523487 五、發明說明（1) -- 【發明的應用範圍】 本發明關於一種以預成型金屬為基材之微電鑄模仁及 其製造方法，特別是關於一種使用焊接材料接合金屬基材 與金屬微結構形成微電鑄模仁的以預成型金屬為基材之微 電鑄模仁及其製造方法。 【發明的背景】 / ▲隨著科技的進步，微小化是微機電產業的趨勢，但必 須能j量製作以降低微小化元件產品之製造成本，因而衍 出付a人世代產業需求之r微系統技術」。微系統技術 二正a積體電路光刻術（DeCp X — Ray Lithography)、電化 學電铸技術（Micro Electroforming)、精密射出成形 (MiCro-Injection)及熱壓成型（Micr〇 —Emb〇ssing)之χ 光 深刻精密電鑄模造成形（LIGA)製程，是量產高深寬比盘高 精度微το件的最佳方法。標準的UGA製程使用同步輻射 X光為光刻源，可製作次微米精度之微結構，且材料的應 用範圍廣泛、，可製造金屬及塑膠的微結構。這些技術的特 ，使得LIGA被公認為最具有技術潛力可開^出高深寬比， 咼，度之=維（2D)及立體（3D)微結構之元件。但因其具有 製程成本高、程序複雜、製程時間長等問題，使得以紫外 光、雷射或電漿作為光源的類liga(uga Uke)製程成 另一種發展趨勢。 類LIGA製程酉己合SU-8負型《阻可使用紫外光源即可得 寬比微結構，運用紫外光源為光刻源的製程稱為 V-LIGA衣程，搭配電鑄技術可製作高深寬比的微結構電 五、發明說明（2) 鎊权仁’以微結構電德 成形及埶m #刑 鑄扠仁作為母模直接運用於塑膠射出 即可製作大量低成本之微小元件。此 A材，於 程搭配之現有電鑄技術多使用矽晶圓為 1 土 #日日0表面蒸鍍金屬薄膜（稱為種子層Seed 有導電性，於矽晶圓表面塗佈光阻定義微結 s ml圓與光阻表面進行電鑄成型複製微結構，再將 石夕晶=光阻去除即得到錢成型之模仁，最後進行機= 以：ίί雷i述微電鑄技術必須電鑄金屬至數毫米的 旱又達，j撻電~模仁所需之塊材強度（Bulk523487 V. Description of the invention (1)-[Scope of application of the invention] The present invention relates to a micro-electroformed mold core using a preformed metal as a substrate and a method for manufacturing the same, and in particular, to a welding material used to join a metal substrate with a metal A microelectroformed mold core with a microstructure forming a microelectroformed mold core using a preformed metal as a base material and a manufacturing method thereof. [Background of the invention] / ▲ With the advancement of technology, miniaturization is a trend in the micro-electromechanical industry, but it must be able to be manufactured in order to reduce the manufacturing cost of miniaturized component products, so it will generate a small amount of demand for generations of industry. System Technology. " Micro system technology II positive integrated circuit lithography (DeCp X — Ray Lithography), electrochemical electroforming technology (Micro Electroforming), precision injection molding (MiCro-Injection) and hot pressing (Micr0-Emb〇ssing) The χ light profound precision electroforming mold forming (LIGA) process is the best method for mass production of high-precision micro το pieces with high aspect ratio disks. The standard UGA process uses synchrotron radiation X-rays as the lithographic source, which can produce sub-micron precision microstructures, and the material has a wide range of applications. It can manufacture metal and plastic microstructures. The characteristics of these technologies make LIGA recognized as having the most technical potential to develop high-aspect-ratio, 咼, degrees = two-dimensional (2D) and three-dimensional (3D) microstructured components. However, because of its high manufacturing cost, complicated procedures, and long manufacturing time, liga (uga Uke) -like processes that use ultraviolet, laser, or plasma as light sources have become another development trend. The LIGA-like process is compatible with the SU-8 negative type. "Ultraviolet light source can be used to obtain the microstructure of the aspect ratio. The process using the ultraviolet light source as the lithographic source is called the V-LIGA clothing process. With the electroforming technology, it can produce high depth V. Microstructure