TWM445688U - Up and down alignment inspection system - Google Patents

Description

Upper and lower alignment check system

This creation is about a top and bottom alignment check system, especially a laser print alignment check system.

In the conventional art, for the offset printing product (ie, the product to be inspected) after the laser printing of the new product, the operator often needs to correct the laser printing, and the mask is used to detect the mask. The operation mode is different from the deviation of the operation mode, and the manual comparison correction is not easy and inconvenient, and the problem of time and labor for the operator is caused.

Regarding the verification of products or processes, a number of related patents are as follows.

TW I358244 discloses a method for setting inspection reference data for filler angle inspection, and a substrate appearance inspection device using the same. An object of the present invention is to automatically set inspection reference data suitable for the shape of an actual filler angle. The solution of the present invention is to classify the shape of the filler angular shape generated by the component of the component type into a plurality of types for each component type, and to prepare a test standard for the inspection reference data such as the threshold value derivation rule for each type of registration. database. For each of the filler angle patterns of the database, each of the height ranges of the emulsion solder paste before the formation of the filler angle is assigned. At the time of teaching, the terminal block window is set for each of the terminal blocks corresponding to the components of the teaching object, and the height of the emulsion solder paste applied to the terminal block is calculated using CAD data or component shape data. Further, the inspection reference data of the filler angle type corresponding to the calculated solder height is read from the inspection reference database, and the setting information corresponding to the terminal block window is given and registered in the memory of the inspection apparatus.

TW I349775 discloses an electronic wire device, a substrate inspection device and a detector positioning method, which can make the inspection speed of the SEM inspection device faster, that is, a method for increasing the throughput. The inspection device for inspecting the surface of the substrate is formed by the electrons generated by the electron source, and is imaged at the desired magnification in the direction of the sample W and is folded. When the overlap is passed, the electrons that become the noise are removed from the opening, the overlap is set to a desired magnification, and the overlap is adjusted so that the overlap forms a parallel electron line to the desired profile. The shape illuminates the substrate. The electron beam is made such that the illuminance unevenness of the electron beam at this time is less than 10%. The electrons emitted from the sample W are detected by the detector (25.11).

TW I329741 discloses an analytical device and microarray having an integrated fluid inlet and outlet, the device consisting of a planar solid phase hydrophilic matrix loop, wherein the planar solid phase hydrophilic matrix loop contains dry chemical reagents, which are integrated in one On the shaped electric pump electrode, the hydrophilic matrix loop is sealed in a gas permeable electrical insulator, which can be used for microbiological analysis, mixture separation and reaction.

TW I307407 discloses a visual inspection support device for industrial products. According to the present invention, various information from other inspection apparatuses can be utilized, and it is possible to easily find a defective position of an electronic circuit component or the like, and it is possible to perform a confirmation operation by the same operation, and it is possible to perform a visual inspection reliably. The present invention is a visual inspection support device having an industrial product in which at least a first camera and a second camera of an inspection target are imaged in different directions, and includes an inspection result of collecting another inspection device, and the like. The result of the inspection result collection and the inspection result data preparation means, and the other inspection apparatus used to track the above have been judged The defective position tracking means for the defective position is provided to the above-described defective position tracking means by the inspection result collected by the above-mentioned inspection result collection and inspection result data creation means, and based on the above-mentioned inspection result collection and inspection result data creation means The above-described inspection result data is created to drive the above-described photographing unit.

TW I299083 discloses a method and apparatus for inspecting a substrate. When printing solder, mounting components, and heating a substrate for a soldering process, an inspection device is used to inspect the substrate. The image of the substrate is taken before and after a manufacturing process (eg, component mounting process and soldering process) and the difference between the images is taken. Each component on the substrate can identify and determine the setting conditions of the window corresponding to the identified component by differential and binarization processing. The window is set according to the determined setting conditions to check the state of the substrate by using the image data in the setting windows and the standard inspection data corresponding to the component identification data.

