[go: up one dir, main page]

USD1007449S1 - Target profile for a physical vapor deposition chamber target - Google Patents

Target profile for a physical vapor deposition chamber target Download PDF

Info

Publication number
USD1007449S1
USD1007449S1 US29/782,632 US202129782632F USD1007449S US D1007449 S1 USD1007449 S1 US D1007449S1 US 202129782632 F US202129782632 F US 202129782632F US D1007449 S USD1007449 S US D1007449S
Authority
US
United States
Prior art keywords
target
vapor deposition
physical vapor
deposition chamber
profile
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/782,632
Inventor
David Gunther
Kirankumar Neelasandra Savandaiah
Jiao Song
Madan Kumar Shimoga Mylarappa
Yue Cui
Nuno Yen-Chu Chen
Mengxue WU
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US29/782,632 priority Critical patent/USD1007449S1/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: GUNTHER, David, SAVANDAIAH, KIRANKUMAR NEELASANDRA, SHIMOGA MYLARAPPA, MADAN KUMAR
Assigned to APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD. reassignment APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SONG, Jiao, CHEN, Nuno Yen-Chu, CUI, Yue, WU, Mengxue
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Priority to TW111305973F priority patent/TWD237732S/en
Priority to TW110305890F priority patent/TWD226530S/en
Priority to JP2022009480F priority patent/JP1730204S/en
Priority to JP2021024277F priority patent/JP1718363S/en
Publication of USD1007449S1 publication Critical patent/USD1007449S1/en
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

FIG. 1 is a top perspective view of a sputtering target for a physical vapor deposition chamber, according to one embodiment of the novel design.
FIG. 2 is a top plan view thereof.
FIG. 3 is a bottom plan view thereof.
FIG. 4 is a right side elevation view thereof.
FIG. 5 is a left side elevation view thereof.
FIG. 6 is a front elevation thereof.
FIG. 7 is a back elevation view thereof; and,
FIG. 8 is an enlarged partial right side elevation view showing portions of the design in greater detail.
The dash-dash broken lines in FIGS. 1-8 represent unclaimed environment and form no part of the claimed design.
The short dash-dot lines on FIG. 4 and FIG. 8 depict the bounds of the region taken from FIG. 4 to be enlarged on FIG. 8 and form no part of the claimed design.

Claims (1)

    CLAIM
  1. We claim the ornamental design for a target profile for a physical vapor deposition chamber target, as shown and described.
US29/782,632 2021-05-07 2021-05-07 Target profile for a physical vapor deposition chamber target Active USD1007449S1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US29/782,632 USD1007449S1 (en) 2021-05-07 2021-05-07 Target profile for a physical vapor deposition chamber target
TW111305973F TWD237732S (en) 2021-05-07 2021-11-01 Target for a physical vapor deposition chamber
TW110305890F TWD226530S (en) 2021-05-07 2021-11-01 Target for a physical vapor deposition chamber
JP2021024277F JP1718363S (en) 2021-05-07 2021-11-08 Target profile for physical vapor deposition chamber targets
JP2022009480F JP1730204S (en) 2021-05-07 2021-11-08 Target Profile for Physical Vapor Deposition Chamber Targets

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/782,632 USD1007449S1 (en) 2021-05-07 2021-05-07 Target profile for a physical vapor deposition chamber target

Publications (1)

Publication Number Publication Date
USD1007449S1 true USD1007449S1 (en) 2023-12-12

Family

ID=82164379

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/782,632 Active USD1007449S1 (en) 2021-05-07 2021-05-07 Target profile for a physical vapor deposition chamber target

Country Status (3)

Country Link
US (1) USD1007449S1 (en)
JP (2) JP1718363S (en)
TW (2) TWD237732S (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1037778S1 (en) * 2022-07-19 2024-08-06 Applied Materials, Inc. Gas distribution plate
USD1053230S1 (en) * 2022-05-19 2024-12-03 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD1071103S1 (en) * 2022-04-11 2025-04-15 Applied Materials, Inc. Gas distribution plate
USD1071886S1 (en) * 2022-01-20 2025-04-22 Applied Materials, Inc. Substrate support for a substrate processing chamber
USD1072774S1 (en) * 2021-02-06 2025-04-29 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1086087S1 (en) * 2023-03-30 2025-07-29 Samsung Electronics Co., Ltd. CMP (chemical mechanical planarization) retaining ring

