a controller configured to access a plurality of memory devices in parallel through the plurality of memory sticks to access the plurality of memory devices as virtual memory devices, and present to the host as having a basis A single non-volatile storage unit of the total capacity of the plurality of memory devices. The controller includes a wireless interface, and the at least one memory stick of the plurality of memory sticks includes a wireless interface. The wireless interface of the controller and the wireless interface of the at least one memory stick are configured to wirelessly communicate commands and data between the controller and the at least one memory stick. At least one memory device of the plurality of memory devices includes a wireless interface. The wireless interface of at least one memory stick is configured with the wireless interface of at least one memory device Wireless communication instructions and data between at least one memory stick and at least one memory device.

控制器可進一步配置成根據記憶體映射來操作,以映射來自主機的記憶體請求至複數個記憶體裝置。記憶體映射可界定記憶體區,記憶體區用於存取複數個記憶棒的每一記憶棒。記憶體區可映射至主機所界定的複數個主機區。複數個主機區的每一主機區可映射至與每一記憶棒相關的不同的記憶體裝置。複數個記憶體區的每一記憶體區可映射至不同的記憶棒,用於平行地寫入與讀取複數個記憶體區,以增加記憶體存取的速度。 The controller can be further configured to operate in accordance with the memory map to map memory requests from the host to the plurality of memory devices. The memory map can define a memory area for accessing each of the memory sticks of the plurality of memory sticks. The memory area can be mapped to a plurality of host areas defined by the host. Each host area of the plurality of host areas can be mapped to a different memory device associated with each memory stick. Each memory region of a plurality of memory regions can be mapped to different memory sticks for writing and reading a plurality of memory regions in parallel to increase the speed of memory access.

複數個記憶棒的每一記憶棒可包括無線介面,使得所有記憶棒係配置成無線通訊指令與資料於控制器。 Each of the memory sticks of the plurality of memory sticks may include a wireless interface such that all of the memory sticks are configured to wirelessly communicate commands and data to the controller.

複數個記憶體裝置的每一記憶體裝置包括無線介面,使得所有記憶體裝置係配置成無線通訊指令與資料於複數個記憶棒。 Each memory device of the plurality of memory devices includes a wireless interface such that all of the memory devices are configured to wirelessly communicate commands and data to a plurality of memory sticks.

複數個記憶體裝置的每一記憶體裝置可包括固態硬碟。 Each memory device of the plurality of memory devices can include a solid state hard disk.

複數個記憶棒的每一記憶棒可為記憶卡棒,且複數個記憶體裝置的每一記憶體裝置可包括記憶卡。 Each of the memory sticks of the plurality of memory sticks may be a memory card, and each memory device of the plurality of memory devices may include a memory card.

該子集的記憶體裝置的每一記憶體裝置可從每一記憶棒熱插拔。 Each memory device of the subset of memory devices can be hot swapped from each memory stick.

固態記憶體裝置可進一步包括機架單元殼體,機架單元殼體係塑形且設計尺寸成適於資料中心機架或機櫃。複數個記憶體裝置、複數個記憶棒、與控制器可設置在機架單元殼體內。 The solid state memory device can further include a rack unit housing that is shaped and sized to fit a data center rack or cabinet. A plurality of memory devices, a plurality of memory sticks, and a controller may be disposed in the frame unit housing.

固態記憶體裝置可進一步包括可滑動托盤,可滑動托盤支撐機架單元殼體內的複數個記憶體裝置與複數個記憶棒。可滑動托盤係配置來滑入機架單元殼體中以及滑出機架單元殼體,以檢查與熱插拔複數個記憶體裝置與複數個記憶棒的至少一者。 The solid state memory device can further include a slidable tray that supports a plurality of memory devices and a plurality of memory sticks within the frame unit housing. The slidable tray is configured to slide into the rack unit housing and slide out of the rack unit housing to inspect and thermally insert at least one of the plurality of memory devices and the plurality of memory sticks.

10‧‧‧記憶體裝置 10‧‧‧ memory device

12‧‧‧殼體 12‧‧‧ housing

14‧‧‧連接器 14‧‧‧Connector

16‧‧‧開孔 16‧‧‧Opening

18‧‧‧記憶卡 18‧‧‧ memory card

19‧‧‧指示器 19‧‧‧ indicator

20‧‧‧固態記憶體裝置 20‧‧‧ solid state memory device

22‧‧‧殼體 22‧‧‧ housing

24‧‧‧USB纜線 24‧‧‧USB cable

42‧‧‧實體連接器 42‧‧‧ physical connector

44‧‧‧實體介面 44‧‧‧Physical interface

46‧‧‧介面控制器 46‧‧‧Interface controller

48‧‧‧序列周邊介面 48‧‧‧Sequence peripheral interface

50‧‧‧記憶卡連接器 50‧‧‧ memory card connector

52‧‧‧控制器核心 52‧‧‧Controller core

54‧‧‧指令記憶體 54‧‧‧Instruction Memory

56‧‧‧工作記憶體控制器 56‧‧‧ working memory controller

58‧‧‧工作記憶體 58‧‧‧ working memory

60‧‧‧USB主機裝置 60‧‧‧USB host device

62‧‧‧現場可編程閘陣列(FPGA) 62‧‧‧ Field Programmable Gate Array (FPGA)

64‧‧‧印刷電路板(PCB) 64‧‧‧Printed circuit board (PCB)

70‧‧‧USB列舉資訊 70‧‧‧USB listing information

72‧‧‧命令映射 72‧‧‧Command Mapping

74‧‧‧檔案路由表 74‧‧‧File Routing Table

80‧‧‧檔案系統 80‧‧‧File System

82‧‧‧檔案 82‧‧‧Files

84‧‧‧檔案句柄 84‧‧‧File handle

86‧‧‧檔案句柄對 86‧‧‧File handle pair

90‧‧‧基板 90‧‧‧Substrate

92‧‧‧連接器部 92‧‧‧Connector Department

94‧‧‧撓性纜線 94‧‧‧Flexible cable

96‧‧‧帶狀纜線 96‧‧‧Band cable

100‧‧‧固態記憶體裝置 100‧‧‧ solid state memory device

102‧‧‧殼體 102‧‧‧ housing

104‧‧‧控制器板 104‧‧‧Controller board

106‧‧‧記憶卡棒 106‧‧‧ memory card stick

108‧‧‧SATA埠 108‧‧‧ SATA埠

110‧‧‧USB埠 110‧‧‧USB埠

112‧‧‧記憶卡 112‧‧‧ memory card

120‧‧‧SATA控制器 120‧‧‧SATA controller

122‧‧‧電源埠 122‧‧‧Power supply埠

124‧‧‧電源調節器 124‧‧‧Power conditioner

126‧‧‧SPI 126‧‧‧SPI

128‧‧‧SPI控制器 128‧‧‧SPI controller

130‧‧‧記憶棒連接器 130‧‧‧Memory Stick Connector

140‧‧‧PCB 140‧‧‧PCB

142‧‧‧實體連接器 142‧‧‧ physical connector

144‧‧‧緩衝器 144‧‧‧buffer

150‧‧‧記憶體區 150‧‧‧ memory area

152‧‧‧寬度 152‧‧‧Width

154‧‧‧主機區 154‧‧‧Host area

160‧‧‧機架單元 160‧‧‧Rack unit

162‧‧‧固態記憶體裝置 162‧‧‧ solid state memory device

164‧‧‧記憶卡棒 164‧‧‧ memory card stick

166‧‧‧殼體 166‧‧‧ housing

168‧‧‧電源供應器 168‧‧‧Power supply

169‧‧‧蓋體 169‧‧‧ cover

180‧‧‧資料中心機架或機櫃 180‧‧‧Data Center Rack or Cabinet

190‧‧‧資料中心機架或機櫃 190‧‧‧Data Center Rack or Cabinet

192‧‧‧固態記憶體裝置 192‧‧‧ solid state memory device

200‧‧‧控制器 200‧‧‧ controller

202‧‧‧記憶棒 202‧‧‧ Memory Stick

204‧‧‧記憶體裝置 204‧‧‧ memory device

206‧‧‧控制邏輯與記憶體 206‧‧‧Control logic and memory

208‧‧‧無線介面 208‧‧‧Wireless interface

210‧‧‧主機無線連結 210‧‧‧Host wireless connection

212‧‧‧無線介面 212‧‧‧Wireless interface

214‧‧‧控制器無線連結 214‧‧‧ Controller Wireless Link

216‧‧‧緩衝器 216‧‧‧buffer

218‧‧‧無線介面 218‧‧‧Wireless interface

220‧‧‧記憶體無線連結 220‧‧‧Memory Wireless Link

222‧‧‧記憶體 222‧‧‧ memory

250‧‧‧機架單元 250‧‧‧Rack unit

252‧‧‧托盤 252‧‧‧Tray

254‧‧‧導軌 254‧‧‧rail

256‧‧‧中間的可滑動導軌 256‧‧‧Sliding guide rail in the middle

258‧‧‧基座導軌 258‧‧‧Base rail

270‧‧‧組件 270‧‧‧ components

圖式僅藉由範例之方式例示本發明的實施例。 The drawings illustrate embodiments of the invention by way of example only.

第1圖根據一些實施例,為固態記憶體裝置的透視圖。 Figure 1 is a perspective view of a solid state memory device, in accordance with some embodiments.

第2圖根據其他實施例,為固態記憶體裝置的透視圖。 Figure 2 is a perspective view of a solid state memory device, in accordance with other embodiments.

第3圖為固態記憶體裝置的方塊圖。 Figure 3 is a block diagram of a solid state memory device.

第4圖為指令記憶體的元件的方塊圖。 Figure 4 is a block diagram of the components of the instruction memory.

第5圖為檔案路由表與檔案系統的方塊圖。 Figure 5 is a block diagram of the file routing table and file system.

第6a圖至第6b圖根據其他實施例,為固態記憶體裝置的示意圖。 6a to 6b are schematic views of a solid state memory device, according to other embodiments.

第7圖根據另外的實施例,為固態記憶體裝置的透視圖。 Figure 7 is a perspective view of a solid state memory device, in accordance with additional embodiments.

第8圖為例如第7圖所示的固態記憶體裝置的方塊圖。 Figure 8 is a block diagram of a solid state memory device such as shown in Figure 7.

第9圖為具有複數個記憶卡的記憶卡棒的圖示。 Figure 9 is an illustration of a memory card with a plurality of memory cards.

第10圖為記憶體映射的圖示。 Figure 10 is a graphical representation of memory mapping.

第11圖根據一實施例,為機架單元的透視圖。 Figure 11 is a perspective view of a rack unit, in accordance with an embodiment.

第12圖根據一實施例,為資料中心機架的透視圖。 Figure 12 is a perspective view of a data center rack, in accordance with an embodiment.

第13圖根據另一實施例,為另一資料中心機架的透視圖。 Figure 13 is a perspective view of another data center rack, according to another embodiment.

第14圖根據另一實施例,為固態記憶體裝置的方塊圖。 Figure 14 is a block diagram of a solid state memory device, according to another embodiment.

第15圖根據另一實施例,為機架單元的透視圖。 Figure 15 is a perspective view of a rack unit, according to another embodiment.

第16圖根據一實施例,為滑動導軌配置的側視圖。 Figure 16 is a side elevational view of a sliding rail arrangement, in accordance with an embodiment.

第17圖根據一實施例,為機架單元的組件的透視圖。 Figure 17 is a perspective view of the components of the rack unit, in accordance with an embodiment.

本發明係關於一種固態記憶體裝置,允許複數個可移除式記憶卡模擬通用序列匯流排(USB)大容量儲存裝置、序列ATA(SATA)硬碟機、或類似的裝 置。這提供在記憶卡庫內儲存大量資料的能力,同時保持已知的儲存裝置的方便性與功能性。 The present invention relates to a solid state memory device that allows a plurality of removable memory cards to emulate a universal serial bus (USB) mass storage device, a serial ATA (SATA) hard disk drive, or the like. Set. This provides the ability to store large amounts of data in a memory card library while maintaining the convenience and functionality of known storage devices.

第1圖繪示固態記憶體裝置10。記憶體裝置10包括殼體12,殼體12具有連接器14,例如USB Type A的插頭,連接器14直接從殼體12突伸,以給予記憶體裝置10類似於可攜式USB記憶棒的結構。殼體12另外包括開孔16,開孔16對準於位於殼體12內的複數個記憶卡連接器,以允許複數個可移除式記憶卡18的插設與移除。指示器19(例如,紅與綠雙色狀態的發光二極體(LED))可提供來指示讀取/寫入存取及/或故障。雖然繪示兩個開孔16,任何數量的開孔16都可提供,以接收任何數量的可移除式記憶卡18。固態記憶體裝置10為可攜式,並且可直接插入至任何合適的USB主機裝置,例如電腦。 FIG. 1 illustrates a solid state memory device 10. The memory device 10 includes a housing 12 having a connector 14, such as a USB Type A plug, that protrudes directly from the housing 12 to give the memory device 10 a portable USB memory stick. structure. The housing 12 additionally includes an aperture 16 that is aligned with a plurality of memory card connectors located within the housing 12 to permit insertion and removal of the plurality of removable memory cards 18. An indicator 19 (eg, a red and green bi-color light emitting diode (LED)) can be provided to indicate read/write access and/or failure. Although two apertures 16 are shown, any number of apertures 16 can be provided to receive any number of removable memory cards 18. The solid state memory device 10 is portable and can be plugged directly into any suitable USB host device, such as a computer.

