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TW202428384A - Solder bodies attach tool and method of treating solder bodies using same - Google Patents

Solder bodies attach tool and method of treating solder bodies using same Download PDF

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Publication number
TW202428384A
TW202428384A TW112149138A TW112149138A TW202428384A TW 202428384 A TW202428384 A TW 202428384A TW 112149138 A TW112149138 A TW 112149138A TW 112149138 A TW112149138 A TW 112149138A TW 202428384 A TW202428384 A TW 202428384A
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Taiwan
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solder body
solder
processing tool
pressurizing
accommodating
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TW112149138A
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Chinese (zh)
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金容和
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南韓商高麗半導體系統股份有限公司
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Publication of TW202428384A publication Critical patent/TW202428384A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/13138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/13147—Copper [Cu] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/756—Means for supplying the connector to be connected in the bonding apparatus
    • H01L2224/75611—Feeding means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/756—Means for supplying the connector to be connected in the bonding apparatus
    • H01L2224/75621—Holding means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/81053—Bonding environment
    • H01L2224/81091—Under pressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119—Arrangement of the bump connectors prior to mounting

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The present invention relates to a solder body processing tool and a solder body processing method using same. The solder body processing tool comprises: a seating plate in which accommodation portions each accommodating a single solder body are arranged in a certain pattern, wherein the height of each of the solder bodies is greater than the long side of the cross-section thereof; a pressure regulator that applies suction pressure to the accommodation portions; and a pressing member provided with a pressing block that can move relative to the accommodation portions and a plurality of pressing pins that extend from the pressing block and are at least partially inserted into the accommodation portions, wherein the solder bodies are pushed out of the accommodation portions by the pressing pins. The present invention achieves the effect of accurately attaching a pillar-shaped solder body in an upright position to a designated location on a substrate, wherein the pillar-shaped solder body is taller than elements on the substrate.

Description

焊料體處理工具及利用其的焊料體處理方法Solder body processing tool and solder body processing method using the same

本發明涉及焊料體處理工具和利用其的焊料體處理方法，更具體地，涉及一種焊料體處理工具及利用其的焊料體處理方法，將高度高的焊料體安裝於下部處理工具的以預設圖案排列的容納部中，將焊料體轉移至具有相同圖案的容納部的上部處理工具，由上部處理工具以所述圖案形態無誤差地附著焊料體至基板。The present invention relates to a solder body processing tool and a solder body processing method using the same, and more specifically, to a solder body processing tool and a solder body processing method using the same, wherein a high solder body is installed in a receiving portion arranged in a preset pattern of a lower processing tool, and the solder body is transferred to an upper processing tool having a receiving portion with the same pattern, and the upper processing tool attaches the solder body to a substrate without error in the form of the pattern.

最近，隨著電子設備的小型化和高性能化，半導體封裝的整合度呈現日益增高的趨勢。由此，半導體晶片以在基板上貼裝元件的狀態進行堆疊並製成高性能的半導體封裝件。Recently, with the miniaturization and high performance of electronic devices, the integration degree of semiconductor packages has been increasing. As a result, semiconductor chips are stacked with components mounted on a substrate to produce high-performance semiconductor packages.

即，如圖1a所示，用於形成一個半導體封裝件的單位晶片U1中，以圖案形態備置有安裝部Cx，其用於電連接堆疊的上側基板和下側基板。此外，作為導電性材料的焊料球mB在安裝於下側基板的安裝部Cx的狀態下，可基於回流製程與下側基板一體化，上側基板堆疊，以電接觸上上下側基板的狀態製成半導體封裝件。That is, as shown in FIG. 1a, in a unit chip U1 for forming a semiconductor package, a mounting portion Cx is provided in a patterned form, which is used to electrically connect the stacked upper substrate and lower substrate. In addition, the solder ball mB, which is a conductive material, can be integrated with the lower substrate based on a reflow process when mounted on the mounting portion Cx of the lower substrate, and the upper substrate is stacked to form a semiconductor package in a state of electrically contacting the upper and lower substrates.

為了在基板S的安裝部Cx安裝焊料球mB，可使用如圖1b所示的處理工具20。基於壓力調節部P2可對處理工具20的內部空間施加吸入壓py，由此，處理工具20的容納部22中吸入焊料球mB並維持把持的狀態下，處理工具20位於基板S的上側且維持相隔預設間距h2的狀態，如果去除吸入壓py，則焊料球mB下落並附著在基板S安裝部Cx中預先塗覆的焊錫膏F的上側。In order to install the solder ball mB in the mounting portion Cx of the substrate S, a processing tool 20 as shown in FIG1b can be used. Based on the pressure adjustment portion P2, a suction pressure py can be applied to the internal space of the processing tool 20, whereby the solder ball mB is sucked into the receiving portion 22 of the processing tool 20 and maintained in a gripping state, and the processing tool 20 is located on the upper side of the substrate S and maintained at a preset distance h2. If the suction pressure py is removed, the solder ball mB falls and adheres to the upper side of the solder paste F pre-coated in the mounting portion Cx of the substrate S.

附圖中未說明的元件符號Bx表示用於形成一個半導體封裝件的單位晶片U1所對應的區域。The unexplained element symbol Bx in the accompanying drawings represents an area corresponding to the unit chip U1 used to form a semiconductor package.

然而，最近，基板S上貼裝的元件K的設定高度hk逐漸增高，焊料球mB的大小和間距呈現逐漸變稠密的趨勢。如上所述，由於基板S上貼裝的元件K的高度hk，處理工具20與基板S之間的間距h2不得不遠，處理工具20去除吸入壓py後，在焊料球mB下落期間，如果處理工具20或吸入壓py發生輕微的晃動則焊料球mB的下落軌跡發生偏移並形成與重力方向不同的路徑，引起焊料球mB不能準確地下落並附著於安裝部Cx的問題。However, recently, the set height hk of the component K mounted on the substrate S has gradually increased, and the size and spacing of the solder balls mB have shown a trend of gradually becoming denser. As described above, due to the height hk of the component K mounted on the substrate S, the distance h2 between the processing tool 20 and the substrate S has to be far away. After the processing tool 20 removes the suction pressure py, during the falling period of the solder ball mB, if the processing tool 20 or the suction pressure py is slightly shaken, the falling trajectory of the solder ball mB is deviated and forms a path different from the direction of gravity, causing the problem that the solder ball mB cannot fall accurately and adhere to the mounting portion Cx.

此外，基板S上貼裝的元件K的高度hk越是增高，用於電接觸堆疊的下側基板和上側基板的焊料球mB的高度也應該隨之增高，球形的焊料球mB的高度增大則焊料球mB的尺寸也隨之增大，引起焊料球mB不能佈置於分佈稠密的基板S的安裝部Cx上的問題。In addition, as the height hk of the component K mounted on the substrate S increases, the height of the solder ball mB of the lower substrate and the upper substrate used for electrical contact stacking should also increase accordingly. As the height of the spherical solder ball mB increases, the size of the solder ball mB also increases, causing the problem that the solder ball mB cannot be arranged on the mounting portion Cx of the densely distributed substrate S.

因此，在利用堆疊方式製造半導體封裝件的製程中極需一種安裝柱狀的焊料體的方法，即使基板S上貼裝的元件K的高度hk增大，利用柱狀的焊料體電接觸上上下側基板的同時，將柱狀的焊料體準確地被拾取到處理工具的容納部，並將處理工具的容納部中容納的焊料體安裝於基板的預設位置的過程中，也能夠以豎立的狀態且不發生傾倒的直立姿勢安裝柱狀的焊料體。Therefore, in the process of manufacturing semiconductor packages using a stacking method, a method for installing a columnar solder body is urgently needed. Even if the height hk of the component K mounted on the substrate S increases, the columnar solder body can be electrically contacted with the upper and lower substrates by the columnar solder body, and the columnar solder body can be accurately picked up into the receiving portion of the processing tool. The solder body contained in the receiving portion of the processing tool is installed at a preset position on the substrate. In the process, the columnar solder body can be installed in an upright posture in a vertical state without tipping over.

進一步地，最近用於製造半導體封裝件的電接觸點的大小和間距逐漸變得更加稠密，更小橫斷面的超小型焊料體的轉移或者附著製程中，基於靜電力轉移或者附著過程中產生不良的問題也極需解決。Furthermore, the size and pitch of electrical contacts used in the manufacture of semiconductor packages have become increasingly dense, and the problem of defects in the transfer or attachment process due to electrostatic force has also become increasingly pressing.

上述結構是用來說明本發明被提出的背景，而非說明本發明的申請日之前所揭露的結構。The above structures are used to illustrate the background in which the present invention is proposed, rather than to illustrate structures disclosed before the filing date of the present invention.

技術問題Technical issues

為了解決如上所述的問題，本發明旨在提供一種焊料體處理工具及利用其的焊料處理方法，該工具可將電連接材料即柱狀焊料體以直立姿勢準確地固定在基板的安裝部上，此安裝部以基板的預設圖案佈置。In order to solve the above-mentioned problems, the present invention aims to provide a solder body processing tool and a solder processing method using the same, wherein the tool can accurately fix the electrical connection material, i.e., the columnar solder body, on the mounting portion of the substrate in an upright position, and the mounting portion is arranged in a preset pattern of the substrate.

換而言之，本發明即使在基板元件的高度增大也能夠將柱狀焊料體以預設的圖案附著到基板上。In other words, the present invention can attach the columnar solder bodies to the substrate in a preset pattern even when the height of the substrate components increases.

為此，本發明的目的在於，在將柱狀焊料體安裝到把持處理工具的容納部。Therefore, an object of the present invention is to mount a columnar solder body in a receiving portion of a holding processing tool.

此外，本發明的目的在於，將安裝於把持處理工具的容納部的焊料體可靠地轉移到附著處理工具的第2容納部。In addition, an object of the present invention is to reliably transfer a solder body mounted in a housing portion of a holding processing tool to a second housing portion to which the processing tool is attached.

此外，本發明的目的在於，將附著處理工具的第2容納部中容納的焊料體準確地附著到基板的預設位置。In addition, an object of the present invention is to accurately attach the solder body accommodated in the second accommodation portion of the attachment processing tool to a preset position on the substrate.

此外，本發明的目的在於，在將焊料體安裝到把持處理工具的容納部中的過程中通過使剩餘的焊料體不發生污染或者損傷，使再利用的焊料體體現出與全新供給的焊料體相同的堆疊品質。Another object of the present invention is to make the reused solder body show the same stacking quality as the newly supplied solder body by preventing the surplus solder body from being contaminated or damaged during the process of installing the solder body into the receiving part of the handling tool.

除此之外，本發明的目的在於，基於超小型焊料體形成基板的電接觸點時，焊料體基於靜電力而很難從處理工具的容納孔分離，從而防止焊料體的安裝過程中出現不良。In addition, the purpose of the present invention is to prevent defects in the installation process of the solder body by making it difficult for the solder body to separate from the receiving hole of the processing tool due to electrostatic force when the electrical contact point of the substrate is formed based on the ultra-small solder body.

由此，本發明的目的在於，即使基板上貼裝的元件導致堆疊的上側基板和下側基板的間距變大，也能夠將柱狀的焊料體準確地佈置於預設的接觸位置上，使上外側基板電氣接觸，從而可利用貼裝有各種元件的基板製造半導體封裝件。Therefore, the purpose of the present invention is to accurately arrange the columnar solder body at the preset contact position to make the upper outer substrate electrically contact even if the components mounted on the substrate cause the distance between the stacked upper substrate and the lower substrate to become larger, so that semiconductor packages can be manufactured using substrates with various components mounted on them.

技術方案Technical solutions

本發明為了實現如上所述的目的，提供一種焊料體處理工具，該焊料體的高度大於橫斷面的長邊，該焊料體處理工具包括：安裝板，其以預設的圖案排列有容納部，所述容納部逐一容納所述焊料體；壓力調節部，其用於向所述容納部施加吸入壓；加壓部件，其具有相當於所述容納部可移動的加壓塊及從所述加壓塊延伸且至少一部分插入所述容納部的多個加壓銷，利用所述加壓銷向所述容納部外部推出所述焊料體。In order to achieve the above-mentioned purpose, the present invention provides a solder body processing tool, wherein the height of the solder body is greater than the long side of the cross-section, and the solder body processing tool comprises: a mounting plate, which has accommodating parts arranged in a preset pattern, and the accommodating parts accommodate the solder bodies one by one; a pressure regulating part, which is used to apply suction pressure to the accommodating parts; a pressurizing component, which has a pressurizing block movable to the accommodating parts and a plurality of pressurizing pins extending from the pressurizing block and at least partially inserted into the accommodating parts, and the solder bodies are pushed out of the accommodating parts by using the pressurizing pins.

此外，本發明提供一種焊料體處理方法，該焊料體的高度大於橫斷面的長邊，包括：焊料體容納步驟，向具有安裝板的附著處理工具的第2容納部施加吸入壓，並將所述焊料體逐一容納至所述第2容納部，所述安裝板上形成有以預設的圖案排列的所述第2容納部；處理工具放置步驟，將所述處理工具放置於相當於與附著對象相隔預設間距z2的高度處；焊料體加壓步驟，利用每個所述第2容納部中佈置的第2加壓銷向所述第2容納部的外部推出所述焊料體。In addition, the present invention provides a solder body processing method, the height of which is greater than the long side of the cross-section, comprising: a solder body accommodating step, applying suction pressure to a second accommodating portion of an attached processing tool having a mounting plate, and accommodating the solder bodies one by one into the second accommodating portion, the mounting plate being provided with second accommodating portions arranged in a preset pattern; a processing tool placing step, placing the processing tool at a height equivalent to a preset spacing z2 from an attachment object; a solder body pressurizing step, using a second pressurizing pin arranged in each of the second accommodating portions to push the solder body to the outside of the second accommodating portion.

