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USD1059312S1 - Deposition ring of a process kit for semiconductor substrate processing - Google Patents

Deposition ring of a process kit for semiconductor substrate processing Download PDF

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Publication number
USD1059312S1
USD1059312S1 US29/848,747 US202229848747F USD1059312S US D1059312 S1 USD1059312 S1 US D1059312S1 US 202229848747 F US202229848747 F US 202229848747F US D1059312 S USD1059312 S US D1059312S
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United States
Prior art keywords
semiconductor substrate
substrate processing
process kit
deposition ring
deposition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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US29/848,747
Inventor
Abhishek Chowdhury
Nataraj BHASKAR RAO
Edwin C. Suarez
Harisha SATHYANARAYANA
Diego Ramiro PUENTE SOTOMAYOR
Qanit Takmeel
Mohammad Kamruzzaman CHOWDHURY
Arun Chakravarthy Chakravarthy
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Applied Materials Inc
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Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to US29/848,747 priority Critical patent/USD1059312S1/en
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SATHYANARAYANA, HARISHA, BHASKAR RAO, NATARAJ, SUAREZ, EDWIN C., TAKMEEL, QANIT, Chowdhury, Abhishek, CHAKRAVARTHY, ARUN CHAKRAVARTHY, CHOWDHURY, Mohammad Kamruzzaman, PUENTE SOTOMAYOR, DIEGO RAMIRO
Priority to TW112300401F priority patent/TWD228654S/en
Priority to JP2023002018F priority patent/JP1747664S/en
Application granted granted Critical
Publication of USD1059312S1 publication Critical patent/USD1059312S1/en
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Description

FIG. 1 is a top isometric view of a deposition ring of a process kit for semiconductor substrate processing, according to the novel design.
FIG. 2 is a bottom isometric view thereof.
FIG. 3 is a top plan view thereof.
FIG. 4 is a bottom plan view thereof.
FIG. 5 is a left elevation view thereof, enlarged to more clearly show details.
FIG. 6 is a right elevation view thereof, enlarged to more clearly show details.
FIG. 7 is a back elevation view thereof, enlarged to more clearly show details; and,
FIG. 8 is a front elevation view thereof, enlarged to more clearly show details.

Claims (1)

    CLAIM
  1. The ornamental design for a deposition ring of a process kit for semiconductor substrate processing, as shown and described.
US29/848,747 2022-08-04 2022-08-04 Deposition ring of a process kit for semiconductor substrate processing Active USD1059312S1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US29/848,747 USD1059312S1 (en) 2022-08-04 2022-08-04 Deposition ring of a process kit for semiconductor substrate processing
TW112300401F TWD228654S (en) 2022-08-04 2023-02-01 Deposition ring of a process kit for semiconductor substrate processing
JP2023002018F JP1747664S (en) 2022-08-04 2023-02-06 Deposition ring in process kit for semiconductor substrate processing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/848,747 USD1059312S1 (en) 2022-08-04 2022-08-04 Deposition ring of a process kit for semiconductor substrate processing

Publications (1)

Publication Number Publication Date
USD1059312S1 true USD1059312S1 (en) 2025-01-28

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US29/848,747 Active USD1059312S1 (en) 2022-08-04 2022-08-04 Deposition ring of a process kit for semiconductor substrate processing

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US (1) USD1059312S1 (en)
JP (1) JP1747664S (en)
TW (1) TWD228654S (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1082730S1 (en) * 2023-01-11 2025-07-08 Nuflare Technology, Inc. Cover base for susceptors
USD1086087S1 (en) * 2023-03-30 2025-07-29 Samsung Electronics Co., Ltd. CMP (chemical mechanical planarization) retaining ring

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1064005S1 (en) 2022-08-04 2025-02-25 Applied Materials, Inc. Grounding ring of a process kit for semiconductor substrate processing
USD1069863S1 (en) * 2022-08-04 2025-04-08 Applied Materials, Inc. Deposition ring of a process kit for semiconductor substrate processing

Citations (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090050272A1 (en) * 2007-08-24 2009-02-26 Applied Materials, Inc. Deposition ring and cover ring to extend process components life and performance for process chambers
KR20090064113A (en) 2007-12-15 2009-06-18 주식회사 동부하이텍 Wafer lifting device and wafer dechucking method using the same
US20120042825A1 (en) * 2010-08-20 2012-02-23 Applied Materials, Inc. Extended life deposition ring
US20120103257A1 (en) * 2010-10-29 2012-05-03 Applied Materials, Inc. Deposition ring and electrostatic chuck for physical vapor deposition chamber
US20130055952A1 (en) * 2011-03-11 2013-03-07 Applied Materials, Inc. Reflective deposition rings and substrate processing chambers incorporting same
US8485128B2 (en) 2010-06-30 2013-07-16 Lam Research Corporation Movable ground ring for a plasma processing chamber
US20130206070A1 (en) * 2012-02-10 2013-08-15 Well Thin Technology, Ltd. Deposition ring
US20140262763A1 (en) 2013-03-14 2014-09-18 Applied Materials, Inc. Selectively groundable cover ring for substrate process chambers
US20160322250A1 (en) 2014-05-15 2016-11-03 Infineon Technologies Ag Wafer Releasing
US20170002461A1 (en) * 2015-07-03 2017-01-05 Applied Materials, Inc. Process kit having tall deposition ring and deposition ring clamp
US9818585B2 (en) 2009-02-27 2017-11-14 Applied Materials, Inc. In situ plasma clean for removal of residue from pedestal surface without breaking vacuum
USD812014S1 (en) * 2015-07-30 2018-03-06 Japan Aviation Electronics Industry, Limited Ring for holding the connections of the connectors
US20190259647A1 (en) * 2018-02-17 2019-08-22 Applied Materials, Inc. Deposition ring for processing reduced size substrates
US20190259635A1 (en) * 2018-02-17 2019-08-22 Applied Materials, Inc. Process kit for processing reduced sized substrates
US20200194243A1 (en) * 2018-12-17 2020-06-18 Applied Materials, Inc. Process kit having tall deposition ring for pvd chamber
USD888903S1 (en) * 2018-12-17 2020-06-30 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
US20200234928A1 (en) 2019-01-17 2020-07-23 Applied Materials, Inc. Semiconductor plasma processing equipment with wafer edge plasma sheath tuning ability
TWD211225S (en) 2019-08-22 2021-05-01 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 Exhaust duct
USD933725S1 (en) * 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD933726S1 (en) * 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
USD934315S1 (en) * 2020-03-20 2021-10-26 Applied Materials, Inc. Deposition ring for a substrate processing chamber
TWD217060S (en) 2020-06-02 2022-02-11 美商應用材料股份有限公司 Enclosure system shelf of a substrate processing system
US20220157572A1 (en) * 2020-11-18 2022-05-19 Applied Materials, Inc. Deposition ring for thin substrate handling via edge clamping
US20220165551A1 (en) 2020-11-23 2022-05-26 Advanced Micro-Fabrication Equipment Inc. China Bottom electrode assembly, plasma processing apparatus, and method of replacing focus ring
US20220344134A1 (en) * 2018-01-19 2022-10-27 Applied Materials, Inc. Process kit for a substrate support
US20220406573A1 (en) * 2021-06-18 2022-12-22 Applied Materials, Inc. Process kit having tall deposition ring and smaller diameter electrostatic chuck (esc) for pvd chamber

