TWI745049B - Nitrogen circulation system - Google Patents
Nitrogen circulation system Download PDFInfo
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- TWI745049B TWI745049B TW109128972A TW109128972A TWI745049B TW I745049 B TWI745049 B TW I745049B TW 109128972 A TW109128972 A TW 109128972A TW 109128972 A TW109128972 A TW 109128972A TW I745049 B TWI745049 B TW I745049B
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 title claims abstract description 215
- 229910052757 nitrogen Inorganic materials 0.000 title claims abstract description 95
- 238000000746 purification Methods 0.000 claims abstract description 36
- 230000006835 compression Effects 0.000 claims abstract description 22
- 238000007906 compression Methods 0.000 claims abstract description 22
- 239000007789 gas Substances 0.000 claims description 47
- 229910001873 dinitrogen Inorganic materials 0.000 claims description 25
- 239000000428 dust Substances 0.000 claims description 25
- 239000011148 porous material Substances 0.000 claims description 20
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 13
- 239000001301 oxygen Substances 0.000 claims description 13
- 229910052760 oxygen Inorganic materials 0.000 claims description 13
- 238000012423 maintenance Methods 0.000 claims description 11
- 238000007791 dehumidification Methods 0.000 claims description 7
- 229920000742 Cotton Polymers 0.000 claims description 2
- 239000012530 fluid Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 10
- 239000000047 product Substances 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 5
- 238000001035 drying Methods 0.000 description 4
- 238000001914 filtration Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000004378 air conditioning Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 239000003814 drug Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000005693 optoelectronics Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000000452 restraining effect Effects 0.000 description 1
- 235000015096 spirit Nutrition 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
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- Separation Of Gases By Adsorption (AREA)
- Filtering Of Dispersed Particles In Gases (AREA)
Abstract
本發明係為一種氮氣循環系統,其係利用氮氣輸入裝置、幫浦、氮氣純化裝置及腔體進行氮氣循環,幫浦係透過第一管路連接於氮氣輸入裝置,氮氣純化裝置係透過第二管路連接於幫浦,氮氣純化裝置包含殼體、進氣過濾模組及壓縮元件,以及腔體係由上而下依序設置第一多孔件及第二多孔件,將腔體分隔為進氣區、潔淨區及出口區,進氣區設置第二進氣口,第二進氣口透過第三管路連接於第一出氣口,出口區設置第二出氣口並透過第四管路連接至幫浦。The present invention is a nitrogen circulation system, which utilizes a nitrogen input device, a pump, a nitrogen purification device and a cavity for nitrogen circulation. The pump is connected to the nitrogen input device through the first pipeline, and the nitrogen purification device is through the second The pipeline is connected to the pump. The nitrogen purification device includes a shell, an intake filter module and a compression element, and the cavity system is sequentially arranged with a first porous member and a second porous member from top to bottom to divide the cavity into In the air inlet area, the clean area and the outlet area, the air inlet area is provided with a second air inlet, the second air inlet is connected to the first air outlet through a third pipeline, and the outlet area is provided with a second air outlet through the fourth pipeline Connect to the pump.
Description
本發明係關於一種裝置,特別是一種氮氣循環系統。 The present invention relates to a device, especially a nitrogen circulation system.
現代精密電子工業以及生物科技工業均依賴潔淨室(clean room)提供低塵度和適當溫濕度的封閉空間,以設置高價值的精密電子或生物科技產品的生產或儲存設備。就傳統的潔淨室的流通氣體清淨系統的設計而言,其通常是類似一般商業辦公場所的空調系統,在室內天花板外部上方設置具有鼓風設備和過濾設備的進氣過濾區和室內的照明燈具。 The modern precision electronics industry and the biotechnology industry rely on clean rooms to provide closed spaces with low dust and appropriate temperature and humidity to set up high-value precision electronics or biotechnology products production or storage equipment. As far as the design of the circulating gas purification system of the traditional clean room is concerned, it is usually similar to the air conditioning system of a general commercial office. Above the indoor ceiling, an intake filter area with blast equipment and filtering equipment and indoor lighting fixtures are set up. .
