TWI632383B - Electronic component transfer device and electronic component inspection device - Google Patents

Abstract

An object of the present invention is to provide an electronic component transfer device and an electronic component inspection device capable of controlling electronic components to a target temperature with high accuracy.

The electronic component transfer device includes a robot arm portion 50 that can transfer a plurality of electronic components, a distribution portion that is provided on the robot arm portion 50 and can distribute the refrigerant that cools the plurality of electronic components to a plurality of flow paths; It is arranged on the mechanical arm portion 50 and can collect the refrigerant after cooling the plurality of electronic parts from the plurality of flow paths. The electronic component inspection device includes a robot arm portion 50 capable of transporting a plurality of electronic components, a distribution portion included in the robot arm portion 50 and capable of distributing a refrigerant for cooling the plurality of electronic components to a plurality of flow paths, and a collection portion It is included in the robot arm part 50 and can collect the refrigerant after cooling the plurality of electronic parts from the plurality of flow paths; and the inspection part for inspecting the electronic parts.

Description

Electronic component transfer device and electronic component inspection device

The present invention relates to an electronic component transfer device and an electronic component inspection device.

Conventionally, there has been known an electronic part inspection apparatus that transports electronic parts such as IC devices and checks the electrical characteristics of the electronic parts. As an example of the electronic component inspection device, for example, Patent Document 1 discloses an electronic component processing device. The electronic component processing device of Patent Document 1 includes a test head for inspecting electronic components, and a pushing device that holds the electronic components and pushes the electronic components to the test head. In Patent Document 1, the test head and the pushing device are disposed in a chamber. In the chamber, in order to adjust the temperature in the chamber, a heat-absorbing heat exchanger for circulating a refrigerant such as liquid nitrogen is provided. Thereby, the temperature in the chamber is maintained at a specific low temperature. With this configuration, in the electronic component processing apparatus of Patent Document 1, the electronic component is transported and inspected in a low-temperature environment.

In addition, an electronic component inspection device that inserts electronic components such as semiconductor elements into an inspection socket and inspects (tests) the electrical characteristics of the electronic components has been known (see, for example, Patent Document 1). In the electronic component inspection device described in Patent Document 1, when performing the above inspection, the inspection can be performed while pushing the electronic component to the inspection socket by the pushing device. In addition, a plurality of pushing devices are provided corresponding to the electronic parts, and a heater for heating the electronic parts to a temperature suitable for the inspection is built in.

In addition, an electronic component inspection apparatus for inspecting the electrical characteristics of electronic components such as semiconductor elements has been conventionally known. As the electronic component inspection device, there is a person who heats an electronic component in a test chamber and inspects the electronic component (for example, refer to Patent Literature) 1). The electronic component inspection device described in Patent Document 1 includes a pushing device that presses an electronic component against a socket during inspection in a test chamber. A heater is built into the pushing device to control a heating temperature relative to the electronic component.

[Prior technical literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2003-28923

However, in such a conventional electronic component inspection device (the electronic component processing device of Patent Document 1), although the entire chamber is kept at a low temperature by a heat-absorbing heat exchanger, the inspection of the electronic components is not performed as described above. The temperature becomes a control of a specific temperature. Therefore, it is difficult to accurately control the temperature of the electronic parts being inspected.

Further, in the electronic component inspection device described in Patent Document 1, since a plurality of pushing devices are provided corresponding to the electronic components, the number of installation devices can be increased or decreased. Therefore, for example, when a pushing device is to be added, the number of connectors used to supply power to the heater may be insufficient according to the number of the added devices.

Further, in the electronic component inspection device described in Patent Document 1, one heater can be heated correspondingly to one electronic component. However, for example, the distance between the pushing devices must be narrowed according to the size of the electronic parts. In this case, it is difficult to arrange one heater with a predetermined size for one electronic part in the pushing device. As a result, for example, a configuration in which a plurality of electronic components are heated by one heater has to be adopted, and a problem arises that the heating temperature of each electronic component cannot be accurately controlled.

The present invention has been made to solve at least a part of the problems described above, and can be achieved by the following.

[Application Example 1] The electronic component transfer device of this application example is characterized by having a robot arm. Section, which can carry a plurality of electronic parts; a distribution section, which is provided on the robot arm section, can distribute the refrigerant cooling the plurality of electronic parts to a plurality of flow paths; and a collection section, which is provided on the robot arm section, The refrigerant after cooling the plurality of electronic components can be collected from the plurality of flow paths.

According to such an electronic component transfer device, the electronic component can be cooled by supplying a refrigerant to the robot arm portion. Therefore, the electronic component can be efficiently cooled, and therefore, the electronic component can be controlled to a target temperature with high accuracy.

[Application Example 2] In the electronic component transfer device described in the above application example, it is preferable that the robot arm portion has a plurality of connection portions that connect to the holding portion that holds the electronic component, and starts from a plurality of streams of the distribution portion. The passage and a plurality of flow paths leading to the collection section are connected to the connection section, respectively.

Accordingly, the electronic component can be efficiently cooled by supplying a refrigerant to the connection portion.

[Application Example 3] In the electronic component transfer device described in the above application example, it is preferable that the distribution unit has a supply flow path for supplying a refrigerant for cooling the plurality of electronic parts, and a plurality of branches branched from the supply flow path. Distribution flow.

Thereby, the refrigerant supplied to one supply flow path can be distributed to a plurality of distribution flow paths. In this way, the refrigerant can be distributed from one site to a plurality of sites.

[Application Example 4] In the electronic component conveying device described in the above application example, it is preferable that the collection unit includes a discharge flow path for discharging the refrigerant after cooling the plurality of electronic parts, and a collection branched from the discharge flow path. Flow path.

Thereby, the refrigerant discharged from the plurality of discharge channels can be collected in one collection channel. In this way, the refrigerant can be collected from a plurality of locations at one location.

[Application Example 5] In the electronic component conveying device described in the application example, it is preferable that the distribution flow path is provided closer to the front end side of the robot arm portion than the collection flow path.

This allows more efficient supply and collection of refrigerant.

[Application Example 6] In the electronic component transporting device described in the application example, it is preferable that the distribution unit and the collection unit are included in one member.

Accordingly, since the distribution section and the collection section can be provided in a unified manner, it is easy to install a device (connection to a cooling mechanism) for supplying refrigerant to the distribution section and recovering the refrigerant from the collection section.

[Application Example 7] In the electronic component conveying device described in the application example, it is preferable that the member is disposed on a side portion of the robot arm portion.

Thereby, it is possible to effectively use a space located on a side portion of the robot arm portion to install a member.

[Application Example 8] In the electronic component transporting device described in the above application example, it is preferable that the member is configured by including a resin.

Thereby, a member having an arbitrary shape can be more easily formed. Moreover, by including a resin, a member can be made lightweight.

[Application Example 9] In the electronic component transfer device described in the above application example, it is preferable that a plurality of holding portions capable of holding the electronic components may be disposed in the robot arm portion, and the components are provided closer to the holding portion than the holding portions The proximal end side of the robot arm portion.

Thereby, it is possible to effectively use a space located on a side portion of the robot arm portion to install a member.

[Application Example 10] In the electronic component transfer device described in the above application example, it is preferable that a plurality of piping for the distribution section is connected to the distribution section, and at least two of the piping for the plurality of distribution sections are from The distribution portions extend in directions different from each other.

This allows the refrigerant to circulate more efficiently and uniformly, so that the temperature of the plurality of electronic components can be controlled to be more uniform.

[Application Example 11] In the electronic component conveying device described in the application example, it is preferable that the plurality of piping systems for the distribution sections are symmetrically arranged with respect to the distribution sections.

Thereby, since the refrigerant can be more efficiently and evenly distributed, the temperature of the plurality of electronic components can be controlled to be more uniform.

[Application Example 12] In the electronic component transporting device described in the application example, it is preferable that the pipe for the distribution portion has a portion extending along a side portion of the robot arm portion.

Thereby, the space for the side part of a robot arm part can be used effectively, and the piping for a distribution part can be provided.

[Application Example 13] In the electronic component transporting device described in the above application example, it is preferable that the robot arm portion has a plurality of connection portions connected to the holding portions that hold the electronic components, and is connected to the plurality of connection portions, respectively. There is a piping for the distribution section.

This allows the refrigerant to flow through the connection portion.

[Application Example 14] In the electronic component transfer device described in the above application example, it is preferable that a plurality of pipings for the collection section are connected to the collection section, and at least two of the pipings for the plurality of collection sections are from The collection portions extend in directions different from each other.

This allows the refrigerant to circulate more efficiently.

[Application Example 15] In the electronic component transporting device described in the above application example, it is preferable that the plurality of piping systems for the collection section are symmetrically disposed with respect to the collection section.

This allows the refrigerant to circulate more efficiently.

[Application Example 16] In the electronic component transporting device described in the above application example, it is preferable that the pipe for the collecting portion has a portion extending along a side portion of the robot arm portion.

Thereby, the space for the side part of a robot arm part can be used effectively, and the piping for a collection part can be provided.

[Application Example 17] In the electronic component conveying device described in the above application example, it is preferable that the robot arm portion has a plurality of connection portions connected to the holding portions that hold the electronic components, and is connected to the plurality of connection portions, respectively. There is a piping for the collection section.

This makes it possible to more efficiently circulate the refrigerant through the connection portion.

[Application Example 18] In the electronic component transporting device described in the above application example, it is preferable that the pipe for the collecting section has a ring portion formed in a ring shape.

Thereby, the piping resistance (flow resistance) of the piping for a collection part can be effectively reduced.

[Application Example 19] In the electronic component conveying device described in the above application example, it is preferable that the ring portion is bent toward the base end side of the robot arm portion and then faces the robot arm. The front side of the part is curved.

Thereby, the piping resistance (flow resistance) of the piping for a collection part can be effectively reduced.

[Application Example 20] The electronic component inspection device of this application example is characterized in that it has a mechanical arm portion that can transport a plurality of electronic components, and a distribution portion that is provided on the mechanical arm portion and can cool the plurality of electronic components. Refrigerant is distributed to a plurality of flow paths; a collection section, which is provided at the above-mentioned mechanical arm section, can collect the refrigerant after cooling the plurality of electronic parts from the plurality of flow paths; and an inspection section, which checks the electronic parts.

According to such an electronic component inspection device, the electronic component can be cooled by supplying a refrigerant to the robot arm portion. Therefore, the electronic component can be efficiently cooled, and therefore, the electronic component can be controlled to a target temperature with high accuracy. Therefore, the inspection accuracy of electronic parts can be further improved.

[Application Example 21] The electronic component transfer device of this application example is characterized in that it has a base portion for mounting a plurality of heating portions for heating electronic components, and a first connection portion which can be used to belong to one of the plurality of heating portions. The heating unit of the group supplies power; and a second connection unit that can supply power to a heating unit belonging to another group different from the group of the plurality of heating units.

According to such an electronic component transfer device, even when a heating section is added, power can be supplied to the added heating section.

[Application Example 22] In the electronic component transporting device described in Application Example 21, it is preferable that the first connection portion and the second connection portion are disposed at positions different from each other.

Thereby, the connection work with respect to a 1st connection part and the connection work with a 2nd connection part can be performed accurately, respectively, Therefore, erroneous connection can be reduced.

[Application Example 23] In the electronic component transporting device described in Application Example 21 or 22 above, it is preferable that the first connection portion and the second connection portion are disposed on the base portion.

This makes it possible to easily perform connection work to each of the first connection portion and the second connection portion.

[Application Example 24] In the electronic component transfer device described in Application Example 23, it is preferable that the first connection portion and the second connection portion are disposed on opposite sides of the base portion via the base portion.

Thereby, the connection work with respect to a 1st connection part and the connection work with a 2nd connection part can be performed accurately, respectively, Therefore, erroneous connection can be reduced.

[Application Example 25] In the electronic component transfer device described in any one of Application Examples 21 to 24, it is preferable that the electronic component transfer device includes a supply section that supplies the electronic component to the heating section, and recovers the electrons from the heating section. A part collection part, and the first connection part is disposed on the supply part side, and the second connection part is disposed on the recovery part side.

Thereby, the connection work with respect to a 1st connection part and the connection work with a 2nd connection part can be performed accurately, respectively, Therefore, erroneous connection can be reduced.

[Application Example 26] In the electronic component transporting device described in any one of the above Application Examples 21 to 25, it is preferable that the electronic component transfer device has a window portion that can visually recognize the base portion at the nearest position, and faces the window portion on one side The first connection portion is disposed, and the second connection portion is disposed on the other side.

Thereby, the connection work with respect to a 1st connection part and the connection work with a 2nd connection part can be performed accurately, respectively, Therefore, erroneous connection can be reduced. Moreover, each connection operation can be performed while confirming through a window part.

[Application Example 27] In the electronic component transporting device described in any one of the above Application Examples 21 to 26, it is preferable that the heating section has a heater that generates heat due to energization, and a temperature that detects the temperature of the heating section. Sensor.

Thereby, the heating part can easily and quickly heat the electronic component. In addition, the temperature of each heating section can be detected as accurately as possible, and the electronic parts can be adjusted to a temperature suitable for inspection based on the detection result.

[Application Example 28] In the electronic component transporting device described in Application Example 27, it is preferable that the first connection portion and the second connection portion each have a first connector connected to the heater, and connected to the heater. The plurality of second connectors of the temperature sensor.

Thereby, the first connection part and the second connection part individually have the first connector and the second connector with different functions. Therefore, for example, it is possible to suppress the second connector from being affected by noise generated by the first connector.

[Application Example 29] In the electronic component transporting device described in Application Example 28, it is preferable that each of the second connectors is disposed through the first connector.

As a result, the configuration balance is relatively good, and for example, it is related to the reduction of misconnections.

[Application Example 30] In the electronic component conveying device described in Application Example 28 or 29, it is preferable that the first connector and each of the second connectors are aligned in a horizontal direction.

Here, if it is assumed that the first connector and each second connector are arranged in the vertical direction, the connection operation of the connector located at the bottom tends to be more difficult than the connection operation of other connectors. Worried about workability degradation. Therefore, by arranging the first connector and each second connector in the horizontal direction, the workability of the connection work to each connector is substantially the same.

[Application Example 31] In the electronic component conveying device described in any one of Application Examples 21 to 30, it is preferable that a connection direction of each of the first connection portion and the second connection portion is a horizontal direction.

Thereby, for example, the connection operation to the first connection portion and the connection operation to the second connection portion can be confirmed from the back side of the electronic component transporting device, respectively. Therefore, each connection operation can be easily and accurately performed.

[Application Example 32] In the electronic component transfer device described in any one of Application Examples 21 to 31, it is preferable that the connection directions of the first connection portion and the second connection portion are opposite to each other.

Thereby, the connection work with respect to a 1st connection part and the connection work with a 2nd connection part can be performed accurately, respectively, Therefore, erroneous connection can be reduced.

[Application Example 33] The electronic component transfer described in any one of the above Application Examples 21 to 32 In the device, it is preferable that the heating section is provided with a specific number, and the first connection section can supply power to the heating section provided with the specific number.

With this, if the number of heating sections is 1 to 8, the use of the second connection section can be stopped, and only the first connection section can supply the power to each heating section.

[Application Example 34] In the electronic component transporting device described in Application Example 33, it is preferable that the second connection section can supply power to heating sections exceeding the specific number.

With this, even if the number of heating sections is increased from eight, the second connection section can supply power to the heating section of the additional section.

[Application Example 35] In the electronic component transfer device described in Application Example 33 or 34, it is preferable that the specific number is eight.

Thereby, it is the number of installation of the heating part corresponding to a standard electronic parts transfer apparatus.

[Application Example 36] In the electronic component transporting device described in any one of the above Application Examples 21 to 35, it is preferable to have a detection section that detects a part that is not in the first connection section and the second connection section. Which one to connect.

This prevents the connection from being forgotten to the first connection portion or the second connection portion.

[Application Example 37] In the electronic component transporting device described in Application Example 36, it is preferable that the detection unit is composed of a serial wiring, and when the serial wiring is disconnected, the detection is not performed on the first connection. And the second connection portion described above.

Thereby, the detection section can be configured with a simple structure using serial wiring.

[Application Example 38] In the electronic component transporting device described in any one of the above Application Examples 21 to 36, it is preferable to have a setting section that can set whether or not to use the second connection section and can display it.

As a result, the user using the electronic component transfer device can appropriately change the appearance of using the first connection portion and the second connection portion, and the appearance of using only the first connection portion without using the second connection portion.

[Application Example 39] In the electronic component transfer device described in any one of the above Application Examples 21 to 37, it is preferable that the first connection can be used on the screen display when the second connection portion is not used. In the case of using the second connection portion, the situation of using the first connection portion and the second connection portion can be displayed on the screen.

With this, the temperature of each heating section can be appropriately set individually regardless of the number of the heating sections provided.

[Application Example 40] The electronic component inspection device of this application example is characterized in that it has a base portion for mounting a plurality of heating portions for heating electronic parts, and a first connection portion which can belong to one of the plurality of heating portions. The heating unit of the group supplies electric power; the second connection unit can supply power to the heating unit belonging to another group different from the one group among the plurality of heating units; and an inspection unit that inspects the electronic components.

