US20130332665A1 - Memory with bank-conflict-resolution (bcr) module including cache - Google Patents
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- US20130332665A1 US20130332665A1 US13/841,025 US201313841025A US2013332665A1 US 20130332665 A1 US20130332665 A1 US 20130332665A1 US 201313841025 A US201313841025 A US 201313841025A US 2013332665 A1 US2013332665 A1 US 2013332665A1
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
- G11C7/10—Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
- G11C7/1072—Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers for memories with random access ports synchronised on clock signal pulse trains, e.g. synchronous memories, self timed memories
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F12/00—Accessing, addressing or allocating within memory systems or architectures
- G06F12/02—Addressing or allocation; Relocation
- G06F12/08—Addressing or allocation; Relocation in hierarchically structured memory systems, e.g. virtual memory systems
- G06F12/0802—Addressing of a memory level in which the access to the desired data or data block requires associative addressing means, e.g. caches
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/41—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming static cells with positive feedback, i.e. cells not needing refreshing or charge regeneration, e.g. bistable multivibrator or Schmitt trigger
- G11C11/413—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing, timing or power reduction
- G11C11/417—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing, timing or power reduction for memory cells of the field-effect type
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
- G11C7/10—Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
- G11C7/1015—Read-write modes for single port memories, i.e. having either a random port or a serial port
- G11C7/1039—Read-write modes for single port memories, i.e. having either a random port or a serial port using pipelining techniques, i.e. using latches between functional memory parts, e.g. row/column decoders, I/O buffers, sense amplifiers
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C8/00—Arrangements for selecting an address in a digital store
- G11C8/12—Group selection circuits, e.g. for memory block selection, chip selection, array selection
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C8/00—Arrangements for selecting an address in a digital store
- G11C8/18—Address timing or clocking circuits; Address control signal generation or management, e.g. for row address strobe [RAS] or column address strobe [CAS] signals
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2212/00—Indexing scheme relating to accessing, addressing or allocation within memory systems or architectures
- G06F2212/30—Providing cache or TLB in specific location of a processing system
- G06F2212/304—In main memory subsystem
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2207/00—Indexing scheme relating to arrangements for writing information into, or reading information out from, a digital store
- G11C2207/22—Control and timing of internal memory operations
- G11C2207/2209—Concurrent read and write
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2207/00—Indexing scheme relating to arrangements for writing information into, or reading information out from, a digital store
- G11C2207/22—Control and timing of internal memory operations
- G11C2207/2245—Memory devices with an internal cache buffer
Definitions
- Embodiments of the present invention relate generally to the field of semiconductor memory technology.
- Embodiments of the present invention include a memory.
- the memory includes a block of memory cells and a cache.
- the block of memory cells is not a random access memory with multiple ports.
- the block of memory cells is partitioned into subunits that have only a single port.
- the cache is coupled to the block of memory cells adapted to handle a plurality of accesses to a same subunit of memory cells without a conflict such that the memory appears to be a random access memory to the plurality of accesses.
- Other embodiments of the present invention include a method of operating the memory, and a memory with bank-conflict-resolution (BCR) module including cache.
- BCR bank-conflict-resolution
- FIG. 1 is a block diagram of a memory device with a bank-conflict-resolution (BCR) module including cache, in accordance with embodiments of the present invention.
- BCR bank-conflict-resolution
- FIG. 2 is a schematic diagram comparing a data structure of a data word stored in a memory location of a memory bank of a memory partition with a data structure of cache data stored in a cache location of a cache of the BCR module, in accordance with embodiments of the present invention.
- FIG. 3 is a flow chart illustrating a method of operating the memory with BCR module, in accordance with embodiments of the present invention.
- FIG. 4 is a flow chart illustrating the method of operating the memory with BCR module of FIGS. 1 and 5 , in accordance with embodiments of the present invention.
- FIG. 5 is a detailed block diagram of the memory with the BCR module, in accordance with embodiments of the present invention.
- Embodiments of the present invention include a memory device, for example, a serial memory device 101 (see FIG. 1 ), without limitation thereto, that includes a block of memory cells in a memory partition and a cache.
- the block of memory cells is not a random-access memory (RAM) with multiple ports.
- the block of memory cells is partitioned into subunits, wherein the subunits have only a single port.
- the cache is coupled to the block of memory cells adapted to handle a plurality of accesses to a same subunit of memory cells without a conflict such that the memory appears to be a random access memory to the plurality of accesses.
- the plurality of accesses may include one or more of a read command and a write command.
- a number of addressable locations in the cache is at least approximately equal to a number of addressable locations in the single subunit of the memory.
- the memory may include a flat memory that is adapted to perform multiple accesses concurrently.
- the memory may be adapted such that a read command is able to be performed without latency relative to a write command.
- the memory may be adapted such that a host scheduler is able to write and to read to a same subunit without having a conflict of the read command and the write command.
- the memory may be also adapted such that a read operation and a write operation are able to be performed to a same address in the subunit without a conflict.
- the memory may have a single read port and a single write port.
- the memory may be a serial memory, embodiments of which are subsequently described herein, without limitation thereto.
- Embodiments of the present invention address the issue of providing a serial memory that provides similar performance to that of a quadruple data-rate (QDR) static random-access memory (SRAM) in the event of simultaneous read and write operations.
- QDR quadruple data-rate
- SRAM static random-access memory
- a block diagram 100 is shown of a serial memory 101 with a bank-conflict-resolution (BCR) module 110 .
- the serial memory device 101 includes a BCR module 110 and a memory partition 150 .
- the BCR module 110 includes a cache 114 and a bank-conflict resolver 112 that includes BCR logic.
- the serial memory device 101 with BCR module 110 provides for (1) reading from cache 114 , if a data word that is sought by a read command is in the cache 114 ; and, (2) writing a data word to the cache 114 , if the actual bank in the memory partition 150 addressed by a write command is occupied. The data word is posted in the cache 114 , and later the write is completed when the bank is not being read by a read command.
- the BCR module 110 may be centrally located on a die on which the serial memory 101 is fabricated.