第2圖繪示固態記憶體裝置20。本文所述的其他實施例的特徵與態樣可用於目前所述的實施例,且可參照類似標識的元件的敘述。記憶體裝置20包括殼體22與連接器14,例如USB Type A的插頭,連接器14藉由USB纜線24而附接至殼體內所容納的電路板。殼體22另外包括開孔16,開孔16對準於位於殼體12內的複數個記憶卡連接器,以允許複數個可移除式記憶卡18的插設與移除。也可提供狀態指示器(未圖示)。雖然繪示十個開孔16,任何數量的開孔16都可提供,以接收任何數量的可移除式記憶卡18。固態記憶體裝置20可使用 作為固定的或可攜式儲存器,其中纜線24允許固態記憶體裝置20插入至任何合適的USB主機裝置,例如電腦。 FIG. 2 illustrates the solid state memory device 20. The features and aspects of other embodiments described herein can be used with the presently described embodiments, and reference to the description of similarly identified elements. The memory device 20 includes a housing 22 and a connector 14, such as a USB Type A plug, which is attached to the circuit board housed within the housing by a USB cable 24. The housing 22 additionally includes an aperture 16 that is aligned with a plurality of memory card connectors located within the housing 12 to permit insertion and removal of the plurality of removable memory cards 18. A status indicator (not shown) is also available. Although ten apertures 16 are shown, any number of apertures 16 can be provided to receive any number of removable memory cards 18. Solid state memory device 20 can be used As a fixed or portable storage, the cable 24 allows the solid state memory device 20 to be plugged into any suitable USB host device, such as a computer.

可移除式記憶卡18可為安全數位(SD,Secure Digital)卡、miniSD卡、或microSD卡。此種卡的儲存容量可為任何可用的大小,例如16GB、64GB、128GB、1TB等,只要卡的數量與選擇的檔案系統支援此種容量即可。 The removable memory card 18 can be a Secure Digital (SD) card, a miniSD card, or a microSD card. The storage capacity of such a card can be any available size, such as 16 GB, 64 GB, 128 GB, 1 TB, etc., as long as the number of cards and the selected file system support such capacity.

第3圖繪示固態記憶體裝置的方塊圖,例如第1圖與第2圖的固態記憶體裝置10、20以及部分繪示在第6a圖至第6b圖中的裝置。第3圖所示的記憶體裝置的元件為範例,且下文討論的功能可用其他種類的元件、較少的較廣義元件、或較多數量的較專用元件來實施。 Figure 3 is a block diagram of a solid state memory device, such as solid state memory devices 10, 20 of Figures 1 and 2, and devices partially depicted in Figures 6a through 6b. The components of the memory device shown in FIG. 3 are examples, and the functions discussed below may be implemented with other kinds of components, fewer generalized components, or a greater number of more specialized components.

固態記憶體裝置包括實體連接器42、連接至實體連接器42的實體介面44、連接至實體介面44的介面控制器46、以及序列周邊介面(SPI,serial peripheral interface)48。複數個記憶卡連接器50連接至SPI 48。每一記憶卡連接器50係配置來接收可移除式記憶卡18。記憶體裝置另外包括控制器核心52,控制器核心52連接在介面控制器46與序列周邊介面48之間,以管理對於記憶卡18的總容量之大容量儲存類型的存取。記憶體裝置可另外包括連接至控制器核心52的指令記憶體54、連接至控制器核心52的工作記憶體控制 器56、以及連接至工作記憶體控制器56的工作記憶體58。 The solid state memory device includes a physical connector 42, a physical interface 44 coupled to the physical connector 42, an interface controller 46 coupled to the physical interface 44, and a serial peripheral interface (SPI) 48. A plurality of memory card connectors 50 are connected to the SPI 48. Each memory card connector 50 is configured to receive a removable memory card 18. The memory device additionally includes a controller core 52 coupled between the interface controller 46 and the serial peripheral interface 48 to manage access to a mass storage type of the total capacity of the memory card 18. The memory device can additionally include a command memory 54 coupled to the controller core 52 and a working memory control coupled to the controller core 52. The device 56, and the working memory 58 connected to the working memory controller 56.

在一些實施例中,實體連接器42為通用序列匯流排(USB)連接器,包括USB Type A的插頭,可連接至USB主機裝置60,例如電腦。或者,USB連接器14可包括另一種USB連接器或者根據另一種標準所製成的連接器。 In some embodiments, the physical connector 42 is a universal serial bus (USB) connector, including a plug of USB Type A, connectable to a USB host device 60, such as a computer. Alternatively, the USB connector 14 can include another USB connector or a connector made according to another standard.

在一些實施例中,實體介面44為USB實體介面44,配置來轉譯USB控制器46(USB控制器46以8位元封包操作)與在USB連接器42處的兩個USB D+與D-信號線之間的數位邏輯信號。USB實體介面44可包括高速USB收發器晶片,例如在亞利桑那州的錢德勒(Chandler)市的微晶科技(Microchip Technology)的指定USB3319之下可用的那些。 In some embodiments, the physical interface 44 is a USB physical interface 44 configured to translate the USB controller 46 (the USB controller 46 operates in 8-bit packets) and the two USB D+ and D-signals at the USB connector 42. A digital logic signal between lines. The USB physical interface 44 may include a high speed USB transceiver chip, such as those available under the designated USB 3319 of Microchip Technology, Chandler, Arizona.

在一些實施例中,介面控制器46為USB控制器46,配置來在USB實體介面44與控制器核心52之間轉移資料、讀取/寫入命令、以及交握(handshaking)與流動控制的通訊。USB控制器46以8位元封包操作。 In some embodiments, the interface controller 46 is a USB controller 46 configured to transfer data, read/write commands, and handshaking and flow control between the USB physical interface 44 and the controller core 52. communication. The USB controller 46 operates in an 8-bit packet.

USB連接器14、實體介面44、與控制器46可根據USB 2.0規格、USB 3.0規格、或類似者來實施。 The USB connector 14, the physical interface 44, and the controller 46 can be implemented in accordance with the USB 2.0 specification, the USB 3.0 specification, or the like.

SPI 48提供控制器核心52與複數個記憶卡18之間的通訊。在一範例中,SPI 48係配置來轉譯來自控制器核心52的32位元讀取與寫入操作成為用於記 憶卡18的1位元或4位元命令與資料週期。SPI 48也可連接至指示器19(第1圖),並且控制指示器19根據讀取/寫入存取及/或故障狀況來照明。 The SPI 48 provides communication between the controller core 52 and a plurality of memory cards 18. In one example, the SPI 48 is configured to translate 32-bit read and write operations from controller core 52 into Recall the 1-bit or 4-bit command and data cycle of card 18. The SPI 48 can also be connected to the indicator 19 (Fig. 1), and the control indicator 19 illuminates according to read/write access and/or fault conditions.

連接器50提供實體連接至可移除式記憶卡18。連接器50可為現售的(off-the-shelf)物品,允許可移除式記憶卡18的實體移除與更換。但是,在一些實施例中,可移除式記憶卡18可卡固在定位,例如藉由殼體的形狀或其他方式,以實體上防止記憶卡18的移除。 The connector 50 provides a physical connection to the removable memory card 18. The connector 50 can be an off-the-shelf item that allows for physical removal and replacement of the removable memory card 18. However, in some embodiments, the removable memory card 18 can be snapped in place, such as by the shape of the housing or otherwise, to physically prevent removal of the memory card 18.

控制器核心52係配置來呈現可移除式記憶卡18給主機60作為具有總容量實質上等於可移除式記憶卡18的個別容量的總和之單一非揮發性儲存單元。在一些實施例中,控制器核心52操作於從USB控制器46接收的輸入8位元封包,並且同樣提供輸出8位元封包給USB控制器46,以傳送至主機60。控制器核心52係配置來解碼與回應從主機60接收的封包,並且在主機60與複數個可移除式記憶卡18之間通訊資料。因此,控制器核心52可配置來根據USB大容量儲存級裝置協定來操作複數個可移除式記憶卡18,並且可因此實施來回應於當主機60連接至USB大容量儲存級裝置時會發出的任何USB狀態/命令/請求封包。在其他實施例中,例如SATA的實施,控制器核心52操作於不同大小的封包或其他資料結構。 The controller core 52 is configured to present the removable memory card 18 to the host 60 as a single non-volatile storage unit having a total capacity substantially equal to the sum of the individual capacities of the removable memory card 18. In some embodiments, controller core 52 operates on an input 8-bit packet received from USB controller 46 and also provides an output 8-bit packet to USB controller 46 for transmission to host 60. Controller core 52 is configured to decode and respond to packets received from host 60 and to communicate data between host 60 and a plurality of removable memory cards 18. Thus, controller core 52 can be configured to operate a plurality of removable memory cards 18 in accordance with a USB mass storage class device protocol, and can thus be implemented in response to when host 60 is connected to a USB mass storage level device. Any USB status / command / request packet. In other embodiments, such as the implementation of SATA, controller core 52 operates on packets of different sizes or other data structures.

控制器核心52可進一步配置來使用工作記憶體58作為緩衝器,用於在主機60與複數個可移除式記憶卡18之間通訊的資料。控制器核心52可實施為可編程狀態機、固定邏輯結構、或這些的組合。控制器核心52可配置來操作於32位元邏輯。 Controller core 52 may be further configured to use working memory 58 as a buffer for communicating data between host 60 and a plurality of removable memory cards 18. Controller core 52 can be implemented as a programmable state machine, a fixed logic structure, or a combination of these. Controller core 52 is configurable to operate on 32 bit logic.

指令記憶體54儲存USB列舉資訊(USB列舉資訊是一種命令映射,用於可由主機60發出並且由控制器核心52回應的命令)以及用於複數個可移除式記憶卡18的一或更多個檔案路由表(file routing tables)。指令記憶體54可另外包括高速暫存記憶體(scratch pad memory),用於控制器核心52的使用。命令映射可配置有可由主機60請求的標準儲存存取命令。 The instruction memory 54 stores USB enumeration information (USB enumeration information is a command map for commands that can be issued by the host 60 and responded by the controller core 52) and one or more for the plurality of removable memory cards 18. File routing tables. The instruction memory 54 may additionally include a scratch pad memory for use by the controller core 52. The command map can be configured with standard storage access commands that can be requested by host 60.

介面控制器46、控制器核心52、指令記憶體54、與工作記憶體控制器56可用現場可編程閘陣列(FPGA)62(例如,Xilinx公司的Spartan6)來實施,或者實施作為可在微處理器上執行的程式編碼。 Interface controller 46, controller core 52, instruction memory 54, and working memory controller 56 may be implemented with Field Programmable Gate Array (FPGA) 62 (eg, Spartan 6 from Xilinx Corporation), or implemented as micro-processable The code of the program executed on the device.

工作記憶體控制器56允許控制器核心52存取工作記憶體58,工作記憶體58由控制器核心52使用作為在主機60與複數個可移除式記憶卡18之間通訊的資料的緩衝器。在此範例中,工作記憶體58包括16位元DDR2 RAM,且工作記憶體控制器56係配置來轉譯來自控制器核心52的32位元讀取與寫入請求成為用於工作記憶體58的16位元資料、位址、刷新、與控制週期。 The working memory controller 56 allows the controller core 52 to access the working memory 58, which is used by the controller core 52 as a buffer for data communicated between the host 60 and the plurality of removable memory cards 18. . In this example, working memory 58 includes a 16-bit DDR2 RAM, and working memory controller 56 is configured to translate 32-bit read and write requests from controller core 52 into working memory 58. 16-bit data, address, refresh, and control cycles.

除了實體連接器42的選擇性排除以外,在一些實施例中,固態記憶體裝置的所有元件可設置在多層印刷電路板(PCB)64中,印刷電路板(PCB)64由殼體(例如,第1圖至第2圖的殼體12、22)圍繞。當固態記憶體裝置10具有USB鑰匙外形時,實體連接器42也可設置在相同的PCB 64上,如同第1圖所示。在其他實施例中(第2圖與第6b圖),實體連接器42可纜線連接至PCB 64,以提供桌上型外形。 In addition to the selective exclusion of the physical connector 42, in some embodiments, all of the components of the solid state memory device can be disposed in a multilayer printed circuit board (PCB) 64 that is comprised of a housing (eg, The housings 12, 22) of Figures 1 to 2 are surrounded. When the solid state memory device 10 has a USB key shape, the physical connector 42 can also be disposed on the same PCB 64 as shown in FIG. In other embodiments (Figs. 2 and 6b), the physical connector 42 can be cabled to the PCB 64 to provide a desktop form factor.