Citations (119)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5320728A (en) 1990-03-30 1994-06-14 Applied Materials, Inc. Planar magnetron sputtering source producing improved coating thickness uniformity, step coverage and step coverage uniformity
USD351450S (en) 1993-05-19 1994-10-11 Riteflite Pty. Limited Target for shooting
USD363464S (en) 1992-08-27 1995-10-24 Tokyo Electron Yamanashi Limited Electrode for a semiconductor processing apparatus
USD376744S (en) 1994-08-03 1996-12-24 Gerd Eisenblatter Gmbh Support plate
USD381030S (en) * 1995-11-21 1997-07-15 Avi Tepman Sputtering target
USD395483S (en) * 1996-06-07 1998-06-23 Riteflite Pty Limited Design for a target
USD423026S (en) 1997-08-20 2000-04-18 Tokyo Electron Limited Quartz cover
USD425919S (en) * 1997-11-14 2000-05-30 Applied Materials, Inc. Electrostatic chuck with improved spacing mask and workpiece detection device
US6086725A (en) 1998-04-02 2000-07-11 Applied Materials, Inc. Target for use in magnetron sputtering of nickel for forming metallization films having consistent uniformity through life
US6114216A (en) 1996-11-13 2000-09-05 Applied Materials, Inc. Methods for shallow trench isolation
USD446231S1 (en) 2000-08-21 2001-08-07 Komatsu Industries Corporation Nozzle for a plasma arc torch
US6390905B1 (en) 2000-03-31 2002-05-21 Speedfam-Ipec Corporation Workpiece carrier with adjustable pressure zones and barriers
USD487254S1 (en) 2002-05-24 2004-03-02 Nichia Corporation Light emitting diode
US20040149567A1 (en) 2002-12-16 2004-08-05 Alexander Kosyachkov Composite sputter target and phosphor deposition method
USD496951S1 (en) 2003-01-30 2004-10-05 Thermal Dynamics Corporation Mechanized cap for a plasma arc torch
US6815352B1 (en) 1999-11-09 2004-11-09 Shin-Etsu Chemical Co., Ltd. Silicon focus ring and method for producing the same
USD503729S1 (en) 2003-10-31 2005-04-05 Nordson Corporation Nozzle for dispensing adhesives and sealants
US20050152089A1 (en) 2003-12-26 2005-07-14 Ngk Insulators, Ltd. Electrostatic chuck and manufacturing method for the same, and alumina sintered member and manufacturing method for the same
US20050193952A1 (en) 2004-02-13 2005-09-08 Goodman Matt G. Substrate support system for reduced autodoping and backside deposition
US20070076345A1 (en) 2005-09-20 2007-04-05 Bang Won B Substrate placement determination using substrate backside pressure measurement
USD553104S1 (en) 2004-04-21 2007-10-16 Tokyo Electron Limited Absorption board for an electric chuck used in semiconductor manufacture
USD557226S1 (en) 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD559066S1 (en) 2004-10-26 2008-01-08 Jsr Corporation Polishing pad
USD559993S1 (en) 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD559994S1 (en) 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD562856S1 (en) 2006-03-30 2008-02-26 Dave Hawley Plasma gun anode
USD570310S1 (en) 2006-08-01 2008-06-03 Tokyo Electron Limited Attracting plate of an electrostatic chuck for semiconductor manufacturing
USD571383S1 (en) 2005-07-29 2008-06-17 Tokyo Electron Limited Top panel for microwave introduction window of a plasma processing apparatus
USD571831S1 (en) 2005-07-29 2008-06-24 Tokyo Electron Limited Top panel for microwave introduction window of a plasma processing apparatus
USD571833S1 (en) 2005-07-29 2008-06-24 Tokyo Electron Limited Top panel for microwave introduction window of plasma processing apparatus
USD572733S1 (en) 2005-07-29 2008-07-08 Tokyo Electron Limited Top panel for microwave introduction window of a plasma processing apparatus
US7402098B2 (en) 2006-10-27 2008-07-22 Novellus Systems, Inc. Carrier head for workpiece planarization/polishing
US20080173541A1 (en) 2007-01-22 2008-07-24 Eal Lee Target designs and related methods for reduced eddy currents, increased resistance and resistivity, and enhanced cooling
USD582949S1 (en) 2006-12-15 2008-12-16 Tokyo Electron Limited Cover for a heater stage of a plasma processing apparatus
US20080308416A1 (en) 2007-06-18 2008-12-18 Applied Materials, Inc. Sputtering target having increased life and sputtering uniformity
USD600660S1 (en) 2008-03-28 2009-09-22 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
US20090260982A1 (en) 2008-04-16 2009-10-22 Applied Materials, Inc. Wafer processing deposition shielding components
US20100096261A1 (en) 2008-10-17 2010-04-22 Applied Materials, Inc. Physical vapor deposition reactor with circularly symmetric rf feed and dc feed to the sputter target
USD614593S1 (en) 2008-07-21 2010-04-27 Asm Genitech Korea Ltd Substrate support for a semiconductor deposition apparatus
US20100108500A1 (en) 2008-10-31 2010-05-06 Applied Materials, Inc. Encapsulated sputtering target
USD616390S1 (en) 2009-03-06 2010-05-25 Tokyo Electron Limited Quartz cover for manufacturing semiconductor wafers
USD616389S1 (en) 2008-10-20 2010-05-25 Ebara Corporation Vacuum contact pad
US20100170786A1 (en) 2009-01-07 2010-07-08 Solar Applied Materials Technology Corp. Refurbished sputtering target and method for making the same
USD633452S1 (en) 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD649126S1 (en) 2008-10-20 2011-11-22 Ebara Corporation Vacuum contact pad
US20120033340A1 (en) 2010-08-06 2012-02-09 Applied Materials, Inc. Electrostatic chuck and methods of use thereof
TWD146490S (en) 2011-01-12 2012-04-21 荏原製作所股份有限公司 Elastic film for semiconductor wafer polishing
US20120263569A1 (en) * 2011-04-14 2012-10-18 Scott Wayne Priddy Substrate holders and methods of substrate mounting
USD669509S1 (en) 2011-10-19 2012-10-23 Kjellberg Stiftung, rechtsfahige Stiftung des burge rlichen Rechts Nozzle for torch
US8371904B2 (en) 2008-08-08 2013-02-12 Globalfoundries Singapore Pte. Ltd. Polishing with enhanced uniformity
US8398833B2 (en) 2008-04-21 2013-03-19 Honeywell International Inc. Use of DC magnetron sputtering systems
USD678745S1 (en) 2011-07-07 2013-03-26 Phuong Van Nguyen Spinning insert polishing pad
USD683806S1 (en) 2012-01-12 2013-06-04 Surefire, Llc Front plate for a firearm sound suppressor
USD687791S1 (en) 2012-03-20 2013-08-13 Veeco Instruments Inc. Multi-keyed wafer carrier
USD687790S1 (en) 2012-03-20 2013-08-13 Veeco Instruments Inc. Keyed wafer carrier