TW 201129795 discloses an inspection method, an inspection device and an electronic wire device. The inspection method of the present invention is a method for inspecting a pattern formed on a substrate by performing a comparison between patterns in the periodic structure for a portion of a pattern in a crystal grain having a periodic structure, and the pattern is not The portion formed by the periodic structure is compared with the other crystal grains.

TW 201130010 discloses an electronic wire device, an electronic wire inspection device, and a method for determining exposure conditions. The electron beam apparatus includes: a device that irradiates an electron beam against a sample; and an apparatus that obtains an electronic magnification projection of surface information of the sample by irradiation of the electron beam with the electron beam and forms the image on the detector. And a device for synthesizing the aforementioned electrons formed on the detector into an image, wherein the electron beam and the electron are biased by an electric field and a magnetic field The device is separated, and the ratio of the aforementioned electrons to the aforementioned detector is 4 to 40%.

TW 201128182 discloses a foreign matter inspection device and an inspection method, which can detect a fine foreign matter existing on the back surface of a transparent flat substrate by a light scattering method with high sensitivity, and can reliably determine which side of the surface or the back surface the foreign matter exists. The solution of the present invention is a foreign matter inspection device that illuminates the detection light by the light projecting system on the transparent flat substrate, and receives the scattered light formed by the foreign matter existing on the transparent flat substrate by the light receiving system, and detects the presence of the foreign matter. The light-emitting system is configured to irradiate the detection light with a specific incident angle on a surface of the transparent flat substrate opposite to the substrate of the transparent flat substrate, and is disposed on the surface side, and the irradiation point of the detection light is The reference is provided at a position slightly symmetrical with the light projecting system, and receives a first light receiving system that scatters light when the detected light is irradiated onto the foreign matter; and is provided at an irradiation point of the detected light on the surface side The second light receiving system that receives the scattered light is received substantially on the head.

TW 201009971 discloses a stitch inspection device, a probe device, a stitch inspection method, and a memory medium. An object of the present invention is to provide a stitch inspection device capable of automatically and highly accurately detecting an exposure state of an underlayer of an electrode pad, such as an exposed substrate, and a device having the same The probe device, the stitch inspection method, and a memory medium in which the execution program of the inspection method is stored. The solution of the present invention is that, in the stitch inspection device, the stitch region extracting portion that extracts the stitch region from the image pickup data obtained by the camera on the electrode pad; and The stitch area is obtained, and the gray scale of the gray scale pattern corresponding to the position of the pixel on the center line extending in the longitudinal direction of the stitch area and the gray scale level of the pixel is obtained. a level data acquisition unit; and a deep excavation determination unit that determines whether or not the base layer is exposed based on the obtained gray scale pattern and the reference pattern when the base layer is exposed from the stitch.

TW 201009973 discloses a stitch inspection device, a probe device and a stitch inspection method, and a memory medium. An object of the present invention is to provide a stitch inspection device capable of automatically and highly accurately detecting an exposure state of an underlayer of an electrode pad, such as an exposed substrate, and a device having the same The probe device, the stitch inspection method, and a memory medium in which the execution program of the inspection method is stored. The RGB component acquisition unit obtains the B selected from the R component data, the G component data, and the B component data in accordance with the difference in reflectance between the material of the electrode pad and the material of the base layer. The component data and the B component histogram acquisition unit obtain the gray scale level set for obtaining the image of the base layer in distinction with the electrode pad for the B component data, and the gray scale level is provided. The number of pixels, the relationship between the two, is determined based on the histogram taken out, and the presence or absence of the exposure of the underlying layer at the stitching.

TW 200844647 discloses an inspection apparatus for a photomask, a method of inspecting a photomask, a method of manufacturing a photomask for manufacturing a liquid crystal device, and a pattern transfer method. In the inspection apparatus for a mask according to the present invention, the mask is held by the mask holding portion, and a light beam of a predetermined wavelength from the light source is irradiated to the mask through the illumination optical system, and the image of the mask is formed by the imaging element via the objective lens system. Do photography. The optical axes of the illumination optical system, the objective lens, and the imaging element are aligned, and the objective lens system and the imaging element are independently moved in the optical axis direction, and the image of the photomask is photographed.