如同第4圖所示,在一些實施例中,指令記憶體54儲存USB列舉資訊70。USB列舉資訊70包括裝置描述符、組態描述符、介面描述符、以及主機60執行USB列舉序列所需的任何進一步資訊。 As shown in FIG. 4, in some embodiments, the instruction memory 54 stores USB enumeration information 70. The USB enumeration information 70 includes device descriptors, configuration descriptors, interface descriptors, and any further information required by the host 60 to perform a USB enumeration sequence.

指令記憶體54可另外儲存命令映射72。命令映射72映射預期由主機60發出的命令(例如,USB或ATA命令)至相容於記憶卡18上所使用的檔案系統之命令(例如,ATA命令)。 Instruction memory 54 may additionally store command map 72. The command map 72 maps commands (e.g., USB or ATA commands) that are expected to be issued by the host 60 to commands (e.g., ATA commands) that are compatible with the file system used on the memory card 18.

指令記憶體54可另外儲存檔案路由表74。 Instruction memory 54 may additionally store file routing table 74.

如同第5圖所示,每一記憶卡18在其自身專用的檔案系統80之下操作。在一些實施例中,檔案系統為FAT32。在其他實施例中,其他檔案系統都可使用,例如NTFS、exFAT、與類似者。在一些實施例中,每一記憶卡18具有其自身獨立的檔案系統,並且若移除時,可個別存取。給定的記憶卡18中的檔案82的檔案句 柄(file handle)是獨特的,但是當考慮到二或更多個記憶卡18時,這並不一定要如此。 As shown in Figure 5, each memory card 18 operates under its own dedicated file system 80. In some embodiments, the file system is FAT32. In other embodiments, other file systems may be used, such as NTFS, exFAT, and the like. In some embodiments, each memory card 18 has its own separate file system and, if removed, can be accessed individually. File file of file 82 in a given memory card 18 The file handle is unique, but this is not necessarily the case when two or more memory cards 18 are considered.

檔案路由表74儲存關於記憶卡18的資訊,並且允許記憶卡18呈現給主機60作為具有總容量等於記憶卡18的加總容量之單一、大儲存容量。這可例如藉由如此來達成:檔案路由表74儲存一組獨特的、主機面向的檔案句柄84(檔案句柄84映射至上層組的獨特容量)以及檔案系統80中的該等組檔案句柄的檔案句柄對86。該組獨特檔案句柄84本身係配置成由檔案系統(例如FAT32或類似者)遵守,主機60把檔案句柄84看成單一大容量。因此,當存取特定的檔案時,主機60使用該組中的檔案句柄84,且此種主機面向檔案句柄係轉譯成該組的檔案句柄對86與容量,以用於存取正確的記憶卡18與記憶卡18上的正確檔案。 The file routing table 74 stores information about the memory card 18 and allows the memory card 18 to be presented to the host 60 as a single, large storage capacity having a total capacity equal to the aggregate capacity of the memory card 18. This can be accomplished, for example, by the file routing table 74 storing a unique set of host-oriented file handles 84 (the file handles 84 are mapped to the unique capacity of the upper group) and the files of the group file handles in the file system 80. The handle is on 86. The set of unique file handles 84 are themselves configured to be followed by a file system (e.g., FAT32 or the like), and the host 60 views the file handles 84 as a single large capacity. Thus, when accessing a particular file, host 60 uses file handles 84 in the group, and such host-oriented file handles are translated into the set of file handle pairs 86 and capacity for accessing the correct memory card. 18 with the correct file on the memory card 18.

檔案路由表74可配置成:對主機60顯示為目錄表。但是,檔案路由表74利用獨特的容量與檔案句柄對86(獨特識別記憶卡18中的檔案)取代目錄表的結構元件(例如,起始叢集、檔案大小等)。 The file routing table 74 can be configured to display the host 60 as a table of contents. However, the file routing table 74 replaces the structural elements of the table of contents (e.g., starting cluster, file size, etc.) with a unique capacity and file handle pair 86 (a file in the unique identification memory card 18).

檔案句柄可為檔案名、檔案名與擴展名、或檔案系統本地的其他識別符。主機面向檔案句柄84之間的牴觸(當不同記憶卡18的二或更多個檔案82具有相同的檔案名時可能發生)可如此避免:藉由增加數字字尾或類似者至主機面向檔案句柄84。 The file handle can be a file name, a file name and an extension, or other identifier local to the file system. The host-to-file handle 84 (which may occur when two or more files 82 of different memory cards 18 have the same file name) can be avoided by adding a digital suffix or similar to the host-oriented file. Handle 84.

此外,在一些實施例中,檔案路由表74的邏輯係限制成完全儲存一個記憶卡18中的給定檔案。為了達成此目的,檔案路由表74或與其相關的另一種表可保持代表記憶卡18的剩餘儲存容量之值。在新檔案寫入之前,控制器核心52可檢查檔案路由表74,以識別個別具有足夠的剩餘空間來儲存整個檔案的每一記憶卡18。控制器核心52然後選擇個別具有足夠空間來儲存檔案的一個記憶卡18。檔案並不允許跨存多個記憶卡18,這可協助減少在一些種類的傳統硬碟機跨存技術中有發現到的資料遺失的可能性,並且進一步可允許記憶卡18的熱插拔以及允許記憶卡18的個別使用的移除。 Moreover, in some embodiments, the logic of the file routing table 74 is limited to completely storing a given file in a memory card 18. To accomplish this, the file routing table 74 or another table associated therewith can maintain a value representative of the remaining storage capacity of the memory card 18. Prior to writing the new file, controller core 52 may examine file routing table 74 to identify each memory card 18 that has sufficient remaining space to store the entire file. Controller core 52 then selects a memory card 18 that individually has sufficient space to store the file. The file does not allow for the splicing of multiple memory cards 18, which may help reduce the likelihood of data loss found in some types of conventional hard disk drive technology, and may further allow hot swapping of the memory card 18 and The removal of the individual use of the memory card 18 is allowed.

當檔案路由表74並未正確格式化為與主機60所見的總容量的檔案系統相容的目錄表時,控制器核心52可配置來產生檔案路由表74的表示,以在主機60要求存取時能夠相容。此種表示可即時產生並且可快速緩衝儲存,以用於後續使用。因此,額外的資訊(例如,記憶卡的可用空間)可儲存在檔案路由表74中,且控制器核52可配置成並不回應於存取命令提供此種資訊至主機60。或者,使用二或更多個檔案路由表74,其中一個此種表74模擬成有益主機60的目錄表,且剩餘的一或更多個此種表儲存關於記憶卡18與記憶卡18上的檔案之其他資訊(例如可用空間)。 When the file routing table 74 is not properly formatted into a directory table that is compatible with the file system of the total capacity seen by the host 60, the controller core 52 can be configured to generate a representation of the file routing table 74 to request access at the host 60. Can be compatible. Such representations can be generated on the fly and can be quickly buffered for later use. Thus, additional information (eg, available space on the memory card) can be stored in the file routing table 74, and the controller core 52 can be configured to provide such information to the host 60 in response to an access command. Alternatively, two or more file routing tables 74 are used, one such table 74 being modeled as a table of contents for the benefit host 60, and the remaining one or more such tables are stored on the memory card 18 and on the memory card 18. Additional information about the file (such as available space).

當記憶卡18移除、加入、或插拔時,控制器核心52可配置來重新列舉與掃描固態儲存裝置,以驗 證、產生、或刪除檔案路由表中該等組的檔案句柄84、86之間的關係。掃描包括控制器核心52獲得每一檔案系統80的目錄,並且若沒有此種檔案句柄存在,則產生用於此種目錄的每一檔案之獨特的、該組主機面向檔案句柄84。掃描進一步包括針對與已經移除的記憶卡18相關的容量,從主機面向組84移除檔案句柄。當新插入的記憶卡18上的檔案具有與已經存在的記憶卡18上的檔案句柄相同的檔案句柄時,控制器核心52可配置成藉由增加字尾至檔案名(例如,「my file」與「my file(1)」),來產生一個此種檔案的主機面向檔案句柄。此種檔案的實際檔案名並未改變。 When the memory card 18 is removed, added, or plugged in, the controller core 52 can be configured to re-enumerate and scan the solid state storage device for verification The relationship between the file handles 84, 86 of the groups in the file routing table is verified, generated, or deleted. The scan includes the controller core 52 obtaining a directory for each file system 80, and if no such file handle exists, a unique set of host-oriented file handles 84 for each file of such a directory is generated. The scanning further includes removing the file handle from the host to group 84 for the capacity associated with the memory card 18 that has been removed. When the file on the newly inserted memory card 18 has the same file handle as the file handle on the existing memory card 18, the controller core 52 can be configured to increase the suffix to the file name (eg, "my file" With "my file(1)"), the host that generates such a file is oriented to the file handle. The actual file name of such a file has not changed.

在其他實施例中,控制器核心52係配置來操作複數個可移除式記憶卡18作為獨立磁碟備援陣列(RAID,redundant array of independent disks)。可實施RAID鏡射,以允許資料冗餘,來協助防止資料遺失。可使用任何實用的RAID級別(例如,RAID 1、RAID 2等)。在一些RAID實施中,記憶卡18不可插拔,因為這會損壞RAID資料。在其他實施例中,控制器核心52係配置來提供資料加密,以提供高度安全且容錯的大容量儲存裝置。 In other embodiments, controller core 52 is configured to operate a plurality of removable memory cards 18 as redundant array of independent disks (RAID). RAID mirroring can be implemented to allow data redundancy to help prevent data loss. Any useful RAID level can be used (for example, RAID 1, RAID 2, etc.). In some RAID implementations, the memory card 18 is not pluggable because it can corrupt the RAID data. In other embodiments, controller core 52 is configured to provide data encryption to provide a highly secure and fault tolerant mass storage device.

第6a圖至第6b圖例示其他實施例,其中固態記憶體裝置係配置來在標準的3.5吋硬碟殼體內提供多個記憶卡。本文所述的其他實施例的特徵與態樣可用於目前所述的實施例,且可參照類似標識的元件的敘述。 複數個記憶卡連接器50設置在基板90上,例如PCB。基板90包括連接器部92,用於接收撓性纜線94的連接,以電連接記憶卡連接器50至撓性纜線94。複數個記憶卡18可耦接至記憶卡連接器50。 Figures 6a through 6b illustrate other embodiments in which the solid state memory device is configured to provide a plurality of memory cards within a standard 3.5 inch hard disk housing. The features and aspects of other embodiments described herein can be used with the presently described embodiments, and reference to the description of similarly identified elements. A plurality of memory card connectors 50 are disposed on the substrate 90, such as a PCB. The substrate 90 includes a connector portion 92 for receiving a connection of the flexible cable 94 to electrically connect the memory card connector 50 to the flexible cable 94. A plurality of memory cards 18 can be coupled to the memory card connector 50.

基板90的數個組件、記憶卡連接器50、與安裝的記憶卡18可堆疊且連接至PCB 64,PCB 64具有相關於第3圖所討論的實體介面44、介面控制器46、序列周邊介面48、控制器核心52、指令記憶體54、工作記憶體控制器56、以及工作記憶體58。每一基板90經由一或更多個撓性纜線94而連接至PCB 64。在一些實施例中,固態記憶體裝置係配置來取代具有旋轉盤的硬碟機。因此,實體介面44為SATA實體介面44、USB 2.0或USB 3.0介面、或類似者。類似地,介面控制器46為SATA控制器、USB 2.0或USB 3.0控制器、或類似者,且實體連接器42為SATA連接器、USB連接器、或者經由帶狀纜線96耦接至PCB的類似者。 A plurality of components of the substrate 90, the memory card connector 50, and the installed memory card 18 can be stacked and connected to the PCB 64. The PCB 64 has a physical interface 44, an interface controller 46, and a sequence peripheral interface as discussed in relation to FIG. 48. Controller core 52, instruction memory 54, working memory controller 56, and working memory 58. Each substrate 90 is connected to the PCB 64 via one or more flexible cables 94. In some embodiments, a solid state memory device is configured to replace a hard disk drive having a rotating disk. Thus, the physical interface 44 is a SATA physical interface 44, a USB 2.0 or USB 3.0 interface, or the like. Similarly, the interface controller 46 is a SATA controller, a USB 2.0 or USB 3.0 controller, or the like, and the physical connector 42 is a SATA connector, a USB connector, or is coupled to the PCB via a ribbon cable 96. Similar.

承載記憶卡18與控制器PCB 64之堆疊的基板90可配置成配裝在3.5吋硬碟的標準體積內。殼體(未圖示)也可設有至電腦機殼的標準緊固點。 The substrate 90 carrying the stack of memory card 18 and controller PCB 64 can be configured to fit within a standard volume of 3.5 inch hard disk. The housing (not shown) can also be provided with standard fastening points to the computer housing.