According to such an electronic component inspection device, even when a heating section is added, power can be supplied to the additional heating section.

[Application Example 41] The electronic component transporting device of this application example is characterized in that it includes a plurality of holding portions that can hold electronic parts, a posture changing portion that can change the posture of the holding portion, and a heating portion that is provided at The holding portion can heat the electronic component.

According to such an electronic component conveying device, a configuration can be adopted in which one heating portion is arranged in one holding portion with respect to one electronic component. With this configuration, when heating the electronic parts held by the holding part, it is possible to accurately control the temperature of each heating of the electronic parts.

[Application Example 42] In the electronic component transporting device described in Application Example 41, it is preferable that the heating section includes a rod heater.

Thereby, the distance between the adjacent holding parts can be set as small as possible, and the electronic parts can be appropriately heated.

[Application Example 43] In the electronic component transporting device described in Application Example 42, the rod heater is preferably one having a total length of 35 mm or more and 40 mm or less.

Thereby, the distance between the adjacent holding portions can be set as small as possible.

[Application Example 44] In the electronic component transporting device described in Application Example 42 or 43 above, it is preferable to include: a temperature sensor provided in the holding portion to detect the temperature of the electronic component; and a temperature fuse, It is arranged on the holding part, and blocks the current when the current above the rated current flows in the rod heater; and the full length of the rod heater is longer than the full length of the temperature sensor and the full length of the temperature fuse Either of them is long.

Thereby, it is possible to fully design the installation position of the longest-length rod heater among the rod heaters, temperature sensors, and temperature fuses in the holding portion.

[Application Example 45] In the electronic component transfer device described in any one of the above Application Examples 41 to 44, it is preferable that the holding portion has a step portion in a plan view, and the adjacent holding portions are the steps. The parts face each other in opposite directions.

Therefore, for example, when the heating portion is a rod heater, the distance between adjacent gripping portions can be minimized while ensuring the installation position of the rod heater.

[Application Example 46] In the electronic component transporting device described in Application Example 45, it is preferable that the heating portion and the step portion overlap in a plan view.

Thereby, the step portion can be a part of the installation portion of the heating portion of the holding portion, and the step portion can be effectively used.

[Application Example 47] In the electronic component transporting device described in Application Example 45 or 46, it is preferable that the heating section has wiring for supplying power, and the heating sections provided in the adjacent holding section are connected to each other as described above. The wirings protrude toward each other.

Thereby, wiring can be routed between adjacent gripping portions, so that the wiring is prevented from being caught by other structures around the gripping portions.

[Application Example 48] In the electronic component transporting device described in any one of the above-mentioned Application Examples 41 to 47, it is preferable that the holding portion is formed in an L shape in a plan view.

With this, for example, when the heating section is a rod heater, the rod can be secured at the same time. On the side where the heater is installed, the distance between adjacent grips should be as small as possible.

[Application Example 49] In the electronic component transporting device described in any one of the above Application Examples 41 to 48, it is preferable that the posture changing section includes an air chamber whose volume can be changed.

Therefore, when the holding part holds the electronic part, it can play a buffering function to the electronic part, that is, cushioning, and conform to the posture of the electronic part. Therefore, the electronic part can be safely and accurately held.

[Application Example 50] In the electronic component transporting device described in any one of the above Application Examples 41 to 49, it is preferable that a means for blocking the heat from the heating section is provided between the posture changing section and the holding section. Thermal insulation components.

This can prevent heat from being transmitted from the heating section to the posture changing section, and thus can prevent the posture change of the gripping section from being affected by heat.

[Application Example 51] In the electronic component conveying device described in any one of the above Application Examples 41 to 50, it is preferable that the heating sections provided in the adjacent gripping sections are related to each other. The distances between the points are halved and arranged symmetrically.

With this, the electronic parts can be heated to the same degree regardless of which of the adjacent holding parts is held by them.

[Application Example 52] In the electronic component transfer device described in any one of the above Application Examples 41 to 51, it is preferable that the electronic component transfer device includes an inspection area for performing an electrical inspection of the electronic component, and the holding portion is disposed in the inspection. region.

Thereby, for example, when the temperature adjustment is performed by heating before the electronic component is held by the holding portion, the temperature adjustment state can be maintained to perform the electrical inspection of the electronic component.

[Application Example 53] In the electronic component transporting device described in any one of the above-mentioned Application Examples 41 to 52, it is preferable that the distance between the adjacent gripping portions is 40 mm or less.

With this, for example, when the gripping unit, the posture changing unit, and the heating unit are unitized. In this case, miniaturization of the unitized structure can be achieved.

[Application Example 54] The electronic component inspection device of this application example is provided with: a plurality of holding portions that can hold electronic components; a posture changing portion that can change the posture of the holding portion; a heating portion that is the same as the above The holding portion is provided correspondingly to heat the electronic component, and the inspection portion checks the electronic component.

According to such an electronic component inspection apparatus, it is possible to adopt a configuration in which one heating portion is disposed in the holding portion with respect to one electronic component. With this configuration, when heating the electronic parts held by the holding part, it is possible to accurately control the temperature of each heating of the electronic parts.

1‧‧‧Inspection device

3‧‧‧ the first connection

3a‧‧‧1st connector

3b‧‧‧2nd connector

4‧‧‧ 2nd connection section

4a‧‧‧1st connector

4b‧‧‧2nd connector

5‧‧‧head

5a‧‧‧head

5b‧‧‧head

5c‧‧‧head

5d‧‧‧head

6‧‧‧ Manifold

7‧‧‧ Piping Department for Distribution Department

8‧‧‧ Piping Department for Collection Department

9‧‧‧ holding section

10‧‧‧cooling unit

11A‧‧‧Tray transfer mechanism

11B‧‧‧Tray transfer mechanism

12‧‧‧Temperature Adjustment Department

13‧‧‧ supply robot

14‧‧‧Device Supply Department

15‧‧‧Supply empty pallet transfer mechanism

16‧‧‧ Inspection Department

17‧‧‧ device transfer head

18‧‧‧Electronic Parts Recycling Department

19‧‧‧Recycling tray

20‧‧‧Recycling robot

21‧‧‧Recycling empty pallet transfer mechanism

22A‧‧‧Tray transfer mechanism

22B‧‧‧Tray transfer mechanism

23‧‧‧Pressing unit

23A‧‧‧Pressing unit

24‧‧‧The first connection

25‧‧‧The second connection

26‧‧‧Serial wiring

27‧‧‧Support

28‧‧‧cooling mechanism

29‧‧‧ Dry air supply mechanism

30‧‧‧Control device

31‧‧‧Control Department

32‧‧‧Memory Department

40‧‧‧ Setting display section

41‧‧‧Display

42‧‧‧Operation Department

50‧‧‧ Robot arm

51‧‧‧ support

52‧‧‧Pressing section

53‧‧‧Connection Department

54‧‧‧Connecting components

55‧‧‧The first form

56‧‧‧ The second form

56A‧‧‧The second form

58‧‧‧The third form

61‧‧‧ Distribution Department

62‧‧‧Collection Department

71‧‧‧Piping for distribution department

72‧‧‧ Piping for distribution department

73‧‧‧ Piping for distribution department

74‧‧‧ Piping for distribution department

81‧‧‧Piping for collection department

82‧‧‧Pipe for collection department

83‧‧‧Piping for collection department

84‧‧‧Piping for collection department

90‧‧‧IC device

91‧‧‧ relay component

92‧‧‧ abutment department

93‧‧‧Pt sensor

100‧‧‧ transport device

101‧‧‧ front cover

102‧‧‧side cover

103‧‧‧side cover

104‧‧‧back cover

105‧‧‧ Upper cover

106‧‧‧ the first partition

107‧‧‧ The second partition

108‧‧‧ 3rd partition

109‧‧‧ 4th partition

110‧‧‧ 5th partition

112‧‧‧Temperature Adjustment Department

113‧‧‧device transfer head

114‧‧‧Device Supply Department

115‧‧‧Tray transfer mechanism

116‧‧‧ Inspection Department

117‧‧‧device transfer head

118‧‧‧Device Recycling Department

120‧‧‧device transfer head

121‧‧‧Tray transfer mechanism

161‧‧‧holding department

171‧‧‧base

172‧‧‧pedestal

173‧‧‧ Pillar

174‧‧‧Support components

175‧‧‧ supporting components

200‧‧‧tray

203‧‧‧holding department

204‧‧‧ Posture Change Department

205‧‧‧ Rod heater

206‧‧‧Insulation component

208‧‧‧Temperature sensor

209‧‧‧temperature fuse

210‧‧‧Electronic parts transfer device

212‧‧‧Temperature Adjustment Department

213‧‧‧device transfer head

214‧‧‧Device Supply Department

215‧‧‧pallet transfer mechanism

216‧‧‧Inspection Department

217‧‧‧device transfer head

218‧‧‧Device Recycling Department

220‧‧‧ device transfer head

221‧‧‧Tray transfer mechanism

230‧‧‧ holding unit

230A‧‧‧The first holding unit

230B‧‧‧The second holding unit

230C‧‧‧The third holding unit

230D‧‧‧4th holding unit

230E‧‧‧The fifth holding unit

230F‧‧‧6th holding unit

230G‧‧‧7th holding unit

230H‧‧‧8th holding unit

231‧‧‧Heating Department

231a‧‧‧The first heating section

231b‧‧‧Second heating section

231c‧‧‧The third heating section

231d‧‧‧The fourth heating section

231e‧‧‧The fifth heating section

231f‧‧‧6th heating section

231g‧‧‧7th heating section

231h‧‧‧8th heating section

231i‧‧‧9th heating section

231j‧‧‧10th heating section

231k‧‧‧11th heating section

231L‧‧‧12th heating section

232‧‧‧Support Department

233‧‧‧heater

234‧‧‧Temperature sensor

241‧‧‧1st connector

242‧‧‧ 2nd connector

251‧‧‧1st connector

252‧‧‧ 2nd connector

261‧‧‧ lower surface

262‧‧‧ attract

263‧‧‧step difference

264‧‧‧Gap

271‧‧‧Air chamber

281‧‧‧Heating tube

282‧‧‧Wiring

291‧‧‧ Resistor

292‧‧‧Wiring

300‧‧‧ monitor

301‧‧‧display screen (display section)

303a‧‧‧holding section

303b‧‧‧holding section

305‧‧‧ Rod heater

308‧‧‧Temperature sensor

309‧‧‧temperature fuse

311‧‧‧Drive Control Department

312‧‧‧ Inspection Control Department

317‧‧‧device transfer head

330‧‧‧ holding unit

330A‧‧‧The first holding unit

330B‧‧‧The second holding unit

400‧‧‧ signal light

411‧‧‧Monitor

421‧‧‧Mouse

500‧‧‧Speaker

501‧‧‧side

511‧‧‧ hook

512‧‧‧ hook

521‧‧‧cylinder

522‧‧‧Piston

523‧‧‧Hollow Department

524‧‧‧flow

525‧‧‧ diaphragm

531‧‧‧flow

551‧‧‧The first menu

552‧‧‧Menu 2

553‧‧‧Menu 3

554‧‧‧Menu 4

561‧‧‧The first menu

562‧‧‧Menu 2

563‧‧‧Menu 3

564‧‧‧Menu 4

565‧‧‧Menu 5

566‧‧‧Menu 6

567‧‧‧Menu 7

568‧‧‧Menu 8

569‧‧‧Menu 9

570‧‧‧Menu 10

571‧‧‧Menu 11

571A‧‧‧Menu 11

572‧‧‧Menu 12

572A‧‧‧Menu 12

573‧‧‧Menu 13

574‧‧‧Menu 14

581‧‧‧The first menu

582‧‧‧Menu 2

583‧‧‧Menu 3

584‧‧‧Menu 4

585‧‧‧Menu 5

586‧‧‧Menu 6

587‧‧‧Menu 7

588‧‧‧Menu 8

589‧‧‧Menu 9

590‧‧‧Menu 10

591‧‧‧11th menu

592‧‧‧Menu 12

600‧‧‧Mouse Station

611‧‧‧ distribution channel

612‧‧‧Distribution flow path

613‧‧‧Distribution flow path

614‧‧‧Distribution flow path

615‧‧‧ supply channel

621‧‧‧collection channel

622‧‧‧collection channel

623‧‧‧collection channel

624‧‧‧collection channel

625‧‧‧Exhaust flow path

700‧‧‧ operation panel

711‧‧‧connector

712‧‧‧connector

721‧‧‧ connector

722‧‧‧connector

730‧‧‧Window

731‧‧‧connector

732‧‧‧connector

741‧‧‧ connector

742‧‧‧connector

800‧‧‧ Control Department

811‧‧‧ connector

812‧‧‧ connector

813‧‧‧Ring

821‧‧‧ connector

822‧‧‧connector

823‧‧‧Circle

831‧‧‧ connector

832‧‧‧ connector

833‧‧‧Ring

841‧‧‧ connector

842‧‧‧ connector

843‧‧‧Ring

900‧‧‧ external power supply

1000‧‧‧ Inspection device

1000A‧‧‧Inspection device

2000‧‧‧Electronic parts inspection device

2000A‧‧‧Inspection device

6151‧‧‧ opening

6251‧‧‧flow

6252‧‧‧flow

6253‧‧‧Piping

6254‧‧‧ opening

6255‧‧‧ opening

6256‧‧‧ opening

A‧‧‧ arrow symbol

A1‧‧‧Tray supply area (area)

A2‧‧‧Device supply area (area)

A3‧‧‧ Inspection area (area)

A4‧‧‧device recycling area (area)

A5‧‧‧Tray removal area (area)

AR1‧‧‧Connection direction

AR1a‧‧‧Connection direction

AR2‧‧‧Connection direction

AR2a‧‧‧Connection direction

B‧‧‧ arrow symbol

F52‧‧‧Activating fluid

G1‧‧‧Group 1

G2‧‧‧Group 2

L ₉ ‧‧‧ full length

L ₅₁ ‧‧‧ full length

L ₈₁ ‧‧‧ full length

O ₅₀ ‧‧‧center

O ₅₁ ‧‧‧center

OL ₁₇₁ ‧‧‧ Outline

P _X ‧‧‧Pitch

P _Y ‧‧‧Distance between pitches

R‧‧‧ Refrigerant

R1‧‧‧Room 1

R2‧‧‧Room 2

R3‧‧‧Room 3

S ₅₁ ‧‧‧line

X‧‧‧ direction

Y‧‧‧ direction

Z‧‧‧ direction

α _11A ‧‧‧ Arrow symbol

α _11B ‧‧‧ Arrow symbol

α _13X ‧‧‧ arrow symbol

α _13Y ‧‧‧ arrow symbol

α ₁₄ ‧‧‧arrow

α ₁₅ ‧‧‧ arrow symbol

α _17Y ‧‧‧Arrow symbol

α ₁₈ ‧‧‧ arrow symbol

α _20X ‧‧‧ arrow symbol

α _20Y ‧‧‧ arrow symbol

α ₂₁ ‧‧‧Arrow symbol

α _22A ‧‧‧ Arrow symbol

α _22B ‧‧‧ Arrow

α ₉₀ ‧‧‧ arrow symbol

FIG. 1 is a schematic perspective view showing an inspection device (electronic component inspection device) according to a preferred embodiment of the present invention.

FIG. 2 is a schematic plan view of the inspection device shown in FIG. 1. FIG.

Fig. 3 is a block diagram showing a control device and the like provided in the inspection device shown in Fig. 1.

FIG. 4 is a schematic view of the device transfer head shown in FIG. 1. FIG.

FIG. 5 is an enlarged perspective view of the robot arm portion shown in FIG. 4.

FIG. 6 is an enlarged perspective view of the robot arm portion shown in FIG. 4.

FIG. 7 is an enlarged schematic cross-sectional view of a head and a holding portion of the robot arm portion shown in FIG. 4.

FIG. 8 is an enlarged schematic cross-sectional view of a connecting portion included in the head shown in FIG. 7.

FIG. 9 is an enlarged schematic side view of the manifold shown in FIG. 4.

Fig. 10 is a sectional view taken along the line A-A of the manifold shown in Fig. 9.

FIG. 11 is a schematic perspective view of a second embodiment of the electronic component inspection device of the present invention as viewed from the front side.

FIG. 12 is a schematic plan view showing an operating state of the electronic component inspection device shown in FIG. 11.

FIG. 13 is a perspective view of a device transfer head disposed in an inspection area of the electronic component inspection device shown in FIG. 12 as viewed from the back side.

FIG. 14 is an exploded perspective view of the device transfer head shown in FIG. 13.

FIG. 15 is an image diagram showing the electrical connection relationship between each heating portion, the first connection portion, and the second connection portion of the device transfer head shown in FIG. 13.

FIG. 16 is an image diagram showing the flow of signals through the serial wiring of the device transfer head shown in FIG. 13.

FIG. 17 is an example of a screen displayed on a monitor of the electronic component inspection apparatus shown in FIG. 11. FIG.

FIG. 18 is an example of a screen displayed on a monitor of the electronic component inspection apparatus shown in FIG. 11. FIG.

FIG. 19 is an example of a screen displayed on a monitor of the electronic component inspection apparatus shown in FIG. 11.