USD691974S1 (en) 2011-12-22 2013-10-22 Tokyo Electron Limited Holding pad for transferring a wafer
US20130316628A1 (en) 2012-05-23 2013-11-28 Samsung Electronics Co., Ltd. Flexible membranes for a polishing head
USD694790S1 (en) 2011-09-20 2013-12-03 Tokyo Electron Limited Baffle plate for manufacturing semiconductor
USD703162S1 (en) 2012-10-17 2014-04-22 Sumitomo Electric Industries, Ltd. Wafer holder for stepper
US20140261180A1 (en) 2013-03-15 2014-09-18 Applied Materials, Inc. Pvd target for self-centering process shield
USD716742S1 (en) 2013-09-13 2014-11-04 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD724553S1 (en) 2013-09-13 2015-03-17 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD732094S1 (en) 2012-07-20 2015-06-16 Ivoclar Vivadent Ag Firing plate for a dental furnace
US20150170888A1 (en) 2013-12-18 2015-06-18 Applied Materials, Inc. Physical vapor deposition (pvd) target having low friction pads
USD741921S1 (en) 2014-04-15 2015-10-27 Q-Linea Ab Positive mold for manufacturing a sample holding disc
USD741823S1 (en) 2013-07-10 2015-10-27 Hitachi Kokusai Electric Inc. Vaporizer for substrate processing apparatus
US20150357169A1 (en) * 2013-01-04 2015-12-10 Tosoh Smd, Inc. Silicon sputtering target with enhanced surface profile and improved performance and methods of making the same
US20160002788A1 (en) 2013-02-21 2016-01-07 Altatech Semiconductor Chemical vapour deposition device
US20160002776A1 (en) 2013-02-21 2016-01-07 Altatech Semiconductor Chemical vapor deposition device
US20160035547A1 (en) 2014-07-29 2016-02-04 Applied Materials, Inc. Magnetron assembly for physical vapor deposition chamber
USD750728S1 (en) 2014-12-02 2016-03-01 John K. Kremer Laser target
USD754468S1 (en) * 2013-07-23 2016-04-26 Michael F. Nason Disposable splatter shield
USD767234S1 (en) 2015-03-02 2016-09-20 Entegris, Inc. Wafer support ring
USD769200S1 (en) 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
US9475996B2 (en) 2012-10-17 2016-10-25 Richard Max Mandle Centrifugal fluid ring plasma reactor
USD770992S1 (en) 2015-06-12 2016-11-08 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
US20170009367A1 (en) * 2015-07-09 2017-01-12 Applied Materials, Inc. Wafer electroplating chuck assembly
USD790039S1 (en) 2016-04-08 2017-06-20 Applied Materials, Inc. Showerhead for a semiconductor processing chamber
USD790041S1 (en) * 2016-01-08 2017-06-20 Asm Ip Holding B.V. Gas dispersing plate for semiconductor manufacturing apparatus
USD793572S1 (en) 2015-06-10 2017-08-01 Tokyo Electron Limited Electrode plate for plasma processing apparatus
USD794753S1 (en) 2016-04-08 2017-08-15 Applied Materials, Inc. Showerhead for a semiconductor processing chamber
USD795208S1 (en) 2015-08-18 2017-08-22 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
USD796458S1 (en) 2016-01-08 2017-09-05 Asm Ip Holding B.V. Gas flow control plate for semiconductor manufacturing apparatus
USD797067S1 (en) 2015-04-21 2017-09-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD797691S1 (en) 2016-04-14 2017-09-19 Applied Materials, Inc. Composite edge ring
USD798248S1 (en) 2015-06-18 2017-09-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
CN206573738U (en) 2017-03-16 2017-10-20 江苏亨通光导新材料有限公司 Low loss fiber
USD801942S1 (en) 2015-04-16 2017-11-07 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD804230S1 (en) * 2016-06-23 2017-12-05 Cbd Consolidated Llc Bench top gripping device
USD808349S1 (en) 2013-05-15 2018-01-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD810705S1 (en) 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
USD813181S1 (en) * 2016-07-26 2018-03-20 Hitachi Kokusai Electric Inc. Cover of seal cap for reaction chamber of semiconductor
USD819580S1 (en) * 2016-04-01 2018-06-05 Veeco Instruments, Inc. Self-centering wafer carrier for chemical vapor deposition
USD830435S1 (en) 2015-12-28 2018-10-09 Ntn Corporation Inner ring for tapered roller bearing
USD830981S1 (en) * 2017-04-07 2018-10-16 Asm Ip Holding B.V. Susceptor for semiconductor substrate processing apparatus
USD836572S1 (en) 2016-09-30 2018-12-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD839224S1 (en) 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD846514S1 (en) 2018-05-03 2019-04-23 Kokusai Electric Corporation Boat of substrate processing apparatus
TWD197321S (en) 2017-12-11 2019-05-01 美商應用材料股份有限公司 Target profile for a physical vapor deposition chamber target
TWD197827S (en) 2017-12-19 2019-06-01 Ebara Corp Elastic film for semiconductor wafer polishing
USD851613S1 (en) 2017-10-05 2019-06-18 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
US10442056B2 (en) 2012-06-29 2019-10-15 Ebara Corporation Substrate holding apparatus and polishing apparatus
TWD202101S (en) 2018-03-09 2020-01-11 美商應用材料股份有限公司 Target profile for a physical vapor deposition chamber target
US10662520B2 (en) 2017-03-29 2020-05-26 Applied Materials, Inc. Method for recycling substrate process components
USD888903S1 (en) 2018-12-17 2020-06-30 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
USD891382S1 (en) 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
USD893441S1 (en) 2019-06-28 2020-08-18 Applied Materials, Inc. Base plate for a processing chamber substrate support
US10811232B2 (en) 2017-08-08 2020-10-20 Applied Materials, Inc. Multi-plate faceplate for a processing chamber
USD908645S1 (en) 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD913980S1 (en) * 2018-02-01 2021-03-23 Asm Ip Holding B.V. Gas supply plate for semiconductor manufacturing apparatus
USD913979S1 (en) * 2019-08-28 2021-03-23 Applied Materials, Inc. Inner shield for a substrate processing chamber
USD933725S1 (en) 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD933726S1 (en) 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD940765S1 (en) 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD941371S1 (en) 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
TWD223430S (en) 2021-11-25 2023-02-01 日商大王製紙股份有限公司 Bag for packaging
TWD223429S (en) 2021-11-25 2023-02-01 日商大王製紙股份有限公司 Packaging bag containing individually wrapped contents
USD984972S1 (en) * 2021-03-29 2023-05-02 Beijing Naura Microelectronics Equipment Co., Ltd. Electrostatic chuck for semiconductor manufacture

