TWI866712B - Heat dissipation structure and electronic package thereof - Google Patents

Abstract

A heat dissipation structure for an electronic package is provided, comprising: a plate body provided on a heat source of the electronic package, wherein the plate body is made of metal and non-metal composite materials. The prevent invention further provides an electronic package arranged with the heat dissipation structure.

Description

Heat dissipation structure and electronic packaging thereof

The present invention relates to a semiconductor packaging structure, in particular to a heat dissipation structure and its electronic packaging component.

As the demand for electronic products in terms of functions and processing speed increases, semiconductor chips, as the core components of electronic products, need to have higher density electronic components and electronic circuits, so semiconductor chips will generate more heat during operation.

Therefore, in order to quickly dissipate heat to the outside, the industry usually configures a heat sink or heat spreader in the semiconductor package. The heat sink is usually combined with the back of the chip through a heat sink such as a thermal interface material (TIM) to dissipate the heat generated by the semiconductor chip through the heat sink and the heat spreader.

As shown in FIG. 1 , the manufacturing method of the known semiconductor package 1 is to first place a semiconductor chip 11 on a package substrate 10 with its active surface 11a by flip chip bonding (i.e., through conductive bumps 110 and bottom glue 111), and then a heat sink 13 is bonded to the inactive surface 11b of the semiconductor chip 11 with its top sheet 130 through a heat sink 12, and the supporting legs 131 of the heat sink 13 are mounted on the package substrate 10 through an adhesive layer 14. During operation, the heat energy generated by the semiconductor chip 11 is transferred to the top sheet 130 of the heat sink 13 through the inactive surface 11b and the heat sink 12 to dissipate heat to the outside of the semiconductor package 1.

However, as the functional requirements of the semiconductor chip 11 increase, the number of its contacts (I/O) also increases, and the heat energy generated becomes higher and higher. The heat sink 13 generally made of metal copper material can no longer meet the high heat dissipation requirements.

Therefore, how to overcome the above-mentioned problems of knowledge and technology has become an urgent issue to be solved.

In view of the various deficiencies of the above-mentioned prior art, the present invention provides a heat dissipation structure for electronic packaging, the heat dissipation structure comprising: a plate body, which is arranged on the heat source of the electronic packaging, and a chamber is formed inside the plate body, wherein the plate body is made of a metal and non-metal composite material; and a working fluid, which is contained in the chamber and changes between gas and liquid by the heat energy generated by the heat source.

In the aforementioned heat dissipation structure, the metal is copper, aluminum, stainless steel or a combination thereof.

In the aforementioned heat dissipation structure, the non-metal is graphene, diamond or a combination thereof.

As in the aforementioned heat dissipation structure, the plate body includes an upper cover and a lower cover, and the upper cover and the lower cover are assembled with each other to form the chamber therebetween.

The aforementioned heat dissipation structure further includes a capillary structure disposed on the lower cover and located in the chamber.

As in the aforementioned heat dissipation structure, a plurality of supporting columns are further included, which are arranged on the upper cover and located in the chamber and abut against the capillary structure.

The aforementioned heat dissipation structure further includes a supporting foot that is combined with the lower cover for being installed on the electronic package.

As in the aforementioned heat dissipation structure, the supporting foot is ring-shaped or column-shaped.

The present invention further provides an electronic package, comprising: a circuit structure having a first side and a second side opposite to each other; an electronic component disposed on the first side of the circuit structure; and a heat dissipation structure as described above, disposed on the electronic component.

The aforementioned electronic package further includes a conductive element disposed on the second side of the circuit structure.

In summary, the heat dissipation structure of the present invention is made of metal and non-metal composite materials, which can have high strength characteristics to reduce the thickness of the overall heat sink, low density characteristics to reduce weight, and high thermal conductivity characteristics to improve heat dissipation capabilities, so that the heat dissipation structure can be combined with the electronic components of the package to effectively meet high heat dissipation requirements.

1:Semiconductor packages

10:Packaging substrate

11: Semiconductor chip

11a,31a: Action surface

11b,31b: non-active surface

110,310: Conductive bump

111: Base glue

12,32: Heat sink

13: Heat sink

130: Top piece

131: Support your feet

14,34: Adhesive layer

2: Heat dissipation structure

20: Board

21: Lower cover

21a, 22a: Inner surface

21b, 22b: outer surface

22: Upper cover

23: Chamber

24: Capillary structure

25: Support column

26: Support your feet

3: Electronic packaging components

30: Circuit structure

30a: First side

30b: Second side

301: Insulation layer

302: Circuit layer

31: Electronic components

311: Insulation material

33: Conductive element

Figure 1 is a schematic cross-sectional view of a conventional semiconductor package.

Figure 2 is a cross-sectional schematic diagram of the heat dissipation structure of the present invention.

Figure 3 is a schematic cross-sectional view of the electronic package of the present invention.

The following is a specific and concrete example to illustrate the implementation of the present invention. People familiar with this technology can easily understand other advantages and effects of the present invention from the content disclosed in this manual.