- the BCR module 110 operates in a manner similar to a direct mapped cache, except that the cache 114 is only filled by write commands, and read commands are satisfied from the cache 114 , or an actual memory bank in the memory partition 150 .
- the memory device 101 with BCR module 110 utilizes a direct mapped write cache with a tag for the bank number.
- write command 161 arrives and the target memory bank is busy with a read
- the cache data contained at the cache location is valid
- the cache location in the cache is flushed and the cache data is moved to a different memory bank than addressed by the write command
- the data word of the write command is put in the cache.
- a restricted write command, WR, and a restricted read command, RD are subject to memory bank restrictions so that restricted write command, WR, and a restricted read command, RD, do not overlap addresses controlled by the BCR module 110 . Therefore, the restricted write command, WR, and a restricted read command, RD, utilize ‘uncached’ operation codes (OP-codes).
- block diagram 100 shows component parts of the serial memory device 101 with BCR module 110 .
- the memory partition 150 includes a plurality of memory banks.
- memory partition 150 includes a first memory bank 150 a and an arbitrarily selected memory bank 150 n to which a read command and/or a write command is addressed.
- memory partition 150 can include any number of memory banks (which are referenced herein as memory banks 150 a - n or memory banks 150 a , 150 n ).
- a memory bank includes an r by c array of memory cells, where c is the width of the array, and r is the length of the array.
- the memory bank 150 n of the memory partition 150 of memory banks 150 a , 150 n may include a 1T-SRAM.
- the width of a memory bank may be 72 cells to accommodate a data word that is 72 bits long; and the length of a memory bank may be 2 15 , or 32K. All the memory banks in the memory partition 150 have the same length and width; and, by way of example, the number of memory banks in a memory partition 150 is 64.
- Each memory bank includes a memory location.
- a memory location for storing a data word, for example, memory location 150 n , j, in a memory partition 150 is indicated by a bank number, given by index, n, and a storage location in the bank, given by the index, j.
- the BCR module 110 includes a cache 114 , as described above. Similar to the memory bank, a cache 114 includes a r ⁇ d array of memory cells, where d is the width of the array, and r is the length of the array. The length, r, of the cache is equal to the length, r, of any memory bank in the memory partition 150 . However, the width, d, of the cache 114 is greater than the width, c, of a memory bank in the memory partition 150 . By way of example, the width of the memory cache may be 88 cells long to accommodate addition information of cache data 214 i (see FIG. 2 ) that is 88 bits long, which is stored in a cache location 114 i . A cache location for cache data, for example, cache location 114 i , in the cache 114 is indicated by a cache storage location in the cache, given by an index, i.
- the BCR module 110 is configured to store cache data 214 i (see FIG. 2 ) that includes a data word in a cache location 114 i of the cache 114 in response to a write command, if the data word is addressed to a memory location 150 n , j of a memory bank 150 n in the memory partition 150 that is simultaneously being read in response to a read command.
- a schematic diagram 200 is shown of the structure of memory data stored in a memory location of a memory bank of a memory partition 150 .
- memory data 250 n , j is stored in memory bank 150 n of memory partition 150
- the structure of cache data 214 i stored in a cache location 114 i of cache 114 .
- FIG. 2 shows the data structure of memory data 250 n , j, and the data structure of cache data 214 i .
- the memory data 250 n , j includes a data word.
- the cache data 214 i includes a data word portion 214 i ⁇ 1, tag data 214 i ⁇ 2 including an index, I, that identifies a memory bank, for example, memory bank 150 n of the memory location 150 n , j, validity data 214 i ⁇ 3, and error-correction-code data 214 i ⁇ 4.
- the memory bank 150 n has a memory-bank data-word width
- the BCR module 110 has a BCR-cache data-word width equal to the memory-bank data-word width.
- validity data 214 i ⁇ 3 may include two bits that describe whether valid data has been stored in the first 36 bits of the data word portion 214 i ⁇ 1, the second 36 bits of the data word portion 214 i ⁇ 1, both the first and second 36 bits of the data word portion 214 i ⁇ 1, or in neither the first and second 36 bits of the data word portion 214 i ⁇ 1. Thus, only those portions of the cache data 214 i that had been written with valid data will be indicated by the value of the validity bits.
- the BCR module 110 further includes a bank-conflict resolver 112 (or BC resolver).
- the bank-conflict resolver 112 includes various blocks of circuitry, of which block 112 - 1 is an example, selected from the group consisting of: a register for the data word portion of the write command, a register for the index of the memory location in the memory bank addressed by the write command, a register for the index of the memory location in a memory bank addressed by the read command, a register for the index of the cache location in the cache, a register for the memory bank in the memory partition 150 addressed by the write command, a register for the memory bank in the memory partition 150 addressed by the read command, a register for the tag data of cache data stored in the cache location of the cache, comparators for comparing various values stored in the registers, BCR logic for executing instructions based on comparing various values stored in the registers, and error correction circuitry, without limitation thereto.
- the BCR module 110 may also include at least one a tag data register and tag data comparator.
- the bank-conflict resolver 112 is configured to store cache data 214 i in the cache 114 .
- the BCR module 110 further includes a read-output multiplexer 116 (which may be referred to by the term of art, “MUX”) configured to (1) send a data word portion 214 i ⁇ 1 from the cache 114 for output 162 from the serial memory 101 if a tag data 214 i ⁇ 2 is identical to a memory location 150 n , j that is being addressed by the read command, and (2) send a data word 250 n , j from the memory bank 150 n of the memory partition 150 as output from the serial memory 101 if the tag data 214 i ⁇ 2 is different from the memory location 150 n , j that is being addressed by the read command.
- MUX read-output multiplexer
- the bank cycle time (t RC ) of the BCR module 110 may be one half t RC of a memory bank 150 n of the memory partition 150 .
- the bank-conflict resolver 112 is configured to test validity data 214 i - 3 of the cache data 214 i for validity of the cache data 214 i , and if the validity data 214 i ⁇ 3 indicates that the cache data 214 i is invalid, to write the data word to the memory location 150 n , j of the memory bank 150 n in the memory partition 150 .