Electricity V. Description of the Invention (2) Pound Quanren's micro-structured electric molding and 埶 m # 刑 投 叉 仁 as a master mold can be directly applied to plastic injection to produce a large number of low-cost micro-components. For this A material, the existing electroforming technology used in the process mostly uses silicon wafers for 1 soil # 日 日 0 surface evaporation metal film (called the seed layer Seed has conductivity, coating photoresist on the surface of the silicon wafer to define the micro The s ml circle and the photoresist surface are electroformed to replicate the microstructure, and then Shi Xijing = the photoresist is removed to obtain the mold core. Finally, the machine is machined. The metal reaches a few millimeters of drought, and the strength of the block required by the tart electricity ~
Strength)，電铸金屬的殘留應力會隨電鑄金屬厚度增加 而上1太仏成了微電鑄模仁之翹曲變•，而後續之機械加 工㈢生應力使微電鑄模仁變形；此變形目前難以控制 加上SU 8負型光阻曝光之後形成硬化樹脂不容易從電鑄模 小 仁之中去除，影響到後續塑膠射出成形及熱壓成型的微，/ 元件之尺寸精度控制成為UV-UGA製程的瓶頸，使得此技 術的發展受到限制。 為減少電鑄模仁產生之變形問題必須克服的是電鑄成 梨之殘留應力，影響電鑄模仁鍍層殘留應力的因素很多， 諸如鍍液成分、pH值、溫度、添加劑、重金屬雜質等，這 呰操作參數實際上都可以在電鑄程序中控制管理，運用適 當的添加劑可將殘留應力調整到較小值。然而，在實際電 鍍時，許多因素會使局部電流密度發生變化，如微結&幾 何形狀的變化、鍍槽設計、電鑄模仁結構材質等均會使局 部電流岔度改變而造成殘留應力，進而導致電禱模仁結構 523487Strength), the residual stress of the electroformed metal will increase with the thickness of the electroformed metal, and it will become a warp change of the microelectrode mold core. The subsequent mechanical processing stress will deform the microelectroform mold core; this deformation is currently It is difficult to control and the hardened resin formed after the exposure of SU 8 negative photoresist is not easy to be removed from the small core of the electroforming mold, which affects the subsequent micro-molding of plastic injection molding and hot pressing. / The dimensional accuracy control of the components has become a UV-UGA process. Bottlenecks limit the development of this technology. In order to reduce the deformation problems caused by the electroforming mold kernel, the residual stress of electroforming into pear must be overcome, and there are many factors that affect the residual stress of the electroforming mold kernel coating, such as plating solution composition, pH value, temperature, additives, heavy metal impurities, etc. The operating parameters can actually be controlled and managed in the electroforming process, and the residual stress can be adjusted to a smaller value by using appropriate additives. However, in actual electroplating, many factors will change the local current density, such as changes in micro-junction & geometry, plating tank design, electroforming mold structure material, etc., will cause the local current bifurcation to change and cause residual stress. Electric Prayer Mould Structure 523487
