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TW202515708A - Robotic system and method for holding objects - Google Patents

Robotic system and method for holding objects Download PDF

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Publication number
TW202515708A
TW202515708A TW113134340A TW113134340A TW202515708A TW 202515708 A TW202515708 A TW 202515708A TW 113134340 A TW113134340 A TW 113134340A TW 113134340 A TW113134340 A TW 113134340A TW 202515708 A TW202515708 A TW 202515708A
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TW
Taiwan
Prior art keywords
suction
robot
mode
suction port
ports
Prior art date
Application number
TW113134340A
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Chinese (zh)
Inventor
小松原瑶太朗
鈴木忠則
石本剣昇
Original Assignee
日商發那科股份有限公司
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Publication of TW202515708A publication Critical patent/TW202515708A/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J13/00Controls for manipulators
    • B25J13/08Controls for manipulators by means of sensing devices, e.g. viewing or touching devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00Gripping heads and other end effectors
    • B25J15/06Gripping heads and other end effectors with vacuum or magnetic holding means

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  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Manipulator (AREA)

Abstract

There has previously been a desire to make it possible to effectively grip articles of various sizes using a robot hand, and to automate the work of gripping such articles of various sizes. A robot system 10 comprises: a robot 12 that has a robot hand 50 including a first suction opening and a second suction opening, the opening dimensions thereof being different from each other; and a control device 20 that operates the robot 12 to move the robot hand 50, and executes a gripping operation for gripping an article W using the robot hand 50. The control device 20 acquires the surface size of the article to be gripped, and in accordance with the acquired surface size, determines the number of first suction openings and the number of second suction openings to use for the gripping operation.

Description

握持物品之機器人系統、方法Robotic system and method for holding objects

本揭示係關於一種握持物品之機器人系統、方法及電腦程式。The present disclosure relates to a robotic system, method and computer program for holding objects.

已知有一種可握持物品之機械手(例如專利文獻1)。 [先前技術文獻] [專利文獻] It is known that there is a robot hand that can hold an object (e.g., Patent Document 1). [Prior Art Document] [Patent Document]

[專利文獻1]日本專利特開2021-79505號公報[Patent Document 1] Japanese Patent Publication No. 2021-79505

[發明所欲解決之問題][The problem the invention is trying to solve]

先前,可以機械手有效握持各種尺寸之物品,有欲將此種握持各種尺寸之物品之作業自動化之要求。 [解決問題之技術手段] Previously, robots could effectively hold objects of various sizes, and there was a demand to automate the operation of holding objects of various sizes. [Technical means to solve the problem]

本揭示之一態樣中,握持物品之機器人系統具備:機器人,其具有包含開口尺寸互不相同之第1吸附口及第2吸附口之機械手;及控制裝置,其使機器人動作而移動機械手,執行以該機械手握持物品之握持動作。控制裝置取得握持對象之物品之表面尺寸,根據取得之表面尺寸,決定用於握持動作之第1吸附口之個數與第2吸附口之個數。In one aspect of the present disclosure, a robot system for holding an object comprises: a robot having a manipulator including a first suction port and a second suction port with opening sizes different from each other; and a control device, which causes the robot to move the manipulator to perform a holding action of holding an object with the manipulator. The control device obtains the surface size of the object to be held, and determines the number of the first suction ports and the number of the second suction ports used for the holding action based on the obtained surface size.

以包含開口尺寸互不相同之第1吸附口及第2吸附口之機械手握持物品之方法係取得握持對象之物品之表面尺寸,根據取得之表面尺寸,決定用於以機械手握持物品之握持動作之第1吸附口之個數與第2吸附口之個數。A method for holding an object by a robot including a first suction port and a second suction port having opening sizes different from each other is to obtain the surface size of the object to be held, and determine the number of the first suction port and the number of the second suction port used for the holding action of the robot to hold the object based on the obtained surface size.

以下,基於圖式詳細說明本揭示之實施形態。另,以下說明之各種實施形態中,對相同要件標註相同符號,省略重複之說明。首先,參照圖1及圖2,對一實施形態之機器人系統10進行說明。機器人系統10具備機器人12、視覺感測器14、第1種排氣裝置16(圖2)、第2種排氣裝置18A、18B、18C及18D(圖2)、以及控制裝置20。The following is a detailed description of the embodiments of the present disclosure based on the drawings. In addition, in the various embodiments described below, the same elements are marked with the same symbols, and repeated descriptions are omitted. First, referring to Figures 1 and 2, a robot system 10 of an embodiment is described. The robot system 10 includes a robot 12, a visual sensor 14, a first exhaust device 16 (Figure 2), a second exhaust device 18A, 18B, 18C and 18D (Figure 2), and a control device 20.

本實施形態中,機器人12為垂直多關節機器人,且具有機器人基座22、迴旋主體24、下臂部26、上臂部28、手腕部30及機械手50。機器人基座22固定於作業單元之地板或無人搬送車(AGV:Automated Guided Vehicle)之上。迴旋主體24以可繞鉛直軸迴旋之方式設置於機器人基座22。In this embodiment, the robot 12 is a vertical multi-joint robot, and has a robot base 22, a rotating body 24, a lower arm 26, an upper arm 28, a wrist 30, and a manipulator 50. The robot base 22 is fixed on the floor of the work unit or an AGV (Automated Guided Vehicle). The rotating body 24 is arranged on the robot base 22 in a manner that it can rotate around a lead straight axis.

下臂部26之基端部可繞水平軸旋動地設置於迴旋主體24,上臂部28之基端部可旋動地設置於下臂部26之前端部。手腕部30具有:手腕基座30a,其以可繞互相正交之2個軸旋動之方式設置於上臂部28之前端部;及手腕凸緣30b,其以可繞手腕軸A1旋動之方式設置於該手腕基座30a。The base end of the lower arm 26 is rotatably provided on the rotating body 24 around a horizontal axis, and the base end of the upper arm 28 is rotatably provided on the front end of the lower arm 26. The wrist 30 includes a wrist base 30a rotatably provided on the front end of the upper arm 28 around two axes orthogonal to each other, and a wrist flange 30b rotatably provided on the wrist base 30a around a wrist axis A1.

於機器人基座22、迴旋主體24、下臂部26、上臂部28及手腕部30,分別設有伺服馬達32(圖2)。伺服馬達32藉由使迴旋主體24、下臂部26、上臂部28、手腕基座30a及手腕凸緣30b繞各自之驅動軸旋動,而使機械手50移動。因此,機器人基座22、迴旋主體24、下臂部26、上臂部28及手腕部30(手腕基座30a、手腕凸緣30b)構成使機械手50移動之移動機構部34(圖1)。The robot base 22, the rotating body 24, the lower arm 26, the upper arm 28 and the wrist 30 are respectively provided with a servo motor 32 (FIG. 2). The servo motor 32 moves the robot 50 by rotating the rotating body 24, the lower arm 26, the upper arm 28, the wrist base 30a and the wrist flange 30b around their respective drive axes. Therefore, the robot base 22, the rotating body 24, the lower arm 26, the upper arm 28 and the wrist 30 (the wrist base 30a and the wrist flange 30b) constitute a moving mechanism 34 (FIG. 1) that moves the robot 50.

機械手50可裝卸地安裝於移動機構部34之手腕凸緣30b。以下,參照圖3~圖7,對機械手50之構成進行說明。另,以下之說明中,將沿圖中之軸線A2之方向稱為軸向,將以該軸線A2為中心之圓之半徑方向稱為徑向,將該圓之圓周方向稱為周向。又,為方便起見,將圖3中之箭頭B之方向稱為軸向下方。The manipulator 50 is detachably mounted on the wrist flange 30b of the moving mechanism 34. The structure of the manipulator 50 is described below with reference to FIGS. 3 to 7. In the following description, the direction along the axis A2 in the figure is referred to as the axial direction, the radius direction of the circle with the axis A2 as the center is referred to as the radial direction, and the circumferential direction of the circle is referred to as the circumferential direction. In addition, for convenience, the direction of the arrow B in FIG. 3 is referred to as the axial downward direction.

機器人50具備手基座52、吸引式手54及吸附式手56。手基座52具有安裝凸緣58、支持台60及複數個柱部62。安裝凸緣58為具有中心軸線A2之大致圓形狀之平板構件。於安裝凸緣58,形成有貫通孔63(圖6、圖7)及複數個安裝孔64(圖6)。貫通孔63配置於安裝凸緣58之中心部。安裝孔64以於周向上等間隔排列之方式配置於貫通孔63周圍。安裝凸緣58藉由插通於安裝孔64之螺栓等緊固具,可拆卸地緊固於手腕凸緣30b。如此,手基座52固定於手腕凸緣30b。The robot 50 has a hand base 52, a suction hand 54 and an adsorption hand 56. The hand base 52 has a mounting flange 58, a support platform 60 and a plurality of column portions 62. The mounting flange 58 is a substantially circular flat plate member having a central axis A2. A through hole 63 (FIG. 6, FIG. 7) and a plurality of mounting holes 64 (FIG. 6) are formed in the mounting flange 58. The through hole 63 is arranged in the center of the mounting flange 58. The mounting holes 64 are arranged around the through hole 63 at equal intervals in the circumferential direction. The mounting flange 58 is detachably fastened to the wrist flange 30b by fasteners such as bolts inserted into the mounting holes 64. In this way, the hand base 52 is fixed to the wrist flange 30b.

支持台60以於軸向下方與安裝凸緣58隔開之方式,與該安裝凸緣58大致平行地對向配置。支持台60為具有與安裝凸緣58相同外形(即大致圓形)之平板構件。於支持台60形成有貫通孔66及68(圖6、圖7)。貫通孔66配置於支持台60之中心部。又,本實施形態中,合計4個貫通孔68以於周向上以規定之角度(=45°)排列之方式配置。The support platform 60 is arranged to be spaced from the mounting flange 58 in the axially downward direction and is arranged to be substantially parallel to the mounting flange 58. The support platform 60 is a flat plate member having the same outer shape (i.e., substantially circular) as the mounting flange 58. Through holes 66 and 68 (Fig. 6 and Fig. 7) are formed in the support platform 60. The through hole 66 is arranged at the center of the support platform 60. In the present embodiment, a total of four through holes 68 are arranged to be arranged at a predetermined angle (=45°) in the circumferential direction.

柱部62之各者於安裝凸緣58與支持台60之間,於軸向上筆直延伸。本實施形態中,於周向上以大致等間隔(90°之間隔)配設有合計2根柱部62。安裝凸緣58、支持台60及柱部62藉由螺栓緊固或焊接等互相固定,藉此構成一體形狀之手基座52。Each of the pillars 62 extends straight in the axial direction between the mounting flange 58 and the support platform 60. In the present embodiment, a total of two pillars 62 are arranged at substantially equal intervals (90° intervals) in the circumferential direction. The mounting flange 58, the support platform 60, and the pillars 62 are fixed to each other by bolt fastening or welding, thereby forming a one-piece hand base 52.

吸引式手54設置於手基座52,具有手臂70、滑塊72、第2種施力機構74及吸引墊76。滑塊72以可於軸向滑動之方式設置於手基座52。於滑塊72之中心部,形成有貫通孔72a(圖6)。另,亦可於滑塊72形成貫通孔(未圖示),將柱部62可相對滑動地插通該貫通孔,藉此將滑塊72以可於軸向往復移動之方式嵌合於柱部62。該情形時,可藉由柱部62引導滑塊72之往復移動。The suction hand 54 is provided on the hand base 52, and has an arm 70, a slider 72, a second force applying mechanism 74, and a suction pad 76. The slider 72 is provided on the hand base 52 in a manner that it can slide in the axial direction. A through hole 72a (FIG. 6) is formed in the center of the slider 72. In addition, a through hole (not shown) can also be formed in the slider 72, and the column 62 can be inserted through the through hole so as to slide relatively, thereby fitting the slider 72 in the column 62 in a manner that it can reciprocate in the axial direction. In this case, the reciprocating movement of the slider 72 can be guided by the column 62.

手臂70(第2手臂)為具有中心軸線A3之圓筒狀之構件,且於軸向延伸。本實施形態中,軸線A3與軸線A1及A2大致一致(或平行)。手臂70具有固定臂部78及可動臂部80。固定臂部78為圓筒狀,且固定於手基座52。更具體而言,固定臂部78插通固定於形成在安裝凸緣58之貫通孔63(圖6、圖7),向該安裝凸緣58之軸向上方拉出。The arm 70 (second arm) is a cylindrical member having a central axis A3 and extending in the axial direction. In the present embodiment, the axis A3 is substantially consistent with (or parallel to) the axes A1 and A2. The arm 70 has a fixed arm portion 78 and a movable arm portion 80. The fixed arm portion 78 is cylindrical and fixed to the hand base 52. More specifically, the fixed arm portion 78 is inserted and fixed to the through hole 63 (FIG. 6, FIG. 7) formed in the mounting flange 58, and is pulled out axially upward of the mounting flange 58.

可動臂部80為圓筒狀,且以可沿軸線A3滑動之方式嵌合於固定臂部78。本實施形態中,可動臂部80具有略大於固定臂部78之徑,於該可動臂部80之內部可滑動地嵌入固定臂部78。另,可動臂部80之內周面與固定臂部78之外周面亦可可相對滑動地氣密性面接觸。又,可動臂部80可相對滑動地插通形成於支持台60之貫通孔66(圖6、圖7)。The movable arm 80 is cylindrical and is fitted in the fixed arm 78 in a manner that allows sliding along the axis A3. In this embodiment, the movable arm 80 has a diameter slightly larger than that of the fixed arm 78, and is slidably fitted into the fixed arm 78 inside the movable arm 80. In addition, the inner peripheral surface of the movable arm 80 and the outer peripheral surface of the fixed arm 78 can also be in airtight surface contact in a relatively slidable manner. In addition, the movable arm 80 can be inserted through the through hole 66 formed in the support table 60 in a relatively slidable manner (Figures 6 and 7).

可動臂部80以其軸向上端部80a固定於滑塊72。更具體而言,可動臂部80之上端部80a插通固定於形成在滑塊72之貫通孔72a(圖6),與該滑塊72一起於軸向上往復移動。可動臂部80之內部與固定臂部78之內部互相連通,劃定後述之外氣之流路。The movable arm 80 is fixed to the slider 72 at its axial end 80a. More specifically, the upper end 80a of the movable arm 80 is inserted and fixed to the through hole 72a (Fig. 6) formed in the slider 72, and reciprocates in the axial direction together with the slider 72. The interior of the movable arm 80 and the interior of the fixed arm 78 are connected to each other, defining a flow path of external air described later.

吸引墊76為具有中心軸線A3之中空之可撓性構件,且安裝於可動臂部80之軸向下端80b。吸引墊76具有前端面82及吸入口84(圖5、圖7)。如圖5所示,前端面82於其中心部劃定出吸入口84。吸入口84為具有中心軸線A3之大致圓形之孔,且向軸向下方開口。另,吸引墊76可成形為波紋管狀,藉此,可向軸向伸縮而構成。The suction pad 76 is a hollow flexible member having a central axis A3 and is mounted on the axially lower end 80b of the movable arm 80. The suction pad 76 has a front end face 82 and a suction port 84 (FIG. 5, FIG. 7). As shown in FIG. 5, the front end face 82 defines the suction port 84 at its center. The suction port 84 is a substantially circular hole having a central axis A3 and is open axially downward. In addition, the suction pad 76 can be formed into a corrugated tube shape, thereby being able to be stretched and contracted in the axial direction.

第2種施力機構74以使可動臂部80及吸引墊76向軸向下方前進之方式施力。本實施形態中,施力機構74具有氣壓式或液壓式缸體86。更具體而言,缸體86具有中空之缸體本體86a與可進退地收容於該缸體本體86a之缸體軸86b。缸體軸86b之前端固定於滑塊72之軸向上表面。The second force-applying mechanism 74 applies force in such a manner that the movable arm 80 and the suction pad 76 advance axially downward. In this embodiment, the force-applying mechanism 74 has a pneumatic or hydraulic cylinder 86. More specifically, the cylinder 86 has a hollow cylinder body 86a and a cylinder shaft 86b housed in the cylinder body 86a in a reciprocating manner. The front end of the cylinder shaft 86b is fixed to the axially upward surface of the slider 72.

缸體本體86a之內部經由流路管PT流體性連接於流體供給裝置FD(皆未圖示),控制裝置20藉由控制該流體供給裝置FD,而可自動控制缸體本體86a內之壓力P。缸體86藉由供給至缸體本體86a內之壓力P,而將缸體軸86b向軸向下方推出,藉此,將滑塊72、可動臂部80及吸引墊76向軸向下方施力。圖4顯示施力機構74(缸體86)使吸引墊76向軸向下方前進之狀態,另一方面,圖8顯示可動臂部80及吸引墊76於軸向上方後退之狀態。如此,手臂70使吸引墊76沿軸線A3進退。The interior of the cylinder body 86a is fluidically connected to the fluid supply device FD (not shown) via the flow tube PT. The control device 20 can automatically control the pressure P in the cylinder body 86a by controlling the fluid supply device FD. The cylinder body 86 pushes the cylinder shaft 86b axially downward by the pressure P supplied to the cylinder body 86a, thereby applying force to the slider 72, the movable arm 80 and the suction pad 76 axially downward. FIG. 4 shows a state in which the force applying mechanism 74 (cylinder body 86) causes the suction pad 76 to move forward axially downward, while FIG. 8 shows a state in which the movable arm 80 and the suction pad 76 move backward axially upward. In this way, the arm 70 causes the suction pad 76 to move forward and backward along the axis A3.