此外，本發明提供一種焊料體處理方法，該焊料體供給至以擱置板的預設圖案分佈的容納部，該方法包括：焊料體供給步驟，向焊料體處理裝置的一側供給高度大於橫斷面面的長邊的焊料體，所述焊料體處理裝置包括把持處理工具和與所述安裝板以相同的高度連續設置的擱置板，所述把持處理工具中形成於安裝板且具有一定圖案的容納部的開口朝向上方設置，多個加壓銷從所述容納部的下部向上部可移動地設置，而且形成為吸入壓可施加至所述容納部；焊料體移動步驟，驅動佈置於所述擱置板一邊的第1激振器及佈置於所述擱置板另一邊的第2激振器，基於所述擱置板的振動，使所述焊料體回彈的同時通過所述容納部上側地移動；焊料體容納步驟，所述焊料體位於所述容納部上側的狀態下，同時驅動所述第1激振器和所述第2激振器，誘使所述焊料體在原位置上回彈並容納至所述容納部。In addition, the present invention provides a method for processing a solder body, wherein the solder body is supplied to a receiving portion arranged in a preset pattern of a mounting plate, the method comprising: a solder body supplying step, supplying a solder body having a height greater than the long side of a cross-sectional surface to one side of a solder body processing device, the solder body processing device comprising a holding processing tool and a mounting plate continuously arranged at the same height as the mounting plate, the holding processing tool having an opening of a receiving portion having a certain pattern formed on the mounting plate and arranged upward, a plurality of pressurizing pins extending from the lower portion of the receiving portion to the upper portion It is movably arranged and formed so that suction pressure can be applied to the accommodating portion; a solder body moving step, driving a first vibrator arranged on one side of the mounting plate and a second vibrator arranged on the other side of the mounting plate, and based on the vibration of the mounting plate, the solder body rebounds and moves through the upper side of the accommodating portion; a solder body accommodating step, when the solder body is located on the upper side of the accommodating portion, the first vibrator and the second vibrator are driven at the same time to induce the solder body to rebound at the original position and be accommodated in the accommodating portion.

本說明書及請求書中記載的術語「焊錫膏」是指將焊料體安置到基板上時使用的具有輔助成分的材料的統稱，其定義為包括焊錫膏（paste）、焊接膏及焊劑（flux）。The term "solder paste" used in this specification and application is a general term for materials with auxiliary components used to place the solder body on the substrate, and is defined to include solder paste, soldering paste, and flux.

本說明書和申請專利範圍中記載的術語「容納部」是指，用於安裝焊料體的預設的處理工具的槽或孔。The term "receiving portion" described in this specification and the scope of the patent application refers to a groove or hole of a preset processing tool for mounting a solder body.

本說明書與申請專利範圍中記載的「長邊」是指橫斷面為圓形時的直徑、為橢圓形時的長半徑的兩倍、為多邊形時的最大對角線長度。The "long side" described in this specification and patent application refers to the diameter when the cross section is a circle, twice the major radius when it is an ellipse, and the maximum diagonal length when it is a polygon.

本說明書和申請專利範圍中記載的術語「焊料體」是指不同於現有實施形態的焊料球，由導電性材料形成且為柱狀的柱高度大於橫斷面的長邊的焊料（solder）。The term "solder body" described in this specification and the scope of the patent application refers to a solder (solder) that is different from the solder ball of the conventional embodiment and is formed of a conductive material and has a columnar column height greater than the long side of the cross-section.

本說明書和申請專利範圍中記載的術語「開口」是指容納焊料體的至少一部分的容納部或第2容納部中用於插入焊料體的入口。The term "opening" described in this specification and the scope of the patent application refers to a receiving portion that receives at least a portion of a solder body or an inlet in a second receiving portion for inserting the solder body.

本說明書和申請專利範圍中記載的術語「外側」及其類似的術語是指從外殼的內部空間通過容納部朝向外部的方向，本說明書和申請專利範圍中記載的術語「內側」及其類似的術語是指朝向外殼的內部空間的方向。因此，焊料體向內側移動的同時容納於容納部，容納部中容納的焊料體向外側移動並移出容納部。The term "outside" and similar terms in this specification and the scope of the patent application refer to the direction from the inner space of the housing through the receiving portion toward the outside, and the term "inside" and similar terms in this specification and the scope of the patent application refer to the direction toward the inner space of the housing. Therefore, the solder body moves inward while being received in the receiving portion, and the solder body received in the receiving portion moves outward and moves out of the receiving portion.

有益效果Beneficial Effects

根據本發明，可獲得將高度大於基板的元件高度的柱狀焊料體以直立姿勢準確地附著到基板的預設位置上的有益效果。According to the present invention, the beneficial effect of accurately attaching a columnar solder body having a height greater than a component height of a substrate to a preset position of a substrate in an upright position can be achieved.

換而言之，本發明透過在移送焊料體的第2容納部中容納柱狀焊料體的狀態下，利用加壓銷維持將焊料體推向基板的狀態或者反覆施加焊接力，基於焊錫膏的黏結力將焊料體以直立姿勢牢固地附著到基板預設位置上。In other words, the present invention accommodates the columnar solder body in the second receiving portion for transferring the solder body, and uses a pressure pin to maintain the state of pushing the solder body toward the substrate or repeatedly applies a soldering force, so that the solder body is firmly attached to a preset position on the substrate in an upright position based on the bonding force of the solder paste.

其中，本發明利用加壓銷並基於空壓施加焊接力以推出焊料體，使焊料體的下端能夠在預設的時間內施加持續壓力至焊錫膏，從而將焊料體以直立狀態牢固地緊固到基板的焊錫膏上。The present invention utilizes a pressure pin and applies welding force based on air pressure to push out the solder body, so that the lower end of the solder body can apply continuous pressure to the solder paste within a preset time, thereby firmly fixing the solder body to the solder paste on the substrate in an upright state.

特別是，本發明為了使焊料體在不脫離第2容納部的狀態下使焊料體的下端與焊錫膏接觸，利用加壓銷施加焊接力以推出焊料體，從而可獲得使柱狀的焊料體不發生傾斜且以直立姿勢固定於基板的有益效果。In particular, in order to make the lower end of the solder body contact the solder paste without separating from the second accommodating portion, the present invention uses a pressurizing pin to apply a soldering force to push out the solder body, thereby achieving the beneficial effect of preventing the columnar solder body from tilting and fixing it to the substrate in an upright position.

此外，本發明透過重複施加利用加壓銷推出焊料體的焊接力至少兩次，透過對拾取的多個焊料體中下端與焊錫膏未發生黏貼狀態的剩餘的焊料體反覆施加焊接力，使其與焊錫膏緊貼，從而可獲得所有焊料體緊貼於焊錫膏且以直立狀態附著的效果。In addition, the present invention repeatedly applies welding force at least twice to push out the solder body using a pressurizing pin, and repeatedly applies welding force to the remaining solder bodies whose lower ends among the multiple solder bodies picked up are not in a state of adhesion to the solder paste, so that they are tightly attached to the solder paste, thereby achieving the effect of all solder bodies being tightly attached to the solder paste and attached in an upright state.

此外，隨著利用加壓銷機械地推出焊料體並緊貼至焊錫膏，從而超小型焊料體與附著處理工具的第2容納部不發生分離，進而可獲得防止附著不良發生的效果。Furthermore, as the solder body is mechanically pushed out by the press pin and adhered to the solder paste, the ultra-small solder body and the second receiving portion of the attachment processing tool are not separated, thereby achieving the effect of preventing the occurrence of poor attachment.

另外，本發明透過利用與移送焊料體相同形態的把持焊料體，將焊料體安裝於基板中以預設的圖案分佈的容納部上，從而可獲得以移送焊料體為媒介將焊料體附著到基板的預設位置上的效果。In addition, the present invention uses a holding solder body of the same shape as the transferred solder body to install the solder body on a receiving portion distributed in a preset pattern in the substrate, thereby achieving the effect of attaching the solder body to a preset position on the substrate using the transferred solder body as a medium.

其中，本發明為了傳遞振動通過將把持處理工具的安裝板與使焊料體振動的擱置板佈置成連續的一體，使供給到安裝板或者擱置板的焊料體進行回彈並移動，從而以非接觸方式安置於容納部，進而不僅能夠防止焊料體受損，將柱狀焊料體以原形附著到基板上，而且不發生污染問題，即使在附著到下一個基板時再利用，也能夠獲得以預期的形狀和姿勢放置焊料體的效果。Among them, in order to transmit vibration, the present invention arranges the mounting plate for holding the processing tool and the placing plate for vibrating the solder body into a continuous whole, so that the solder body supplied to the mounting plate or the placing plate rebounds and moves, and is placed in the storage part in a non-contact manner, thereby preventing the solder body from being damaged and attaching the columnar solder body to the substrate in its original shape without causing contamination problems. Even if it is reused when attached to the next substrate, the effect of placing the solder body in the expected shape and posture can be obtained.

此時，本發明透過在容納部的開口形成相對於深度方向呈25度至35度的角度傾斜的傾斜面，傾斜面的深度為焊料體的高度的1/3倍至2/3倍，從而進行回彈移動的焊料體的一部分流入容納部的傾斜面，則自行豎起且流入容納部並實現安置，從而可獲得大幅縮減將焊料體安置於容納部時所需時間的效果。At this time, the present invention forms an inclined surface at an angle of 25 to 35 degrees relative to the depth direction at the opening of the accommodating portion, and the depth of the inclined surface is 1/3 to 2/3 times the height of the solder body, so that a part of the solder body that rebounds and moves flows into the inclined surface of the accommodating portion, then stands up by itself and flows into the accommodating portion to be placed, thereby achieving the effect of greatly reducing the time required to place the solder body in the accommodating portion.

由此，本發明在基板上貼裝有元件的狀態下，也能夠透過銷狀的焊料體形成小橫斷面的同時將上下相隔距離較大的基板電氣接觸地連接，從而實現疊層結構的半導體封裝的高整合化效果。Therefore, the present invention can form a small cross-section through the pin-shaped solder body while electrically connecting the upper and lower substrates that are separated by a large distance, while a component is mounted on the substrate, thereby achieving a high integration effect of a stacked structure semiconductor package.

下面，參考附圖對根據本發明一實施例的焊料體處理工具100及利用其的處理裝置1的結構進行說明。Next, the structure of a solder body processing tool 100 and a processing apparatus 1 using the same according to an embodiment of the present invention will be described with reference to the accompanying drawings.

如圖3a至圖5所示，根據本發明一實施例的焊料體處理工具100作為通過將柱狀的焊料體hB吸入進行容納或者移送，或者轉移或者附著等處理過程中使用的機構，包括：外殼110，其一面具有設置有多個容納部115的安裝板112，且形成用有與外部隔絕的空間；壓力調節部P，其用於調節外殼110的內部壓力；加壓部件120，其設置為在每一個容納部115具有加壓銷122，且基於加壓驅動部M向容納部115的貫通方向往返移動。As shown in Figures 3a to 5, a solder body processing tool 100 according to an embodiment of the present invention is a mechanism used in a process of sucking in a columnar solder body hB to accommodate or transfer, or transfer or attach, and includes: an outer shell 110, one side of which has a mounting plate 112 provided with a plurality of receiving portions 115, and forms a space isolated from the outside; a pressure adjusting portion P, which is used to adjust the internal pressure of the outer shell 110; a pressurizing component 120, which is provided with a pressurizing pin 122 in each receiving portion 115, and moves back and forth in the through direction of the receiving portion 115 based on the pressurizing driving portion M.

其中，焊料體hB是指由導電性材料形成的焊料（solder），其具有高度hh大於橫斷面中最長邊dd的形狀。例如，焊料體hB可由高導電性的銅等形成。The solder body hB refers to a solder formed of a conductive material, and has a shape in which a height hh is greater than the longest side dd in a cross section. For example, the solder body hB may be formed of highly conductive copper or the like.

焊料體hB的長邊dd大致可以為200 ㎛至300 ㎛，本發明中採用的超小型焊料體hB的長邊dd還可為50 ㎛至150 ㎛。此外，焊料體hB的高度hh可以為長邊dd的1.2倍至5.0倍。The long side dd of the solder body hB can be approximately 200 to 300 ㎛, and the long side dd of the ultra-small solder body hB used in the present invention can also be 50 to 150 ㎛. In addition, the height hh of the solder body hB can be 1.2 to 5.0 times the long side dd.

如圖6所示，當焊料體hB為圓柱形狀時，焊料體的長邊為圓的直徑dd，當焊料體hB為橢圓柱時，焊料體的長邊為橢圓的長半徑的2倍，焊料體hB為多棱柱時焊料體的長邊為多棱形的最長對角線長度。As shown in Figure 6, when the solder body hB is cylindrical, the long side of the solder body is the diameter dd of the circle; when the solder body hB is an elliptical cylinder, the long side of the solder body is twice the long radius of the ellipse; when the solder body hB is a polygonal column, the long side of the solder body is the longest diagonal length of the polygon.

如圖3所示，所述外殼110設定為與外部隔絕且基於壓力調節部P調節壓力。形成外殼110一面的安裝板112中貫通地形成有容納部115，容納部115呈與安裝部Cx對齊的圖案排列，所述安裝部Cx位於縱橫連接有多個單位晶片U1的基板S上。As shown in FIG3 , the housing 110 is configured to be isolated from the outside and to adjust the pressure based on the pressure adjusting portion P. A receiving portion 115 is formed through the mounting plate 112 forming one side of the housing 110 , and the receiving portion 115 is arranged in a pattern aligned with the mounting portion Cx, and the mounting portion Cx is located on a substrate S to which multiple unit chips U1 are connected vertically and horizontally.

