US20140345830A1

US20140345830A1 - Dc motor device and dc fan using the same

Info

Publication number: US20140345830A1
Application number: US14/147,455
Authority: US
Inventors: Yung-Li JANG; Kai-Hua Wang; Ming-Chih Chen
Original assignee: Wistron Corp
Current assignee: Wistron Corp
Priority date: 2013-05-27
Filing date: 2014-01-03
Publication date: 2014-11-27
Also published as: TWI487476B; TW201446124A; CN104185401A

Abstract

A heat dissipating device includes a substrate, a plurality of fins, and a heat pipe. The substrate has a plurality of retaining holes. Each of the fins includes a heat dissipating sheet and a retaining sheet extended from the heat dissipating sheet and passing through one of the retaining holes. The heat pipe is disposed on the fins.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority of China Patent Application No. 201310201784.X filed on May. 27, 2013, the entirety of which is incorporated by reference herein.

BACKGROUND OF THE INVENTION

1. Field of the Invention
The present disclosure relates to a heat dissipating device, and in particular, to a heat dissipating device with fins.
2. Description of the Related Art
Regarding the conventional manufacturing method of the heat dissipating device, the fins and the heat pipe are fixed on the substrate thereof by solder paste. However, for environmentally friendly considerations, the solder paste should be reduced through the redesigning of the structure of the heat dissipating device. Moreover, manufacturing cost may be decreased because the solder process is performed by manual labor.

BRIEF SUMMARY OF THE INVENTION

To solve the described problems, the present disclosure provides a heat dissipating device assembled without solder paste.
The present disclosure provides a heat dissipating device including a substrate, a plurality of the first fins and a heat pipe. The substrate has a plurality of retaining holes. Each of the first fins includes a heat dissipating sheet, a contacting sheet, and a retaining sheet. The heat dissipating sheet has a receiving hole. The contacting sheet is extended from the heat dissipating sheet. The retaining sheet is extended from the heat dissipating sheet, and passes through one of the retaining holes. The heat pipe is disposed on the receiving hole, and contacts with the contacting sheet.
The present disclosure provides a heat dissipating device including a substrate, a plurality of the first fins, and a heat pipe. The substrate has a retaining hole. Each of the first fins includes a heat dissipating sheet, a contacting sheet and a first retaining sheet. The heat dissipating sheet has a receiving hole. The contacting sheet is extended from the heat dissipating sheet, and has a first end. The first retaining sheet is extended from the first end, and passes through the retaining hole. The heat pipe is disposed on the receiving hole, contacting with the contacting sheet.
In the conclusion, the heat dissipating device of the present disclosure is fastened on the substrate by the retaining sheets of the fins to fix the heat pipe between the fins and the substrate. Moreover, solder paste is not needed during the manufacturing process of the heat dissipating device of the present disclosure, meeting environmentally friendly considerations, and decreasing manufacturing costs.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention can be more fully understood by reading the subsequent detailed description and examples with references made to the accompanying drawings, wherein:

FIG. 1 is a perspective view of a heat dissipating device according to a first embodiment of the present disclosure;

FIG. 2 is an exploded view of the heat dissipating device according to the first embodiment of the present disclosure, wherein the retaining sheets are unbent;

FIG. 3 is a cross-sectional view of the heat dissipating device according to the first embodiment of the present disclosure;

FIG. 4 is a perspective view of a first fin according to the first embodiment view of the present disclosure;

FIG. 5 is a perspective view of a second fin according to the first embodiment of the present disclosure;

FIG. 6 is a perspective view of a heat dissipating device according to a second embodiment of the present disclosure;

FIG. 7 is an exploded view of the heat dissipating device according to the second embodiment of the present disclosure;

FIG. 8 is a perspective view of a first fin according to the second embodiment of the present disclosure;

FIG. 9 is a perspective view of a heat dissipating device according to a third embodiment of the present disclosure;

FIG. 10 is a perspective view of a substrate according to the third embodiment of the present disclosure;

FIG. 11 is a perspective view of the first fin and second fin according to the third embodiment of the present disclosure;

FIG. 12 is a perspective view of the first fins according to the third embodiment of the present disclosure; and

FIG. 13 is a perspective view of the second fins according to the third embodiment of the present disclosure.