上述潔淨室和上述空調系統的差別在於,除了在上述進氣過濾區採用遠較一般空調系統更為精細的過濾器例如是高效濾網(HEPA,high-efficiency particulate air)之外,還在建築物樓地板上設置高架地板供承載上述設備,上述高架地板會盡可能設置大量孔洞,以便上述粉塵受重力作用落入高架地板下方,並且利用由上述進氣過濾區向高架地板吹送的氣流,將上述生產或儲存活動產生的粉塵,經由上述孔洞帶離上述潔淨室,上述高架地板下方設置有例如靜電除塵設備、加熱器或加濕器等處理設備,以將潔淨室排出的流通氣體淨化和調整至符合適當的塵度和溫度和濕度要求,然後再送回上述進氣過濾區如此循環使用上述流通氣體。 The difference between the above-mentioned clean room and the above-mentioned air-conditioning system is that, in addition to the use of a filter that is much finer than the general air-conditioning system, such as a high-efficiency particulate air (HEPA, high-efficiency particulate air), in the air-intake filter area, it is also used in construction A raised floor is provided on the floor of the building to carry the above equipment. The raised floor will have as many holes as possible so that the dust will fall under the raised floor by gravity, and the airflow blown from the air intake filter area to the raised floor will be used to reduce The dust generated by the above production or storage activities is carried away from the clean room through the holes, and processing equipment such as electrostatic dust removal equipment, heaters or humidifiers are installed under the raised floor to purify and adjust the circulating gas discharged from the clean room. Until it meets the appropriate dust level, temperature and humidity requirements, then it is sent back to the above-mentioned intake filter area so that the above-mentioned circulating gas is recycled.
此外,尖端的半導體工業以及光電工業採用大量的電漿氣體設備對加工的產品進行材料的沉積(deposition)、清洗(cleaning)、灰化(ashing)或蝕刻(etching)等工序統稱為乾製程,這些乾製程所用的設備具有近乎真空的電漿腔室且同樣循環使用著各種特化氣體作為工作氣體,無疑的也必須在上述電漿腔室的入口以及出口設置上述的潔淨和除塵設備,以保持上述工作氣體的成分、壓力、流量和塵度符合對應的乾製程所需。 In addition, the cutting-edge semiconductor industry and the optoelectronic industry use a large number of plasma gas equipment to process products such as deposition, cleaning, ashing or etching, etc., which are collectively referred to as dry processes. The equipment used in these dry processes has a plasma chamber that is nearly vacuum and also recycles various specialized gases as working gas. Undoubtedly, the above-mentioned cleaning and dust removal equipment must be installed at the entrance and exit of the above-mentioned plasma chamber. Keep the composition, pressure, flow rate and dustiness of the above working gas in line with the requirements of the corresponding dry process.
不僅如此,上述尖端的半導體工業以及光電工業同時具有大量的濕蝕刻、光阻顯影以及各種清洗等濕式製程,也採用各種液體藥劑並循環使用以節省成本,同樣也必須在上述濕式製程設備的入口以及出口,設置上述的循環藥劑潔淨和除塵設備,以保持上述藥劑的成分、溫度、流量和一除塵度符合對應的濕式製程所需。 Not only that, the above-mentioned cutting-edge semiconductor industry and the optoelectronic industry also have a large number of wet etching, photoresist development, and various cleaning processes. They also use various liquid chemicals and recycle them to save costs. They must also be used in the above wet process equipment. The inlet and outlet of the above-mentioned circulating medicine cleaning and dust removal equipment are provided to maintain the composition, temperature, flow rate and a dust removal degree of the above-mentioned medicine to meet the requirements of the corresponding wet process.
然而,上述的各種流體主要是依賴鼓風設備或是在藥液循環系統中的幫浦提供驅動力而流動,除此之外並未進一步對於流體的流速進行精確控制以及利用,以至於上述粉塵的移除效率不高需要以人力定期執行大清掃(super clean),或是上述乾、濕製程設備工作氣體或藥液等工作流體的成分、溫度、流量不穩定,導致製程條件的控制不佳產生不良品。 However, the above-mentioned various fluids mainly rely on the driving force provided by the blowing equipment or the pump in the liquid medicine circulation system to flow. In addition, the flow rate of the fluid is not further accurately controlled and utilized, so that the above-mentioned dust The removal efficiency is not high and requires regular manual super clean, or the composition, temperature, and flow of working fluids such as the working gas or chemical liquid of the dry and wet process equipment are unstable, resulting in poor control of the process conditions Produce defective products.
因此,如何精確控制流體應用裝置的流體流速,以改善流體應用裝置內部的塵度或是控制工作流體的穩定度,一直是本領域產業市場上亟待解決的問題。 Therefore, how to accurately control the fluid flow rate of the fluid application device to improve the dust level inside the fluid application device or control the stability of the working fluid has always been a problem to be solved urgently in the industry market in this field.