Patent Citations (135)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5320728A (en) 1990-03-30 1994-06-14 Applied Materials, Inc. Planar magnetron sputtering source producing improved coating thickness uniformity, step coverage and step coverage uniformity
USD363464S (en) 1992-08-27 1995-10-24 Tokyo Electron Yamanashi Limited Electrode for a semiconductor processing apparatus
USD351450S (en) 1993-05-19 1994-10-11 Riteflite Pty. Limited Target for shooting
USD376744S (en) 1994-08-03 1996-12-24 Gerd Eisenblatter Gmbh Support plate
USD381030S (en) * 1995-11-21 1997-07-15 Avi Tepman Sputtering target
USD395483S (en) * 1996-06-07 1998-06-23 Riteflite Pty Limited Design for a target
US6114216A (en) 1996-11-13 2000-09-05 Applied Materials, Inc. Methods for shallow trench isolation
USD423026S (en) 1997-08-20 2000-04-18 Tokyo Electron Limited Quartz cover
USD425919S (en) * 1997-11-14 2000-05-30 Applied Materials, Inc. Electrostatic chuck with improved spacing mask and workpiece detection device
US6086725A (en) 1998-04-02 2000-07-11 Applied Materials, Inc. Target for use in magnetron sputtering of nickel for forming metallization films having consistent uniformity through life
US6815352B1 (en) 1999-11-09 2004-11-09 Shin-Etsu Chemical Co., Ltd. Silicon focus ring and method for producing the same
US6390905B1 (en) 2000-03-31 2002-05-21 Speedfam-Ipec Corporation Workpiece carrier with adjustable pressure zones and barriers
US6659850B2 (en) 2000-03-31 2003-12-09 Speedfam-Ipec Corporation Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
USD446231S1 (en) 2000-08-21 2001-08-07 Komatsu Industries Corporation Nozzle for a plasma arc torch
USD487254S1 (en) 2002-05-24 2004-03-02 Nichia Corporation Light emitting diode
US20040149567A1 (en) 2002-12-16 2004-08-05 Alexander Kosyachkov Composite sputter target and phosphor deposition method
USD496951S1 (en) 2003-01-30 2004-10-05 Thermal Dynamics Corporation Mechanized cap for a plasma arc torch
USD503729S1 (en) 2003-10-31 2005-04-05 Nordson Corporation Nozzle for dispensing adhesives and sealants
US20050152089A1 (en) 2003-12-26 2005-07-14 Ngk Insulators, Ltd. Electrostatic chuck and manufacturing method for the same, and alumina sintered member and manufacturing method for the same
US20050193952A1 (en) 2004-02-13 2005-09-08 Goodman Matt G. Substrate support system for reduced autodoping and backside deposition
USD553104S1 (en) 2004-04-21 2007-10-16 Tokyo Electron Limited Absorption board for an electric chuck used in semiconductor manufacture
USD592030S1 (en) 2004-10-26 2009-05-12 Jsr Corporation Polishing pad
USD584591S1 (en) 2004-10-26 2009-01-13 Jsr Corporation Polishing pad
USD559066S1 (en) 2004-10-26 2008-01-08 Jsr Corporation Polishing pad
USD600989S1 (en) 2004-10-26 2009-09-29 Jsr Corporation Polishing pad
USD592029S1 (en) 2004-10-26 2009-05-12 Jsr Corporation Polishing pad
USD559993S1 (en) 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD559994S1 (en) 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD571383S1 (en) 2005-07-29 2008-06-17 Tokyo Electron Limited Top panel for microwave introduction window of a plasma processing apparatus
USD571833S1 (en) 2005-07-29 2008-06-24 Tokyo Electron Limited Top panel for microwave introduction window of plasma processing apparatus
USD572733S1 (en) 2005-07-29 2008-07-08 Tokyo Electron Limited Top panel for microwave introduction window of a plasma processing apparatus
USD571831S1 (en) 2005-07-29 2008-06-24 Tokyo Electron Limited Top panel for microwave introduction window of a plasma processing apparatus
USD557226S1 (en) 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
US20070076345A1 (en) 2005-09-20 2007-04-05 Bang Won B Substrate placement determination using substrate backside pressure measurement
USD562856S1 (en) 2006-03-30 2008-02-26 Dave Hawley Plasma gun anode
USD570310S1 (en) 2006-08-01 2008-06-03 Tokyo Electron Limited Attracting plate of an electrostatic chuck for semiconductor manufacturing
US7402098B2 (en) 2006-10-27 2008-07-22 Novellus Systems, Inc. Carrier head for workpiece planarization/polishing
USD582949S1 (en) 2006-12-15 2008-12-16 Tokyo Electron Limited Cover for a heater stage of a plasma processing apparatus
US20080173541A1 (en) 2007-01-22 2008-07-24 Eal Lee Target designs and related methods for reduced eddy currents, increased resistance and resistivity, and enhanced cooling
US20080308416A1 (en) 2007-06-18 2008-12-18 Applied Materials, Inc. Sputtering target having increased life and sputtering uniformity
USD600660S1 (en) 2008-03-28 2009-09-22 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