DETAILED DESCRIPTION OF THE INVENTION

FIG. 1 is a perspective view of a heat dissipating device 1 according to a first embodiment of the present disclosure. FIG. 2 is an exploded view of the heat dissipating device 1 according to the first embodiment of the present disclosure, wherein the retaining sheet 22 is unbent. FIG. 3 is a cross-sectional view of the heat dissipating device 1 according to the first embodiment of the present disclosure. FIG. 4 is a perspective view of a first fin 20 according to the first embodiment view of the present disclosure. FIG. 5 is a perspective view of a second fin 30 according to the first embodiment of the present disclosure. The heat dissipating device 1 may be disposed in a portable electronic device (not shown) to provide a dissipating function. The heat dissipating device 1 includes a substrate 10, a plurality of first fins 20, a plurality of second fins 30 and a heat pipe 40.
The substrate 10 may be a printed circuit board or a supporting board in an electronic device. The supporting board is made of heat-conducting or electrically conducting material, such as metal, and is utilized for disposing a variety of electronic elements thereon, such as a printed circuit board, a power supply, or a fan. The substrate 10 may be a sheet structure, and has a plurality of retaining holes 11 arranged along an arrangement direction D1. The retaining holes 11 may be rectangular and extended along an extension direction D2, which is perpendicular to the arrangement direction D1. In the embodiment, a part of the retaining holes 11 are located at the edge of the substrate 10, and is respectively communicated with the openings 12 located at the edge of the substrate 10.
As shown in FIG. 4, the first fins 20 is made from a metal sheet by a stamping process. The first fins 20 may be a sheet structure including a first body 21 and two retaining sheets 22. The retaining sheets 22 are extended from the first body 21, and contact with the substrate 10. The first body 21 includes a first heat dissipating sheet 211, a first contacting sheet 212, and a first spacing sheet 213. The first heat dissipating sheet 211, the first contacting sheet 212, the first spacing sheet 213, and the retaining sheet 22 are formed as a single piece.
The first heat dissipating sheet 211 is a plate structure perpendicular to the arrangement direction D1. The first heat dissipating sheet 211 has a receiving hole S1. The first contacting sheet 212, the first spacing sheet 213, and the retaining sheets 22 are disposed on a surface 2111 (as shown in FIG. 4) of the first heat dissipating sheet 211 and extended from the first heat dissipating sheet 211 along the arrangement direction D1. In other words, the first contacting sheet 212, the first spacing sheet 213, and the retaining sheets 22 are substantially perpendicular to the first heat dissipating sheet 211 and substantially parallel to the substrate 10.
The first contacting sheet 212 is located at the edge of the receiving hole S1, and around the receiving hole S1. The first spacing sheet 213 and the retaining sheets 22 are respectively located at two opposite sides of the first heat dissipating sheet 211. The retaining sheets 22 are respectively located at the two opposite sides of the receiving hole S1 and the first contacting sheet 212. The length of the retaining sheet 22 is greater than the length of the first spacing sheet 213. In the embodiment, the length of the retaining sheet 22 is about at least two, three or four times that of the length of the first spacing sheet 213. The retaining sheets 22 and the first heat dissipating sheet 211 are respectively located at two opposite sides of the substrate 10.
As shown in FIG. 3, the second fins 30 are disposed on the first surface 13 of the substrate 10, but not passing through the retaining holes 11 of the substrate 10. As shown in FIG. 5, the second fins 30 include a second body 31 including a second heat dissipating sheet 311, a second contacting sheet 312, and a second spacing sheet 313. The second heat dissipating sheet 311 is substantially parallel to the first heat dissipating sheet 211. The structure of the second fins 30 is substantially the same as the structure of the first fins 20. However, the second fins 30 excludes the retaining sheets 22. Accordingly, for the description of the second fins 30, reference can be made to the description of the first fins 20.
The heat pipe 40 is extended along the arrangement direction D1 and disposed in the receiving holes S1 of the first fins 20 and the second fins 30, and disposed on the substrate 10. In the embodiment, the heat pipe 40 is a thin structure having a plane 41, and thus, a heat source (not shown) may be disposed on an end of the plane 41, wherein the heat source may be an electronic element, such as a chip. The heat pipe 40 transmits the heat generated by the heat source to the first fins 20 and the second fins 30 for heat dissipation. In another embodiment, the heat pipe 40 may be a curved structure extended over the substrate 10, and the heat source may be disposed on the substrate 10.
As shown in FIGS. 2 and 3, when assembling the heat dissipating device 1 of the embodiment, the first fins 20 and the second fins 30 are alternately overlaid to each other along the arrangement direction D1, wherein one or more of the first fins 20 are adjacent to each other. The second spacing sheet 313 abuts against an adjacent first spacing sheet 213 or another adjacent second spacing sheet 313, and the second contacting sheet 312 abuts against an adjacent first contacting sheet 212 or another adjacent second contacting sheet 312. Thus, by the first spacing sheets 213, the second spacing sheets 313, the first contacting sheets 212, and the second contacting sheets 312, the first heat dissipating sheets 211 and the second heat dissipating sheets 311 are separated from each other stably. In addition, by the arrangement of the first fins 20 and the second fins 30, the numbers of the retaining holes 11 on the substrate 10 is decreased, and the strength of the substrate 10 is improved.