本發明之一目的,在於提供一種氮氣循環系統,其係利用第一多孔件及第二多孔件使氣流均速通過第一多孔件及第二多孔件,透過第一多孔件及第二多孔件的多孔特性,使氣流通過時流速被控制,有利於均勻帶走腔體內之粉塵,使腔體內環境潔淨無粉塵。 An object of the present invention is to provide a nitrogen circulation system, which utilizes the first porous member and the second porous member to make the air flow pass through the first porous member and the second porous member at an even speed, and to pass through the first porous member And the porous characteristics of the second porous member, the flow rate of the air flow is controlled, which is beneficial to uniformly remove the dust in the cavity, and make the environment in the cavity clean and dust-free.
本發明之一目的,在於提供一種氮氣循環系統,本發明當腔體內壓力過高時,透過壓縮元件可將氮氣引流出腔體後儲存,並使腔體內之壓力下降,當腔體內壓力不足時,將儲存之氮氣引流至腔體內以有效利用氮氣避免能源浪費。 One purpose of the present invention is to provide a nitrogen circulation system. When the pressure in the cavity is too high, the compression element can drain nitrogen out of the cavity and store it, and reduce the pressure in the cavity. When the pressure in the cavity is insufficient , Drain the stored nitrogen into the cavity to effectively use the nitrogen to avoid energy waste.
針對上述之目的,本發明提供一種氮氣循環系統,其包含:一氮氣輸入裝置;一幫浦,其係透過一第一管路連接於該氮氣輸入裝置;一氮氣純化裝置,其係透過一第二管路連接於該幫浦;以及一腔體,該腔體透過一第三管路與該氮氣純化裝置相連,其內依序設置有一第一多孔件及一第二多孔件,該第一多孔件具有一第一孔徑,該第二多孔件具有一第二孔徑,其中,該第一孔徑大於該第二孔徑;當該氮氣輸入裝置透過該第一管路輸入一氮氣至該幫浦時,該幫浦利用該第二管路將該氮氣輸入至該氮氣純化裝置中進行純化,接著透過該第三管路將該氮氣由該氮氣純化裝置輸入至該腔體內,使該氮氣流經該第一多孔件及該第二多孔件時,因流速改變產生壓力差,而將該腔體內之粉塵帶走。 In view of the above objective, the present invention provides a nitrogen circulation system, which includes: a nitrogen input device; a pump connected to the nitrogen input device through a first pipe; and a nitrogen purification device through a second Two pipelines are connected to the pump; and a cavity, the cavity is connected to the nitrogen purification device through a third pipeline, in which a first porous member and a second porous member are arranged in sequence, the The first porous member has a first pore diameter, and the second porous member has a second pore diameter, wherein the first pore diameter is larger than the second pore diameter; When the pump is used, the pump uses the second pipeline to input the nitrogen gas into the nitrogen purification device for purification, and then the third pipeline imports the nitrogen gas from the nitrogen purification device into the cavity, so that the When nitrogen flows through the first porous member and the second porous member, a pressure difference is generated due to the change of the flow rate, and the dust in the cavity is taken away.
本發明提供一實施例,其中該氮氣純化裝置包含一殼體,其設有一第一進氣口及一第一出氣口,該第一進氣口設置於該殼體之一第一側並透過該第二管路與該幫浦相連,該第一出氣口設置於該殼體之一第二側,並透過 該第三管路與該腔體相連;一氣體過濾模組,其係設置於該殼體內,並位於靠近該第一進氣口之一側;以及一壓縮元件,其係設置於該殼體內,位於該氣體過濾模組及該第一出氣口之間,用於調節該腔體內的氣體壓力。 The present invention provides an embodiment, wherein the nitrogen purification device includes a housing provided with a first air inlet and a first air outlet, and the first air inlet is arranged on a first side of the housing and penetrates The second pipeline is connected to the pump, and the first air outlet is arranged on a second side of the housing and penetrates The third pipeline is connected to the cavity; a gas filter module is arranged in the housing and located on a side close to the first air inlet; and a compression element is arranged in the housing , Located between the gas filter module and the first air outlet, for adjusting the gas pressure in the cavity.
本發明提供一實施例,其中該氣體過濾模組包含一過濾元件,一除濕元件及一濾氧元件,該除濕元件設置於該過濾元件及濾氧元件之間。 The present invention provides an embodiment, wherein the gas filter module includes a filter element, a dehumidification element and an oxygen filter element, and the dehumidification element is disposed between the filter element and the oxygen filter element.
