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TWI366421B - High thermal conductivity, high glass transition temperature (tg) resin composition and its pre-impregnated and coating materials for printed circuit boards - Google Patents

High thermal conductivity, high glass transition temperature (tg) resin composition and its pre-impregnated and coating materials for printed circuit boards

Info

Publication number
TWI366421B
TWI366421B TW097132040A TW97132040A TWI366421B TW I366421 B TWI366421 B TW I366421B TW 097132040 A TW097132040 A TW 097132040A TW 97132040 A TW97132040 A TW 97132040A TW I366421 B TWI366421 B TW I366421B
Authority
TW
Taiwan
Prior art keywords
impregnated
resin composition
printed circuit
thermal conductivity
transition temperature
Prior art date
Application number
TW097132040A
Other languages
English (en)
Other versions
TW201010531A (en
Inventor
Sung Yueh Shieh
Dein Run Fung
Te Chao Liao
Hao Sheng Chen
Original Assignee
Nanya Plastics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanya Plastics Corp filed Critical Nanya Plastics Corp
Priority to TW097132040A priority Critical patent/TWI366421B/zh
Priority to US12/318,680 priority patent/US20100048789A1/en
Priority to JP2009029596A priority patent/JP5306844B2/ja
Publication of TW201010531A publication Critical patent/TW201010531A/zh
Application granted granted Critical
Publication of TWI366421B publication Critical patent/TWI366421B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Reinforced Plastic Materials (AREA)
  • Epoxy Resins (AREA)
TW097132040A 2008-08-22 2008-08-22 High thermal conductivity, high glass transition temperature (tg) resin composition and its pre-impregnated and coating materials for printed circuit boards TWI366421B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW097132040A TWI366421B (en) 2008-08-22 2008-08-22 High thermal conductivity, high glass transition temperature (tg) resin composition and its pre-impregnated and coating materials for printed circuit boards
US12/318,680 US20100048789A1 (en) 2008-08-22 2009-01-06 Resin composition of high thermal conductivity and high glass transition temperature (Tg) and for use with PCB, and prepreg and coating thereof
JP2009029596A JP5306844B2 (ja) 2008-08-22 2009-02-12 高熱伝導性および高ガラス転位温度（Ｔｇ）を有しプリント基板に使用する樹脂組成物ならびにそれを用いたプリプレグおよびコーティング

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW097132040A TWI366421B (en) 2008-08-22 2008-08-22 High thermal conductivity, high glass transition temperature (tg) resin composition and its pre-impregnated and coating materials for printed circuit boards

Publications (2)

Publication Number Publication Date
TW201010531A TW201010531A (en) 2010-03-01
TWI366421B true TWI366421B (en) 2012-06-11

Family

ID=41696977

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097132040A TWI366421B (en) 2008-08-22 2008-08-22 High thermal conductivity, high glass transition temperature (tg) resin composition and its pre-impregnated and coating materials for printed circuit boards

Country Status (3)

Country Link
US (1) US20100048789A1 (zh)
JP (1) JP5306844B2 (zh)
TW (1) TWI366421B (zh)

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JP2013062379A (ja) * 2011-09-13 2013-04-04 Nitto Denko Corp 熱伝導性シートおよびその製造方法
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TWI465513B (zh) * 2012-08-13 2014-12-21 Taiwan Union Technology Corp 樹脂組合物及其應用
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CN103194044A (zh) * 2013-04-14 2013-07-10 鲍联 一种无卤阻燃环氧树脂组合物
KR102022430B1 (ko) * 2013-05-28 2019-09-18 엘지이노텍 주식회사 에폭시 수지 조성물 및 이를 이용한 절연층을 포함하는 인쇄 회로 기판
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TWI610974B (zh) * 2015-03-24 2018-01-11 上緯企業股份有限公司 雙官能基環氧樹脂與單官能基一級胺硬化劑及／或雙官能基二級胺硬化劑之混合物作為預浸料之用途、含有該混合物之複合材料及其製備方法
CN105235315B (zh) * 2015-09-24 2017-11-28 苏州宽温电子科技有限公司 一种铝基覆铜板及其制备方法
CN106832772A (zh) * 2016-12-30 2017-06-13 深圳先进技术研究院 一种导热陶瓷纳米线/环氧树脂复合材料及其制备方法
CN108202393B (zh) * 2018-01-10 2020-05-08 伍亮英 一种利用线路板粉和镁质胶凝材料生产新型环保板材的方法
KR102080030B1 (ko) * 2018-03-23 2020-02-21 (주)켐트로스 열전도성 접착제 조성물
JP7075254B2 (ja) * 2018-03-23 2022-05-25 日鉄ケミカル＆マテリアル株式会社 エポキシ樹脂組成物、プリプレグ、およびその硬化物
JP2019178271A (ja) * 2018-03-30 2019-10-17 Jnc株式会社 電気伝導性熱膨張制御組成物、電気伝導性熱膨張制御部材、電子機器および電気伝導性熱膨張制御組成物の製造方法
US10796998B1 (en) 2019-04-10 2020-10-06 Gan Systems Inc. Embedded packaging for high voltage, high temperature operation of power semiconductor devices
CN110117407A (zh) * 2019-04-17 2019-08-13 江苏诺德新材料股份有限公司 一种用于无铅制程领域的中Tg 特殊固化材料及其使用方法
CN110272236A (zh) * 2019-07-10 2019-09-24 昆山市益民环保技术开发有限公司 Pcb树脂纤维粉、再生活性炭混合制免烧砖及生产方法
CN111662621A (zh) * 2020-07-08 2020-09-15 铜陵华科电子材料有限公司 一种阻燃型印制电路板用三防漆及其制备方法
US11342248B2 (en) 2020-07-14 2022-05-24 Gan Systems Inc. Embedded die packaging for power semiconductor devices
CN114989757B (zh) * 2022-06-29 2023-04-25 东莞市德聚胶接技术有限公司 一种低温快速固化耐湿热环氧粘结剂及其制备方法和应用
CN115304994A (zh) * 2022-09-06 2022-11-08 广东施奈仕实业有限公司 快干型高附着性改性聚氨酯三防漆的配方及其制备方法
CN119307046B (zh) * 2024-12-16 2025-04-25 日丰新材有限公司 一种ppr管材及其制备方法和应用

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Also Published As

Publication number Publication date
US20100048789A1 (en) 2010-02-25
TW201010531A (en) 2010-03-01
JP5306844B2 (ja) 2013-10-02
JP2010047743A (ja) 2010-03-04

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MM4A Annulment or lapse of patent due to non-payment of fees