FIG. 20 is a perspective view of a device transfer head disposed in an inspection area of the electronic component inspection device (third embodiment) of the present invention, as viewed from the back side.

Fig. 21 is an example of a screen displayed on a monitor of the electronic component inspection apparatus (third embodiment) of the present invention.

Fig. 22 is a schematic perspective view of a fourth embodiment of the electronic component inspection device according to the present invention as viewed from the front side.

FIG. 23 is a schematic plan view showing an operating state of the electronic component inspection device shown in FIG. 22.

FIG. 24 is a front view of the device transfer head in the inspection area in FIG. 23. FIG.

FIG. 25 is a diagram viewed from the direction of arrow A in FIG. 24.

FIG. 26 is a diagram viewed from the direction of arrow B in FIG. 24 (the IC device is omitted in FIG. 26).

Fig. 27 is a view of the electronic component inspection device (fifth embodiment) of the present invention as viewed from below; Picture of the device transfer head in the inspection area.

Fig. 28 is a diagram of a device transfer head of an inspection area of the electronic component inspection device (fifth embodiment) of the present invention as viewed from below.

Hereinafter, the electronic component transfer device and the electronic component inspection device of the present invention will be described in detail based on the preferred embodiments shown in the attached drawings.

In the drawings referred to below, for the sake of explanation, the three axes that are orthogonal to each other, that is, the X-axis, the Y-axis, and the Z-axis are illustrated by arrow symbols, and the front side of the arrow symbol is set to "+ (plus)" Or "positive" and set the base side to "-(minus)" or "negative". In the following description, a direction parallel to the X axis is referred to as "X axis direction", a direction parallel to the Y axis is referred to as "Y axis direction", and a direction parallel to the Z axis is referred to as "Z axis direction". In the following, for convenience of explanation, the upper side (+ Z axis direction side) in the figure is also referred to as "up (or upward)", and the lower side (-Z axis direction side) is referred to as "down (or lower)" ".

The XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. The so-called "horizontal" in the description of the present case is not limited to a complete level, as long as it does not hinder the transportation of electronic parts, it also includes a state inclined slightly (for example, less than about 5 °) with respect to the level.

The inspection device (electronic component inspection device) shown in the following embodiments is used to transport IC devices such as BGA (Ball grid array) packages or LGA (Land grid array) packages, A device that checks the electrical characteristics of electronic components such as LCD (Liquid Crystal Display) and CIS (CMOS Image Sensor: CMOS) during transportation. In the following, for convenience of explanation, a case where an IC device is used as the above-mentioned electronic component for inspection will be described as a representative, and it will be referred to as "IC device 90". The IC device 90 is placed on a tray 200, that is, a mounting member.

<First Embodiment>

Hereinafter, referring to FIG. 1 to FIG. 10, an electronic part transfer device and an electronic zero of the present invention will be described. A first embodiment of the component inspection device will be described.

FIG. 1 is a schematic perspective view showing an inspection device (electronic component inspection device) according to a preferred embodiment of the present invention. FIG. 2 is a schematic plan view of the inspection device shown in FIG. 1. FIG. Fig. 3 is a block diagram showing a control device and the like provided in the inspection device shown in Fig. 1. FIG. 4 is a schematic view of the device transfer head shown in FIG. 1. FIG. 5 and 6 are enlarged perspective views of the robot arm portion shown in FIG. 4, respectively. FIG. 7 is an enlarged schematic cross-sectional view of a head and a holding portion of the robot arm portion shown in FIG. 4. FIG. 8 is an enlarged schematic cross-sectional view of a connecting portion included in the head shown in FIG. 7. FIG. 9 is an enlarged schematic side view of the manifold shown in FIG. 4. Fig. 10 is a sectional view taken along the line A-A of the manifold shown in Fig. 9.

As shown in FIGS. 1 and 2, the inspection device 1 (electronic component inspection device) includes a transfer device 100 (electronic component transfer device) that transports IC devices 90 (electronic components), an inspection portion 16, and includes a display portion 41 and an operation portion 42. A setting display section 40 and a control device 30.

In addition, in the present embodiment, the inspection device 1 is configured by removing the inspection section 16 and the inspection control section 312 included in the control device 30 described later from the inspection device 1 to configure the transfer device 100 (see FIG. 3).

As shown in FIGS. 1 and 2, the inspection device 1 is divided into a tray supply area A1, a device supply area A2, an inspection area A3 provided with an inspection section 16, a device recovery area A4, and a tray removal area A5. In the inspection device 1, the IC device 90 sequentially passes through each area from the tray supply area A1 to the tray removal area A5, and performs inspection (electrical inspection) in the inspection area A3 in the middle. In this embodiment, the inspection of the IC device 90 can be performed in a cooling environment.

Regarding the transport direction of electronic parts, the upstream side is also simply referred to as the "upstream side", and the downstream side is also simply referred to as the "downstream side". The upper side of the robot arm portion shown in FIG. 4 is referred to as a “base end”, and the lower side is referred to as a “front end”.

Hereinafter, the inspection device 1 will be described for each of the areas A1 to A5.

(Tray supply area A1)

As shown in FIG. 2, the tray supply area A1 supplies a plurality of arrays in an unchecked state. Area of the tray 200 of the IC device 90. In the tray supply area A1, a plurality of trays 200 can be stacked.

(Device supply area A2)

As shown in FIG. 2, the device supply area A2 is an area where a plurality of IC devices 90 on the tray 200 from the tray supply area A1 are respectively supplied to the inspection area A3. In addition, there are provided a transfer unit that transfers the tray 200 across the tray supply area A1 and the device supply area A2, that is, the tray transfer mechanisms 11A and 11B.

In the device supply area A2, a temperature adjustment section 12 (a soaking plate), a supply robot 13 (a device transfer head), and a supply empty tray transfer mechanism 15 are provided.

The temperature adjustment unit 12 is a device that arranges the IC device 90, cools the placed IC device 90, and adjusts (controls) the IC device 90 to a temperature suitable for inspection. In the configuration shown in FIG. 2, two temperature adjustment sections 12 are arranged and fixed along the Y-axis direction. The IC device 90 on the tray 200 carried in from the tray supply area A1 by the tray transfer mechanism 11A is transferred to and placed on any one of the temperature adjustment units 12.

The supply robot 13 is a transfer unit that carries the IC device 90 and is supported to be movable in the X-axis direction, the Y-axis direction, and the Z-axis direction in the device supply area A2. The supply robot 13 is responsible for conveying the IC device 90 between the tray 200 carried in the tray supply area A1 and the temperature adjustment section 12, and the IC device 90 between the temperature adjustment section 12 and a device supply section 14 described later. The supply robot 13 includes a plurality of holding portions (not shown) that hold the IC device 90. Each gripping portion includes a suction nozzle, and can hold the IC device 90 by suction. In addition, the supply robot 13 can cool the IC device 90 and adjust the IC device 90 to a temperature suitable for inspection in the same manner as the temperature adjustment unit 12.

The supply empty tray transfer mechanism 15 is a transfer unit that transfers the empty tray 200 in a state where all IC devices 90 have been removed in the X-axis direction. After the transfer, the empty tray 200 is returned from the device supply area A2 to the tray supply area A1 by the tray transfer mechanism 11B.

(Inspection area A3)

As shown in FIG. 2, the inspection area A3 is an area where the IC device 90 is inspected. In this inspection area A3, a device supply section 14 (supply shuttle), an inspection section 16, a device transfer head 17 (transport section), and an electronic component recovery section 18 (recovery shuttle) are provided. In addition, in this embodiment, the device supply unit 14 and the electronic component recovery unit 18 are configured to be independently movable, but they may be configured to be connected or integrated and move in the same direction.

The device supply section 14 is a device that carries the IC device 90 after temperature adjustment (temperature control) and transfers the IC device 90 to a transfer section near the inspection section 16. The device supply section 14 is reciprocable along the X-axis direction between the device supply region A2 and the inspection region A3. In the configuration shown in FIG. 2, two device supply units 14 are arranged in the Y-axis direction, and IC devices 90 on the temperature adjustment unit 12 are transported and placed on any one of the device supply units 14. The transfer is performed by the supply robot 13. Further, in the device supply section 14, similarly to the temperature adjustment section 12, the IC device 90 can be cooled, and the IC device 90 can be adjusted to a temperature suitable for inspection.

The inspection section 16 is a unit for inspecting / testing the electrical characteristics of the IC device 90, and is a holding section that holds the IC device 90 when the IC device 90 is inspected.

The inspection section 16 includes eight holding sections 161 in which the IC device 90 is arranged. Although not shown, a plurality of probe pins (electrode terminals) electrically connected to the terminals (electrode terminals) of the IC device 90 are respectively provided in the holding portions 161. In addition, the terminals of the IC device 90 are electrically connected (contacted) with the probe pins, and the IC device 90 is inspected through the probe pins. When the IC device 90 is inspected, one IC device 90 is arranged (held) in one holding portion 161.

In addition, in the inspection unit 16, similarly to the temperature adjustment unit 12, the IC device 90 can be cooled, and the IC device 90 can be adjusted to a temperature suitable for inspection.

The device transfer head 17 is a transfer unit for transferring the IC device 90, and is supported so as to be movable in the Y-axis direction within the inspection area A3. This device transfer head 17 can transfer and place the IC device 90 on the device supply section 14 carried in from the device supply area A2 to the inspection section 16.

When the device transfer head 17 is to inspect the IC device 90, the IC device 90 is moved to the The inspection section 16 is pressed (toward the -Z axis direction). As a result, the IC device 90 is in contact with the inspection unit 16, and as described above, the terminals of the IC device 90 and the probe pins of the inspection unit 16 are electrically connected.

The device transfer head 17 can cool the IC device 90 and adjust the IC device 90 to a temperature suitable for inspection, similarly to the temperature adjustment unit 12.

In this embodiment, as shown in the figure, the number of the device transfer heads 17 is one, but two or more may be provided.

The electronic component recovery section 18 is an IC device 90 that has been inspected by the inspection section 16 and is transferred to the transport section of the device recovery area A4. The electronic component recovery section 18 is reciprocable along the X-axis direction between the inspection area A3 and the device recovery area A4. In the configuration shown in FIG. 2, the electronic component recovery unit 18 is the same as the device supply unit 14, and two of them are arranged in the Y-axis direction. The IC devices 90 on the inspection unit 16 are transported to any electronic component. The collection unit 18 is placed. The transfer is performed by the device transfer head 17.

(Device recycling area A4)

As shown in FIG. 2, the device recovery area A4 is an area for recovering the IC devices 90 that have been inspected. In this device recovery area A4, a recovery tray 19, a recovery robot 20 (classification robot), and a recovery empty tray transfer mechanism 21 (tray transfer mechanism) are provided. Also, three empty trays 200 are prepared in the device recovery area A4.

The recovery tray 19 is a mounting portion on which the IC device 90 is mounted, and is fixed in the device recovery area A4. In the configuration shown in FIG. 2, three recovery trays are arranged in the X-axis direction. In addition, three empty trays 200 are also mounting portions on which the IC devices 90 are mounted, and three are arranged in the X-axis direction. In addition, the IC device 90 on the electronic component recovery section 18 moved to the device recovery area A4 is transported and placed on any one of the recovery tray 19 and the empty tray 200. Thereby, the IC device 90 is collected and classified (sorted) according to each inspection result. The classification of the IC device 90 based on the inspection result is performed by the recovery robot 20. The recovery robot 20 classifies the IC devices 90 in accordance with instructions from a control device 30 described later.

The recovery robot 20 is a transfer unit that carries the IC device 90, and can be recovered at the device. The area A4 is supported to move in the X-axis direction, the Y-axis direction, and the Z-axis direction. The collection robot 20 can transfer the IC device 90 from the electronic component collection unit 18 to a collection tray 19 or an empty tray 200. The collection robot 20 includes a plurality of holding portions (not shown) that hold the IC device 90. Each gripping portion includes a suction nozzle, and can hold the IC device 90 by suction.

The collected empty tray transfer mechanism 21 is a transfer unit that transfers the empty tray 200 carried in from the tray removal area A5 in the X-axis direction. After the transfer, the empty tray 200 is placed at a position where the IC device 90 is recovered. That is, the empty tray 200 may become any one of the three empty trays 200 described above.

(Tray removal area A5)

The tray removal area A5 is an area for collecting and removing the trays 200 in which the plurality of IC devices 90 in the inspected state are arranged. In the tray removing area A5, a plurality of trays 200 can be stacked. In addition, a tray transfer mechanism 22A, 22B, which is a transfer unit that transfers the tray 200 one by one across the device recovery area A4 and the tray removal area A5, is provided. The tray transfer mechanism 22A transfers the tray 200 on which the IC devices 90 having been inspected are loaded from the device recovery area A4 to the tray removal area A5. The tray transfer mechanism 22B transfers the empty tray 200 for recycling the IC devices 90 from the tray removal area A5 to the device collection area A4.

As described above, the regions A1 to A5 are separated from each other by a wall portion, a stop portion, and the like, which are not shown. Further, the device supply area A2 becomes the first room R1 divided by the wall portion or the stop portion, the inspection area A3 becomes the second room R2 divided by the wall portion or the stop portion, and the device recovery area A4 becomes the wall portion or The third room R3 of the partition and the like. The first room R1, the second room R2, and the third room R3 are configured so as to ensure air-tightness or thermal insulation, respectively. Thereby, the first room R1, the second room R2, and the third room R3 can maintain the humidity or temperature as much as possible, respectively.

In addition, although not shown in the first room R1, the second room R2, and the third room R3, a temperature sensor (thermometer) for detecting indoor temperature and a humidity sensor for detecting indoor humidity (relative humidity) are provided. Oxygen concentration sensor (hygrometer) and oxygen concentration sensor (oxygen concentration meter) for detecting the oxygen concentration in the room. In this embodiment, each of the first room R1, the second room R2, and the third room R3 A temperature sensor, a humidity sensor, and an oxygen concentration sensor are installed in the room, but the locations where the temperature sensor, the humidity sensor, and the oxygen concentration sensor are installed are arbitrary.

As shown in FIG. 3, the inspection device 1 includes a cooling mechanism 28 and a dry air supply mechanism (dehumidification mechanism) 29. In addition, in FIG. 3, even if it has a several cooling mechanism 28 and the dry air supply mechanism 29, 1 is shown as a representative.

The cooling mechanism 28 includes, for example, a device that cools each part of the inspection device 1 by flowing a refrigerant (for example, liquid nitrogen or a low-temperature gas), and the like. The cooling mechanism 28 cools the temperature adjustment unit 12, the supply robot 13, the device supply unit 14, the inspection unit 16, and the device transfer head 17.

The dry air supply mechanism 29 is configured to be able to supply low-humidity air, nitrogen, and the like (hereinafter, also referred to as dry air) to the first and second chambers R1 and R2. If necessary, dew condensation and icing (with ice and frost) of the IC device 90 can be prevented by supplying dry air. In this embodiment, the dry air supply mechanism 29 is configured to supply dry air into the first room R1 and the second room R2, but may be configured to supply dry air into the third room R3.

(Control device 30)

As shown in FIG. 3, the control device 30 has a function of controlling each section of the inspection device 1, and includes a control section 31 and a memory section 32.

The control unit 31 includes, for example, a CPU (Central Processing Unit), and includes a drive control unit 311 and an inspection control unit 312. The memory unit 32 includes, for example, a ROM (read only memory) and a RAM (Random Access Memory).

The drive control section 311 controls each section (the tray transfer mechanisms 11A and 11B, the temperature adjustment section 12, the supply robot 13, the supply empty tray transfer mechanism 15, the device supply section 14, the inspection section 16, the device transfer head 17, the electronic parts recovery section 18, The driving of the recovery robot 20, the recovery empty tray transfer mechanism 21 and the tray transfer mechanisms 22A and 22B), the cooling mechanism 28, and the dry air supply mechanism 29, and the like.

The inspection control unit 312 may also perform an inspection of the IC device 90 arranged in the inspection unit 16 based on, for example, a program (software) stored in the memory unit 32.

In addition, the control unit 31 has a function of displaying the driving, inspection results, image data, and the like of each unit on the display unit 41 or a function of processing based on input from the operation unit 42.

The memory unit 32 stores programs or data used by the control unit 31 to perform various processes.

(Setting display section 40)

As shown in FIGS. 1 and 3, the setting display section 40 includes a display section 41 and an operation section 42.

The display unit 41 includes a monitor 411 that displays the driving and inspection results of each unit. The monitor 411 may be configured by, for example, a liquid crystal display panel or a display panel such as an organic EL. Through this monitor 411, the operator can set or confirm various processes and conditions of the inspection device 1.

The operation unit 42 is an input device such as a mouse 421 and outputs an operation signal corresponding to an operation performed by an operator to the control unit 31. Therefore, the operator can use the mouse 421 to instruct the control unit 31 for various processes and the like.

The operation unit 42 may be, for example, an input device such as a keyboard, a trackball, and a touch panel.

The configuration of the inspection device 1 has been briefly described above.

In such an inspection device 1, as described above, the temperature adjustment unit 12, the supply robot 13, the device supply unit 14, the inspection unit 16, and the device transfer head 17 are configured to cool the IC device 90. Thereby, the temperature of the IC device 90 is kept constant during the transportation. In addition, in the inspection device 1, the IC device 90 can be inspected in a low-temperature environment in a range of, for example, -60 ° C to -40 ° C by cooling these parts.

Here, in the inspection device 1, when the IC device 90 is inspected in a low-temperature environment, among the above-mentioned sections of the cooled IC device 90, the temperature management of the device transfer head 17 is also particularly important.

The device transfer head 17 will be described in detail below.

[Device transfer head]

As described above, the device transfer head 17 functions as a transfer unit that holds and transfers the IC device 90.

As shown in FIG. 4, the device transfer head 17 is supported above the inspection section 16 by a support frame 27 that is movable in the Y-axis direction. Thereby, the device transfer head 17 can be moved above the inspection unit 16 (+ Z axis side) in the Y axis direction (see FIG. 2).

As shown in FIG. 4, the device transfer head 17 includes a robot arm portion 50 (socket layout kit), a plurality of gripping portions 9 (change kits), and a cooling unit 10 that cools the robot arm portion 50.

(Robot Arm)

As shown in FIG. 4, the robot arm portion 50 includes a plurality of heads 5 and a support body 51 that supports the plurality of heads 5 together.

(Support)

As shown in FIG. 5, the support body 51 is a plate member that supports the plurality of heads 5 from the upper side.

A plurality of hooks 511 and 512 are provided on the upper portion of the support body 51. Although not shown, hooks corresponding to the hooks 511 and 512 are respectively provided on the support frame 27. Therefore, the support body 51 can be attached to the support frame 27 by engaging the hooks 511 and 512 with a hook (not shown) included in the support frame 27. Thereby, the robot arm portion 50 can be detachably connected to the support frame 27. With this configuration, attachment and detachment of the robot arm portion 50 to and from the support frame 27 can be easily performed.

In addition, the connection method of the support body 51 to the support frame 27 is not limited to this, and for example, it may be screwed or the like. The support body 51 may be fixed to the support frame 27 instead of being detachable.

(head)

As shown in FIG. 6, the robot arm portion 50 has the same number as the holding portion 161 of the inspection portion 16, that is, eight heads 5.

The eight heads 5 are arranged in a matrix shape corresponding to the holding portions 161 of the inspection portion 16. That is, 8 The heads 5 are arranged in a matrix of 2 columns in the Y-axis direction and 4 rows in the X-axis direction.

The number, arrangement, etc. of the heads 5 are not limited to those shown in the drawings, but are arbitrary. For example, the number or arrangement of the heads 5 may be set according to the number or arrangement of the holding portions 161.

Hereinafter, the configuration of the heads 5 will be briefly described. However, since the eight heads 5 have substantially the same configuration except for the difference in arrangement, one head 5 will be representatively described below.

As shown in FIG. 7, the head 5 includes a pressing portion 52, a connecting portion 53 provided below the pressing portion 52, and a plurality of connecting members 54 connecting the pressing portion 52 and the connecting portion 53. Further, a holding portion 9 that holds the IC device 90 is connected to the connecting portion 53.

The pressing portion 52 is a device that presses the connecting member 54, the connecting portion 53, and the holding portion 9 connected to the connecting portion 53 downward (-Z axis direction), which are lower than the pressing portion 52. That is, the pressing portion 52 is a device that presses or releases the IC device 90 held by the holding portion 9 with respect to the holding portion 161 of the inspection portion 16.

The pressing portion 52 includes a cylinder 521 having a hollow portion 523 and a flow path 524 communicating with the hollow portion 523; a piston 522 which is housed in the cylinder 521 and is provided to protrude downward; and a diaphragm 525 which connects the cylinder Body 521 and piston 522.

Such a pressing portion 52 is such that when the working fluid F52 is supplied from a hydraulic device (not shown) to the hollow portion 523 through the flow path 524, the hydraulic pressure in the hollow portion 523 rises and the diaphragm 525 deforms. As a result, the piston 522 and the components located lower than the piston 522 are pressed downward together. As a result, the IC device 90 held by the holding portion 9 can be pressed against the inspection portion 16. 7 shows a state where the piston 522 is pushed downward.

On the other hand, when the pressing of the pressing portion 52 is released, the supply of the working fluid F52 and the like into the hollow portion 523 by the hydraulic device is stopped, and the working fluid F52 in the hollow portion 523 is discharged to the hollow portion 523 through the flow path 524. outer. As a result, the hydraulic pressure of the hollow portion 523 decreases, the diaphragm 525 is deformed (recovered) in a direction opposite to the above-mentioned deformation, and the force of pressing down the piston 522 is weakened. As a result, the IC device 90 held by the holding portion 9 can be made to the inspection portion 16. go away.

The configuration of the pressing portion 52 has been described above, but the configuration of the pressing portion 52 is not limited to the above as long as it can press the holding portion 9 connected to the robot arm portion 50 downward (-Z axis direction). Of the composition.

As shown in FIG. 7, each of the plurality of connecting members 54 is formed in a rod shape, and one end is fixed to the piston 522 and the other end is fixed to the connecting portion 53.

In this embodiment, four connecting members 54 are provided, and the four connecting members 54 are respectively provided at corner portions of the connecting portion 53 formed in a quadrangular shape in a plan view (see FIGS. 6 and 7).

The number and arrangement of the connecting members 54 are not limited to those shown in the drawings, but are arbitrary. The connection member 54 is fixed to the connection portion 53. For example, the connection portion 54 may be supported so as to be slidable in the Z-axis direction.

As shown in FIG. 7, a connection portion 53 is provided below the four connection members 54. The connecting portion 53 is a member that connects the gripping portion 9 as described above. The method of connecting the gripping portion 9 of the connecting portion 53 is not particularly limited, and examples thereof include screwing and the like.

As shown in FIG. 8, a flow path 531 is formed inside the connection portion 53. In this flow path 531, a refrigerant R supplied from a cooling mechanism 28 via a cooling unit 10 to be described later flows. The connection portion 53 is cooled by the refrigerant R flowing through the flow path 531. Thereby, the IC device 90 held by the holding portion 9 connected to the connection portion 53 can be cooled.

The constituent material of the connection portion 53 is not particularly limited. For example, a material having excellent thermal conductivity is preferred, and various metal materials such as aluminum or aluminum alloys can be mentioned.

So far, the first 5 have been briefly explained.

By arranging the plurality of heads 5 of such a configuration on the above-mentioned support body 51 together, the plurality of IC devices 90 can be pressed against the inspection unit 16 together. Therefore, inspection can be performed more quickly.

In addition, in the above description, the holding portion 9 is connected to the connecting portion 53. However, for example, the connecting member 54 may be provided so as to penetrate the connecting portion 53. The end is connected to the holding portion 9. In this case, it can be considered that the “connection portion” is constituted by the connection member 54 and the connection portion 53.

(Holding section)

As shown in FIG. 7, the holding portion 9 is located below the connecting portion 53 and is connected to the connecting portion 53.

The holding portion 9 includes a plate-shaped relay member 91 and a contact portion 92 provided below the relay member 91 and abutting against the IC device 90.

The relay member 91 is a portion which is detachably attached to the connection portion 53. Therefore, the holding portion 9 can be replaced according to each type of the IC device 90, for example.

Although not shown, the contact portion 92 includes a suction nozzle. Thereby, the abutting portion 92 can attract the IC device 90, and therefore, the gripping portion 9 can grip the IC device 90.

A Pt sensor 93 is built into the abutting portion 92 of the gripping portion 9. The Pt sensor 93 is electrically connected to the control device 30 and sends the detected temperature to the control device 30. In the inspection device 1, the temperature of the holding portion 9 is detected by the Pt sensor 93, and the temperature is regarded as the temperature of the IC device 90 held by the holding portion 9.

In addition, the installation location of the Pt sensor 93 functioning as a temperature detection section that detects the temperature of the IC device 90 is not limited to the abutment section 92, but may be provided on the relay member 91, the connection section 53, and the like.

(Cooling unit)

As shown in FIG. 4, the cooling unit 10 includes a manifold 6 (member) having a distribution portion 61 and a collection portion 62, and a distribution portion piping portion 7 having a plurality of distribution portion pipes 71, 72, 73, and 74. And a piping section 8 for a collecting section, which includes a plurality of pipings 81, 82, 83, and 84 for a collecting section.

A cooling mechanism 28 is connected to the manifold 6 included in the cooling unit 10. The cooling unit 10 is a device that distributes the refrigerant R supplied from the cooling mechanism 28 to the plurality of connection portions 53 included in the above-mentioned robot arm portion 50.

(Manifold)

The manifold 6 is a machine that distributes the refrigerant R supplied from the cooling mechanism 28 to a plurality of flow paths or collects the refrigerant R from the plurality of flow paths.

As shown in FIG. 4, the manifold 6 is provided on a side portion 501 of the robot arm portion 50. Specifically, the upper part of the manifold 6 is mounted on the side of the + X axis side of the support body 51, and the manifold 6 is connected to the side part 501, and is closer to the base end side of the robot arm part 50 than the grip part 9 (more 9 and above), and arranged so as not to protrude upward from the support body 51. In this way, it is possible to effectively use the space located on the side portion 501 of the robot arm portion 50 to install the manifold 6.

The method of mounting the manifold 6 to the robot arm portion 50 is not particularly limited, and examples thereof include screwing.

As shown in FIG. 9 and FIG. 10, the manifold 6 is formed into a substantially rectangular shape in a side view (as viewed from the X-axis direction).

A distribution portion 61 and a collection portion 62 for circulating the refrigerant R are provided inside the manifold 6. The distribution portion 61 is provided on the upper side of the manifold 6. The collection portion 62 is located on the lower side of the manifold 6 and is provided below the distribution portion 61.

As shown in FIG. 10, the distribution unit 61 includes a supply flow path 615 and distribution flow paths 611, 612, 613, and 614.

The supply flow path 615 extends in the Z-axis direction and has an opening 6151 that is open at the upper portion of the manifold 6. A cooling mechanism 28 is connected to the opening 6151. Thereby, the refrigerant R from the cooling mechanism 28 is supplied to the supply flow path 615.

In addition, the supply flow path 615 is provided at a central portion in the Y-axis direction of the manifold 6 and is located closer to the + Y axis than the center line of the manifold 6 in the Z-axis direction as viewed from the X-axis direction.

The distribution flow paths 611, 612, 613, and 614 respectively extend along the Y-axis direction, and both ends are respectively opened at the sides of the manifold 6. The distribution flow paths 611, 612, 613, and 614 are arranged from above the manifold 6 in this order and downward. As shown in FIG. 9, the distribution channels 611 and 613 are arranged on the + X axis side, and the distribution channels 612 and 614 are arranged on the -X axis side when viewed from the Y axis direction.

Such distribution flow paths 611, 612, 613, and 614 are connected to the above-mentioned supply flow paths, respectively. 615. As a result, the refrigerant R from the cooling mechanism 28 is distributed to the plurality of distribution channels 611, 612, 613, and 614 via one supply channel 615.

As shown in FIG. 10, the collection unit 62 includes a plurality of collection channels 621, 622, 623, and 624, and a discharge channel 625.

The collection flow paths 621, 622, 623, and 624 respectively extend in the Y-axis direction, and both ends are respectively opened at the sides of the manifold 6. The collection flow paths 621, 622, 623, and 624 are arranged from below the manifold 6 in this order and upward. As shown in FIG. 9, when viewed from the Y-axis direction, the collecting channels 621 and 623 are arranged on the -X axis side, and the collecting channels 622 and 624 are arranged on the + X axis side.

As shown in FIG. 9, the discharge flow path 625 is a flow path 6251 formed in the lower portion of the manifold 6 and extending in the Z axis direction. The discharge flow path 625 is a flow path 6252 formed in the upper portion of the manifold 6 and extends in the Z axis direction. And a pipe 6253 which connects the flow path 6251 and the flow path 6252. In addition, the flow path 6251, the flow path 6252, and the pipe 6253 are provided at the central portion in the Y-axis direction of the manifold 6, respectively.

The flow path 6251 has an opening 6254 that is open at a side portion of the -X axis side of the manifold 6. At the opening 6254, the lower end (lower end joint) of the piping 6253 is communicated.

Similarly, the flow path 6252 also has an opening 6255 that is open at a side portion of the -X axis side of the manifold 6. At the opening 6255, the upper end (upper end joint) of the pipe 6253 is communicated. In addition, the flow path 6252 has an opening 6256 which is opened at an upper portion of the manifold 6. The opening 6256 is connected to the cooling mechanism 28. Thereby, the refrigerant R is discharged from the discharge flow path 625 to the cooling mechanism 28.

The exhaust flow path 625 communicates with each of the collection flow paths 621, 622, 623, and 624. As a result, the refrigerant R from the plurality of collection flow paths 621, 622, 623, and 624 is collected in one discharge flow path 625, and the refrigerant R is discharged from the discharge flow path 625 to the cooling mechanism 28.

In the manifold 6 having such a configuration, a distribution section 61 and a collection section 62 are provided in one manifold 6. Thereby, by providing the distribution part 61 and the collection part 62 together, the connection with the cooling mechanism 28 can be performed easily. Furthermore, as described above, the plurality of distribution channels 611, 612, 613, and 614 included in the distribution unit 61 are located higher than the plurality of collection channels 621, 622, 623, and 624 included in the collection unit 62. This makes it possible to efficiently supply the refrigerant through the distribution section 61. R, the refrigerant R is recovered from the collection unit 62. Further, in the manifold 6, the opening 6151 of the supply flow path 615 and the opening 6256 of the discharge flow path 625 are provided adjacent to each other at the upper portion of the manifold 6. Therefore, it is possible to more easily connect the distribution section 61 and the collection section 62 of the manifold 6 to the cooling mechanism 28.

The constituent material of the manifold 6 having such a configuration is not particularly limited, and examples thereof include various metal materials and various resin materials. Among these, it is particularly preferable that the manifold 6 is composed of a resin, and more preferably that the manifold 6 is composed of a resin having a high compression ratio (higher density).

Since the manifold 6 is made of resin, the distribution portion 61 and the collection portion 62 having the above-described configuration can be easily formed using a method such as injection molding. In addition, since the manifold 6 includes a resin, the manifold 6 can be made lightweight, and the thermal resistance of the manifold 6 can be increased.

In particular, since the manifold 6 is made of a resin having a higher compression ratio (higher density), the refrigerant R can be continuously supplied to the manifold 6 to prevent or reduce the damage of the manifold 6 due to moisture absorption.

From this point, as a specific constituent material of the manifold 6, it is preferable that the manifold 6 is composed of, for example, an aromatic polyester resin.

(Piping section for distribution section)

As shown in FIGS. 5 and 6, the distribution unit piping unit 7 includes two sets of a plurality of distribution unit pipes 71, 72, 73, and 74.

Two sets of piping 71, 72, 73, and 74 for the distribution part are provided on the side part 501 of the robot arm part 50, and one set is different from the other set from the distribution part 61 toward the + Y axis side and the -Y axis side. Direction. In addition, when viewed from the Z-axis direction, the two sets of pipes 71, 72, 73, and 74 for the distribution section are symmetrically disposed with respect to the distribution section 61.

The two sets of pipes 71, 72, 73, and 74 for the distribution unit will be described below. However, the two sets of pipes 71, 72, 73, and 74 for the distribution unit have substantially the same structure except for the difference in arrangement, so they are as follows. A group of pipings 71, 72, 73, and 74 for the distribution portion on the -Y axis side will be representatively described.

As shown in FIG. 5, a plurality of pipes 71, 72, 73, and 74 for the distribution section are self-manifolds, respectively. From 6 on, the part on the + X axis side of the side part 501 extends in the -Y axis direction, and the part on the -Y axis side of the side part 501 extends in the -X axis direction and then extends downward. In this way, by providing the plurality of distribution unit pipes 71, 72, 73, and 74 on the side portion 501 of the robot arm portion 50, it is possible to effectively use the space located on the side portion 501 to arrange the plurality of distribution unit pipes 71, 72, 73, 74.

The pipes 71, 72, 73, and 74 for the distribution unit are arranged in this order from the base end toward the front end of the robot arm portion 50.

The plural pipings 71, 72, 73, and 74 for the distribution unit are provided corresponding to the distribution channels 611, 612, 613, and 614 described above.

Specifically, the distribution unit pipe 71 is connected to the distribution flow path 611 via a joint 711. The distribution pipe 72 is connected to the distribution channel 612 via a joint 721. The distribution pipe 73 is connected to the distribution channel 613 via a joint 731. The distribution pipe 74 is connected to the distribution channel 614 via a joint 741. Thereby, the refrigerant R allocated to the distribution channels 611, 612, 613, and 614 flows to the corresponding distribution channels 611, 612, 613, and 614, respectively.

In addition, the plurality of distribution part pipes 71, 72, 73, and 74 are provided corresponding to the flow paths 531 included in the connection part 53 of the plurality of heads 5 described above. In addition, hereinafter, among the eight heads, four heads 5 belonging to one line are sequentially referred to as "head 5a", "head 5b", "head 5c", and "head" from the -X axis side to the + X axis side. 5d ".