本發明提供一實施例,其中該第一多孔件及該第二多孔件,將該腔體分隔為一進氣區、一潔淨區及一出口區,該進氣區設置一第二進氣口,該第二進氣口透過該第三管路連接於該第一出氣口,該出口區設置一第二出氣口並透過一第四管路連接至該幫浦。 The present invention provides an embodiment, wherein the first porous member and the second porous member separate the cavity into an air inlet area, a clean area and an outlet area, and the air inlet area is provided with a second inlet The second air inlet is connected to the first air outlet through the third pipeline, and the outlet area is provided with a second air outlet and connected to the pump through a fourth pipeline.
本發明提供一實施例,其中該過濾元件係為HEPA、或高效過濾棉。 The present invention provides an embodiment, wherein the filter element is HEPA or high efficiency filter cotton.
本發明提供一實施例,其中該第一多孔件具有一第一孔徑,該第二多孔件具有一第二孔徑,其中,該第一孔徑大於該第二孔徑。 The present invention provides an embodiment, wherein the first porous member has a first pore size and the second porous member has a second pore size, wherein the first pore size is larger than the second pore size.
本發明提供一實施例,其中該腔體進一步設置有一進氣過濾模組,該進氣過濾模組設置於該第一多孔件及該第二多孔件之間。 The present invention provides an embodiment, wherein the cavity is further provided with an air inlet filter module, and the air inlet filter module is arranged between the first porous member and the second porous member.
本發明提供一實施例,其中該進氣過濾模組係為空氣淨化機或風機濾網機組。 The present invention provides an embodiment, wherein the intake filter module is an air purifier or a fan filter unit.
本發明提供一實施例,其中更包含一維修排氣口,其係設於一第五管路之一側,該維修排氣口其係透過一第五管路連接至該幫浦。 The present invention provides an embodiment, which further includes a maintenance exhaust port, which is arranged on one side of a fifth pipeline, and the maintenance exhaust port is connected to the pump through a fifth pipeline.
本發明提供一實施例,其中該氮氣純化裝置更包含一氣體緩衝槽,其係設置於該壓縮元件及該第一出氣口之間。 The present invention provides an embodiment, wherein the nitrogen purification device further includes a gas buffer tank, which is disposed between the compression element and the first gas outlet.
本發明提供一實施例,其中該壓縮元件更包含一洩壓閥,該洩壓閥用以洩除該槽體內之一壓力。 The present invention provides an embodiment, wherein the compression element further includes a pressure relief valve, the pressure relief valve being used to relieve a pressure in the tank.
1:第一管路 1: The first pipeline
10:氮氣輸入裝置 10: Nitrogen input device
2:第二管路 2: The second pipeline
20:幫浦 20: pump
3:第三管路 3: The third pipeline
30:氮氣純化裝置 30: Nitrogen purification device
32:殼體 32: shell
322:第一進氣口 322: First Air Inlet
324:第一出氣口 324: The First Outlet
34:氣體過濾模組 34: Gas filter module
342:過濾元件 342: filter element
344:除濕元件 344: Dehumidification element
346:濾氧元件 346: oxygen filter element
36:壓縮元件 36: Compression element
38:氣體緩衝槽 38: Gas buffer tank
4:第四管路 4: The fourth pipeline
40:腔體 40: Cavity
41:第二進氣口 41: second air inlet
42:第一多孔件 42: The first porous piece
422:第一孔徑 422: first aperture
43:第二出氣口 43: second outlet
44:第二多孔件 44: second porous piece
442:第二孔徑 442: second aperture
45:擴散板 45: diffuser
46:第一緩衝空間 46: The first buffer space
47:進氣過濾模組 47: intake filter module
48:第二緩衝空間 48: second buffer space
5:第五管路 5: Fifth pipeline
6:第六管路 6: The sixth pipeline
72:第一側 72: first side
74:第二側 74: second side
80:維修排氣口 80: Maintenance exhaust port
92:進氣區 92: intake area
94:潔淨區 94: clean area
96:出口區 96: Exit area
962:出口緩衝空間 962: exit buffer space
第1A圖:其為本發明之一實施例之裝置示意圖;第1B圖:其為本發明之一實施例之第一多孔件示意圖;第1C圖:其為本發明之一實施例之一第二多孔件示意圖;第2圖:其為本發明之一實施例之緩衝空間及擴散板位置示意圖;以及第3圖:其為本發明之一實施例之維修排氣示意圖。 Figure 1A: It is a schematic diagram of the device of an embodiment of the present invention; Figure 1B: It is a schematic diagram of the first porous member of an embodiment of the present invention; Figure 1C: It is one of the embodiments of the present invention Schematic diagram of the second porous member; Figure 2: It is a schematic diagram of the position of the buffer space and the diffuser of an embodiment of the present invention; and Figure 3: It is a schematic diagram of the maintenance exhaust of an embodiment of the present invention.