US20090260982A1 (en) 2008-04-16 2009-10-22 Applied Materials, Inc. Wafer processing deposition shielding components
US8398833B2 (en) 2008-04-21 2013-03-19 Honeywell International Inc. Use of DC magnetron sputtering systems
USD614593S1 (en) 2008-07-21 2010-04-27 Asm Genitech Korea Ltd Substrate support for a semiconductor deposition apparatus
US8371904B2 (en) 2008-08-08 2013-02-12 Globalfoundries Singapore Pte. Ltd. Polishing with enhanced uniformity
US20100096261A1 (en) 2008-10-17 2010-04-22 Applied Materials, Inc. Physical vapor deposition reactor with circularly symmetric rf feed and dc feed to the sputter target
USD616389S1 (en) 2008-10-20 2010-05-25 Ebara Corporation Vacuum contact pad
USD649126S1 (en) 2008-10-20 2011-11-22 Ebara Corporation Vacuum contact pad
US20100108500A1 (en) 2008-10-31 2010-05-06 Applied Materials, Inc. Encapsulated sputtering target
US20100170786A1 (en) 2009-01-07 2010-07-08 Solar Applied Materials Technology Corp. Refurbished sputtering target and method for making the same
USD616390S1 (en) 2009-03-06 2010-05-25 Tokyo Electron Limited Quartz cover for manufacturing semiconductor wafers
USD633452S1 (en) 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
US20120033340A1 (en) 2010-08-06 2012-02-09 Applied Materials, Inc. Electrostatic chuck and methods of use thereof
TWD146490S (en) 2011-01-12 2012-04-21 荏原製作所股份有限公司 Elastic film for semiconductor wafer polishing
US20120263569A1 (en) * 2011-04-14 2012-10-18 Scott Wayne Priddy Substrate holders and methods of substrate mounting
USD678745S1 (en) 2011-07-07 2013-03-26 Phuong Van Nguyen Spinning insert polishing pad
USD694790S1 (en) 2011-09-20 2013-12-03 Tokyo Electron Limited Baffle plate for manufacturing semiconductor
USD669509S1 (en) 2011-10-19 2012-10-23 Kjellberg Stiftung, rechtsfahige Stiftung des burge rlichen Rechts Nozzle for torch
USD691974S1 (en) 2011-12-22 2013-10-22 Tokyo Electron Limited Holding pad for transferring a wafer
USD683806S1 (en) 2012-01-12 2013-06-04 Surefire, Llc Front plate for a firearm sound suppressor
USD687791S1 (en) 2012-03-20 2013-08-13 Veeco Instruments Inc. Multi-keyed wafer carrier
USD687790S1 (en) 2012-03-20 2013-08-13 Veeco Instruments Inc. Keyed wafer carrier
US20130316628A1 (en) 2012-05-23 2013-11-28 Samsung Electronics Co., Ltd. Flexible membranes for a polishing head
US10442056B2 (en) 2012-06-29 2019-10-15 Ebara Corporation Substrate holding apparatus and polishing apparatus
USD732094S1 (en) 2012-07-20 2015-06-16 Ivoclar Vivadent Ag Firing plate for a dental furnace
US9475996B2 (en) 2012-10-17 2016-10-25 Richard Max Mandle Centrifugal fluid ring plasma reactor
USD703162S1 (en) 2012-10-17 2014-04-22 Sumitomo Electric Industries, Ltd. Wafer holder for stepper
US20150357169A1 (en) * 2013-01-04 2015-12-10 Tosoh Smd, Inc. Silicon sputtering target with enhanced surface profile and improved performance and methods of making the same
US20160002788A1 (en) 2013-02-21 2016-01-07 Altatech Semiconductor Chemical vapour deposition device
US20160002776A1 (en) 2013-02-21 2016-01-07 Altatech Semiconductor Chemical vapor deposition device
US20140261180A1 (en) 2013-03-15 2014-09-18 Applied Materials, Inc. Pvd target for self-centering process shield
USD808349S1 (en) 2013-05-15 2018-01-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD769200S1 (en) 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD741823S1 (en) 2013-07-10 2015-10-27 Hitachi Kokusai Electric Inc. Vaporizer for substrate processing apparatus
USD754468S1 (en) * 2013-07-23 2016-04-26 Michael F. Nason Disposable splatter shield
USD716742S1 (en) 2013-09-13 2014-11-04 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD724553S1 (en) 2013-09-13 2015-03-17 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
US20150170888A1 (en) 2013-12-18 2015-06-18 Applied Materials, Inc. Physical vapor deposition (pvd) target having low friction pads
USD741921S1 (en) 2014-04-15 2015-10-27 Q-Linea Ab Positive mold for manufacturing a sample holding disc
US20160035547A1 (en) 2014-07-29 2016-02-04 Applied Materials, Inc. Magnetron assembly for physical vapor deposition chamber
USD750728S1 (en) 2014-12-02 2016-03-01 John K. Kremer Laser target
USD767234S1 (en) 2015-03-02 2016-09-20 Entegris, Inc. Wafer support ring
USD801942S1 (en) 2015-04-16 2017-11-07 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD837755S1 (en) 2015-04-16 2019-01-08 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD797067S1 (en) 2015-04-21 2017-09-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD825504S1 (en) 2015-04-21 2018-08-14 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD793572S1 (en) 2015-06-10 2017-08-01 Tokyo Electron Limited Electrode plate for plasma processing apparatus