吸附式手56設置於手基座52。本實施形態中,吸附式手56具有合計2個大吸附手88及90,與合計2個小吸附手92及94。如圖5所示,本實施形態中,大吸附手88及90與小吸附手92及94以繞軸線A3(即,軸線A1及A2)依規定之角度θ1=45°交替排列之方式配置。The suction hand 56 is disposed on the hand base 52. In this embodiment, the suction hand 56 has a total of two large suction hands 88 and 90, and a total of two small suction hands 92 and 94. As shown in FIG. 5 , in this embodiment, the large suction hands 88 and 90 and the small suction hands 92 and 94 are arranged in an alternating manner around the axis A3 (i.e., the axes A1 and A2) at a prescribed angle θ1=45°.

大吸附手88為具有中心軸線A4之中空構件,且插通固定於形成在支持台60之貫通孔68(圖6、圖7)。具體而言,大吸附手88具有吸附墊96、手臂98及第1種施力機構100。吸附墊96為具有中心軸線A4之中空之可撓性構件,且安裝於手臂98之前端部。具體而言,吸附墊96具有前端面102及吸附口104(圖5、圖7)。The large suction hand 88 is a hollow member having a central axis A4, and is inserted and fixed in a through hole 68 formed in the support table 60 (FIG. 6, FIG. 7). Specifically, the large suction hand 88 has a suction pad 96, an arm 98, and a first force applying mechanism 100. The suction pad 96 is a hollow flexible member having a central axis A4, and is mounted on the front end of the arm 98. Specifically, the suction pad 96 has a front end surface 102 and a suction port 104 (FIG. 5, FIG. 7).

前端面102於其中心部劃定出吸附口104。吸附口104(第1吸附口)為具有中心軸線A4之大致圓形之孔,且具有第1開口尺寸R1。另,吸附墊96成形為波紋管狀,藉此,亦可向軸向可伸縮地構成。又,吸附墊96亦可具有較上述吸引墊76高之可撓性。又,吸附墊96亦可由與吸引墊76不同之材料(橡膠、樹脂等)構成。The front end surface 102 defines a suction port 104 at its center. The suction port 104 (first suction port) is a substantially circular hole having a center axis A4 and having a first opening size R1. In addition, the suction pad 96 is formed into a corrugated tube shape, thereby also being configured to be axially stretchable. In addition, the suction pad 96 may also have a higher flexibility than the above-mentioned suction pad 76. In addition, the suction pad 96 may also be composed of a material different from that of the suction pad 76 (rubber, resin, etc.).

手臂98(第1手臂)為具有中心軸線A4之中空構件,且固定於手基座52。更具體而言,手臂98具有缸體部106及軸部108。缸體部106為中空,且插通固定於支持台60之貫通孔68(圖6、圖7)。軸部108為中空,以可向軸線A4之方向進退之方式,收容於缸體部106之內部。吸附墊96安裝於軸部108之前端。The arm 98 (first arm) is a hollow member having a central axis A4 and is fixed to the hand base 52. More specifically, the arm 98 has a cylinder 106 and a shaft 108. The cylinder 106 is hollow and is inserted through the through hole 68 (FIG. 6 and FIG. 7) fixed to the support 60. The shaft 108 is hollow and is accommodated inside the cylinder 106 in a manner that it can move forward and backward in the direction of the axis A4. The suction pad 96 is mounted on the front end of the shaft 108.

第1種施力機構100以使軸部108及吸附墊96向軸向下方前進之方式施力。本實施形態中,施力機構100具有內置於缸體部106之彈簧SP(未圖示)。彈簧SP介插於缸體部106之內壁與軸部108之間,施力機構100藉由該彈簧SP之彈性力,將軸部108及吸附墊96施力。The first force applying mechanism 100 applies force to the shaft 108 and the adsorption pad 96 in an axially downward direction. In this embodiment, the force applying mechanism 100 has a spring SP (not shown) built into the cylinder 106. The spring SP is inserted between the inner wall of the cylinder 106 and the shaft 108, and the force applying mechanism 100 applies force to the shaft 108 and the adsorption pad 96 by the elastic force of the spring SP.

如此,施力機構100為藉由彈簧SP產生施力力之第1種施力機構,另一方面,上述施力機構74為藉由缸體86產生施力力之與第1種不同之第2種施力機構。藉由該施力機構100之作用,手臂98使吸附墊96沿吸附口104之軸線A4進退。Thus, the urging mechanism 100 is a first type of urging mechanism that generates urging force by the spring SP, while the urging mechanism 74 is a second type of urging mechanism that generates urging force by the cylinder 86. By the action of the urging mechanism 100, the arm 98 moves the suction pad 96 forward and backward along the axis A4 of the suction port 104.

大吸附手90為具有中心軸線A5之中空構件,且插通固定於形成在支持台60之貫通孔68。大吸附手90具有與大吸附手88相同之構成,配置成以軸線A3為基準,與該大吸附手88旋轉對稱。具體而言,大吸附手90具有吸附墊96、手臂98(缸體部106、軸部108)及施力機構100,該吸附墊96劃定具有軸線A5之吸附口104。藉由設置於缸體部106內之施力機構100(彈簧SP)之作用,大吸附手90之手臂98使吸附墊96沿吸附口104之軸線A5進退。The large suction hand 90 is a hollow member having a central axis A5, and is inserted and fixed in a through hole 68 formed in the support table 60. The large suction hand 90 has the same structure as the large suction hand 88, and is arranged to be rotationally symmetrical with the large suction hand 88 based on the axis A3. Specifically, the large suction hand 90 has a suction pad 96, an arm 98 (cylinder body 106, shaft 108) and a force-applying mechanism 100, and the suction pad 96 defines a suction port 104 having an axis A5. By the action of the force-applying mechanism 100 (spring SP) provided in the cylinder body 106, the arm 98 of the large suction hand 90 causes the suction pad 96 to move forward and backward along the axis A5 of the suction port 104.

小吸附手92為具有中心軸線A6之中空構件,且插通固定於形成在支持台60之貫通孔68。小吸附手92具有吸附墊110、上述手臂98(缸體部106、軸部108)及施力機構100。該手臂98之缸體部106插通固定於支持台60之貫通孔68,吸附墊110安裝於該手臂98之軸部108之前端。The small suction hand 92 is a hollow member having a central axis A6 and is inserted and fixed in a through hole 68 formed in the support table 60. The small suction hand 92 has a suction pad 110, the arm 98 (cylinder body 106, shaft 108) and a force applying mechanism 100. The cylinder body 106 of the arm 98 is inserted and fixed in the through hole 68 of the support table 60, and the suction pad 110 is installed at the front end of the shaft 108 of the arm 98.

吸附墊110為具有中心軸線A6之中空之可撓性構件,且具有前端面112及吸附口114(圖5、圖7)。前端面112於其中心部劃定出吸附口114。吸附口114(第2吸附口)為具有中心軸線A6之大致圓形之孔,且具有小於上述第1開口尺寸R1之第2開口尺寸R2(R2<R1)。The suction pad 110 is a hollow flexible member having a central axis A6, and has a front end surface 112 and a suction port 114 (FIG. 5, FIG. 7). The front end surface 112 defines the suction port 114 at its center. The suction port 114 (second suction port) is a substantially circular hole having a central axis A6, and has a second opening size R2 smaller than the first opening size R1 (R2<R1).

另,吸附墊110成形為波紋管狀,藉此,亦可向軸向可伸縮地構成。又,吸附墊110亦可具有較上述吸引墊76高之可撓性。又,吸附墊110亦可由與吸引墊76不同之材料(橡膠、樹脂等)構成。藉由設置於缸體部106內之施力機構100(彈簧SP)之作用,小吸附手92之手臂98使吸附墊110沿吸附口114之軸線A6進退。In addition, the suction pad 110 is formed into a corrugated tube shape, thereby also being configured to be axially stretchable. In addition, the suction pad 110 may also have a higher flexibility than the above-mentioned suction pad 76. In addition, the suction pad 110 may also be composed of a material different from that of the suction pad 76 (rubber, resin, etc.). By the action of the force-applying mechanism 100 (spring SP) disposed in the cylinder body 106, the arm 98 of the small suction hand 92 causes the suction pad 110 to move forward and backward along the axis A6 of the suction port 114.

小吸附手94為具有中心軸線A7之中空構件,且插通固定於形成在支持台60之貫通孔68。小吸附手94具有與小吸附手92相同之構成,配置成以軸線A3為基準,與該小吸附手92旋轉對稱。具體而言,小吸附手94具有吸附墊110、手臂98(缸體部106、軸部108)及施力機構100,該吸附墊110劃定具有軸線A7之吸附口114。藉由設置於缸體部106內之施力機構100(彈簧SP)之作用,小吸附手94之手臂98使吸附墊110沿軸線A7進退。The small suction hand 94 is a hollow component having a central axis A7, and is inserted and fixed in a through hole 68 formed in the support table 60. The small suction hand 94 has the same structure as the small suction hand 92, and is arranged to be rotationally symmetrical with the small suction hand 92 based on the axis A3. Specifically, the small suction hand 94 has a suction pad 110, an arm 98 (cylinder body 106, shaft 108) and a force-applying mechanism 100, and the suction pad 110 defines a suction port 114 having an axis A7. By the action of the force-applying mechanism 100 (spring SP) provided in the cylinder body 106, the arm 98 of the small suction hand 94 causes the suction pad 110 to move forward and backward along the axis A7.

如上所述,本實施形態中,吸附式手56如圖5所示,具有以於繞軸線A1、A2及A3之方向排列之方式配置於吸入口84周圍之複數個(具體而言為2個)吸附口104,及複數個(具體而言為2個)吸附口114。且,吸附口104與吸附口114以繞軸線A1、A2及A3依規定之角度θ1(=90°)交替排列之方式配設於周向上。另,本實施形態中,吸引式手54之軸線A3、大吸附手88及90之軸線A4及A5、小吸附手92及94之軸線A6及A7互相大致平行。As described above, in the present embodiment, the suction hand 56 has a plurality of (specifically, 2) suction ports 104 and a plurality of (specifically, 2) suction ports 114 arranged around the suction port 84 in a manner arranged in directions around the axes A1, A2, and A3, as shown in FIG. 5. Moreover, the suction ports 104 and the suction ports 114 are arranged in the circumferential direction in a manner alternately arranged around the axes A1, A2, and A3 at a prescribed angle θ1 (=90°). In addition, in the present embodiment, the axis A3 of the suction hand 54, the axes A4 and A5 of the large suction hands 88 and 90, and the axes A6 and A7 of the small suction hands 92 and 94 are substantially parallel to each other.

再次參照圖1及圖2,視覺感測器14拍攝應由機械手50握持之物品W。具體而言,視覺感測器14例如為3維視覺感測器,具有CCD(Charge Coupled Device:電荷耦合器件)或CMOS(Complementary Metal Oxide Semiconductor:互補金屬氧化物半導體)等攝像感測器、聚焦透鏡等光學透鏡及圖像處理處理器等。視覺感測器14配置於可將物品納入視野內之攝像位置αi,將拍攝到之物品之圖像資料ID(3維點群圖像資料、距離圖像資料等)供給至控制裝置20。另,視覺感測器14可定點固定於指定之攝像位置αi,或亦可固定於手腕凸緣30b或機械手50(例如,手基座52),藉由移動機構部34向攝像位置αi移動。Referring again to FIG. 1 and FIG. 2 , the visual sensor 14 photographs the object W to be held by the robot 50. Specifically, the visual sensor 14 is, for example, a 3D visual sensor, and has an imaging sensor such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor), an optical lens such as a focusing lens, and an image processing processor. The visual sensor 14 is arranged at an imaging position αi where the object can be included in the field of view, and supplies the image data ID (3D point group image data, distance image data, etc.) of the photographed object to the control device 20. In addition, the visual sensor 14 can be fixed at a designated imaging position αi, or can also be fixed to the wrist flange 30b or the robot 50 (for example, the hand base 52), and moved to the imaging position αi by the moving mechanism 34.

參照圖2,第1種排氣裝置16流體性連接於吸引式手54之內部,以通過吸引式手54之吸入口84吸入外氣之方式,使該吸引式手54內產生氣流。以下,參照圖9,對第1種排氣裝置16之一例進行說明。本實施形態中,第1種排氣裝置16利用所謂之康達效應,產生自吸引式手54之吸入口84吸入外氣之氣流。Referring to FIG. 2 , the first type of exhaust device 16 is fluidically connected to the inside of the suction hand 54 so as to generate an air flow in the suction hand 54 by sucking in the outside air through the suction port 84 of the suction hand 54. Hereinafter, an example of the first type of exhaust device 16 will be described with reference to FIG. 9 . In this embodiment, the first type of exhaust device 16 utilizes the so-called Coanda effect to generate an air flow by sucking in the outside air from the suction port 84 of the suction hand 54.

具體而言,排氣裝置16具有氣體噴射裝置120及氣流產生機構122。氣流產生機構122具有氣體入口122a、螺旋流路122b、氣體出口122c及氣體吸入口122d。氣體噴射裝置120向氣體入口122a導入氣體之噴流D1。流入氣體入口122a之噴流D1於形成於氣流產生機構122內部之螺旋流路122b流動,自氣體出口122c作為噴流D1’而噴出。Specifically, the exhaust device 16 has a gas injection device 120 and an airflow generating mechanism 122. The airflow generating mechanism 122 has a gas inlet 122a, a spiral flow path 122b, a gas outlet 122c, and a gas suction port 122d. The gas injection device 120 introduces a gas jet D1 into the gas inlet 122a. The jet D1 flowing into the gas inlet 122a flows in the spiral flow path 122b formed inside the airflow generating mechanism 122, and is ejected from the gas outlet 122c as a jet D1'.

藉由此種氣流產生機構122內之噴流D1之流動而產生康達效應,藉此,產生自氣體吸入口122d吸入至氣流產生機構122內之氣流D2。氣體吸入口122d經由流路管124,流體性連接於吸引式手54之內部(具體而言,固定臂部78之軸向上側之開口端),可藉由如上所述產生之氣流D2,產生自吸引式手54之吸入口84吸入外氣之氣流。The flow of the jet D1 in the airflow generating mechanism 122 generates a Coanda effect, thereby generating an airflow D2 sucked into the airflow generating mechanism 122 from the gas suction port 122d. The gas suction port 122d is fluidically connected to the inside of the suction hand 54 (specifically, the opening end on the axial side of the fixed arm 78) through the flow tube 124, and can generate an airflow of sucking outside air from the suction port 84 of the suction hand 54 through the airflow D2 generated as described above.

另,排氣裝置16不限於具有利用康達效應之氣流產生機構122之形態,例如亦可為具有附葉片之風扇與使該風扇旋轉之馬達者(如所謂之吸塵器般之吸引裝置等)。或者,排氣裝置16亦可由將複數個後述之文丘里管式負壓產生機構連結而成之文丘里管機構組裝體構成。In addition, the exhaust device 16 is not limited to the form of the airflow generating mechanism 122 utilizing the Coanda effect, and may be, for example, a fan with blades and a motor for rotating the fan (such as a suction device such as a so-called vacuum cleaner). Alternatively, the exhaust device 16 may be composed of a Venturi tube mechanism assembly formed by connecting a plurality of Venturi tube type negative pressure generating mechanisms described later.

以將吸引式手54之吸入口84打開之狀態啟動排氣裝置16之情形時,吸引式手54以可自吸入口84吸入最大流量E1之外氣之方式構成。另一方面,以將吸入口84閉塞之狀態啟動排氣裝置16之情形時,吸引式手54於吸引墊76之內部(即,吸入口84)形成負壓ρ1。When the exhaust device 16 is activated with the suction port 84 of the suction hand 54 opened, the suction hand 54 is configured to be able to suck in a maximum flow rate E1 of external air from the suction port 84. On the other hand, when the exhaust device 16 is activated with the suction port 84 closed, the suction hand 54 forms a negative pressure ρ1 inside the suction pad 76 (i.e., the suction port 84).

第2種排氣裝置18A、18B、18C及18D分別流體性連接於大吸附手88及90、小吸附手92及94之內部,於該等大吸附手88及90、小吸附手92及94之內部形成負壓。第2種排氣裝置18A、18B、18C及18D以與第1種排氣裝置16不同之機制產生氣流。The second exhaust devices 18A, 18B, 18C and 18D are fluidly connected to the inside of the large suction hands 88 and 90 and the small suction hands 92 and 94, respectively, to form negative pressure inside the large suction hands 88 and 90 and the small suction hands 92 and 94. The second exhaust devices 18A, 18B, 18C and 18D generate airflow by a different mechanism from the first exhaust device 16.

以下,參照圖10,對第2種排氣裝置18A、18B、18C及18D之一例進行說明。排氣裝置18A、18B、18C及18D各自具有氣體噴射裝置130及負壓產生機構132。負壓產生機構132具有氣體入口132a、文丘里管流路132b、氣體出口132c及氣體吸入口132d。於文丘里管流路132b與氣體吸入口132d連通之部位,形成有使該文丘里管流路132b縮窄之噴嘴132e。Hereinafter, referring to FIG. 10 , an example of the second type of exhaust devices 18A, 18B, 18C and 18D will be described. The exhaust devices 18A, 18B, 18C and 18D each have a gas injection device 130 and a negative pressure generating mechanism 132. The negative pressure generating mechanism 132 has a gas inlet 132a, a venturi tube flow path 132b, a gas outlet 132c and a gas suction port 132d. A nozzle 132e is formed at a portion where the venturi tube flow path 132b and the gas suction port 132d are connected to narrow the venturi tube flow path 132b.