- the bank-conflict resolver 112 is configured to test validity data 214 i ⁇ 3 of the cache data 214 i for validity of the cache data 214 i , and if the validity data 214 i ⁇ 3 indicates that the cache data 214 i is valid, to test tag data 214 i ⁇ 2 of the cache data 214 i for equality with a memory address of the memory location 150 n , j.
- the bank-conflict resolver 112 is configured to merge-modify the data word with a data word portion 214 i ⁇ 1 of the cache data 214 i stored in the cache.
- the bank-conflict resolver 112 is configured to write the data word into the memory location 150 n , j of the memory bank 150 n in the memory partition 150 .
- the bank-conflict resolver 112 may further include an error-correction-code (ECC) module configured to correct errors in the data word.
- ECC error-correction-code
- a flow chart 300 is shown of a method of operating the memory device 101 with BCR module 110 .
- the method includes the following operations.
- a Write Command (e.g., write command 161 ) at time 0, Wo, is received for a memory bank, Bw, and a memory location having an index, Iw, in the memory bank, Bw, that is addressed by the Write Command.
- the Write command can be designated as: (Wo, Bw, Iw).
- the Write Command also includes an associated data word that is designated by: [DATA-Wo].
- the flow chart 300 is divided into two portions: in one portion primarily on the left-hand side of FIG. 3 and outside of the dashed lines, operations related primarily to a Read Command are shown; and, in another portion on the right-hand side of FIG. 3 , operations related to the Write Command, (Wo, Bw, Iw), are shown, which are included inside the dashed lines.
- one or more of following operations may occur during use of memory device 101 , according to flow chart 300 : at 306 , a delay occurs; at 307 , receive a read command at time, 1, to any memory bank at any index; at 308 , cache is read at same index as incoming write command to extract bank value stored therein; at 309 a , memory is read at a memory bank at a memory index to retrieve the data; at 309 b , read from cache at the index to extract the bank value stored therein; at 310 , update cache; at 311 , checking for conflicts between read and write operations; at 312 , write data from write command along with same bank value over existing cache data at an index; at 313 , write incoming data to a memory bank without conflict to read from the memory bank; at 316 , write incoming data to the cache index; at 318 , relocate prior cache entry; at 320 , write the data read prior from cache to memory at a memory bank with no conflict
- FIG. 4 a flow chart 400 is shown that illustrates the method of operating the memory device 101 with BCR module 101 , in accordance with embodiments of the present invention. Embodiments of memory device are depicted in FIGS. 1 and 5 .
- a write command is received.
- a write command (e.g. notation, WR ko, io) is received to write a data word to a memory location 150 n , j at bank address, n (e.g. notation, ko), and index j, (e.g. notation, io) in the memory partition 150 .
- read data word portion and tag data are read.
- the bank address, n, of the memory location 150 n , j, of the write command is equal to the tag data 214 i ⁇ 2 at cache location 114 i .
- write the data word portion For example, the data word portion 214 i ⁇ 1 of the cache data 214 i is written to a merge-modify write operation with the data word (e.g. notation, [DATA-Wo]) of the write command (e.g. notation of entire step, $[io] ⁇ WR ko, io).
- a read command is received.
- a read command (e.g. notation, RD j, i 1 ) is received to read a data word from a memory location at a bank address (e.g. notation, j) and index (e.g. notation, i 1 ) in the memory partition 150 (e.g. notation of entire step, RD j, i 1 )
- the memory data is written.
- the memory data 250 n , j in memory bank 150 n of the write command, in memory partition 150 is written to in a write operation with the data word of the write command (e.g. notation of entire step, WRITE ko, io)
- the bank address, given by j of the read command is equal to the bank address, n, of the memory location 150 n , j, of the write command, then, at 454 , if the cache data is valid, then the memory data is written. For example, if the cache data 214 i is valid, then the memory data in the memory bank given by the tag data 214 i ⁇ 2, m, in memory partition 150 is written to in a write operation with the data word portion 214 - i , (e.g. notation, [DATA-C]), of the cache data (e.g. notation of entire step, WRITE m, io with ⁇ do ⁇ .
- the data word portion 214 - i e.g. notation, [DATA-C]
- the cache data is written. For example, if the cache data 214 i is valid, then the cache data portion 214 i ⁇ 1 in cache location 114 i in cache 114 is written to in a write operation with the data word (e.g. notation, [DATA-Wo]), of the write command (e.g. notation of entire step, $[io] ⁇ WR ko, io).
- the combination of operations 454 and 456 may be referred to, herein, by the term of art, “swap,” or alternatively, “eviction.”
- the data word is read.
- the data word e.g. notation, [DATA-M]
- index e.g. notation of entire step, READ j, i 1
- the data word and tag data are read.
- the value read at 460 is stored in a register as a data word, ro. (e.g. notation of entire step, STORE as: ro).
- the tag data, n, at the cache location read in operation 462 is equal to the bank address, j, of the memory location given by j of the read command, RD j, i 1 , then the data word, r 1 , is output in response to the read command, RD j, i 1 (e.g. notation of entire step, OUT ⁇ r 1 ).
- the data word is output. For example, if the tag data, n, at the cash location read in operation 462 is not equal to the bank address, j, of the memory location given by j of the read command, READ j, i 1 , then the data word, ro, is output in response to the read command, RD j, i 1 (e.g. notation of entire step, OUT ⁇ ro)
- a detailed block diagram 500 is shown of the serial memory device 101 with the BCR module.
- the serial memory device 101 with BCR module 110 includes a memory partition 150 .
- the BCR module 110 includes a bank-conflict resolver 112 that includes BCR logic, a cache 114 , and a read-output multiplexer 116 .
- the bank-conflict resolver 112 includes various blocks of circuitry. For example, blocks 112 - 1 a - h which will be described in further detail below.
- the operation of the serial memory device 101 with BCR module 110 shown in FIG. 5 may be explained with the aid of the flow chart 400 of FIG. 4 .
- the cache 114 and a first write delay 112 - 1 e receive the new write command (e.g., WR k 1 , i 1 ), at 410 .