It should be noted that the structures, proportions, sizes, etc. depicted in the drawings attached to this specification are only used to match the contents disclosed in the specification for understanding and reading by people familiar with this technology, and are not used to limit the restrictive conditions for the implementation of the present invention. Therefore, they have no substantial technical significance. Any modification of the structure, change of the proportion relationship or adjustment of the size should still fall within the scope of the technical content disclosed by the present invention without affecting the effects and purposes that can be achieved by the present invention. At the same time, the terms such as "above", "first", "second" and "one" used in this specification are only used to facilitate the clarity of the description, and are not used to limit the scope of implementation of the present invention. Changes or adjustments to their relative relationships, without substantially changing the technical content, should also be regarded as the scope of implementation of the present invention.

FIG2 is a schematic cross-sectional view of the heat dissipation structure 2 of the present invention. The heat dissipation structure 2 can be in the form of a vapor chamber, which includes a plate 20, a chamber 23, a capillary structure 24, and a plurality of supporting columns 25.

The plate body 20 includes a lower cover 21 and an upper cover 22. The lower cover 21 has an inner surface 21a and an outer surface 21b opposite to each other, and the upper cover 22 has an inner surface 22a and an outer surface 22b opposite to each other. The lower cover 21 and the upper cover 22 can be assembled with each other in the directions corresponding to the inner surfaces 21a and 22a, and after being combined, a chamber 23 is formed between the lower cover 21 and the upper cover 22.

In this embodiment, after the chamber 23 is evacuated, a working fluid is injected and contained therein, and the working fluid may be water, cooling liquid, methanol, acetone, mercury, etc., which may change into a gas state after absorbing heat energy and may change into a liquid state after cooling. In actual operation, the working fluid may coexist in a gas state and a liquid state in the chamber 23 at the same time.

In this embodiment, the plate 20 is made of a metal and non-metal composite material.

In one embodiment, the metal is copper (Young's modulus 0.13TPa, density 8.9g/ ^cm3 , thermal conductivity 400W/mk), aluminum (Young's modulus 0.07TPa, density 2.7g/ ^cm3 , thermal conductivity 315W/mk), stainless steel (Young's modulus 0.19TPa, density 7.9g/ ^cm3 , thermal conductivity 16.3W/mk) or a combination thereof, and the non-metal is graphene (Young's modulus 1TPa, density 0.22g/ ^cm3 , thermal conductivity 5300W/mk), diamond (Young's modulus 1.2TPa, density 3.5g/ ^cm3 , thermal conductivity 2300W/mk) or a combination thereof, but the present invention is not limited thereto.

The capillary structure 24 is disposed on the inner surface 21a of the lower cover 21 and is located in the chamber 23 to absorb the liquid working fluid.

In this embodiment, the capillary structure 24 can be fiber, a sintered particle body or a metal mesh body, wherein the sintered particle body refers to a tissue or structure having a plurality of capillaries or interconnected holes formed by sintering metal powder (such as copper), and the metal mesh body refers to a woven mesh having a plurality of meshes woven from metal (such as copper), but the present invention is not limited to the above.

A plurality of supporting columns 25 are disposed on the inner surface 22a of the upper cover 22 and are spaced apart from each other and are located in the chamber 23. The lower cover 21 and the upper cover 22 are assembled with each other, and the plurality of supporting columns 25 abut against the capillary structure 24.

In this embodiment, a plurality of support columns 25 are formed on the inner surface 22a of the upper cover 22 in an evenly distributed manner, with a certain distance between each other, so as to evenly support the upper cover 22 and prevent the central part of the upper cover 22 from being sunken.

In one embodiment, the plurality of support columns 25 may be cylindrical. In other embodiments, the plurality of support columns 25 may also be square columns or strips. The plurality of support columns 25 may also be formed on the inner surface 22a of the upper cover 22 in an irregularly distributed manner, for example, the support columns 25 may be centrally arranged in the pressure concentration area.

In one embodiment, the upper cover 22 and the plurality of supporting columns 25 can be formed in one piece, that is, the material of the plurality of supporting columns 25 can be the same as that of the upper cover 22.

FIG3 is a schematic cross-sectional view of the electronic package 3 of the present invention. The electronic package 3 includes the heat dissipation structure 2 of FIG2 , a circuit structure 30 , an electronic component 31 and a conductive component 33 .

The circuit structure 30 is, for example, a substrate with a core layer or a coreless substrate, which includes at least one insulating layer 301 and at least one circuit layer 302 combined with the insulating layer 301, and has a first side 30a and a second side 30b opposite to each other.

In addition, the material forming the circuit layer 302 is copper, and the material forming the insulating layer 301 is, for example, a dielectric material such as polybenzoxazole (PBO), polyimide (PI), prepreg (PP), or the outermost layer can be a green paint anti-soldering material.

The electronic component 31 is connected to the first side 30a of the circuit structure 30 via a plurality of conductive bumps 310 so that the electronic component 31 is electrically connected to the circuit layer 302.

