US20220341680A1 - Heat pipe structure - Google Patents
Heat pipe structure Download PDFInfo
- Publication number
- US20220341680A1 US20220341680A1 US17/242,246 US202117242246A US2022341680A1 US 20220341680 A1 US20220341680 A1 US 20220341680A1 US 202117242246 A US202117242246 A US 202117242246A US 2022341680 A1 US2022341680 A1 US 2022341680A1
- Authority
- US
- United States
- Prior art keywords
- heat pipe
- pipe structure
- working fluid
- pipe
- airtight chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000012530 fluid Substances 0.000 claims abstract description 33
- 239000000843 powder Substances 0.000 claims abstract description 14
- 229910052751 metal Inorganic materials 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims description 25
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 13
- 229910052782 aluminium Inorganic materials 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- 239000010935 stainless steel Substances 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 4
- 239000010936 titanium Substances 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- 238000005245 sintering Methods 0.000 claims description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 2
- 239000012071 phase Substances 0.000 description 7
- 239000007791 liquid phase Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 4
- 239000012808 vapor phase Substances 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 229910000553 6063 aluminium alloy Inorganic materials 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 239000002250 absorbent Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
Definitions
- the present invention relates to a heat pipe structure, and more particularly, to a low-temperature heat pipe structure that enables latent heat exchange in a phase change of a working fluid in the heat pipe under an ambient temperature of 0° C. to -90° C.
- a conventional heat pipe structure includes a hollow pipe shell, in which a water-absorbent wick structure and a working fluid, such as water, coolant, methanol, acetone and liquid ammonia, are provided.
- a working fluid such as water, coolant, methanol, acetone and liquid ammonia.
- Most of the currently commercially available hollow pipe shells for the conventional heat pipe structure are made of a copper material or an aluminum material.
- the heat pipe structure applied to the heat dissipation of electronic products usually includes a copper pipe and an amount of pure water filled therein to serve as the working fluid. Since the copper pipe has good heat conductivity and the pure water has good latent heat, the conventional heat pipe structure can be used in most normal environments with restriction in some applications. For example, the conventional heat pipe structure is not advantageous for use in some indoor and outdoor applications, such as for the heat dissipation of chips for 5G and 6G base stations, insulted-gate bipolar transistors (IGBTs) of outdoor photovoltaic power source and automotive chips. Further, the pure water as the working fluid tends to freeze under an ambient temperature of 0° C., and the decreased molecular force of the frozen water will cause problem in the structural strength of the heat pipe structure.
- IGBTs insulted-gate bipolar transistors
- a primary object of the present invention is to effectively solve the problems in the conventional heat pipe structure by providing an improved low-temperature heat pipe structure that enables latent heat exchange in a phase change of a working fluid in a pipe thereof under a low ambient temperature.
- the heat pipe structure includes a pipe, a plurality of wick structures, and a working fluid.
- the pipe internally defines an airtight chamber.
- the wick structures includes a plurality of grooves, a wire mesh and a sintered powder metal formed in the airtight chamber of the pipe layer by layer from a radially outer side to a radially inner side.
- the grooves respectively have an open side and an opposite closed side, and the open side has a width smaller than that of the closed side.
- the working fluid is filled in the airtight chamber of the pipe and is capable of diffusing and flowing back through the wick structures.
- the wire mesh is mainly used to further separate the sintered powder metal form the grooves, lest fine powder of the sintered powder metal should fall into the grooves and block the same to adversely affect the diffusion of the vapor-phase working fluid through the grooves.
- the heat pipe structure of the present invention is a low-temperature heat pipe structure enabling latent heat exchange in a phase change of the working fluid in the pipe under a low ambient temperature of 0° C. to -90° C.
- FIG. 1 is an exploded perspective view of a heat pipe structure according to a preferred embodiment of the present invention.
- FIG. 2 is an assembled sectional view of the heat pipe structure of FIG. 1 .