- the subscripts of indices may differ from those previous used in the description of FIG. 4 .
- the write command is designated by a prior write command (e.g., WR ko, io).
- the write command is propagated to the following: the memory partition write input multiplexer 112 - 1 b , a first memory bank index comparator 112 - 1 d , a second memory bank index comparator 112 - 1 f , and a conditional gate 112 - 1 c.
- the cache After the cache receives the write command, at 420 , the cache reads cache data from the cache location (indexed by io), and outputs the data word portion, ⁇ do ⁇ , along with the bank memory location index, m, and the memory location index, io, to a second write delay 112 - 1 a . After the delay, this appears on the output of the second write delay 112 - 1 a as a write command from cache, (e.g., WR m, io).
- the write command from cache appears on the input of the write input multiplexer 112 - 1 b and the input of the first memory bank index comparator 112 - 1 d .
- the cache 114 and the second memory bank index comparator 112 - 1 f receive the read command, RD j 1 , i 1 , at 440 .
- the cache may be merged with the delayed write command, WR ko, io, sent through the conditional gate 112 - 1 c , at 456 .
- the logic function generator 112 - 1 g receives a logical “1” from the second memory bank index comparator 112 - 1 f and a logical “0” from the first memory bank index comparator 112 - 1 d , respectively.
- the logic function generator 112 - 1 g sends a signal to the write input multiplexer 112 - 1 b to pass the write command from cache, WR m, io, appearing on input 1 of the write input multiplexer 112 - 1 b to be written to the memory partition 150 , at 454 , if the cache data is valid in the write command from cache, WR m, io.
- the combination of operations 452 and 454 constitute the “swap” previously described.
- the logic function generator 112 - 1 g receives a logical “0” from the second memory bank index comparator 112 - 1 f and a logical “0” from the first memory bank index comparator 112 - 1 d , respectively.
- the logic function generator 112 - 1 g sends a signal to the write input multiplexer 112 - 1 b to pass the delayed write command, WR ko, io, appearing on input 2 of the write input multiplexer 112 - 1 b to be written to the memory partition 150 , at 452 .
- the read command, RD j 1 , i 1 appears on the inputs to the cache 114 and the memory partition 150 , at 440 .
- the memory partition is read at bank location index, j 1 , and memory location index, i 1 , at 460 .
- the cache After the cache receives the read command, RD j 1 , i 1 , at 462 , the cache reads cache data from the cache location indexed by i 1 , and outputs the data word portion, ⁇ r 1 ⁇ , along with the tag data, n, as cache read data, RD n, output to input 1 of the read-output multiplexer 116 , and an input of a third memory bank index comparator 112 - 1 h.
- the memory partition outputs the data word, ro, stored at bank location index, j 1 , and memory location index, i 1 , along with the bank memory location index, j 1 , to input 2 of the read-output multiplexer 116 , and the other input of the third memory bank index comparator 112 - 1 h .
- the read-output multiplexer 116 receives a signal to pass through the data word portion, r 1 , of the cache read data, RD n.
- the read-output multiplexer 116 receives a signal to pass through the data word, ro, of the read data output from the memory partition 150 .
- error correction operation may be applied to data received by, or sent by, the serial memory device 101 .
- an error correction code is generated on a data word of a write command and/or an error correction is performed on cache data of a data word portion of the cache data.
- a bandwidth engine may include at least one memory partition 150 with BCR module 110 .
- each serial memory includes a memory partition and a dedicated BCR module.
- the BE includes a plurality of memory a plurality of partitions.
- the number of memory partitions may be four.
- one memory partition 150 may include memory banks 152 a , 152 n.
- the memory 150 further includes array manager circuitry coupled to the plurality of memories with BCR module, and serializer/deserializer (SerDes) interfaces coupled to the array manager circuitry.
- array manager circuitry coupled to the plurality of memories with BCR module
- SerDes serializer/deserializer
- methods and associated method steps described herein are carried out by processors and electrical components under the control of computer readable and computer executable instructions.
- the computer readable and computer executable instructions reside, for example, in a data storage medium such as computer usable volatile and non-volatile memory. However, the computer readable and computer executable instructions may reside in any type of computer readable storage medium.
- method steps are performed at least by serial memory device 101 .
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Abstract
Description
- This application claims priority to and benefit of co-pending U.S. Patent Application No. 61/656,423, filed on Jun. 6, 2012, entitled, “MEMORY WITH BANK-CONFLICT-RESOLUTION (BCR) MODULE INCLUDING CACHE,” by Patel et al., having Attorney Docket No. MP-1233.PRO, and assigned to the assignee of the present application.
- Embodiments of the present invention relate generally to the field of semiconductor memory technology.
- The growth of the Internet has placed ever increasing demands on routers, servers, and switches for increased bandwidth to keep pace with increasing network loads, for just one example, increased loads associated with video streaming. As a result, semiconductor RAM technology has been advancing to supply information storage capacities for the increased bandwidth associated with such increased loads. However, conventional semiconductor RAM technology, for example, quadruple data-rate (QDR) static random-access memory (SRAM), is both expensive, and consumes large amounts of power, due to the six-transistor SRAM memory-cell design employed by QDR SRAM memories.
- Embodiments of the present invention include a memory. The memory includes a block of memory cells and a cache. The block of memory cells is not a random access memory with multiple ports. The block of memory cells is partitioned into subunits that have only a single port. The cache is coupled to the block of memory cells adapted to handle a plurality of accesses to a same subunit of memory cells without a conflict such that the memory appears to be a random access memory to the plurality of accesses. Other embodiments of the present invention include a method of operating the memory, and a memory with bank-conflict-resolution (BCR) module including cache.