In this embodiment, the electronic component 31 is an active component, a passive component or a combination thereof. The active component is, for example, a semiconductor chip, and the passive component is, for example, a resistor, a capacitor and an inductor. For example, the electronic component 31 is a semiconductor chip having an active surface 31a and an inactive surface 31b opposite to each other. The active surface 31a has a plurality of electrode pads, which are disposed on the circuit layer 302 on the first side 30a of the circuit structure 30 by a plurality of conductive bumps 310 such as solder materials, metal pillars (pillars) or others by flip chip method and electrically connected to the circuit layer 302, and the conductive bumps 310 are coated with an insulating material 311 such as a primer or a non-conductive bottom fill film (NCF); or, the electronic component 31 can directly electrically contact the circuit layer 302 on the first side 30a of the circuit structure 30. Therefore, there are many ways for the electronic component 31 to be electrically connected to the circuit structure 30, which are not limited to the above.

The heat dissipation structure 2 is disposed on the non-active surface 31b of the electronic component 31 through the heat sink 32 with the outer surface 21b of the lower cover 21, so that the electronic component 31 acts as a heat source to transfer heat energy to the board 20 and the working fluid therein, and is simultaneously connected to the first side 30a of the circuit structure 30 through the support leg 26.

In this embodiment, the heat sink 32 may be, for example, a thermal interface material (TIM), solder, metal or other thermal conductive materials.

In this embodiment, the support pin 26 is bonded to the first side 30a of the circuit structure 30 and the outer surface 21b of the lower cover 21 by an adhesive layer 34, and is disposed around the electronic component 31. In one embodiment, the support pin 26 may be ring-shaped, but the present invention is not limited thereto. The support pin 26 may also be column-shaped, for example, two columns are respectively located at two opposite sides of the electronic component 31, or four columns are respectively located at the four corners of the electronic component 31.

In one embodiment, the support leg 26 can be formed integrally with the lower cover 21, that is, the material of the support leg 26 can be the same as that of the lower cover 21.

The conductive element 33 may be, for example, a solder bump, disposed on the second side 30b of the circuit structure 30 and electrically connected to the circuit layer 302.

The operation of the heat dissipation structure 2 of the present invention is as follows. The heat energy generated by the electronic component 31 (heat source) is transferred to the lower cover 21 through the heat sink 32. The working fluid (liquid) in the capillary structure 24 absorbs the heat energy and changes into gaseous state, and moves toward the upper cover 22 and the chamber 23 between the plurality of support columns 25. The gaseous working fluid cools down after exchanging heat energy with the outside and condenses into liquid. The liquid working fluid will move toward the lower cover 21 and be absorbed by the capillary structure 24 to carry out the next heat dissipation cycle.

In summary, the heat dissipation structure of the present invention is made of metal and non-metal composite materials, which can have high strength characteristics to reduce the thickness of the overall heat sink, low density characteristics to reduce weight, and high thermal conductivity characteristics to improve heat dissipation capabilities, so that the heat dissipation structure can be combined with the electronic components of the package to effectively meet high heat dissipation requirements.

The above embodiments are used to illustrate the principles and effects of the present invention, but are not used to limit the present invention. Anyone familiar with this technology can modify the above embodiments without violating the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be as listed in the scope of the patent application described below.

2: Heat dissipation structure

20: Board

21: Lower cover

21a, 22a: Inner surface

21b, 22b: outer surface

22: Upper cover

23: Chamber

24: Capillary structure

25: Support column

26: Support your feet

3: Electronic packaging components

30: Circuit structure

30a: First side

30b: Second side

301: Insulation layer

302: Circuit layer

31: Electronic components

31a: Action surface

31b: Non-active surface

310: Conductive bump

311: Insulation material

32: Heat sink

33: Conductive element

34: Adhesive layer

Claims (8)

A heat dissipation structure for an electronic package, comprising: a plate body, disposed on a heat source of the electronic package, and forming a chamber inside the plate body, wherein the plate body is made of a metal and non-metal composite material, wherein the metal is copper, aluminum, stainless steel or a combination thereof, and the non-metal is graphene, diamond or a combination thereof; and a working fluid, contained in the chamber, which changes between gas and liquid by the heat energy generated by the heat source. The heat dissipation structure as described in claim 1, wherein the plate body includes an upper cover and a lower cover, and the upper cover and the lower cover are assembled with each other to form the chamber therebetween. The heat dissipation structure as described in claim 2 further includes a capillary structure disposed on the lower cover and located in the chamber. The heat dissipation structure as described in claim 3 further includes a plurality of supporting columns disposed on the upper cover and located in the chamber and abutting against the capillary structure. The heat dissipation structure as described in claim 2 further includes a support foot that is combined with the lower cover for being installed on the electronic package. The heat dissipation structure as described in claim 5, wherein the supporting leg is ring-shaped or column-shaped. An electronic package includes: a circuit structure having a first side and a second side opposite to each other; an electronic component disposed on the first side of the circuit structure; and a heat dissipation structure as described in any one of claims 1 to 6, disposed on the electronic component. The electronic package as described in claim 7 further includes a conductive element disposed on the second side of the circuit structure.

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