Further, the heat pipe 40 is disposed on the receiving holes S1 of the first fins 20 and the second fins 30, and contacts with the first contacting sheets 212 and the second contacting sheets 312. Next, the substrate 10 is disposed on the heat pipe 40, and the first fins 20 and the second fins 30. The retaining sheets 22 respectively pass through retaining holes 11. Next, the retaining sheets 22 are bent and contacted with the second surface 14, which is opposite to the first surface 13, of the substrate 10, to fasten the first fins 20 on substrate 10. Then, the assembly of the heat dissipating device 1 is finished.
It should be noted that there are many assembly and manufacturing methods for the heat dissipating device 1, and the assembly and manufacturing methods are not limited herein.
In the embodiment, since the heat pipe 40 is tightly mounted on the first contacting sheets 212 and the second contacting sheets 312, the first fins 20 and the second fins 30 are stably disposed on the heat pipe 40. Moreover, by the retaining sheets 22 contacting with the second surface 14 of the substrate 10, the first heat dissipating sheets 211 press the heat pipe 40 to clamp the heat pipe 40 between the first surface 13 of the substrate 10 and the first heat dissipating sheets 211.
In the embodiment, since the first fins 20, the second fins 30, and the heat pipe 40 are fixed on the substrate 10 by bending the retaining sheets 22, solder paste is not needed for the assembly of the heat dissipating device 1. Moreover, the assembly of the heat dissipating device 1 is able to be performed by automated equipment, and thus, labor and manufacturing costs are decreased.
In another embodiment, the first fins 20 or the second fins 30 includes a fastening element (not shown) to make the second fins 30 fix onto the first fins 20 or another adjacent second fin.
FIG. 6 is a perspective view of a heat dissipating device 1 a according to a second embodiment of the present disclosure. FIG. 7 is an exploded view of the heat dissipating device 1 a according to the second embodiment of the present disclosure. FIG. 8 is a perspective view of a first fin 20 a according to the second embodiment of the present disclosure. In the second embodiment, the substrate 10 a has two retaining holes 11 a parallel to each other, and the retaining holes 11 a are extended along the arrangement direction D1. The retaining sheet 22 a is extended from the first end 2121 of the sheet 212 along the extension direction D2. The first fins 20 a and the second fins 30 are stacked along the arrangement direction D1, wherein the first fins 20 a are stacked to each other, and all of the first fins 20 a are located between the second fins 30.
In FIG. 7, the retaining sheets 22 a are unbent. When the substrate 10 a is assembled with the first fins 20 a, the retaining sheets 22 a pass through the retaining holes 11 a and bend to the substrate 10. In the embodiment, the second fins 30 may be excluded.
FIG. 9 is a perspective view of a heat dissipating device 1 b according to a third embodiment of the present disclosure. FIG. 10 is a perspective view of a substrate 10 b according to the third embodiment of the present disclosure. FIG. 11 is a perspective view of the first fins 20 b and the second fins 30 b according to the third embodiment of the present disclosure. FIG. 12 is a perspective view of the first fins 20 b according to the third embodiment of the present disclosure. FIG. 13 is a perspective view of the second fins 30 b according to the third embodiment of the present disclosure.
The substrate 10 b has a retaining hole 11 b extended along the arrangement direction D1. Two L-shaped fastening elements 15 are disposed on the edge of the substrate 10 b, wherein the L-shaped fastening element 15 includes a first plate 151 and a second plate 152. The first plate 151 is connected to the edge of the substrate 10, and is perpendicular to the substrate 10. The second plate 152 is connected to the first plate 151, and is perpendicular to the first plate 151 and parallel to substrate 10. Moreover, the retaining holes 11, and the connection of the first plate 151 and the substrate 10 are extended along the arrangement direction D1. The heat pipe 40 is located between the L-shaped fastening elements 15 and the substrate 10.
The retaining sheets 22 b and 22 c of the first fins 20 b are respectively extended from the first end 2121 and the second end 2122 of the first contacting sheet 212. The retaining sheet 22 b and the retaining sheet 22 c are extended to each other. In the first fins 20 b, the first spacing sheet 213 of the first embodiment may be excluded.
The second fins 30 b has a second body 31 b and a fastening portion 32 b. The second body 31 b includes a second heat dissipating sheet 311 b and a second contacting sheet 312 b. In the embodiment, the second heat dissipating sheet 311 b and the second contacting sheet 312 b of the second fins 30 b are an L-shape. The fastening portion 32 b is extended from one end of the second contacting sheet 312 b.
In FIG. 11, the retaining sheets 22 b and 22 c are unbent. When the substrate 10 is assembled to the first fins 20 and the second fins 30, the retaining sheets 22 b pass through the retaining holes 11 b and are bent to the substrate 10. The retaining sheets 22 c and the fastening portions 32 b are bent to the heat pipe 40, and fastened on heat pipe 40.
In conclusion, the heat dissipating device of the present disclosure is fastened on the substrate by the retaining sheets of the fins to fix the heat pipe between the fins and the substrate. Moreover, solder paste is not needed during the manufacturing process of the heat dissipating device of the present disclosure for environmentally friendly considerations, and thus, the manufacturing costs are decreased.
While the invention has been described by way of example and in terms of preferred embodiment, it is to be understood that the invention is not limited thereto.
On the contrary, it is intended to cover various modifications and similar arrangements (as would be apparent to those skilled in the art). Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.