其中，容納部115包括各種形狀，可用於容納焊料體hB的至少一部分。如，容納部115可形成為槽狀，也可形成為貫通孔形狀。根據本發明的優選實施形態，如圖4所示，容納部115由貫通孔形成，向外部暴露容納部115的開口的相反側具有加壓銷122的前端122e，加壓銷122的前端122e可形成有支撐面，用於將焊料體hB容納於容納部115，從而基於加壓銷122的前端122e可確定安裝於容納部115的焊料體hB前端的插入深度。Among them, the accommodating portion 115 includes various shapes and can be used to accommodate at least a portion of the solder body hB. For example, the accommodating portion 115 can be formed into a groove shape or a through hole shape. According to a preferred embodiment of the present invention, as shown in FIG. 4 , the accommodating portion 115 is formed by a through hole, and the opposite side of the opening of the accommodating portion 115 exposed to the outside has a front end 122e of the pressurizing pin 122, and the front end 122e of the pressurizing pin 122 can be formed with a supporting surface for accommodating the solder body hB in the accommodating portion 115, so that the insertion depth of the front end of the solder body hB installed in the accommodating portion 115 can be determined based on the front end 122e of the pressurizing pin 122.

此時，加壓驅動部M能夠以加壓塊121的預設衝程進行往返移動。例如，在加壓塊121以最大遠離容納部115並後退的狀態中，可確定將焊料體hB容納到容納部115的位置，在加壓塊121以最大接近容納部115地移動的狀態中，可確定將焊料體hB從容納部115向外部推出的位置。因此，加壓塊121的移動衝程末端還可以備置有限位器。只是，本發明不限於此，還可以設定為基於控制部160根據需要以電學方式對加壓塊121的移動衝程進行控制。At this time, the pressurizing drive unit 24 can move back and forth with the preset stroke of the pressurizing block 121. For example, when the pressurizing block 121 is moved away from the accommodating portion 115 as far as possible and retreats, the position of accommodating the solder body hB in the accommodating portion 115 can be determined, and when the pressurizing block 121 moves as close to the accommodating portion 115 as possible, the position of pushing the solder body hB out of the accommodating portion 115 can be determined. Therefore, a limiter can be provided at the end of the moving stroke of the pressurizing block 121. However, the present invention is not limited to this, and can also be set to control the moving stroke of the pressurizing block 121 electrically as needed based on the control unit 160.

焊料體hB設定為在容納於容納部115的狀態下與加壓銷122的前端122e接觸，電離裝置（未圖示）設定為與加壓銷122連接的加壓塊121靠近，從而能夠使電離裝置產生的離子中與焊料體hB極性相反的離子向焊料體hB移動，基於該離子與焊料體電荷的結合產生聚合，並去除焊料體hB與加壓銷122之間可能產生的靜電力，從而對於超微細焊料體hB也能夠獲得順利地從安裝板112的容納部115分離的效果。其中，電離裝置作為各種悉知的手段，可應用於施加電壓或用於提供電離所需的離子。The solder body hB is configured to be in contact with the front end 122e of the pressurizing pin 122 while being accommodated in the accommodating portion 115, and the ionizing device (not shown) is configured to be close to the pressurizing block 121 connected to the pressurizing pin 122, so that the ions generated by the ionizing device and having the opposite polarity to the solder body hB can move toward the solder body hB, and polymerization is generated based on the combination of the ions and the charge of the solder body, and the electrostatic force that may be generated between the solder body hB and the pressurizing pin 122 is removed, so that the ultra-fine solder body hB can also be smoothly separated from the accommodating portion 115 of the mounting plate 112. Among them, the ionization device can be used as various well-known means to apply voltage or to provide ions required for ionization.

另外，容納部115還可以以一定的斷面貫通地形成，如圖4所示，向外部暴露的開口側可形成有朝向外部開口且斷面逐漸增加的傾斜面1151。由此，處理工具100在圖7圖示的處理裝置1中能夠使焊料體hB回彈的同時縮短利用容納部115的開口安裝焊料體hB的時間。In addition, the receiving portion 115 can also be formed with a certain cross section, and the opening side exposed to the outside can be formed with an inclined surface 1151 that opens toward the outside and has a gradually increasing cross section as shown in FIG4. Thus, the processing tool 100 can make the solder body hB rebound while shortening the time for installing the solder body hB using the opening of the receiving portion 115 in the processing device 1 shown in FIG7.

其中，傾斜面1151的傾斜角ang1相對於容納部115的深度方向呈25度至35度的角度傾斜地形成。這是由於參考基於各種傾斜角的實驗結果可知，如果傾斜面1151的傾斜角ang1為25度以內，則容納部115的開口斷面小，焊料體hB流入容納部115內部的比例顯著變小，不可取，如果傾斜面1151的傾斜角ang1超過35度，則即使焊料體hB的一部分通過容納部115的開口流入但是由於沒有安裝於容納部115的內部，因此重新向外部彈出的可能性明顯變大。The inclination angle ang1 of the inclined surface 1151 is formed to be inclined at an angle of 25 to 35 degrees relative to the depth direction of the accommodating portion 115. This is because, referring to the experimental results based on various inclination angles, it can be seen that if the inclination angle ang1 of the inclined surface 1151 is within 25 degrees, the opening cross-section of the accommodating portion 115 is small, and the proportion of the solder body hB flowing into the accommodating portion 115 is significantly reduced, which is not desirable. If the inclination angle ang1 of the inclined surface 1151 exceeds 35 degrees, even if a part of the solder body hB flows into the accommodating portion 115 through the opening, it is not installed inside the accommodating portion 115, so the possibility of it popping out again to the outside is significantly increased.

同時，所述傾斜面1151以相對於從容納部115的開口至焊料體hB的高度hh的1/3倍至2/3倍的深度d1形成。由此，如圖10所示可獲得如下優點：在將焊料體hB容納於把持處理工具101的容納部的製程中，只要焊料體hB的末端部流入開口，便可以誘使焊料體hB容納至容納部115，還可以在將焊料體hB附著到基板S的製程中，將焊料體hB的一部分zz容納於容納部115的容納貫通部1153的狀態下，維持焊料體hB的一端與作為附著物件的基板S的表面接觸的狀態的同時，利用加壓銷122向下加壓焊料體hB。At the same time, the inclined surface 1151 is formed with a depth d1 of 1/3 to 2/3 of the height hh from the opening of the receiving portion 115 to the solder body hB. As a result, as shown in FIG10 , the following advantages can be obtained: in the process of receiving the solder body hB in the receiving portion of the holding processing tool 101, as long as the end of the solder body hB flows into the opening, the solder body hB can be induced to be received in the receiving portion 115, and in the process of attaching the solder body hB to the substrate S, a part zz of the solder body hB can be received in the receiving through portion 1153 of the receiving portion 115, while maintaining the state in which one end of the solder body hB is in contact with the surface of the substrate S as the attached object, and the solder body hB can be pressed downward by the pressurizing pin 122.

此外，如圖4所示，容納部115的開口相反側也可形成朝向內側開口且斷面逐漸增加的內側傾斜面1152。由此，即使加壓銷122與容納部115的對齊狀態存在誤差，也可利用容納部115的內側貫通部1154引導加壓銷122，使焊料體hB的至少一部分容納於焊料容納部115的狀態下，使焊料體hB的前端與加壓銷122的前端122e接觸的同時能夠準確地容納焊料體hB，從容納部115排出焊料體hB時，能夠準確地引入向外推的焊接力。In addition, as shown in Fig. 4, an inner inclined surface 1152 which opens inward and has a gradually increasing cross section may be formed on the opposite side of the opening of the receiving portion 115. Thus, even if there is an error in the alignment state between the pressurizing pin 122 and the receiving portion 115, the pressurizing pin 122 may be guided by the inner through-hole 1154 of the receiving portion 115, so that at least a portion of the solder body hB is received in the solder receiving portion 115, the front end of the solder body hB contacts the front end 122e of the pressurizing pin 122, and the solder body hB can be accurately received, and when the solder body hB is discharged from the receiving portion 115, the soldering force pushing outward can be accurately introduced.

容納部115的內側貫通部1154與傾斜面1151之間備置有容納貫通部1153，容納貫通部1153相比於內側貫通部1154，直徑dx更小，內側貫通部1154用於容納導銷，導銷用於容納焊料體hB。其中，容納貫通部1153的直徑dx可為焊料體hB的長邊dd的1.2倍至1.5倍。An accommodating through-portion 1153 is provided between the inner through-portion 1154 of the accommodating portion 115 and the inclined surface 1151. The accommodating through-portion 1153 has a smaller diameter dx than the inner through-portion 1154. The inner through-portion 1154 is used to accommodate a guide pin, and the guide pin is used to accommodate the solder body hB. The diameter dx of the accommodating through-portion 1153 can be 1.2 to 1.5 times the long side dd of the solder body hB.

另外，外殼110中可備置有引導部113，用於引導加壓部件120的直線往復運動。如圖3a所示，外殼110的內部設置有一個加壓部件120時，外殼110側壁的內周面備置有用於引導加壓部件120直線往復運動120d的引導部113，以抑制使加壓部件120發生傾斜的傾斜位移。例如，引導部113為直線形的導軌狀，能夠插入加壓部件120的加壓塊121的凹槽部。In addition, the housing 110 may be provided with a guide portion 113 for guiding the linear reciprocating motion of the pressurizing component 120. As shown in FIG3a, when a pressurizing component 120 is provided inside the housing 110, the inner peripheral surface of the side wall of the housing 110 is provided with a guide portion 113 for guiding the linear reciprocating motion 120d of the pressurizing component 120 to suppress the tilting displacement that causes the pressurizing component 120 to tilt. For example, the guide portion 113 is in the shape of a linear guide rail, which can be inserted into the groove portion of the pressurizing block 121 of the pressurizing component 120.

外殼110可形成處理工具100的外廓，安裝板112對應基板S的形狀並形成。例如，如圖所圖示，包括多個單位晶片U1的基板S如果為四邊形狀，則安裝板112也為四邊形狀，同時外殼110為直六面體形狀。此外，若基板S如晶圓為圓形形狀，則安裝板112也為圓形形狀，外殼110可為低高度的圓柱形狀。只是，本發明不限於此，可包括備置有容納部115的各種形狀的結構，所述容納部115與基板S中的安裝部Cx的佈置相匹配。下面，為了方便說明，將附圖中示出了在四邊形狀的基板S上附著焊料體hB的結構作為範例進行說明。The outer shell 110 can form the outer contour of the processing tool 100, and the mounting plate 112 is formed corresponding to the shape of the substrate S. For example, as shown in the figure, if the substrate S including a plurality of unit chips U1 is in a quadrilateral shape, the mounting plate 112 is also in a quadrilateral shape, and the outer shell 110 is in a right hexahedron shape. In addition, if the substrate S is in a circular shape such as a wafer, the mounting plate 112 is also in a circular shape, and the outer shell 110 can be in a low-height cylindrical shape. However, the present invention is not limited to this, and may include structures of various shapes provided with a receiving portion 115, and the receiving portion 115 matches the layout of the mounting portion Cx in the substrate S. Below, for the convenience of explanation, the structure in which the solder body hB is attached to the quadrilateral substrate S shown in the attached figure is used as an example for explanation.

所述壓力調節部P用於調節外殼110內部空間的壓力，為了維持將焊料體hB容納於容納部115的拾取動作及維護容納的拾取狀態，施加吸入壓py，在執行將焊料體hB從容納部115推出的釋放動作時，去除吸入壓py或根據需要施加靜壓py’。The pressure regulating portion P is used to regulate the pressure of the internal space of the outer shell 110. In order to maintain the picking action of accommodating the solder body hB in the accommodating portion 115 and maintain the accommodating picking state, a suction pressure py is applied. When performing the release action of pushing the solder body hB out of the accommodating portion 115, the suction pressure py is removed or static pressure py' is applied as needed.

所述加壓部件120包括：加壓塊121，其佈置於外殼110的內部，且在靠近或遠離安裝板112容納部115的方向上進行往復移動；以及多個加壓銷122，其從加壓塊121向容納部115突出。加壓塊121基於受控制部160控制的加壓驅動部M進行直線往復運動，由此，從加壓塊121延伸的加壓銷122的末端可移入容納部115直至可插入的位置，同時在將焊料體hB從容納部115釋放時，能夠將容納部115中容納的焊料體hB機械地向容納部115的外部推出。The pressurizing component 120 includes: a pressurizing block 121, which is arranged inside the housing 110 and reciprocates in a direction close to or away from the receiving portion 115 of the mounting plate 112; and a plurality of pressurizing pins 122, which protrude from the pressurizing block 121 toward the receiving portion 115. The pressurizing block 121 performs a linear reciprocating motion based on a pressurizing driving portion 54 controlled by the control portion 160, whereby the distal end of the pressurizing pin 122 extending from the pressurizing block 121 can be moved into the receiving portion 115 until an insertable position, and at the same time, when the solder body hB is released from the receiving portion 115, the solder body hB contained in the receiving portion 115 can be mechanically pushed out of the receiving portion 115.

其中，加壓驅動部M包括驅動馬達，可作為各種驅動源，優選地，可進行驅動，以使加壓塊121基於空壓移向容納部115。由此，如圖12f所示，在基板S的預設位置上以預設大小的焊接力Fm施加第2容納部215中所容納的焊料體hB，從而可提高將焊料體hB以直立狀態附著於基板S的焊錫膏F上的準確性。即，不採用以加壓塊121的推出位移進行控制的方法，而是採用以加壓塊121的推力進行荷重控制的方法，從而不會引起因向微細尺寸的焊料體hB施加過度的作用力而帶來的變形等損傷，還可以在附著於基板的狀態下提高點電接觸的可靠性。The pressurizing driving part M includes a driving motor, which can be used as various driving sources. Preferably, the pressurizing block 121 can be driven to move toward the receiving part 115 based on air pressure. As a result, as shown in FIG. 12f, the solder body hB received in the second receiving part 215 is applied with a preset welding force Fm at a preset position of the substrate S, thereby improving the accuracy of attaching the solder body hB to the solder paste F on the substrate S in an upright state. That is, instead of adopting a method of controlling the push displacement of the pressure block 121, a method of controlling the load by the thrust of the pressure block 121 is adopted, thereby avoiding deformation and other damages caused by applying excessive force to the fine-sized solder body hB, and improving the reliability of point electrical contact when attached to the substrate.