- FIGS. 1 and 2 are exploded perspective and assembled sectional views, respectively, of a heat pipe structure according to a preferred embodiment of the present invention.
- the heat pipe structure in the preferred embodiment of the present invention includes a pipe 11 , a plurality of wick structures 12 and a working fluid 2 .
- the pipe 11 defines an internal airtight chamber 111 , and can be made of an aluminum material, a copper material, a stainless steel material, or a titanium material.
- the aluminum materials include, but not limited to, A3003 and AL 6063 aluminum alloys.
- the pipe 11 has a wall thickness about 0.5 mm and can be round, flat or square in cross section.
- the pipe 11 has an evaporator area located at one end or a middle section of the pipe 11 and a condenser area located at another opposite end of the pipe 11 .
- the wick structures 12 include a plurality of axial grooves 121 , a wire mesh 122 and a sintered powder metal 3 provided in the pipe 11 layer by layer from a radially outer side to a radially inner side.
- the axial grooves 121 are circumferentially arrayed on an inner wall surface of the pipe 11 and respectively have an open side 1211 and a closed side 1212 .
- the open side 1211 has a width smaller than that of the closed side 1212 , giving the grooves 121 a substantially inverted trapezoidal, omega-shaped or inverted triangular cross section.
- the metal mesh 122 is provided on and connected to the inner wall surface of the pope 11 by way of sintering or diffusion bonding.
- the wire mesh 122 can be made of a copper material, an aluminum material, a stainless steel material, or a titanium material.
- the aluminum materials include, but not limited to, A3003 and AL 6063 aluminum alloys.
- the wire mesh 122 is preferably a #200 wire mesh without being particularly limited thereto.
- the working fluid 2 is filled in the airtight chamber 111 of the pipe 11 .
- the working fluid 2 initially in the evaporator area in a liquid phase is heated and evaporated into a vapor phase.
- the vaporized working fluid 2 diffuses in the airtight chamber 111 and the grooves 121 or flows from the evaporator area to the condenser area, at where the working fluid 2 in the vapor phase releases heat and is condensed into the liquid phase again.
- the liquid-phase working fluid 2 is guided by the wire mesh 122 and the sintered powder metal 3 or by a capillary action occurred at the grooves 121 to flow back to the evaporator area, i.e. an area in contact with a heat source.
- the grooves 121 help the condensed liquid-phase working fluid 2 to flow back to the evaporator area or help the evaporated vapor-phased working fluid 2 to diffuse to the condenser area.
- the wire mesh 122 is mainly used to separate the sintered powder metal 3 from the grooves 121 , lest finely powder of the sintered powder metal 3 should fall into the grooves 121 to block the same. Blocked grooves 121 would adversely affect the diffusion of the vaporized working fluid 2 through the grooves 121 .
- the heat pipe structure of the present invention is a low-temperature heat pipe structure enabling latent heat exchange in a phase change of the working fluid in the pipe under a low ambient temperature of 0° C. to -90° C.
- the wire mesh 122 has an outer peripheral surface 1221 and an inner peripheral surface 1222 .
- the outer peripheral surface 1221 is correspondingly fitted to the open side 1211 of the grooves 121
- the inner peripheral surface 1222 has a powder sintered body 3 provided thereon.
- the powder sintered body 3 is a structural body formed by sintering copper powder, aluminum powder or nickel powder.
- the working fluid 2 is filled in the airtight chamber 111 of the pipe 11 .
- the present invention provides a low-temperature heat pipe structure having multiple liquid-absorbent wick structures 12 .
- the low-temperature heat pipe structure includes a pipe 11 made of an aluminum material; a plurality of grooves 121 with an omega-shaped cross section, a wire mesh 122 made of an aluminum material, and a powder sintered body 3 are sequentially provided on an inner wall surface of the pipe 11 ; and a working fluid 2 , such as a coolant having a liquidus temperature point of -90° C., is filled in the pipe 11 to give the heat pipe structure an operating temperature interval between -90° C.
- a working fluid 2 such as a coolant having a liquidus temperature point of -90° C.
- the heat pipe structure of the present invention is a low-temperature heat pipe structure enabling latent heat exchange in a phase change of the working fluid at a low temperature. Therefore, the heat pipe structure of the present invention can be applied in a low-temperature environment without the problem of having a frozen working fluid in the pipe to maintain normal vapor and liquid circulation in the heat pipe.
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
- The present invention relates to a heat pipe structure, and more particularly, to a low-temperature heat pipe structure that enables latent heat exchange in a phase change of a working fluid in the heat pipe under an ambient temperature of 0° C. to -90° C.
- A conventional heat pipe structure includes a hollow pipe shell, in which a water-absorbent wick structure and a working fluid, such as water, coolant, methanol, acetone and liquid ammonia, are provided. Most of the currently commercially available hollow pipe shells for the conventional heat pipe structure are made of a copper material or an aluminum material. By taking advantage of a latent heat exchange that occurs in the working fluid due to phase change of the working fluid in the hollow pipe shell, the heat pipe structure is used to transfer heat.
- Currently, the heat pipe structure applied to the heat dissipation of electronic products usually includes a copper pipe and an amount of pure water filled therein to serve as the working fluid. Since the copper pipe has good heat conductivity and the pure water has good latent heat, the conventional heat pipe structure can be used in most normal environments with restriction in some applications. For example, the conventional heat pipe structure is not advantageous for use in some indoor and outdoor applications, such as for the heat dissipation of chips for 5G and 6G base stations, insulted-gate bipolar transistors (IGBTs) of outdoor photovoltaic power source and automotive chips. Further, the pure water as the working fluid tends to freeze under an ambient temperature of 0° C., and the decreased molecular force of the frozen water will cause problem in the structural strength of the heat pipe structure.
- It is therefore an important target of persons skilled in the art to protect the vapor and liquid circulation in the heat pipe structure against damages due to a frozen working fluid under low temperature.
- A primary object of the present invention is to effectively solve the problems in the conventional heat pipe structure by providing an improved low-temperature heat pipe structure that enables latent heat exchange in a phase change of a working fluid in a pipe thereof under a low ambient temperature.
- To achieve the above and other objects, the heat pipe structure according to the present invention includes a pipe, a plurality of wick structures, and a working fluid. The pipe internally defines an airtight chamber. The wick structures includes a plurality of grooves, a wire mesh and a sintered powder metal formed in the airtight chamber of the pipe layer by layer from a radially outer side to a radially inner side.
- The grooves respectively have an open side and an opposite closed side, and the open side has a width smaller than that of the closed side. The working fluid is filled in the airtight chamber of the pipe and is capable of diffusing and flowing back through the wick structures. The wire mesh is mainly used to further separate the sintered powder metal form the grooves, lest fine powder of the sintered powder metal should fall into the grooves and block the same to adversely affect the diffusion of the vapor-phase working fluid through the grooves. With the above arrangements, the heat pipe structure of the present invention is a low-temperature heat pipe structure enabling latent heat exchange in a phase change of the working fluid in the pipe under a low ambient temperature of 0° C. to -90° C.
- The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein
-
FIG. 1 is an exploded perspective view of a heat pipe structure according to a preferred embodiment of the present invention; and -
FIG. 2 is an assembled sectional view of the heat pipe structure ofFIG. 1 . - The present invention will now be described with a preferred embodiment thereof and by referring to the accompanying drawings.