為使 貴審查委員對本發明之特徵及所達成之功效有更進一步之瞭解與認識,謹佐以較佳之實施例及配合詳細之說明,說明如後: In order to enable your reviewer to have a further understanding and understanding of the features of the present invention and the effects achieved, the preferred embodiments and detailed descriptions are provided here. The description is as follows:
習知各種流體主要是依賴鼓風設備或是在藥液循環系統中的幫浦提供驅動力而流動,除此之外並未進一步對於流體的流速進行精確控制以及利用,導致製程條件的控制不佳產生不良品,且傳統的系統在腔體壓力過大時,會採用直接洩壓的方式將氣體排出腔體外,雖然可以控制腔體壓力,但是卻會造成能源之浪費。 Conventionally, various fluids mainly rely on the driving force provided by the blowing equipment or the pump in the chemical liquid circulation system to flow. In addition, there is no further precise control and utilization of the flow rate of the fluid, which leads to the inconsistent control of the process conditions. Good produces defective products, and when the cavity pressure is too high, the traditional system will directly discharge the gas out of the cavity by means of direct pressure relief. Although the cavity pressure can be controlled, it will cause a waste of energy.
本發明利用第一多孔件及第二多孔件使氣流均速通過第一多孔件及第二多孔件,透過第一多孔件及第二多孔件的多孔孔徑不同之特性,使氣流通過時流速被控制,有利於均勻帶走腔體內之粉塵,使腔體內環境潔淨無粉 塵,提升良品的生產率;另外,本發明當腔體內壓力過高時,透過壓縮元件可將氮氣引流出腔體後儲存,並使腔體內之壓力下降,當腔體內壓力不足時,將儲存之氮氣引流至腔體內以有效利用氮氣避免能源浪費。 The present invention utilizes the first porous member and the second porous member to make the air flow pass through the first porous member and the second porous member at a uniform speed, and to pass through the characteristics of the different pore diameters of the first porous member and the second porous member. The flow rate is controlled when the airflow passes, which is beneficial to evenly remove the dust in the cavity, and make the environment in the cavity clean and powder-free Dust improves the productivity of good products; in addition, when the pressure in the cavity is too high, the present invention can draw nitrogen out of the cavity and store it through the compression element, and reduce the pressure in the cavity. When the pressure in the cavity is insufficient, it will be stored. Nitrogen is drained into the cavity to effectively use the nitrogen to avoid energy waste.
在下文中,將藉由圖式來說明本發明之各種實施例來詳細描述本發明。然而本發明之概念可能以許多不同型式來體現,且不應解釋為限於本文中所闡述之例示性實施例。 Hereinafter, various embodiments of the present invention will be described in detail through the use of drawings. However, the concept of the present invention may be embodied in many different forms, and should not be construed as being limited to the exemplary embodiments set forth herein.
首先,請參閱第1A圖,其為本發明之一實施例之裝置示意圖,如圖所示,本發明之氮氣循環系統包含一氮氣輸入裝置10、一幫浦20、一氮氣純化裝置30及一腔體40。
First, please refer to Figure 1A, which is a schematic diagram of an apparatus of an embodiment of the present invention. As shown in the figure, the nitrogen circulation system of the present invention includes a
