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TWD138654S1 - Light-emitting diode - Google Patents

Light-emitting diode

Info

Publication number
TWD138654S1
TWD138654S1 TW099300411F TW99300411F TWD138654S1 TW D138654 S1 TWD138654 S1 TW D138654S1 TW 099300411 F TW099300411 F TW 099300411F TW 99300411 F TW99300411 F TW 99300411F TW D138654 S1 TWD138654 S1 TW D138654S1
Authority
TW
Taiwan
Prior art keywords
light
emitting diode
creation
item
resin package
Prior art date
Application number
TW099300411F
Other languages
Chinese (zh)
Inventor
Teruo Takeuchi
Tatsuo Tonedachi
Kazuhisa Iwashita
Satoshi Shimizu
Original Assignee
東芝股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東芝股份有限公司 filed Critical 東芝股份有限公司
Publication of TWD138654S1 publication Critical patent/TWD138654S1/en

Links

Abstract

【物品用途】;本創作的物品是發光二極體，作為電氣機器等之光源使用的發光二極體。;【創作特點】;如各圖所示，是將多個焊接墊封裝在透明之扁矩形狀的樹脂封裝體內，該焊接墊是分成三部分，大體上是由兩側為呈細長的板形體，以及中間為面積較寬且上方配置多個長方形塊狀體的板形體所構成，各個焊接墊之間以金屬線連接，該些焊接墊係如「表示透明部之參考背面立體圖」所示，其底面及四周面分別露出於樹脂封裝體的外表面。[Purpose of the item]; The item in this creation is a light-emitting diode, which is used as a light source for electrical equipment, etc.; [Features of the creation]; As shown in the figures, multiple solder pads are encapsulated in a transparent flat rectangular resin package. The solder pad is divided into three parts, which are generally composed of two thin and long plates on the sides and a wider plate in the middle with multiple rectangular blocks arranged on the top. Each solder pad is connected by a metal wire. As shown in the "Reference back three-dimensional image showing the transparent part", the bottom and surrounding surfaces of these solder pads are exposed on the outer surface of the resin package.

TW099300411F 2009-10-16 2010-01-28 Light-emitting diode TWD138654S1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009024372 2009-10-16

Publications (1)

Publication Number Publication Date
TWD138654S1 true TWD138654S1 (en) 2011-01-11

Family

ID=42734346

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099300411F TWD138654S1 (en) 2009-10-16 2010-01-28 Light-emitting diode

Country Status (2)

Country Link
US (1) USD624031S1 (en)
TW (1) TWD138654S1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD710532S1 (en) * 2014-04-08 2014-08-05 Phoenix Products Company, Inc. Light fixture
USD710533S1 (en) * 2014-04-08 2014-08-05 Phoenix Products Company, Inc. Light fixture
USD710534S1 (en) * 2014-04-08 2014-08-05 Phoenix Products Company, Inc. Light fixture
TWD202085S (en) * 2018-09-04 2020-01-11 晶元光電股份有限公司 Light-emitting device
TWD204008S (en) * 2019-03-22 2020-04-11 晶元光電股份有限公司 Part of light-emitting device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6677667B1 (en) * 2000-11-28 2004-01-13 National Semiconductor Corporation Leadless leadframe package design that provides a greater structural integrity
US6734536B2 (en) * 2001-01-12 2004-05-11 Rohm Co., Ltd. Surface-mounting semiconductor device and method of making the same
JP3638136B2 (en) * 2001-12-27 2005-04-13 株式会社三井ハイテック Lead frame and semiconductor device using the same
US7298034B2 (en) * 2004-06-28 2007-11-20 Semiconductor Components Industries, L.L.C. Multi-chip semiconductor connector assemblies
USD581885S1 (en) 2007-06-14 2008-12-02 Panasonic Corporation Light source of light emitting diode
US20090057855A1 (en) * 2007-08-30 2009-03-05 Maria Clemens Quinones Semiconductor die package including stand off structures

Also Published As

Publication number Publication date
USD624031S1 (en) 2010-09-21

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