- The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments of the invention and, together with the description, serve to explain the embodiments of the invention:
-
FIG. 1 is a block diagram of a memory device with a bank-conflict-resolution (BCR) module including cache, in accordance with embodiments of the present invention. -
FIG. 2 is a schematic diagram comparing a data structure of a data word stored in a memory location of a memory bank of a memory partition with a data structure of cache data stored in a cache location of a cache of the BCR module, in accordance with embodiments of the present invention. -
FIG. 3 is a flow chart illustrating a method of operating the memory with BCR module, in accordance with embodiments of the present invention. -
FIG. 4 is a flow chart illustrating the method of operating the memory with BCR module ofFIGS. 1 and 5 , in accordance with embodiments of the present invention. -
FIG. 5 is a detailed block diagram of the memory with the BCR module, in accordance with embodiments of the present invention. - The drawings referred to in this description should not be understood as being drawn to scale except if specifically noted.
- Reference will now be made in detail to the alternative embodiments of the present invention. While the invention will be described in conjunction with the alternative embodiments, it will be understood that they are not intended to limit the invention to these embodiments. On the contrary, the invention is intended to cover alternatives, modifications and equivalents, which may be included within the spirit and scope of the invention as defined by the appended claims.
- Furthermore, in the following description of embodiments of the present invention, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, it should be appreciated that embodiments of the present invention may be practiced without these specific details. In other instances, well known methods, procedures, and components have not been described in detail as not to unnecessarily obscure embodiments of the present invention. In the FIGS. and throughout the written description, herein, like reference numerals are used for similar elements of embodiments of the present invention.
- Embodiments of the present invention include a memory device, for example, a serial memory device 101 (see
FIG. 1 ), without limitation thereto, that includes a block of memory cells in a memory partition and a cache. The block of memory cells is not a random-access memory (RAM) with multiple ports. The block of memory cells is partitioned into subunits, wherein the subunits have only a single port. The cache is coupled to the block of memory cells adapted to handle a plurality of accesses to a same subunit of memory cells without a conflict such that the memory appears to be a random access memory to the plurality of accesses. - In accordance with embodiments of the present invention, the plurality of accesses may include one or more of a read command and a write command. A number of addressable locations in the cache is at least approximately equal to a number of addressable locations in the single subunit of the memory.
- In one embodiment, the memory may include a flat memory that is adapted to perform multiple accesses concurrently. The memory may be adapted such that a read command is able to be performed without latency relative to a write command. The memory may be adapted such that a host scheduler is able to write and to read to a same subunit without having a conflict of the read command and the write command. The memory may be also adapted such that a read operation and a write operation are able to be performed to a same address in the subunit without a conflict. The memory may have a single read port and a single write port. By way of example, in accordance with embodiments of the present invention, the memory may be a serial memory, embodiments of which are subsequently described herein, without limitation thereto.
- Embodiments of the present invention address the issue of providing a serial memory that provides similar performance to that of a quadruple data-rate (QDR) static random-access memory (SRAM) in the event of simultaneous read and write operations.
- With reference now to
FIG. 1 , in accordance with embodiments of the present invention, a block diagram 100 is shown of aserial memory 101 with a bank-conflict-resolution (BCR)module 110. As shown inFIG. 1 , theserial memory device 101 includes aBCR module 110 and amemory partition 150. - The BCR
module 110 includes acache 114 and a bank-conflict resolver 112 that includes BCR logic. In one embodiment, theserial memory device 101 withBCR module 110 provides for (1) reading fromcache 114, if a data word that is sought by a read command is in thecache 114; and, (2) writing a data word to thecache 114, if the actual bank in thememory partition 150 addressed by a write command is occupied. The data word is posted in thecache 114, and later the write is completed when the bank is not being read by a read command. TheBCR module 110 may be centrally located on a die on which theserial memory 101 is fabricated. - In one embodiment, the
BCR module 110 operates in a manner similar to a direct mapped cache, except that thecache 114 is only filled by write commands, and read commands are satisfied from thecache 114, or an actual memory bank in thememory partition 150. - With further reference to
FIG. 1 , in accordance with embodiments of the present invention, thememory device 101 withBCR module 110 utilizes a direct mapped write cache with a tag for the bank number. - More specifically, when write
command 161 arrives and the target memory bank is busy with a read, if the cache data contained at the cache location is valid, (1) the cache location in the cache is flushed and the cache data is moved to a different memory bank than addressed by the write command, and (2) the data word of the write command is put in the cache. - However, when read
command 160 arrives, (1) the bank-conflict resolver 112 looks in thecache 114 to determine if the cache data stored there is valid data; and (2) theread command 160 reads the memory location in the memory bank of thememory partition 150. Thus, an unrestricted write command, UWR, and an unrestricted read command, URD, utilize theBCR module 110. - On the other hand, a restricted write command, WR, and a restricted read command, RD, are subject to memory bank restrictions so that restricted write command, WR, and a restricted read command, RD, do not overlap addresses controlled by the
BCR module 110. Therefore, the restricted write command, WR, and a restricted read command, RD, utilize ‘uncached’ operation codes (OP-codes). - In various embodiments, block diagram 100 shows component parts of the
serial memory device 101 withBCR module 110. Thememory partition 150 includes a plurality of memory banks. For example,memory partition 150 includes afirst memory bank 150 a and an arbitrarily selectedmemory bank 150 n to which a read command and/or a write command is addressed. It should be appreciated thatmemory partition 150 can include any number of memory banks (which are referenced herein asmemory banks 150 a-n ormemory banks - A memory bank includes an r by c array of memory cells, where c is the width of the array, and r is the length of the array. In one embodiment, the