- Please refer to
FIGS. 1 and 2 , which are exploded perspective and assembled sectional views, respectively, of a heat pipe structure according to a preferred embodiment of the present invention. As shown, the heat pipe structure in the preferred embodiment of the present invention includes apipe 11, a plurality ofwick structures 12 and a workingfluid 2. - The
pipe 11 defines aninternal airtight chamber 111, and can be made of an aluminum material, a copper material, a stainless steel material, or a titanium material. In the case of analuminum pipe 11, the aluminum materials include, but not limited to, A3003 and AL 6063 aluminum alloys. Further, thepipe 11 has a wall thickness about 0.5 mm and can be round, flat or square in cross section. Thepipe 11 has an evaporator area located at one end or a middle section of thepipe 11 and a condenser area located at another opposite end of thepipe 11. - The
wick structures 12 include a plurality ofaxial grooves 121, awire mesh 122 and a sinteredpowder metal 3 provided in thepipe 11 layer by layer from a radially outer side to a radially inner side. Theaxial grooves 121 are circumferentially arrayed on an inner wall surface of thepipe 11 and respectively have anopen side 1211 and a closedside 1212. Theopen side 1211 has a width smaller than that of the closedside 1212, giving the grooves 121 a substantially inverted trapezoidal, omega-shaped or inverted triangular cross section. Themetal mesh 122 is provided on and connected to the inner wall surface of thepope 11 by way of sintering or diffusion bonding. Thewire mesh 122 can be made of a copper material, an aluminum material, a stainless steel material, or a titanium material. In the case of analuminum wire mesh 122, the aluminum materials include, but not limited to, A3003 and AL 6063 aluminum alloys. Further, thewire mesh 122 is preferably a #200 wire mesh without being particularly limited thereto. - The working
fluid 2 is filled in theairtight chamber 111 of thepipe 11. When the heat pipe structure is in use, the workingfluid 2 initially in the evaporator area in a liquid phase is heated and evaporated into a vapor phase. The vaporized workingfluid 2 diffuses in theairtight chamber 111 and thegrooves 121 or flows from the evaporator area to the condenser area, at where the workingfluid 2 in the vapor phase releases heat and is condensed into the liquid phase again. When the vapor-phase working fluid 2 is condensed to form the liquid-phase working fluid 2 again, the liquid-phase working fluid 2 is guided by thewire mesh 122 and the sinteredpowder metal 3 or by a capillary action occurred at thegrooves 121 to flow back to the evaporator area, i.e. an area in contact with a heat source. Thegrooves 121 help the condensed liquid-phase working fluid 2 to flow back to the evaporator area or help the evaporated vapor-phased workingfluid 2 to diffuse to the condenser area. - The
wire mesh 122 is mainly used to separate the sinteredpowder metal 3 from thegrooves 121, lest finely powder of the sinteredpowder metal 3 should fall into thegrooves 121 to block the same. Blockedgrooves 121 would adversely affect the diffusion of the vaporized workingfluid 2 through thegrooves 121. With the above arrangements, the heat pipe structure of the present invention is a low-temperature heat pipe structure enabling latent heat exchange in a phase change of the working fluid in the pipe under a low ambient temperature of 0° C. to -90° C. - The
wire mesh 122 has an outerperipheral surface 1221 and an innerperipheral surface 1222. The outerperipheral surface 1221 is correspondingly fitted to theopen side 1211 of thegrooves 121, while the innerperipheral surface 1222 has a powder sinteredbody 3 provided thereon. The powder sinteredbody 3 is a structural body formed by sintering copper powder, aluminum powder or nickel powder. - The working
fluid 2 is filled in theairtight chamber 111 of thepipe 11. - In summary, the present invention provides a low-temperature heat pipe structure having multiple liquid-
absorbent wick structures 12. In an embodiment, the low-temperature heat pipe structure includes apipe 11 made of an aluminum material; a plurality ofgrooves 121 with an omega-shaped cross section, awire mesh 122 made of an aluminum material, and a powder sinteredbody 3 are sequentially provided on an inner wall surface of thepipe 11; and a workingfluid 2, such as a coolant having a liquidus temperature point of -90° C., is filled in thepipe 11 to give the heat pipe structure an operating temperature interval between -90° C. and 100° C., enabling the heat pipe structure to be applied in outdoor environments, such as being used for dissipating heat produced by 5G and 6G base station chips, insulated-gate bipolar transistors (IGBTs) of a photovoltaic power source, and automotive chips. Since latent heat exchange in a phase change of the workingfluid 2 can occur in thepipe 11 under an ambient temperature of 0° C. to -90° C., the heat pipe structure of the present invention is a low-temperature heat pipe structure enabling latent heat exchange in a phase change of the working fluid at a low temperature. Therefore, the heat pipe structure of the present invention can be applied in a low-temperature environment without the problem of having a frozen working fluid in the pipe to maintain normal vapor and liquid circulation in the heat pipe. - The present invention has been described with a preferred embodiment thereof and it is understood that many changes and modifications in the described embodiment can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims.