變形。還有一減少電鑄模仁之 鎿金屬相同之材料取代石夕晶圓 金屬基材製程其電鑄模仁微結 械鍵結強度’結合性差無法滿 與重複使用之壽命等需求。 【發明之目的與概述】 殘留應力的方法為使用與電 作為基材（如金屬鎳），但此 構與金屬基枋之間僅具有機 足作為成型模具所需之強度 、本發明之以預成型金屬為基材之微電鑄模仁及其製造 方法其目的為避免微電鑄模仁之翹曲變形；本發明提二一 種以焊接材料接合金屬基材與電鑄金屬微結構的方法^作 一體成型之微電鑄模仁，以避免習知技術容易產生的微電 鑄杈仁蹺曲變形的問題，並且於熱處理製程中使焊接材料 接合金屬基材與電鑄金屬微結構，同時燒除硬化之光阻材 料，可避免使用光阻去除劑（stripper)並簡化製程；並符 合塑膠射出成型、熱壓成型及合金壓鑄成型使用之微小元 件模具所需要的高硬度、高強度、高精密度、使用壽命長 及耐熱衝擊性等模具特性。 本發明以預成型金屬為基材之微電鑄模仁及其製造方 法’其製造方法包含：於研磨拋光處理之預成形金屬基材 表面形成一層銲接材料；利用旋轉塗佈機將光阻塗佈於金 屬基板表面’利用紫外光透過光罩定義光阻的微結構圖 顯影之後得到高深寬比之光阻微結構；進行電鑄使電 轉材料填入光阻微結構之間隙形成金屬微結構，再拋光加 工金屬微結構與光阻微結構之表面，以免光阻微結構去除 後之加工造成金屬微結構之變形；利用攝氏2〇〇度至12〇〇Deformation. There is also a reduction in the metal material of the electroformed mold to replace the Shixi wafer. The metal substrate process of the electroformed mold has a micro-junction mechanical bond strength that is poor in combination and cannot meet the requirements of longevity and reuse. [Objective and Summary of the Invention] The method of residual stress is to use and electricity as a substrate (such as metal nickel), but this structure and the metal substrate have only the strength required for the machine as a molding mold. A microelectroformed mold core with a formed metal as a base material and a manufacturing method thereof The purpose is to avoid warp deformation of the microelectroformed mold core; the present invention provides a method for joining a metal substrate and a microstructure of an electroformed metal with a welding material as a whole. The formed micro-electroformed mold core avoids the problem of distortion of the micro-electroformed mold core which is easily produced by the conventional technology, and the welding material is bonded to the metal substrate and the electroformed metal microstructure during the heat treatment process, and the hardened Photoresist materials, which can avoid the use of strippers and simplify the manufacturing process; and meet the high hardness, high strength, high precision, and precision required for the micro-component molds used in plastic injection molding, hot-press molding and alloy die-casting molding. Mold characteristics such as long life and thermal shock resistance. The invention relates to a micro-electroformed mold core using a pre-formed metal as a base material and a method for manufacturing the same. The manufacturing method includes: forming a layer of welding material on the surface of the pre-formed metal base material subjected to grinding and polishing treatment; and coating the photoresist with a spin coater. On the surface of the metal substrate, the microstructure of the photoresist is defined by using ultraviolet light through the photomask to develop a photoresist microstructure with a high aspect ratio; electroforming is performed to fill the gap between the photoresist microstructure with the electroconversion material to form a metal microstructure, and then Polish the surface of metal microstructures and photoresist microstructures to prevent deformation of metal microstructures caused by processing after photoresist microstructure removal; use 200 ° C to 1200 °