Specifically, the distribution pipe 71 is a flow path 531 (see FIG. 8) included in the connection portion 53 connected to the head 5 a via a joint 712. The distribution part piping 72 is a flow path 531 included in the connection part 53 of the head 5 b via a joint 722. The distribution part pipe 73 is a flow path 531 included in the connection part 53 of the head 5c via a joint 732. The distribution pipe 74 is a flow path 531 included in the connection portion 53 of the head 5d via a joint 742. As a result, the refrigerant R flowing through the distribution unit pipes 71, 72, 73, and 74 flows to the respective flow paths 531 of the corresponding heads 5a, 5b, 5c, and 5d, respectively.

The plurality of distribution section pipes 71, 72, 73, and 74 are connected in this manner. The distribution portion 61 and the connection portion 53 included in each head 5 allow the refrigerant R distributed to the distribution portion 61 to flow to the connection portion 53.

In addition, as described above, the pipes 71, 72, 73, and 74 for the distribution unit extend from the other group of self-distribution units 61 toward the + Y-axis side and the -Y-axis side in mutually different directions. Regarding the distribution unit 61, Symmetrical setting. Therefore, the refrigerant R can be more efficiently distributed to the plurality of connection portions 53.

(Piping section for collection section)

As shown in FIG. 5 and FIG. 6, the collection unit piping unit 8 includes two sets of a plurality of collection unit pipes 81, 82, 83, and 84. Most of the piping section 8 for the collection section is provided below the piping section 7 for the distribution section described above. As shown in FIG. 4, the above-mentioned piping portion 7 for the distribution portion and the piping portion 8 for the collection portion are located closer to the base end side of the robot arm portion 50 (above the holding portion 9) than the holding portion 9, It is arranged so as to protrude upward from the support body 51.

Two sets of pipings 81, 82, 83, and 84 for the collection part are provided on the side part 501 of the robot arm part 50, and one set and the other set extend from the collection part 62 toward the + Y axis side and the -Y axis side. In addition, when viewed from the Z-axis direction, the two sets of pipings 81, 82, 83, and 84 for the collection section are arranged symmetrically about the collection section 62.

The two sets of piping 81, 82, 83, and 84 for the collection section will be described below. However, the two sets of piping 81, 82, 83, and 84 for the collection section have substantially the same structure except for the difference in arrangement. A group of pipings 81, 82, 83, and 84 for the collection section on the -Y axis side will be representatively described.

As shown in FIG. 5, a plurality of pipes 81, 82, 83, and 84 for the collecting portion are respectively from the manifold 6, and the portion on the + X-axis side of the side portion 501 extends in the −Y-axis direction, and After the part on the -Y axis side extends in the -X axis direction, it is bent toward the base end side of the robot arm part 50 and then bent toward the front end side of the robot arm part 50. In this way, by providing the plurality of collection unit pipes 81, 82, 83, and 84 on the side portion 501 of the robot arm portion 50, it is possible to effectively use the space located on the side portion 501 to install the plurality of collection unit pipes 81, 82, 83, 84.

In addition, the pipings 81, 82, 83, and 84 for the collection unit are in this order from the robot arm portion 50. The front end is aligned toward the base end. In this way, the arrangement order of the pipes 81, 82, 83, and 84 for the collection part is in a relationship with the arrangement of the corresponding connection part 53, and is opposite to the arrangement order of the pipes 71, 72, 73, and 74 for the distribution part described above. Therefore, it is possible to reduce the overlap of the pipes 81, 82, 83, and 84 for the collecting section and the pipes 71, 72, 73, and 74 for the distributing section.

The plurality of pipings 81, 82, 83, and 84 for the collecting portions are provided corresponding to the flow paths 531 included in the connection portion 53 of the plurality of heads 5 described above.

Specifically, the collection unit pipe 81 is a flow path 531 (see FIG. 8) included in the connection portion 53 connected to the head 5 a via a joint 812. The collecting part pipe 82 is a flow path 531 included in the connection part 53 of the head 5 b via a joint 822. The collecting part piping 83 is a flow path 531 included in the connection part 53 of the head 5c via a joint 832. The collecting part piping 84 is a flow path 531 included in the connection part 53 of the head 5d via a joint 842. Thereby, the refrigerant R flowing through each of the flow paths 531 of the heads 5a, 5b, 5c, and 5d is distributed to the corresponding collection unit pipes 81, 82, 83, and 84.

In addition, a plurality of pipings 81, 82, 83, and 84 for the collection section are provided corresponding to the collection flow paths 621, 622, 623, and 624 described above.

Specifically, the collection unit pipe 81 is connected to the collection flow path 621 via a joint 811. The collecting part pipe 82 is connected to the collecting flow path 622 via a joint 821. The collecting part pipe 83 is connected to the collecting flow path 623 via a joint 831. The collecting part pipe 84 is connected to the collecting flow path 624 via a joint 841. As a result, the refrigerant R flowing through the collection unit pipes 81, 82, 83, and 84 flows to the corresponding collection flow paths 621, 622, 623, and 624, respectively.

With a plurality of collection unit pipes 81, 82, 83, and 84 configured as described above, the connection portion 53 and the collection portion 62 of each head 5 are connected, and the refrigerant R flowing through the flow path 531 of each connection portion 53 can be collected.部 62circulates.

Further, as described above, the two sets of pipes 81, 82, 83, and 84 for the collection unit extend in a different direction from the other group toward the + Y-axis side and the -Y-axis side, and are symmetrically disposed about the distribution section 61. Home. Therefore, the refrigerant R from the plurality of connection portions 53 can be distributed to the collection portion 62 more efficiently.

In addition, the plurality of pipings 81, 82, 83, and 84 for the collecting portion are bent toward the base end side of the robot arm portion 50 as described above, and then bent toward the front end side of the robot arm portion 50. More specifically, the collecting pipe 81 has a ring portion 813 formed in a ring shape, the collecting pipe 82 has a ring portion 823 formed in a ring shape, and the collecting portion pipe 83 has a ring portion 833 formed in a ring shape. The collecting portion pipe 84 includes a ring portion 843 formed in a ring shape. With this, even if the pipes 81, 82, 83, and 84 for the collection part are disposed lower than the pipes 71, 72, 73, and 74 for the distribution part, there is no need to sharply bend the pipes 81, 82, 83, and 84 for the collection part, that is, It can be connected to the connection portion 53, so that piping resistance (flow resistance) can be effectively reduced.

In addition, in the figure, the ring portions 813, 823, 833, and 843 are formed into a ring that surrounds the primary ring once, but may be formed into a ring that surrounds the multiple rings.

According to the cooling unit 10 configured as described above, as described above, the device transfer head 17 for transferring the IC device 90 has the refrigerant R supplied from the cooling mechanism 28 distributed to a plurality of flow paths (distribution flow paths 611, 612, 613, 614). ), A distribution unit 61, and a collection unit 62 that collects refrigerant R from a plurality of channels (collection channels 621, 622, 623, 624). In this manner, the refrigerant R supplied to one supply flow path 615 can be distributed to the plurality of distribution flow paths 611, 612, 613, and 614 by the distribution portion 61, whereby the refrigerant R can be distributed to each connection portion 53. Therefore, the plurality of IC devices 90 can be efficiently cooled. In addition, since the refrigerant R discharged from the plurality of collection channels 621, 622, 623, and 624 can be collected in one discharge channel 625 by the collection unit 62, the refrigerant R can be efficiently circulated (circulated). According to this case, since the plurality of IC devices 90 can be controlled to the target temperature with high accuracy, the plurality of IC devices 90 can be inspected with high accuracy.

In addition, the plurality of flow paths to which the refrigerant R is distributed in the self-distribution section 61 may be considered to include not only the distribution flow paths 611, 612, 613, and 614, but also the distribution section piping 71 connecting the distribution section 61 and each connection section 53. 72, 73, 74. Similarly, the plurality of flow paths for collecting the refrigerant R in the collecting section 62 can be regarded as not only including the collecting flow paths 621, 622, 623, 624 also includes pipes 81, 82, 83, and 84 for the collection section that connect the respective connection sections 53 and the collection section 62.

In addition, since the device transfer head 17 for transferring the IC device 90 is provided with the cooling unit 10 described above, compared with the previous configuration of checking the IC device 90 by setting only the gas environment in the inspection area A3 to a low temperature environment, It is easy and more accurate to control the temperature of the IC device 90 during inspection.

In addition, by providing the manifold 6 in the robot arm portion 50, as long as a cooling mechanism 28 is connected to one manifold 6, the IC device 90 held by the plurality of holding portions 9 can be cooled. Further, even if the robot arm portion 50 is replaced or the grip portion 9 is replaced, it is not necessary to separately connect the cooling mechanism 28 to each of the robot arm portions 50, and it is easy to install the cooling mechanism 28.

<Second Embodiment>

The second embodiment of the electronic component transfer device and the electronic component inspection device of the present invention will be described below.

As shown in FIG. 11 and FIG. 12, the inspection device 1000 is divided into a tray supply area A1, a device supply area (hereinafter referred to as the "supply area") A2, an inspection area A3, and a device recovery area (hereinafter referred to as the "recycling area") A4. , And the tray removal area A5. In addition, the IC device 90 passes through the tray supply area A1 to the tray removal area A5 in order, and is inspected in the inspection area A3 in the middle. In this manner, the inspection device 1000 includes the following components: an electronic component transfer device (processor) that transports IC devices 90 in each area; an inspection unit 116 that performs inspection in the inspection area A3; The inspection apparatus 1000 includes a monitor 300, a signal lamp 400, and an operation panel 700.

In addition, the inspection device 1000 is a side where the tray supply area A1 and the tray removal area A5 (the -Y axis direction in Fig. 12) are disposed as the front side, and the opposite side, that is, the side where the inspection area A3 is disposed (Fig. 12). (Zhongzhi + Y axis direction) is used as the back side.

The tray supply area A1 is a material supply section for supplying a tray (mounting member) 200 in which a plurality of IC devices 90 are arranged in an unchecked state. Multiple trays can be stacked in the tray supply area A1 Plate 200.

The supply area A2 is an area where a plurality of IC devices 90 arranged on the tray 200 from the tray supply area A1 are supplied to the inspection area A3, respectively. In addition, tray conveying mechanisms 11A and 11B are provided to move the tray 200 one by one in a horizontal direction so as to span the tray supply area A1 and the supply area A2. The tray conveying mechanism 11A is a moving part that can move the tray 200 and the IC device 90 placed on the tray 200 toward the positive side in the Y-axis direction. Thereby, the IC device 90 can be stably conveyed to the supply area A2. The tray conveyance mechanism 11B is a moving portion that can move the empty tray 200 toward the negative side in the Y-axis direction, that is, from the supply area A2 to the tray supply area A1.

In the supply area A2, a temperature adjustment section 112, a device transfer head 113, and a tray transfer mechanism 115 are provided.

The temperature adjustment section 112 is a device that can cool or heat a plurality of IC devices 90 together, and is sometimes referred to as a "heat equalizing plate". The IC device 90 before the inspection by the inspection unit 116 may be cooled or heated in advance by the soaking plate to adjust the temperature suitable for the inspection. In the configuration shown in FIG. 12, two temperature adjustment sections 112 are arranged in the Y-axis direction and are fixed to two. The IC device 90 on the tray 200 that has been carried in (carried in) from the tray supply area A1 by the tray transfer mechanism 11A is transferred to any one of the temperature adjustment units 112.

The device transfer head 113 is supported to move in the X-axis direction and the Y-axis direction, and further in the Z-axis direction within the supply area A2. Thereby, the device transfer head 113 can transfer the IC device 90 between the tray 200 and the temperature adjustment section 112 carried in from the tray supply area A1, and the IC device 90 between the temperature adjustment section 112 and the device supply section 114 described later. Of transportation.

The tray transfer mechanism 115 is a mechanism that transfers the empty tray 200 in a state where all the IC devices 90 have been removed, to the positive side in the X-axis direction in the supply area A2. After the transfer, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the tray transfer mechanism 11B.

The inspection area A3 is an area where the IC device 90 is inspected. In this inspection area A3, set There are an inspection section 116 and a device transfer head 117. Also, a device supply unit 114 that moves across the supply area A2 and the inspection area A3, and a device recovery unit 118 that moves across the inspection area A3 and the recovery area A4 are also provided.

The device supply section 114 is a mounting section that can mount the IC device 90 that has been temperature-adjusted by the temperature adjustment section 112 and transport (moves) the IC device 90 to the inspection section near the inspection section 116. This is sometimes referred to as a "supply shuttle." ".

The device supply unit 114 is supported so as to be movable in the horizontal direction between the supply region A2 and the inspection region A3 in the X-axis direction. In the configuration shown in FIG. 12, two device supply sections 114 are arranged in the Y-axis direction, and the IC devices 90 on the temperature adjustment section 112 are transported to any one of the device supply sections 114. The device supply unit 114 is configured so that the temperature-adjusted state of the IC device 90 can be maintained. Thereby, the IC device 90 can be cooled or heated, and therefore, the temperature adjustment state of the IC device 90 can be maintained.

The inspection section 116 is a mounting section on which the IC device 90 is mounted, and the electrical characteristics of the IC device 90 are checked / tested. The inspection unit 116 is provided with a plurality of probe pins electrically connected to the terminal portion of the IC device 90. The terminal portion of the IC device 90 is electrically connected (contacted) with the probe pin, and the IC device 90 is inspected through the probe pin. The inspection of the IC device 90 is performed based on a program stored in an inspection control section provided in a tester connected to the inspection section 116. In addition, in the inspection unit 116, similarly to the temperature adjustment unit 112, the IC device 90 can be cooled or heated, and the IC device 90 can be adjusted to a temperature suitable for inspection.

The device transfer head 117 is supported to be movable in the Y-axis direction and the Z-axis direction within the inspection area A3. Thereby, the device transfer head 117 can transfer and place the IC device 90 on the device supply part 114 carried in from the supply area A2 to the inspection part 116. In addition, the device transfer head 117 may cool or heat the IC device 90 and adjust the IC device 90 to a temperature suitable for inspection.

The device recovery section 118 is an IC device 90 that can be placed in the inspection section 116 after the inspection is completed, and the IC device 90 is transported (moved) to the placement section in the recovery area A4, and is sometimes referred to as a "recycling shuttle".

The device recovery unit 118 is supported so as to be movable in the horizontal direction between the inspection region A3 and the recovery region A4 in the X-axis direction. In the configuration shown in FIG. 12, the device recovery unit 118 is arranged in the Y-axis direction in the same manner as the device supply unit 114, and the IC devices 90 on the inspection unit 116 are transported to any of the device recovery units 118. While placing. This transfer is performed by the device transfer head 117.

The recovery area A4 is an area for recovering the plurality of IC devices 90 after the inspection has been completed. In this collection area A4, a collection tray 19, a device transfer head 120, and a tray transfer mechanism 121 are provided. An empty tray 200 is also prepared in the collection area A4.

The recycling tray 19 is a mounting portion on which the IC device 90 inspected by the inspection unit 116 is mounted, and is fixed in the recovery area A4 without moving. Thereby, even if the recovery area A4 in which various movable parts such as a relatively large number of device transfer heads 120 are arranged, the inspected IC devices 90 are stably placed on the recovery tray 19. In the configuration shown in FIG. 12, three collection trays 19 are arranged along the X-axis direction.

Three empty trays 200 are also arranged along the X-axis direction. The empty tray 200 also serves as a mounting portion on which the IC device 90 that is inspected by the inspection portion 116 is placed. The IC device 90 on the device recovery section 118 moved to the recovery area A4 is transported and placed on any one of the recovery tray 19 and the empty tray 200. Thereby, the IC device 90 is sorted and recovered based on the results of each inspection.

The device transfer head 120 is supported so as to be movable in the X-axis direction and the Y-axis direction, and further in the Z-axis direction within the recovery area A4. Thereby, the device transfer head 120 can transfer the IC device 90 from the device collection part 118 to the collection tray 19 or the empty tray 200.

The tray transfer mechanism 121 is a mechanism that transfers the empty tray 200 carried in from the tray removal area A5 to the X-axis direction in the recovery area A4. In addition, after the transfer, the empty tray 200 is placed at a position where the IC device 90 is recovered, that is, it may become any of the three empty trays 200 described above.

The tray removal area A5 collects and removes a plurality of ICs arranged in a checked state. The material removal section of the tray 200 of the device 90. In the tray removing area A5, a plurality of trays 200 can be stacked.

In addition, tray transfer mechanisms 22A and 22B are provided to transfer the tray 200 one by one in the Y-axis direction so as to span the recovery area A4 and the tray removal area A5. The tray conveyance mechanism 22A is a moving portion that can move the tray 200 in the Y-axis direction. Thereby, the inspected IC device 90 can be transferred from the recovery area A4 to the tray removal area A5. The tray transfer mechanism 22B can move the empty tray 200 for recycling the IC devices 90 from the tray removal area A5 to the moving portion of the recycling area A4.

The control unit 800 includes, for example, a drive control unit. The drive control unit controls, for example, the tray transfer mechanisms 11A and 11B, the temperature adjustment unit 112, the device transfer head 113, the device supply unit 114, the tray transfer mechanism 115, the inspection unit 116, the device transfer head 117, the device recovery unit 118, and the device transfer head 120 , The tray conveyance mechanism 121, and the drive of each part of the tray conveyance mechanism 22A, 22B.

The inspection control unit of the tester performs, for example, inspection of the electrical characteristics of the IC device 90 disposed in the inspection unit 116 based on a program stored in a memory not shown.

The operator can set or confirm the operating conditions of the inspection device 1000 through the monitor 300. The monitor 300 includes, for example, a display screen (display section) 301 composed of a liquid crystal screen, and is arranged on the upper part of the front side of the inspection device 1000. As shown in FIG. 11, on the right side of the drawing in the tray removal area A5, a mouse stage 600 for placing a mouse used when placing a screen displayed by the operation monitor 300 is provided.

An operation panel 700 is disposed on the lower right side (+ X-axis direction and -Z-axis direction) of FIG. 11 with respect to the monitor 300. In addition to the monitor 300, the operation panel 700 also instructs the inspection device 1000 to perform desired actions.

In addition, the signal lamp 400 can report the operation state of the inspection device 1000 and the like by the combination of the emitted colors. The signal lamp 400 is disposed above the inspection apparatus 1000. Also, check The device 1000 has a built-in speaker 500, and the speaker 500 can be used to report the operation state of the inspection device 1000 and the like.

As shown in FIG. 12, the inspection device 1000 divides (separates) the tray supply area A1 and the supply area A2 by the first partition wall 106, and divides the supply area A2 and the inspection area A3 by the second partition wall 107, and The third partition wall 108 partitions between the inspection area A3 and the recovery area A4, and the fourth partition wall 109 partitions between the recovery area A4 and the tray removal area A5. The fifth partition wall 110 is also partitioned between the supply area A2 and the recovery area A4.

The inspection device 1000 has its outermost body covered with a cover. The cover includes, for example, a front cover 101, a side cover 102, a side cover 103, a rear cover 104, and an upper cover 105.

In addition, the inspection apparatus 1000 includes, for example, a plurality of types of inspection sections 116 corresponding to various conditions such as the type of the IC device 90, and these are replaced and used. In this embodiment, as an example, the inspection unit 116 may be configured such that six inspection devices 116 are arranged in the X-axis direction and two IC devices 90 are arranged in the Y-axis direction. The device transfer head 117 is used by mounting a pressing unit 23 corresponding to the inspection unit 116 (see FIGS. 13 and 14).

As shown in FIG. 14, the pressing unit 23 includes six heating portions 231 each disposed in the X-axis direction and two in the Y-axis direction, and a support portion 232 that supports the heating portions 231 together.

A heater 233 and a temperature sensor 234 are built into each heating section 231. The heater 233 is constituted by, for example, a rod-type sensor that generates heat by being energized. Thereby, each heating part 231 can heat the IC device 90 one by one and individually. The temperature sensor 234 is configured by, for example, a Pt sensor. Thereby, the temperature of the heating part 231 in which the temperature sensor 234 is built can be detected as accurately as possible, and the IC device 90 can be adjusted to a temperature suitable for inspection based on the detection result.

In addition, in addition to the function of heating the IC device 90, each heating section 231 also has a function of adsorbing the IC device 90. Thereby, the IC device 90 on the device supply section 114 can be supplied (transferred) to the inspection section 116. The IC device 90 on the inspection unit 116 may be recovered (transferred) to the device recovery unit 118.

Each heating unit 231 also has a function of pressing the IC device 90 on the inspection unit 116 to the inspection unit 116. Thereby, the electrical connection between the IC device 90 and the inspection unit 116 can be achieved, and therefore, the inspection of the IC device 90 can be performed accurately.

Moreover, each heating part 231 is numbered sequentially from "1" to "12". Hereinafter, the heating section 231 with the serial number "1" is referred to as "first heating section 231a", the heating section 231 with the serial number "2" is referred to as "second heating section 231b", and the heating with the serial number "3" The heating unit 231 is referred to as "the third heating unit 231c", the heating unit 231 having the serial number "4" is referred to as the "fourth heating unit 231d", and the heating unit 231 having the serial number "5" is referred to as the "fifth heating unit 231e" ", Heating unit 231 with serial number" 6 "is called" sixth heating unit 231f ", heating unit 231 with serial number" 7 "is called" seventh heating unit 231g ", and heating with serial number" 8 " The heating unit 231 is referred to as the "eighth heating unit 231h", the heating unit 231 having the serial number "9" is referred to as the "ninth heating unit 231i", and the heating unit 231 having the serial number "10" is referred to as the "10th heating unit 231j" ", The heating section 231 having the serial number" 11 "is referred to as" the 11th heating section 231k ", and the heating section 231 having the serial number" 12 "is referred to as the" 12th heating section 231L ". In addition, in the present embodiment, the 12 heating sections 231 are located on the most front side (negative side in the Y-axis direction) and on the supply area A2 side (negative side in the X-axis direction), that is, from the inspection device 1000. The nearest heating portion 231 on the origin side is the first heating portion 231a with the serial number "1".

As shown in FIG. 15, the first heating portion 231 a to the eighth heating portion 231 h among the first heating portion 231 a to the twelfth heating portion 231L constitute a first group G1. The first heating portion 231a to the eighth heating portion 231h are electrically connected to the first connection portion 24 on the heating portion side. On the other hand, the ninth heating section 231i to the twelfth heating section 231L constitute a second group G2 different from the first group G1, and are electrically connected to the heating section-side second connection section 25.

Such a heating section 231 is mounted on the device transfer head 117 via the support section 232. The support section 232 supports the heating section 231 with its lower side. As shown in FIG. 14, the pressing unit 23 (supporting portion 232) is slid (inserted) from the positive side to the negative side of the X-axis direction with respect to the device transfer head 117 to be mounted on the device transfer head 117 at a position of its movement limit. Of the state. Another, branch The holding portion 232 is preferably configured to restrict the insertion direction of the device transfer head 117, that is, to prevent the reverse insertion of the device transfer head 117. Thereby, the pressing unit 23 can be accurately mounted on the device transfer head 117.

In addition, the pressing unit 23 may have a function of cooling the IC device 90 in the same manner as the temperature adjustment section 112 or the inspection section 116 described above.

As shown in FIGS. 13 and 14, the device transfer head 117 includes a base portion 171, a first connection portion 3, and a second connection portion 4.

The base portion 171 includes a base 172, a pillar 173, a support member 174, and a support member 175.

The base 172 is a portion where the pressing unit 23 is mounted, and is supported in a suspended state from above via a pillar 173.

The support member 174 supports the first connection portion 3 on the supply area A2 side of the base 172, and the support member 175 supports the second connection portion 4 on the recovery area A4 side of the base 172.

As shown in FIG. 13, the rear cover 73 is provided with a window portion 730 that allows the base portion 171 to be viewed at the nearest position. Via this window 730, for example, it is possible to confirm the mounting state of the pressing unit 23 to the device transfer head 117, and the like. The window portion 730 is preferably openable and closable.

As shown in FIG. 15, the first connection portion 3 is connected to the heating portion-side first connection portion 24 of the pressing unit 23. In this connection state, the heating sections 231 labeled with the serial numbers “1” to “8” among the 12 heating sections 231, that is, the first heating section 231a to the eighth heating section 231h belonging to the first group G1, Power is supplied from an external power source 900. Thereby, heating in the first heating section 231a to the eighth heating section 231h can be performed individually.

The second connection portion 4 is connected to the heating portion-side second connection portion 25 of the pressing unit 23. In this connection state, the heating unit 231 marked with a serial number of "9" to "12", that is, the 9th heating unit 231i to the 12th heating unit 231L belonging to the second group G2, can be supplied with power from an external power source 900 . Thereby, it is possible to individually perform the operation from the ninth heating section 231i to the twelfth heating section 231L. heating.

As described above, the inspection apparatus 1000 includes a plurality of types of inspection units 116 corresponding to various conditions such as the type of the IC device 90. In addition, corresponding to various inspection units 116, there is also a pressing unit 23. Therefore, in the present embodiment, the pressing unit 23 is exemplified by having 12 heating sections 231, but the number of the heating sections 231 is not limited to this. The number of the heating portions 231 may be generally 1 to 16. In addition, when the number of the heating sections 231 is one to eight, the first connection section 3 can supply power to each of the heating sections 231. In addition, when the number of the heating sections 231 exceeds 9, that is, 10 or more, even if the heating sections 231 are added from 8 (specific number), the second connecting section 4 can heat the added section. The power supply of the unit 231.

As described above, in the inspection device 1000, regardless of the number of the heating sections 231 provided, the first connection section 3 and the second connection section 4 can distribute the power supply to each heating section 231. Thereby, since heating in each heating part 231 can be performed individually, the temperature adjustment of each IC device 90 at the time of a heating inspection can be performed accurately.

As shown in FIGS. 13 and 14, the first connection portion 3 is supported and fixed to the base 172 of the base portion 171 via a support member 174. Similarly, the second connection portion 4 is also supported and fixed to the base 172 of the base portion 171 via a support member 175. Since the first connection portion 3 and the second connection portion 4 are arranged on a common base 172, the connection work to each connection portion can be easily performed.

The first connection portion 3 and the second connection portion 4 are arranged at different positions on the base 172. In this embodiment, the pillars 173 of the base portion 171 are arranged on opposite sides of each other. In particular, as shown in FIG. 13, the first connection portion 3 is disposed on the supply region A2 side, that is, on the right side (one side) toward the window portion 730, and the second connection portion 4 is disposed on the recovery region A4 side, that is, toward the window portion 730. To the left (the other side). With this arrangement, when the connection operation to the first heating portion side connection portion 24 and the connection portion to the second heating portion side connection portion 25 of the pressing unit 23 are separately performed, it is possible to reduce the erroneous positioning of the first heating portion side connection portion. The connecting portion 24 is connected to the second connecting portion 4, or Incorrect connection of the second connection portion 25 on the heating portion side to the first connection portion 3 by mistake. Moreover, since each connection operation can be confirmed through the window part 730, each connection operation can be performed easily.

As shown in FIG. 14, when the connection operation between the first connection portion 3 and the heating portion-side first connection portion 24 is performed, the connection direction AR1a of the heating portion-side first connection portion 24 to the first connection portion 3 is directed toward the first connection portion 3. The connection direction AR1 of the 1 connection part 3 is the same, and this connection operation is performed. When the second connection portion 4 and the heating portion-side second connection portion 25 are connected, the connection direction AR2a of the heating portion-side second connection portion 25 to the second connection portion 4 is directed toward the second connection portion 4 The connection direction AR2 coincides with this connection operation. Moreover, although either of the connection direction AR1 and the connection direction AR2 is oriented in the horizontal direction, they face each other outwardly and in opposite directions. In contrast, when the connection direction AR1 and the connection direction AR2 face inward, there may be a case where the stay 173 hinders each connection operation. However, since the connection direction AR1 and the connection direction AR2 face outward as described above, it is possible to prevent the pillar 173 from interfering with each connection operation.

As shown in FIGS. 13 and 14, the first connection portion 3 includes one first connector 3 a and two second connectors 3 b. Corresponding to this, the heating-unit-side first connection portion 24 also includes one heating-unit-side first connector 241 and two heating-unit-side second connectors 242. The first connector 3a is connected to each of the heaters 233 of the first heating section 231a to the eighth heating section 231h via the heating connector-side first connector 241. Each of the second connectors 3b is connected to the temperature sensors 234 of the first heating section 231a to the eighth heating section 231h via the heating-unit-side second connector 242. As described above, since the first connection portion 3 has the first connector 3a and the second connector 3b having different functions individually, for example, wiring can be easily performed.

The second connection portion 4 includes one first connector 4a and two second connectors 4b. Corresponding to this, the heating-unit-side second connection portion 25 also includes one heating-unit-side first connector 251 and two heating-unit-side second connectors 252. The first connector 4a is connected to each of the heaters 233 of the ninth heating section 231i to the twelfth heating section 231L via the first connector 251 on the heating section side. Each of the second connectors 4b is connected to the temperature sensor 234 of the ninth heating section 231i to the twelfth heating section 231L through the second connector 252 on the heating unit side. Further, similarly to the first connection portion 3, the second connection portion 3 The connection portion 4 also has the first connector 4a and the second connector 4b having different functions individually, and for example, it is easy to perform wiring.

As shown in FIGS. 13 and 14, due to the arrangement of the first connector 3 a and the second connector 3 b in the first connection portion 3, and between the first connector 4 a and the second connector 4 b in the second connection portion 4. Since the arrangement is the same arrangement, the arrangement in the first connection section 3 will be representatively described below.

Each second connector 3b is arranged via the first connector 3a. As a result, the configuration balance is relatively good, and for example, it is related to the reduction of misconnections.

The first connectors 3a and the second connectors 3b are arranged along the Y-axis direction (in the horizontal direction). Here, if it is assumed that the first connector 3a and each second connector 3b are arranged along the Z-axis direction (along the vertical direction), there is a connection operation for the connector located at the bottom compared to other connectors. The connection work tends to be more difficult, and there is a concern that workability will decrease. However, by arranging the first connector 3a and each of the second connectors 3b in the Y-axis direction, the workability of the connection work to each connector is substantially the same.

As shown in FIG. 16, in the device transfer head 117 on which the pressing unit 23 is mounted, as a detection unit that detects which is not connected to the first connection portion 3 and the second connection portion 4, the serial wiring 26 performs this function. Way of composition.

The serial wiring 26 can be determined by a signal that is not connected to any of the first connection portion 3 and the second connection portion 4. For example, as shown in FIG. 16, when any one of the first connection part 3 and the second connection part 4 is connected, the signal sent from the control part 800 passes through the first connection part 3 and the second part in order. The connection section 4 returns to the control section 800 again, that is, the signal is received by the control section 800. On the other hand, when neither of the first connection portion 3 and the second connection portion 4 is connected, the control unit 800 will not receive a signal. In this case, it is determined that the serial wiring 26 is disconnected halfway, and is not connected to any of the first connection portion 3 and the second connection portion 4. This is intended to be notified by, for example, the monitor 300 or the speaker 500. .

In addition, "disconnecting the serial wiring 26" includes a state in which the serial wiring 26 itself is disconnected in addition to a state in which it is not connected to the first connecting portion 3 or the second connecting portion 4.

As described above, in the inspection device 1000, a simple configuration using the serial wiring 26 can be used to prevent forgetting the connection to the first connection portion 3 or the second connection portion 4.

Next, a screen when the first connection portion 3 and the second connection portion 4 are used will be described with reference to FIGS. 17 to 19.

When the first connection portion 3 and the second connection portion 4 are used, first, the first window 55 shown in FIG. 17 is displayed on the monitor 300 (display screen 301). The first form 55 includes "Handling Mode" as the first menu 551, "Shuttle Mode" as the second menu 552, and "compliance unit ( Compliance Unit "and" Test Site Assign "as the fourth menu 554. And, in the third menu 553, you can choose "40mm ² (1unit / 1device) (40mm Square (1unit / 1device))" or "40mm ² (1unit / 2device) (40mm Square (1unit / 2devices)" )) ". When using the first connection portion 3 and the second connection portion 4, select "40mm ² (1 unit / 1 device)" (40mm Square (1 unit / 1 device)). When only the first connection portion 3 is used and the second connection portion 4 is not used, "40 mm ² (1 unit / 2 devices)" is selected. In this way, the third menu 553 becomes a setting portion that can set whether to use the second connection portion 4 and display it. As a result, the user using the inspection device 1000 can appropriately change the first usage pattern using the first connection portion 3 and the second connection portion 4 as needed, and use only the first connection portion 3 without using the second connection portion. The second of 4 uses the aspect.

After selecting "40mm ² (1unit / 1device)" in the third menu 553, the second window 56 is displayed on the monitor 300. The second form 56 includes "Setup Files" as the first menu 561, "Test Site" as the second menu 562, and "User Selection ( User Select "," Temperature "as 4th menu 564," Tester "as 5th menu 565," Run Mode "as 6th menu 566, and 7th `` Start mode '' on menu 567, `` Bin Setting '' as 8th menu 568, `` Input Shuttle '' as 9th menu 569, and `` 10th menu 570 ''"Hotplate","Robot 2 (Arm2)" as 11th menu 571, "Robot 1 (Arm1)" as 12th menu 572, and "Socket Heat" as 13th menu 573 ", And" Socket Air "as the 14th menu 574. And, in the twelfth menu 572, the temperature of the heating section 231 with the setting serial number "1" to "8" can be input, and in the eleventh menu 571, the temperature of the heating section 231 with the setting serial number "9" or later can be input. . In this way, the eleventh menu 571 and the twelfth menu 572 are screens corresponding to a state where the first connection portion 3 and the second connection portion 4 are used. Thereby, the temperature of each heating part 231 can be individually set.

When a specific other operation is performed on the monitor 300, the third window 58 shown in FIG. 19 is displayed on the monitor 300. The third form 58 includes "Temperature Mode" as the first menu 581, "Priority Mode" as the second menu 582, and "Environment Mode Setting (3 Ambient Mode Setting), `` Heating / Cooling / Ambient Control / Dehumidification Mode Setting '' as the fourth menu 584, and `` Base-points '' as the fifth menu 585 "," Extra Offset "as the 6th menu 586," Temperature offset testing "as the 7th menu 587," Socket Heater "as the 8th menu 588, As the "Temperature Offset Setting" of the ninth menu 589, "Arm2" of the 590th menu, and "Board / shuttle / socket heater / blast ( Plate / Shuttle / SocketHeater / AirBlow) "and" Robot 1 (Arm1) "as the twelfth menu 592. Moreover, in the tenth menu 590, the correction value of the temperature of the heating section 231 after the setting serial number is "9", that is, the deviation value, and in the twelfth menu 592, the setting serial number can be "1" to " The correction value of the temperature of the heating section 231 of 8 ".

<Third Embodiment>

The third embodiment of the electronic component transfer device and the electronic component inspection device of the present invention will be described, but the differences from the above embodiment will be mainly described, and descriptions of the same matters will be omitted.

The inspection device 1000A of this embodiment is the same as the second embodiment described above except that the number of the heating sections of the pressing unit is different.

As shown in FIG. 20, in the inspection device 1000A of this embodiment, the pressing unit 23A includes four heating units 231 each arranged in the X-axis direction and two in the Y-axis direction. The eight heating sections 231 are the first heating section 231a to the eighth heating section 231h. When the pressing unit 23A is mounted on the device transfer head 117, the first connection portion 3 is used, and the second connection portion 4 is not used.

In this case, select "40mm ² (1unit / 2devices)" in the third menu 553 of the first form 55. Thereafter, the second window 56A shown in FIG. 21 is displayed on the monitor 300. This second form 56A is different from the second form 56 described in the above-mentioned second embodiment, and includes "manipulator 2 (Arm2)" as the eleventh menu 571A and "manipulator 1 ( Arm1). " In addition, in "Robot 1 (Arm1)" as the twelfth menu 572A, the temperature of the heating section 231 with the setting serial number "1" to "4" can be input. Arm2) ", you can enter the temperature of the heating section 231 after the setting serial number is" 5 ". In this way, the eleventh menu 571A and the twelfth menu 572A are screens corresponding to a state where only the first connection section 3 is used. Thereby, the temperatures of the eight heating sections 231 can be individually set.

<Fourth Embodiment>

Hereinafter, a fourth embodiment of the electronic component transfer device and the electronic component inspection device according to the present invention will be described with reference to FIGS. 22 to 26.

The electronic component inspection apparatus 2000 shown in FIG. 22 and FIG. 23 is a built-in electronic component transfer device 210.

The electronic component inspection device 2000 includes a tray supply area A1, a device supply area (hereinafter referred to as "supply area") A2, an inspection area A3, a device recovery area (hereinafter referred to as "recycling area") A4, and a tray removal area A5. And these areas are divided by each wall part as mentioned later. In addition, the IC device 90 passes through the tray supply area A1 to the tray removal area A5 in order along the direction of the arrow symbol α ₉₀ , and is inspected in the inspection area A3 in the middle. In this manner, the electronic component inspection device 2000 is an electronic component transfer device (processor) 10 that transports IC devices 90 in each area; an inspection unit 216 that performs inspection in the inspection area A3; and Control section 800. The electronic component inspection device 2000 includes a monitor 300, a signal light 400, and an operation panel 700.

In addition, the electronic component inspection device 2000 is provided with the tray supply area A1 and the tray removal area A5, that is, the -Y axis direction side in FIG. 23 becomes the front side, and the side with the inspection area A3, that is, FIG. The middle + Y-axis direction side is used as the back side.

The tray supply area A1 is a material supply section for supplying a tray 200 in which a plurality of IC devices 90 are arranged in an unchecked state. In the tray supply area A1, a plurality of trays 200 can be stacked.

The supply area A2 is an area for supplying a plurality of IC devices 90 on the tray 200 carried from the tray supply area A1 to the inspection area A3, respectively. In addition, tray conveyance mechanisms 11A and 11B are provided to move the tray 200 one by one in the horizontal direction so as to span the tray supply area A1 and the supply area A2. The tray conveying mechanism 11A is a moving part that can move the tray 200 and the IC device 90 placed on the tray 200 toward the positive side of the Y-axis direction, that is, in the direction of the arrow symbol α _11A in FIG. 23. Thereby, the IC device 90 can be stably conveyed to the supply area A2. The tray conveying mechanism 11B is a moving part that can move the empty tray 200 toward the negative side in the Y-axis direction, that is, in the direction of the arrow symbol α _11B in FIG. 23. Thereby, the empty tray 200 can be moved from the supply area A2 to the tray supply area A1.

In the supply area A2, a temperature adjustment section (a soaking plate (English description: soap plate, Chinese description (example): soaking plate)) 212, a device transfer head 213, and a tray transfer mechanism 215 are provided.

The temperature adjustment unit 212 can mount a plurality of IC devices 90, and And the person who heats it is called a "soaking plate". The IC device 90 before inspection by the inspection unit 216 can be heated in advance by the soaking plate to adjust the temperature suitable for the inspection (high-temperature inspection). In the configuration shown in FIG. 23, two temperature adjustment sections 212 are arranged and fixed along the Y-axis direction. The IC device 90 on the tray 200 carried in from the tray supply area A1 by the tray transfer mechanism 11A is transferred to any one of the temperature adjustment units 212.

The device transfer head 213 is supported so as to be movable in the X-axis direction and the Y-axis direction, and further in the Z-axis direction within the supply region A2. Thereby, the device transfer head 213 can transfer the IC device 90 between the tray 200 and the temperature adjustment section 212 carried in from the tray supply area A1, and the IC device 90 between the temperature adjustment section 212 and a device supply section 214 described later Of transportation. In addition, in FIG. 23, the movement of the X-axis direction of the device transfer head 213 is shown by an arrow symbol α _13X , and the movement of the Y-axis direction of the device transfer head 213 is shown by an arrow symbol α _13Y .

A tray transporting mechanism 215 based all of the IC devices 90 have been removed in the state of the empty tray supply region 200 A2 positive side of the X-axis direction, i.e. the direction of arrow α ₁₅ of the transport mechanism. After the transfer, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the tray transfer mechanism 11B.

The inspection area A3 is an area where the IC device 90 is inspected. In this inspection area A3, an inspection section 216 and a device transfer head 217 are provided. A device supply unit 214 that moves across the supply area A2 and the inspection area A3, and a device recovery unit 218 that moves across the inspection area A3 and the recovery area A4 are also provided.

The device supply section 214 is configured to mount the IC device 90 that has been temperature-adjusted by the temperature adjustment section 212 and transport the IC device 90 to a mounting section near the inspection section 216, also referred to as a "supply shuttle" Or simply referred to as the "supply shuttle".

In addition, the device supply unit 214 is supported so as to be able to move back and forth between the supply area A2 and the inspection area A3 in the X-axis direction, that is, the direction of the arrow symbol α ₁₄ . In the configuration shown in FIG. 23, two device supply sections 214 are arranged in the Y-axis direction, and the IC devices 90 on the temperature adjustment section 212 are transported to any one of the device supply sections 214. The device supply unit 214 is configured to heat the IC device 90 placed on the device supply unit 214 in the same manner as the temperature adjustment unit 212. Thereby, the IC device 90 temperature-adjusted by the temperature adjustment section 212 can be transported to the vicinity of the inspection section 216 of the inspection area A3 while maintaining its temperature adjustment state.

The device transfer head 217 holds the IC device 90 that maintains the above-mentioned temperature-adjusted state, and transfers the operating portion of the IC device 90 in the inspection area A3. The device transfer head 217 is supported by reciprocating movements in the Y-axis direction and the Z-axis direction in the inspection area A3, and becomes a part of a mechanism called an "index robot arm". Thereby, the device transfer head 217 can transfer and place the IC device 90 on the device supply part 214 carried in from the supply area A2 to the inspection part 216. In addition, in FIG. 23, the Y-axis direction reciprocating movement of the device transfer head 217 is indicated by an arrow symbol α _17Y . The device transfer head 217 is supported to be reciprocally movable in the Y-axis direction, but is not limited thereto, and may be supported to be reciprocally movable in the X-axis direction.

The device transfer head 217 is configured to heat the IC device 90 to be held, as in the temperature adjustment unit 212. Thereby, the temperature adjustment state of the IC device 90 can be continuously maintained from the device supply section 214 to the inspection section 216.

The inspection section 216 is a mounting section configured to mount an IC device 90 which is an electronic component and to inspect the electrical characteristics of the IC device 90. The inspection section 216 is provided with a plurality of probe pins electrically connected to the terminal section of the IC device 90. In addition, the terminal portion of the IC device 90 can be electrically connected to the probe pin, that is, contacted, and the inspection of the IC device 90 can be performed. The inspection of the IC device 90 is performed based on a program stored in an inspection control section provided in a tester connected to the inspection section 216. The inspection unit 216 can also heat the IC device 90 in the same manner as the temperature adjustment unit 212, and adjust the IC device 90 to a temperature suitable for inspection.

In addition, the inspection unit 216, the temperature adjustment unit 212, the device supply unit 214, and the device transfer head 217 may be configured such that the IC device 90 can be heated, and the IC device 90 can be cooled.

The device recovery section 218 is an IC device 90 that can be placed in the inspection section 216 after the inspection is completed, and the IC device 90 is transported to the placement section of the recovery area A4, which is called a "recycling shuttle" or simply " Recovery shuttle ".

The device recovery unit 218 is supported to reciprocate between the inspection region A3 and the recovery region A4 in the X-axis direction, that is, in the direction of the arrow symbol α ₁₈ . In the configuration shown in FIG. 23, the device recovery unit 218 is arranged in the Y-axis direction in the same manner as the device supply unit 214, and the IC devices 90 on the inspection unit 216 are transported to any of the device recovery units 218. While placing. This transfer is performed by the device transfer head 217.

The recovery area A4 is an area for recovering the plurality of IC devices 90 after the inspection has been completed. In this collection area A4, a collection tray 19, a device transfer head 220, and a tray transfer mechanism 221 are provided. An empty tray 200 is also prepared in the collection area A4.

The recovery tray 19 is a mounting portion on which the IC device 90 inspected by the inspection portion 216 is placed, and is fixed in the recovery area A4 without moving. Thereby, even if the recovery area A4 in which various movable parts such as a relatively large number of device transfer heads 220 are arranged, the inspected IC devices 90 are stably placed on the recovery tray 19. In the configuration shown in FIG. 23, three collection trays 19 are arranged along the X-axis direction.

Three empty trays 200 are also arranged along the X-axis direction. The empty tray 200 also serves as a mounting portion on which the IC device 90 that is inspected by the inspection portion 216 is placed. In addition, the IC device 90 on the device recovery unit 218 moved to the recovery area A4 is transported and placed on any one of the recovery tray 19 and the empty tray 200. Thereby, the IC device 90 is sorted and recovered based on the results of each inspection.

The device transfer head 220 is supported to move in the X-axis direction and the Y-axis direction, and further in the Z-axis direction within the recovery area A4. Thereby, the device transfer head 220 can transfer the IC device 90 from the device collection part 218 to the collection tray 19 or the empty tray 200. In addition, in FIG. 23, the movement in the X-axis direction of the device transport head 220 is shown by an arrow symbol α _20X , and the movement in the Y-axis direction of the device transport head 220 is shown by an arrow symbol α _20Y .

The tray transfer mechanism 221 is a mechanism that transfers the empty tray 200 carried in from the tray removal area A5 toward the X-axis direction, that is, in the direction of the arrow symbol α ₂₁ in the recovery area A4. In addition, after the transfer, the empty tray 200 is placed at a position where the IC device 90 is recovered, that is, it may become any of the three empty trays 200 described above.

The tray removal area A5 collects and removes the material removal section of the tray 200 in which the plurality of IC devices 90 are arranged in a checked state. In the tray removing area A5, a plurality of trays 200 can be stacked.

In addition, tray transfer mechanisms 22A and 22B are provided to move the tray 200 one by one in the Y-axis direction so as to span the collection area A4 and the tray removal area A5. The tray conveying mechanism 22A is a moving part that can reciprocate the tray 200 in the Y-axis direction, that is, the direction of the arrow symbol α _22A . Thereby, the inspected IC device 90 can be transferred from the recovery area A4 to the tray removal area A5. In addition, the tray transfer mechanism 22B can move the empty tray 200 for recovering the IC device 90 toward the positive side in the Y-axis direction, that is, in the direction of the arrow symbol α _22B . Thereby, the empty tray 200 can be moved from the tray removal area A5 to the recovery area A4.

The control unit 800 includes, for example, a drive control unit. The drive control unit controls, for example, the tray transfer mechanism 11A, the tray transfer mechanism 11B, the temperature adjustment unit 212, the device transfer head 213, the device supply unit 214, the tray transfer mechanism 215, the inspection unit 216, the device transfer head 217, the device recovery unit 218, the device The operations of the various parts of the transfer head 220, the tray transfer mechanism 221, the tray transfer mechanism 22A, and the tray transfer mechanism 22B.

The inspection control unit of the tester performs, for example, inspection of the electrical characteristics of the IC device 90 arranged in the inspection unit 216 based on a program stored in a memory (not shown).

The operator can set or confirm the operating conditions and the like of the electronic component inspection apparatus 2000 via the monitor 300. The monitor 300 includes a display screen 301 composed of, for example, a liquid crystal screen, and is disposed on the upper portion of the front side of the electronic component inspection device 2000. As shown in FIG. 22, on the right side in the drawing of the tray removal area A5, a mouse stage 600 for placing a mouse is provided. This mouse is used when operating a screen displayed on the monitor 300.

An operation panel 700 is disposed on the lower right of FIG. 22 with respect to the monitor 300. In addition to the monitor 300, the operation panel 700 instructs the electronic component inspection apparatus 2000 to perform desired actions.

In addition, the signal lamp 400 can report the operation state of the electronic component inspection device 2000 and the like by the combination of the emitted colors. The signal lamp 400 is disposed above the electronic component inspection device 2000. In addition, the electronic component inspection device 2000 has a built-in speaker 500, and the operating state of the electronic component inspection device 2000 and the like can be notified through the speaker 500.

The electronic part inspection device 2000 is divided between the tray supply area A1 and the supply area A2 by the first partition wall 106, between the supply area A2 and the inspection area A3 by the second partition wall 107, and by the third partition wall 108. Between A3 and the recovery area A4, the fourth partition wall 109 partitions between the recovery area A4 and the tray removal area A5. The fifth partition wall 110 is also partitioned between the supply area A2 and the recovery area A4.

The outermost part of the electronic component inspection device 2000 is covered with a cover. The cover includes, for example, a front cover 101, a side cover 102, a side cover 103, a rear cover 104, and an upper cover 105.

As described above, the device transfer head 217 is configured to heat the IC device 90. Hereinafter, this configuration will be described with reference to FIGS. 24 to 26.

The electronic component inspection device 2000 (electronic component transfer device 210) includes a device transfer head 217. The device transfer head 217 is provided with a base portion 171, eight holding portions 203, four posture changing portions 204, and eight rod heating units as heating portions. Device 205, eight temperature sensors 208, and eight temperature fuses 209 as a temperature detecting section. In addition, the number of the holding portions 203 is eight in this embodiment, but it is not limited to this, as long as it is plural, for example, it may be two to seven or nine or more. The rod heater 205, the temperature sensor 208 (heating section), and the temperature fuse 209 are provided in accordance with the number of the holding sections 203. Therefore, in the device transfer head 217, one rod heater 205, a temperature sensor 208, and a temperature fuse 209 are provided for each holding portion 203.

In the device transfer head 217, one gripping unit 230 is composed of one gripping portion 203, one rod heater 205, one temperature sensor 208, and one temperature fuse 209. As shown in FIG. 26, in this embodiment, there are eight holding units 230, and the holding units 230 are arranged in a matrix of four X-axis directions and two Y-axis directions. Later, from the far left in Figure 26 From the upper holding unit 230, it is called "first holding unit 230A", "second holding unit 230B", "third holding unit 230C", "fourth holding unit 230D", and "fifth holding unit" in order from the lower side. Unit 230E "," 6th holding unit 230F "," 7th holding unit 230G ", and" 8th holding unit 230H ".

The base 171 is connected to a mechanism (not shown) that reciprocates the entire device transfer head 217 in the Y-axis direction and the Z-axis direction above it.

As shown in FIG. 24, below the base portion 171, the four posture changing units 204 are supported together. Each posture changing unit 204 is a person (see FIG. 25) that can change the posture of two holding units 230 (the holding unit 203) adjacent to each other in the Y-axis direction, and is referred to as a “flexible mechanism”. With the posture changing unit 204, the gripping unit 230 can be swung around the axis in the X-axis direction or the axis in the Y-axis direction. Thereby, when holding the IC device 90, the holding unit 230 can follow the posture (tilt) of the IC device 90, and can accurately perform its holding action. In this embodiment, the first gripping unit 230A and the second gripping unit 230B are supported by one posture changing unit 204, the third gripping unit 230C and the fourth gripping unit 230D are supported by one posture changing unit 204, and the fifth The holding unit 230E and the sixth holding unit 230F are supported by one posture changing unit 204, and the seventh holding unit 230G and the eighth holding unit 230H are supported by one posture changing unit 204. In addition, the number of the holding units 230 supported by the posture changing unit 204 is not limited to two, for example, it may be one, or may be three or more.