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/242,246 US20220341680A1 (en) | 2021-04-27 | 2021-04-27 | Heat pipe structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/242,246 US20220341680A1 (en) | 2021-04-27 | 2021-04-27 | Heat pipe structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US20220341680A1 true US20220341680A1 (en) | 2022-10-27 |
Family
ID=83694010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US17/242,246 Abandoned US20220341680A1 (en) | 2021-04-27 | 2021-04-27 | Heat pipe structure |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | US20220341680A1 (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3528494A (en) * | 1966-11-07 | 1970-09-15 | Teledyne Inc | Heat pipe for low thermal conductivity working fluids |
| JPH11294980A (en) * | 1998-04-13 | 1999-10-29 | Fujikura Ltd | Heat pipe and manufacturing method thereof |
| US20060180296A1 (en) * | 2005-02-17 | 2006-08-17 | Yuh-Cheng Chemical Ltd. | Heat pipe |
| US20060207750A1 (en) * | 2005-03-18 | 2006-09-21 | Foxconn Technology Co., Ltd. | Heat pipe with composite capillary wick structure |
| US7137442B2 (en) * | 2003-12-22 | 2006-11-21 | Fujikura Ltd. | Vapor chamber |
| US20060283574A1 (en) * | 2005-06-15 | 2006-12-21 | Top Way Thermal Management Co., Ltd. | Thermoduct |
| US20070034357A1 (en) * | 2005-08-12 | 2007-02-15 | Chuen-Shu Hou | Heat pipe and method of producing the same |
| US20070240855A1 (en) * | 2006-04-14 | 2007-10-18 | Foxconn Technology Co., Ltd. | Heat pipe with composite capillary wick structure |
| US20080099186A1 (en) * | 2006-11-01 | 2008-05-01 | Foxconn Technology Co., Ltd. | Flexible heat pipe |
-
2021
- 2021-04-27 US US17/242,246 patent/US20220341680A1/en not_active Abandoned
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3528494A (en) * | 1966-11-07 | 1970-09-15 | Teledyne Inc | Heat pipe for low thermal conductivity working fluids |
| JPH11294980A (en) * | 1998-04-13 | 1999-10-29 | Fujikura Ltd | Heat pipe and manufacturing method thereof |
| US7137442B2 (en) * | 2003-12-22 | 2006-11-21 | Fujikura Ltd. | Vapor chamber |
| US20060180296A1 (en) * | 2005-02-17 | 2006-08-17 | Yuh-Cheng Chemical Ltd. | Heat pipe |
| US20060207750A1 (en) * | 2005-03-18 | 2006-09-21 | Foxconn Technology Co., Ltd. | Heat pipe with composite capillary wick structure |
| US20060283574A1 (en) * | 2005-06-15 | 2006-12-21 | Top Way Thermal Management Co., Ltd. | Thermoduct |
| US20070034357A1 (en) * | 2005-08-12 | 2007-02-15 | Chuen-Shu Hou | Heat pipe and method of producing the same |
| US20070240855A1 (en) * | 2006-04-14 | 2007-10-18 | Foxconn Technology Co., Ltd. | Heat pipe with composite capillary wick structure |
| US20080099186A1 (en) * | 2006-11-01 | 2008-05-01 | Foxconn Technology Co., Ltd. | Flexible heat pipe |
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