523487 五、發明說明（4) 度之熱處理使焊接材料接合金屬基材與電鑄之金屬微結構 形成微電鍀模仁並將光阻直接燒除，亦可使用溶劑去除光 阻。 本發明以預成型金屬為基材之微電鑄模仁，其包含有 一金屬基材’金屬基材表面經研磨拋光處理，並預先製作 完成後續製程所需之塑膠射出成形機台及熱壓成形機台所 需之定位機構或夾持部，金屬基材表面覆蓋一焊接材料； 及一電鑄材料，電鑄材料於該金屬基材表面形成一金屬微 結構/，焊接材料接合電鑄材料之金屬微結構與金屬基材形 成:微電鑄模仁；金屬基材可選擇工具鋼、鎳基合金、鈷 基合金、鐵基合金以及金屬模具材料其中之一，焊接材料 可選擇硬銲材料或軟銲材料，硬銲材料可選擇銀系合金、 鉻系口金、鎳系合金和銅系合金其中之一；電鑄材料形 结構高度為以^至1 500 "111，該微結構圖案之深 寬係為1至3〇，電鑄材料可選擇鎳、鎳鈷合金、鎳鎢合 金以及加入填充顆粒增加硬度之合金材料其中之一。口 "ΐϊίΠ所揭露的以預成型金屬為基材之微電鑄模 之機台定位機構與爽持部，”膠射= 金屬壓鑄成形等機台所需之定位機構，=少後： ，免造成微辑模仁變形；在金屬基板形成—^ 作 入電鑄材料，由於本圖案間隙填 微結構圖案間隙:，大幅縮短電習：：：需填入 』苟^知技術所需電鑄 523487 五、發明說明（5) 時間的三分之一；並利用熱處理使焊接材料接合金屬基材 與電鑄金屬微結構形成微電鑄模仁以及將光阻直接燒除， 可減少去光阻劑的使用並簡化製程；金屬基材與電鑄金屬 微結構形成之微電鑄模仁受内應力產生的蹺曲量接近零， 而以習知方法製作之微電鑄模仁蹺曲量約為3〇() Am ;本發 明金屬基材與電铸金屬微結構形成之微電鑄模仁可重複進 行熱壓成形之次數為1 〇 〇 0 0次，習知方法製作之微電鎿模 仁約可進行熱壓30 00次；由此可知本發明可運用於製造更 ，精度之兀件，並減少使用脫模劑同時提升微電鑄模仁的 壽命。 為使對本發明的目的、構造特徵及其功能有進一步的 了解，茲配合圖示詳細說明如下： 【較佳實施例說明】 本發明之以預成型金屬為基材之微電鑄模仁與其製造 方法，其微電铸模仁是以預成型金屬為基材，其金屬基材 表面經研磨拋光處理，並預先製作完成後續製程所需之塑 膠射出成形機台及熱壓成形機台所需之定位機構或夾持 部，利用焊接材料接合金屬基材與電鑄之金屬微結構以形 成微電鑄模仁。本發明以預成型金屬為基材之微電鎢模 仁’其受内應力產生的蹺曲量接近零；並由於後續製程所 需之定位機構或夾持部已製作完成所以不需要再次加工， 可避免微電鑄模仁於加工過程中造成變形；因此，本發明 之以預成型金屬為基材之微電鑄模仁與其製造方法可應用 於需要高精密度的微小元件模具。 ~523487 V. Description of the invention (4) The heat treatment of degree 4 allows the welding material to join the metal substrate and the metal microstructure of the electroformed metal to form a micro-electric mold core and directly burn out the photoresist. You can also use a solvent to remove the photoresist. The present invention is a micro-electroformed mold core using a pre-formed metal as a base material, which includes a metal base material. The surface of the metal base material is ground and polished, and a plastic injection molding machine and a hot press forming machine required for completing subsequent processes are prepared in advance. The positioning mechanism or clamping part required on the table, the surface of the metal substrate is covered with a welding material; and an electroforming material, the electroforming material forms a metal microstructure on the surface of the metal substrate, and the welding material joins the metal of the electroforming material Formation of microstructure and metal substrate: micro-electroformed mold core; metal substrate can choose one of tool steel, nickel-based alloy, cobalt-based alloy, iron-based alloy and metal mold material, and the welding material can choose hard soldering material or soft soldering Materials, brazing materials can choose one of silver-based alloys, chromium-based alloys, nickel-based alloys, and copper-based alloys; the height of the shape structure of the electroformed material is ^ to 1 500 " 111, and the depth and width of the microstructure pattern are From 1 to 30, one of nickel, nickel-cobalt alloy, nickel-tungsten alloy, and alloy material added with filler particles to increase hardness can be selected for the electroforming material.口 " 持 ίΠ disclosed the positioning mechanism and holding part of the micro-electroformed mold based on the preformed metal as the base material, "glue injection = the positioning mechanism required for the machine such as metal die-casting molding, = less after:, free Causes the deformation of the micro-series mold core; formed on the metal substrate—as an electroformed material, because the pattern gap fills the microstructure pattern gap :, which greatly shortens the electric habit ::: need to fill in. ”Known technology requires electroforming 523487 5 2. Description of the invention (5) One third of the time; and the use of heat treatment to join the welding material to the metal substrate and the microstructure