The posture changing unit 204 is provided with an air chamber 271 whose volume can be changed, and can be configured using, for example, a cylinder or a diaphragm. Thereby, when the holding unit 230 holds the IC device 90, it can play a buffering function with respect to the IC device 90, that is, cushioning, while conforming to the posture of the IC device 90. Therefore, the IC device 90 can be safely held.

Further, three thermal insulation members 206 are provided between the posture changing section 204 and the gripping unit 230 (the gripping section 203). As shown in FIG. 26, the heat-insulating members 206 are provided in a space around the suction port 262 of the holding portion 203 described later in a plan view. In addition, three heat-insulating members 206 are provided for each of the holding units 230, but are not limited thereto. For example, Set one, two, four or more each.

The heat-insulating member 206 provided in this manner can block heat from the heating unit, that is, the rod heater 205. Thereby, the heat from the rod heater 205 can be prevented from being transmitted to the posture changing unit 204. In addition, such an insulation can prevent the air chamber 271 from thermally expanding inadvertently, thereby affecting the posture change of the holding unit 230.

The heat-insulating member 206 is preferably composed of a columnar or block-shaped member. The constituent material of the heat-insulating member 206 is not particularly limited. For example, a material having excellent heat-insulating properties such as epoxy resin can be used.

As described above, in the device transfer head 217, there are eight holding units 230. Since the configurations of the holding units 230 are the same, one of the holding units 230 will be representatively described below.

Each of the holding units 230 includes a holding portion 203, a rod heater 205, a temperature sensor 208, and a temperature fuse 209. The electronic component inspection device 2000 (electronic component transfer device 210) includes an inspection area A3 for performing an electrical inspection of the IC device 90, which is an electronic component. A holding unit 230 (holding unit 203) is arranged in the inspection area A3. Thereby, the temperature-adjusted IC device 90 can be transported to the inspection section 16 from the temperature adjustment section 212 through the device supply section 214 and heated and temperature-adjusted.

As shown in FIG. 26, the grip portion 203 is formed of a plate-shaped (or block-shaped) member, and has a suction port 262 opened on a lower surface 261 thereof. The suction port 262 is connected to an ejector (not shown) via a pipe (not shown). In addition, the grip portion 203 generates an attraction force on the suction port 262 by operating the ejector. Thereby, the IC device 90 which is an electronic component can be held. In addition, since the vacuum destruction in the ejector is performed while the IC device 90 is being held, the holding state of the IC device 90 can be released, and the IC device 90 can be released from the holding portion 203.

In addition, the holding portion 203 has a stepped portion 263 that is formed in an L shape in plan view, that is, a portion of the outer peripheral portion in the X-axis direction in plan view protrudes toward the positive or negative side of the Y-axis direction. This stepped portion 263 becomes a part where the rod heater 205 is provided. The holding portions 203 adjacent to each other in the Y-axis direction are such that the step portions 263 are adjacent to each other in the X-axis direction and face opposite directions. For example, focusing on the third holding unit 230C and the fourth holding unit 230D in FIG. 26, the step portion 263 of the holding portion 203 of the third holding unit 230C is located on the left side in the figure and faces the negative side in the Y-axis direction. The step portion 263 of the holding portion 203 of the fourth holding unit 230D is located on the right side in the figure and faces the positive side in the Y-axis direction. By forming such a step portion 263, the position of the longest-length rod heater 205 among the rod heater 205, the temperature sensor 208, and the temperature fuse 209 can be ensured while being reduced to the Y axis as much as possible. The distance P _Y between the adjacent gripping portions 203 in the direction. Accordingly, miniaturization of the device transfer head 217 can be achieved. Here, the “inter-pitch distance P _Y ” refers to the distance between the centers in the Y-axis direction of the suction port 262.

The distance P _Y between the adjacent gripping portions 203 in the Y-axis direction is preferably 40 mm or less, more preferably 4 mm or more and 36 mm or less. In addition, it is preferable that the distance P _X between the adjacent holding portions 203 in the X-axis direction is also set to the same numerical range as the distance P _Y between the distances. This range of values contributes to miniaturization of the device transfer head 217. Here, the "inter-pitch distance P _X " refers to the center-to-center distance in the X-axis direction of the suction port 262.

Moreover, adjacent holding portions 203 in the Y-axis direction are spaced apart from each other. Thereby, a gap 264 having a crank shape in a plan view is formed between the adjacent gripping portions 203 in the Y-axis direction. Moreover, adjacent holding portions 203 in the X-axis direction are also spaced apart from each other.

The constituent material of the holding portion 203 is not particularly limited. For example, various metal materials having excellent thermal conductivity such as aluminum or stainless steel can be used.

As shown in FIG. 26, in the holding portion 203, a rod heater 205, a temperature sensor 208, and a temperature fuse 209 are built.

The rod heater 205 is provided corresponding to the holding portion 203, and is a heating portion that can heat the IC device 90, which is an electronic component held by the holding portion 203, together with the holding portion 203.

The rod heater 205 as such a heating unit has a rigid heating tube 281 with a heating wire (not shown) which generates heat by supplying power, and is electrically connected to the heating wire and supplies the heating wire from the outside. Wiring 282 for electric power from a power source (not shown). The rod heater 205 is preferably a length between both ends of the heating tube 281 which becomes the body, that is, a length L ₅₁ of 35 mm or more and 40 mm or less, more preferably 36 mm or more and 38 mm or less. The total length L _{51 of the} heating tube 281 can be set to the full length of the heater 5. The output value of the rod heater 205 is preferably 35 W or more and 55 W or less, and more preferably 40 W or more and 48 W or less. By incorporating such a rod heater 205 in the holding portion 203, the inter-pitch distance P _X or the inter-pitch distance P _{Y can be} set within the above numerical range, and the IC device 90 can be appropriately heated.

As shown in FIG. 26, as the heating portion, a rod heater 205 is a heating tube 281 arranged in the Y-axis direction, and a part of the heating tube 281 overlaps with the step portion 263 of the holding portion 203 in a plan view. Thereby, the stepped portion 263 can be a part of the installation place of the rod heater 205 with the longest length among the rod heater 205, the temperature sensor 208, and the temperature fuse 209, and the step portion 263 can be effectively used. As the rod heater 205, an existing one can be used.

As described above, in the electronic component inspection device 2000 (electronic component transfer device 210), a configuration is adopted in which one rod heater 205 having a predetermined size is disposed on one of the holding portions 203 with respect to one IC device 90. Thereby, when each IC device 90 is heated, the temperature control of each IC device 90 can be accurately performed.

In addition, the rod heaters 205 that are heating portions provided on the holding portions 203 adjacent to each other in the Y-axis direction are related to each other by a point that divides each heating portion, that is, the distance between the rod heaters 205 in half hereinafter referred to as "the center point O _50") point symmetrically arranged. For example, focusing on the first holding unit 230A and the second holding unit 230B in FIG. 26, it is assumed that the central point O ₅₁ of the long-side direction of the heating pipe 281 connected to the first holding unit 230A and the heating pipe 281 of the second holding unit 230B are assumed. The line segment S ₅₁ of the center point O _{51 in} the longitudinal direction. The point at which this line segment S _{51 is} bisected becomes the center point O ₅₀ . In addition, regarding this center point O ₅₀ , the rod heater 205 of the first holding unit 230A and the rod heater 205 of the second holding unit 230B are arranged symmetrically at a point. With this configuration, whether the IC device 90 is heated by the rod heater 205 of the first holding unit 230A, or the IC device 90 is heated by the rod heater 205 of the second holding unit 230B, The degree of heating is the same. That is, the IC device 90 is heated to the same degree regardless of which holding unit 230 is holding it.

As described above, the rod heater 205 as the heating section has the wiring 282 for supplying power. The rod heaters 205 which are the heating portions provided in the holding portions 203 adjacent to each other in the Y-axis direction, and the wirings 282 of the rod heaters 205 protrude toward each other. For example, focusing on the first holding unit 230A and the second holding unit 230B in FIG. 26, the wire 282 of the rod heater 205 of the first holding unit 230A protrudes toward the positive side of the Y-axis direction, and the second holding unit 230B The wiring 282 of the rod heater 205 protrudes toward the negative side in the Y-axis direction. By the wiring of such a wiring 282, the wiring 282 is restricted to the outside, that is, it protrudes more outwardly than the outline OL _{171 of the} base 171 in the state shown in FIG. This prevents the wiring 282 from being caught by other structures around the device transfer head 217.

The temperature sensor 208 is a temperature detection unit provided corresponding to the holding portion 203 and detecting the temperature of the IC device 90 held by the holding portion 203. The temperature sensor 208 is a Pt sensor, and has a rod-shaped resistor 291 and a wiring 292 electrically connected to the resistor 291 and transmitting an electrical signal from the resistor 291 to the control unit 800. In addition, the total length L _{81 of the} temperature sensor 208 series resistor 291 is shorter than the total length L _{51 of the} heating tube 281, for example, it is preferably 10 mm or more and 20 mm or less, and more preferably 15 mm or more and 20 mm or less.

The temperature sensor 208 configured in this way is a resistor 291 and a heating tube 281 of the rod heater 205 arranged in parallel. The resistor 291 is closer to the suction port 262 than the heating pipe 281. In addition, the temperature sensors 208 provided in the holding portions 203 adjacent to each other in the Y-axis direction are arranged symmetrically with respect to the center point O _{50 in the} same manner as the rod heater 205.

In addition, the temperature sensors 208 provided in the holding portions 203 adjacent to each other in the Y-axis direction are connected to each other with wires 292 protruding in a direction facing each other. Thereby, like the wiring 282, the wiring 292 is prevented from being caught by other structures around the device transfer head 217.

The temperature fuse 209 is a device that blocks the current when a current higher than the rated current flows through the rod heater 205. In addition, the total length L ₉ of the temperature fuse 209 is the length between the total length L ₅₁ of the heating tube 281 and the total length L ₈₁ of the resistor 291. For example, it is preferably 15 mm or more and 25 mm or less, and more preferably 20 mm or more and 25 mm or less. .

The temperature fuse 209 having such a structure is arranged in parallel with the heating tube 281 of the rod heater 205 in the same manner as the resistor 291. The temperature fuse 209 is disposed on the side opposite to the rod heater 205 with the temperature sensor 208 interposed therebetween. In addition, the rod heaters 205, the temperature sensors 208, and the temperature fuses 209 are dispersedly arranged in the X-axis direction in a plan view. With this arrangement, the holding portion 203 can keep the lower surface 261 as horizontal as possible during the movement of the device transfer head 217.

In addition, the temperature fuses 209 provided in the holding portions 203 adjacent to each other in the Y-axis direction are arranged symmetrically with respect to the center point O _{50 in the} same manner as the rod heater 205.

In addition, by setting the total length L _{81 of the} resistor 291 and the total length L _{9 of the} temperature fuse 209 to the above-mentioned numerical ranges, it is possible to reduce the size of the device transfer head 217.

<Fifth Embodiment>

Hereinafter, a fifth embodiment of the electronic component transfer device and the electronic component inspection device of the present invention will be described with reference to FIGS. 27 and 28. The differences from the above embodiment will be mainly described, and the description of the same matters will be omitted. .

The inspection device 2000A of this embodiment is the same as the fourth embodiment except that the installation positions of the rod heater, the temperature sensor, and the temperature fuse of the holding portion are different.

As shown in FIGS. 27 and 28, in the inspection device 2000A of this embodiment, in the holding unit 330, the rod heater 305, the temperature sensor 308, and the temperature fuse 309 are oriented the same with respect to the Y-axis direction. Orientation. Thereby, for example, the length in the Y-axis direction of the holding unit 330 can be made shorter than the length in the Y-axis direction of the holding unit 230 in the fourth embodiment described above. Therefore, the size of the device transfer head 317 can be reduced. In addition, in FIG. 27 and FIG. 28, the 1st holding means 330A and the 2nd holding means 330B are typically described.

And, in the holding portions 303 (the holding portion 303a or the holding portion 303b) adjacent to each other in the Y-axis direction, each of the rod heaters 305, the temperature sensors 308, and the temperature fuses 309 is about the center. The points O ₅₀ are arranged symmetrically. With this configuration, the IC device 90 is heated to the same degree regardless of which holding unit 330 is holding it, and the temperature is accurately detected.

Moreover, in FIG. 27, the holding part 303 (303a) is formed in L shape in planar view. On the other hand, in FIG. 28, the grip portion 303 (303b) is formed in a rectangular shape (a rectangular shape or a quadrangular shape) in a plan view. Such a shape is appropriately selected depending on, for example, the length L ₅₀ of the rod heater 305 or the arrangement state (posture) of the rod heater 305, the temperature sensor 308, and the temperature fuse 309.

The electronic component transfer device and the electronic component inspection device of the present invention have been described based on the illustrated embodiments, but the present invention is not limited to this, and the configuration of each part may be replaced with any configuration having the same function. Moreover, you may add another arbitrary structure to this invention.

The electronic component transfer device and the electronic component inspection device of the present invention may be a combination (a feature) of any two or more of the above-mentioned embodiments.

In addition, either the connection direction to the first connection portion or the connection direction to the second connection portion is a horizontal direction in each of the above embodiments, but at least one of the connection directions may be a vertical direction.

In the second embodiment and the third embodiment, the number of the second connectors provided in the first connection portion and the second connection portion is two, but it is not limited to this. For example, it may be three or more. .

Claims (18)

An electronic component conveying device, comprising: a robot arm portion capable of conveying a plurality of electronic components, and having a plurality of connection portions connected to a holding portion that holds and holds the electronic component; and a distribution portion provided on the robot arm portion, The refrigerant for cooling the plurality of electronic parts can be distributed to the plurality of flow paths by the distribution part piping connected to the plurality of connection parts, and can be transported to the plurality of connection parts; and a collection part provided in the robot arm It is possible to collect refrigerant for cooling the plurality of electronic components through the plurality of flow paths from the plurality of connection portions through the piping for the collection portion connected to the plurality of connection portions. For example, in the electronic component transfer device of claim 1, a plurality of flow paths starting from the distribution section and a plurality of flow paths leading to the collection section are connected to the connection section, respectively. In the electronic component conveying device according to claim 1 or 2, wherein the distribution section has a supply flow path for supplying a refrigerant for cooling the plurality of electronic parts, and a plurality of distribution flow paths branched from the supply flow path. For example, the electronic component conveying device according to claim 3, wherein the collection unit includes a discharge flow path for discharging the refrigerant after cooling the plurality of electronic parts, and a collection flow path branched from the discharge flow path. According to the electronic component transfer device of claim 4, wherein the distribution flow path is disposed closer to the front end side of the robot arm portion than the collection flow path. For example, the electronic component transfer device according to claim 1 or 2, wherein the distribution unit and the collection unit are included in one component. The electronic component transfer device according to claim 6, wherein the member is disposed on a side portion of the robot arm portion. The electronic component transfer device according to claim 6, wherein the above-mentioned member is constituted by containing a resin. For example, the electronic component transporting device of claim 6, wherein a plurality of holding portions capable of holding the electronic parts may be disposed in the robot arm portion; and the member is disposed closer to the base end side of the robot arm portion than the holding portion. For example, the electronic part transfer device of claim 1 or 2, wherein a plurality of piping for the distribution section is connected to the distribution section; and at least two of the plurality of piping for the distribution section are different from each other from the distribution section. Extending in the direction. According to the electronic component transfer device of claim 10, wherein the plurality of piping systems for the distribution section are symmetrically arranged with respect to the distribution section. The electronic component conveying device according to claim 10, wherein the piping for the distribution portion has a portion extending along a side portion of the robot arm portion. For example, the electronic part transfer device of claim 1 or 2, wherein a plurality of pipings for the collection section are connected to the collection section; and at least two of the plurality of pipings for the collection section are different from each other since the collection section Extending in the direction. According to the electronic component transporting device of claim 13, wherein the plurality of piping systems for the collection section are symmetrically arranged with respect to the collection section. The electronic component conveying device according to claim 13, wherein the piping for the collection section has a portion extending along a side portion of the robot arm section. The electronic component conveying device according to claim 13, wherein the piping for the collection unit has a ring portion formed in a ring shape. According to the electronic component transfer device of claim 16, wherein the ring portion is bent toward the base end side of the robot arm portion, and then bent toward the front end side of the robot arm portion. An electronic component inspection device, comprising: a mechanical arm portion capable of transporting a plurality of electronic components and having a plurality of connecting portions connected to a holding portion that holds the electronic components; and a distribution portion provided on the mechanical arm portion, The refrigerant for cooling the plurality of electronic components can be distributed to the plurality of flow paths by the distribution portion piping connected to the plurality of connection portions, and can be transported to the plurality of connection portions; and a collection portion provided in the robot arm portion The refrigerant after cooling the plurality of electronic parts can be collected through the plurality of flow paths from the plurality of connection parts through a piping for a collection part connected to the plurality of connection parts; and an inspection part that inspects the electronic parts.