TW 200641340 discloses a strain enthalpy wafer surface inspection method and inspection device. The method for inspecting the strained wafer surface of the present invention comprises a photographing step and a synthetic image generating step, wherein the photographing step is performed in an environment of irradiating the surface of the strained wafer with the light from the light source device, by relative to the strain The image pickup device provided on the surface of the wafer in a predetermined positional relationship captures the surface of the strained wafer at a plurality of rotation angle positions by photographing conditions of the bright line appearing on the surface of the strained wafer. Further, the synthetic image generating step is performed by a surface of the wafer obtained by the image pickup device at a plurality of rotation angle positions to generate a composite image at a predetermined rotation angle position.

In the above-mentioned prior patent technology, there is no system or method for performing automatic (such as E) laser printing correction, and it is still unable to reduce the time-consuming labor and high precision error rate caused by the manual operation of the operator. Unable to reduce the error rate.

Therefore, it is necessary to provide a novel and progressive alignment check system to improve the above problems.

Therefore, in order to solve the above problems, the main purpose of the present invention is to provide an upper and lower alignment check system, which can perform automatic laser print correction correction, reduce time-consuming labor and precision errors, and reduce error rate, and can work Electronic (E).

In order to achieve the above objectives, the main technical means used in the creation is achieved by the following technical solutions: an upper and lower alignment inspection system for detecting a positive product to be inspected with laser printing, the laser printing system being located at the inspection One side of the positive product, the upper and lower alignment inspection system comprises: a base; a see-through platform, located at The pedestal for placing the product to be inspected; a first aligning unit disposed on the lower side of the fluoroscopic platform for obtaining the image signal of the underside of the product to be inspected and transmitting to the processing unit; a second alignment unit is disposed on the upper side of the fluoroscopic platform for acquiring the image signal of the upper side of the product to be inspected and transmitted to the processing unit; and a processing unit for calculating the pair according to the lower image signal The position information of the lower side of the lower image and the position information of the upper side of the upper image are calculated according to the image signal of the upper side, and the information is calculated according to the information of the lower side position and the position information of the upper side. The laser print deviation of the positive product.

The new purpose of this creation and solving its technical problems can be further realized by the following technical measures.

According to the above-described upper and lower alignment inspection system, the first alignment unit includes a first CCD (charge coupled device) device for acquiring the lower image signal; the second alignment unit includes a second CCD device For obtaining the upper video signal.

According to the above-mentioned upper and lower alignment inspection system, the second alignment unit further includes a second moving mechanism disposed on the base, the second CCD device is disposed on the second moving mechanism and can be substantially parallel The fluoroscopic platform surface moves in the direction of the surface.

According to the above-mentioned upper and lower alignment inspection system, the first alignment unit further includes a first moving mechanism disposed on the base, the first CCD device is disposed on the first moving mechanism and substantially parallel to the It can move in the direction of the surface of the platform.

According to the above-mentioned upper and lower alignment check system, the processing unit further includes a control module for controlling the movement of the first and second alignment units.

The above-mentioned upper and lower alignment inspection system further includes a cover having a see-through window and a frame disposed around the see-through window, the frame being pivotally disposed on the base Or the fluoroscopic platform can be selectively capped to the fluoroscopic platform.

According to the above-mentioned upper and lower alignment inspection system, the processing unit is a computer.

According to the above-mentioned upper and lower alignment inspection system, the processing unit includes a storage module capable of storing the laser print offset difference.

According to the above-mentioned upper and lower alignment inspection system, further comprising a laser printing device, which receives the signal of the laser printing deviation from the processing unit and performs a laser printing correction of the product to be inspected accordingly school.