USD770992S1 (en) 2015-06-12 2016-11-08 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD825505S1 (en) 2015-06-18 2018-08-14 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD798248S1 (en) 2015-06-18 2017-09-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
US20170009367A1 (en) * 2015-07-09 2017-01-12 Applied Materials, Inc. Wafer electroplating chuck assembly
USD795208S1 (en) 2015-08-18 2017-08-22 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
USD830435S1 (en) 2015-12-28 2018-10-09 Ntn Corporation Inner ring for tapered roller bearing
USD790041S1 (en) * 2016-01-08 2017-06-20 Asm Ip Holding B.V. Gas dispersing plate for semiconductor manufacturing apparatus
USD796458S1 (en) 2016-01-08 2017-09-05 Asm Ip Holding B.V. Gas flow control plate for semiconductor manufacturing apparatus
USD810705S1 (en) 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
USD819580S1 (en) * 2016-04-01 2018-06-05 Veeco Instruments, Inc. Self-centering wafer carrier for chemical vapor deposition
USD794753S1 (en) 2016-04-08 2017-08-15 Applied Materials, Inc. Showerhead for a semiconductor processing chamber
USD790039S1 (en) 2016-04-08 2017-06-20 Applied Materials, Inc. Showerhead for a semiconductor processing chamber
USD797691S1 (en) 2016-04-14 2017-09-19 Applied Materials, Inc. Composite edge ring
USD804230S1 (en) * 2016-06-23 2017-12-05 Cbd Consolidated Llc Bench top gripping device
USD813181S1 (en) * 2016-07-26 2018-03-20 Hitachi Kokusai Electric Inc. Cover of seal cap for reaction chamber of semiconductor
USD869409S1 (en) * 2016-09-30 2019-12-10 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD836572S1 (en) 2016-09-30 2018-12-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD839224S1 (en) 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
CN206573738U (en) 2017-03-16 2017-10-20 江苏亨通光导新材料有限公司 Low loss fiber
US10662520B2 (en) 2017-03-29 2020-05-26 Applied Materials, Inc. Method for recycling substrate process components
USD830981S1 (en) * 2017-04-07 2018-10-16 Asm Ip Holding B.V. Susceptor for semiconductor substrate processing apparatus
US10811232B2 (en) 2017-08-08 2020-10-20 Applied Materials, Inc. Multi-plate faceplate for a processing chamber
USD894137S1 (en) 2017-10-05 2020-08-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD851613S1 (en) 2017-10-05 2019-06-18 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
TWD197321S (en) 2017-12-11 2019-05-01 美商應用材料股份有限公司 Target profile for a physical vapor deposition chamber target
USD868124S1 (en) * 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD946638S1 (en) 2017-12-11 2022-03-22 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
TWD197827S (en) 2017-12-19 2019-06-01 Ebara Corp Elastic film for semiconductor wafer polishing
USD913980S1 (en) * 2018-02-01 2021-03-23 Asm Ip Holding B.V. Gas supply plate for semiconductor manufacturing apparatus
TWD202101S (en) 2018-03-09 2020-01-11 美商應用材料股份有限公司 Target profile for a physical vapor deposition chamber target
USD902165S1 (en) 2018-03-09 2020-11-17 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD877101S1 (en) 2018-03-09 2020-03-03 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD846514S1 (en) 2018-05-03 2019-04-23 Kokusai Electric Corporation Boat of substrate processing apparatus
USD888903S1 (en) 2018-12-17 2020-06-30 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
USD933725S1 (en) 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD891382S1 (en) 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
USD893441S1 (en) 2019-06-28 2020-08-18 Applied Materials, Inc. Base plate for a processing chamber substrate support
USD908645S1 (en) 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD913979S1 (en) * 2019-08-28 2021-03-23 Applied Materials, Inc. Inner shield for a substrate processing chamber
USD941371S1 (en) 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD970566S1 (en) * 2020-03-23 2022-11-22 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD933726S1 (en) 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
USD940765S1 (en) 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD966357S1 (en) * 2020-12-02 2022-10-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD984972S1 (en) * 2021-03-29 2023-05-02 Beijing Naura Microelectronics Equipment Co., Ltd. Electrostatic chuck for semiconductor manufacture
TWD223430S (en) 2021-11-25 2023-02-01 日商大王製紙股份有限公司 Bag for packaging
TWD223429S (en) 2021-11-25 2023-02-01 日商大王製紙股份有限公司 Packaging bag containing individually wrapped contents