of the electroformed metal to form a microelectroformed mold core and directly burn out the photoresist, which can reduce the use of photoresist. And simplify the manufacturing process; the amount of rocking caused by the internal stress of the microelectroformed mold core formed by the metal substrate and the electroformed metal microstructure is close to zero, and the amount of rocking of the microelectroformed mold made by the conventional method is about 30 () Am; the micro-electroformed mold core formed by the metal substrate and the electroformed metal microstructure of the present invention can be repeatedly hot-pressed for 1,000 times, and the micro-electric mold core made by the conventional method can be hot-pressed. 30,000 times; the present invention It is used to manufacture more precise parts, and reduce the use of mold release agents while improving the life of micro-electroformed mold cores. In order to further understand the purpose, structural features and functions of the present invention, the detailed description with the drawings is as follows: [Description of the preferred embodiment] The micro-electroformed mold kernel of the present invention using a preformed metal as a substrate and a method for manufacturing the same, the micro-electroformed mold kernel is based on a preformed metal, and the surface of the metal substrate is polished and polished. In addition, the plastic injection molding machine required for the subsequent process and the positioning mechanism or clamping part required for the hot-press molding machine are prepared in advance, and the metal substrate and the electroformed metal microstructure are joined with a welding material to form a microelectroformed mold core. The micro-electric tungsten mold core based on the preformed metal of the present invention has an amount of rocking caused by internal stress close to zero; and since the positioning mechanism or the clamping part required for the subsequent process has been completed, no re-processing is required. , Can avoid the deformation of the micro-electrode mold during processing; therefore, the micro-electrode mold and its manufacturing method based on the preformed metal of the present invention can be applied Minor elements require high precision molds. ~
第9頁Page 9
523487 五、發明說明（6) 因此，依照本發明的目的，本 金屬為基材之微電鱗模仁與其製造方種以預成型 以下步驟：於預成形金屬基材表面覆蓋一焊ςί方法包含 於一光阻材料金屬基材表面之焊接接材料；塗佈 二過光罩定義光阻材料之圖案 光二:吏用紫外光 成所需之微結構圖案 2卩材枓加以顯影形 金屬基材形成-：id::隙，使電鑄材料與該 使焊接材料接合；微電禱模仁加以熱處理， 第1圖至第ϋ::與ί屬基材並去除光阻材料。 圖；如第丄圖所示製作流程剖面示意 基板1〇表面鐘上—拋光並以丙酮清洗之金屬 鋼、鎳基合金、心：；材：2二J屬基板10選擇工具 中之一；金屬Α你1 η 口 〃鐵基a金以及金屬模具材料其 形機△戶/?二# ΐ γ可預先製作塑膠射出成形以及熱壓成 ί二;Γ:機構與夹持部。焊接材料20係由電鏟 icTheM" ：；Γ：ΓΛ^ ^ ^ 面，Pit# Η其中 方法鍍於該金屬基板10表 材料^可！:的厚度為0·1 (微米）至10 //Π1。此銲接 户理之3士 ^具有擴散接合的功能之硬鋒材料，並且於熱 液相產生以免電鑄的金屬微結構產生變形；其 ^ ^ 料2〇可選擇硬銲材料及軟銲材料其中之一，·如 ㈣為銀系合金、路系合金、錄系合金和銅系 第2圖所不為利用旋轉塗佈方法在金屬基板1 0表面塗 523487 五、發明說明（7) 佈一層光阻材料，再以紫外 影後即可得到高、菜宫μ二 疋義光阻圖形，顯 于到同冰見比的光阻微結構3〇， j為心,至__，深寬比為_ 構的 型光阻材料及負型光阻材料其中之一材枓為正 使巧材枓填滿光阻微結構3〇的間隙 構40 ;其中電鑄材料係為 /风金屬成結 ^ it ^ f I #fr ^ 鎳鈷d金、鎳鎢合金以及加 入填充顆㈣加硬度之合金材料其中之—。 力口 打研磨，光電鑄材料使其高度平整的步驟，避=光f 之加工造成微電鑄模仁變形。第4圖所示為進行埶處理 焊=:20接合金屬微結構4〇與金屬基板ι〇並同時声 =930以形成微電鑄模仁，其中熱處理溫度在：氏 2 0 0度至1 2 0 0度之間，可剎田卜曰枪u i 又牡攝八 .