memory bank 150 n of thememory partition 150 ofmemory banks memory partition 150 have the same length and width; and, by way of example, the number of memory banks in amemory partition 150 is 64. - Each memory bank includes a memory location. A memory location for storing a data word, for example,
memory location 150 n, j, in amemory partition 150 is indicated by a bank number, given by index, n, and a storage location in the bank, given by the index, j. - The
BCR module 110 includes acache 114, as described above. Similar to the memory bank, acache 114 includes a r×d array of memory cells, where d is the width of the array, and r is the length of the array. The length, r, of the cache is equal to the length, r, of any memory bank in thememory partition 150. However, the width, d, of thecache 114 is greater than the width, c, of a memory bank in thememory partition 150. By way of example, the width of the memory cache may be 88 cells long to accommodate addition information ofcache data 214 i (seeFIG. 2 ) that is 88 bits long, which is stored in acache location 114 i. A cache location for cache data, for example,cache location 114 i, in thecache 114 is indicated by a cache storage location in the cache, given by an index, i. - The
BCR module 110 is configured to storecache data 214 i (seeFIG. 2 ) that includes a data word in acache location 114 i of thecache 114 in response to a write command, if the data word is addressed to amemory location 150 n, j of amemory bank 150 n in thememory partition 150 that is simultaneously being read in response to a read command. - With reference now to
FIG. 2 , in accordance with embodiments of the present invention, a schematic diagram 200 is shown of the structure of memory data stored in a memory location of a memory bank of amemory partition 150. For example,memory data 250 n, j is stored inmemory bank 150 n ofmemory partition 150, and the structure ofcache data 214 i stored in acache location 114 i ofcache 114. -
FIG. 2 shows the data structure ofmemory data 250 n, j, and the data structure ofcache data 214 i. Thememory data 250 n, j includes a data word. - The
cache data 214 i includes adata word portion 214 i−1,tag data 214 i−2 including an index, I, that identifies a memory bank, for example,memory bank 150 n of thememory location 150 n, j,validity data 214 i−3, and error-correction-code data 214 i−4. Thememory bank 150 n has a memory-bank data-word width, and theBCR module 110 has a BCR-cache data-word width equal to the memory-bank data-word width. - In various embodiments,
validity data 214 i−3 may include two bits that describe whether valid data has been stored in the first 36 bits of thedata word portion 214 i−1, the second 36 bits of thedata word portion 214 i−1, both the first and second 36 bits of thedata word portion 214 i−1, or in neither the first and second 36 bits of thedata word portion 214 i−1. Thus, only those portions of thecache data 214 i that had been written with valid data will be indicated by the value of the validity bits. - For example, a value of the validity bits of 01 may indicate that only the first 36 bits of the
data word portion 214 i−1 have valid data; a value of the validity bits of 10 may indicate that only the second 36 bits of thedata word portion 214 i−1 have valid data; a value of the validity bits of 11 may indicate that both the first and second 36 bits of thedata word portion 214 i−1 have valid data; and, a value of the validity bits of 00 may indicate that neither the first, nor second 36 bits, of thedata word portion 214 i−1 have valid data. - Referring again to
FIG. 1 , in accordance with embodiments of the present invention, theBCR module 110 further includes a bank-conflict resolver 112 (or BC resolver). In addition, the bank-conflict resolver 112 includes various blocks of circuitry, of which block 112-1 is an example, selected from the group consisting of: a register for the data word portion of the write command, a register for the index of the memory location in the memory bank addressed by the write command, a register for the index of the memory location in a memory bank addressed by the read command, a register for the index of the cache location in the cache, a register for the memory bank in thememory partition 150 addressed by the write command, a register for the memory bank in thememory partition 150 addressed by the read command, a register for the tag data of cache data stored in the cache location of the cache, comparators for comparing various values stored in the registers, BCR logic for executing instructions based on comparing various values stored in the registers, and error correction circuitry, without limitation thereto. - The
BCR module 110 may also include at least one a tag data register and tag data comparator. The bank-conflict resolver 112 is configured to storecache data 214 i in thecache 114. - The
BCR module 110 further includes a read-output multiplexer 116 (which may be referred to by the term of art, “MUX”) configured to (1) send adata word portion 214 i−1 from thecache 114 foroutput 162 from theserial memory 101 if atag data 214 i−2 is identical to amemory location 150 n, j that is being addressed by the read command, and (2) send adata word 250 n, j from thememory bank 150 n of thememory partition 150 as output from theserial memory 101 if thetag data 214 i−2 is different from thememory location 150 n, j that is being addressed by the read command. - The bank cycle time (tRC) of the
BCR module 110 may be one half tRC of amemory bank 150 n of thememory partition 150. - The bank-
conflict resolver 112 is configured to testvalidity data 214 i-3 of thecache data 214 i for validity of thecache data 214 i, and if thevalidity data 214 i−3 indicates that thecache data 214 i is invalid, to write the data word to thememory location 150 n, j of thememory bank 150 n in thememory partition 150. - In addition, the bank-
conflict resolver 112 is configured to testvalidity data 214 i−3 of thecache data 214 i for validity of thecache data 214 i, and if thevalidity data 214 i−3 indicates that thecache data 214 i is valid, to testtag data 214 i−2 of thecache data 214 i for equality with a memory address of thememory location 150 n, j. - Also, if the
tag data 214 i−2 of thecache data 214 i indicates that thetag data 214 i−2 of thecache data 214 i equals a memory address of thememory location 150 n, j, the bank-conflict resolver 112 is configured to merge-modify the data word with adata word portion 214 i−1 of thecache data 214 i stored in the cache. - On the other hand, if the
tag data 214 i−2 of thecache data 214 i indicates that thetag data 214 i−2 of thecache data 214 i does not equal a memory address of thememory location 150 n, j, the bank-conflict resolver 112 is configured to write the data word into thememory location 150 n, j of thememory bank 150 n in thememory partition 150. The bank-conflict resolver 112 may further include an error-correction-code (ECC) module configured to correct errors in the data word. - With reference now to
FIG. 3 , in accordance with embodiments of the present invention, aflow chart 300 is shown of a method of operating thememory device 101 withBCR module 110. The method includes the following operations. At 304, a Write Command (e.g., write command 161) attime 0, Wo, is received for a memory bank, Bw, and a memory location having an index, Iw, in the memory bank, Bw, that is addressed by the Write Command. - The Write Command can be designated as: (Wo, Bw, Iw). The Write Command also includes an associated data word that is designated by: [DATA-Wo].
- As shown in
FIG. 3 , below operation 304, theflow chart 300 is divided into two portions: in one portion primarily on the left-hand side ofFIG. 3 and outside of the dashed lines, operations related primarily to a Read Command are shown; and, in another portion on the right-hand side ofFIG. 3 , operations related to the Write Command, (Wo, Bw, Iw), are shown, which are included inside the dashed lines. - In various embodiments, as depicted in
FIG. 3 , one or more of following operations may occur during use of memory device 101, according to flow chart 300: at 306, a delay occurs; at 307, receive a read command at time, 1, to any memory bank at any index; at 308, cache is read at same index as incoming write command to extract bank value stored therein; at 309 a, memory is read at a memory bank at a memory index to retrieve the data; at 309 b, read from cache at the index to extract the bank value stored therein; at 310, update cache; at 311, checking for conflicts between read and write operations; at 312, write data from write command along with same bank value over existing cache data at an index; at 313, write incoming data to a memory bank without conflict to read from the memory bank; at 316, write incoming data to the cache index; at 318, relocate prior cache entry; at 320, write the data read prior from cache to memory at a memory bank with no conflict to read bank; at 322, if the data is invalid, do not write to memory; at 350, check most recent data for output; at 351, read data as most recent data to be output (e.g., output 162) for a read command (e.g., read command 160); and at 352, read data as most recent data to be output (e.g., output 162) for a read command (e.g., read command 160). - Referring now to
FIG. 4 , aflow chart 400 is shown that illustrates the method of operating thememory device 101 withBCR module 101, in accordance with embodiments of the present invention. Embodiments of memory device are depicted inFIGS. 1 and 5 . - At 410, a write command is received. For example, a write command (e.g. notation, WR ko, io) is received to write a data word to a
memory location 150 n, j at bank address, n (e.g. notation, ko), and index j, (e.g. notation, io) in thememory partition 150. - At 420, read data word portion and tag data are read. For example, the
data word portion 214 i−1 (e.g. notation, do) and thetag data 214 i−2 atcache location 114 i (e.g. notation, io) are read from the cache 114 (e.g. notation of entire step, {do, m}=$[io]). - At 430, it is determined if the bank address is equal to the tag data. For example, the condition is tested whether the bank address, n, of the
memory location 150 n, j (e.g. notation, ko) of the write command, is equal to thetag data 214 i−2 (e.g. notation, m) atcache location 114 i (e.g. notation of entire step, ko==m). - If the bank address, n, of the
memory location 150 n, j, of the write command, is equal to thetag data 214 i−2 atcache location 114 i, then, at 432, write the data word portion. For example, thedata word portion 214 i−1 of thecache data 214 i is written to a merge-modify write operation with the data word (e.g. notation, [DATA-Wo]) of the write command (e.g. notation of entire step, $[io]←WR ko, io). - At 440, a read command is received. For example, a read command (e.g. notation, RD j, i1) is received to read a data word from a memory location at a bank address (e.g. notation, j) and index (e.g. notation, i1) in the memory partition 150 (e.g. notation of entire step, RD j, i1)
- The read command information is made available to the
next operation 450. If the bank address, n, of thememory location 150 n, j of the write command, is not equal to thetag data 214 i−2, atcache location 114 i, then, at 450, it is determined if the bank address, j is equal to bank address, n. For example, the condition is tested whether the bank address, given by j of the read command, is equal to the bank address, n, of thememory location 150 n, j of the write command. (e.g. notation of entire step, j==ko) - If the bank address, j, of the read command, is not equal to the bank address, n, of the
memory location 150 n, j of the write command, then, at 452, the memory data is written. For example, thememory data 250 n, j inmemory bank 150 n of the write command, inmemory partition 150 is written to in a write operation with the data word of the write command (e.g. notation of entire step, WRITE ko, io) - If the bank address, given by j of the read command, is equal to the bank address, n, of the
memory location 150 n, j, of the write command, then, at 454, if the cache data is valid, then the memory data is written. For example, if thecache data 214 i is valid, then the memory data in the memory bank given by thetag data 214 i−2, m, inmemory partition 150 is written to in a write operation with the data word portion 214-i, (e.g. notation, [DATA-C]), of the cache data (e.g. notation of entire step, WRITE m, io with {do}. - Also, if the bank address, given by j of the read command, is equal to the bank address, n, of the
memory location 150 n, j of the write command, then, at 456 (and in parallel with operation 454), the cache data is written. For example, if thecache data 214 i is valid, then thecache data portion 214 i−1 incache location 114 i incache 114 is written to in a write operation with the data word (e.g. notation, [DATA-Wo]), of the write command (e.g. notation of entire step, $[io]←WR ko, io). The combination ofoperations - At 460, the data word is read. For example, the data word (e.g. notation, [DATA-M]), from a memory location at a bank address, and index, in the
memory partition 150 is read (e.g. notation of entire step, READ j, i1) - At 462, the data word and tag data are read. For example, in parallel with
operation 460, a data word portion, r1, and tag data, n, at a cache location are read from the cache 114 (e.g. notation of entire step, {r1, n}=$[i1]). - At 470, the value read at 460 is stored in a register as a data word, ro. (e.g. notation of entire step, STORE as: ro).
- At 480, it is determined whether the bank address is equal to the tag data. For example, the condition is tested whether the tag data, n, at the cache location read in
operation 462 is equal to the bank address, j, of the memory location given by j of the read command, READ j, i1 (e.g. notation of entire step, n==j). - At 482, if the tag data, n, at the cache location read in
operation 462 is equal to the bank address, j, of the memory location given by j of the read command, RD j, i1, then the data word, r1, is output in response to the read command, RD j, i1 (e.g. notation of entire step, OUT←r1). - At 484, the data word is output. For example, if the tag data, n, at the cash location read in
operation 462 is not equal to the bank address, j, of the memory location given by j of the read command, READ j, i1, then the data word, ro, is output in response to the read command, RD j, i1 (e.g. notation of entire step, OUT←ro) - With reference now to
FIG. 5 and further reference toFIG. 4 , in accordance with embodiments of the present invention, a detailed block diagram 500 is shown of theserial memory device 101 with the BCR module. As shown inFIG. 5 , theserial memory device 101 withBCR module 110 includes amemory partition 150. - The
BCR module 110 includes a bank-conflict resolver 112 that includes BCR logic, acache 114, and a read-output multiplexer 116. - The bank-
conflict resolver 112 includes various blocks of circuitry. For example, blocks 112-1 a-h which will be described in further detail below. - The operation of the
serial memory device 101 withBCR module 110 shown inFIG. 5 may be explained with the aid of theflow chart 400 ofFIG. 4 . Thecache 114 and a first write delay 112-1 e receive the new write command (e.g., WR k1, i1), at 410. Throughout the following discussion the subscripts of indices may differ from those previous used in the description ofFIG. 4 . - After the write delay 112-1 e, the write command is designated by a prior write command (e.g., WR ko, io). The write command is propagated to the following: the memory partition write input multiplexer 112-1 b, a first memory bank index comparator 112-1 d, a second memory bank index comparator 112-1 f, and a conditional gate 112-1 c.