上述之該氮氣輸入裝置10係用以輸入一氮氣進入該腔體40內,該幫浦20係透過一第一管路1管路連接於該氮氣輸入裝置10,該氮氣純化裝置30係透過一第二管路2管路連接於該幫浦20,以及該腔體40係由上而下依序設置一第一多孔件42及一第二多孔件44,將該腔體40分隔為一進氣區92、一潔淨區94及一出口區96,該進氣區92設置一第二進氣口41,該第二進氣口41透過一第三管路3管路連接於該氮氣純化裝置30之一第一出氣口324,該出口區96設置一第二出氣口43並透過一第四管路4管路連接至該幫浦10,使該氮氣透過該幫浦10可回流至該氮氣純化裝置30內,其中,該出口區96包含一出口緩衝空間962,該出口緩衝空間962係用以緩衝由該潔淨區92所排出之含有粉塵顆粒之該氮氣,透過該出口緩衝空間962,可有效率的使該氮氣中的粉塵沉降於該出口區96之中。
The above-mentioned
其中,上述之該氮氣純化裝置30包含了一殼體32、一氣體過濾模組34及一壓縮元件36,該殼體32係包含一第一進氣口322及該第一出氣口
324,該第二管路2連接於該第一進氣口322,該第一進氣口322設置於該殼體32之一第一側72,該第一出氣口324設置於該殼體32之一第二側74,而該氣體過濾模組34係設置於該殼體32內,該氣體過濾模組34係位於該第一進氣口322之一側,另外,該壓縮元件36係設置於該殼體32內,該壓縮元件36係設置於該氣體過濾模組34及該第一出氣口324之間,該氮氣純化裝置30係將進入之該氮氣內的水氣、粉塵以及多餘的氧氣過濾,使該氮氣利用該第三管路3進入該腔體40時,該氮氣為純氮氣。
The above-mentioned
而該氣體過濾模組34係包含一過濾元件342、一除濕元件344及一濾氧元件346,該過濾元件342係設置於該殼體32內並設置於該第一進氣口322及該壓縮元件36之間,該除濕元件344係設置於該過濾元件342及該壓縮元件36之間,該除濕元件344係用以去除該氣體過濾模組34內通過之該氮氣中所含之水氣,而該濾氧元件346係設置於該除濕元件344及該壓縮元件36之間,該濾氧元件346係用以去除該氣體過濾模組34內通過之該氮氣中所含之氧氣,透過該氣體過濾模組34可將該氮氣進行過濾純化之程序,使進入該腔體40的該氮氣為純氮,降低粉塵或水氣污染該腔體40。
The
再者,由於過去的氮氣循環淨化系統,因外在環境溫度變化,造成該腔體40內該氮氣溫度跟隨變化,當該氮氣溫度上升時,該腔體40壓力隨之升高,反之,該氮氣溫度下降,該腔體40之壓力隨之下降,為了控制該腔體40內之適宜的壓力,傳統常見做法是當該腔體40壓力下降時,氮氣循環淨化系統直接使用該幫浦20加壓該氮氣,讓該腔體40壓力上升至適宜範圍,而當該腔體40壓力上升時,採用直接洩壓方式將該氮氣排出該腔體40外,讓該腔體40壓
力下降至適宜範圍,雖透過這種直接洩壓的方式可控制該腔體40之壓力,但會造成該氮氣能源浪費。
Furthermore, due to the past nitrogen circulating purification system, the temperature of the nitrogen in the
因此,氮氣純化裝置30內之該壓縮元件36包含一洩壓閥(未圖示),該洩壓閥用以洩除該腔體40內之一壓力,透過該洩壓閥將該氮氣引流出該腔體40外,另外,除了該壓縮元件36外,於該氮氣純化裝置30內更包含一氣體緩衝槽38,該氣體緩衝槽38係設置於該壓縮元件36及該第一出氣口324之間,有別於過去的氮氣循環淨化系統,使用該壓縮元件36及該氣體緩衝槽38控制因溫度變化而產生的該腔體40的壓力變化;當該腔體40壓力升高,將該腔體40內多餘的壓力透過該壓縮元件36儲存至該氣體緩衝槽38,讓該腔體40之壓力下降至適當的範圍,當該腔體40壓力下降時,透過該壓縮元件36將該氣體緩衝槽38內的該氮氣加壓並釋放至該腔體40內,本發明之氮氣循環系統不但可以有效控制該腔體40之壓力,更有別一般氮氣循環淨化系統更節能,避免多於的該氮氣能源浪費。
Therefore, the
另外,該腔體40內更包含一進氣過濾模組47,該進氣過濾模組47設置於該第一多孔件42及該第二多孔件44之間,該進氣過濾模組47係為空氣淨化機或風機濾網機組(Fan Filter Unit,FFU),該進氣過濾模組47是一種結合送風機與高效濾網(HEPA或ULPA)氣流循環與過濾之無塵室潔淨設備,主要是用來過濾來自作業場所空氣中所存在有害空氣中的粉塵顆粒,提供潔淨之空氣。該進氣過濾模組47大致可分層流型(laminar)與紊流型(turbulent)兩大類,層流型都在Class 1000以下,而紊流型無塵室則是在Class 1000以上主要安裝於無塵室天花板上及機台上方,或網格地板內安裝此設備,提供無塵室與機台所需之氣流循環與空氣濾淨,使用此設備多半大致採送風式居多。
In addition, the
復參閱第1A圖,透過該進氣過濾模組47將該氮氣由該進氣區92處之該第二進氣口41流入該腔體40,該氮氣流經該第一多孔件42、該潔淨區94及該第二多孔件44後進入該出口區96,而該氮氣(如第1A圖中之箭頭)於該出口區96之該出口緩衝空間962做流體緩衝後,使該氮氣中所含之粉塵沉降於該出口區96後,再由該出口區96一側之一第六管路6連接該第三管路3,再利用該第三管路3巡迴流回該腔體40內,而上述之該氮氣透過該進氣過濾模組47循環於該腔體40內之方式,係可為單邊循環,亦可為兩邊循環,而本實施例中係以單邊循環進行說明,但不以此為限。
Referring back to Fig. 1A, the nitrogen gas flows into the
因此,由上述內容可了解本發明去除粉塵係利用該進氣過濾模組47形成之內循環風道,維持該腔體40之潔淨度,而更進一步,透過該氮氣純化裝置30去除該氮氣中水及氧氣來維持該腔體40內之低水氧之環境。
Therefore, it can be understood from the above content that the present invention uses the internal circulation air duct formed by the
因此,本發明之氮氣循環系統當該氮氣輸入裝置10透過該第一管路1輸入該氮氣至該幫浦20時,該幫浦20利用該第二管路2將該氮氣輸入至該氮氣純化裝置30中進行純化,接著透過該第三管路3將該氮氣由該氮氣純化裝置30輸入至該腔體40內,使該氮氣流經該第一多孔件42及該第二多孔件44時,因流速改變產生壓力差,而將該腔體40內之粉塵帶走。