Claims

What is claimed is:

1. A heat dissipating device, comprising:

a substrate having a plurality retaining holes;

a plurality of first fins, wherein each of the first fins comprises:

a heat dissipating sheet having a receiving hole;

a contacting sheet extending from the heat dissipating sheet; and

a retaining sheet, extending from the heat dissipating sheet, passing through one of the retaining holes; and

a heat pipe, disposed on the receiving hole, contacting with the contacting sheet.

2. The heat dissipating device as claimed in claim 1, wherein the contacting sheet and the retaining sheet are substantially perpendicular to the heat dissipating sheet.

3. The heat dissipating device as claimed in claim 1, wherein the retaining sheet and the contacting sheet are substantially parallel to the substrate.

4. The heat dissipating device as claimed in claim 1, wherein the retaining sheet and the heat dissipating sheet are respectively located at two opposite sides of the substrate.

5. The heat dissipating device as claimed in claim 1, wherein the first fins are sheet structures, and the heat dissipating sheet, the contacting sheet, and the retaining sheet are formed as a single piece.

6. The heat dissipating device as claimed in claim 1, further comprising a plurality of second fins disposed on the substrate,

wherein the first fins and the second fins are alternately overlaid to each other, and the second fins do not pass through the retaining holes.

7. A heat dissipating device, comprising:

a substrate having retaining hole;

a plurality of first fins, wherein each of the first fins comprises:

a heat dissipating sheet having a receiving hole;

a contacting sheet, extending from the heat dissipating sheet, having a first end; and

a first retaining sheet, extending from the first end, passing through the retaining hole; and

8. The heat dissipating device as claimed in claim 7, wherein the contacting sheet and the first retaining sheet are substantially perpendicular to the heat dissipating sheet.

9. The heat dissipating device as claimed in claim 7, wherein the first retaining sheet and the contacting sheet are substantially parallel to the substrate.

10. The heat dissipating device as claimed in claim 7, wherein the first retaining sheet and the heat dissipating sheet are respectively located at two opposite sides of the substrate.

11. The heat dissipating device as claimed in claim 7, wherein the first fins is a sheet structure, and the heat dissipating sheet, the contacting sheet, and the first retaining sheet are formed as a single piece.

12. The heat dissipating device as claimed in claim 7, wherein the contacting sheet has a second end, and the first fins further comprises a second retaining sheet extending from the second end and fastening on the heat pipe.

13. The heat dissipating device as claimed in claim 7, further comprising a plurality of second fins, disposed on the substrate, but not passing through the retaining hole,

wherein the first fins and the second fins are overlapped along an arrangement direction, and the first fins are located between the second fins.

14. The heat dissipating device as claimed in claim 13, wherein each of the second fins comprises a fastening portion fastened on the heat pipe.