Compared with the prior art, the author can use the first aligning unit and the second aligning unit to perform automatic laser printing verification, thereby greatly reducing the time-consuming labor and high precision error rate caused by the manual operation of the operator. To reduce the error rate, and to electronically work (E).

In order to make the above-mentioned purposes, features and advantages of this creation easier to understand, the following is a detailed example of this creation, and with the accompanying drawings, the following is a detailed description, in which: Figures 1 and 2 are the top and bottom of the creation. A schematic diagram of a first implementation aspect of a registration inspection system; and FIG. 3 is a schematic diagram of image capture of a creative alignment unit that can be moved relative to a positive product to be inspected; Figure 4 is a schematic view of the back side of the product to be inspected; Figure 5 is a schematic view of the second embodiment of the creation of the upper and lower alignment check system; and Figure 6 is the third of the creation of the upper and lower alignment check system A schematic diagram of the implementation.

Please refer to FIG. 1 to FIG. 4 together. The first embodiment of the present invention is an upper and lower alignment inspection system (100) for detecting laser marking (420) to be inspected. a product (400), the laser printing (420) is located on one side of the positive product (400) to be inspected, and the positive product (400) to be inspected includes a plurality of product units (410), to be inspected The positive product (400) may be, for example, a lead frame in the semiconductor industry or a product of this type, and the product unit (410) is each lead frame unit, and each product unit (410) may have a laser print on the lower side ( 420).

The upper and lower alignment inspection system (100) includes a base (10), a see-through platform (20), a cover plate (30), a first alignment unit (40), and a second alignment unit (50). And a processing unit (60).

The interior of the base (10) serves as the basis for the placement of the upper and lower alignment inspection system (100) and is assembled for other components, and has an accommodation space.

The fluoroscopic platform (20) is disposed on the pedestal (10) and located above the accommodating space of the pedestal (10) for arranging the product to be inspected (400), the fluoroscopic platform (20) Preferably, it is a glass substrate, but it may also be a transparent acrylic substrate or a similar see-through substrate. The fluoroscopic platform (20) is preferably a detachable group of fluoroscopic substrates and an outer frame. The operator can manually check the product to be inspected (400) is placed on the fluoroscopic platform (20) for subsequent image capture operations. The product to be inspected (400) can be placed at a corner of the fluoroscopic platform (20) correspondingly at a corner thereof, so as to stabilize the positioning of the product to be inspected (400) and facilitate calculation of subsequent coordinate values. Or the product (400) to be inspected can be placed in the middle of the fluoroscopic platform (20) (as shown in FIG. 2), so that the first alignment unit (40) and the second can be facilitated. The alignment unit (50) captures an image.

The cover (30) has a see-through window (32) and a frame (34) disposed around the see-through window (32). The frame (34) is pivotally disposed on one side thereof. The pedestal (10) or the fluoroscopic platform (20) is selectively closable to the fluoroscopic platform (20), and the cover plate (30) is affixed to the fluoroscopic platform (20) for stabilization The product to be inspected (400) is compressed between the cover plate (30) and the fluoroscopic platform (20) without being arbitrarily moved, so as to accurately perform the correcting operation. In this embodiment, a piece (36) is provided on one side of the frame body (34) opposite to the pivoting side (may also be disposed on any other left or right side, or may not be provided) for operation. The cover plate (30) is pivoted, and the operator can manually cover the cover plate (30) to the see-through platform (20).

The first alignment unit (40) is disposed on the lower side of the fluoroscopic platform (20) for acquiring the image signal under the side of the product (400) to be inspected and transmitted to the processing unit (60). In this embodiment, the first alignment unit (40) includes a first CCD (charge coupled device) device (42) for acquiring the lower image signal. It should be noted that the first alignment unit (40) may further include a first moving mechanism (44) disposed on the base (10), and the first CCD device (42) is provided. The first moving mechanism (44) can be moved substantially in the XY direction along the surface of the fluoroscopic platform (20), so that the first CCD device (42) can be moved to a predetermined image capturing position as needed. That is, the first CCD device (42) can be moved to a relative position above each product unit (410) of the product under test (400) for image capture.