- After the cache receives the write command, at 420, the cache reads cache data from the cache location (indexed by io), and outputs the data word portion, {do}, along with the bank memory location index, m, and the memory location index, io, to a second write delay 112-1 a. After the delay, this appears on the output of the second write delay 112-1 a as a write command from cache, (e.g., WR m, io).
- The write command from cache appears on the input of the write input multiplexer 112-1 b and the input of the first memory bank index comparator 112-1 d. The write command from cache, WR m, io, and the delayed write command, WR ko, io, are received by the first memory bank index comparator 112-1 d, if the condition, ko==m, is satisfied, at 432, the cache may be written with the delayed write command, WR ko, io.
- With further reference to
FIGS. 4 and 5 , in accordance with embodiments of the present invention, thecache 114 and the second memory bank index comparator 112-1 f receive the read command, RD j1, i1, at 440. - If the condition tested by the first memory bank index comparator 112-1 d, ko==m, is not satisfied, at 450, the condition, j==ko, may be tested in the conditional gate 112-1 c and the second memory bank index comparator 112-1 f.
- If the condition, j1==ko OR m==ko, is satisfied, the cache may be merged with the delayed write command, WR ko, io, sent through the conditional gate 112-1 c, at 456.
- If the condition, j1==ko, is satisfied, and the condition, ko==m, is not satisfied, which are tested by the second memory bank index comparator 112-1 f and by the first memory bank index comparator 112-1 d, respectively, the logic function generator 112-1 g receives a logical “1” from the second memory bank index comparator 112-1 f and a logical “0” from the first memory bank index comparator 112-1 d, respectively. For this combination of logic values, the logic function generator 112-1 g sends a signal to the write input multiplexer 112-1 b to pass the write command from cache, WR m, io, appearing on
input 1 of the write input multiplexer 112-1 b to be written to thememory partition 150, at 454, if the cache data is valid in the write command from cache, WR m, io. The combination ofoperations - If the condition, j1==ko, is not satisfied, and the condition, ko==m, is not satisfied, which are tested by the second memory bank index comparator 112-1 f and by the first memory bank index comparator 112-1 d, respectively, the logic function generator 112-1 g receives a logical “0” from the second memory bank index comparator 112-1 f and a logical “0” from the first memory bank index comparator 112-1 d, respectively. For this combination of logic values, the logic function generator 112-1 g sends a signal to the write input multiplexer 112-1 b to pass the delayed write command, WR ko, io, appearing on
input 2 of the write input multiplexer 112-1 b to be written to thememory partition 150, at 452. - With reference now to
FIG. 5 and further reference toFIG. 4 , in accordance with embodiments of the present invention, the function of component parts of theserial memory 101 withBCR module 110 operations associated with the read command, RD j1, i1, are next described. - The read command, RD j1, i1, appears on the inputs to the
cache 114 and thememory partition 150, at 440. The memory partition is read at bank location index, j1, and memory location index, i1, at 460. - After the cache receives the read command, RD j1, i1, at 462, the cache reads cache data from the cache location indexed by i1, and outputs the data word portion, {r1}, along with the tag data, n, as cache read data, RD n, output to input 1 of the read-
output multiplexer 116, and an input of a third memory bank index comparator 112-1 h. - At 470, the memory partition outputs the data word, ro, stored at bank location index, j1, and memory location index, i1, along with the bank memory location index, j1, to input 2 of the read-
output multiplexer 116, and the other input of the third memory bank index comparator 112-1 h. The cache read data, RD n, output from cache, and the read data output from thememory partition 150, are received by the third memory bank index comparator 112-1 h, and the condition, n==j1, is tested, at 480. - If the condition, n==j1, is satisfied, at 482, the read-
output multiplexer 116 receives a signal to pass through the data word portion, r1, of the cache read data, RD n. - If the condition, n==j1, is not satisfied, at 484, the read-
output multiplexer 116 receives a signal to pass through the data word, ro, of the read data output from thememory partition 150. - In various embodiments error correction operation may be applied to data received by, or sent by, the
serial memory device 101. For example, an error correction code is generated on a data word of a write command and/or an error correction is performed on cache data of a data word portion of the cache data. - In accordance with embodiments of the present invention, a bandwidth engine (BE) may include at least one
memory partition 150 withBCR module 110. For example, each serial memory includes a memory partition and a dedicated BCR module. Thus, the BE includes a plurality of memory a plurality of partitions. By way of example, the number of memory partitions may be four. By way of example, onememory partition 150 may include memory banks 152 a, 152 n. - In addition to the component parts of the
serial memory device 101 withBCR module 110 described herein, thememory 150 further includes array manager circuitry coupled to the plurality of memories with BCR module, and serializer/deserializer (SerDes) interfaces coupled to the array manager circuitry. - In various embodiments, methods and associated method steps described herein, are carried out by processors and electrical components under the control of computer readable and computer executable instructions. The computer readable and computer executable instructions reside, for example, in a data storage medium such as computer usable volatile and non-volatile memory. However, the computer readable and computer executable instructions may reside in any type of computer readable storage medium. In some embodiments, method steps are performed at least by
serial memory device 101.
Claims (32)
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US11467902B2 (en) | 2018-03-28 | 2022-10-11 | Samsung Electronics Co., Ltd. | Apparatus to insert error-correcting coding (ECC) information as data within dynamic random access memory (DRAM) |
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US9496009B2 (en) | 2016-11-15 |
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