Therefore, in the nitrogen circulation system of the present invention, when the
另外,請一併參考第1B圖,其為本發明之一實施例之第一多孔件示意圖,以及第1C圖,其為本發明之一實施例之一第二多孔件示意圖,如圖所示,該腔體40內之該第一多孔件42係具有一第一孔徑422,該第二多孔件44係具有一第二孔徑442,本發明之該進氣過濾模組47在同樣的風量下,該第一多孔件42之該第一孔徑422依風量通過的截面積(Porous Plate),計算開孔率15%至30%的圓孔孔徑,且平均分佈於風量通過的截面積上,而另一方面,該第二
多孔件44之該第二孔徑442以該第一多孔件42所計算之開孔率,再縮減70%至80%的圓孔孔徑(依該第一多孔件42風量通過的截面積,則開孔率為10.5%至24%的圓孔孔徑),且平均分佈於風量通過的截面積上,該第二多孔件44之功效係可加快該氮氣氣體的氣流速度,該第二孔徑442通過的風速可提升4.2至9.5倍,快速將該腔體40之粉塵帶至該第二多孔件44下方的該腔體40底部之該出口區96,抑制該潔淨區94(Clean Area)內的粉塵汙染,更有別一般顆粒淨化之功能。
In addition, please also refer to Fig. 1B, which is a schematic diagram of a first porous member according to an embodiment of the present invention, and Fig. 1C, which is a schematic diagram of a second porous member according to an embodiment of the present invention, as shown in Fig. As shown, the first
接著,請參考第2圖,其為本發明之一實施例之緩衝空間及擴散板位置示意圖,如圖所示,本發明之氮氣循環系統更包含一擴散板45,該擴散板45可使該氮氣之氣體氣流平均流入該潔淨區94內,進一步,該第一多孔件42及該進氣過濾模組47之間設有一第一緩衝空間46,該第一緩衝空間46係使該氮氣均勻分布擴散流經該進氣過濾模組47,同樣的,該進氣過濾模組47及該擴散板45之間設有一第二緩衝空間48,該第二緩衝空間48係使該氮氣均勻分布擴散流經該擴散板45。
Next, please refer to Figure 2, which is a schematic diagram of the position of the buffer space and the diffuser plate of an embodiment of the present invention. As shown in the figure, the nitrogen circulation system of the present invention further includes a
該氮氣經由該第三管路3流入該進氣區92後,通過該第一多孔件42,再流經該第一緩衝空間46、該第二緩衝空間48及該擴散板45使該氮氣在流入該潔淨區94時。可均勻流入而不會使該潔淨區94之該氮氣量過多產生氣流紊亂。
After the nitrogen gas flows into the
另外,請接著參考第3圖,其為本發明之一實施例之維修排氣示意圖,如圖所示,本發明之氮氣循環系統於該幫浦20之一側設置有一維修排氣口80,其係透過一第五管路5連接至該幫浦20,透過該維修排氣口80,於本發明之氮氣循環系統需要維修時,透過該幫浦20將該腔體40及該第一管路1、該
第二管路2、該第三管路3及該第四管路4內之該氮氣抽出,以利後續維修或清潔事宜。
In addition, please refer to Fig. 3, which is a schematic diagram of maintenance exhaust of an embodiment of the present invention. As shown in the figure, the nitrogen circulation system of the present invention is provided with a
以上所述之實施例,本發明係為一種氮氣循環系統,係可使用氮氣或氬氣的無塵室,或是使用電漿氣體乾製程設備之流體流速調節循環處理系統,供循環處理流體應用裝置中流動的流體,透過腔體內之第一多孔件之第一孔徑及第二多孔件之第二孔徑控制氣體氣流速度,使氣體氣流均速通過第一多孔件及第二多孔件時,因第二孔徑小於第一孔徑,因此氣流均速通過第二多孔件時,會因為不同孔徑的變化,使通過的流速增加,有利於快速帶走腔體內粉塵,使腔體內環境潔淨無粉塵,提升良品的生產率。 In the above-mentioned embodiment, the present invention is a nitrogen circulation system, which can use a clean room of nitrogen or argon, or use a fluid flow rate adjustment circulation processing system of plasma gas dry process equipment, for circulating processing fluid applications The fluid flowing in the device passes through the first aperture of the first porous member and the second aperture of the second porous member in the cavity to control the gas flow rate, so that the gas flow passes through the first porous member and the second porous member at a uniform speed Because the second pore size is smaller than the first pore size, when the airflow passes through the second porous piece at a uniform speed, the flow rate will increase due to the change of the different pore sizes, which is beneficial to quickly take away the dust in the cavity and make the environment in the cavity Clean and dust-free, improve the productivity of good products.