The second alignment unit (50) is disposed on the upper side of the fluoroscopic platform (20) for acquiring the image signal of the upper side of the product (400) to be detected and transmitted to the processing unit (60). In this embodiment, the second alignment unit (50) includes a second CCD device (52) for acquiring the upper video signal. Preferably, the second alignment unit (50) further includes a second moving mechanism (54) disposed on the base (10), and the second CCD device (52) is disposed on the second moving mechanism ( 54) and moving substantially parallel to the surface of the fluoroscopic platform (20) in the XY direction to move the second CCD device (52) to a predetermined image capturing position as needed, that is, the second The CCD device (52) moves to a relative position above each product unit (410) of the product under test (400) for image capture.

Since the structure and the operation mode of the second alignment unit (50) and the first alignment unit (40) are substantially the same, only the structure and operation of the first alignment unit (40) are shown in the drawing. The third picture of the method is described first.

The processing unit (60) (eg, a computer) is electrically connected to the first aligning unit (40) and the second aligning unit (50) (of course, can also be wirelessly connected), and the first The recording unit (60) and the second aligning unit (50) perform bidirectional transmission of signals and data. The processing unit (60) may include a control module for controlling the first and second aligning units. (40), (50) move. The processing unit (60) is configured to calculate, according to the lower side image signal, information corresponding to the lower side position of the lower image, and calculate the position information of the corresponding upper image according to the upper image signal, and according to the lower side The positional position information and the upper positional position information are used to calculate a laser print offset difference of the product to be inspected (400). The processing unit (60) may include a laser print detection model (for example, a software including a programmable laser print offset difference), and the processing unit (60) is configured to calculate the corresponding image according to the lower image signal. The position information of the product unit (410) area of the lower image, and the position data of each product unit (410) area corresponding to the upper image according to the upper image signal, and the laser print inspection based on the one-bit reference The positive model is compared with the location data corresponding to each product unit (410) region of the upper image to calculate the laser printing offset difference of the positive product (400) to be inspected. The processing unit (60) can store the laser printing offset difference value via one of the storage modules, and the stored laser printing offset difference value can be stored in a storage medium and then transferred to a laser. The printing device (70) (as shown in FIG. 6), the laser printing device (70) can perform the laser printing correction correction of the product (400) to be inspected according to the laser printing deviation value.

In the following practical embodiment, it is assumed that the laser printing (420) is disposed on the lower side of the product (400) to be inspected, that is, the obtained lower side image contains the laser printing (420). An image, and a position facing the lower left of the upper and lower alignment inspection system (100) is defined as a coordinate reference for calculating a laser printing offset value of the product to be inspected (400).

The image processing unit (60) can control the movement of the first alignment unit (40) and the second alignment unit (50) through the control module. The lower side and upper side image signals of each product unit (410) of the product to be inspected (400) are obtained and transmitted to the processing unit (60). More specifically, the control module of the processing unit (60) automatically controls the size of the product unit (410) of the product to be inspected (400) as the moving pitch (which can be changed according to different preset conditions). The first moving mechanism (44) and the second moving mechanism (54) the first CCD device (42) of the first aligning unit (40) and the second CCD device of the second aligning unit (50) ( 52) The image capture of each product unit (410) is performed by moving the width of each product unit (410) or the length of each length, and the above actions are repeatedly performed until the images of all product units (410) are captured. It should be noted that the first CCD device (42) of the first alignment unit (40) and the second CCD device (52) of the second alignment unit (50) can simultaneously move to the same product unit (410). Capture images, or move to different product units (410) at the same time to capture images.