複數個記憶卡18可為可移除的種類(例如,microSD),但是不需要是使用者可移除的。亦即,基板90與PCB 64的配置可為永久的或半永久的,需要特殊的工具來取用與移除記憶卡18或者防止任何記憶卡完全移除。 The plurality of memory cards 18 can be of a removable type (eg, microSD), but need not be user removable. That is, the configuration of substrate 90 and PCB 64 can be permanent or semi-permanent, requiring special tools to access and remove memory card 18 or to prevent any memory card from being completely removed.

第7圖繪示本發明的另一實施例的透視圖。固態記憶體裝置100包括殼體102、控制器板104、與複數個記憶卡棒106。固態記憶體裝置100為硬碟機替代品,就主機裝置而言,固態記憶體裝置100操作作為具有旋轉盤的傳統硬碟機。本文所述的其他固態記憶體裝置的特徵與態樣可用於固態記憶體裝置100。 Figure 7 is a perspective view of another embodiment of the present invention. The solid state memory device 100 includes a housing 102, a controller board 104, and a plurality of memory card bars 106. The solid state memory device 100 is a hard disk drive replacement, and as far as the host device is concerned, the solid state memory device 100 operates as a conventional hard disk drive having a rotating disk. Features and aspects of other solid state memory devices described herein can be used with solid state memory device 100.

殼體102的尺寸與形狀符合3.5吋的硬碟機殼體標準。殼體102可包括安裝點、及/或用於內部安裝至電腦機殼、安裝至機架伺服器的硬體、或類似者。在其他實施例中,殼體102的尺寸與形狀可不同。 The housing 102 is sized and shaped to meet the 3.5 inch hard drive housing standard. The housing 102 can include mounting points, and/or hardware for internal mounting to a computer housing, to a rack server, or the like. In other embodiments, the housing 102 can vary in size and shape.

控制器板104為多層PCB,包括介面硬體,用於連接至主機裝置(例如,電腦),並且允許主機裝置讀取及寫入存取複數個記憶卡棒106。在此實施例中,控制器板104包括SATA埠108與USB埠110,用於連接至主機裝置處的一或更多個個別的埠。在其他實施例中,提供SATA埠108與USB埠110的一者。在又其他實施例中,提供不同類型的埠。 The controller board 104 is a multi-layer PCB that includes interface hardware for connection to a host device (e.g., a computer) and allows the host device to read and write access to a plurality of memory card sticks 106. In this embodiment, the controller board 104 includes a SATA port 108 and a USB port 110 for connection to one or more individual ports at the host device. In other embodiments, one of SATA port 108 and USB port 110 is provided. In still other embodiments, different types of defects are provided.

複數個記憶卡棒106的每一者包括複數個記憶卡112。在一些實施例中,如同所繪的,數個記憶卡112(例如,四個)安裝在記憶卡棒106的一面上,而數個其他記憶卡112(例如,四個)安裝在記憶卡棒106的相反面上。這可增加在空間受限的實施中的記憶卡密度。 Each of the plurality of memory card bars 106 includes a plurality of memory cards 112. In some embodiments, as depicted, a plurality of memory cards 112 (eg, four) are mounted on one side of the memory card 106, and a plurality of other memory cards 112 (eg, four) are mounted on the memory card The opposite side of 106. This can increase the density of memory cards in space-constrained implementations.

提供的記憶卡棒106的數量以及提供給每一記憶卡棒106的記憶卡112的數量並不特別限制。 The number of memory sticks 106 provided and the number of memory cards 112 provided to each memory card 106 are not particularly limited.

記憶卡112可為可移除式SD卡、miniSD卡、microSD卡、或類似者。記憶卡112可用可移除或不可移除的方式安裝在記憶卡棒106中。亦即,記憶卡112可為可移除的種類(例如,microSD),但是不需要是使用者可移除的,如同上文討論的。記憶卡棒106可為可從控制器板104移除或不可從控制器板104移除。使記憶卡棒106及/或記憶卡112可移除會有利地允許故障的記憶卡棒106及/或記憶卡112可插拔出。 The memory card 112 can be a removable SD card, a miniSD card, a microSD card, or the like. The memory card 112 can be mounted in the memory card 106 in a removable or non-removable manner. That is, the memory card 112 can be of a removable type (eg, microSD), but need not be user removable, as discussed above. The memory card 106 can be removable from the controller board 104 or removed from the controller board 104. Removing the memory card 106 and/or the memory card 112 advantageously allows the failed memory card 106 and/or memory card 112 to be plugged out.

第8圖繪示固態記憶體裝置的方塊圖,例如第7圖的固態記憶體裝置100。第8圖所示的記憶體裝置的元件為範例,且下文討論的功能可用其他種類的元件、較少的較廣義元件、或較多數量的較專用元件來實施。類似的元件符號標識類似的元件,且為了清楚起見,省略多餘的敘述。 Figure 8 is a block diagram of a solid state memory device, such as solid state memory device 100 of Figure 7. The components of the memory device shown in Figure 8 are examples, and the functions discussed below may be implemented with other kinds of components, fewer generalized components, or a greater number of more specialized components. Like reference numerals designate similar elements, and the redundant description is omitted for clarity.

固態記憶體裝置包括控制器核心52、指令記憶體54、工作記憶體控制器56、與工作記憶體58。控制器核心52連接至指令記憶體54與工作記憶體控制器56,工作記憶體控制器56連接至工作記憶體58。控制器核心52、指令記憶體54、與工作記憶體控制器56可由設置在控制器板104上適當配置的FPGA 62來實施。可參考第3圖的敘述,得到進一步的細節。 The solid state memory device includes a controller core 52, a command memory 54, a working memory controller 56, and a working memory 58. The controller core 52 is coupled to the instruction memory 54 and the working memory controller 56, and the working memory controller 56 is coupled to the working memory 58. Controller core 52, instruction memory 54, and working memory controller 56 may be implemented by FPGA 62, which is suitably configured on controller board 104. Further details can be obtained by referring to the description of Fig. 3.

固態記憶體裝置另外包括SATA控制器120,SATA控制器120連接SATA埠108與控制器核心52。在此實施例中,SATA控制器120係配置成回應於控制器核心52與位於連接至SATA埠108的主機裝置處的SATA匯流排之間的讀取/寫入命令以及交握(handshaking)與流動控制,提供8位資料轉移。SATA控制器120可遵循產業標準。當實施在FPGA 62(例如,Spartan6)上時,SATA控制器120可經由高速千兆位元收發器接腳而連接至資料埠108,高速千兆位元收發器接腳允許無膠或直接介接至主機裝置的SATA匯流排。SATA控制器120與SATA埠108可配置成允許固態記憶體裝置連接至主機裝置,就像傳統的硬碟機。 The solid state memory device additionally includes a SATA controller 120 that connects the SATA port 108 to the controller core 52. In this embodiment, the SATA controller 120 is configured to respond to read/write commands and handshaking between the controller core 52 and the SATA busbars located at the host device connected to the SATA port 108. Flow control provides 8-bit data transfer. The SATA controller 120 can follow industry standards. When implemented on an FPGA 62 (eg, Spartan 6), the SATA controller 120 can be connected to the data port 108 via a high speed gigabit transceiver pin that allows for glueless or direct mediation. Connect to the SATA bus of the host unit. The SATA controller 120 and SATA port 108 can be configured to allow a solid state memory device to be connected to a host device, just like a conventional hard disk drive.

USB實體介面44與USB控制器46(兩者將在本文的別處詳細討論)設有USB埠110,USB埠110是用於固態記憶體裝置的USB大容量儲存介面。使用者可因此選擇是否經由SATA連接或USB連接來連接固態記憶體裝置至主機裝置(例如,電腦)。 The USB physical interface 44 and the USB controller 46 (both of which will be discussed in detail elsewhere herein) are provided with a USB port 110, which is a USB mass storage interface for solid state memory devices. The user can therefore choose whether to connect the solid state memory device to the host device (eg, a computer) via a SATA connection or a USB connection.

固態記憶體裝置另外包括電源埠122與連接的電源調節器124。電源埠122係配置來從外部來源接收電力(若需要的話),且電源調節器124係配置來調節供電並且以任何需要的電壓來提供操作電力至固態記憶體裝置。 The solid state memory device additionally includes a power port 122 and a connected power conditioner 124. The power port 122 is configured to receive power from an external source, if desired, and the power conditioner 124 is configured to regulate the power supply and provide operational power to the solid state memory device at any desired voltage.

固態記憶體裝置另外包括SPI 126。SPI 126包括複數個SPI控制器128。每一SPI控制器128提供控制器核心52與一個記憶卡棒106之間的通訊。每一SPI控制器128係配置來轉譯來自控制器核心52的讀取與寫入操作成為標準SD卡的4位元命令與資料週期。此外,每一SPI控制器128係配置成與個別記憶卡棒106的所有記憶卡112平行通訊。每一SPI控制器128也可連接至指示器(例如,第1圖的指示器19),並且控制指示器根據個別記憶卡棒106的讀取/寫入存取及/或故障狀況來照明。 The solid state memory device additionally includes an SPI 126. The SPI 126 includes a plurality of SPI controllers 128. Each SPI controller 128 provides communication between the controller core 52 and a memory card 106. Each SPI controller 128 is configured to translate the read and write operations from the controller core 52 into a 4-bit command and data cycle of the standard SD card. In addition, each SPI controller 128 is configured to communicate in parallel with all of the memory cards 112 of the individual memory card 106. Each SPI controller 128 can also be coupled to an indicator (e.g., indicator 19 of FIG. 1), and the control indicators are illuminated according to read/write access and/or fault conditions of the individual memory card 106.

複數個記憶棒連接器130連接至SPI 126。每一記憶棒連接器130係配置成實體連接記憶卡棒106至個別的SPI控制器128。 A plurality of memory stick connectors 130 are coupled to the SPI 126. Each memory stick connector 130 is configured to physically connect the memory card stick 106 to an individual SPI controller 128.

第9圖繪示一個記憶卡棒106的圖示。記憶卡棒106包括PCB 140,PCB 140上藉由可移除或不可移除的連接方式來安裝記憶卡112。記憶卡棒106另外包括實體連接器142與緩衝器144,緩衝器144連接連接器142至每一記憶卡112。 FIG. 9 is a diagram showing a memory card 106. The memory card 106 includes a PCB 140 on which the memory card 112 is mounted by a removable or non-removable connection. The memory card 106 additionally includes a physical connector 142 and a buffer 144 that connects the connector 142 to each of the memory cards 112.

連接器142可為相同於個別連接器130(第8圖)的元件,或者可配置成以可移除或不可移除的方式配接於連接器130。 The connector 142 can be the same component as the individual connector 130 (Fig. 8), or can be configured to be mated to the connector 130 in a removable or non-removable manner.

緩衝器144可配置來控制信號的完整性,並且減少連接器142與記憶卡112之間的資料通訊的雜訊。 The buffer 144 can be configured to control the integrity of the signal and reduce the noise of data communication between the connector 142 and the memory card 112.

在所示的範例中,八個microSD記憶卡112設置在每一記憶卡棒106上。但是,記憶卡112的數量並不特別限制。在一些範例中,使用50Mhz的資料時脈來存取記憶卡112,且每一記憶卡112係經由4位元介面埠來存取。這可提供200MB/s的讀取速度與大約150MB/s的寫入速度。記憶卡112可以平行存取,使得二或四個記憶卡112可在相同的讀取或寫入佇列中。這可進一步增加讀取/寫入速度至大約800MB/s的讀取與600MB/s的寫入。此種記憶卡配置在經由SATA埠108(第8圖)存取時可允許SATA 1、SATA 2、或SATA 3速度之資料傳輸速率。 In the illustrated example, eight microSD memory cards 112 are disposed on each memory card 106. However, the number of the memory cards 112 is not particularly limited. In some examples, a 50 Mhz data clock is used to access memory card 112, and each memory card 112 is accessed via a 4-bit interface. This provides a read speed of 200 MB/s and a write speed of approximately 150 MB/s. The memory card 112 can be accessed in parallel such that two or four memory cards 112 can be in the same read or write queue. This can further increase the read/write speed to approximately 800 MB/s read and 600 MB/s write. This memory card is configured to allow data transfer rates for SATA 1, SATA 2, or SATA 3 speeds when accessed via SATA port 108 (Fig. 8).

返回參見第8圖,控制器核心52係配置來提供對於每一記憶卡棒106的記憶卡112的平行讀取/寫入存取。控制器核心52係配置來提供對於記憶卡棒106的平行存取。因此,固態記憶體裝置的總容量大約等於記憶卡112的容量的總和。另外,因為對於記憶卡棒106的平行存取,對於總儲存容量的讀取/寫入存取時間會減少,相對於個別記憶卡112的讀取/寫入存取時間來說。 Referring back to FIG. 8, controller core 52 is configured to provide parallel read/write access to memory card 112 for each memory card 106. Controller core 52 is configured to provide parallel access to memory card 106. Therefore, the total capacity of the solid state memory device is approximately equal to the sum of the capacities of the memory cards 112. In addition, because of the parallel access to the memory stick 106, the read/write access time for the total storage capacity is reduced relative to the read/write access time of the individual memory card 112.

在此實施例中,固態記憶體裝置處理所有的讀取、寫入、刪除、以及類似的檔案存取操作實質上就像是標準的SATA硬碟機及/或USB記憶棒。固態記憶體裝置可以模擬SATA硬碟機。 In this embodiment, the solid state memory device handles all read, write, delete, and similar file access operations substantially as if it were a standard SATA hard drive and/or USB memory stick. The solid state memory device can emulate a SATA hard drive.

第10圖例示記憶體映射,控制器核心52使用記憶體映射來映射來自主機裝置的記憶體請求至記憶卡 棒106的個別記憶卡112。記憶體映射可儲存在固態記憶體裝置的指令記憶體54(第8圖)中。控制器核心52可配置成參考記憶體映射來存取記憶卡112,如同本文別處所討論的。 Figure 10 illustrates memory mapping, controller core 52 uses memory mapping to map memory requests from the host device to the memory card The individual memory card 112 of the stick 106. The memory map can be stored in the instruction memory 54 (Fig. 8) of the solid state memory device. Controller core 52 may be configured to access memory card 112 with reference to a memory map, as discussed elsewhere herein.

記憶體映射界定記憶體區150,記憶體區150具有N位元組的寬度152,其中N為每一記憶卡棒106的記憶卡112的數量。在此範例中,使用八個記憶卡112來產生八位元組或64位元的區寬度152。進一步,在此範例中,總共的區大小係選擇為4千位元組(KB)。記憶體區150係映射至主機裝置處所使用的主機區154。在此範例中,主機區154為一位元組寬度並且具有512位元組的總大小,這相容於一般電腦作業系統存取硬碟機與類似的儲存裝置時所使用的標準區。因此,在此範例中,記憶體映射將標準8位元寬512位元組的主機區154映射至64位元寬4KB的記憶體區150。 The memory map defines a memory region 150 having a width 152 of N bytes, where N is the number of memory cards 112 per memory card 106. In this example, eight memory cards 112 are used to generate an octet or 64-bit zone width 152. Further, in this example, the total zone size is selected to be 4 kilobytes (KB). The memory area 150 is mapped to the host area 154 used at the host device. In this example, host area 154 is a one-bit width and has a total size of 512 bytes, which is compatible with the standard area used by typical computer operating systems to access hard drives and similar storage devices. Thus, in this example, the memory map maps a standard 8-bit wide 512-bit host area 154 to a 64-bit wide 4 KB memory area 150.

在此實施例中,每一記憶卡棒106的記憶卡122係平行地存取,沒有個別記憶卡存取的性能,導致記憶卡棒106操作為虛擬的64位元寬記憶卡。 In this embodiment, the memory card 122 of each memory card 106 is accessed in parallel, without the performance of individual memory card accesses, resulting in the memory card 106 operating as a virtual 64-bit wide memory card.

在此範例中,八個主機區154(各自為512位元組)映射至一個記憶體區150(4KB)。因此,64個主機區154(32KB)的線性群組映射至八個記憶體區150,而128個主機區154(32KB)的線性群組映射至16個記憶體區150。 In this example, eight host regions 154 (each 512 bytes) are mapped to one memory region 150 (4 KB). Therefore, a linear group of 64 host areas 154 (32 KB) is mapped to eight memory areas 150, and a linear group of 128 host areas 154 (32 KB) is mapped to 16 memory areas 150.

記憶體映射可進一步相繼地映射記憶體區150至記憶卡棒106。亦即,針對記憶體區150的群組,下個記憶體區150係分配至下個記憶卡棒106。例如,當使用25個記憶卡棒106時,第一記憶體區150係映射至第一記憶卡棒106,第二記憶體區150係映射至第二記憶卡棒106,依此類推,其中第二十六記憶體區150係映射至第一記憶卡棒106的第二記憶體區。 The memory map can further map the memory region 150 to the memory card 106 in succession. That is, for the group of memory regions 150, the next memory region 150 is assigned to the next memory card 106. For example, when 25 memory cards 106 are used, the first memory region 150 is mapped to the first memory card 106, the second memory region 150 is mapped to the second memory card 106, and so on. The twenty-sixth memory region 150 is mapped to the second memory region of the first memory card 106.

因此,記憶體映射可允許平行寫入與讀取多個記憶體區150,因為每一記憶體區150係相繼地映射至不同的記憶卡棒106。此種平行寫入可導致記憶體存取的速度增加至高達所用的記憶卡棒106的數量。在25個記憶卡棒106的範例中,大約100KB(25個4KB的記憶體區)可同時寫入。可佇列高於記憶卡棒106數量之要寫入的記憶體區數量。 Thus, memory mapping can allow parallel writing and reading of multiple memory regions 150 because each memory region 150 is successively mapped to a different memory card 106. Such parallel writing can result in an increase in the speed of memory access up to the number of memory sticks 106 used. In the example of 25 memory sticks 106, approximately 100 KB (25 4 KB memory areas) can be simultaneously written. The number of memory regions to be written higher than the number of memory card bars 106 can be listed.

上文討論的固態裝置提供對於多個記憶卡的同時存取,以模擬高密度、高速的硬碟機。區的順序係配置成使得硬碟的區的連續配置可映射至記憶卡棒106,允許用於連續區讀取與寫入的平行/佇列存取。區映射係在個別的記憶卡平行進行,增加存取速度。固態裝置可一次讀取或寫入多個區,保持USB或SATA介面充滿資料,以回應於主機裝置一次請求32、64、128、或更多的區。 The solid state device discussed above provides simultaneous access to multiple memory cards to simulate a high density, high speed hard disk drive. The order of the zones is configured such that a continuous configuration of the zones of the hard disk can be mapped to the memory card stick 106, allowing parallel/column access for sequential zone reads and writes. The zone mapping is performed in parallel on individual memory cards to increase access speed. The solid state device can read or write multiple zones at a time, keeping the USB or SATA interface full of data in response to the host device requesting 32, 64, 128, or more zones at a time.

在其他實施例中,控制器核心52係配置成操作複數個記憶卡棒106作為RAID。可實施RAID鏡射, 以允許資料冗餘,來協助防止資料遺失。可使用任何實用的RAID級別(例如,RAID 1、RAID 2等)。在其他實施例中,控制器核心52係配置來提供資料加密,以提供高度安全且容錯的大容量儲存裝置。 In other embodiments, controller core 52 is configured to operate a plurality of memory card sticks 106 as RAID. Can implement RAID mirroring, To allow data redundancy, to help prevent data loss. Any useful RAID level can be used (for example, RAID 1, RAID 2, etc.). In other embodiments, controller core 52 is configured to provide data encryption to provide a highly secure and fault tolerant mass storage device.

參見第11圖,本發明包括配置為機架單元160的一或更多個固態記憶體裝置162。固態記憶體裝置162可為本文所述的任何固態記憶體裝置。固態記憶體裝置162可包括複數個記憶卡棒164,記憶卡棒164可包括複數個記憶卡(例如,SD、miniSD、microSD,如同上文討論的),如同本文別處所述的。額外地或替代地,機架單元160中的固態記憶體裝置162可包括並未使用可移除式記憶卡與記憶棒的固態硬碟(SSD,solid-state drive)。在此實施例中,複數個類似或相同的固態記憶體裝置162係配置為機架單元160。 Referring to FIG. 11, the present invention includes one or more solid state memory devices 162 configured as rack units 160. Solid state memory device 162 can be any of the solid state memory devices described herein. The solid state memory device 162 can include a plurality of memory card 164, and the memory card 164 can include a plurality of memory cards (eg, SD, miniSD, microSD, as discussed above), as described elsewhere herein. Additionally or alternatively, the solid state memory device 162 in the rack unit 160 can include a solid state drive (SSD) that does not use a removable memory card and a memory stick. In this embodiment, a plurality of similar or identical solid state memory devices 162 are configured as rack units 160.

機架單元160包括:容納固態記憶體裝置162的殼體166、連接至固態記憶體裝置162來提供電源給固態記憶體裝置162的電源供應器168、以及可移除的蓋體169。殼體166包括通風開孔以及用於固持固態記憶體裝置162的內部支撐。電源供應器168係配置來調整與調節固態記憶體裝置162所使用的主要電力,並且可包括不間斷電源(UPS,uninterruptable power source)。可移除的蓋體169係可移除地附接至機架單元160的前面,以允許取用固態記憶體裝置162,來允許插拔出整個固態記憶體裝置162、裝置162 上的記憶卡棒、或記憶卡棒上的個別記憶卡。每一固態記憶體裝置162可從機架單元160個別地移除與熱插拔,使得每一固態記憶體裝置162可用另一固態記憶體裝置162來替換。每一固態記憶體裝置162的每一記憶卡棒與每一記憶卡可個別地移除與熱插拔,如同本文別處所討論的。電源供應器168較小於使用硬碟機、具有類似的總儲存容量之傳統的機架單元,因為本文所述的固態記憶體裝置對於電力的需求減少。 The rack unit 160 includes a housing 166 that houses the solid state memory device 162, a power supply 168 that is coupled to the solid state memory device 162 to provide power to the solid state memory device 162, and a removable cover 169. The housing 166 includes a venting opening and an internal support for holding the solid state memory device 162. The power supply 168 is configured to adjust and regulate the primary power used by the solid state memory device 162 and may include an uninterruptable power source (UPS). A removable cover 169 is removably attached to the front of the rack unit 160 to allow access to the solid state memory device 162 to allow insertion and removal of the entire solid state memory device 162, device 162 The memory card on the top, or the individual memory card on the memory card. Each solid state memory device 162 can be individually removed and hot swapped from the rack unit 160 such that each solid state memory device 162 can be replaced with another solid state memory device 162. Each memory card and each memory card of each solid state memory device 162 can be individually removed and hot swapped, as discussed elsewhere herein. The power supply 168 is smaller than a conventional rack unit that uses a hard disk drive with similar overall storage capacity because the solid state memory devices described herein have reduced power requirements.

機架單元160可為所繪的4U單元或任何其他大小,例如1U、2U等,其中殼體166的形狀與大小相應地改變。機架單元160可安裝至標準的資料中心機架或機櫃180,如同第12圖所示。資料中心機架180可為標準的42U大小,並且可固持任何適當數量與大小的機架單元160,總共42U或較少。其他元件(例如,伺服器、不間斷電源、介面、與類似的裝置)可安裝在相同的機架180中作為一或更多個機架單元160。 Rack unit 160 can be a 4U unit or any other size, such as 1 U, 2 U, etc., where the shape and size of housing 166 changes accordingly. Rack unit 160 can be mounted to a standard data center rack or cabinet 180, as shown in FIG. The data center rack 180 can be a standard 42U size and can hold any suitable number and size of rack units 160 for a total of 42U or less. Other components (eg, servers, uninterruptible power supplies, interfaces, and the like) may be mounted in the same rack 180 as one or more rack units 160.

如同第13圖所示,客制化的資料中心機架或機櫃190可包括任何數量的固態記憶體裝置(繪示在192處)直接安裝至機架190中。這消除了遵循1U、2U等標準的限制,並且可允許固態記憶體裝置的較有效率或成本有效的配置。本文所述的任何固態記憶體裝置可使用在機架或機櫃190中。 As shown in FIG. 13, the customized data center rack or cabinet 190 can include any number of solid state memory devices (shown at 192) mounted directly into the rack 190. This eliminates the limitations of standards such as 1U, 2U, etc., and allows for a more efficient or cost effective configuration of solid state memory devices. Any of the solid state memory devices described herein can be used in a rack or cabinet 190.

其他高容量的外形也可設想到,例如桌上型盒子、塔式伺服器、以及類似者。 Other high-capacity shapes are also conceivable, such as desktop boxes, tower servers, and the like.

利用第11圖至第13圖所示的實施例可達成高儲存密度,同時維持本文所述的固態記憶體裝置的其他優點。 A high storage density can be achieved using the embodiments illustrated in Figures 11 through 13 while maintaining other advantages of the solid state memory devices described herein.

第14圖根據本發明,繪示另一固態記憶體裝置。第14圖所示的記憶體裝置的元件為範例,且下文討論的功能可用其他種類的元件、較少的較廣義元件、或較多數量的較專用元件來實施。類似的元件符號標識類似的元件,且為了清楚起見,省略多餘的敘述。 Figure 14 illustrates another solid state memory device in accordance with the present invention. The components of the memory device shown in Fig. 14 are examples, and the functions discussed below may be implemented with other kinds of components, fewer generalized components, or a larger number of more specialized components. Like reference numerals designate similar elements, and the redundant description is omitted for clarity.

固態記憶體裝置包括控制器200、複數個記憶棒202、與複數個記憶體裝置204。控制器200、記憶棒202、與記憶體裝置204類似於本文別處所討論的元件。例如,控制器200包括繪示為安裝在第8圖的控制器板104處之一或更多個元件,且具體為控制器核心52、指令記憶體54、以及工作記憶體控制器56與工作記憶體58。記憶棒202可包括記憶卡棒106的元件與功能,且記憶體裝置204可包括記憶卡(例如,SD、miniSD、microSD等)。控制器200、記憶棒202、與記憶體裝置204也根據記憶體映射並且平行地操作,如同相關於第10圖在上文討論的,其中記憶棒202與記憶體裝置204可從固態記憶體裝置移除與熱插拔。上文討論的容錯、RAID、與加密特徵也可利用固態記憶體裝置來實施。控制器200、記憶棒202、與記憶體裝置204經由無線通訊而相互連接,並且經由無線通訊而連接至主機裝置60。 The solid state memory device includes a controller 200, a plurality of memory sticks 202, and a plurality of memory devices 204. Controller 200, memory stick 202, and memory device 204 are similar to those discussed elsewhere herein. For example, controller 200 includes one or more components depicted as being mounted at controller board 104 of FIG. 8, and specifically controller core 52, instruction memory 54, and working memory controller 56 and operation Memory 58. The memory stick 202 can include the elements and functions of the memory stick 106, and the memory device 204 can include a memory card (eg, SD, miniSD, microSD, etc.). The controller 200, the memory stick 202, and the memory device 204 are also mapped in accordance with the memory and operate in parallel, as discussed above in relation to FIG. 10, wherein the memory stick 202 and the memory device 204 are removable from the solid state memory device. Remove and hot swap. The fault tolerance, RAID, and encryption features discussed above can also be implemented using solid state memory devices. The controller 200, the memory stick 202, and the memory device 204 are connected to each other via wireless communication, and are connected to the host device 60 via wireless communication.

控制器200包括控制邏輯與記憶體206,例如,參見第8圖所述的控制器核心52、指令記憶體54、以及工作記憶體控制器56與工作記憶體58。控制邏輯與記憶體206可進一步包括相關於第3圖與第8圖所述的其他元件。控制邏輯與記憶體206係配置成根據相關於第10圖所述的平行記憶體映射來控制記憶體存取。此外,控制邏輯與記憶體206可配置來用於容錯、RAID、與加密,如同本文別處所討論的。 Controller 200 includes control logic and memory 206, such as controller core 52, instruction memory 54, and working memory controller 56 and working memory 58 as described in FIG. Control logic and memory 206 may further include other components described in relation to Figures 3 and 8. Control logic and memory 206 are configured to control memory access in accordance with the parallel memory map described in relation to FIG. In addition, control logic and memory 206 can be configured for fault tolerance, RAID, and encryption, as discussed elsewhere herein.

控制器200另外包括短或中距離的無線介面208,例如藍牙、Wi-Fi、WiMAX、或類似的介面。無線介面208包括無線發送器、無線接收器、無線收發器、或具有一或更多個合適天線的此種裝置的組合。無線介面208係配置來提供主機無線連結210,以在控制器200與主機裝置60之間通訊指令與資料,主機裝置60例如為桌上型/膝上型電腦、智慧型手機、伺服器、或包括相容的無線介面之其他數位裝置。無線介面208進一步配置來在控制器200與記憶棒202之間通訊指令與資料。或者,一或更多個額外的無線介面可提供給控制器200,用於通訊於記憶棒202。此種額外的無線介面可為與無線介面208相同或不同的方案(藍牙、Wi-Fi、WiMAX等)。 Controller 200 additionally includes a short or medium distance wireless interface 208, such as Bluetooth, Wi-Fi, WiMAX, or a similar interface. Wireless interface 208 includes a wireless transmitter, a wireless receiver, a wireless transceiver, or a combination of such devices having one or more suitable antennas. The wireless interface 208 is configured to provide a host wireless connection 210 for communicating commands and data between the controller 200 and the host device 60, such as a desktop/laptop, a smart phone, a server, or Other digital devices including compatible wireless interfaces. The wireless interface 208 is further configured to communicate instructions and data between the controller 200 and the memory stick 202. Alternatively, one or more additional wireless interfaces may be provided to controller 200 for communication with memory stick 202. Such additional wireless interfaces may be the same or different schemes (Bluetooth, Wi-Fi, WiMAX, etc.) as the wireless interface 208.

每一記憶棒202包括短或中距離的無線介面212,例如藍牙、Wi-Fi、WiMAX、或類似的介面。無線介面212包括無線發送器、無線接收器、無線收發 器、或具有一或更多個合適天線的此種裝置的組合。無線介面212係配置來提供與控制器200的控制器無線連結214,以在控制器200與記憶棒202之間通訊指令與資料。無線介面212另外配置來通訊指令與資料於記憶體裝置204的子集。或者,一或更多個額外的無線介面可提供給記憶棒202,用於通訊於記憶體裝置204。此種額外的無線介面可為與無線介面212相同或不同的方案(藍牙、Wi-Fi、WiMAX等)。 Each memory stick 202 includes a short or medium distance wireless interface 212, such as Bluetooth, Wi-Fi, WiMAX, or a similar interface. The wireless interface 212 includes a wireless transmitter, a wireless receiver, and a wireless transceiver. A combination of such devices, or one or more suitable antennas. The wireless interface 212 is configured to provide a wireless connection 214 to the controller of the controller 200 to communicate commands and data between the controller 200 and the memory stick 202. The wireless interface 212 is additionally configured to communicate commands and data to a subset of the memory device 204. Alternatively, one or more additional wireless interfaces may be provided to the memory stick 202 for communication with the memory device 204. Such additional wireless interfaces may be the same or different schemes (Bluetooth, Wi-Fi, WiMAX, etc.) as the wireless interface 212.

每一記憶棒202可另外包括緩衝器216,用於在記憶棒202與連結的記憶體裝置204之間傳輸的期間緩衝資料與指令。緩衝器216可配置來控制信號的完整性,並且減少記憶棒202與連結的記憶體裝置204之間的資料通訊的雜訊。 Each memory stick 202 can additionally include a buffer 216 for buffering data and instructions during transmission between the memory stick 202 and the associated memory device 204. Buffer 216 can be configured to control signal integrity and reduce noise in data communication between memory stick 202 and connected memory device 204.

每一記憶體裝置204包括短或中距離的無線介面218,例如藍牙、Wi-Fi、WiMAX、或類似的介面。無線介面218包括無線發送器、無線接收器、無線收發器、或具有一或更多個合適天線的此種裝置的組合。無線介面218係配置來提供與一個記憶棒202的記憶體無線連結214,以在記憶體裝置204與記憶棒202之間通訊指令與資料。每一記憶體裝置204另外包括記憶體222,例如記憶卡(例如,SD、miniSD、microSD等)、SSD、或類似者。注意到,本文在別處敘述記憶卡如何連接、映射、以及控制所討論的技術同樣適用於SSD。 Each memory device 204 includes a short or medium distance wireless interface 218, such as Bluetooth, Wi-Fi, WiMAX, or a similar interface. Wireless interface 218 includes a wireless transmitter, a wireless receiver, a wireless transceiver, or a combination of such devices having one or more suitable antennas. The wireless interface 218 is configured to provide a memory wireless connection 214 to a memory stick 202 for communicating commands and data between the memory device 204 and the memory stick 202. Each memory device 204 additionally includes a memory 222, such as a memory card (eg, SD, miniSD, microSD, etc.), an SSD, or the like. It is noted that the techniques discussed herein, how the memory card is connected, mapped, and controlled, are equally applicable to SSDs.

控制器200、記憶棒202、與記憶體裝置204的每一者可儲存獨特的識別符(例如,媒體存取控制、MAC、位址),使得它們可以針對無線通訊的目的被識別。亦即,控制器200具有由主機裝置60與記憶棒202參照來識別控制器200的識別符,且識別符區分控制器200與在範圍內且使用相同的無線通訊方案的其他裝置,例如記憶體裝置204。類似地,每一記憶棒202具有由控制器200與記憶體裝置204參照來識別記憶棒202的識別符,且識別符區分記憶棒202與在範圍內且使用相同的無線通訊方案的其他裝置。同樣地,每一記憶體裝置204具有由記憶棒202參照來識別記憶體裝置204的識別符,且識別符區分記憶體裝置204與在範圍內且使用相同的無線通訊方案的其他裝置。控制器200、記憶棒202、與記憶體裝置204的每一者可配置成相關於參照獨特識別符的個別控制器200、記憶棒202、與記憶體裝置204。控制器200相關於複數個記憶棒202,且每一記憶棒202相關於複數個記憶體裝置204的不同子集。裝置之間的關聯可建立為無線通訊方案的配對或其他處理的部分。記憶棒202以及記憶棒202之間以及記憶體裝置204的關聯可儲存在控制器200的控制邏輯與記憶體206中。當記憶棒202無法由控制器200存取時,控制器200標記相關的記憶體裝置204為從固態記憶體裝置移除。若至記憶棒202的無線連接有重新建立,控制器200標記相關的記憶體裝置 204為可用的。當至新記憶棒202的無線連接建立時,控制器200列舉與記憶棒202相關的記憶體裝置204。控制器200可例如當實施RAID時,從現存的記憶體裝置204複製資料至新記憶棒202的記憶體裝置204。當與個別記憶棒202的無線連接建立、遺失、與重新建立時,上文相同的概念適用於個別的記憶體裝置204。 Each of controller 200, memory stick 202, and memory device 204 can store unique identifiers (eg, media access control, MAC, address) such that they can be identified for wireless communication purposes. That is, the controller 200 has an identifier that is recognized by the host device 60 and the memory stick 202 to identify the controller 200, and the identifier distinguishes the controller 200 from other devices within the range and using the same wireless communication scheme, such as a memory. Device 204. Similarly, each memory stick 202 has an identifier that is referenced by the controller 200 and the memory device 204 to identify the memory stick 202, and the identifier distinguishes the memory stick 202 from other devices that are within range and use the same wireless communication scheme. Similarly, each memory device 204 has an identifier that is referenced by the memory stick 202 to identify the memory device 204, and the identifier distinguishes the memory device 204 from other devices that are within range and use the same wireless communication scheme. Each of controller 200, memory stick 202, and memory device 204 can be configured to be associated with individual controller 200, memory stick 202, and memory device 204 that reference unique identifiers. Controller 200 is associated with a plurality of memory sticks 202, and each memory stick 202 is associated with a different subset of a plurality of memory devices 204. The association between devices can be established as part of a pairing or other processing of a wireless communication scheme. The association between the memory stick 202 and the memory stick 202 and the memory device 204 can be stored in the control logic and memory 206 of the controller 200. When the memory stick 202 is not accessible by the controller 200, the controller 200 marks the associated memory device 204 as being removed from the solid state memory device. If the wireless connection to the memory stick 202 is re-established, the controller 200 marks the associated memory device. 204 is available. When the wireless connection to the new memory stick 202 is established, the controller 200 enumerates the memory device 204 associated with the memory stick 202. The controller 200 can copy material from the existing memory device 204 to the memory device 204 of the new memory stick 202, for example, when RAID is implemented. The same concepts as above apply to individual memory devices 204 when wireless connections to individual memory sticks 202 are established, lost, and re-established.

在此實施例中,較佳地,每一記憶體裝置204在給定的時間僅相關於一個記憶棒202,且每一記憶棒202在給定的時間僅相關於一個控制器200。控制器200可配置來相應地管理無線連接。 In this embodiment, preferably, each memory device 204 is associated with only one memory stick 202 at a given time, and each memory stick 202 is associated with only one controller 200 at a given time. Controller 200 can be configured to manage wireless connections accordingly.

注意到,記憶棒202與記憶體裝置204並非電腦或類似的處理裝置。亦即,記憶棒202與記憶體裝置204的功能係限制為資料的儲存與擷取以及相關的處理。這有利地減少了複雜性,且可能增加資料存取速度。 It is noted that memory stick 202 and memory device 204 are not computer or similar processing devices. That is, the functions of the memory stick 202 and the memory device 204 are limited to the storage and retrieval of data and related processing. This advantageously reduces complexity and may increase data access speed.

上述用於其他實施例的記憶體映射同樣適用於本實施例。記憶體映射參照記憶棒202與記憶體裝置204的獨特識別符,以分配資料於記憶體裝置204之間,並且從記憶體裝置204擷取資料。主機裝置60僅需要知道控制器200的識別符。 The memory mapping described above for other embodiments is equally applicable to the present embodiment. The memory map references the unique identifier of the memory stick 202 and the memory device 204 to distribute data between the memory devices 204 and to retrieve data from the memory device 204. The host device 60 only needs to know the identifier of the controller 200.

在一些實施例中,控制器200、記憶棒202、與記憶體裝置204係配置成形成特設或私有無線網路,作為虛擬儲存池,其中每一記憶棒202與每一記憶體裝置204具有與虛擬儲存池的區段/區相關的私有無線MAC位址。如同上述,控制器200為與主機60的主要無 線介面。此外,控制器200係配置來維持私有無線MAC位址映射至虛擬儲存池的區段/區,以轉譯主機請求至相關的記憶棒202與裝置204。當第一次產生用於虛擬儲存池的檔案系統時,控制器200係配置來攔截來自主機60的格式命令,並且進一步配置來參照格式命令而建構映射。亦即,控制器200可配置來建構一張表,以記錄哪些記憶棒202與裝置204形成虛擬儲存池的哪些特定部分,以及若或當記憶棒202與裝置204增加、移除、或替換時,更新那張表。在一範例中,此種表包括記憶棒202與裝置204的私有無線MAC位址,相關於主機60可見之虛擬儲存池的區段/區。控制器200可配置來維持指標表,並且提供使用者介面給主機60,使得指標表可由主機60存取來輸出統計資料,例如使用層級,並且允許更換虛擬儲存池內的特定記憶棒202與記憶體裝置204。在這些實施例中,無線記憶棒202與無線記憶體裝置204的存庫一起聯營,並且可自動偵測作為一個大磁碟,具有容易增加/移除/替換記憶棒202與記憶體裝置204的能力。 In some embodiments, the controller 200, the memory stick 202, and the memory device 204 are configured to form an ad hoc or private wireless network as a virtual storage pool, wherein each memory stick 202 and each memory device 204 have The private wireless MAC address associated with the zone/zone of the virtual storage pool. As described above, the controller 200 is the main one without the host 60. Line interface. In addition, controller 200 is configured to maintain a private wireless MAC address mapped to a sector/zone of a virtual storage pool to translate host requests to associated memory stick 202 and device 204. When the file system for the virtual storage pool is first generated, the controller 200 is configured to intercept the format commands from the host 60 and is further configured to construct the mapping with reference to the format commands. That is, the controller 200 can be configured to construct a table to record which memory sticks 202 and devices 204 form particular portions of the virtual storage pool, and if or when the memory stick 202 and device 204 are added, removed, or replaced. , update the table. In one example, such a table includes the private wireless MAC address of memory stick 202 and device 204, associated with the sector/area of the virtual storage pool visible to host 60. The controller 200 can be configured to maintain the indicator table and provide a user interface to the host 60 such that the indicator table can be accessed by the host 60 to output statistics, such as usage levels, and to allow replacement of a particular memory stick 202 and memory within the virtual storage pool. Body device 204. In these embodiments, the wireless memory stick 202 is associated with the memory of the wireless memory device 204 and can be automatically detected as a large disk having the ability to easily add/remove/replace the memory stick 202 and the memory device 204. ability.

在操作中,主機裝置60與控制器200經由主機無線連結210建立無線連接,控制器200經由控制器無線連結214而與記憶棒202建立無線連接,且每一記憶棒202經由記憶體無線連結220而與記憶體裝置204的個別子集建立無線連接。來自主機裝置60、要儲存與擷取資料的命令係發送至控制器200,控制器200解譯 該等命令並且發送對應的指令至相關的記憶棒202,相關的記憶棒202接著命令相關的記憶體裝置204。回應於該等指令,資料儲存在記憶體裝置204中或從記憶體裝置204擷取。 In operation, host device 60 and controller 200 establish a wireless connection via host wireless connection 210, controller 200 establishes a wireless connection with memory stick 202 via controller wireless connection 214, and each memory stick 202 is wirelessly coupled via memory 220. A wireless connection is established with an individual subset of memory devices 204. From the host device 60, a command to store and retrieve data is sent to the controller 200, and the controller 200 interprets The commands also send corresponding instructions to the associated memory stick 202, and the associated memory stick 202 then commands the associated memory device 204. In response to the instructions, the data is stored in or retrieved from the memory device 204.

第14圖的實施例可有利地與第11圖至第13圖的機架與機櫃實施例一起使用。例如,1U控制器機架單元可管理1U記憶棒機架單元,1U記憶棒機架單元管理八個4U記憶體裝置機架單元,具有無線通訊傳送命令與資料於其間以及控制機架單元與主機裝置之間,主機裝置可安裝在相同的機架中。在另一範例中,8U機架單元包括控制器200、相關的記憶棒202、以及相關的記憶體裝置204在自我包含的配置中,經由無線通訊來內部通訊,並且經由無線通訊來與主機裝置外部通訊。也可設想到其他範例。 The embodiment of Figure 14 can be advantageously used with the rack and cabinet embodiments of Figures 11 through 13. For example, a 1U controller rack unit can manage a 1U memory stick rack unit, and a 1U memory stick rack unit manages eight 4U memory unit rack units with wireless communication transfer commands and data in between and control rack units and hosts. Between the devices, the host device can be installed in the same rack. In another example, the 8U rack unit includes the controller 200, the associated memory stick 202, and associated memory device 204 in a self-contained configuration, internally communicating via wireless communication, and communicating with the host device via wireless communication. External communication. Other examples are also envisaged.

參見第15圖,本發明包括一或更多個固態記憶體裝置162係配置為機架單元250。機架單元250類似於機架單元160,且將僅詳細討論兩者的差異。類似的元件符號表示類似的元件,且可參照上文針對機架單元160的敘述。機架單元250容納複數個固態記憶體裝置162,例如本文所述的任何固態記憶體裝置。在繪示的範例中,機架單元250為4U單元。 Referring to Figure 15, the present invention includes one or more solid state memory devices 162 configured as a rack unit 250. Rack unit 250 is similar to rack unit 160 and only the differences between the two will be discussed in detail. Like reference numerals indicate like elements and reference to the above description of rack unit 160. Rack unit 250 houses a plurality of solid state memory devices 162, such as any of the solid state memory devices described herein. In the illustrated example, rack unit 250 is a 4U unit.

機架單元250包括複數個托盤252垂直支撐於機架單元250內。複數個固態記憶體裝置162係可移除地附接至每一托盤252的上表面。每一托盤252藉此 機械性地支撐附接的複數個固態記憶體裝置162。托盤252也可包括電連接,例如連接器埠,用於提供電力及/或資料連接至支撐的固態記憶體裝置162。在此種情況中,至少一撓性纜線連接托盤252上的電連接至機架單元250的主要匯流排或其他系統。或者,托盤252並不包括電連接,且至固態記憶體裝置162的電力及/或資料連接係經由至機架單元250的主要匯流排或其他系統之撓性纜線來完成。在又另一範例中,托盤252包括電連接,以提供電力至支撐的固態記憶體裝置162,而與裝置162的資料連接則經由撓性纜線來完成或者是無線的。通常,裝置162的每一電力連接與資料連接可經由下述來提供:(a)在支撐托盤252處的剛性連接器,以及從支撐托盤252至機架單元250的主要匯流排或其他系統之撓性纜線,或者(b)從裝置162至機架單元250的主要匯流排或其他系統之撓性纜線。此外,裝置162的資料連接可無線地提供,而無需纜線或剛性連接器。 The rack unit 250 includes a plurality of trays 252 that are vertically supported within the rack unit 250. A plurality of solid state memory devices 162 are removably attached to the upper surface of each tray 252. Each tray 252 is thereby The attached plurality of solid state memory devices 162 are mechanically supported. The tray 252 may also include electrical connections, such as connector ports, for providing power and/or data connections to the supported solid state memory device 162. In this case, at least one of the flexible cable connection trays 252 is electrically connected to the main busbar or other system of the rack unit 250. Alternatively, tray 252 does not include electrical connections, and power and/or data connections to solid state memory device 162 are accomplished via flexible busses to the main busbars of rack unit 250 or other systems. In yet another example, the tray 252 includes electrical connections to provide power to the supported solid state memory device 162, while the data connection to the device 162 is accomplished via a flexible cable or wireless. In general, each power connection and data connection of device 162 can be provided via: (a) a rigid connector at support tray 252, and a main busbar or other system from support tray 252 to rack unit 250. Flexible cable, or (b) a flexible busbar from the device 162 to the main busbar of the rack unit 250 or other system. Additionally, the data connection of device 162 can be provided wirelessly without the need for a cable or rigid connector.

每一托盤252係藉由至少一可滑動導軌254而支撐在機架250內。每一可滑動導軌254耦接至機架單元250的殼體166,並且配置來在蓋體169(未圖示)移除時,針對固態記憶體裝置162或個別記憶卡棒或記憶棒的視覺檢查與插拔,將附接有支撐的固態記憶體裝置162之托盤252滑動出殼體166。如同本文別處所提到的,指示器19(例如,LED)可提供至固態記憶體裝置162,以視覺上指示故障或其他事項,來促進檢查。 此種指示器19可配置來指示個別記憶卡、記憶卡棒、及/或固態記憶體裝置162的故障。有利地,托盤252與導軌254系統允許容易取用固態記憶體裝置162來熱插拔裝置、棒、與卡,以及用於快速與方便的檢查。 Each tray 252 is supported within the frame 250 by at least one slidable rail 254. Each slidable rail 254 is coupled to the housing 166 of the gantry unit 250 and is configured to view the solid state memory device 162 or individual memory card or memory stick when the cover 169 (not shown) is removed. Inspecting and inserting, the tray 252 to which the supported solid state memory device 162 is attached is slid out of the housing 166. As mentioned elsewhere herein, an indicator 19 (eg, an LED) can be provided to the solid state memory device 162 to visually indicate a fault or other event to facilitate inspection. Such an indicator 19 can be configured to indicate a failure of an individual memory card, memory card, and/or solid state memory device 162. Advantageously, the tray 252 and rail 254 system allows for easy access to the solid state memory device 162 for hot plugging of devices, rods, and cards, as well as for quick and convenient inspection.

第16圖繪示導軌配置的側視圖,配置來滑動托盤252進與出機架250。托盤252所固定至的可滑動導軌254可伸縮地嵌接於中間的可滑動導軌256,中間的可滑動導軌256可伸縮地嵌接於不動的基座導軌258,基座導軌258固定至機架250的殼體166的內部。可使用任何數量之中間的可滑動導軌256。中間的可滑動導軌256可省略,使得可滑動導軌254直接耦接至不動的基座導軌258。導軌之間的伸縮式滑動機械連接可包括軸承、軸套、與類似者。 Figure 16 is a side elevational view of the rail arrangement configured to slide the tray 252 into and out of the frame 250. The slidable rail 254 to which the tray 252 is fixed is telescopically engaged with the intermediate slidable rail 256, and the middle slidable rail 256 is telescopically engaged with the stationary base rail 258, and the base rail 258 is fixed to the frame. The interior of the housing 166 of 250. Any number of intermediate slidable rails 256 can be used. The intermediate slidable rail 256 can be omitted such that the slidable rail 254 is directly coupled to the stationary base rail 258. Telescopic sliding mechanical connections between the rails can include bearings, bushings, and the like.

第17圖繪示複數個機架單元250成為機櫃或其他垂直堆疊配置之組件270。每一機架單元的每一托盤252可個別地滑出,以檢查與熱插拔固態記憶體裝置162、記憶卡棒、或個別的記憶卡。有利地,在故障或有其他需要時,超大陣列儲存元件的每一元件(下至單一個別的記憶卡)可個別地檢查與熱插拔。 Figure 17 illustrates a plurality of rack units 250 as components 270 of a cabinet or other vertically stacked configuration. Each tray 252 of each rack unit can be individually slid out to inspect and hot plug the solid state memory device 162, memory card, or individual memory card. Advantageously, each component of the oversized array storage element (down to a single individual memory card) can be individually inspected and hot swapped in the event of a fault or other need.

雖然上文的技術係相關於SD卡來敘述,但這並不打算作為限制,且本發明的各種態樣可應用於目前可用的、正在研發的、或尚未研發的其他記憶體技術。本發明的各種態樣可應用至任何類型的記憶體,且所用的記憶體類型可為純理論的,且不需要由系統知悉的。 可與本發明的各種態樣一起使用的記憶體技術的範例包括SD卡、快閃記憶體、動態隨機存取記憶體(DRAM)、磁性儲存器(例如,硬碟機)、憶阻裝置、相變記憶體(PCM,phase-change memory)、以及自旋轉移扭矩隨機存取記憶體(STT-RAM,spin-transfer torque random-access memory)。這些記憶體技術的每一者可應用作為記憶體裝置、記憶棒、或記憶卡,如同本文別處所討論的。 Although the above techniques are described in relation to SD cards, this is not intended to be limiting, and various aspects of the present invention are applicable to other memory technologies currently available, under development, or not yet developed. The various aspects of the invention are applicable to any type of memory, and the type of memory used can be purely theoretical and need not be known by the system. Examples of memory technologies that can be used with various aspects of the present invention include SD cards, flash memory, dynamic random access memory (DRAM), magnetic storage (eg, hard disk drives), memrist devices, Phase-change memory (PCM), and spin-transfer torque random access memory (STT-RAM). Each of these memory technologies can be applied as a memory device, a memory stick, or a memory card, as discussed elsewhere herein.

本發明的優點可包括沒有移動部件、減少熱產生、減少噪音產生、以及低成本的容量,這可有效地取代硬碟機及/或USB大容量儲存裝置。另外,本發明可提供較便宜且較密集的儲存容量,相較於一些種類的固態硬碟(SSD)來說。另外,複數個記憶卡的容量以有效率、方便使用者、且資料安全的方式結合。關於高容量,當使用各自包括八個128GB的microSD卡之25個記憶卡棒時,產生的固態硬碟的容量大約是25TB。另外,高容量的外形與無線連接可提供給高密度的應用,在實體放置上有較少的限制。 Advantages of the present invention can include no moving parts, reduced heat generation, reduced noise generation, and low cost capacity, which can effectively replace hard disk drives and/or USB mass storage devices. Additionally, the present invention can provide a relatively inexpensive and dense storage capacity compared to some types of solid state drives (SSDs). In addition, the capacity of a plurality of memory cards is combined in an efficient, user-friendly, and data-safe manner. Regarding high capacity, when using 25 memory card bars each including eight 128 GB microSD cards, the generated solid state disk has a capacity of about 25 TB. In addition, high-capacity form factor and wireless connectivity are available for high-density applications with fewer restrictions on physical placement.

雖然前述提供某些非限制的範例實施例,應理解到,前述的組合、子集、與變化可設想到。所尋求的專賣權由申請專利範圍界定。 While the foregoing provides certain non-limiting example embodiments, it should be understood that the foregoing combinations, sub-sets, and variations are conceivable. The exclusive right sought is defined by the scope of the patent application.

44‧‧‧實體介面 44‧‧‧Physical interface

46‧‧‧介面控制器 46‧‧‧Interface controller

52‧‧‧控制器核心 52‧‧‧Controller core

54‧‧‧指令記憶體 54‧‧‧Instruction Memory

56‧‧‧工作記憶體控制器 56‧‧‧ working memory controller

58‧‧‧工作記憶體 58‧‧‧ working memory

62‧‧‧現場可編程閘陣列(FPGA) 62‧‧‧ Field Programmable Gate Array (FPGA)

104‧‧‧控制器板 104‧‧‧Controller board

106‧‧‧記憶卡棒 106‧‧‧ memory card stick

108‧‧‧SATA埠 108‧‧‧ SATA埠

110‧‧‧USB埠 110‧‧‧USB埠

120‧‧‧SATA控制器 120‧‧‧SATA controller

122‧‧‧電源埠 122‧‧‧Power supply埠

124‧‧‧電源調節器 124‧‧‧Power conditioner

126‧‧‧SPI 126‧‧‧SPI

128‧‧‧SPI控制器 128‧‧‧SPI controller

130‧‧‧記憶棒連接器 130‧‧‧Memory Stick Connector

Claims (18)

一種固態記憶體裝置,包括:一機架單元殼體,該機架單元殼體係塑形且設計尺寸成適於一資料中心機架或機櫃;複數個記憶體裝置,該複數個記憶體裝置設置在該機架單元殼體內;複數個記憶棒,該複數個記憶棒設置在該機架單元殼體內,該複數個記憶棒的每一記憶棒耦接至該複數個記憶體裝置的一子集的記憶體裝置;一控制器,該控制器係配置成透過該複數個記憶棒來平行存取該複數個記憶體裝置,以存取該複數個記憶體裝置作為一虛擬記憶體裝置,並且呈現給一主機為具有基於該複數個記憶體裝置的容量之一總容量的一單一非揮發性儲存單元;該控制器進一步配置成根據一記憶體映射來操作,以映射來自該主機的記憶體請求至該複數個記憶體裝置,該記憶體映射界定一記憶體區,該記憶體區用於存取該複數個記憶棒的每一記憶棒,該記憶體區映射至該主機所界定的複數個主機區,該複數個主機區的每一主機區映射至每一記憶棒的一不同的記憶體裝置;及複數個記憶體區的每一記憶體區係映射至一不同 的記憶棒,用於平行地寫入與讀取該複數個記憶體區,以增加記憶體存取的速度。 A solid state memory device comprising: a rack unit housing shaped and dimensioned to be adapted to a data center rack or cabinet; a plurality of memory devices, the plurality of memory device settings a plurality of memory sticks disposed in the rack unit housing, each memory stick of the plurality of memory sticks being coupled to a subset of the plurality of memory devices a memory device; the controller is configured to access the plurality of memory devices in parallel through the plurality of memory sticks to access the plurality of memory devices as a virtual memory device and present Giving a host a single non-volatile storage unit having a total capacity based on a capacity of the plurality of memory devices; the controller further configured to operate in accordance with a memory map to map memory requests from the host Up to the plurality of memory devices, the memory map defines a memory region for accessing each memory stick of the plurality of memory sticks, the memory Mapping to a plurality of host areas defined by the host, each host area of the plurality of host areas being mapped to a different memory device of each memory stick; and each memory area mapping of the plurality of memory areas Different The memory stick is used to write and read the plurality of memory areas in parallel to increase the speed of memory access. 如請求項1所述之裝置,其中該控制器包括一無線介面,且該複數個記憶棒的至少一記憶棒包括一無線介面,該控制器的該無線介面與該至少一記憶棒的該無線介面係配置來在該控制器與該至少一記憶棒之間無線通訊指令與資料。 The device of claim 1, wherein the controller comprises a wireless interface, and the at least one memory stick of the plurality of memory sticks comprises a wireless interface, the wireless interface of the controller and the wireless of the at least one memory stick The interface is configured to wirelessly communicate instructions and data between the controller and the at least one memory stick. 如請求項2所述之裝置,其中該複數個記憶棒的至少一記憶棒包括一無線介面,且該複數個記憶體裝置的至少一記憶體裝置包括一無線介面,該至少一記憶棒的該無線介面與該至少一記憶體裝置的該無線介面係配置來在該至少一記憶棒與該至少一記憶體裝置之間無線通訊指令與資料。 The device of claim 2, wherein the at least one memory stick of the plurality of memory sticks comprises a wireless interface, and the at least one memory device of the plurality of memory devices comprises a wireless interface, the at least one memory stick The wireless interface and the wireless interface of the at least one memory device are configured to wirelessly communicate commands and data between the at least one memory stick and the at least one memory device. 如請求項1所述之裝置,進一步包括一電源供應器,該電源供應器設置在該機架單元殼體內,用於提供電力至該固態記憶體裝置。 The device of claim 1 further comprising a power supply disposed within the rack unit housing for providing power to the solid state memory device. 如請求項1所述之裝置,其中該複數個記憶體裝置的每一記憶體裝置包括一固態硬碟。 The device of claim 1, wherein each of the plurality of memory devices comprises a solid state hard disk. 如請求項1所述之裝置,其中該複數個記憶棒的每一記憶棒為一記憶卡棒,且該複數個記憶體裝置的每一記憶體裝置包括一記憶卡。 The device of claim 1, wherein each memory stick of the plurality of memory sticks is a memory card, and each memory device of the plurality of memory devices includes a memory card. 如請求項1所述之裝置,其中該子集的記憶 體裝置的每一記憶體裝置可從每一記憶棒熱插拔。 The device of claim 1, wherein the subset of memories Each memory device of the body device can be hot swapped from each memory stick. 如請求項1所述之裝置,進一步包括一可滑動托盤,該可滑動托盤支撐該機架單元殼體內的該複數個記憶體裝置與該複數個記憶棒,該可滑動托盤係配置來滑入該機架單元殼體中以及滑出該機架單元殼體,以檢查與熱插拔該複數個記憶體裝置與該複數個記憶棒的至少一者。 The device of claim 1, further comprising a slidable tray supporting the plurality of memory devices in the rack unit housing and the plurality of memory sticks, the slidable tray being configured to slide in The rack unit housing is slid out of the rack unit housing to inspect and hot plug the at least one of the plurality of memory devices and the plurality of memory sticks. 一種資料中心機架或機櫃,包括如請求項1所述之複數個固態記憶體裝置。 A data center rack or cabinet comprising a plurality of solid state memory devices as claimed in claim 1. 一種固態記憶體裝置,包括:複數個記憶體裝置;複數個記憶棒,該複數個記憶棒的每一記憶棒耦接至該複數個記憶體裝置的一子集的記憶體裝置;一控制器,該控制器係配置成透過該複數個記憶棒來平行存取該複數個記憶體裝置,以存取該複數個記憶體裝置作為一虛擬記憶體裝置,並且呈現給一主機為具有基於該複數個記憶體裝置的容量之一總容量的一單一非揮發性儲存單元;該控制器包括一無線介面,且該複數個記憶棒的至少一記憶棒包括一無線介面,該控制器的該無線介面與該至少一記憶棒的該無線介面係配置來在該控制器與該至少一記憶棒之間無線通訊指令與資 料;及該複數個記憶體裝置的至少一記憶體裝置包括一無線介面,該至少一記憶棒的該無線介面與該至少一記憶體裝置的該無線介面係配置來在該至少一記憶棒與該至少一記憶體裝置之間無線通訊指令與資料。 A solid state memory device comprising: a plurality of memory devices; a plurality of memory sticks, each memory stick of the plurality of memory sticks coupled to a memory device of a subset of the plurality of memory devices; a controller The controller is configured to access the plurality of memory devices in parallel through the plurality of memory sticks to access the plurality of memory devices as a virtual memory device and present to a host based on the complex number a single non-volatile storage unit having a total capacity of one of the memory devices; the controller includes a wireless interface, and the at least one memory stick of the plurality of memory sticks includes a wireless interface, the wireless interface of the controller The wireless interface with the at least one memory stick is configured to wirelessly communicate commands and resources between the controller and the at least one memory stick And the at least one memory device of the plurality of memory devices includes a wireless interface, the wireless interface of the at least one memory stick and the wireless interface of the at least one memory device being configured to be in the at least one memory stick Wireless communication instructions and data between the at least one memory device. 如請求項10所述之裝置,其中該控制器進一步配置成根據一記憶體映射來操作,以映射來自該主機的記憶體請求至該複數個記憶體裝置,該記憶體映射界定一記憶體區,該記憶體區用於存取該複數個記憶棒的每一記憶棒,該記憶體區映射至該主機所界定的複數個主機區,該複數個主機區的每一主機區映射至與每一記憶棒相關的一不同的記憶體裝置,且複數個記憶體區的每一記憶體區係映射至一不同的記憶棒,用於平行地寫入與讀取該複數個記憶體區,以增加記憶體存取的速度。 The device of claim 10, wherein the controller is further configured to operate in accordance with a memory map to map a memory request from the host to the plurality of memory devices, the memory map defining a memory region The memory area is used to access each memory stick of the plurality of memory sticks, the memory area is mapped to a plurality of host areas defined by the host, and each host area of the plurality of host areas is mapped to each a different memory device associated with a memory stick, and each memory region of the plurality of memory regions is mapped to a different memory stick for writing and reading the plurality of memory regions in parallel Increase the speed of memory access. 如請求項10所述之裝置,其中該複數個記憶棒的每一記憶棒包括一無線介面,使得所有記憶棒係配置成無線通訊指令與資料於該控制器。 The device of claim 10, wherein each memory stick of the plurality of memory sticks comprises a wireless interface such that all of the memory sticks are configured to wirelessly communicate instructions and data to the controller. 如請求項10所述之裝置,其中該複數個記憶體裝置的每一記憶體裝置包括一無線介面,使得所有記憶體裝置係配置成無線通訊指令與資料於該複數個記憶棒。 The device of claim 10, wherein each of the plurality of memory devices includes a wireless interface such that all of the memory devices are configured to wirelessly communicate instructions and data to the plurality of memory sticks. 如請求項10所述之裝置,其中該複數個記憶體裝置的每一記憶體裝置包括一固態硬碟。 The device of claim 10, wherein each of the plurality of memory devices comprises a solid state drive. 如請求項10所述之裝置,其中該複數個記憶棒的每一記憶棒為一記憶卡棒,且該複數個記憶體裝置的每一記憶體裝置包括一記憶卡。 The device of claim 10, wherein each memory stick of the plurality of memory sticks is a memory card, and each memory device of the plurality of memory devices includes a memory card. 如請求項10所述之裝置,其中該子集的記憶體裝置的每一記憶體裝置可從每一記憶棒熱插拔。 The device of claim 10, wherein each memory device of the subset of memory devices is hot pluggable from each memory stick. 如請求項10所述之裝置,進一步包括一機架單元殼體,該機架單元殼體係塑形且設計尺寸成適於一資料中心機架或機櫃,其中該複數個記憶體裝置、該複數個記憶棒、與該控制器設置在該機架單元殼體內。 The device of claim 10, further comprising a rack unit housing shaped and adapted to be adapted to a data center rack or cabinet, wherein the plurality of memory devices, the plurality A memory stick is disposed in the housing unit housing with the controller. 如請求項17所述之裝置,進一步包括一可滑動托盤,該可滑動托盤支撐該機架單元殼體內的該複數個記憶體裝置與該複數個記憶棒,該可滑動托盤係配置來滑入該機架單元殼體中以及滑出該機架單元殼體,以檢查與熱插拔該複數個記憶體裝置與該複數個記憶棒的至少一者。 The device of claim 17, further comprising a slidable tray supporting the plurality of memory devices in the rack unit housing and the plurality of memory sticks configured to slide in The rack unit housing is slid out of the rack unit housing to inspect and hot plug the at least one of the plurality of memory devices and the plurality of memory sticks.
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