故本發明實為一具有新穎性、進步性及可供產業上利用者,應符合我國專利法專利申請要件無疑,爰依法提出發明專利申請,祈 鈞局早日賜准專利,至感為禱。 Therefore, the present invention is truly novel, progressive, and available for industrial use. It should meet the patent application requirements of my country's patent law. Undoubtedly, I filed an invention patent application in accordance with the law. I pray that the Bureau will grant the patent as soon as possible.
惟以上所述者,僅為本發明之較佳實施例而已,並非用來限定本發明實施之範圍,舉凡依本發明申請專利範圍所述之形狀、構造、特徵及精神所為之均等變化與修飾,均應包括於本發明之申請專利範圍內。 However, the above are only the preferred embodiments of the present invention, and are not used to limit the scope of implementation of the present invention. For example, the shapes, structures, features and spirits described in the scope of the patent application of the present invention are equally changed and modified. , Should be included in the scope of patent application of the present invention.
1:第一管路 1: The first pipeline
10:氮氣輸入裝置 10: Nitrogen input device
2:第二管路 2: The second pipeline
20:幫浦 20: pump
3:第三管路 3: The third pipeline
30:氮氣純化裝置 30: Nitrogen purification device
32:殼體 32: shell
322:第一進氣口 322: First Air Inlet
324:第一出氣口 324: The First Outlet
34:氣體過濾模組 34: Gas filter module
342:過濾元件 342: filter element
344:除濕元件 344: Dehumidification element
346:濾氧元件 346: oxygen filter element
36:壓縮元件 36: Compression element
38:氣體緩衝槽 38: Gas buffer tank
4:第四管路 4: The fourth pipeline
40:腔體 40: Cavity
41:第二進氣口 41: second air inlet
42:第一多孔件 42: The first porous piece
43:第二出氣口 43: second outlet
44:第二多孔件 44: second porous piece
47:進氣過濾模組 47: intake filter module
6:第六管路 6: The sixth pipeline
72:第一側 72: first side
74:第二側 74: second side
92:進氣區 92: intake area
94:潔淨區 94: clean area
96:出口區 96: Exit area
962:出口緩衝空間 962: exit buffer space
Claims (9)
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| US20040168742A1 (en) * | 2003-02-12 | 2004-09-02 | Kim Hyun-Joon | Module for transferring a substrate |
| TW200620391A (en) * | 2004-07-01 | 2006-06-16 | Samsung Electronics Co Ltd | Greating and clean room system comprising the same |
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| CN108695206A (en) * | 2017-03-31 | 2018-10-23 | 东京毅力科创株式会社 | Base board delivery device and substrate transfer method adopted therein |
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| CN116809553A (en) * | 2023-07-19 | 2023-09-29 | 天津建工城市建设发展有限公司 | A nitrogen purging equipment for copper pipe cleaning |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202208049A (en) | 2022-03-01 |
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