In this embodiment, the processing unit (60) is calculated based on the center position of each of the captured product units (410) on the lower side of the laser printing (420). Converting the point coordinate of each position of each lower product unit (410) image to be a rectangular coordinate unit; and taking the center position of each upper product unit (410) image as a calculation reference, at the above setting coordinates Based on the reference, the processing unit (60) converts the point coordinates of each position of each of the lower product units (410) to be measured into a rectangular coordinate unit; the processing unit (60) then corresponds to each lower side The product unit (410) image and the right angle coordinates of each upper product unit (410) after image conversion are subtracted to obtain the laser printing offset difference of each product unit (410).

The processing unit (60) can store the laser printing offset difference value via one of the storage modules, and the stored laser printing offset difference value can be stored in a storage medium and then transferred to a laser. The printing device (70) (as shown in FIG. 6), it can be understood that the laser printing offset difference can also be transmitted to the laser printing device by the processing unit (60) by wire or wirelessly ( 70) The laser printing device (70) can perform laser printing correction correction of the product (400) to be inspected according to the laser printing deviation value.

Please refer to FIG. 5, which is a second embodiment of the present invention, which is an upper and lower alignment inspection system (400), and an upper and lower alignment inspection system which has been described in the first embodiment and the first embodiment ( 100) similar components are denoted by the same reference numerals in FIG. 5 or omitted.

In the second embodiment, the upper and lower alignment inspection system (200) further includes a driving unit that connects the pivot of one side of the frame (34) of the cover (30) and can drive the cover (30). Pivot. The drive unit (80) may include, but is not limited to, a motor-transmission mechanism assembly, a hydraulic cylinder or a pneumatic cylinder, and any device or mechanism that can drive the cover (30) for pivoting is applicable. The motor-gear assembly can be, but is not limited to, a motor-gear assembly, a motor-belt assembly, a motor-chain assembly.

Please refer to Fig. 6, which is a third embodiment of the present invention, which is an upper and lower alignment inspection system (300), and an upper and lower alignment inspection system which has been described in the first embodiment and the first embodiment ( 100) Similar components are denoted by the same reference numerals in FIG. 6 or omitted.

In a third embodiment, the upper and lower alignment inspection system (300) further includes a laser printing device (70) that receives the lightning from the processing unit (60) The signal of the offset difference is printed and the laser print correction correction of the product (400) to be inspected is performed.

In summary, this creation provides a top-to-bottom alignment check system, which is designed to improve the "preferred printing products for laser-printed products (ie, products to be tested) for new products. Operators often need to correct laser printing. To adjust the mask, it is necessary to use the pattern detection mask (Mask) to manually offset the deviation value by manual operation, and the manual comparison correction is not easy and inconvenient to adjust the alignment and "causing the operator to spend time and labor" problem. Furthermore, the creation can use the first alignment unit and the second alignment unit to perform automatic laser printing verification, thereby greatly reducing the time-consuming and high-precision error rate caused by the manual operation of the operator, so as to reduce errors. Rate, and the job can be electronicized (E).

This is the first of its kind in the same category, in line with the new patent requirements, and apply for it according to law. However, the above description is only the preferred embodiment of the present invention, and the equivalent structural changes that are applied to the present specification, the scope of the patent application or the drawings are included in the scope of the patent of the present invention.

100‧‧‧Up and down alignment inspection system

200‧‧‧Up and down alignment inspection system

300‧‧‧Up and down alignment inspection system

10‧‧‧ Pedestal

20‧‧‧Perspective platform

30‧‧‧ Cover

32‧‧‧Perspective window

34‧‧‧ frame

36‧‧‧ pieces

40‧‧‧First alignment unit

42‧‧‧First CCD device

44‧‧‧First mobile agency

50‧‧‧second alignment unit

52‧‧‧Second CCD device

54‧‧‧Second mobile agency

60‧‧‧Processing unit

70‧‧‧Laser printing device

80‧‧‧ drive unit

400‧‧‧Check positive products

410‧‧‧Product unit

420‧‧‧ laser printing

The first and second figures are schematic diagrams of the first embodiment of the upper and lower alignment check system of the creation; the third figure is a schematic diagram of the image capture of the creation of the alignment unit relative to the product to be inspected; A schematic diagram of the back side of the product to be inspected; FIG. 5 is a schematic view of the second embodiment of the creation of the upper and lower alignment check system; Fig. 6 is a schematic view showing a third embodiment of the upper and lower alignment check system of the creation.

100‧‧‧Up and down alignment inspection system

10‧‧‧ Pedestal

20‧‧‧Perspective platform

30‧‧‧ Cover

32‧‧‧Perspective window

34‧‧‧ frame

36‧‧‧ pieces

40‧‧‧First alignment unit

42‧‧‧First CCD device

44‧‧‧First mobile agency

50‧‧‧second alignment unit

52‧‧‧Second CCD device

54‧‧‧Second mobile agency

60‧‧‧Processing unit

400‧‧‧Check positive products

410‧‧‧Product unit

Claims (12)

An upper and lower alignment inspection system for detecting a positive product to be inspected by laser printing, the laser printing system being located on one side of the product to be inspected, the upper and lower alignment inspection system comprising: a base; a fluoroscopic platform is disposed on the pedestal for placing the product to be inspected; a first aligning unit is disposed on a lower side of the fluoroscopic platform for obtaining a video signal of the underside of the product to be inspected and transmitting a processing unit; a second alignment unit disposed on the upper side of the fluoroscopic platform for acquiring the image signal of the upper side of the product to be inspected and transmitting to the processing unit; and a processing unit for The side image signal calculates the information corresponding to the lower side position of the lower image, and calculates the position information corresponding to the upper side of the upper image according to the upper image signal, and according to the information of the lower side position and the position of the upper side The information calculates the laser print offset difference of the product to be inspected. The upper aligning inspection system according to the first aspect of the patent application, wherein the first aligning unit comprises a first CCD (charge coupled device) device for acquiring the lower image signal; the second aligning unit A second CCD device is included for obtaining the upper video signal. The upper aligning inspection system according to the second aspect of the patent application, wherein the second aligning unit further comprises a second moving mechanism disposed on the base, the second CCD The device is disposed on the second moving mechanism and is movable substantially in a direction parallel to the surface of the fluoroscopic platform. The upper aligning inspection system according to the second aspect of the patent application, wherein the first aligning unit further includes a first moving mechanism disposed on the pedestal, wherein the first CCD device is disposed in the first moving mechanism and It can move substantially parallel to the direction of the fluoroscopic platform surface. The upper sub-alignment inspection system according to the first aspect of the patent application, wherein the processing unit further comprises a control module for controlling movement of the first and second alignment units. The upper sub-alignment inspection system according to the first aspect of the patent application, further comprising a cover plate having a see-through window and a frame disposed around the see-through window, the frame being pivotable on one side thereof The pedestal can be selectively attached to the pedestal or the fluoroscopic platform. The upper and lower alignment inspection system according to item 6 of the patent application scope includes a handle member disposed on any other side of the frame body for operating to drive the frame body to pivot. The upper sub-alignment inspection system according to item 6 of the patent application scope further includes a driving unit that is connected to the frame body and can drive the frame body to pivot. The upper sub-alignment inspection system according to item 8 of the patent application scope, wherein the drive unit comprises a motor-transmission mechanism assembly, a motor-gear assembly, a motor-belt assembly, a motor-chain assembly, a hydraulic cylinder or a pneumatic cylinder. The upper and lower alignment inspection system according to the first aspect of the patent application scope, wherein the processing unit is a computer. The upper sub-alignment inspection system according to the first aspect of the patent application scope, wherein the processing unit comprises a storage module capable of storing the laser print offset difference. The upper sub-alignment inspection system according to claim 11 of the patent application scope, further comprising a laser printing device that receives the signal of the laser printing offset value from the processing unit and performs the product to be inspected accordingly Laser printing correction correction.