氣體噴射裝置130向氣體入口132a導入氣體之噴流G1。流入至氣體入口132a之噴流G1於文丘里管流路132b內流動,藉由噴嘴132e急劇壓縮後,自氣體出口132c作為噴流G1’而噴出。藉由由噴嘴132e急劇壓縮之噴流G1之流動而產生文丘里管效應,藉此,於氣體吸入口132d產生較大負壓。其結果,產生被吸入至氣體吸入口132d之氣流G2。另,氣體吸入口132d可具有較上述氣體吸入口122d小之開口尺寸。The gas injection device 130 introduces a gas jet G1 into the gas inlet 132a. The jet G1 flowing into the gas inlet 132a flows in the venturi tube flow path 132b, is rapidly compressed by the nozzle 132e, and is ejected from the gas outlet 132c as a jet G1'. The flow of the jet G1 rapidly compressed by the nozzle 132e generates a venturi effect, thereby generating a relatively large negative pressure at the gas suction port 132d. As a result, an air flow G2 is generated and sucked into the gas suction port 132d. In addition, the gas suction port 132d may have an opening size smaller than the above-mentioned gas suction port 122d.

排氣裝置18A、18B、18C、18D之氣體吸入口132d分別經由流路管134流體性連接於大吸附手88及90、小吸附手92及94之內部。藉由如上所述般產生之氣流G2,可於大吸附手88及90、小吸附手92及94各自之內部形成較大負壓。另,排氣裝置18A、18B、18C及18D之至少一者不限於具有利用文丘里管效應之負壓產生機構132之形態,例如亦可為具有真空泵者。The gas inlet 132d of the exhaust devices 18A, 18B, 18C, and 18D are fluidly connected to the inside of the large suction hands 88 and 90, and the small suction hands 92 and 94 through the flow pipe 134. By the airflow G2 generated as described above, a relatively large negative pressure can be formed inside each of the large suction hands 88 and 90, and the small suction hands 92 and 94. In addition, at least one of the exhaust devices 18A, 18B, 18C, and 18D is not limited to the form having the negative pressure generating mechanism 132 using the Venturi effect, and may also be a vacuum pump, for example.

以閉塞大吸附手88及90之吸附口104之狀態啟動排氣裝置18A及18B之情形時,大吸附手88及90以可於各自之吸附墊96之內部(即,吸附口104),形成遠大於上述負壓ρ1之負壓ρ2(|ρ2|≫|ρ1|)之方式構成。另一方面,以打開吸附口104之狀態啟動排氣裝置18A及18B之情形時,大吸附手88及90自各自之吸附口104吸入遠小於上述最大流量E1之最大流量E2(E2≪E1)之外氣。When the exhaust devices 18A and 18B are activated with the suction ports 104 of the large suction hands 88 and 90 closed, the large suction hands 88 and 90 are configured so as to form a negative pressure ρ2 (|ρ2|≫|ρ1|) much greater than the negative pressure ρ1 in the interior of the respective suction pads 96 (i.e., the suction ports 104). On the other hand, when the exhaust devices 18A and 18B are activated with the suction ports 104 open, the large suction hands 88 and 90 inhale the outside air at a maximum flow rate E2 (E2≪E1) much less than the maximum flow rate E1 from the respective suction ports 104.

同樣地,以閉塞小吸附手92及94之吸附口114之狀態啟動排氣裝置18C及18D之情形時,小吸附手92及94以可於各自之吸附墊110之內部(即,吸附口114),形成遠大於上述負壓ρ1之負壓ρ3(|ρ3|≫|ρ1|)之方式構成。Similarly, when the exhaust devices 18C and 18D are activated with the suction ports 114 of the small suction hands 92 and 94 closed, the small suction hands 92 and 94 are constructed in such a way that a negative pressure ρ3 (|ρ3|≫|ρ1|) much greater than the above-mentioned negative pressure ρ1 can be formed inside their respective suction pads 110 (i.e., suction ports 114).

另,負壓ρ3可與上述負壓ρ2大致相同(ρ3≒ρ2),或者亦可小於(或大於)負壓ρ2(ρ3<ρ2或ρ3>ρ2)。另一方面,以打開吸附口114之狀態啟動排氣裝置18C及18D之情形時,小吸附手92及94自各自之吸附口114吸入遠小於上述最大流量E1之最大流量E3(E3≪E1)之外氣。In addition, the negative pressure ρ3 may be substantially the same as the negative pressure ρ2 (ρ3≒ρ2), or may be less than (or greater than) the negative pressure ρ2 (ρ3<ρ2 or ρ3>ρ2). On the other hand, when the exhaust devices 18C and 18D are activated with the suction port 114 opened, the small suction hands 92 and 94 inhale the outside air from their respective suction ports 114 at a maximum flow rate E3 (E3≪E1) which is much less than the maximum flow rate E1.

參照圖2,控制裝置20使移動機構部34動作而移動機械手50,以執行以該機械手50握持物品之握持動作之方式,控制機器人12之動作。更具體而言,控制裝置20為具有處理器40、記憶體42及I/O介面44之電腦。2 , the control device 20 controls the movement of the robot 12 by operating the moving mechanism 34 to move the robot 50 so as to perform a holding action of holding an object with the robot 50. More specifically, the control device 20 is a computer having a processor 40, a memory 42, and an I/O interface 44.

處理器40具有CPU(Central Processing Unit:中央處理單元)或GPU(Graphics Processing Unit:圖形處理單元)等,經由匯流排46,與記憶體42及I/O介面44可通信地連接。處理器40與記憶體42及I/O介面44通信,且進行用以執行後述之握持動作之運算處理。記憶體42具有RAM(Random Access Memory:隨機存取記憶體)或ROM(Read-Only Memory:唯讀記憶體)等,暫時或永久地記憶各種資料。記憶體42亦可為半導體記憶體、磁性記錄媒體或光記錄媒體等電腦可讀取之記錄媒體。The processor 40 has a CPU (Central Processing Unit) or a GPU (Graphics Processing Unit), etc., and is communicatively connected to the memory 42 and the I/O interface 44 via a bus 46. The processor 40 communicates with the memory 42 and the I/O interface 44, and performs calculation processing for executing the holding action described later. The memory 42 has a RAM (Random Access Memory) or a ROM (Read-Only Memory), etc., and temporarily or permanently stores various data. The memory 42 can also be a computer-readable recording medium such as a semiconductor memory, a magnetic recording medium, or an optical recording medium.

I/O介面44例如具有乙太網路(註冊商標)埠、USB埠、光纖連接器或HDMI(High Definition Multimedia Interface:高畫質多媒體介面)(註冊商標)端子,於來自處理器40之指令下,與外部機器之間以有線或無線通信資料。上述伺服馬達32、視覺感測器14、排氣裝置16及18A~18D以有線或無線可通信地連接於I/O介面44。The I/O interface 44 has, for example, an Ethernet (registered trademark) port, a USB port, an optical fiber connector, or an HDMI (High Definition Multimedia Interface) (registered trademark) terminal, and communicates data with an external device by wire or wirelessly under the command from the processor 40. The servo motor 32, the visual sensor 14, the exhaust device 16, and 18A to 18D are connected to the I/O interface 44 by wire or wireless communication.

如圖1所示,對機器人12設定機器人座標系C1及工具座標系C2。機器人座標系C1為用以自動控制機器人12之各可動組件(即,迴旋主體24、下臂部26、上臂部28、手腕基座30a、手腕凸緣30b及機械手50)之動作之座標系。本實施形態中,機器人座標系C1以其之原點配置於機器人基座22之中心,其之z軸與迴旋主體24之迴旋軸平行(具體而言,一致)之方式,固定於機器人基座22。As shown in FIG1 , a robot coordinate system C1 and a tool coordinate system C2 are set for the robot 12. The robot coordinate system C1 is a coordinate system for automatically controlling the movements of the movable components of the robot 12 (i.e., the rotating body 24, the lower arm 26, the upper arm 28, the wrist base 30a, the wrist flange 30b, and the manipulator 50). In the present embodiment, the robot coordinate system C1 is fixed to the robot base 22 with its origin arranged at the center of the robot base 22 and its z-axis being parallel (specifically, identical) to the rotation axis of the rotating body 24.

另一方面,工具座標系C2為規定機器人座標系C1中之機械手50之位置之座標系。例如,工具座標系C2以其之原點(所謂之TCP(Tool Centre Position:工具中心點))配置於吸引式手54之吸入口84之中心,其之z軸與軸線A3平行(具體而言,一致)之方式,固定於機械手50。On the other hand, the tool coordinate system C2 is a coordinate system that specifies the position of the manipulator 50 in the robot coordinate system C1. For example, the tool coordinate system C2 is fixed to the manipulator 50 in such a way that its origin (so-called TCP (Tool Center Position)) is located at the center of the suction port 84 of the suction hand 54 and its z-axis is parallel to (specifically, coincident with) the axis A3.

使機械手50移動時,控制裝置20之處理器40於機器人座標系C1中設定工具座標系C2,以將機械手50定位於由設定之該工具座標系C2表示之位置之方式,產生對機器人12之各伺服馬達32之指令。如此,控制裝置20可將機械手50定位於機器人座標系C1中之任意位置。另,本說明書中,「位置」有表示位置及姿勢之情形。When the robot 50 is moved, the processor 40 of the control device 20 sets the tool coordinate system C2 in the robot coordinate system C1, and generates instructions to the servo motors 32 of the robot 12 in such a manner that the robot 50 is positioned at the position represented by the set tool coordinate system C2. In this way, the control device 20 can position the robot 50 at any position in the robot coordinate system C1. In addition, in this specification, "position" may represent both position and posture.

接著,對機器人系統10之功能進行說明。本實施形態中,如圖11所示,尺寸、形狀、質量或材質等不同之各種物品W分散堆積於容器H內。作為一例,物品W為將商品(食品、藥品、雜貨等)收容於內部之定形之包裝箱,且由紙材或樹脂材等構成,具有平滑或凹凸之外表面。再者,作為其他例,物品W為具有較定形之包裝箱高之可撓性之不定形之包裝袋(乙烯樹脂袋、包裝紙等),且由紙材或樹脂等構成。Next, the function of the robot system 10 is described. In this embodiment, as shown in FIG. 11 , various articles W of different sizes, shapes, masses or materials are dispersed and stacked in a container H. As an example, the article W is a fixed-shaped packaging box that contains goods (food, medicine, groceries, etc.) and is made of paper or resin and has a smooth or uneven outer surface. Furthermore, as another example, the article W is an indeterminate packaging bag (vinyl bag, wrapping paper, etc.) with higher flexibility than a fixed-shaped packaging box and is made of paper or resin.

控制裝置20之處理器40使移動機構部34動作而移動機械手50,執行以該機械手50握持容器H內之物品W,並取出至容器H外之握持動作。以下,參照圖12,對物品握持作業之流程進行說明。處理器40於自操作員、上階控制器或電腦程式PG受理作業開始指令時,開始圖12所示之流程。另,處理器40亦可依照預先記憶於記憶體42之電腦程式PG,執行圖12所示之流程。The processor 40 of the control device 20 operates the moving mechanism 34 to move the robot 50, and performs the holding operation of holding the article W in the container H and taking it out of the container H. The following is a description of the process of the article holding operation with reference to FIG. 12. When the processor 40 receives the operation start instruction from the operator, the upper controller or the computer program PG, it starts the process shown in FIG. 12. In addition, the processor 40 can also execute the process shown in FIG. 12 according to the computer program PG pre-stored in the memory 42.

步驟S1中,處理器40藉由視覺感測器14拍攝物品W。具體而言,處理器40啟動配置於攝像位置αi之視覺感測器14,使其拍攝容器C內之物品W。處理器40自視覺感測器14取得拍攝之物品W之圖像資料ID(例如,3維點群圖像資料或距離圖像資料)。In step S1, the processor 40 uses the visual sensor 14 to photograph the object W. Specifically, the processor 40 activates the visual sensor 14 disposed at the photographing position αi to photograph the object W in the container C. The processor 40 obtains the image data ID (e.g., 3D point group image data or distance image data) of the photographed object W from the visual sensor 14.

步驟S2中,處理器40取得握持對象之物品W之表面尺寸SZ。具體而言,處理器40分析前一刻之步驟S1中取得之圖像資料ID,自該圖像ID中映現之複數個物品W中決定作為握持對象之物品W。此時,處理器40亦可將機器人座標系C1之z座標(換言之,鉛直方向之高度)最大之1個物品W決定為握持對象。接著,處理器40基於圖像資料ID,特定作為握持對象之物品W之朝向上側之表面Ws,取得該表面Ws之尺寸SZ(例如,表面積)。In step S2, the processor 40 obtains the surface size SZ of the object W to be held. Specifically, the processor 40 analyzes the image data ID obtained in the previous step S1, and determines the object W to be held from the multiple objects W shown in the image ID. At this time, the processor 40 can also determine the object W with the largest z coordinate (in other words, the height in the vertical direction) of the robot coordinate system C1 as the object to be held. Then, based on the image data ID, the processor 40 specifies the upward surface Ws of the object W to be held, and obtains the size SZ (for example, the surface area) of the surface Ws.

步驟S3中,處理器40判定對握持對象之物品W進行握持之握持動作中是否使用吸引式手54。例如,處理器40判定前一刻之步驟S2中取得之表面尺寸SZ是否小於小吸附手92及94之1個吸附口114之開口尺寸R2。In step S3, the processor 40 determines whether the suction hand 54 is used in the holding action of holding the object W. For example, the processor 40 determines whether the surface size SZ obtained in the previous step S2 is smaller than the opening size R2 of one suction port 114 of the small suction hands 92 and 94.

此處,假設表面尺寸SZ小於1個吸附口114之開口尺寸R2之情形時,即使使吸附墊110之前端面112與物品W之表面Ws面接觸,亦於前端面112與表面Ws之間產生間隙。該情形時,無法於吸附墊110之內部形成負壓ρ3,無法使物品W吸附於吸附口114。這對於具有更大開口尺寸R1之大吸附手88及90之吸附口104亦同樣。Here, if the surface size SZ is smaller than the opening size R2 of one suction port 114, even if the front end surface 112 of the suction pad 110 is brought into surface contact with the surface Ws of the article W, a gap is generated between the front end surface 112 and the surface Ws. In this case, the negative pressure ρ3 cannot be formed inside the suction pad 110, and the article W cannot be sucked into the suction port 114. This is also true for the suction ports 104 of the large suction hands 88 and 90 having a larger opening size R1.

此種情形時,有效的是使用吸引式手54吸引握持物品W。該步驟S3中,處理器40將步驟S2中取得之表面尺寸SZ與1個吸附口114之開口尺寸R2(例如,由開口尺寸R2表示之表面積)進行比較,於表面尺寸SZ小於開口尺寸R2之情形時,判定為使用吸引式手54(即,是(YES))。處理器40於判定為是之情形時,進入步驟S5,另一方面,於判定為否(NO)之情形時,進入步驟S4。In this case, it is effective to use the suction hand 54 to suck and hold the article W. In step S3, the processor 40 compares the surface size SZ obtained in step S2 with the opening size R2 of one suction port 114 (for example, the surface area represented by the opening size R2). When the surface size SZ is smaller than the opening size R2, the processor 40 determines that the suction hand 54 is used (that is, YES). When the processor 40 determines that it is YES, it proceeds to step S5. On the other hand, when the processor 40 determines that it is NO, it proceeds to step S4.

步驟S4中,處理器40執行吸附式手56之握持動作之方案。參照圖13,對該步驟S4進行說明。步驟S11中,處理器40根據最近之步驟S2中取得之表面尺寸SZ,決定用於握持動作之吸附口104之個數N1與吸附口114之個數N2。此處,本實施形態中,預先設定各自規定有用於握持動作之吸附口104之個數N1與吸附口114之個數N2之複數個吸附模式。將該吸附模式之一例顯示於圖14。圖14所示之例中,規定有7個吸附模式1~7。圖14中,「N1」行表示吸附口104之個數N1,「N2」行表示吸附口114之個數N2。In step S4, the processor 40 executes the plan of the holding action of the suction hand 56. Referring to Figure 13, the step S4 is explained. In step S11, the processor 40 determines the number N1 of suction ports 104 and the number N2 of suction ports 114 used for the holding action based on the surface size SZ obtained in the most recent step S2. Here, in the present embodiment, a plurality of suction modes, each of which specifies the number N1 of suction ports 104 and the number N2 of suction ports 114 used for the holding action, are pre-set. An example of the suction mode is shown in Figure 14. In the example shown in Figure 14, 7 suction modes 1 to 7 are specified. In Figure 14, the "N1" row represents the number N1 of suction ports 104, and the "N2" row represents the number N2 of suction ports 114.

例如,吸附模式4中,由於N1=0且N2=2,故規定使用2個吸附口114(即,小吸附手92及94),執行握持動作。另一方面,吸附模式7中,由於N1=2且N2=2,故規定使用2個吸附口104(即,大吸附手88及90)與2個吸附口114(即,小吸附手92及94),執行握持動作。For example, in suction mode 4, since N1=0 and N2=2, it is specified that two suction ports 114 (i.e., small suction hands 92 and 94) are used to perform the holding action. On the other hand, in suction mode 7, since N1=2 and N2=2, it is specified that two suction ports 104 (i.e., large suction hands 88 and 90) and two suction ports 114 (i.e., small suction hands 92 and 94) are used to perform the holding action.