Λ '、、、地埋万法係為真空熱處理、大氧埶 處理、通入氣氛之熱處理其中之一 .Α 轧熱 結構30亦可使用溶劑去除。 /、 材之先阻微 ，過上述方法，本發明可製作出具有高硬度、高強 度、南精密度、使用壽命長及耐熱衝擊性等特性之模具， 符合塑膠射出成型、熱壓成型及合金壓禱成型的微^ 模具之所需。 ^ # 第5圖所不為本發明實施例之以預成型金屬為基材之 微電鑄模仁立體示意圖，其結構包含有：表面經研磨拋光 處理的預成型金屬基板1〇，金屬基板1〇表面覆蓋焊接材料 20，焊接材料20用以接合電鑄之金屬微結構4〇與金屬基板 1 0形成微電鑄模仁。焊接材料以化學擴散及物理熔接其中 523487 五、發明說明（8) 之/一方法接合電鑄之金屬微結構與金屬基材形成一體成形 之微電鎢模仁。微電鑄模仁可使用於塑膠射出成形與熱壓 成形以大量製作塑膠微小元件以及鋁合金、鋅合金和鎂合 金壓鑄成形以大量製作金屬微小元件。 上述結構的材料以及製造方法，皆與上述方法以及其 方法所使用的材料相同，在此不再贅述。 雖然本發明之實施例揭露如上所述，然其並非用以限 定本發明，任何熟習相關技藝者，在不脫離本發明之精神 和範圍内，當可作些許之更動與潤飾，因此本發明之^利 保護範圍須視本說明書所附之申請專利範圍所界定者1523487 V. Description of the invention (6) Therefore, in accordance with the purpose of the present invention, the micro-scale mold core with the metal as the base material and the manufacturing method thereof are preformed with the following steps: covering the surface of the preformed metal base material with a welding method. Welding material on the surface of a photoresist material metal substrate; coating two photomasks to define the pattern of the photoresist material Photo2: using UV light to form the desired microstructure pattern 2 material, and then forming a developing metal substrate -: Id :: gap, so that the electroformed material and the welding material are joined; the micro-electrical mold is heat treated, Figures 1 to ϋ :: and the substrate and remove the photoresist material. Figure; The cross-section of the production process shown in the second figure shows the substrate 10 on the surface of the clock—metal steel, nickel-based alloy, and core polished and washed with acetone: material: 22 is one of the 10 substrate selection tools; metal ΑYou 1 η mouth iron-based a gold and metal mold materials and its shape machine △ 户 /? 二 # ΐ γ can be made in advance by plastic injection molding and hot pressing into two; Γ: mechanism and clamping section. Welding material 20 is made of electric shovel icTheM ": Γ: ΓΛ ^ ^ ^ surface, Pit # Η which method is plated on the metal substrate 10 Table material ^ OK! : The thickness is from 0 · 1 (micron) to 10 // Π1. 3% of this welding household ^ a hard front material with the function of diffusion bonding, and is generated in the hot liquid phase to avoid deformation of the electroformed metal microstructure; its ^ ^ material 20 can choose between hard soldering materials and soldering materials One, Rugao is a silver-based alloy, a road-based alloy, a recording-based alloy, and a copper-based alloy. Figure 2 does not apply the spin coating method to the surface of the metal substrate 10 0 523487. 5. Description of the invention (7) A layer of photoresist Material, and then use ultraviolet shadow to obtain high and cai μ μ-yiyi photoresist pattern, showing the photoresistance microstructure of the same ice ratio 30, j is the heart, to __, the aspect ratio is _ structure One of the photoresist material and negative photoresist material is a gap structure 40 that fills the photoresist microstructure 30 with a positive material; the electroformed material is a / wind metal junction ^ it ^ f I #fr ^ Nickel-cobalt d gold, nickel-tungsten alloy, and alloy materials with filler particles and hardness— The