Patent Citations (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090050272A1 (en) * 2007-08-24 2009-02-26 Applied Materials, Inc. Deposition ring and cover ring to extend process components life and performance for process chambers
KR20090064113A (en) 2007-12-15 2009-06-18 주식회사 동부하이텍 Wafer lifting device and wafer dechucking method using the same
US9818585B2 (en) 2009-02-27 2017-11-14 Applied Materials, Inc. In situ plasma clean for removal of residue from pedestal surface without breaking vacuum
US8485128B2 (en) 2010-06-30 2013-07-16 Lam Research Corporation Movable ground ring for a plasma processing chamber
US20120042825A1 (en) * 2010-08-20 2012-02-23 Applied Materials, Inc. Extended life deposition ring
US20120103257A1 (en) * 2010-10-29 2012-05-03 Applied Materials, Inc. Deposition ring and electrostatic chuck for physical vapor deposition chamber
US20130055952A1 (en) * 2011-03-11 2013-03-07 Applied Materials, Inc. Reflective deposition rings and substrate processing chambers incorporting same
US20130206070A1 (en) * 2012-02-10 2013-08-15 Well Thin Technology, Ltd. Deposition ring
US20140262763A1 (en) 2013-03-14 2014-09-18 Applied Materials, Inc. Selectively groundable cover ring for substrate process chambers
US20160322250A1 (en) 2014-05-15 2016-11-03 Infineon Technologies Ag Wafer Releasing
US20170002461A1 (en) * 2015-07-03 2017-01-05 Applied Materials, Inc. Process kit having tall deposition ring and deposition ring clamp
USD812014S1 (en) * 2015-07-30 2018-03-06 Japan Aviation Electronics Industry, Limited Ring for holding the connections of the connectors
US20220344134A1 (en) * 2018-01-19 2022-10-27 Applied Materials, Inc. Process kit for a substrate support
US20190259647A1 (en) * 2018-02-17 2019-08-22 Applied Materials, Inc. Deposition ring for processing reduced size substrates
US20190259635A1 (en) * 2018-02-17 2019-08-22 Applied Materials, Inc. Process kit for processing reduced sized substrates
US20200194243A1 (en) * 2018-12-17 2020-06-18 Applied Materials, Inc. Process kit having tall deposition ring for pvd chamber
USD888903S1 (en) * 2018-12-17 2020-06-30 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
US20200234928A1 (en) 2019-01-17 2020-07-23 Applied Materials, Inc. Semiconductor plasma processing equipment with wafer edge plasma sheath tuning ability
USD933725S1 (en) * 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
TWD211225S (en) 2019-08-22 2021-05-01 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 Exhaust duct
USD934315S1 (en) * 2020-03-20 2021-10-26 Applied Materials, Inc. Deposition ring for a substrate processing chamber
TWD217060S (en) 2020-06-02 2022-02-11 美商應用材料股份有限公司 Enclosure system shelf of a substrate processing system
USD933726S1 (en) * 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
US20220157572A1 (en) * 2020-11-18 2022-05-19 Applied Materials, Inc. Deposition ring for thin substrate handling via edge clamping
US20220165551A1 (en) 2020-11-23 2022-05-26 Advanced Micro-Fabrication Equipment Inc. China Bottom electrode assembly, plasma processing apparatus, and method of replacing focus ring
US20220406573A1 (en) * 2021-06-18 2022-12-22 Applied Materials, Inc. Process kit having tall deposition ring and smaller diameter electrostatic chuck (esc) for pvd chamber

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PCT International Search Report and Written Opinion for PCT/US2023/027370 dated Oct. 30, 2023.

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1082730S1 (en) * 2023-01-11 2025-07-08 Nuflare Technology, Inc. Cover base for susceptors
USD1086087S1 (en) * 2023-03-30 2025-07-29 Samsung Electronics Co., Ltd. CMP (chemical mechanical planarization) retaining ring

Also Published As

Publication number Publication date
TWD228654S (en) 2023-11-21
JP1747664S (en) 2023-06-29

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