Non-Patent Citations (6)

* Cited by examiner, † Cited by third party
Title
Search Report for Taiwan Design Application No. 106301373 dated Jun. 20, 2017.
Search Report for Taiwan Design Application No. 107305358 dated Feb. 21, 2019.
Search Report for Taiwan Design Application No. 1077303086 dated Jul. 6, 2018.
Search Report for Taiwan Design Application No. 110302622 dated May 21, 2021.
Sputtering Targets for LSis, posted at JX Nippon Mining & Metals, posting date Mar. 22, 2016. Site visited Apr. 1, 2019. URL: <https://web .archive .org/web/20160322055046/http :1/www.nmm.jx-group.co.jp/english/products/04_supa/target_adv.html> (Year: 2016).
Sputtering Targets, posted at Angstrom Sciences, posting date May 5, 2016. Site visited Apr. 1, 2019. URL: <https://web.archive.org/web/20160505015447/https://www.angstromsciences.com/sputtering-targets> (Year: 2016).

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1072774S1 (en) * 2021-02-06 2025-04-29 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1071886S1 (en) * 2022-01-20 2025-04-22 Applied Materials, Inc. Substrate support for a substrate processing chamber
USD1071103S1 (en) * 2022-04-11 2025-04-15 Applied Materials, Inc. Gas distribution plate
USD1053230S1 (en) * 2022-05-19 2024-12-03 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD1037778S1 (en) * 2022-07-19 2024-08-06 Applied Materials, Inc. Gas distribution plate
USD1086087S1 (en) * 2023-03-30 2025-07-29 Samsung Electronics Co., Ltd. CMP (chemical mechanical planarization) retaining ring