此時，加壓部件120在焊料體hB與作為附著對象的基板S的沾有焊錫膏F的表面接觸的狀態下對焊料體hB進行加壓至少兩次，從而即使在施加一次焊接力時焊料體hB的一部分無法透過焊錫膏F的黏合力固定，也可以透過其後的焊接力使焊料體hB透過焊錫膏F的黏合力緊貼，從而可進一步提高以直立狀態進行附著的可靠性。At this time, the pressurizing component 120 pressurizes the solder body hB at least twice when the solder body hB is in contact with the surface of the substrate S to be attached and coated with the solder paste F. Therefore, even if a part of the solder body hB cannot be fixed by the adhesive force of the solder paste F when the soldering force is applied once, the solder body hB can be tightly adhered by the adhesive force of the solder paste F through the subsequent soldering force, thereby further improving the reliability of attachment in an upright state.

此時，加壓塊121還可以設置一個空壓缸作為加壓驅動部M，為了抑制加壓塊121產生傾斜位移，附圖中雖未圖示，還可以在加壓塊121的中心位置及在與中心位置對稱的多個位置上設置多個空壓缸作為加壓驅動部M。At this time, the pressurizing block 121 can also be provided with a pneumatic cylinder as a pressurizing drive part M. In order to suppress the tilting displacement of the pressurizing block 121, although not shown in the attached drawings, multiple pneumatic cylinders can be provided as the pressurizing drive part M at the center position of the pressurizing block 121 and at multiple positions symmetrical to the center position.

另外，加壓塊121還可以設定為基於空壓缸進行往復移動，還可以設定為在加壓塊121與安裝板112之間壓縮設定有多個彈簧（未圖示）並且加壓塊121相對於容納部115後退最大的位置上具有用於限制加壓塊121後退移動的限位器，從而只在加壓銷122推出焊料體hB時，基於由空壓缸構成的加壓驅動部M進行工作，而基於在空壓缸中降低空壓及基於彈簧的彈性復原力，使加壓塊121恢復到後退位置。In addition, the pressurizing block 121 can also be set to reciprocate based on the air cylinder, and can also be set to have multiple springs (not shown) compression-set between the pressurizing block 121 and the mounting plate 112 and have a limiter for limiting the backward movement of the pressurizing block 121 at the position where the pressurizing block 121 retreats the most relative to the accommodating portion 115, so that only when the pressurizing pin 122 pushes out the solder body hB, the pressurizing drive portion M formed by the air cylinder works, and based on the reduction of the air pressure in the air cylinder and the elastic restoring force of the spring, the pressurizing block 121 is restored to the retreated position.

另外，加壓部件120如圖3a所示可由一個加壓塊121形成，如圖3b所示可由多個分割的加壓塊121：121A、121B、121C及121D形成。此時，各個分割的加壓塊121A、121B、121C及121D在進行往復移動120d的期間，為了抑制發生傾斜的傾斜位移，備置有引導部118，其從外殼110的頂板朝向安裝板112並在各加壓塊121A、121B、121C及121D之間突出。例如，如圖5所示，橫穿各個分割的加壓塊121A、121B、121C及121D之間的引導部118中形成有朝往復移動方向凹陷的凹槽部118x，分割的加壓塊121A、121B、121C及121D的側面突出地形成有凸起120y，用於插入凹槽部118x，基於凹槽部118x和凸起120y可輔助分割的加壓塊121A、121B、121C及121D無傾斜地進行往復移動。此時，若加壓部件120由多個分割的加壓塊121A、121B、121C及121D形成，則加壓驅動部M可由多個空壓缸形成，並使各個分割的加壓塊121A、121B、121C及121D進行往復移動120d。In addition, the pressurizing member 120 may be formed of one pressurizing block 121 as shown in Fig. 3a, or may be formed of a plurality of divided pressurizing blocks 121: 121A, 121B, 121C, and 121D as shown in Fig. 3b. At this time, in order to suppress the tilting displacement of each divided pressurizing block 121A, 121B, 121C, and 121D during the reciprocating movement 120d, a guide portion 118 is provided, which protrudes from the top plate of the housing 110 toward the mounting plate 112 and between each pressurizing block 121A, 121B, 121C, and 121D. For example, as shown in FIG5 , a groove portion 118x recessed in the reciprocating direction is formed in the guide portion 118 that crosses each of the divided pressurizing blocks 121A, 121B, 121C, and 121D, and a protrusion 120y is protrudingly formed on the side surface of the divided pressurizing blocks 121A, 121B, 121C, and 121D for inserting into the groove portion 118x. Based on the groove portion 118x and the protrusion 120y, the divided pressurizing blocks 121A, 121B, 121C, and 121D can be assisted to reciprocate without tilting. At this time, if the pressurizing component 120 is formed by a plurality of divided pressurizing blocks 121A, 121B, 121C and 121D, the pressurizing driving part M can be formed by a plurality of pneumatic cylinders, and each of the divided pressurizing blocks 121A, 121B, 121C and 121D can be reciprocated 120d.

如上所構成的本發明的處理工具100如圖7至圖9e所示，還可用作將焊料體hB安裝於容納部115的把持處理工具101，如圖12a至圖12g所示，還可用作將焊料體hB以拾取的狀態釋放到附著物體並進行附著的附著處理工具201。即，透過將相同或類似結構的處理工具100分別用作把持處理工具101和附著處理工具201，從而能夠將需要進行超精密加工的處理工具100製作為單一體並用於實現各種動作。The processing tool 100 of the present invention constructed as above can also be used as a holding processing tool 101 for mounting the solder body hB in the receiving portion 115 as shown in FIGS. 7 to 9e, and can also be used as an attaching processing tool 201 for releasing the solder body hB in a picked-up state to an attached object and attaching it as shown in FIGS. 12a to 12g. That is, by using the processing tool 100 of the same or similar structure as the holding processing tool 101 and the attaching processing tool 201, the processing tool 100 that needs to be processed ultra-precision can be made into a single body and used to realize various actions.

下面，在說明前述的處理工具100分別用作把持處理工具101和附著處理工具201的結構的過程中，對於相同或者類似的對應結構採用類似的元件符號，附著處理工具201中的各名稱透過添加「第2~」進行說明。Next, in explaining the aforementioned processing tool 100 used as the structure of the holding processing tool 101 and the attachment processing tool 201, similar component symbols are used for the same or similar corresponding structures, and each name in the attachment processing tool 201 is explained by adding "2nd~".

依本發明一實施例的焊料體處理裝置1包括：把持處理工具101，其佈置為使安裝板112朝向上方（z軸方向）；擱置板199，其以與把持處理工具101的安裝板112的上面相同的高度以連續的形態較廣地佈置；保護牆198，其用於包圍擱置板199的周邊；焊料體供給裝置90，其可移動地設置，以向擱置板199的上面供給焊料體hB；第1激振器130，其設置於擱置板199的一側S1並對擱置板199進行振動，使供給的焊料體hB回彈的同時朝向另一側S2的方向X2移送；第2激振器140，其設置於擱置板199的另一側S2並對擱置板199進行振動，使供給的焊料體hB回彈的同時朝向一側S1的方向X1移送；附著處理工具201，其接收把持處理工具101的容納部115中安裝的焊料體hB，並轉移至附著對象即基板S的安裝部Cx；控制部160，其用於控制焊料體供給裝置90、把持處理工具101、激振器130、140、視覺170及附著處理工具201。According to an embodiment of the present invention, a solder body processing device 1 comprises: a holding processing tool 101, which is arranged so that the mounting plate 112 faces upward (z-axis direction); a placing plate 199, which is arranged in a continuous form and is widely arranged at the same height as the upper surface of the mounting plate 112 of the holding processing tool 101; a protective wall 198, which is used to surround the periphery of the placing plate 199; a solder body supply device 90, which is movably arranged to supply the solder body hB to the upper surface of the placing plate 199; a first exciter 130, which is arranged on one side S1 of the placing plate 199 and vibrates the placing plate 199 to make the supplied solder body hB while rebounding, it is transferred toward the direction X2 of the other side S2; the second vibrator 140, which is arranged on the other side S2 of the mounting plate 199 and vibrates the mounting plate 199, so that the supplied solder body hB rebounds and is transferred toward the direction X1 of the one side S1; the attachment processing tool 201, which receives the solder body hB installed in the storage part 115 of the holding processing tool 101, and transfers it to the mounting part Cx of the attachment object, that is, the substrate S; the control part 160, which is used to control the solder body supply device 90, the holding processing tool 101, the vibrators 130, 140, the vision 170 and the attachment processing tool 201.

其中，把持處理工具101的容納部115和附著處理工具201的第2容納部215皆以與最終附著的基板S的安裝部Cx相同的圖案進行分佈。The receiving portion 115 of the holding processing tool 101 and the second receiving portion 215 of the attaching processing tool 201 are arranged in the same pattern as the mounting portion Cx of the substrate S to be finally attached.

所述把持處理工具101以安裝板112朝上面的姿勢設置，安裝板112的周圍連續地佈置有擱置板199。附圖中未說明的符號Bx表示用於形成一個半導體封裝件的單位晶片U1所對應的區域，具有用於附著焊料體hB的多個安裝部Cx。The handling tool 101 is arranged with the mounting plate 112 facing upward, and the mounting plate 199 is continuously arranged around the mounting plate 112. The unexplained symbol Bx in the figure indicates an area corresponding to the unit chip U1 for forming a semiconductor package, and has a plurality of mounting parts Cx for attaching the solder body hB.

其中，安裝板112和擱置板199由相同的厚度和材料形成，設置為將基於激振器131、132、141及142中至少任意一個施加到擱置板199的振動同樣傳遞到安裝板112。優選地，安裝板112和擱置板199可由一個一體型板形成，這可透過將把持處理工具101的安裝板112製作成面積大於擱置板199所佔面積來實現。The mounting plate 112 and the support plate 199 are formed of the same thickness and material, and are configured to transmit the vibration applied to the support plate 199 by at least any one of the exciters 131, 132, 141, and 142 to the mounting plate 112. Preferably, the mounting plate 112 and the support plate 199 can be formed of a one-piece plate, which can be achieved by making the mounting plate 112 holding the processing tool 101 larger in area than the area occupied by the support plate 199.

另外，擱置板199的周圍佈置有保護牆198，所述保護牆198以充分的高度圍繞，用於防止焊料體hB脫離，為了使基於激振器131、132、141及142中任意一個的擱置板199的振動不受保護牆198的妨礙，擱置板199和保護牆198之間具有細微的縫隙並且相隔。其中，擱置板199與保護牆198的縫隙大小設定為能夠抑制焊料體hB從縫隙脫落的程度。In addition, a protective wall 198 is arranged around the mounting plate 199, and the protective wall 198 is surrounded with a sufficient height to prevent the solder body hB from falling off. In order to prevent the vibration of the mounting plate 199 based on any one of the exciters 131, 132, 141 and 142 from being hindered by the protective wall 198, the mounting plate 199 and the protective wall 198 are separated from each other with a fine gap. The size of the gap between the mounting plate 199 and the protective wall 198 is set to a degree that can suppress the solder body hB from falling off from the gap.

設置於擱置板199一側S1的第1激振器130可由在擱置板199的一側S1的兩頂角附近分別設置第1-1激振器131和第1-2激振器132來實現，設置於擱置板199另一側S2的第2激振器140可由在擱置板199另一側S2的兩頂角附近分別設置第2-1激振器141和第2-2激振器142來實現。其中，激振器131、132、141及142可作為給料機（feeder）中的激振器使用。The first vibrator 130 disposed on one side S1 of the shelf 199 can be realized by respectively disposing a 1-1 vibrator 131 and a 1-2 vibrator 132 near the two top corners of one side S1 of the shelf 199, and the second vibrator 140 disposed on the other side S2 of the shelf 199 can be realized by respectively disposing a 2-1 vibrator 141 and a 2-2 vibrator 142 near the two top corners of the other side S2 of the shelf 199. Among them, the vibrators 131, 132, 141 and 142 can be used as vibrators in a feeder.

由此，在擱置板199的一側上面供給焊料體hB的狀態下，如果基於第1-1激振器131和第1-2激振器132擱置板199的一側產生振動v1，則焊料體hB回彈的同時從擱置板199的一側S1向另一側S2的方向X2移送。相反地，在擱置板199的另一側上面有焊料體hB供給的狀態下，如果基於第2-1激振器141和第2-2激振器142擱置板199的另一側產生振動v2，則焊料體hB回彈的同時從擱置板199的另一側S2向一側S1的方向X1移送。Thus, when the solder body hB is supplied to one side of the shelf 199, if vibration v1 is generated on one side of the shelf 199 by the 1-1 exciter 131 and the 1-2 exciter 132, the solder body hB rebounds and is transferred in the direction X2 from the one side S1 to the other side S2 of the shelf 199. Conversely, when the solder body hB is supplied to the other side of the shelf 199, if vibration v2 is generated on the other side of the shelf 199 by the 2-1 exciter 141 and the 2-2 exciter 142, the solder body hB rebounds and is transferred in the direction X1 from the other side S2 to the one side S1 of the shelf 199.

類似地，如果基於第1-1激振器131和第2-1激振器141在擱置板199的側面一側Sa進行振動，則焊料體hB回彈的同時從擱置板199的側面一側Sa向側邊另一側Sb的方向Yb移送。相反地，如果基於第1-2激振器132和第2-2激振器142在擱置板199的側面另一側Sb產生振動，則焊料體hB回彈的同時從擱置板199的側面另一側Sb向側邊另一側Sa方向Ya移送。Similarly, if the 1-1st exciter 131 and the 2-1st exciter 141 vibrate at the side Sa of the mounting plate 199, the solder body hB rebounds and is transferred in the direction Yb from the side Sa of the mounting plate 199 to the other side Sb. On the contrary, if the 1-2nd exciter 132 and the 2-2nd exciter 142 vibrate at the other side Sb of the mounting plate 199, the solder body hB rebounds and is transferred in the direction Ya from the other side Sb of the mounting plate 199 to the other side Sa.

此時，如果基於第1-1激振器131和第1-2激振器132的振動強度大於第2-1激振器141和第2-2激振器142的振動強度，則焊料體hB只基於第1-1激振器131和第1-2激振器132向另一側的方向X2移送，同樣地，如果基於第2-1激振器141和第2-2激振器142的振動強度大於第1-1激振器131和第1-2激振器132的振動強度，則焊料體hB只基於第2-1激振器141和第2-2激振器142向一側的方向X1移送。另外，如果在指定的誤差範圍內，基於第1-1激振器131和第1-2激振器132的振動強度等於第2-1激振器141和第2-2激振器142的振動強度，則焊料體hB處於原地回彈且不進行移送的狀態。At this time, if the vibration intensity based on the 1-1 exciter 131 and the 1-2 exciter 132 is greater than the vibration intensity based on the 2-1 exciter 141 and the 2-2 exciter 142, the solder body hB is only transferred to the other side direction X2 based on the 1-1 exciter 131 and the 1-2 exciter 132. Similarly, if the vibration intensity based on the 2-1 exciter 141 and the 2-2 exciter 142 is greater than the vibration intensity based on the 1-1 exciter 131 and the 1-2 exciter 132, the solder body hB is only transferred to one side direction X1 based on the 2-1 exciter 141 and the 2-2 exciter 142. In addition, if the vibration intensity based on the 1-1st vibrator 131 and the 1-2nd vibrator 132 is equal to the vibration intensity based on the 2-1st vibrator 141 and the 2-2nd vibrator 142 within the specified error range, the solder body hB is in a state of rebounding on the spot and not being transferred.

附圖中所給出的實施例中，雖然示出了擱置板199的一側S1和另一側S2各自具有兩個激振器的結構，但是本發明不限於此，擱置板199的一側S1和另一側S2還可以各自具有一個激振器或三個激振器。In the embodiment shown in the accompanying drawings, although it is shown that one side S1 and the other side S2 of the mounting plate 199 each have a structure with two exciters, the present invention is not limited to this, and one side S1 and the other side S2 of the mounting plate 199 may each have one exciter or three exciters.

所述視覺170拍攝影像並檢查基於激振器130、140進行振動的同時焊料體hB是否正常地安裝於把持處理工具101的容納部115。The vision device 170 captures an image and checks whether the solder body hB is normally installed in the receiving portion 115 of the holding processing tool 101 while the vibrators 130 and 140 are vibrating.

如果所述附著處理工具201基於視覺170拍攝的影像感測到焊料體hB的正常安裝狀態，則接收把持處理工具101的容納部115中安裝的焊料體hB，將焊料體hB豎直直立於附著物件即基板S的預設安裝部Cx的狀態進行轉移。If the attachment processing tool 201 senses the normal installation state of the solder body hB based on the image taken by the vision 170, it receives the solder body hB installed in the storage part 115 of the holding processing tool 101 and transfers the state of the solder body hB standing upright on the preset installation part Cx of the attachment object, namely the substrate S.

下面，依序說明利用如上構成的處理裝置1，向把持處理工具101的容納部115供給焊料體hB的結構。Next, a structure for supplying the solder body hB to the housing portion 115 holding the processing tool 101 using the processing apparatus 1 configured as above will be described in order.

步驟1：首先，如圖9a所示，透過焊料體供給裝置90將考慮到貼裝到附著物件的元件K高度而選擇的焊料體hB供給71至焊料體處理裝置1的擱置板199。Step 1: First, as shown in FIG. 9a, a solder body hB selected in consideration of the height of a component K mounted on an attached object is supplied 71 to a placing plate 199 of a solder body processing device 1 through a solder body supply device 90.

步驟2：然後，如圖9b，佈置於擱置板199一側S1的第1-1激振器131和第1-2激振器132開始振動，使擱置於擱置板199一側上面的焊料體hB回彈的同時向擱置板199的另一側S2方向X2移送72。Step 2: Then, as shown in FIG. 9b, the 1-1 exciter 131 and the 1-2 exciter 132 arranged on one side S1 of the mounting plate 199 start to vibrate, causing the solder body hB placed on one side of the mounting plate 199 to rebound while being transferred 72 toward the other side S2 of the mounting plate 199 in the direction X2.

如果所供給的焊料體hB從安裝板112的容納部115的上側向擱置板199的另一側S2，焊料體hB發生部分堆疊，如圖9c所示，則驅動佈置於擱置板199另一側S2的第2-1激振器141和第2-2激振器142，使焊料體hB在擱置板199的上面回彈的同時向一側S1方向X1移送73。If the supplied solder body hB moves from the upper side of the accommodating portion 115 of the mounting plate 112 to the other side S2 of the holding plate 199, and the solder body hB is partially stacked, as shown in FIG9c, the 2-1 exciter 141 and the 2-2 exciter 142 arranged on the other side S2 of the holding plate 199 are driven to make the solder body hB rebound on the top of the holding plate 199 and move 73 to one side S1 in the direction X1.

根據需要，透過調節第1-1激振器131和第1-2激振器132與第2-1激振器141和第2-2激振器142的振動強度，來調節焊料體hB的移送速度，從而使焊料體最小限度地停留在擱置板199的一側和另一側上面。此外，根據需要，透過驅動第1-1激振器131和第2-1激振器141，或驅動第2-1激振器141和第2-2激振器142也可以向軸方向（±y軸方向）移送。由此，將大多數的焊料體hB置於安裝板112容納部115的上側。If necessary, the transfer speed of the solder body hB is adjusted by adjusting the vibration strength of the 1-1st exciter 131 and the 1-2nd exciter 132 and the 2-1st exciter 141 and the 2-2nd exciter 142, so that the solder body stays on one side and the other side of the placing plate 199 to the minimum. In addition, if necessary, the solder body hB can be transferred in the axial direction (±y axis direction) by driving the 1-1st exciter 131 and the 2-1st exciter 141 or the 2-1st exciter 141 and the 2-2nd exciter 142. As a result, most of the solder body hB is placed on the upper side of the storage portion 115 of the mounting plate 112.

步驟3：然後，如圖9d所示，透過將第1-1激振器131和第1-2激振器132及第2-1激振器141和第2-2激振器142的振動強度調整至相同或相近的大小以達到預設偏差以下，從而引導位於安裝板112上側的焊料體hB在原地進行回彈運動74。Step 3: Then, as shown in FIG. 9d, the vibration intensities of the 1-1st exciter 131 and the 1-2nd exciter 132 and the 2-1st exciter 141 and the 2-2nd exciter 142 are adjusted to the same or similar magnitudes so as to be below a preset deviation, thereby guiding the solder body hB located on the upper side of the mounting plate 112 to perform a rebound motion 74 in place.

同時，把持處理工具101的壓力調節部P1將外殼110的內部調至負壓狀態，誘使吸入壓py在各容納部115中發揮作用。特別如圖10所示，容納部115的開口形成有相對於容納部115的深度方向呈25度至35度的角度ang1傾斜的傾斜面1151，如果回彈的焊料體hB的末端一部分落入基於在傾斜面1151變寬的開口中，則焊料體hB以沿著傾斜面1151向元件符號99標出的方向旋轉的同時引導並插入容納部115的狀態安裝。此外，基於傾斜面1151變寬的開口，如元件符號98所示，有助於焊料體hB直接安裝於容納部115。安置在容納部115中的焊料體hB突出預定高度zp。At the same time, the pressure adjustment part P1 of the holding processing tool 101 adjusts the inside of the housing 110 to a negative pressure state, inducing the suction pressure py to act in each accommodating part 115. As shown in FIG. 10 in particular, the opening of the accommodating part 115 is formed with an inclined surface 1151 inclined at an angle ang1 of 25 to 35 degrees relative to the depth direction of the accommodating part 115. If a part of the end of the rebounded solder body hB falls into the opening based on the widening of the inclined surface 1151, the solder body hB is installed in a state of being guided and inserted into the accommodating part 115 while rotating along the inclined surface 1151 in the direction indicated by the component symbol 99. In addition, the opening widened by the inclined surface 1151, as shown by reference numeral 98, facilitates the solder body hB to be directly mounted on the receiving portion 115. The solder body hB placed in the receiving portion 115 protrudes by a predetermined height zp.

因此，焊料體hB一直維持容納於容納部115的狀態直至下端與加壓銷122的前端接觸為止，基於容納部115開口處形成的傾斜面1151，可大幅縮短將焊料體hB容納於把持處理工具101的容納部115所需的製程時間，具有有益效果。Therefore, the solder body hB remains contained in the receiving portion 115 until the lower end contacts the front end of the pressurizing pin 122. Based on the inclined surface 1151 formed at the opening of the receiving portion 115, the process time required to contain the solder body hB in the receiving portion 115 of the holding processing tool 101 can be greatly shortened, which has a beneficial effect.

如果將焊料體hB安裝於容納部115的製程充分進行，則在維持把持處理工具101的容納部115中施加吸入壓py的狀態的同時，將線性噴射空氣的鼓風機（未圖示）沿著擱置板199和安裝板112的上面進行吹掃，並將把持處理工具101的安裝板112上面殘留的焊料體移向擱置板199的一側或另一側。If the process of installing the solder body hB in the accommodating portion 115 is fully carried out, while maintaining the state of applying suction pressure py in the accommodating portion 115 of the holding processing tool 101, a linear jet air blower (not shown) is blown along the top of the holding plate 199 and the mounting plate 112, and the solder body remaining on the mounting plate 112 of the holding processing tool 101 is moved to one side or the other side of the holding plate 199.

步驟4：然後，如圖9e所示，利用視覺170拍攝把持處理工具101的容納部115中是否容納有焊料體hB，並將拍攝影像傳送給控制部160。Step 4: Then, as shown in FIG. 9 e , the vision device 170 is used to capture whether the receiving portion 115 of the handling tool 101 contains the solder body hB, and the captured image is transmitted to the control unit 160 .

控制部160接收來自視覺170的拍攝影像，並判斷焊料體hB在容納部115中的容納狀態是否屬於正常範疇。如果焊料體的容納狀態屬於正常範疇，則利用附著處理工具201進行轉移焊料體的製程，如果焊料體的容納狀態不屬於正常範疇，即把持處理工具101容納部115中的一部分中無焊料體容納等，則反覆進行步驟2和步驟3。The control unit 160 receives the captured image from the vision 170 and determines whether the storage state of the solder body hB in the storage unit 115 is within the normal range. If the storage state of the solder body is within the normal range, the process of transferring the solder body is performed using the attached processing tool 201. If the storage state of the solder body is not within the normal range, that is, there is no solder body in a part of the storage unit 115 of the holding processing tool 101, etc., then step 2 and step 3 are repeated.

步驟5：在步驟4中，如果把持處理工具101容納部115中焊料體的容納狀態認定為屬於正常範圍，即認定為將焊料體hB逐一容納於以預設圖案排列的容納部115的焊料體容納步驟已完成，如圖11a和圖11b所示，則基於移動驅動部MC使附著處理工具201移動201d1至與把持處理工具101對齊的位置。此時，可具有感測感測器，用於感測附著處理工具201的對齊位置。Step 5: In step 4, if the receiving state of the solder bodies in the receiving portion 115 of the holding processing tool 101 is determined to be within the normal range, that is, it is determined that the solder body receiving step of receiving the solder bodies hB one by one in the receiving portions 115 arranged in a preset pattern has been completed, as shown in Figures 11a and 11b, then based on the moving drive unit MC, the attachment processing tool 201 is moved 201d1 to a position aligned with the holding processing tool 101. At this time, a sensing sensor may be provided to sense the alignment position of the attachment processing tool 201.

附著處理工具201的第2容納部215與把持處理工具101的容納部115以相同的圖案形成，並且在附著處理工具201與把持處理工具101對齊的狀態下，附著處理工具201的第2容納部215與把持處理工具101的容納部115呈上下互相對視的狀態。The second receiving portion 215 of the attached processing tool 201 and the receiving portion 115 of the holding processing tool 101 are formed with the same pattern, and when the attached processing tool 201 and the holding processing tool 101 are aligned, the second receiving portion 215 of the attached processing tool 201 and the receiving portion 115 of the holding processing tool 101 are facing each other from top to bottom.

此時，在附著處理工具201的第2壓力調節部P2不工作的狀態下，容納部215維持大氣壓力，第2加壓驅動部M2向上側移動220d1加壓銷222，以維持第2容納部215能夠容納焊料體hB的狀態。此外，把持處理工具101的壓力調節部P1將外殼110的內部空間調至負壓狀態，而容納部115中維持吸入壓py產生作用的狀態，如120d1所示方向，加壓驅動部M1向下側移動加壓銷222，並維持各容納部115中容納有焊料體hB的狀態。At this time, when the second pressure adjusting part P2 of the attached processing tool 201 is not in operation, the accommodating part 215 maintains atmospheric pressure, and the second pressure driving part M2 moves the pressure pin 222 upward by 220d1 to maintain the state in which the second accommodating part 215 can accommodate the solder body hB. In addition, the pressure adjusting part P1 of the holding processing tool 101 adjusts the internal space of the housing 110 to a negative pressure state, and the accommodating part 115 maintains the state in which the suction pressure py is generated, as shown in the direction of 120d1, and the pressure driving part M1 moves the pressure pin 222 downward, and maintains the state in which each accommodating part 115 accommodates the solder body hB.

附著處理工具201與把持處理工具101之間的間距z1，設定為小於焊料體hB的高度hh減去把持處理工具101容納部115的傾斜面1151深度d1的取值（hh-d1）。更優選地，附著處理工具201與把持處理工具101之間的間距z1設定為小於焊料體hB的高度hh減去把持處理工具101容納部115的傾斜面1151深度d1與附著處理工具201第2容納部215的第2傾斜面2151深度dz總和後的取值（hh-d1-dz）。由此，如圖11b（其為圖11a中C部分的放大圖）所示，在從把持處理工具101的容納部115向附著處理工具201的第2容納部215供給焊料體hB的過程中，把持處理工具101的加壓銷122向上方舉起並推出焊料體hB時，如圖11b的放大圖中虛線的焊料體位置中所確認，焊料體hB的下部一部分位於把持處理工具101的容納部115的容納貫通部1153中，焊料體hB的上部一部分位於附著處理工具201的第2容納部215的第2容納貫通部2153中，從而可防止焊料體hB傾倒並脫落，具有有益效果。The distance z1 between the attachment processing tool 201 and the holding processing tool 101 is set to be smaller than the value obtained by subtracting the depth d1 of the inclined surface 1151 of the receiving portion 115 of the holding processing tool 101 from the height hh of the solder body hB (hh-d1). More preferably, the distance z1 between the attachment processing tool 201 and the holding processing tool 101 is set to be smaller than the value obtained by subtracting the sum of the depth d1 of the inclined surface 1151 of the receiving portion 115 of the holding processing tool 101 and the depth dz of the second inclined surface 2151 of the second receiving portion 215 of the attachment processing tool 201 (hh-d1-dz). Therefore, as shown in Figure 11b (which is an enlarged view of part C in Figure 11a), in the process of supplying the solder body hB from the accommodating portion 115 of the holding processing tool 101 to the second accommodating portion 215 of the attached processing tool 201, when the pressurizing pin 122 of the holding processing tool 101 lifts and pushes the solder body hB upward, as confirmed by the position of the solder body indicated by the dotted line in the enlarged view of Figure 11b, a lower portion of the solder body hB is located in the accommodating through-portion 1153 of the accommodating portion 115 of the holding processing tool 101, and an upper portion of the solder body hB is located in the second accommodating through-portion 2153 of the second accommodating portion 215 of the attached processing tool 201, thereby preventing the solder body hB from tipping over and falling off, which has a beneficial effect.

步驟6：然後，如圖11c（其為圖11a中C部分的放大圖）所示，把持處理工具101的壓力調節部P1去除吸入壓，加壓驅動部M1向上方（如120d2所示方向）推加壓銷122。此時，壓力調節部P1還可以在去除吸入壓的同時施加靜壓。Step 6: Then, as shown in FIG. 11c (which is an enlarged view of part C in FIG. 11a), the pressure regulating part P1 of the processing tool 101 is held to remove the suction pressure, and the pressure driving part M1 pushes the pressure pin 122 upward (in the direction shown by 120d2). At this time, the pressure regulating part P1 can also apply static pressure while removing the suction pressure.

此外，附著處理工具201的第2壓力調節部P2維持第2外殼210的內部為負壓狀態，以使吸入壓py作用於第2容納部215，第2加壓驅動部M2維持向上方拉第2加壓銷222的狀態，從而容納從把持處理工具101的容納部115向上方推上來的焊料體hB。In addition, the second pressure adjustment part P2 attached to the processing tool 201 maintains the interior of the second outer shell 210 in a negative pressure state so that the suction pressure py acts on the second accommodating part 215, and the second pressurizing drive part M2 maintains the state of pulling the second pressurizing pin 222 upward, thereby accommodating the solder body hB pushed upward from the accommodating part 115 of the holding processing tool 101.

如前所述，為了使焊料體hB保持下端部和上端部同時搭在把持處理工具101的容納貫通部1153和附著處理工具201的第2容納貫通部2153的狀態，設定附著處理工具201與把持處理工具101之間的間距z1，從而在從把持處理工具101向附著處理工具201移送焊料體hB的過程中可防止直立狀態的焊料體hB傾倒並脫離的問題發生。As mentioned above, in order to keep the lower end and upper end of the solder body hB in a state where they are simultaneously resting on the receiving through-portion 1153 of the holding processing tool 101 and the second receiving through-portion 2153 of the attachment processing tool 201, a distance z1 is set between the attachment processing tool 201 and the holding processing tool 101, thereby preventing the upright solder body hB from tipping over and falling off during the process of transferring the solder body hB from the holding processing tool 101 to the attachment processing tool 201.

進一步地，把持處理工具101的加壓銷122向上方推出焊料體hB，直至焊料體hB的上端處於與第2容納部215的第2加壓銷222的前端222e接觸的狀態為止，焊料體hB一直維持下方受到加壓銷122支撐的狀態，在焊料體hB的上端接觸第2加壓銷222的前端222e的狀態下基於吸入壓py的作用能夠將焊料體hB穩定無誤地拾取到第2容納部215中。Furthermore, the pressurizing pin 122 of the holding processing tool 101 is used to push the solder body hB upward until the upper end of the solder body hB is in contact with the front end 222e of the second pressurizing pin 222 of the second accommodating portion 215. The solder body hB is always supported by the pressurizing pin 122 from below. When the upper end of the solder body hB is in contact with the front end 222e of the second pressurizing pin 222, the solder body hB can be stably and accurately picked up into the second accommodating portion 215 based on the action of the suction pressure py.

步驟7：在步驟6中第2容納部215中施加吸入壓py並將焊料體hB逐一容納之後，如圖11d所示，附著處理工具201基於移動驅動部MC以與把持處理工具101相隔的狀態，如圖12a所示，向附著物件即基板S的上側移動201d2。Step 7: After applying suction pressure py in the second receiving portion 215 in step 6 and receiving the solder bodies hB one by one, as shown in FIG. 11d, the attachment processing tool 201 moves 201d2 toward the upper side of the attachment object, i.e., the substrate S, based on the moving drive portion MC in a state separated from the holding processing tool 101 as shown in FIG. 12a.

另外，在進行步驟8之前，基板S的安裝部Cx中預先塗佈適當量的焊錫膏F。基板S上塗佈焊錫膏F是基於印刷方式或者點描（dotting）方式、或者利用掩模的塗佈方式在基板S的安裝部Cx以預定的量進行塗抹。焊錫膏F可選用焊劑或焊接膏。In addition, before performing step 8, an appropriate amount of solder paste F is pre-applied to the mounting portion Cx of the substrate S. The solder paste F is applied to the substrate S by printing or dotting, or by applying with a mask to the mounting portion Cx of the substrate S in a predetermined amount. The solder paste F can be selected from flux or solder paste.

步驟8：第2容納部215的佈置圖案與附著物件即基板S的安裝部Cx的圖案相同，如圖12b的「D」部分的放大圖即圖12c所示，將附著處理工具201的第2容納部215與基板S的安裝部Cx對齊，且將附著處理工具201放置201d3於與基板S相隔預設間距z2的位置上。Step 8: The layout pattern of the second accommodating portion 215 is the same as the pattern of the mounting portion Cx of the attached object, i.e., the substrate S. As shown in the enlarged view of the "D" portion of Figure 12b, i.e., Figure 12c, the second accommodating portion 215 of the attached processing tool 201 is aligned with the mounting portion Cx of the substrate S, and the attached processing tool 201 is placed 201d3 at a position separated from the substrate S by a preset distance z2.

此時，附著處理工具201的第2壓力調節部P2處於向第2容納部215施加吸入壓py的狀態，此時焊料體hB維持被拾取到第2容納部215且被把持的狀態且上端與加壓銷222接觸。At this time, the second pressure adjustment portion P2 of the attachment processing tool 201 is in a state of applying a suction pressure py to the second accommodating portion 215. At this time, the solder body hB maintains a state of being picked up and held in the second accommodating portion 215 and the upper end is in contact with the pressurizing pin 222.

步驟9：然後，如圖12d和圖12f所示，第2加壓驅動部M2向下方移動220d2加壓塊221，基於第2加壓銷222將各第2容納部215中容納的焊料體hB向外推出。同時，第2壓力調節部P2去除第2容納部215所施加的吸入壓py。Step 9: Then, as shown in FIG. 12d and FIG. 12f, the second pressure driving part M2 moves the pressure block 221 downward 220d2, and pushes out the solder body hB contained in each second receiving part 215 based on the second pressure pin 222. At the same time, the second pressure adjusting part P2 removes the suction pressure py applied by the second receiving part 215.

步驟8中，附著處理工具201與基板S之間的間距z2設定為小於焊料體hB的高度hh減去第2容納部215的傾斜面2151深度dz後取值。即，為了使焊料體hB容納在第2容納部215的第2容納貫通部2153中且以一部分長度zz搭靠，同時為了保持與基板S的表面形成的焊錫膏F接觸的狀態，第2安裝板212的位置和高度相對於基板S而設定。In step 8, the distance z2 between the attachment processing tool 201 and the substrate S is set to be smaller than the height hh of the solder body hB minus the depth dz of the inclined surface 2151 of the second receiving portion 215. That is, in order to allow the solder body hB to be received in the second receiving through-portion 2153 of the second receiving portion 215 and overlap with a portion of the length zz, and at the same time to maintain the state of contact with the solder paste F formed on the surface of the substrate S, the position and height of the second mounting plate 212 are set relative to the substrate S.

由此，步驟9中，如果附著處理工具201的第2容納部215釋放焊料體hB，則即使焊料體hB的下端處於完全貫通焊錫膏F並與基板S的表面接觸的狀態，焊料體hB的上端部在附著處理工具201的第2容納部215的容納貫通部2153中以預設的長度zz呈干涉狀態保留，焊料體hB可維持上端干涉地豎直直立於容納貫通部2153中的狀態。Therefore, in step 9, if the second receiving portion 215 of the attached processing tool 201 releases the solder body hB, even if the lower end of the solder body hB is in a state of completely penetrating the solder paste F and contacting the surface of the substrate S, the upper end of the solder body hB is retained in an interference state with a preset length zz in the receiving through-portion 2153 of the second receiving portion 215 of the attached processing tool 201, and the solder body hB can maintain the state of the upper end interferingly standing upright in the receiving through-portion 2153.

更重要的是，如圖12d所示，對於第2加壓銷222，焊料體hB的另一端以預設長度zz干涉地容納於第2容納部215的第2容納貫通部2153中，並且在焊料體hB的一端與焊錫膏F接觸的狀態下，基於第2加壓銷222對焊料體hB施加朝向焊錫膏F的焊接力Fm。More importantly, as shown in Figure 12d, for the second pressure pin 222, the other end of the solder body hB is accommodated in the second accommodating through-portion 2153 of the second accommodating portion 215 with a preset length zz with interference, and when one end of the solder body hB is in contact with the solder paste F, the second pressure pin 222 applies a welding force Fm toward the solder paste F to the solder body hB.

如前所述，用於驅動第2加壓部件220移動的第2加壓驅動部M2可由空壓缸形成，基於空壓缸可準確地施加預設大小的力。因此，透過第2加壓銷222，向焊料體hB施加朝向焊錫膏F方向的一定大小的焊接力Fm，焊料體hB不發生彎曲變形的同時，能夠使焊料體hB的下端部基於焊錫膏F的黏結力附接並以直立狀態固定。As described above, the second pressurizing drive part M2 for driving the second pressurizing member 220 to move can be formed by an air pressure cylinder, and the air pressure cylinder can accurately apply a preset force. Therefore, through the second pressurizing pin 222, a certain welding force Fm in the direction of the solder paste F is applied to the solder body hB, and the solder body hB does not bend or deform, and the lower end of the solder body hB can be attached and fixed in an upright state based on the adhesive force of the solder paste F.

為此，基於空壓缸以第2加壓銷222為媒介施加至焊料體hB的焊接力Fm可以設定為在焊料體hB的一端接觸到焊錫膏F的狀態下，利用第2加壓銷222在預設時間內對焊料體hB施加焊接力。如上所述，將施加至焊料體hB的焊接力Fm的時間（例如，0.5秒至2秒左右）設定為充分的時長，使焊料體hB的下端部基於焊錫膏F的黏結力以直立姿勢牢固地固定。For this purpose, the welding force Fm applied to the solder body hB by the air pressure cylinder through the second pressure pin 222 can be set to apply the welding force to the solder body hB for a preset time by the second pressure pin 222 when one end of the solder body hB contacts the solder paste F. As described above, the time (for example, about 0.5 seconds to 2 seconds) for applying the welding force Fm to the solder body hB is set to a sufficient time so that the lower end of the solder body hB is firmly fixed in an upright position based on the adhesive force of the solder paste F.

另外，基於空壓缸以第2加壓銷222為媒介向焊料體hB施加的焊接力Fm可以設定為在焊料體hB的一端與焊錫膏F接觸的狀態下，利用第2加壓銷222向焊料體hB施加焊接力至少兩次。如上所述，向焊料體hB施加焊接力Fm的次數設定為至少兩次，如圖12e所示，對於利用一次焊接力無法固定於焊錫膏F的焊料體ehB，如圖12f所示，利用第2加壓銷222將焊接力Fm重複施加於焊料體hB，使焊料體hB的下端部基於焊錫膏F的黏結力以直立姿勢牢固地固定。In addition, the welding force Fm applied to the solder body hB by the air pressure cylinder using the second pressure pin 222 as a medium can be set to apply the welding force to the solder body hB at least twice using the second pressure pin 222 when one end of the solder body hB is in contact with the solder paste F. As described above, the number of times the welding force Fm is applied to the solder body hB is set to at least twice, as shown in FIG12e, and for the solder body ehB that cannot be fixed to the solder paste F using a single welding force, the welding force Fm is repeatedly applied to the solder body hB using the second pressure pin 222 as shown in FIG12f, so that the lower end of the solder body hB is firmly fixed in an upright position based on the adhesive force of the solder paste F.

另外，根據需要，第2壓力調節部P2還可以採用靜壓作為從第2容納部215推出的力並施加。這是由於焊料體hB的上端以直立姿勢干涉地維持在附著處理工具201的第2容納部215中，因此即使基於第2壓力調節部P2存在從第2容納部215向外部的空氣流動，也不會發生焊料體hB的姿勢扭曲或傾倒的問題。此外，透過基於第2壓力調節部P2調節的空氣流動，能夠克服可能產生於第2加壓銷222的下端222e與焊料體hB之間的靜電力，因此，在基於第2加壓銷222向焊料體hB施加焊接力Fm之後，第2加壓銷222在後退的同時進行遠離焊料體hB的上端的移動220d1時，即使與焊料體hB間存在靜電力，透過強制空氣流動使第2加壓銷222與焊料體hB強行分離，從而在焊料體附著過程中，附著處理工具201的眾多第2容納部215中的焊料體hB全部轉移到基板S的安裝部Cx無一殘留，具有有益效果。In addition, if necessary, the second pressure adjusting portion P2 can also apply static pressure as the force to push out from the second housing portion 215. This is because the upper end of the solder body hB is maintained in an upright position in the second housing portion 215 of the attached processing tool 201, so even if there is air flow from the second housing portion 215 to the outside due to the second pressure adjusting portion P2, the posture of the solder body hB will not be distorted or tilted. In addition, the air flow regulated by the second pressure adjusting portion P2 can overcome the electrostatic force that may be generated between the lower end 222e of the second pressure pin 222 and the solder body hB. Therefore, after the second pressure pin 222 applies the welding force Fm to the solder body hB, when the second pressure pin 222 moves 220d1 away from the upper end of the solder body hB while retreating, even if there is electrostatic force between the second pressure pin 222 and the solder body hB, the second pressure pin 222 is forcibly separated from the solder body hB by forced air flow, so that during the solder body attachment process, all the solder bodies hB in the numerous second receiving portions 215 of the attachment processing tool 201 are transferred to the mounting portion Cx of the substrate S without any residue, which has a beneficial effect.

步驟10：在基於步驟9將焊料體hB以直立的姿勢附著到基板S的安裝部Cx之後，如圖12g所示，附著處理工具201移動201d4並遠離基板S。然後，再參考圖11a，附著處理工具201靠近把持處理工具101轉移焊料體hB並附著到新的基板S上。Step 10: After the solder body hB is attached to the mounting portion Cx of the substrate S in an upright position based on step 9, as shown in FIG. 12g, the attaching processing tool 201 moves 201d4 away from the substrate S. Then, referring to FIG. 11a again, the attaching processing tool 201 approaches the holding processing tool 101 to transfer the solder body hB and attach it to a new substrate S.

另外，在基板S的預設的圖案位置上以豎立狀態附著有焊料體hB，該基板將移送至進行回流等的後續製程。In addition, a solder body hB is attached in a vertical state at a preset pattern position of the substrate S, and the substrate is transferred to a subsequent process such as reflow.

儘管上面已經描述了本發明的一些優選實施方式，但本發明並不限於這些實施方式。應瞭解，在不脫離申請專利範圍中限定的本發明的範圍的情況下可以進行各種改變和修改。Although some preferred embodiments of the present invention have been described above, the present invention is not limited to these embodiments. It should be understood that various changes and modifications can be made without departing from the scope of the present invention defined in the scope of the patent application.

1:處理裝置 71:供給 74:回彈運動 90:焊料體供給裝置 98:開口 101:把持處理工具 160:控制部 170:視覺 198:保護牆 199:擱置板 201:附著處理工具 1154:內側貫通部 110、210:外殼 112、212:安裝板 113、118:引導部 1151、1152、2151:傾斜面 1153、2153:容納貫通部 118x:凹槽部 120、220:加壓部件 120d:直線往復運動/往復移動 120d1、120d2: 方向 120y:凸起 121、221、121A、121B、121C、121D:加壓塊 122、222:加壓銷 122e:前端 130、131、132、140、141、142:激振器 20、100、100':處理工具 201d1、201d2、201d4、220d1、220d2:移動 201d3:放置 22、115、215:容納部 222e:前端/下端 72、73:移送 99、x、X1、X2、y、Ya、Yb、z:方向 A、B、C、D:部分 ang1:傾斜角/角度 ang2:傾斜角 Bx:區域 Cx:安裝部 d1、dz:深度 dd:長邊/直徑 dx:直徑 ehB、hB:焊料體 F:焊錫膏 Fm:焊接力 h2、z1、z2:間距 hh、hk:高度 K:元件 M、M1、M2、Ma、Mb、Mc、Md:加壓驅動部 mB:焊料球 MC:移動驅動部 P、P1、P2:壓力調節部 py:吸入壓 py':靜壓 S:基板 S1、S2、Sa、Sb:側 U1:單位晶片 v1、v2:振動 Xa-Xa、Xb-Xb:切線 zp: 高度 zz:部分/長度 1: Processing device 71: Supply 74: Rebound motion 90: Solder body supply device 98: Opening 101: Holding processing tool 160: Control unit 170: Vision 198: Protective wall 199: Shelf plate 201: Attaching processing tool 1154: Inner through-hole 110, 210: Outer shell 112, 212: Mounting plate 113, 118: Guide 1151, 1152, 2151: Inclined surface 1153, 2153: Accommodating through-hole 118x: Groove unit 120, 220: Pressurizing component 120d: Linear reciprocating motion/reciprocating movement 120d1, 120d2: Direction 120y: Protrusion 121, 221, 121A, 121B, 121C, 121D: Pressure block 122, 222: Pressure pin 122e: Front end 130, 131, 132, 140, 141, 142: Vibrator 20, 100, 100': Processing tool 201d1, 201d2, 201d4, 220d1, 220d2: Move 201d3: Place 22, 115, 215: Accommodation 222e: Front end/lower end 72, 73: Transfer 99, x, X1, X2, y, Ya, Yb, z: Direction A, B, C, D: Part ang1: tilt angle/angle ang2: tilt angle Bx: area Cx: mounting part d1, dz: depth dd: long side/diameter dx: diameter ehB, hB: solder body F: solder paste Fm: soldering force h2, z1, z2: spacing hh, hk: height K: component M, M1, M2, Ma, Mb, Mc, Md: pressure drive part mB: solder ball MC: moving drive part P, P1, P2: pressure adjustment part py: suction pressure py': static pressure S: substrate S1, S2, Sa, Sb: side U1: unit chip v1, v2: vibration Xa-Xa, Xb-Xb: tangent zp: height zz: section/length

圖1a是用於附著焊料體的安裝部所具有的單位晶片的結構立體圖。 圖1b是用於製造多個單位晶片的附著焊料球的結構示意圖。 圖2是圖1的單位晶片縱橫排列的基板的結構示意圖。 圖3a是根據本發明一實施例的焊料體處理工具的結構示意圖。 圖3b是根據本發明另一實施例的焊料體處理工具的結構示意圖。 圖4是圖3a的「A」部分的放大圖。 圖5是基於圖3b的切線Xa-Xa的橫斷面圖。 圖6是基於圖3a和圖3b的焊料體處理工具處理的焊料體的範例圖。 圖7是將圖3a的焊料體處理工具作為把持處理工具的處理裝置的立體圖。 圖8是圖7的處理裝置的結構示意圖。 圖9a至圖9e是依序圖示將焊料體安置於圖7的處理裝置的把持處理工具的容納部的結構圖示。 圖10是圖9d的「B」部分的放大圖，是用來說明將焊料體安置於容納部的工作原理的圖示。 圖11a至圖11d是依序圖示將把持處理工具的容納部中安置的焊料體轉移至附著處理工具的第2容納部的結構示意圖。 圖12a至圖12g是依序圖示將附著處理工具中容納的焊料體轉移至基板的結構示意圖。 FIG. 1a is a structural three-dimensional diagram of a unit chip having a mounting portion for attaching a solder body. FIG. 1b is a structural schematic diagram of an attached solder ball for manufacturing a plurality of unit chips. FIG. 2 is a structural schematic diagram of a substrate in which the unit chips of FIG. 1 are arranged vertically and horizontally. FIG. 3a is a structural schematic diagram of a solder body processing tool according to an embodiment of the present invention. FIG. 3b is a structural schematic diagram of a solder body processing tool according to another embodiment of the present invention. FIG. 4 is an enlarged view of the "A" portion of FIG. 3a. FIG. 5 is a cross-sectional view based on the tangent line Xa-Xa of FIG. 3b. FIG. 6 is an example diagram of a solder body processed by the solder body processing tool based on FIG. 3a and FIG. 3b. FIG7 is a perspective view of a processing device using the solder body processing tool of FIG3a as a holding processing tool. FIG8 is a schematic diagram of the structure of the processing device of FIG7. FIG9a to FIG9e are sequentially illustrated structural diagrams of placing the solder body in the storage portion of the holding processing tool of the processing device of FIG7. FIG10 is an enlarged view of the "B" portion of FIG9d, which is used to illustrate the working principle of placing the solder body in the storage portion. FIG11a to FIG11d are sequentially illustrated structural diagrams of transferring the solder body placed in the storage portion of the holding processing tool to the second storage portion of the attached processing tool. FIG12a to FIG12g are sequentially illustrated structural diagrams of transferring the solder body contained in the attached processing tool to the substrate.

212:安裝板 212: Mounting plate

215:容納部 215: Accommodation Department

222:加壓銷 222:Pressure pin

220d1:移動 220d1:Move

220d2:移動 220d2:Move

F:焊錫膏 F:Solder paste

Fm:焊接力 Fm: welding force

hB:焊料體 hB: Solder body

S:基板 S: Substrate

zz:部分/長度 zz: part/length

Claims (31)

一種焊料體處理工具，用於處理高度大於橫斷面的長邊的焊料體，包括： 安裝板，其以預設的圖案排列有容納部，所述容納部逐一容納所述焊料體； 壓力調節部，其用於向所述容納部施加吸入壓； 加壓部件，其具有相對於所述容納部可移動的加壓塊及從所述加壓塊延伸且至少一部分插入所述容納部的多個加壓銷，利用所述加壓銷向所述容納部外部推出所述焊料體。 A solder body processing tool, used for processing a solder body having a height greater than the long side of a cross section, comprising: a mounting plate, which has receiving parts arranged in a preset pattern, and the receiving parts receive the solder bodies one by one; a pressure regulating part, which is used to apply suction pressure to the receiving parts; a pressurizing component, which has a pressurizing block movable relative to the receiving parts and a plurality of pressurizing pins extending from the pressurizing block and at least partially inserted into the receiving parts, and the pressurizing pins are used to push the solder body to the outside of the receiving parts. 如請求項1所述的焊料體處理工具，其特徵在於： 所述壓力調節部將所述焊料體容納在所述容納部並進行拾取時施加吸入壓，從所述容納部推出所述焊料體並進行釋放時去除吸入壓。 The solder body processing tool as described in claim 1 is characterized in that: The pressure regulating part applies suction pressure when the solder body is accommodated in the accommodating part and picked up, and removes the suction pressure when the solder body is pushed out of the accommodating part and released. 如請求項2所述的焊料體處理工具，其特徵在於： 在從所述容納部釋放所述焊料體時，所述加壓部件機械地將所述焊料體推出至所述容納部外部。 The solder body processing tool as described in claim 2 is characterized in that: When the solder body is released from the receiving portion, the pressurizing component mechanically pushes the solder body out of the receiving portion. 如請求項3所述的焊料體處理工具，其特徵在於： 所述加壓銷的前端形成有支撐面，用於將所述焊料體容納到所述容納部。 The solder body processing tool as described in claim 3 is characterized in that: The front end of the pressurizing pin is formed with a supporting surface for accommodating the solder body in the accommodating portion. 如請求項3所述的焊料體處理工具，其特徵在於： 在所述焊料體的一部分容納於所述容納部的狀態下，所述加壓部件在維持所述焊料體一端與附著對象的表面接觸的狀態的同時對焊料體進行施壓。 The solder body processing tool as described in claim 3 is characterized in that: When a part of the solder body is accommodated in the accommodation portion, the pressurizing component applies pressure to the solder body while maintaining a state in which one end of the solder body is in contact with the surface of the attachment object. 如請求項5所述的焊料體處理工具，其特徵在於： 所述加壓銷基於空壓對所述焊料體進行加壓。 The solder body processing tool as described in claim 5 is characterized in that: The pressurizing pin pressurizes the solder body based on air pressure. 如請求項6所述的焊料體處理工具，其特徵在於： 所述加壓銷利用預設的焊接力加壓所述焊料體來進行荷載控制。 The solder body processing tool as described in claim 6 is characterized in that: The pressurizing pin uses a preset welding force to pressurize the solder body to perform load control. 如請求項6所述的焊料體處理工具，其特徵在於： 所述安裝板與所述加壓塊之間施加有使所述加壓塊遠離所述容納部後退的彈簧的彈性復原力，所述空壓只在所述加壓銷向所述容納部外部推出所述焊料體時施加。 The solder body processing tool as described in claim 6 is characterized in that: An elastic restoring force of a spring is applied between the mounting plate and the pressurizing block to cause the pressurizing block to retreat away from the accommodating portion, and the air pressure is applied only when the pressurizing pin pushes the solder body out of the accommodating portion. 如請求項6所述的焊料體處理工具，其特徵在於： 所述加壓部件在所述焊料體與所述附著對象的所述表面接觸的狀態下，加壓至少兩次。 The solder body processing tool as described in claim 6 is characterized in that: The pressurizing component applies pressure at least twice when the solder body is in contact with the surface of the attachment object. 如請求項1所述的焊料體處理工具，其特徵在於： 所述容納部形成有朝向開口且開口斷面呈逐漸擴張形態的傾斜面，所述傾斜面從所述開口以預設的深度，相對於所述容納部的深度方向以25度至35度的角度傾斜。 The solder body processing tool as described in claim 1 is characterized in that: The receiving portion is formed with an inclined surface facing the opening and the opening cross section is gradually expanding, and the inclined surface is inclined at an angle of 25 to 35 degrees relative to the depth direction of the receiving portion from the opening at a preset depth. 如請求項10所述的焊料體處理工具，其特徵在於： 所述傾斜面以相當於所述焊料體高度的1/3倍至2/3倍的深度形成。 The solder body processing tool as described in claim 10 is characterized in that: The inclined surface is formed with a depth equivalent to 1/3 to 2/3 times the height of the solder body. 如請求項1所述的焊料體處理工具，其特徵在於： 所述焊料體的主材料為銅材料。 The solder body processing tool as described in claim 1 is characterized in that: The main material of the solder body is copper material. 如請求項1所述的焊料體處理工具，其特徵在於： 所述處理工具用於將所述焊料體附著在塗有焊錫膏的基板表面上。 The solder body processing tool as described in claim 1 is characterized in that: The processing tool is used to attach the solder body to the surface of the substrate coated with solder paste. 如請求項1所述的焊料體處理工具，其特徵在於： 所述安裝板佈置於擱置板的開口處，以使所述容納部的開口朝向上方； 如果從焊料體供給部向所述擱置板的表面供給焊料體，則佈置於所述擱置板一邊的第1激振器和佈置於所述擱置板另一邊的第2激振器開始振動，並使所述擱置板產生振動，使所述焊料體回彈，從而使焊料體安置到施加有吸入壓的所述容納部中。 The solder body processing tool as described in claim 1 is characterized in that: The mounting plate is arranged at the opening of the placement plate so that the opening of the storage portion faces upward; If the solder body is supplied from the solder body supply portion to the surface of the placement plate, the first exciter arranged on one side of the placement plate and the second exciter arranged on the other side of the placement plate start to vibrate, and the placement plate vibrates, causing the solder body to rebound, thereby placing the solder body in the storage portion to which the suction pressure is applied. 如請求項1所述的焊料體處理工具，其特徵在於： 所述加壓部件由多個加壓塊構成。 The solder body processing tool as described in claim 1 is characterized in that: The pressurizing component is composed of multiple pressurizing blocks. 一種焊料體處理方法，所述焊料體的高度大於橫斷面的長邊，包括： 焊料體容納步驟，向具有安裝板的附著處理工具的容納部施加吸入壓，並將所述焊料體逐一容納至所述容納部，所述安裝板上形成有以預設的圖案排列的所述容納部； 處理工具放置步驟，將所述處理工具放置於相當於與附著物件相隔預設間距的高度； 焊料體加壓步驟，利用每個所述容納部中佈置的加壓銷向所述容納部的外部推出所述焊料體。 A method for processing a solder body, wherein the height of the solder body is greater than the long side of the cross section, comprises: A solder body accommodating step, applying suction pressure to a accommodating portion of a processing tool attached to a mounting plate, and accommodating the solder bodies one by one into the accommodating portion, wherein the accommodating portions arranged in a preset pattern are formed on the mounting plate; A processing tool placing step, placing the processing tool at a height equivalent to a preset spacing from an attached object; A solder body pressurizing step, using a pressurizing pin arranged in each of the accommodating portions to push the solder body out of the accommodating portion. 如請求項16所述的焊料體處理方法，其特徵在於，進一步包括： 在所述焊料體加壓步驟之前或在所述焊料體加壓步驟進行期間，去除所述容納部中施加的吸入壓的吸入壓去除步驟。 The solder body processing method as described in claim 16 is characterized in that it further includes: Before the solder body pressurizing step or during the solder body pressurizing step, a suction pressure removal step of removing the suction pressure applied in the accommodating portion. 如請求項17所述的焊料體處理方法，其特徵在於，進一步包括： 在進行所述吸入壓去除步驟之後，向所述容納部施加靜壓的步驟。 The solder body processing method as described in claim 17 is characterized in that it further includes: After performing the suction pressure removal step, a step of applying static pressure to the accommodating portion. 如請求項16所述的焊料體處理方法，其特徵在於，在所述焊料體加壓步驟之前，進一步包括： 在所述附著物件的表面且用於附著所述焊料體的位置上形成焊錫膏的焊錫膏形成步驟。 The solder body processing method as described in claim 16 is characterized in that, before the solder body pressurization step, it further includes: A solder paste forming step of forming solder paste on the surface of the attachment object and at the position for attaching the solder body. 如請求項16所述的焊料體處理方法，其特徵在於： 所述附著處理工具放置步驟中，為了使所述焊料體部分容納於所述容納部的同時保持與形成於所述附著物件的表面的焊錫膏接觸的狀態，所述安裝板的位置和高度相對於所述附著物件進行設定。 The solder body processing method as described in claim 16 is characterized in that: In the step of placing the attachment processing tool, in order to allow the solder body to be partially accommodated in the accommodation portion while maintaining a state of contact with the solder paste formed on the surface of the attachment object, the position and height of the mounting plate are set relative to the attachment object. 如請求項20所述的焊料體處理方法，其特徵在於： 所述焊料體加壓步驟中，在所述焊料體的另一端容納於所述容納部，且所述焊料體的一端與所述焊錫膏接觸的狀態下，基於所述加壓銷對所述焊料體施加朝向所述焊錫膏的焊接力。 The solder body processing method as described in claim 20 is characterized in that: In the solder body pressurizing step, when the other end of the solder body is accommodated in the accommodating portion and one end of the solder body is in contact with the solder paste, a soldering force toward the solder paste is applied to the solder body based on the pressurizing pin. 如請求項21所述的焊料體處理方法，其特徵在於： 所述焊料體加壓步驟中，在所述焊料體的一端與所述焊錫膏接觸的狀態下，利用所述加壓銷在預設的時間內向所述焊料體施加焊接力。 The solder body processing method as described in claim 21 is characterized in that: In the solder body pressurizing step, when one end of the solder body is in contact with the solder paste, the pressurizing pin is used to apply a soldering force to the solder body within a preset time. 如請求項21所述的焊料體處理方法，其特徵在於： 所述焊料體加壓步驟中，基於空壓利用所述加壓銷向所述焊料體施加焊接力。 The solder body processing method as described in claim 21 is characterized in that: In the solder body pressurizing step, the pressurizing pin is used to apply a soldering force to the solder body based on air pressure. 如請求項21所述的焊料體處理方法，其特徵在於： 所述焊料體加壓步驟中，在所述焊料體的一端與所述焊錫膏接觸的狀態下，利用所述加壓銷向所述焊料體施加焊接力至少兩次。 The solder body processing method as described in claim 21 is characterized in that: In the solder body pressurizing step, the soldering force is applied to the solder body at least twice using the pressurizing pin while one end of the solder body is in contact with the solder paste. 如請求項16所述的焊料體處理方法，其特徵在於： 所述容納部形成有朝向開口且開口斷面呈逐漸擴張形態的傾斜面，所述傾斜面以相對於所述容納部的深度方向呈25度至35度的角度傾斜地形成。 The solder body processing method as described in claim 16 is characterized in that: The receiving portion is formed with an inclined surface facing the opening and the opening cross section is gradually expanding, and the inclined surface is formed at an angle of 25 degrees to 35 degrees relative to the depth direction of the receiving portion. 一種焊料體處理方法，所述焊料體供給至以擱置板的預設圖案分佈的第1容納部，其特徵在於，包括： 焊料體供給步驟，向焊料體處理裝置的一側供給高度大於橫斷面的長邊的焊料體，所述焊料體處理裝置包括把持處理工具和與第1安裝板以相同的高度連續設置的擱置板，所述把持處理工具中形成於所述第1安裝板且具有一定圖案的第1容納部的開口朝向上方設置，多個第1加壓銷從所述第1容納部的下部向上部可移動地設置，而且形成為吸入壓可施加至所述第1容納部； 焊料體移動步驟，驅動佈置於所述擱置板一邊的第1激振器及佈置於所述擱置板另一邊的第2激振器，基於所述擱置板的振動，使所述焊料體回彈的同時移動通過所述第1容納部的上側； 焊料體容納步驟，所述焊料體位於所述第1容納部上側的狀態下，同時驅動所述第1激振器和所述第2激振器，誘使所述焊料體在原位置上回彈並容納至所述第1容納部。 A method for processing a solder body, wherein the solder body is supplied to a first receiving portion arranged in a preset pattern of a shelf plate, and is characterized in that it comprises: A solder body supplying step, supplying a solder body having a height greater than the long side of the cross-section to one side of a solder body processing device, wherein the solder body processing device comprises a holding processing tool and a shelf plate continuously arranged at the same height as a first mounting plate, wherein the opening of the first receiving portion formed on the first mounting plate in the holding processing tool and having a certain pattern is arranged upward, and a plurality of first pressure pins are movably arranged from the lower part of the first receiving portion to the upper part, and are formed so that suction pressure can be applied to the first receiving portion; The solder body moving step is to drive the first exciter arranged on one side of the placement plate and the second exciter arranged on the other side of the placement plate, so that the solder body rebounds and moves through the upper side of the first accommodating portion based on the vibration of the placement plate; The solder body accommodating step is to drive the first exciter and the second exciter at the same time when the solder body is located on the upper side of the first accommodating portion, so as to induce the solder body to rebound at the original position and be accommodated in the first accommodating portion. 如請求項26所述的焊料體處理方法，其特徵在於： 所述第1容納部形成有朝向開口且開口斷面呈逐漸擴張形態的傾斜面，所述傾斜面相對於所述第1容納部的深度方向以25度至35度的角度傾斜。 The solder body processing method as described in claim 26 is characterized in that: The first receiving portion is formed with an inclined surface facing the opening and the opening cross section is gradually expanding, and the inclined surface is inclined at an angle of 25 degrees to 35 degrees relative to the depth direction of the first receiving portion. 如請求項26所述的焊料體處理方法，其特徵在於： 所述第1安裝板和所述擱置板由一個板材形成，基於所述第1激振器和所述第2激振器中至少任一個，振動也傳遞至所述第1安裝板。 The solder body processing method as described in claim 26 is characterized in that: The first mounting plate and the placement plate are formed by a plate, and vibration is also transmitted to the first mounting plate based on at least one of the first exciter and the second exciter. 如請求項26所述的焊料體處理方法，其特徵在於，進一步包括： 附著處理工具放置步驟，將所述附著處理工具放置於與所述把持處理工具的所述第1安裝板的上側對齊的位置處，附著處理工具包括：第2安裝板，以與所述第1安裝板的所述圖案相同的圖案排列有第2容納部，所述第2安裝板逐一容納所述焊料體；壓力調節部，用於向所述第1容納部施加吸入壓；第2加壓銷，將所述第1容納部中容納的焊料體向所述第1容納部的外部推出； 加壓銷加壓步驟，所述第1加壓銷將所述把持處理工具的所述第1容納部中容納的所述焊料體向上方推出，並使至少一部分插入所述附著處理工具的所述第2容納部地推出； 焊料體吸入步驟，向所述附著處理工具的所述第2容納部施加吸入壓，使所述焊料體安裝於所述第2容納部。 The solder body processing method as described in claim 26 is characterized in that it further includes: An attachment processing tool placement step, placing the attachment processing tool at a position aligned with the upper side of the first mounting plate of the holding processing tool, the attachment processing tool includes: a second mounting plate, having a second accommodating portion arranged in a pattern identical to the pattern of the first mounting plate, the second mounting plate accommodating the solder bodies one by one; a pressure regulating portion for applying suction pressure to the first accommodating portion; a second pressurizing pin for pushing the solder body accommodated in the first accommodating portion to the outside of the first accommodating portion; A pressurizing step of a pressurizing pin, wherein the first pressurizing pin pushes the solder body contained in the first receiving portion of the holding processing tool upward and pushes it out so that at least a portion of it is inserted into the second receiving portion of the attachment processing tool; A solder body suction step, wherein suction pressure is applied to the second receiving portion of the attachment processing tool so that the solder body is installed in the second receiving portion. 如請求項29所述的焊料體處理方法，其特徵在於： 所述第1容納部形成有朝向開口且開口斷面呈逐漸擴張形態的傾斜面，且 在所述焊料體加壓步驟中，所述附著處理工具與所述把持處理工具之間的間距設定為小於所述焊料體的高度減去所述第1容納部的所述傾斜面的深度的值。 The solder body processing method as described in claim 29 is characterized in that: The first receiving portion is formed with an inclined surface facing the opening and the opening cross section is gradually expanded, and In the solder body pressurizing step, the distance between the attachment processing tool and the holding processing tool is set to a value less than the height of the solder body minus the depth of the inclined surface of the first receiving portion. 如請求項29所述的焊料體處理方法，其特徵在於： 所述焊料體加壓步驟中，基於所述第1加壓銷向上方推出所述焊料體，直至所述焊料體的上端處於與所述第2容納部的所述第2加壓銷接觸的狀態。 The solder body processing method as described in claim 29 is characterized in that: In the solder body pressurizing step, the solder body is pushed upward based on the first pressurizing pin until the upper end of the solder body is in contact with the second pressurizing pin of the second accommodating portion.
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