本實施形態中,預先準備如圖14所示之吸附模式之資料表DT1,並記憶於記憶體42。該步驟S11中,處理器40根據最近取得之表面尺寸SZ,選擇複數個吸附模式1~7中之1個,藉此決定個數N1與個數N2。此處,表面尺寸SZ之範圍與各個吸附模式1~7建立關聯。In this embodiment, a data table DT1 of the adsorption mode as shown in FIG. 14 is prepared in advance and stored in the memory 42. In step S11, the processor 40 selects one of the plurality of adsorption modes 1 to 7 according to the surface size SZ obtained most recently, thereby determining the number N1 and the number N2. Here, the range of the surface size SZ is associated with each of the adsorption modes 1 to 7.

例如,SZ n≦SZ<SZ n+1之範圍與1個吸附模式n(n=1、2、3、…)建立關聯。該情形時,閾值SZ n亦可以吸附模式n所規定之個數N1與吸附口104之開口尺寸R1(表面積)之積(=N1×R1),及吸附模式n所規定之個數N2與吸附口114之開口尺寸R2(表面積)之積(=N2×R2)的和(=N1×R1+N2×R2)為基準(例如,以與和一致之方式)預先設定。 For example, the range of SZn ≦SZ<SZn +1 is associated with one adsorption mode n (n=1, 2, 3, ...). In this case, the threshold SZn can also be pre-set based on the product of the number N1 specified by the adsorption mode n and the opening size R1 (surface area) of the adsorption port 104 (=N1×R1), and the sum (=N1×R1+N2×R2) of the number N2 specified by the adsorption mode n and the opening size R2 (surface area) of the adsorption port 114 (=N2×R2).

如此,表面尺寸SZ之範圍與複數個吸附模式n之各者建立關聯。處理器40將最近取得之表面尺寸SZ應用於資料表DT1,自複數個吸附模式1~7中選擇對應於該表面尺寸SZ之1個吸附模式n。如此,處理器40可將選擇之吸附模式n所規定之個數N1及N2決定為用於握持動作之吸附口104之個數N1與吸附口114之個數N2。In this way, the range of the surface size SZ is associated with each of the plurality of adsorption patterns n. The processor 40 applies the most recently acquired surface size SZ to the data table DT1, and selects one adsorption pattern n corresponding to the surface size SZ from the plurality of adsorption patterns 1 to 7. In this way, the processor 40 can determine the number N1 and N2 specified by the selected adsorption pattern n as the number N1 of the adsorption ports 104 and the number N2 of the adsorption ports 114 used for the holding action.

步驟S12中,處理器40開始以吸附式手56對握持對象之物品W進行握持之握持動作。以下,對處理器40於前一刻之步驟S11中,選擇圖14所示之吸附模式3(N1=1,N2=2)之情形進行說明。該情形時,處理器40啟動連接於大吸附手90之排氣裝置18B,與連接於小吸附手92之排氣裝置18C。In step S12, the processor 40 starts to hold the object W with the suction hand 56. The following describes the case where the processor 40 selects suction mode 3 (N1=1, N2=2) shown in FIG. 14 in the previous step S11. In this case, the processor 40 activates the exhaust device 18B connected to the large suction hand 90 and the exhaust device 18C connected to the small suction hand 92.

且,處理器40使移動機構部34動作而使機械手50向握持對象之物品W移動。其結果,如圖15所示,大吸附手90之吸附墊96之前端面102與小吸附手92之吸附墊110之前端面112抵壓於物品W之表面Ws並與該表面Ws氣密性面接觸。此時,藉由吸附墊96及110於軸向靈活變形,而可使前端面102及112與表面Ws有效地面接觸。如此,於吸附墊96及110之內部劃定密閉空間。Furthermore, the processor 40 operates the moving mechanism 34 to move the robot 50 toward the object W to be held. As a result, as shown in FIG15 , the front end face 102 of the suction pad 96 of the large suction hand 90 and the front end face 112 of the suction pad 110 of the small suction hand 92 are pressed against the surface Ws of the object W and are in airtight surface contact with the surface Ws. At this time, the front end faces 102 and 112 can be effectively in surface contact with the surface Ws by the flexible deformation of the suction pads 96 and 110 in the axial direction. In this way, a closed space is defined inside the suction pads 96 and 110.

其結果,於在吸附墊96及110之內部劃定之密閉空間,藉由排氣裝置18B及18C之作用,分別形成負壓ρ2及ρ3。物品W藉由如此形成於密閉空間(即,吸附口104及114)之負壓ρ2及ρ3,氣密性吸附於吸附口104及114。如此,物品W由大吸附手90與小吸附手92吸附握持。As a result, negative pressures ρ2 and ρ3 are formed in the closed space defined inside the suction pads 96 and 110 respectively by the exhaust devices 18B and 18C. The object W is airtightly adsorbed to the suction ports 104 and 114 by the negative pressures ρ2 and ρ3 thus formed in the closed space (i.e., the suction ports 104 and 114). In this way, the object W is adsorbed and held by the large suction hand 90 and the small suction hand 92.

此處,於執行步驟S12之握持動作之期間,以吸附墊96及110吸附握持物品W時,藉由該吸附墊96及110於軸向變形,可將物品W向手基座52向上方提起。此時,吸引式手54之吸引墊76可與物品W之表面Ws抵接。Here, during the holding action of step S12, when the object W is held by the suction pads 96 and 110, the object W can be lifted upward toward the hand base 52 by the axial deformation of the suction pads 96 and 110. At this time, the suction pad 76 of the suction hand 54 can contact the surface Ws of the object W.

步驟S13中,處理器40判定握持動作是否失敗。例如,機器人系統10進而具備可檢測形成於大吸附手88及90、以及小吸附手92及94各者之內部之負壓ρ2及ρ3之壓力感測器PS(未圖示)。處理器40於握持動作中使機械手50向握持對象移動之期間,監視大吸附手90之負壓ρ2與小吸附手92之負壓ρ3。In step S13, the processor 40 determines whether the gripping action fails. For example, the robot system 10 is further provided with a pressure sensor PS (not shown) that can detect the negative pressures ρ2 and ρ3 formed inside the large suction hands 88 and 90, and the small suction hands 92 and 94, respectively. The processor 40 monitors the negative pressure ρ2 of the large suction hand 90 and the negative pressure ρ3 of the small suction hand 92 while the robot hand 50 moves toward the gripping object in the gripping action.

處理器40於大吸附手90之負壓ρ2與小吸附手92之負壓ρ3之至少一者未超出規定之閾值ρ th之情形時,判定為是,進入步驟S14。另一方面,處理器40於大吸附手90之負壓ρ2與小吸附手92之負壓ρ3全部超出閾值ρ th之情形時,判定為否,進入步驟S17。 When at least one of the negative pressure ρ2 of the large suction hand 90 and the negative pressure ρ3 of the small suction hand 92 does not exceed the prescribed threshold ρ th , the processor 40 determines that it is yes and proceeds to step S14. On the other hand, when both the negative pressure ρ2 of the large suction hand 90 and the negative pressure ρ3 of the small suction hand 92 exceed the threshold ρ th , the processor 40 determines that it is no and proceeds to step S17.

步驟S14中,處理器40判定握持動作失敗之次數Nf是否達到規定之次數Nf th。此處,處理器40於步驟S13中判定為是,於步驟S14及S15中判定為否之期間,重複執行步驟S11~S16之循環。處理器40於重複步驟S11~S16之循環之期間,計數步驟S13中判定為是之次數Nf。且,處理器40於該步驟S14中,於該次數Nf達到規定之次數Nf th(例如,Nf th=3次)之情形時,判定為是,返回至圖12中之步驟S1,另一方面,於判定為否之情形時,進入步驟S15。 In step S14, the processor 40 determines whether the number of times Nf of failed gripping actions has reached a specified number of times Nf th . Here, the processor 40 repeats the loop of steps S11 to S16 when it is determined to be yes in step S13 and when it is determined to be no in steps S14 and S15. During the period of repeating the loop of steps S11 to S16, the processor 40 counts the number of times Nf of the times determined to be yes in step S13. In addition, in step S14, when the number of times Nf reaches a specified number of times Nf th (for example, Nf th = 3 times), the processor 40 determines to be yes and returns to step S1 in FIG. 12 . On the other hand, when it is determined to be no, it proceeds to step S15.

步驟S15中,處理器40判定最近之步驟S11中決定之個數N1及N2是否為圖14中之吸附模式1之個數(N1=0,N2=1)。處理器40於判定為是之情形時,進入圖12中之步驟S5,另一方面,於判定為否之情形時,進入步驟S16。In step S15, the processor 40 determines whether the numbers N1 and N2 determined in the most recent step S11 are the numbers of adsorption mode 1 in FIG14 (N1=0, N2=1). When the processor 40 determines that it is yes, it proceeds to step S5 in FIG12, and when it determines that it is no, it proceeds to step S16.

步驟S16中,處理器40執行機器人12之退避動作。具體而言,處理器40使機器人12之移動機構部34動作而使機械手50自最近之步驟S13中判定為是之位置,向機器人座標系C1之z軸正方向(即,鉛直上方)退避規定之距離。其結果,機械手50向容器之外側退避。In step S16, the processor 40 executes the retreat action of the robot 12. Specifically, the processor 40 operates the moving mechanism 34 of the robot 12 to make the robot 50 retreat a predetermined distance from the nearest position determined as yes in step S13 to the positive direction of the z-axis of the robot coordinate system C1 (i.e., directly upward). As a result, the robot 50 retreats to the outside of the container.

其後,處理器40返回至步驟S11,再次決定個數N1與個數N2。此處,本實施形態中,於步驟S16之後執行步驟S11之情形時,選擇將上一次之步驟S11中選擇之吸附模式n之識別編號「n」往前推1個之吸附模式n-1。即,處理器40於步驟S11中選擇吸附模式n(n=2、3、4、…),接著,執行步驟S12~S16後,再次執行步驟S11。該情形時,處理器40選擇吸附模式n-1。Afterwards, the processor 40 returns to step S11 and determines the number N1 and the number N2 again. Here, in this embodiment, when step S11 is executed after step S16, the adsorption mode n-1 is selected by pushing the identification number "n" of the adsorption mode n selected in the previous step S11 forward by one. That is, the processor 40 selects adsorption mode n (n=2, 3, 4, ...) in step S11, and then, after executing steps S12 to S16, executes step S11 again. In this case, the processor 40 selects adsorption mode n-1.

若更具體敘述,則假設於第1次步驟S11中選擇吸附模式3(N1=1,N2=1),其後執行步驟S12~S16,之後執行第2次步驟S11。該情形時,處理器40於第2次步驟S11中,選擇吸附模式2(N1=1,N2=0)。To be more specific, assume that in the first step S11, adsorption mode 3 (N1=1, N2=1) is selected, and then steps S12 to S16 are executed, and then the second step S11 is executed. In this case, the processor 40 selects adsorption mode 2 (N1=1, N2=0) in the second step S11.

吸附模式3(第1吸附模式)之個數N1及N2之總數Ns(=N1+N2)為2個,另一方面,吸附模式2(第2吸附模式)之個數N1及N2之總數Ns為1個。即,該情形時,處理器40於依照第1次步驟S11中選擇之吸附模式3執行之握持動作失敗之情形時,選擇個數N1及N2之總數Ns較該吸附模式3少之吸附模式2,依照該吸附模式2,再次於步驟S12中執行握持動作。另,於第1次步驟S11中選擇吸附模式7或6後,執行第2次步驟S11之情形亦同樣,處理器40選擇總數Ns減少1個之吸附模式6或5。The total number Ns (= N1 + N2) of the number N1 and N2 of adsorption mode 3 (the first adsorption mode) is 2. On the other hand, the total number Ns of the number N1 and N2 of adsorption mode 2 (the second adsorption mode) is 1. That is, in this case, when the holding action performed according to adsorption mode 3 selected in the first step S11 fails, the processor 40 selects adsorption mode 2 whose total number Ns of the number N1 and N2 is less than that of adsorption mode 3, and performs the holding action again in step S12 according to adsorption mode 2. In addition, after selecting adsorption mode 7 or 6 in the first step S11, the same is true when executing the second step S11. The processor 40 selects adsorption mode 6 or 5 whose total number Ns is reduced by 1.

另一方面,於第1次步驟S11中選擇吸附模式5,其後執行第2次步驟S11之情形時,處理器40於第2次步驟S11中,選擇吸附模式4。該情形時,吸附模式5(第1吸附模式)中規定了吸附口104之個數N1=2,另一方面,規定了吸附口114之個數N2=0。On the other hand, when the adsorption mode 5 is selected in the first step S11 and the second step S11 is executed thereafter, the processor 40 selects the adsorption mode 4 in the second step S11. In this case, the number N1 of the adsorption ports 104 is specified to be 2 in the adsorption mode 5 (the first adsorption mode), and the number N2 of the adsorption ports 114 is specified to be 0.

又,吸附模式4(第2吸附模式)中,規定了吸附口104之個數N1=0,另一方面,規定了吸附口114之個數N2=2。即,該情形時,處理器40於依照第1次步驟S11中選擇之吸附模式5執行之握持動作失敗之情形時,選擇雖總數Ns相同,但用於握持動作之吸附口之開口尺寸R變得更小之吸附模式4,依照該吸附模式4,再次於步驟S12中執行握持動作。另,於第1次之步驟S11中選擇吸附模式4或2後,執行第2次之步驟S11之情形亦同樣,處理器40選擇雖總數Ns相同但開口尺寸R更小之吸附模式3或1。Furthermore, in suction mode 4 (second suction mode), the number of suction ports 104 N1=0 is specified, and on the other hand, the number of suction ports 114 N2=2 is specified. That is, in this case, when the gripping action performed according to suction mode 5 selected in the first step S11 fails, the processor 40 selects suction mode 4 in which the opening size R of the suction port used for the gripping action becomes smaller although the total number Ns is the same, and the gripping action is performed again in step S12 according to the suction mode 4. In addition, after suction mode 4 or 2 is selected in the first step S11, the second step S11 is executed in the same manner, and the processor 40 selects suction mode 3 or 1 in which the opening size R is smaller although the total number Ns is the same.

如上所述,處理器40於步驟S16之後執行步驟S11之情形時,選擇吸附模式n-1,依照該模式n-1再次執行步驟S12。此時,處理器40藉由使機械手50繞軸線A1(即,軸線A2及A3)旋轉,可將用於握持動作之吸附口104及114自吸附模式n切換為吸附模式n-1。As described above, when the processor 40 executes step S11 after step S16, it selects the adsorption mode n-1 and executes step S12 again according to the mode n-1. At this time, the processor 40 can switch the adsorption ports 104 and 114 used for the holding action from the adsorption mode n to the adsorption mode n-1 by rotating the robot 50 around the axis A1 (i.e., the axes A2 and A3).

例如,第1次步驟S12中,依照圖14之吸附模式5(N1=2,N2=0),以圖5之大吸附手88及90進行握持動作。接著,處理器40於第2次步驟S12中,依照吸附模式4(N1=0,N2=2),以小吸附手92及94進行握持動作。該情形時,處理器40藉由使機械手50繞軸線A1旋轉角度θ1(90°),而可自吸附模式5切換為吸附模式4。For example, in the first step S12, the large suction hands 88 and 90 in FIG. 5 perform a gripping action according to the suction mode 5 (N1=2, N2=0) in FIG. 14. Then, in the second step S12, the processor 40 performs a gripping action according to the suction mode 4 (N1=0, N2=2) with the small suction hands 92 and 94. In this case, the processor 40 can switch from the suction mode 5 to the suction mode 4 by rotating the robot hand 50 around the axis A1 by an angle θ1 (90°).

再次參照圖13,步驟S13中判定為否之情形時,步驟S17中,處理器40繼續握持動作。具體而言,作為握持動作,處理器40如圖15所示,使以吸附式手56(具體而言,大吸附手90與小吸附手92)吸附握持容器H內之物品W之機械手50向規定之取出方向DR1退避。該取出方向DR1例如定為機器人座標系C1之z軸正方向(即,鉛直上方)。藉此,將物品W自容器H取出。於該握持動作之期間,處理器40繼續監視由上述壓力感測器PS檢測之負壓ρ2及ρ3。Referring to FIG. 13 again, when the determination in step S13 is negative, in step S17, the processor 40 continues the holding action. Specifically, as a holding action, the processor 40 causes the robot 50 that holds the object W in the container H by the suction hand 56 (specifically, the large suction hand 90 and the small suction hand 92) to retreat in a specified removal direction DR1 as shown in FIG. The removal direction DR1 is, for example, defined as the positive direction of the z-axis of the robot coordinate system C1 (i.e., directly upward). In this way, the object W is taken out of the container H. During the holding action, the processor 40 continues to monitor the negative pressures ρ2 and ρ3 detected by the pressure sensor PS.

步驟S18中,處理器40與上述步驟S13同樣,判定握持動作是否失敗。具體而言,處理器40於壓力感測器PS檢測出之負壓ρ2及ρ3之至少一者低於規定之閾值之情形時,判定為是,進入圖12中之步驟S1。另一方面,處理器40於判定為否之情形時,進入步驟S19。In step S18, the processor 40 determines whether the gripping action fails, similarly to the above step S13. Specifically, when at least one of the negative pressures ρ2 and ρ3 detected by the pressure sensor PS is lower than a predetermined threshold, the processor 40 determines that it is a failure and proceeds to step S1 in FIG. 12. On the other hand, when the processor 40 determines that it is a failure, it proceeds to step S19.

步驟S19中,處理器40判定握持動作是否結束。具體而言,處理器40於使機械手50自以吸附式手56吸附握持物品W時(具體而言,步驟S13中判定為否)之位置,向取出方向DR1退避至規定之位置α1時,判定為是。該位置α1可定為自容器H之開口端He(圖11)向取出方向DR1(機器人座標系C1之z軸正方向)隔開規定距離Δ之位置。該距離Δ例如預先設定為分散堆積於容器H內之各種物品W中之最長型物品之長度以上之距離。In step S19, the processor 40 determines whether the holding action is completed. Specifically, the processor 40 determines that it is yes when the robot 50 retreats from the position when the suction hand 56 holds the object W by suction (specifically, it is determined as no in step S13) to the predetermined position α1 in the removal direction DR1. The position α1 can be defined as a position separated by a predetermined distance Δ from the opening end He (Figure 11) of the container H in the removal direction DR1 (the positive direction of the z-axis of the robot coordinate system C1). The distance Δ is, for example, pre-set to a distance greater than the length of the longest object among the various objects W dispersedly stacked in the container H.

處理器40於判定為是之情形時,進入圖12中之步驟S6,另一方面,於判定為否之情形時,返回至步驟S18。該步驟S19中判定為是時,機器人50握持之物品W之與取出方向DR1為相反方向之端部We(圖15)配置於較容器H之開口端He(圖11)向該取出方向DR1隔開距離Δ之位置。When the processor 40 determines that it is yes, it proceeds to step S6 in FIG. 12 , and when it determines that it is no, it returns to step S18 . When the processor 40 determines that it is yes in step S19 , the end We ( FIG. 15 ) of the object W held by the robot 50 in the opposite direction to the taking-out direction DR1 is arranged at a position spaced apart from the opening end He ( FIG. 11 ) of the container H in the taking-out direction DR1 by a distance Δ.

再次參照圖12,步驟S3或圖13中之步驟S15中判定為是時,步驟S5中,處理器40執行吸引式手54之握持動作之方案。參照圖16,對該步驟S5進行說明。步驟S21中,處理器40執行以吸引式手54握持握持對象之物品W之握持動作。Referring again to Fig. 12, when the judgment is yes in step S3 or step S15 in Fig. 13, in step S5, the processor 40 executes the scheme of the holding action of the suction hand 54. Referring to Fig. 16, the step S5 is explained. In step S21, the processor 40 executes the holding action of the object W of the holding object with the suction hand 54.

具體而言,處理器40首先啟動排氣裝置16,開始自吸引式手54之吸入口84吸入外氣之動作。接著,處理器40使移動機構部34動作而使機械手50向握持對象之物品W移動。其結果,如圖17所示,吸引墊76之前端面82與握持對象之物品W接觸,藉由以最大流量E1吸入至吸入口84之外氣之流動,該物品W被吸引至該吸入口84。Specifically, the processor 40 first activates the exhaust device 16 to start the action of sucking outside air from the suction port 84 of the suction hand 54. Then, the processor 40 operates the moving mechanism 34 to move the robot hand 50 toward the object W to be held. As a result, as shown in FIG. 17 , the front end surface 82 of the suction pad 76 contacts the object W to be held, and the object W is sucked into the suction port 84 by the flow of outside air sucked into the suction port 84 at the maximum flow rate E1.

此處,本實施形態中,圖16所示之步驟S5之流程於上述步驟S3中判定為是時(即,物品W之表面尺寸SZ小於吸附口114之開口尺寸R2之情形),或圖13中之步驟S15中判定為是時(即,以吸附模式1(僅1個吸附口114)握持動作失敗之情形)執行。因此,執行該步驟S5時,作為握持對象之物品W之表面尺寸SZ可能小至無法以1個吸附口114吸附之程度。Here, in this embodiment, the process of step S5 shown in FIG. 16 is executed when the determination in the above step S3 is yes (i.e., the surface size SZ of the object W is smaller than the opening size R2 of the suction port 114), or when the determination in step S15 in FIG. 13 is yes (i.e., the holding action in suction mode 1 (only one suction port 114) fails). Therefore, when executing step S5, the surface size SZ of the object W to be held may be so small that it cannot be sucked by one suction port 114.

因此,於將物品W吸引至吸入口84之狀態下,可能於吸引墊76之前端面82與物品W之間形成間隙G,通過該間隙G,大流量之外氣持續吸入至吸入口84。藉由此種外氣之流動,吸引式手54可將表面尺寸SZ較小之物品W持續吸引握持於吸入口84。Therefore, when the article W is sucked into the suction port 84, a gap G may be formed between the front end surface 82 of the suction pad 76 and the article W, and a large amount of external air is continuously sucked into the suction port 84 through the gap G. By the flow of such external air, the suction hand 54 can continuously suck and hold the article W with a small surface size SZ in the suction port 84.

另,由於形成上述間隙G,故圖17所示狀態之吸引墊76之內部不能成為密閉空間,因而,此時形成於吸引墊76內部之負壓ρ1’遠小於上述負壓ρ2及ρ3(|ρ1’|≪|ρ2|及|ρ3|)。換言之,吸引式手54並非藉由吸引墊76之負壓ρ1’吸引握持物品W,而藉由吸入至吸入口84之外氣之流動吸引握持物品W。如此,吸引式手54以與上述吸附式手56之「吸附式」不同之「吸引式」握持物品W。In addition, due to the formation of the above-mentioned gap G, the inside of the suction pad 76 in the state shown in FIG. 17 cannot become a closed space, and therefore, the negative pressure ρ1' formed inside the suction pad 76 at this time is much smaller than the above-mentioned negative pressures ρ2 and ρ3 (|ρ1'|≪|ρ2| and|ρ3|). In other words, the suction hand 54 does not suck and hold the object W by the negative pressure ρ1' of the suction pad 76, but sucks and holds the object W by the flow of the outside air sucked into the suction port 84. In this way, the suction hand 54 holds the object W by a "suction method" different from the "suction method" of the above-mentioned suction hand 56.

步驟S22中,處理器40判定握持動作是否失敗。例如,機器人系統10進而具備可檢測於吸引式手54(具體而言,可動臂部80及固定臂部78)之內部流動之外氣之流量E之流量感測器FS(未圖示)。處理器40於握持動作中使機械手50向握持對象移動之期間,監視流量感測器FS檢測出之流量E。處理器40於監視之流量E未以低於規定之閾值E th之方式變化之情形時,判定為是,進入步驟S23。另一方面,處理器40於流量E以低於閾值E th之方式變化之情形時,判定為否,進入步驟S25。 In step S22, the processor 40 determines whether the holding action fails. For example, the robot system 10 is further provided with a flow sensor FS (not shown) that can detect the flow rate E of the external air flowing inside the suction hand 54 (specifically, the movable arm 80 and the fixed arm 78). The processor 40 monitors the flow rate E detected by the flow sensor FS while the robot hand 50 moves toward the holding object in the holding action. When the monitored flow rate E does not change in a manner lower than the specified threshold E th , the processor 40 determines that it is yes and proceeds to step S23. On the other hand, when the flow rate E changes in a manner lower than the threshold E th , the processor 40 determines that it is no and proceeds to step S25.

步驟S23中,處理器40與上述步驟S14同樣,判定握持動作失敗之次數Nf是否達到規定之次數Nf th。處理器40於判定為是之情形時,進入圖12中之步驟S1,另一方面,於判定為否之情形時,進入步驟S24。另,該步驟S23中作為閾值參照之次數Nf th可與上述步驟S14相同,亦可不同。步驟S24中,處理器40與上述步驟S16同樣,於執行機器人12之退避動作後,返回至步驟S21。 In step S23, the processor 40 determines whether the number of times Nf of failed gripping actions has reached the specified number Nfth , similar to the above step S14. When the processor 40 determines that it is yes, it proceeds to step S1 in FIG. 12. On the other hand, when the processor 40 determines that it is no, it proceeds to step S24. In addition, the number Nfth used as a threshold reference in step S23 may be the same as that in step S14, or may be different. In step S24, the processor 40 returns to step S21 after executing the retreat action of the robot 12, similar to the above step S16.

另一方面,步驟S22中判定為否之情形時,步驟S25中,處理器40與上述步驟S17同樣地繼續握持動作,如圖17所示,使以吸引式手54吸引握持物品W之機械手50向取出方向DR1退避。於該握持動作之期間,處理器40繼續監視由上述流量感測器FS檢測之流量E。On the other hand, if the determination in step S22 is negative, in step S25, the processor 40 continues the holding action as in step S17, and as shown in FIG17, the robot 50 holding the article W by the suction hand 54 is made to retreat in the taking-out direction DR1. During the holding action, the processor 40 continues to monitor the flow rate E detected by the flow sensor FS.

步驟S26中,處理器40與上述步驟S22同樣,判定握持動作是否失敗。處理器40於判定為是之情形時,進入圖12中之步驟S1,另一方面,於判定為否之情形時,進入步驟S27。步驟S27中,處理器40與上述步驟S19同樣,判定握持動作是否結束(即,是否已使機械手50退避至位置α1),判定為是之情形時,進入圖12中之步驟S6,另一方面,於判定為否之情形時,返回至步驟S26。In step S26, the processor 40 determines whether the holding action has failed, similarly to the above step S22. When the processor 40 determines that it is yes, it proceeds to step S1 in FIG. 12, and when it determines that it is no, it proceeds to step S27. In step S27, the processor 40 determines whether the holding action has ended (i.e., whether the robot 50 has retreated to position α1), similarly to the above step S19, and when it determines that it is yes, it proceeds to step S6 in FIG. 12, and when it determines that it is no, it returns to step S26.

再次參照圖12,步驟S6中,處理器40執行將以機械手50取出之物品W搬送至指定之保管場所SL,並放置於該保管場所SL之搬送動作。具體而言,處理器40使移動機構部34動作,使握持有物品W之機械手50自上述位置α1朝與握持動作中之取出方向DR1交叉(例如正交)之方向DR2移動。例如,方向DR2定為沿機器人座標系C1之x-y平面之方向(即,水平方向)。Referring again to FIG. 12 , in step S6, the processor 40 performs a transporting operation to transport the article W taken out by the robot 50 to the designated storage location SL and place it in the storage location SL. Specifically, the processor 40 operates the moving mechanism 34 to move the robot 50 holding the article W from the above-mentioned position α1 toward a direction DR2 that intersects (e.g., is orthogonal to) the taking-out direction DR1 in the holding operation. For example, the direction DR2 is defined as a direction along the x-y plane of the robot coordinate system C1 (i.e., a horizontal direction).

且,處理器40使機械手50移動至保管場所SL上之指定位置α2時,使移動機構部34停止,接著,使機械手50動作而釋放握持之物品W。例如,於步驟S4之後執行步驟S6之情形時,處理器40藉由使排氣裝置18B及18C停止,而消除大吸附手90內部之負壓ρ2與小吸附手92內部之負壓ρ3。Furthermore, when the processor 40 moves the robot 50 to the designated position α2 on the storage location SL, the moving mechanism 34 stops, and then the robot 50 moves to release the gripped object W. For example, when executing step S6 after step S4, the processor 40 stops the exhaust devices 18B and 18C to eliminate the negative pressure ρ2 inside the large suction hand 90 and the negative pressure ρ3 inside the small suction hand 92.

或者,於步驟S5之後執行步驟S6之情形時,處理器40藉由使排氣裝置16停止,而停止自吸入口84吸入外氣之動作。其結果,機械手50可釋放握持之物品W,將其放置於保管場所SL。步驟S7中,處理器40判定取出容區H內之所有物品W之作業是否完成。處理器40於判定為是之情形時,結束圖12所示之流程,另一方面,於判定為否之情形時,返回至步驟S1。Alternatively, when executing step S6 after step S5, the processor 40 stops the action of sucking in the outside air from the suction port 84 by stopping the exhaust device 16. As a result, the robot 50 can release the gripped object W and place it in the storage place SL. In step S7, the processor 40 determines whether the operation of taking out all the objects W in the storage area H is completed. If the processor 40 determines that it is yes, it ends the process shown in FIG. 12. On the other hand, if the processor determines that it is no, it returns to step S1.

如上所述,本實施形態中,機器人系統10具備:機器人12,其具有包含開口尺寸R1、R2互不相同之第1吸附口104及第2吸附口114之機械手50;及控制裝置20,其使機器人12動作而移動機械手50,執行以該機械手50握持物品W之握持動作。As described above, in the present embodiment, the robot system 10 comprises: a robot 12 having a manipulator 50 including a first suction port 104 and a second suction port 114 having opening sizes R1 and R2 different from each other; and a control device 20 which moves the robot 12 to move the manipulator 50 to perform a holding action of holding the object W with the manipulator 50.

控制裝置20(具體而言,處理器40)取得握持對象之物品W之表面尺寸SZ(步驟S2),根據取得之表面尺寸SZ,決定用於握持動作之第1吸附口104之個數N1與第2吸附口114之個數N2(步驟S11)。根據該構成,由於可決定適合物品W之表面尺寸SZ之個數N1及N2,故可以決定之個數N1之吸附口104與個數N2之吸附口114,有效握持各種尺寸之物品W。又,可將此種握持並提起各種尺寸之物品W之作業自動化。The control device 20 (specifically, the processor 40) obtains the surface size SZ of the object W to be grasped (step S2), and determines the number N1 of the first suction ports 104 and the number N2 of the second suction ports 114 used for the grasping operation based on the obtained surface size SZ (step S11). According to this configuration, since the number N1 and N2 of the surface size SZ suitable for the object W can be determined, the suction ports 104 with the number N1 and the suction ports 114 with the number N2 can be determined to effectively grasp objects W of various sizes. In addition, the operation of grasping and lifting objects W of various sizes can be automated.

又,本實施形態中,預先設定各自規定有第1吸附口104之個數N1與第2吸附口114之個數N2之複數個吸附模式1~7(圖14)。且,控制裝置20藉由根據表面尺寸SZ,選擇複數個吸附模式1~7中之1個,而決定個數N1及N2(步驟S11)。根據該構成,由於可自吸附模式1~7容易且迅速決定適合表面尺寸SZ之個數N1及N2,故亦可減少決定個數N1及N2所需之運算處理量,且縮短作業之循環時間。In addition, in the present embodiment, a plurality of adsorption patterns 1 to 7 (FIG. 14) are pre-set, each of which specifies the number N1 of the first adsorption ports 104 and the number N2 of the second adsorption ports 114. Furthermore, the control device 20 determines the numbers N1 and N2 by selecting one of the plurality of adsorption patterns 1 to 7 according to the surface size SZ (step S11). According to this configuration, since the numbers N1 and N2 suitable for the surface size SZ can be easily and quickly determined from the adsorption patterns 1 to 7, the amount of computational processing required to determine the numbers N1 and N2 can be reduced, and the cycle time of the operation can be shortened.

又,本實施形態中,控制裝置20於依照選擇之第1吸附模式n(例如,n=3、6或7)執行之握持動作失敗之情形(步驟S13中是)時,選擇第1吸附口104之個數N1與第2吸附口114之個數N2之總數Ns少於第1吸附模式n之第2吸附模式n-1,依照該第2吸附模式n-1再次執行握持動作。Furthermore, in the present embodiment, when the holding action performed according to the selected first adsorption mode n (for example, n=3, 6 or 7) fails (in step S13), the control device 20 selects a second adsorption mode n-1 whose total number Ns of the number N1 of the first adsorption ports 104 and the number N2 of the second adsorption ports 114 is less than the first adsorption mode n, and performs the holding action again according to the second adsorption mode n-1.

例如,如上所述,第1次之步驟S11中選擇吸附模式3,其後於步驟S12中執行握持動作。此時,可能於物品W之表面Ws之一部分有微小凹凸。該情形時,於以1個吸附口104與1個吸附口114吸附表面Ws之情形時,可能有因該凹凸而未將吸附口104或114密閉,而無法形成負壓ρ2及ρ3之情形。或者,以1個吸附口104與1個吸附口114吸附表面Ws之情形時,可能亦有吸附口104或114自表面Ws之端緣向外方略微伸出,而未將吸附口104或114密閉之情形。此種情形時,可能導致吸附模式3之握持動作失敗。For example, as described above, the adsorption mode 3 is selected in the first step S11, and then the holding action is performed in step S12. At this time, there may be slight bumps on a portion of the surface Ws of the object W. In this case, when the surface Ws is adsorbed by one adsorption port 104 and one adsorption port 114, the adsorption port 104 or 114 may not be sealed due to the bumps, and the negative pressures ρ2 and ρ3 may not be formed. Alternatively, when the surface Ws is adsorbed by one adsorption port 104 and one adsorption port 114, the adsorption port 104 or 114 may slightly extend outward from the edge of the surface Ws, and the adsorption port 104 or 114 may not be sealed. In this case, the holding action of adsorption mode 3 may fail.

本發明者進行積極研討,結果發現,於如此吸附模式3之握持動作失敗之情形時,減少其總數Ns=2,以吸附模式2再次執行握持動作時,可提高由1個吸附口104以避開上述凹凸之方式吸附表面Ws之平滑部分之可能性。又,本發明者亦發現如下點:藉由減少總數Ns=2,若為1個吸附口104,則可減少自表面Ws之端緣向外方伸出之可能性。其結果,確認即使為1個吸附口104,亦可握持物品W。The inventors of the present invention have conducted active research and found that, when the gripping action of the suction mode 3 fails, the total number Ns=2 is reduced, and the gripping action is performed again in the suction mode 2, the possibility of the smooth part of the surface Ws being adsorbed by one suction port 104 in a manner avoiding the above-mentioned unevenness can be increased. In addition, the inventors of the present invention have also found that by reducing the total number Ns=2, if there is one suction port 104, the possibility of the edge of the surface Ws extending outward can be reduced. As a result, it was confirmed that even with one suction port 104, the object W can be gripped.

另一方面,假設若吸附模式3之握持動作成功,則可穩定握持並提起尺寸或質量更大之物品W。另,關於第1次之步驟S11中選擇吸附模式7或6後,於第2次之步驟S11中,選擇總數Ns較少之吸附模式6或5之情形,亦可確認相同效果。On the other hand, if the gripping action of the suction mode 3 is successful, it is possible to stably grip and lift an object W of larger size or mass. In addition, the same effect can be confirmed in the case where the suction mode 6 or 5 with a smaller total number Ns is selected in the second step S11 after the suction mode 7 or 6 is selected in the first step S11.

如此,根據本實施形態,首先,以總數Ns較多之吸附模式n試行握持動作,假設若成功,則即使為尺寸或質量較大之物品W,亦可穩定握持並提起,另一方面,假設失敗之情形時,亦可藉由以總數Ns較少之吸附模式n-1重試握持動作,而提高使握持動作成功之可能性。藉此,可提高作業效率,因而可縮短循環時間。Thus, according to the present embodiment, first, the gripping action is tried with the suction mode n with a larger total number Ns. If successful, even an object W with a larger size or mass can be stably gripped and lifted. On the other hand, if a failure occurs, the gripping action can be retried with the suction mode n-1 with a smaller total number Ns, thereby increasing the probability of success of the gripping action. In this way, the operation efficiency can be improved, and the cycle time can be shortened.

又,本實施形態中,第1吸附口104具有較第2吸附口114大之開口尺寸R1,第1吸附模式n(例如,n=2或5)中,將第1吸附口104之個數N1規定為1以上,另一方面,將第2吸附口114之個數N2規定為零。又,第2吸附模式n-1中,將第2吸附口114之個數N2規定為1以上,另一方面,將第1吸附口104之個數N1規定為零。Furthermore, in this embodiment, the first suction port 104 has an opening size R1 larger than that of the second suction port 114. In the first suction mode n (for example, n=2 or 5), the number N1 of the first suction ports 104 is set to 1 or more, and the number N2 of the second suction ports 114 is set to zero. Furthermore, in the second suction mode n-1, the number N2 of the second suction ports 114 is set to 1 or more, and the number N1 of the first suction ports 104 is set to zero.

且,控制裝置20於依照選擇之第1吸附模式n執行之握持動作失敗之情形時,選擇第2吸附模式n-1,依照第2吸附模式n-1再次執行握持動作。例如,如上所述,第1次之步驟S11中選擇吸附模式5,其後於步驟S12中執行握持動作。該情形時,以2個吸附口104吸附表面Ws,但此時,可能因上述凹凸或自端緣伸出,使得吸附口104未密閉,而握持動作失敗。Furthermore, when the holding action performed according to the selected first suction mode n fails, the control device 20 selects the second suction mode n-1 and performs the holding action again according to the second suction mode n-1. For example, as described above, the suction mode 5 is selected in the first step S11, and then the holding action is performed in step S12. In this case, the two suction ports 104 are used to suck the surface Ws, but at this time, the suction ports 104 may not be closed due to the above-mentioned unevenness or extension from the edge, and the holding action fails.

本發明者進行積極研討,結果確認到,於如此吸附模式5之握持動作失敗之情形時,以規定有開口尺寸R更小之吸附口114之吸附模式4再次執行握持動作時,可避免與上述凹凸之干涉或自端緣伸出,使吸附動作成功。另,關於第1次之步驟S11中選擇吸附模式2後,第2次之步驟S11中選擇吸附模式1之情形,亦可確認相同效果。The inventors of the present invention have actively studied and found that when the holding action of the suction mode 5 fails, the suction mode 4 with the suction port 114 having a smaller opening size R can be used to avoid interference with the above-mentioned concave and convex parts or extension from the edge, so that the suction action is successful. In addition, the same effect can be confirmed when the suction mode 1 is selected in the second step S11 after the suction mode 2 is selected in the first step S11.

如此,根據本實施形態,首先,以開口尺寸R較大之吸附模式n試行握持動作,假設若成功,則即使為尺寸或質量較大之物品W,亦可穩定握持並提起,另一方面,假設失敗之情形時,藉由以開口尺寸R較小之吸附模式n-1重試握持動作,可提高握持動作成功之可能性。藉此,可提高作業效率,因而可縮短循環時間。Thus, according to the present embodiment, first, the gripping action is tried with the suction mode n having a larger opening size R. If successful, even an object W with a larger size or mass can be stably gripped and lifted. On the other hand, if it fails, the gripping action can be retried with the suction mode n-1 having a smaller opening size R, thereby increasing the probability of success of the gripping action. In this way, the operation efficiency can be improved, and the cycle time can be shortened.

又,本實施形態中,複數個第1吸附口104與複數個第2吸附口114以於繞機械手50之軸線A2、A3之方向排列之方式配置。且,控制裝置20於依照第2吸附模式n-1執行握持動作時,藉由使機械手50繞軸線A2、A3旋轉,而將用於握持動作之第1吸附口104及第2吸附口114自第1吸附模式n切換為第2吸附模式n-1(例如,自上述吸附模式5切換為吸附模式4)。根據該構成,可防止機械手50之組件與周圍之環境物(例如,容器H或物品W)干涉,同時迅速且容易地切換吸附模式。Furthermore, in the present embodiment, the plurality of first suction ports 104 and the plurality of second suction ports 114 are arranged in a manner arranged in the direction of the axes A2 and A3 of the robot 50. Furthermore, when the control device 20 performs the gripping action according to the second gripping mode n-1, the first suction ports 104 and the second suction ports 114 used for the gripping action are switched from the first gripping mode n to the second gripping mode n-1 (for example, from the above-mentioned gripping mode 5 to the gripping mode 4) by rotating the robot 50 around the axes A2 and A3. According to this configuration, the components of the robot 50 can be prevented from interfering with the surrounding environment (for example, the container H or the object W), and the gripping mode can be switched quickly and easily.

又,本實施形態中,機械手50進而具有可吸入外氣並吸引握持物品W之吸入口84,第2吸附口114具有較第1吸附口104小之開口尺寸R2。且,控制裝置20於取得之表面尺寸SZ小於第2吸附口114之開口尺寸R2之情形(步驟S3中否)時,執行以吸入口84吸引握持物品W之握持動作(步驟S21)。根據該構成,即使為尺寸小至無法以吸附口114吸附握持之程度之物品W,亦可以吸入口84穩定吸引握持並提起。藉此,可握持更多種類之物品W。Furthermore, in the present embodiment, the robot 50 further has a suction port 84 that can inhale the outside air and suck and hold the object W, and the second suction port 114 has an opening size R2 that is smaller than the first suction port 104. Furthermore, when the surface size SZ obtained is smaller than the opening size R2 of the second suction port 114 (No in step S3), the control device 20 executes a holding action (step S21) of sucking and holding the object W by the suction port 84. According to this structure, even if the object W is so small that it cannot be sucked and held by the suction port 114, it can be stably sucked, held and lifted by the suction port 84. In this way, more types of objects W can be held.

另,上述實施形態中,已對處理器40於圖13所示之流程中,於步驟S16之後執行步驟S11之情形時,選擇將上一次之步驟S11中選擇之吸附模式n之識別編號「n」往前推1個之吸附模式n-1之情形進行敘述。然而,處理器40亦可於步驟S16之後執行步驟S11之情形時,選擇將上一次之步驟S11中選擇之吸附模式n之識別編號「n」往後推1個之吸附模式n+1。In addition, in the above-mentioned embodiment, the case where the processor 40 selects to push the identification number "n" of the adsorption mode n selected in the previous step S11 forward by one adsorption mode n-1 when executing step S11 after step S16 in the process shown in FIG. 13 has been described. However, the processor 40 may also select to push the identification number "n" of the adsorption mode n selected in the previous step S11 backward by one adsorption mode n+1 when executing step S11 after step S16.

即,處理器40於步驟S11中選擇吸附模式n(n=1、2、3、…),接著,執行步驟S12~S16後,再次執行步驟S11。該情形時,處理器40選擇吸附模式n+1。假設於第1次步驟S11中選擇吸附模式2(N1=1,N2=0),其後執行步驟S12~S16後,執行第2次步驟S11。該情形時,處理器40於第2次之步驟S11中,選擇吸附模式3(N1=1,N2=1)。吸附模式2(第1吸附模式)之個數N1及N2之總數Ns為1個,另一方面,吸附模式3(第2吸附模式)之個數N1及N2之總數Ns為2個。That is, the processor 40 selects adsorption mode n (n=1, 2, 3, ...) in step S11, and then executes steps S12 to S16 and then executes step S11 again. In this case, the processor 40 selects adsorption mode n+1. Assume that adsorption mode 2 (N1=1, N2=0) is selected in the first step S11, and then steps S12 to S16 are executed and then step S11 is executed for the second time. In this case, the processor 40 selects adsorption mode 3 (N1=1, N2=1) in the second step S11. The total number Ns of the number N1 and N2 of adsorption pattern 2 (first adsorption pattern) is 1, while the total number Ns of the number N1 and N2 of adsorption pattern 3 (second adsorption pattern) is 2.

即,該情形時,處理器40於依照第1次步驟S11中選擇之吸附模式2執行之握持動作失敗之情形時,選擇個數N1及N2之總數Ns較該吸附模式2多之吸附模式3,依照該吸附模式3,再次於步驟S12中執行握持動作。另,於第1次之步驟S11中選擇吸附模式5或6後,執行第2次之步驟S11之情形亦同樣,處理器40選擇總數Ns增加1個之吸附模式6或7。That is, in this case, when the holding action performed according to the suction mode 2 selected in the first step S11 fails, the processor 40 selects suction mode 3 whose total number Ns of numbers N1 and N2 is greater than that of suction mode 2, and performs the holding action again in step S12 according to suction mode 3. In addition, after suction mode 5 or 6 is selected in the first step S11, the second step S11 is performed in the same manner, and the processor 40 selects suction mode 6 or 7 whose total number Ns increases by 1.

另一方面,於第1次之步驟S11中選擇吸附模式4,其後執行第2次之步驟S11之情形時,處理器40於第2次之步驟S11中,選擇吸附模式5。該情形時,吸附模式4(第1吸附模式)中,規定了吸附口114之個數N2=2,另一方面,規定了吸附口104之個數N1=0。On the other hand, when the adsorption mode 4 is selected in the first step S11 and then the second step S11 is executed, the processor 40 selects the adsorption mode 5 in the second step S11. In this case, in the adsorption mode 4 (the first adsorption mode), the number N2 of the adsorption ports 114 is specified to be 2, and on the other hand, the number N1 of the adsorption ports 104 is specified to be 0.

又,吸附模式5(第2吸附模式)中,規定了吸附口104之個數N1=2,另一方面,規定了吸附口114之個數N2=0。即,該情形時,處理器40於依照第1次步驟S11中選擇之吸附模式4執行之握持動作失敗之情形時,選擇雖總數Ns相同,但用於握持動作之吸附口之開口尺寸R變得更大之吸附模式5,依照該吸附模式5,再次於步驟S12中執行握持動作。另,第1次之步驟S11中選擇吸附模式1或3後執行第2次之步驟S11之情形亦同樣,處理器40選擇雖總數Ns相同但開口尺寸R更大之吸附模式2或4。Furthermore, in suction mode 5 (second suction mode), the number of suction ports 104 N1=2 is specified, and on the other hand, the number of suction ports 114 N2=0 is specified. That is, in this case, when the gripping action performed according to suction mode 4 selected in the first step S11 fails, the processor 40 selects suction mode 5 in which the opening size R of the suction port used for the gripping action becomes larger although the total number Ns is the same, and the gripping action is performed again in step S12 according to the suction mode 5. In addition, the same is true in the case where suction mode 1 or 3 is selected in the first step S11 and the second step S11 is executed, the processor 40 selects suction mode 2 or 4 in which the opening size R is larger although the total number Ns is the same.

如上所述,處理器40於步驟S16之後執行步驟S11之情形時,選擇吸附模式n+1,依照該模式n+1再次執行步驟S12。此時,處理器40藉由使機械手50繞軸線A1(即,軸線A2及A3)旋轉,而可將用於握持動作之吸附口104及114自吸附模式n切換為吸附模式n+1。As described above, when the processor 40 executes step S11 after step S16, it selects the suction mode n+1 and executes step S12 again according to the mode n+1. At this time, the processor 40 can switch the suction ports 104 and 114 used for the holding action from the suction mode n to the suction mode n+1 by rotating the robot 50 around the axis A1 (i.e., the axes A2 and A3).

另,上述實施形態中,已對圖12中之步驟S3中,處理器40藉由判定表面尺寸SZ是否小於吸附口114之開口尺寸R2,而判定是否使用吸引式手54之情形進行敘述。然而,不限於此,處理器40亦可自步驟S1中拍攝之圖像資料ID,判定物品W之種類,根據該種類,判定握持動作中是否使用吸引式手54(即,吸入口84)。In the above embodiment, the processor 40 determines whether to use the suction hand 54 by determining whether the surface size SZ is smaller than the opening size R2 of the suction port 114 in step S3 of FIG. 12. However, the present invention is not limited thereto. The processor 40 may also determine the type of the object W from the image data ID captured in step S1, and determine whether to use the suction hand 54 (i.e., the suction port 84) in the holding action based on the type.

以下,對步驟S3之其他例進行說明。例如,處理器40使用機械學習模型LM1(所謂之AI(Artificial Intelligence:人工智慧)算法),自圖像資料ID特定物品W之種類。例如,操作員將各種物品W之圖像資料ID,與表示該圖像資料ID中映現之物品W之種類(樹脂之定形包裝箱、紙製之定形包裝箱、不定形之包裝袋等)之標籤資料LB之資料組DS1輸入至機械學習裝置LD(未圖示)。機械學習裝置LD使用資料組DS1,學習表示物品W之圖像資料ID與物品W之種類之相關性的機械學習模型LM1。另,處理器40亦可以作為機械學習裝置LD發揮功能之方式構成。機械學習模型LM1預先存儲於記憶體42。Other examples of step S3 are described below. For example, the processor 40 uses a machine learning model LM1 (so-called AI (Artificial Intelligence) algorithm) to identify the type of object W from the image data ID. For example, the operator inputs the image data ID of various objects W and the data set DS1 of the label data LB representing the type of object W shown in the image data ID (resin fixed-shaped packaging box, paper fixed-shaped packaging box, irregular packaging bag, etc.) into the mechanical learning device LD (not shown). The mechanical learning device LD uses the data set DS1 to learn the mechanical learning model LM1 representing the correlation between the image data ID of the object W and the type of the object W. In addition, the processor 40 can also be configured in a manner to function as the mechanical learning device LD. The machine learning model LM1 is pre-stored in the memory 42.

且,處理器40於步驟S3中,將最近之步驟S1中取得之圖像資料ID輸入至機械學習模型LM1。機械學習模型LM1輸出與輸入之圖像資料ID具有相關性之標籤資料LB,作為最優解。處理器40自機械學習模型LM1輸出之標籤資料LB特定物品W之種類。例如,將物品W設為具有凹凸狀表面之紙製之定形包裝箱。該情形時,難以由吸附式手56吸附保持物品W。此種情形時,處理器40於步驟S3中,自機械學習模型LM1輸出之標籤資料LB辨識出物品W之種類為紙製之定形包裝箱之情形時,判定為是。Furthermore, in step S3, the processor 40 inputs the image data ID obtained in the most recent step S1 into the machine learning model LM1. The machine learning model LM1 outputs the label data LB that is correlated with the input image data ID as the optimal solution. The processor 40 specifies the type of item W from the label data LB output from the machine learning model LM1. For example, item W is set as a paper-shaped packaging box with a concave-convex surface. In this case, it is difficult for the suction hand 56 to hold item W by suction. In this case, in step S3, the processor 40 determines that the type of item W is a paper-shaped packaging box when it is identified from the label data LB output from the machine learning model LM1.

且,處理器40藉由執行步驟S5,而如圖18所示,可吸引握持凹凸狀之物品W。握持凹凸狀之物品W時,於前端面82與表面Ws之間形成間隙G,但通過該間隙,將大流量之外氣持續吸入至吸入口84。藉由此種外氣之流動,吸引式手54可將凹凸狀之物品W持續吸引握持於吸入口84。Furthermore, the processor 40 can suck and hold the concavo-convex article W by executing step S5 as shown in FIG18 . When holding the concavo-convex article W, a gap G is formed between the front end face 82 and the surface Ws, but a large flow of external air is continuously sucked into the suction port 84 through the gap. By the flow of such external air, the suction hand 54 can continuously suck and hold the concavo-convex article W at the suction port 84.

代替而言,將物品W設為不定形之包裝袋。該情形時,亦難以由吸附式手56吸附握持物品W。此種情形時,處理器40於步驟S3中,自機械學習模型LM1輸出之標籤資料LB辨識出物品W之種類為不定形之包裝袋之情形時,判定為是。且,處理器40藉由執行步驟S5,而如圖19所示,可有效吸引握持不定形之包裝袋。Instead, the object W is set as an irregular packaging bag. In this case, it is also difficult for the suction hand 56 to suck and hold the object W. In this case, the processor 40 determines that the type of the object W is an irregular packaging bag when it recognizes from the label data LB output by the machine learning model LM1 in step S3. In addition, the processor 40 can effectively suck and hold the irregular packaging bag by executing step S5 as shown in FIG. 19.

另,亦可於記憶體42預先記憶資料表DT2,該資料表DT2將各種標籤資料LB,與用於由該標籤資料LB表示之種類之物品W之握持動作之吸引式手54及吸附模式1~7分別建立關聯而存儲。該情形時,處理器40藉由將機械學習模型LM1輸出之標籤資料LB應用於資料表DT2,可判定應將吸引式手54及吸附模式1~7之哪一者用於握持動作。另,處理器40不限於機械學習模型LM1,例如亦可基於來自操作員之輸入資訊,特定物品W之種類。In addition, a data table DT2 may be pre-stored in the memory 42. The data table DT2 associates and stores various tag data LB with the suction hand 54 and suction patterns 1 to 7 used for the gripping action of the object W of the type represented by the tag data LB. In this case, the processor 40 can determine which of the suction hand 54 and suction patterns 1 to 7 should be used for the gripping action by applying the tag data LB output by the machine learning model LM1 to the data table DT2. In addition, the processor 40 is not limited to the machine learning model LM1, and can also specify the type of the object W based on input information from the operator.

另,上述實施形態中,處理器40於以機械手50握持物品W時,亦可藉由使該機械手50繞軸線A1旋動,而有意地使物品W之配置變化。例如,握持對象之物品W在容器H之側壁附近之情形時,由於可能會產生機械手50與該側壁之干涉,故握持動作可能變困難。In addition, in the above-mentioned embodiment, when the handler 40 holds the object W with the robot 50, the robot 50 may be rotated around the axis A1 to intentionally change the arrangement of the object W. For example, when the object W to be held is near the side wall of the container H, the holding action may become difficult because interference between the robot 50 and the side wall may occur.

因此,處理器40於將在容器H之側壁附近之物品W決定為握持對象之情形時,使吸附式手56或吸引式手54抵接於該物品W,使機械手50繞軸線A1旋動。其結果,可避免機械手50之組件與容器H干涉,且使該物品W自側壁附近向容器H之中央區域移位。藉此,可提高該物品W之握持動作之成功幾率。Therefore, when the processor 40 determines that the object W near the side wall of the container H is to be grasped, the suction hand 56 or the attracting hand 54 abuts against the object W, and the robot 50 rotates around the axis A1. As a result, the components of the robot 50 can be prevented from interfering with the container H, and the object W is shifted from the vicinity of the side wall to the central area of the container H. In this way, the success rate of the grasping action of the object W can be increased.

另,亦可省略上述步驟S16或S24(退避動作)。又,上述實施形態中,已對確定圖14所示之吸附模式1~7之情形進行敘述。然而,圖14所示之吸附模式1~7為一例,作為吸附模式n,亦可確定任意之個數N1及N2。又,亦可不確定吸附模式n而決定個數N1及N2。例如,處理器40亦可基於來自操作員之輸入資訊,決定個數N1及N2。In addition, the above-mentioned step S16 or S24 (avoidance action) may be omitted. In addition, in the above-mentioned embodiment, the case where the adsorption patterns 1 to 7 shown in FIG. 14 are determined has been described. However, the adsorption patterns 1 to 7 shown in FIG. 14 are just examples, and arbitrary numbers N1 and N2 may be determined as adsorption patterns n. In addition, the numbers N1 and N2 may be determined without determining the adsorption pattern n. For example, the processor 40 may determine the numbers N1 and N2 based on input information from the operator.

代替而言,亦可預先準備表示物品W之圖像資料ID(或自該圖像資料ID取得之表面尺寸SZ),與個數N1及N2之相關性之機械學習模型LM2。例如,操作員將各種物品W之圖像資料ID(或表面尺寸SZ),與適於吸附握持該圖像資料ID(表面尺寸SZ)之個數N1及個數N2之組合的資料組DS2輸入至機械學習裝置LD。Alternatively, a machine learning model LM2 may be prepared in advance to represent the correlation between the image data ID (or the surface size SZ obtained from the image data ID) and the numbers N1 and N2 of the objects W. For example, an operator inputs a data set DS2 of the image data ID (or surface size SZ) of various objects W and the combination of the numbers N1 and N2 of the image data ID (surface size SZ) suitable for suction and gripping into the machine learning device LD.

機械學習裝置LD使用資料組DS2,學習表示圖像資料ID(表面尺寸SZ)與個數N1及N2之組合之相關性的機械學習模型LM2。機械學習模型LM2預先存儲於記憶體42。該情形時,處理器40於上述步驟S11中,將步驟S1中拍攝到之圖像資料ID(或步驟S2中取得之表面尺寸SZ)輸入至機械學習模型LM2。於是,機械學習模型LM2輸出與輸入之圖像資料ID(表面尺寸SZ)具有相關性之個數N1及N2之組合,作為最優解。如此,處理器40可基於圖像資料ID(表面尺寸SZ)決定個數N1及N2。The mechanical learning device LD uses the data set DS2 to learn the mechanical learning model LM2 that represents the correlation between the image data ID (surface size SZ) and the combination of the numbers N1 and N2. The mechanical learning model LM2 is pre-stored in the memory 42. In this case, the processor 40 inputs the image data ID captured in step S1 (or the surface size SZ obtained in step S2) into the mechanical learning model LM2 in the above-mentioned step S11. Then, the mechanical learning model LM2 outputs the combination of the numbers N1 and N2 that are correlated with the input image data ID (surface size SZ) as the optimal solution. In this way, the processor 40 can determine the numbers N1 and N2 based on the image data ID (surface size SZ).

另,上述實施形態中,施力機構74及100之一者例如亦可由產生施力力之磁鐵構成。又,亦可自機械手50省略施力機構74及100之至少一者,由一體形狀之棒狀構件構成手臂70及98之至少一者。In the above-mentioned embodiment, one of the force applying mechanisms 74 and 100 may be formed by a magnet generating a force applying force. Also, at least one of the force applying mechanisms 74 and 100 may be omitted from the robot 50, and at least one of the arms 70 and 98 may be formed by a rod-shaped member of a single body.

另,上述機械手50中,已對2個吸附口104與2個吸附口114以依角度θ1=90°於周向上交替排列之方式配設之情形進行敘述。然而,不限於此,角度θ1亦可設定為例如45°、60°或72°等360°之約數。又,吸附口104及114不限於在周向上配設於吸入口84之周圍之形態,例如複數個吸附口104或114亦可於與吸入口84之徑向外側相鄰之位置排列一行而配置。又,吸附式手56可各具有1個吸附口104及114,但亦可具有任意個數之吸附口104與任意個數之吸附口114。又,機械手50亦可具備複數個吸引式手54(吸入口84)。In addition, in the above-mentioned robot 50, the situation in which two suction ports 104 and two suction ports 114 are arranged alternately in the circumferential direction at an angle θ1=90° has been described. However, this is not limited to the above, and the angle θ1 may also be set to a divisor of 360°, such as 45°, 60° or 72°. Furthermore, the suction ports 104 and 114 are not limited to being arranged circumferentially around the suction port 84. For example, a plurality of suction ports 104 or 114 may also be arranged in a row at positions adjacent to the radially outer side of the suction port 84. Furthermore, the suction-type hand 56 may each have one suction port 104 and 114, but may also have any number of suction ports 104 and any number of suction ports 114. Furthermore, the robot 50 may also have a plurality of suction-type hands 54 (suction ports 84).

又,上述實施形態中,已對吸附式手56具備互不相同之開口尺寸R1及R2之吸附口104及114之情形進行敘述。然而,不限於此,吸附式手56亦可僅具有相同開口尺寸R1(或R2)之吸附口104(或吸附口114)。代替而言,吸附式手56亦可進而具有較開口尺寸R1大之吸附口。又,吸附口104及114亦可具有彼此相同之開口尺寸R1(或R2)。該情形時,吸附墊96及110亦可由互不相同之種類(外形尺寸、形狀、材料或可撓性)之焊墊構成。Furthermore, in the above-mentioned embodiment, the case where the suction hand 56 has the suction ports 104 and 114 with different opening sizes R1 and R2 has been described. However, this is not limited to the above, and the suction hand 56 may also have only the suction port 104 (or suction port 114) with the same opening size R1 (or R2). Alternatively, the suction hand 56 may further have a suction port with a larger opening size R1. Furthermore, the suction ports 104 and 114 may also have the same opening size R1 (or R2). In this case, the suction pads 96 and 110 may also be composed of welding pads of different types (external dimensions, shapes, materials or flexibility).

又,上述實施形態中,已對吸附式手56具有複數個手臂98之情形進行敘述。然而,不限於此,例如吸附式手56亦可具有同軸狀固設於手基座52,具有一體形狀之圓筒狀之環臂。該情形時,複數個吸附墊96及110亦可以於該環臂之軸向下端交替排列之方式設置。In the above embodiment, the suction hand 56 has been described as having a plurality of arms 98. However, the present invention is not limited thereto. For example, the suction hand 56 may also have a cylindrical ring arm coaxially fixed to the hand base 52 and having a one-piece shape. In this case, the plurality of suction pads 96 and 110 may also be arranged alternately from the axis of the ring arm to the lower end.

又,亦可自機械手50省略吸附墊96及110,例如於上述軸部108或環臂之軸向下端面,直接形成吸附口104及114。又,亦可自吸引式手54省略吸引墊76,例如於手臂70(可動臂部80)之軸向下端面直接形成吸入口84。Furthermore, the suction pads 96 and 110 may be omitted from the robot 50, for example, the suction ports 104 and 114 may be directly formed on the shaft portion 108 or the lower end surface of the ring arm. Furthermore, the suction pad 76 may be omitted from the suction hand 54, for example, the suction port 84 may be directly formed on the shaft portion 70 (movable arm portion 80) lower end surface.

另,上述實施形態中,已對吸入口84之軸線A3、吸入口104之軸線A4及A5、吸入口114之軸線A6及A7互相大致平行之情形進行敘述。然而,不限定於此,軸線A4~A7中之至少一者(例如全部)亦可相對於軸線A3傾斜。另,機器人12不限於垂直多關節型,亦可為水平多關節型、平行連桿型等任意類型之機器人。In the above embodiment, the axis A3 of the suction port 84, the axes A4 and A5 of the suction port 104, and the axes A6 and A7 of the suction port 114 are substantially parallel to each other. However, the present invention is not limited thereto, and at least one of the axes A4 to A7 (for example, all) may be inclined relative to the axis A3. In addition, the robot 12 is not limited to a vertical multi-joint type, and may be any type of robot such as a horizontal multi-joint type, a parallel linkage type, etc.

另,亦可自機器人系統10省略視覺感測器14。例如,於物品W標註特定該物品W之種類及表面尺寸SZ之資訊之識別資訊(例如,條型碼),另一方面,機器人系統10亦可進而具備讀取該識別資訊之讀取感測器RS。且,處理器40亦可基於該讀取感測器RS讀取出之識別資訊,取得物品W之表面尺寸SZ。In addition, the visual sensor 14 may be omitted from the robot system 10. For example, identification information (e.g., a barcode) that specifies the type and surface size SZ of the object W may be marked on the object W, and the robot system 10 may further include a reading sensor RS that reads the identification information. Furthermore, the processor 40 may also obtain the surface size SZ of the object W based on the identification information read by the reading sensor RS.

以上,已對本揭示進行詳述,但本揭示並非限定於上述各個實施形態。該等實施形態於不脫離本揭示之主旨之範圍內,或者於不脫離自申請專利範圍所記載之內容及其均等物導出之本揭示之主旨之範圍內,可進行各種追加、置換、變更、部分刪除等。又,該等實施形態亦可組合實施。例如,上述實施形態中,各動作之順序或各處理之順序作為一例而顯示,並非限定於此。又,對上述實施形態之說明使用數值或數式之情形亦同樣。The present disclosure has been described in detail above, but the present disclosure is not limited to the above-mentioned embodiments. These embodiments may be added, replaced, changed, partially deleted, etc., without departing from the scope of the present disclosure, or without departing from the scope of the present disclosure derived from the contents recorded in the scope of the patent application and its equivalents. Moreover, these embodiments may also be implemented in combination. For example, in the above-mentioned embodiments, the sequence of each action or the sequence of each processing is shown as an example, and is not limited to this. Moreover, the same applies to the use of numerical values or formulas in the description of the above-mentioned embodiments.

本揭示記載以下之態樣。 (態樣1)一種機器人系統10、200、210,其係握持物品W者,其具備:機器人12,其具有包含第1吸附口104及第2吸附口114之機械手50;及控制裝置20,其使機器人12動作而移動機械手50,執行以該機械手50握持物品W之握持動作;控制裝置20取得握持對象之物品W之表面尺寸SZ,根據取得之表面尺寸SZ,決定用於握持動作之第1吸附口104之個數N1與第2吸附口114之個數N2。 (態樣2)如態樣1之機器人系統10、200、210,其中預先設定各自規定有第1吸附口104之個數N1與第2吸附口114之個數N2之複數個吸附模式n,控制裝置20藉由根據表面尺寸SZ,選擇複數個吸附模式n中之1個,而決定個數N1及N2。 (態樣3)如態樣2之機器人系統10、200、210,其中於依照選擇之第1吸附模式n執行之握持動作失敗之情形時,選擇第1吸附口104之個數N1與第2吸附口114之個數N2之總數Ns少於第1吸附模式n之第2吸附模式n-1,或該總數Ns多於第1吸附模式n之第2吸附模式n+1,依照第2吸附模式n-1或n+1,再次執行握持動作。 (態樣4)如態樣2或3之機器人系統10、200、210,其中第1吸附口104具有較第2吸附口114大之開口尺寸R1,第1吸附模式n中,將第1吸附口104之個數N1規定為1以上,另一方面,將第2吸附口114之個數N2規定為零,第2吸附模式n-1中,將第2吸附口114之個數N2規定為1以上,另一方面,將第1吸附口104之個數N1規定為零,控制裝置20於依照選擇之第1吸附模式n執行之握持動作失敗之情形時,選擇第2吸附模式n-1,依照第2吸附模式n-1再次執行握持動作。 (態樣5)如態樣2至4中任一態樣之機器人系統10、200、210,其中第1吸附口104具有大於第2吸附口114之開口尺寸R1,第1吸附模式n中,將第2吸附口114之個數N2規定為1以上,另一方面,將第1吸附口104之個數N1規定為零,第2吸附模式n+1中,將第1吸附口104之個數N1規定為1以上,另一方面,將第2吸附口114之個數N2規定為零,控制裝置20於依照選擇之第1吸附模式n執行之握持動作失敗之情形時,選擇第2吸附模式n+1,依照第2吸附模式n+1再次執行握持動作。 (態樣6)如態樣3至5中任一態樣之機器人系統10、200、210,其中複數個第1吸附口104與複數個第2吸附口114以於繞機械手50之軸線A2、A3之方向排列之方式配置,控制裝置20於依照第2吸附模式n-1執行握持動作時,藉由使機械手50繞軸線A1、A2、A3旋轉,而將用於該握持動作之第1吸附口104及第2吸附口114自第1吸附模式n切換為第2吸附模式n-1或n+1。 (態樣7)如態樣1至6中任一態樣之機器人系統10、200、210,其中機械手50進而具有可吸入外氣而吸引握持物品之吸入口84,第2吸附口114具有較第1吸附口104小之開口尺寸R2,控制裝置20於取得之表面尺寸SZ小於第2吸附口114之開口尺寸R2之情形時,執行以吸入口84吸引握持物品W之握持動作。 (態樣8)一種機器人系統10、200、210,其係握持物品W者,其具備:機器人12,其具有包含第1吸附口104及第2吸附口114之機械手50;視覺感測器14,其拍攝物品W;控制裝置20,其使機器人12動作而移動機械手50,執行以該機械手50握持物品W之握持動作;及機械學習模型LM2,其表示物品W之圖像資料ID,與對於該圖像資料ID中映現之該物品W之握持動作應使用之第1吸附口104之個數N1及第2吸附口114之個數N2之相關性;且控制裝置20將視覺感測器14拍攝之圖像資料ID輸入至機械學習模型LM2,根據該機械學習模型LM2輸出之個數N1及N2,決定用於握持動作之第1吸附口104之個數N1與第2吸附口114之個數N2。 (態樣9)一種方法,其係以包含開口尺寸R互不相同之第1吸附口104及第2吸附口114之機械手50握持物品W者,且取得握持對象之物品W之表面尺寸SZ,根據取得之表面尺寸SZ,決定用於由機械手50握持物品W之握持動作之第1吸附口104之個數N1與第2吸附口114之個數N2。 This disclosure describes the following aspects. (Aspect 1) A robot system 10, 200, 210, which is for holding an object W, comprises: a robot 12, which has a manipulator 50 including a first suction port 104 and a second suction port 114; and a control device 20, which causes the robot 12 to move the manipulator 50 to perform a holding action of holding the object W with the manipulator 50; the control device 20 obtains the surface size SZ of the object W to be held, and determines the number N1 of the first suction port 104 and the number N2 of the second suction port 114 used for the holding action according to the obtained surface size SZ. (Aspect 2) In the robot system 10, 200, 210 of aspect 1, a plurality of adsorption modes n are pre-set, each of which specifies the number N1 of the first adsorption ports 104 and the number N2 of the second adsorption ports 114. The control device 20 determines the numbers N1 and N2 by selecting one of the plurality of adsorption modes n according to the surface size SZ. (Aspect 3) In the robot system 10, 200, 210 of aspect 2, when the gripping action performed according to the selected first suction mode n fails, the total number Ns of the number N1 of the first suction ports 104 and the number N2 of the second suction ports 114 is selected to be less than the second suction mode n-1 of the first suction mode n, or the total number Ns is greater than the second suction mode n+1 of the first suction mode n, and the gripping action is performed again according to the second suction mode n-1 or n+1. (Aspect 4) A robot system 10, 200, 210 as in aspect 2 or 3, wherein the first suction port 104 has an opening size R1 larger than the second suction port 114, in the first suction mode n, the number N1 of the first suction ports 104 is set to be greater than 1, and on the other hand, the number N2 of the second suction ports 114 is set to be zero, in the second suction mode n-1, the number N2 of the second suction ports 114 is set to be greater than 1, and on the other hand, the number N1 of the first suction ports 104 is set to be zero, and when the holding action performed according to the selected first suction mode n fails, the control device 20 selects the second suction mode n-1, and performs the holding action again according to the second suction mode n-1. (Aspect 5) A robot system 10, 200, 210 as in any aspect 2 to 4, wherein the first suction port 104 has an opening size R1 larger than the second suction port 114, in the first suction mode n, the number N2 of the second suction ports 114 is set to be greater than 1, and on the other hand, the number N1 of the first suction ports 104 is set to be zero, and in the second suction mode n+1, the number N1 of the first suction ports 104 is set to be greater than 1, and on the other hand, the number N2 of the second suction ports 114 is set to be zero, and when the holding action performed according to the selected first suction mode n fails, the control device 20 selects the second suction mode n+1 and performs the holding action again according to the second suction mode n+1. (Aspect 6) A robot system 10, 200, 210 as in any aspect 3 to 5, wherein the plurality of first suction ports 104 and the plurality of second suction ports 114 are arranged in a manner arranged in the direction of the axes A2 and A3 of the manipulator 50, and when the control device 20 performs a gripping action according to the second gripping mode n-1, the first suction port 104 and the second suction port 114 used for the gripping action are switched from the first gripping mode n to the second gripping mode n-1 or n+1 by rotating the manipulator 50 around the axes A1, A2, A3. (Aspect 7) A robot system 10, 200, 210 as in any of aspects 1 to 6, wherein the robot arm 50 further has a suction port 84 for sucking in external air to suck the gripped object, and the second suction port 114 has an opening size R2 smaller than the first suction port 104. When the surface size SZ obtained by the control device 20 is smaller than the opening size R2 of the second suction port 114, the control device 20 performs a gripping action of sucking the gripped object W with the suction port 84. (Aspect 8) A robot system 10, 200, 210 for holding an object W comprises: a robot 12 having a manipulator 50 including a first suction port 104 and a second suction port 114; a visual sensor 14 for photographing the object W; a control device 20 for causing the robot 12 to move the manipulator 50 to perform a holding action of holding the object W with the manipulator 50; and a machine learning model LM2 for representing an image data ID of the object W. The control device 20 inputs the image data ID captured by the visual sensor 14 into the machine learning model LM2, and determines the number N1 of the first suction port 104 and the number N2 of the second suction port 114 used for the holding action of the object W shown in the image data ID. (Aspect 9) A method of holding an object W by a robot 50 including a first suction port 104 and a second suction port 114 having different opening sizes R, and obtaining a surface size SZ of the object W to be held, and determining the number N1 of the first suction port 104 and the number N2 of the second suction port 114 used for the holding action of the robot 50 to hold the object W according to the obtained surface size SZ.

10:機器人系統 12:機器人 14:視覺感測器 16:第1種排氣裝置 18A:第2種排氣裝置 18B:第2種排氣裝置 18C:第2種排氣裝置 18D:第2種排氣裝置 20:控制裝置 22:機器人基座 24:迴旋主體 26:下臂部 28:上臂部 30:手腕部 30a:手腕基座 30b:手腕凸緣 32:伺服馬達 34:移動機構部 40:處理器 42:記憶體 44:I/O介面 46:匯流排 50:機械手 52:手基座 54:吸引式手 56:吸附式手 58:安裝凸緣 60:支持台 62:柱部 63:貫通孔 64:安裝孔 66:貫通孔 68:貫通孔 70:手臂 72:滑塊 72a:貫通孔 74:第2種施力機構 76:吸引墊 78:固定臂部 80:可動臂部 80a:軸向上端部 80b:軸向下端 82:前端面 84:吸入口 86:缸體 86a:缸體本體 86b:缸體軸 88:大吸附手 90:大吸附手 92:小吸附手 94:小吸附手 96:吸附墊 98:手臂 100:第1種施力機構 102:前端面 104:吸附口 106:缸體部 108:軸部 110:吸附墊 112:前端面 114:吸附口 120:氣體噴射裝置 122:氣流產生機構 122a:氣體入口 122b:螺旋流路 122c:氣體出口 122d:氣體吸入口 124:流路管 130:氣體噴射裝置 132:負壓產生機構 132a:氣體入口 132b:文丘里管流路 132c:氣體出口 132d:氣體吸入口 132e:噴嘴 134:流路管 200:機器人系統 202:感測器 210:機器人系統 212:感測器 A1~A7:軸線 B:箭頭 C1:機器人座標系 C2:工具座標系 D1:噴流 D1':噴流 D2:氣流 DR1:取出方向 G:間隙 G1:噴流 G1':噴流 G2:氣流 H:容器 He:開口端 IV:箭頭 N1:個數 N2:個數 S1~S7:步驟 S11~S19:步驟 S21~S27:步驟 V:箭頭 W:物品 We:端部 Ws:表面 θ1:角度 10: Robot system 12: Robot 14: Vision sensor 16: First exhaust device 18A: Second exhaust device 18B: Second exhaust device 18C: Second exhaust device 18D: Second exhaust device 20: Control device 22: Robot base 24: Rotating body 26: Lower arm 28: Upper arm 30: Wrist 30a: Wrist base 30b: Wrist flange 32: Servo motor 34: Moving mechanism 40: Processor 42: Memory 44: I/O interface 46: Bus 50: Robot hand 52: Hand base 54: Suction hand 56: Suction hand 58: Mounting flange 60: Support platform 62: Column 63: Through hole 64: Mounting hole 66: Through hole 68: Through hole 70: Arm 72: Slider 72a: Through hole 74: Second force mechanism 76: Suction pad 78: Fixed arm 80: Movable arm 80a: Axial upper end 80b: Axial lower end 82: Front end 84: Suction port 86: Cylinder 86a: Cylinder body 86b: Cylinder shaft 88: Large suction hand 90: Large suction hand 92: Small suction hand 94: Small suction hand 96: Suction pad 98: Arm 100: First force-applying mechanism 102: Front end face 104: Adsorption port 106: Cylinder body 108: Shaft 110: Adsorption pad 112: Front end face 114: Adsorption port 120: Gas injection device 122: Airflow generating mechanism 122a: Gas inlet 122b: Spiral flow path 122c: Gas outlet 122d: Gas suction port 124: Flow path pipe 130: Gas injection device 132: Negative pressure generating mechanism 132a: Gas inlet 132b: Venturi flow path 132c: Gas outlet 132d: Gas suction port 132e: Nozzle 134: Flow path pipe 200: Robot system 202: Sensor 210: Robot system 212: Sensor A1~A7: Axis B: Arrow C1: Robot coordinate system C2: Tool coordinate system D1: Jet D1': Jet D2: Air flow DR1: Removal direction G: Gap G1: Jet G1': Jet G2: Air flow H: Container He: Open end IV: Arrow N1: Number N2: Number S1~S7: Step S11~S19: Step S21~S27: Step V: Arrow W: Object We: End Ws: Surface θ1: Angle

圖1係一實施形態之機器人系統之概略圖。 圖2係圖1所示之機器人系統之方塊圖。 圖3係一實施形態之機械手之前視圖。 圖4係自圖3中之箭頭IV觀察圖3所示之機械手之側視圖。 圖5係自圖3中之箭頭V觀察圖3所示之機械手之仰視圖。 圖6係自上側觀察圖3所示之機械手之立體圖。 圖7係自下側觀察圖3所示之機械手之立體圖。 圖8顯示於圖4所示之機械手中,使吸引式手後退之狀態。 圖9係圖2所示之第1種排氣裝置之概略圖。 圖10係圖2所示之第2種排氣裝置之概略圖。 圖11顯示分散堆積於容器內之物品與拍攝該物品之視覺感測器。 圖12係顯示圖1所示之機器人系統之動作流程之一例之流程圖。 圖13係顯示圖12中之步驟S4之流程之一例之流程圖。 圖14顯示吸附模式之資料表之一例。 圖15顯示以吸附式手吸附握持物品之狀態。 圖16係顯示圖12中之步驟S5之流程之一例之流程圖。 圖17顯示以吸引式手吸引握持小型物品之狀態。 圖18顯示以吸引式手吸引握持凹凸狀物品之狀態。 圖19顯示以吸引式手吸引握持不定形物品之狀態。 FIG. 1 is a schematic diagram of a robot system in an embodiment. FIG. 2 is a block diagram of the robot system shown in FIG. 1. FIG. 3 is a front view of a robot in an embodiment. FIG. 4 is a side view of the robot shown in FIG. 3 as viewed from arrow IV in FIG. 3. FIG. 5 is a bottom view of the robot shown in FIG. 3 as viewed from arrow V in FIG. 3. FIG. 6 is a three-dimensional view of the robot shown in FIG. 3 as viewed from above. FIG. 7 is a three-dimensional view of the robot shown in FIG. 3 as viewed from below. FIG. 8 shows the state in which the suction hand is retracted in the robot shown in FIG. 4. FIG. 9 is a schematic diagram of the first exhaust device shown in FIG. 2. FIG. 10 is a schematic diagram of the second exhaust device shown in FIG. 2. FIG. 11 shows the objects scattered and stacked in the container and the visual sensor photographing the objects. FIG. 12 is a flowchart showing an example of the action flow of the robot system shown in FIG. 1. FIG. 13 is a flowchart showing an example of the process of step S4 in FIG. 12. FIG. 14 shows an example of a data table of the suction mode. FIG. 15 shows the state of sucking and holding an object with a suction hand. FIG. 16 is a flowchart showing an example of the process of step S5 in FIG. 12. FIG. 17 shows the state of sucking and holding a small object with a suction hand. FIG. 18 shows the state of sucking and holding a concave-convex object with a suction hand. FIG. 19 shows the state of sucking and holding an amorphous object with a suction hand.

10:機器人系統 10: Robotic system

12:機器人 12:Robots

14:視覺感測器 14: Visual sensor

20:控制裝置 20: Control device

22:機器人基座 22:Robot base

24:迴旋主體 24: Rotating subject

26:下臂部 26: Lower arm

28:上臂部 28: Upper arm

30:手腕部 30: Wrist

30a:手腕基座 30a: Wrist base

30b:手腕凸緣 30b: Wrist flange

34:移動機構部 34: Mobile mechanism department

50:機械手 50:Manipulator

52:手基座 52: Hand base

A1:軸線 A1: Axis

C1:機器人座標系 C1: Robot coordinate system

C2:工具座標系 C2: Tool coordinate system

Claims (9)

一種機器人系統,其係握持物品者,且具備: 機器人,其具有包含第1吸附口及第2吸附口之機械手;及 控制裝置,其使上述機器人動作而移動上述機械手,執行以該機械手握持上述物品之握持動作;且 上述控制裝置 取得握持對象之上述物品之表面尺寸, 根據取得之上述表面尺寸,決定用於上述握持動作之上述第1吸附口之個數與上述第2吸附口之個數。 A robot system is used for holding an object and comprises: a robot having a manipulator including a first suction port and a second suction port; and a control device which causes the robot to move the manipulator to perform a holding action of holding the object with the manipulator; and the control device obtains the surface size of the object to be held, and determines the number of the first suction port and the number of the second suction port used for the holding action based on the obtained surface size. 如請求項1之機器人系統,其中預先設定各自規定有上述第1吸附口之個數與上述第2吸附口之個數之複數個吸附模式, 上述控制裝置藉由根據上述表面尺寸,選擇上述複數個吸附模式中之1個,而決定上述個數。 For example, in the robot system of claim 1, a plurality of adsorption modes are pre-set, each of which specifies the number of the first adsorption ports and the number of the second adsorption ports. The control device determines the number by selecting one of the plurality of adsorption modes according to the surface size. 如請求項2之機器人系統,其中上述控制裝置 於依照選擇之第1上述吸附模式執行之上述握持動作失敗之情形時,選擇上述第1吸附口之個數與上述第2吸附口之個數之總數少於或多於上述第1吸附模式之第2上述吸附模式, 依照上述第2吸附模式,再次執行上述握持動作。 A robot system as claimed in claim 2, wherein the control device selects a second suction mode in which the total number of the first suction ports and the second suction ports is less than or greater than the first suction mode when the holding action performed according to the selected first suction mode fails, and performs the holding action again according to the second suction mode. 如請求項2之機器人系統,其中上述第1吸附口具有較上述第2吸附口大之上述開口尺寸, 第1上述吸附模式中,將上述第1吸附口之個數規定為1以上,另一方面,將上述第2吸附口之個數規定為零, 第2上述吸附模式中,將上述第2吸附口之個數規定為1以上,另一方面,將上述第1吸附口之個數規定為零, 上述控制裝置於依照選擇之上述第1吸附模式執行之上述握持動作失敗之情形時,選擇上述第2吸附模式, 依照上述第2吸附模式再次執行上述握持動作。 A robot system as claimed in claim 2, wherein the first suction port has an opening size larger than that of the second suction port, In the first suction mode, the number of the first suction ports is set to be 1 or more, and on the other hand, the number of the second suction ports is set to be zero, In the second suction mode, the number of the second suction ports is set to be 1 or more, and on the other hand, the number of the first suction ports is set to be zero, When the holding action performed in accordance with the selected first suction mode fails, the control device selects the second suction mode, and performs the holding action again in accordance with the second suction mode. 如請求項2之機器人系統,其中上述第1吸附口具有大於上述第2吸附口之上述開口尺寸, 第1上述吸附模式中,將上述第2吸附口之個數規定為1以上,另一方面,將上述第1吸附口之個數規定為零, 第2上述吸附模式中,將上述第1吸附口之個數規定為1以上,另一方面,將上述第2吸附口之個數規定為零, 上述控制裝置於依照選擇之上述第1吸附模式執行之上述握持動作失敗之情形時,選擇上述第2吸附模式, 依照上述第2吸附模式再次執行上述握持動作。 A robot system as claimed in claim 2, wherein the first suction port has an opening size larger than that of the second suction port, In the first suction mode, the number of the second suction ports is set to 1 or more, and on the other hand, the number of the first suction ports is set to zero, In the second suction mode, the number of the first suction ports is set to 1 or more, and on the other hand, the number of the second suction ports is set to zero, When the holding action performed in accordance with the selected first suction mode fails, the control device selects the second suction mode, and performs the holding action again in accordance with the second suction mode. 如請求項3至5中任一項之機器人系統,其中複數個上述第1吸附口與複數個上述第2吸附口以於繞上述機械手之軸線之方向排列之方式配置, 上述控制裝置於依照上述第2吸附模式執行上述握持動作時,藉由使上述機械手繞上述軸線旋轉,而將用於該握持動作之上述第1吸附口及上述第2吸附口自上述第1吸附模式切換為上述第2吸附模式。 A robot system as claimed in any one of claims 3 to 5, wherein the plurality of the first suction ports and the plurality of the second suction ports are arranged in a direction around the axis of the robot arm, and when the control device performs the holding action in accordance with the second suction mode, the first suction port and the second suction port used for the holding action are switched from the first suction mode to the second suction mode by rotating the robot arm around the axis. 如請求項1之機器人系統,其中上述機械手進而具有可吸入外氣而吸引握持上述物品之吸入口, 上述第2吸附口具有較上述第1吸附口小之上述開口尺寸, 上述控制裝置於取得之上述表面尺寸小於上述第2吸附口之上述開口尺寸之情形時,執行以上述吸入口吸引握持上述物品之上述握持動作。 A robot system as claimed in claim 1, wherein the robot arm further has a suction port for sucking in external air to hold the object, the second suction port has an opening size smaller than the first suction port, and the control device performs the holding action of sucking and holding the object with the suction port when the surface size obtained is smaller than the opening size of the second suction port. 一種機器人系統,其係握持物品者,且具備: 機器人,其具有包含第1吸附口及第2吸附口之機械手; 視覺感測器,其拍攝上述物品; 控制裝置,其使上述機器人動作而移動上述機械手,執行以該機械手握持上述物品之握持動作;及 機械學習模型,其表示上述物品之圖像資料,與對於該圖像資料中映現之該物品之上述握持動作應使用之上述第1吸附口之個數及上述第2吸附口之個數之相關性;且 上述控制裝置將上述視覺感測器拍攝之圖像資料輸入至上述機械學習模型,根據該機械學習模型輸出之上述個數,決定用於上述握持動作之上述第1吸附口之上述個數與上述第2吸附口之上述個數。 A robot system that holds an object and comprises: a robot having a manipulator including a first suction port and a second suction port; a visual sensor that photographs the object; a control device that moves the robot to move the manipulator to perform a holding action of holding the object with the manipulator; and a mechanical learning model that represents the image data of the object and the correlation between the number of the first suction ports and the number of the second suction ports that should be used for the holding action of the object shown in the image data; and The control device inputs the image data captured by the visual sensor into the mechanical learning model, and determines the number of the first suction ports and the number of the second suction ports used for the holding action according to the number output by the mechanical learning model. 一種方法,其係以包含第1吸附口及第2吸附口之機械手握持物品者,該方法係 取得握持對象之上述物品之表面尺寸, 根據取得之上述表面尺寸,決定用於由上述機械手握持上述物品之握持動作之上述第1吸附口之個數與上述第2吸附口之個數。 A method for holding an object with a robot including a first suction port and a second suction port, wherein the method is to obtain the surface size of the object to be held, and to determine the number of the first suction ports and the number of the second suction ports used for the holding action of the robot to hold the object based on the obtained surface size.
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