step of grinding and photo-forming the material to make it highly flat, to avoid the deformation of the micro-electrode casting mold caused by the processing of light f. Fig. 4 shows the 埶 treatment welding =: 20 joining the metal microstructure 4〇 and the metal substrate ι〇 and the simultaneous sound = 930 to form a micro-electroformed mold core, wherein the heat treatment temperature is: 200 degrees to 1 2 0 Between 0 degrees, Kesha Tian Bu said that the gun ui and the photo were taken. Λ ',,, and the buried method are one of the vacuum heat treatment, the oxygen treatment, and the heat treatment of the atmosphere. A rolling hot structure 30 It can also be removed using solvents. / 、 The resistance of the material is small. After the above method, the present invention can make a mold with high hardness, high strength, high precision, long service life, and thermal shock resistance. It conforms to plastic injection molding, hot pressing molding and alloy. The pressure is required for forming micro ^ molds. ^ # Figure 5 is not a three-dimensional schematic diagram of a micro-electroformed mold core using a pre-formed metal as a substrate according to an embodiment of the present invention. Its structure includes: a pre-formed metal substrate 10 whose surface is ground and polished, and a metal substrate 10. The surface is covered with a welding material 20, which is used to join the electroformed metal microstructure 40 and the metal substrate 10 to form a microelectroformed mold core. The welding material is chemically diffused and physically welded. 523487 V. One of the methods described in (8) of the invention is to join the electroformed metal microstructure and the metal substrate to form an integrally formed microelectric tungsten mold core. The micro-electrode mold can be used for plastic injection molding and hot-press molding to mass-produce plastic micro-components, and aluminum alloy, zinc alloy and magnesium alloy die-cast molding to mass-produce metal micro-components. The materials and manufacturing methods of the above structures are the same as those used in the above methods and methods, and will not be repeated here. Although the embodiments of the present invention are disclosed as described above, they are not intended to limit the present invention. Any person skilled in the art can make some modifications and retouching without departing from the spirit and scope of the present invention. ^ The scope of protection shall be determined by the scope of the patent application attached to this specification1
第12頁 523487 圖式簡單說明 第1圖至第4圖為本發明較佳實施例之製作流程剖面示 意圖；及 第5圖為本發明實施例之以預成型金屬為基材之微電 鑄模仁立體示意圖。 【圖式符號說明】 10 金屬基板 20 焊接材料 30 光阻微結構 40 金屬微結構Page 12 523487 Brief description of the drawings Figures 1 to 4 are schematic cross-sectional views of the manufacturing process of the preferred embodiment of the present invention; and Figure 5 is a micro-electroformed mold core based on a preformed metal according to an embodiment of the present invention Stereo schematic. [Illustration of Symbols] 10 Metal substrate 20 Welding material 30 Photoresist microstructure 40 Metal microstructure
第13頁Page 13