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Application filed by United Microelectronics CorpfiledCriticalUnited Microelectronics Corp
Priority to TW086105681ApriorityCriticalpatent/TW363238B/en
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Publication of TW363238BpublicationCriticalpatent/TW363238B/en
Testing Or Measuring Of Semiconductors Or The Like
(AREA)
Abstract
A kind of wafer testing method which employs the probing pad on the cutting line which is to allocate a plurality of probing pads on the cutting line and combines all the similar control pin on the die to the same probing pad, and the data pins are individually linked to different probing pad on the cutting line. The method can reduce the amount of probe pins and avoid that when the pad inside the die has been punched by the pins several times, the metal of pad will be destroyed and cause the apparatus not working so as to influence the quality rate.
TW086105681A1997-04-291997-04-29Wafer testing method for probing pad on the cutting line
TW363238B
(en)
Semiconductor device,production method therefor,method for testing semiconductor elements,test substrate for the method and method for producing the test