Also Published As

Publication number Publication date
JP1718363S (en) 2022-06-28
TWD226530S (en) 2023-07-21
JP1730204S (en) 2022-11-18
TWD237732S (en) 2025-04-21

Similar Documents

Publication Publication Date Title
USD966357S1 (en) Target profile for a physical vapor deposition chamber target
USD937329S1 (en) Sputter target for a physical vapor deposition chamber
USD1007449S1 (en) Target profile for a physical vapor deposition chamber target
USD1053230S1 (en) Sputter target for a physical vapor deposition chamber
USD908645S1 (en) Sputtering target for a physical vapor deposition chamber
USD946638S1 (en) Target profile for a physical vapor deposition chamber target
USD902165S1 (en) Target profile for a physical vapor deposition chamber target
USD888590S1 (en) Food thermometer
USD941372S1 (en) Process shield for a substrate processing chamber
USD941371S1 (en) Process shield for a substrate processing chamber
USD981168S1 (en) Oven cooking
USD942516S1 (en) Process shield for a substrate processing chamber
USD998575S1 (en) Collimator for use in a physical vapor deposition (PVD) chamber
USD906140S1 (en) Food thermometer
USD1051867S1 (en) Confinement liner for a substrate processing chamber
USD946440S1 (en) Tracker
USD997111S1 (en) Collimator for use in a physical vapor deposition (PVD) chamber
USD943539S1 (en) Confinement plate for a substrate processing chamber
USD923134S1 (en) Shooting shelf
USD1042357S1 (en) Anti pinching contact
USD1036279S1 (en) Food thermometer
USD1026054S1 (en) Collimator for a physical vapor deposition (PVD) chamber
USD1021603S1 (en) Cabinet knob
USD1038901S1 (en) Collimator for a physical vapor deposition chamber
USD960207S1 (en) Refrigerator

Legal Events

Date Code Title Description
FEPP Fee payment procedure

Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY