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WO1989005570A1 - Substrat de montage pour support de puce ceramique sans fil - Google Patents

Substrat de montage pour support de puce ceramique sans fil Download PDF

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Publication number
WO1989005570A1
WO1989005570A1 PCT/US1988/004318 US8804318W WO8905570A1 WO 1989005570 A1 WO1989005570 A1 WO 1989005570A1 US 8804318 W US8804318 W US 8804318W WO 8905570 A1 WO8905570 A1 WO 8905570A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive
socket
ceramic substrate
conductive pads
substrate means
Prior art date
Application number
PCT/US1988/004318
Other languages
English (en)
Inventor
Jorge M. Hernandez
Original Assignee
Rogers Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rogers Corporation filed Critical Rogers Corporation
Publication of WO1989005570A1 publication Critical patent/WO1989005570A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1031—Surface mounted metallic connector elements
    • H05K2201/10318—Surface mounted metallic pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10386—Clip leads; Terminals gripping the edge of a substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Definitions

  • This invention relates generally to surface mounted leadless ceramic chip carriers. More particularly, this invention relates to a socket for a surface mo ⁇ nted leadless chip carrier comprised of a ceramic material and incorporating therein at least one capacitive element for providing noise decoupling.
  • ceramic leadless chip carriers are surface mounted on printed wiring boards typically made of an epoxy glass laminate material. It is also well known that one of the most severe problems in using ceramic leadless chip carriers on surface mounted PC boards has been the large difference in the coefficient of thermal expansion between the ceramic material of the leadless IC package and the epoxy-glass laminate material of the PC board. That difference produces excessive stresses on the solder joints which connect the chip carrier to the PC board when the assembly goes through temperature excursions. As a result, the soldered joints develop fatigue and eventually crack in a catastrophic manner. This is obviously a severe reliability problem. Two common solutions have been developed for this problem. The first solution tries to match the coefficient of thermal expansion of the PC board to that of the ceramic chip carrier by adding a metal core inside the PC board.
  • the metal core is made of copper clad Invar alloy.
  • this solution makes the PC board heavier and more expensive.
  • this solution has other complications, such as the board becoming more like a heat sink, which makes the removal of heat from the Invar core difficult. In general, this is detrimental to the reliability of the PC board assembly.
  • a second typical solution is the use of plastic molded sockets, with "J” or “Gull-Wing” shaped leads for solder surface mounted attachment to the PC board and a cavity with contacts on top, in a cavity configuration, to receive the chip carrier.
  • means are provided to secure the chip carrier inside the socket cavity.
  • the complexity and tolerances required for the installed socket makes it very costly.
  • the socket is bulky, taking more board space than the chip carrier itself. This is a disadvantage which can be serious for those applications where board area is at a premium.
  • a socket for a leadless ceramic chip carrier is comprised of a ceramic material which is preferably substantially identical to the ceramic material composing the leadless chip carrier (typically alumina) .
  • the use of the ceramic socket of the present invention provides an essentially exact match between the coefficients of thermal expansion of the chip carrier and the socket and thereby eliminates the problems of the prior art regarding catastrophic failure of the solder joints.
  • FIGURE 1 is a perspective plan view of a ceramic socket for use in conjunction with a leadless chip carrier in accordance with a first embodiment of the present invention
  • FIGURE 2 is a bottom perspective view of the socket of FIGURE 1;
  • FIGURE 3 is an enlarged view, partly in cross section, of a contact pin from the socket of FIGURES 1 and 2;
  • FIGURE 4 is a side view showing the ceramic socket of FIGURE 1 in a subassembly with a leadless ceramic chip carrier and a printed wiring board; -
  • FIGURE 5 is a perspective plan view of a ceramic socket for a leadless chip carrier in accordance with a second embodiment of the present invention
  • FIGURE 6 is a bottom perspective view of the ceramic socket of FIGURE 5;
  • FIGURE 7 is an enlarged cross-sectional elevation view along the line 7-7 of FIGURE 5;
  • FIGURE 8 is an enlarged cross-sectonal elevation view along the line 8-8 of FIGURE 6;
  • FIGURE 9 is a side elevation view of the ceramic socket of FIGURE 5 is a subassembly with a leadless ceramic chip carrier and a printed wiring board;
  • FIGURE 10 is a perspective plan view of a ceramic socket in conjunction with a leadless chip carrier in accordance with a third embodiment of the present invention.
  • FIGURE 11 is a bottom perspective view of the ceramic socket of FIGURE 10;
  • FIGURE 12 is an enlarged cross-sectional elevation view along the line 12-12 of FIGURE 11;
  • FIGURE 13 is a side elevation view of the ceramic socket of FIGURE 10 in a subassembly with a leadless ceramic chip carrier and a printed wiring ' board;
  • FIGURE 14 is a side elevation view of a ceramic socket similar to the ceramic socket of FIGURE 1, but adapted for through-hole mounting;
  • FIGURE 15 is an enlarged side elevation view partly in cross-section, of a portion of the subassembly shown in FIGURE 14.
  • Socket 10 includes a substantially rectangular or square substrate 12 comprised of a suitable ceramic material which is typically alumina.
  • Substrate 12 includes a top surface 14 and a bottom surface 16.
  • Top surface 14 has an array of holes 18 drilled therethrough along the four side edges thereof. Each hole is filled with a conductive material such as conductive ink to define a plurality of vias.
  • Top surface 14 additionally includes a plurality of conductive pads 22 printed thereon in locations corresponding to conductive vias 20. Conductive pads 22 are adapted to receive and electrically connect with castellations of a well know leadless ceramic chip carrier (see FIGURE 4).
  • conductive pads may be printed on top surface 14 using any known and conventional printing means and any known and conventional conductive ink such as silver palladium (Ag-Pd) , or tungsten conductive inks.
  • the bottom surface 16 of ceramic substrate 12 includes a plurality of contact pins 24 which are mechanically and electrically connected to a corresponding via using any suitable conductive adhesive or solder.
  • each pin 24 includes a flat head 25 which contacts bottom surface 16.
  • an electrical bridge is formed by each via 20 electrically interconnecting conductive pads 22 to conductive pins 24.
  • pins 24 are relatively short and thick cylindrical pins which provide for low inductance. This pin configuration will also comply to the stress caused by thermal excursions.
  • the pins have a length of between about 0.025" and 0.040" and a diameter of between about 0.030" and 0.050".
  • lower surface 16 of substrate 12 includes a pair of opposed and spaced conductive pads 26 and 28.
  • Each pad 26 and 28 will be electrically connected to at least one of the conductive pins 24.
  • conductive pad 26 is electrically connected to conductive pin 24* while conductive pad 28 is electrically connected to conductive pin 24".
  • Conductive pads 26 and 28 preferably have a diverging configuration with respect to pins 24 and terminate along a relatively wide perimeter. It will be appreciated that the use of such wide conductive pads leads to low inductance. At least one decoupling capacitive element electrically communicates between pads 26 and 28.
  • this decoupling capacitive element comprises a known multilayer capacitive element of the type having a pair of opposed end terminations between interleaved layers of metallization and ceramic with alternating metallized layers connected to the end terminations, such as shown in U.S. Patent No. 4,584,627, assigned to the assignee hereof, all of the contents of which are incorporated herein by reference.
  • two multilayer ceramic decoupling capacitors 30 and 32 have been provided onto bottom surface 16. It will be appreciated that the respective conductive end terminations of each capacitive element 30, 32 are electrically connected to respective pads 26 and 28 using solder or some other suitable electrical adhesive material 33.
  • each socket 10 will be tailored to have a configuration of conductive pins 24 in contact with pads 26 and 28 which correspond to the particular power and ground configuration of a selected LCCC.
  • FIGURE 4 a subassembly of the ceramic socket 10 of FIGURE 1, a leadless ceramic chip carrier 34 and a printed wiring board 36 is shown.
  • leadless chip carrier 34 is comprised of a ceramic material and has a substantially rectangular or square configuration.
  • LCCC 34 Along the four sides of LCCC 34 are a plurality of conductive castellations 38 which electrically connect to an integrated circuit chip within the LCCC in a well known fashion.
  • the castellations 38 of LCCC 34 are electrically connected to corresponding conductive pads 22 on the top surface 14 of socket 10 using solder or other conductive adhesive material.
  • the power and ground castellations 38 of LCCC 34 will be electrically connected to those surface pads 22 (in this case pads 22' and 22") which electrically connect to conductive pins 24 (in this case pins 24' and 24") communicating with lower conductive pads 26 and 28.
  • Conductive pins 24 in turn are soldered or otherwise adhesively connected to surface pads 40 located on a conventional printed circuit board 36. Note that the length of conductive pins 24 must be enough so as to provide sufficient spacing for the decoupling capacitive elements 30 and 32.
  • the leadless ceramic chip carrier socket 10 of FIGURES 1-4 thus defines a decoupling ceramic socket means.
  • socket 40 is comprised of a block 42 of ceramic material such as alumina and includes an upper surface 44 having a pluralityOf conductive pads 46 arranged along the perimeter thereof and a lower surface 48 having a pair of opposed and spaced conductive pads 50 and 52 which are electrically interconnected by at least one (and in this case two) decoupling capacitor elements, preferably multilayer ceramic decoupling capacitor elements 54 and 56.
  • the FIGURE 5 embodiment of the present invention substantially differs from the FIGURE 1 embodiment in the way in which upper conductive pads 46 are electrically connected to the bottom surface 48 of ceramic substrate 42.
  • a plurality of conductive J-shaped leads 58 are used to electrically interconnect top surface 44 to bottom surface 48.
  • the J-shaped leads 58 may be comprised of any suitable conductive metal such as copper. It will be appreciated that the use of a conductive metal will impart a compliant spring action to leads 58.
  • two different types of leads are utilized. The majority of leads 58 will be of the type shown in FIGURE 7 wherein the lead is mechanically and electrically connected (via solder or other conductive adhesive) to a conductive mounting pad 46.
  • the bottom end of lead 58 terminates at a flattened section 60 which is adapted for surface mounting on a mounting pad of a printed wiring board.
  • FIGURE 8 A second configuration of lead 58 is shown in FIGURE 8 at 58'.
  • Lead 58' is utilized in those locations where it is necessary to interconnect a conductive pad 46 on upper surface 44 to a lower conductive pad 50 or 52 on lower surface 48.
  • lead 58* includes a central member 64 for defining a U-shaped jaw which is received by a portion of the side edge of substrate 52.
  • an upper conductive pad 46 electrically communicates with a lower conductive pad 50 or 52 via the U-shaped portion of lead 58'.
  • leads 58' terminate with a flattened portion 60' adapted for surface mounting on a printed wiring board.
  • decoupled ceramic socket 40 is used in the same manner as previously described socket 10 and is mounted between a leadless ceramic chip carrier 66 and a printed wiring board 68 wherein the socket 40 performs both the functions of electrically interconnecting LCCC 66 to printed wiring board 68 as well as providing the important decoupling function through the use of decoupling multilayer capacitor elements 54 and 56.
  • Ceramic LCCC socket 70 is similar to ceramic sockets 10 and 40 of FIGURES 1 and 5 respectively and combines some of the features of each.
  • Ceramic socket 70 includes a substrate 72 having a top surface 74 and a bottom surface 76.
  • Upper surface 74 includes a plurality of conductive pads 78 along the perimeter thereof while lower surface 76 includes a pair of spaced opposed pads 80 and 82 electrically interconnected by decoupling capacitive elements 84 and 86 as in the previous embodiments.
  • socket 70 includes a plurality of openings through substrate 76 which are filled with a conductive material (e.g.
  • socket 70 also includes a plurality of springy or compliant J-shaped leads 90.
  • J-shaped leads 58 of FIGURES 5-9 electrically bridge the opposed top and bottom surfaces of the ceramic substrate
  • J-shaped leads 90 are positioned along bottom surface 76 only.
  • the J-shaped leads include an upper flattened portion 92 and a lower flattened portion 94.
  • Upper flattened portion 92 is adapted to be supported by lower ceramic surface 76 while lower flattened portion 94 is adapted to be supported by a solder pad on a printed wiring board.
  • an upper conductive pad 78 will electrically communicate to flattened portion 94 of lead 90 by way of via 88.
  • socket 70 will act to interconnect a leadless ceramic chip carrier 96 to a printed wiring board 98 in a manner similar to the previously described embodiments as shown in FIGURES 4 and 9.
  • the ceramic socket for use with surface mounted leadless ceramic chip carriers of the present invention overcomes many of the problems and deficiencies of the prior art.
  • the socket of the present invention is comprised of a ceramic material
  • the problems derived during thermal expansion wherein catastrophic joint failure often develops between the ceramic chip carrier and the printed circuit board is obviated.
  • the many costly and inefficient solutions which have been proposed for solving problems accompanying thermal expansion such as the use of a metal core (Invar core) printed circuit board and the use of plastic molded sockets are no longer necessary.
  • the problems of conserving real estate on the surface of the printed wiring board and high inductance associated with utilizing decoupling capacitors are also obviated by incorporating the decoupling function directly within the ceramic socket of the present invention.
  • FIGURES 14 and 15 show a ceramic socket 100 which is essentially similar to socket 100 and 10 is that instead of the short pins 24 having flattened bottom surfaces, socket 100 includes a plurality of pins 102 which have a narrow end termination configuration adapted for insertion onto a through-hole type printed wiring board.
  • pin 102 has been inserted into a through-hole 104 of printed wiring board 106 and is soldered therein for electrical and mechanical connection to the wiring board.
  • any of the other embodiments (sockets 40 or 70) of the present invention may similarly be adapted for use in connection with through-hole mounting on a printed circuit board.
  • the decoupled ceramic socket of the present invention may be used as a means to effectively convert a surface mountable leadless ceramic chip carrier to a through-hole insertable device as is clearly shown in FIGURE 14.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connecting Device With Holders (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

Prise (10, 40, 70, 100) pour support de puce céramique sans fil (34, 66, 96) composé d'une matière céramique de préférence sensiblement identique à la matière céramique composant le support de puce sans fil (34, 66, 96) (typiquement de l'oxyde d'aluminium). L'utilisation de la prise céramique (10, 40, 70, 100) de la présente invention assure une adaptation sensiblement exacte entre les coefficients de dilatation thermique du support de puce (34, 66, 96) et de la prise, ce qui élimine les problèmes de l'art antérieur relatifs aux défaillances catastrophiques des jonctions par brasage. Une autre caractéristique importante de la nouvelle prise de support de puce sans fil (10, 40, 70, 100) de la présente invention (en plus de sa composition en céramique) est l'incorporation d'une fonction de désaccouplement dans la prise céramique proprement dite. L'on parvient ainsi à réduire l'inductance indésirable du fil (que l'on trouve dans les prises moulées en plastique de l'art antérieur), ainsi qu'à rendre plus efficace (par rapport aux combinaisons de découplage classiques) l'utilisation de tableaux de connexions imprimées (36, 68, 98, 106).
PCT/US1988/004318 1987-12-08 1988-12-02 Substrat de montage pour support de puce ceramique sans fil WO1989005570A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13008587A 1987-12-08 1987-12-08
US130,085 1987-12-08

Publications (1)

Publication Number Publication Date
WO1989005570A1 true WO1989005570A1 (fr) 1989-06-15

Family

ID=22442984

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1988/004318 WO1989005570A1 (fr) 1987-12-08 1988-12-02 Substrat de montage pour support de puce ceramique sans fil

Country Status (4)

Country Link
JP (1) JPH01204379A (fr)
GB (1) GB8828691D0 (fr)
IT (1) IT8822889A0 (fr)
WO (1) WO1989005570A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003037054A1 (fr) * 2001-09-26 2003-05-01 Molex Incorporated Alimentation pour circuits integres utilisant des condensateurs discrets
WO2003073250A3 (fr) * 2002-02-25 2004-02-19 Molex Inc Connecteur a alimentation en courant filtree
EP1215690A3 (fr) * 2000-11-29 2006-03-01 Murata Manufacturing Co., Ltd. Module de condensateurs céramiques
CN102009433A (zh) * 2010-11-03 2011-04-13 江苏省宜兴电子器件总厂 陶瓷外壳刻槽模具及用该模具加工无引线陶瓷外壳的方法
CN104080273A (zh) * 2014-07-04 2014-10-01 中国航天科技集团公司第五研究院第五一三研究所 Lccc陶瓷转接座

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4725817B2 (ja) * 2006-05-17 2011-07-13 株式会社村田製作所 複合基板の製造方法
CN113784505B (zh) * 2021-10-11 2024-11-29 贵阳顺络迅达电子有限公司 一种90°电桥电路板优化结构及其制造方法

Citations (8)

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Publication number Priority date Publication date Assignee Title
US3340438A (en) * 1965-04-05 1967-09-05 Ibm Encapsulation of electronic modules
US4051550A (en) * 1974-11-29 1977-09-27 Hitachi, Ltd. Thick film integrated circuits
US4214120A (en) * 1978-10-27 1980-07-22 Western Electric Company, Inc. Electronic device package having solder leads and methods of assembling the package
US4445274A (en) * 1977-12-23 1984-05-01 Ngk Insulators, Ltd. Method of manufacturing a ceramic structural body
US4551747A (en) * 1982-10-05 1985-11-05 Mayo Foundation Leadless chip carrier apparatus providing for a transmission line environment and improved heat dissipation
US4560826A (en) * 1983-12-29 1985-12-24 Amp Incorporated Hermetically sealed chip carrier
US4611882A (en) * 1982-09-08 1986-09-16 Alps Electric Co., Ltd. High-frequency circuit device with an annular capacitor on the back of an insulated substrate
US4673967A (en) * 1985-01-29 1987-06-16 Texas Instruments Incorporated Surface mounted system for leaded semiconductor devices

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3340438A (en) * 1965-04-05 1967-09-05 Ibm Encapsulation of electronic modules
US4051550A (en) * 1974-11-29 1977-09-27 Hitachi, Ltd. Thick film integrated circuits
US4445274A (en) * 1977-12-23 1984-05-01 Ngk Insulators, Ltd. Method of manufacturing a ceramic structural body
US4214120A (en) * 1978-10-27 1980-07-22 Western Electric Company, Inc. Electronic device package having solder leads and methods of assembling the package
US4611882A (en) * 1982-09-08 1986-09-16 Alps Electric Co., Ltd. High-frequency circuit device with an annular capacitor on the back of an insulated substrate
US4551747A (en) * 1982-10-05 1985-11-05 Mayo Foundation Leadless chip carrier apparatus providing for a transmission line environment and improved heat dissipation
US4560826A (en) * 1983-12-29 1985-12-24 Amp Incorporated Hermetically sealed chip carrier
US4673967A (en) * 1985-01-29 1987-06-16 Texas Instruments Incorporated Surface mounted system for leaded semiconductor devices

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1215690A3 (fr) * 2000-11-29 2006-03-01 Murata Manufacturing Co., Ltd. Module de condensateurs céramiques
WO2003037054A1 (fr) * 2001-09-26 2003-05-01 Molex Incorporated Alimentation pour circuits integres utilisant des condensateurs discrets
US6853559B2 (en) 2001-09-26 2005-02-08 Molex Incorporated Thermal management of power delivery systems for integrated circuits
US6885563B2 (en) 2001-09-26 2005-04-26 Molex Incorporated Power delivery and other systems for integrated circuits
US6888235B2 (en) 2001-09-26 2005-05-03 Molex Incorporated Power delivery system for integrated circuits utilizing discrete capacitors
WO2003073250A3 (fr) * 2002-02-25 2004-02-19 Molex Inc Connecteur a alimentation en courant filtree
WO2003073251A3 (fr) * 2002-02-25 2004-04-15 Molex Inc Alimentation en electricite d'un support de processeur
US6837719B2 (en) 2002-02-25 2005-01-04 Molex Incorporated Connector with included filtered power delivery
US7095619B2 (en) 2002-02-25 2006-08-22 Molex Incorporated Power delivery to base of processor
US7298628B2 (en) 2002-02-25 2007-11-20 Molex Incorporated Power delivery to base of processor
CN102009433A (zh) * 2010-11-03 2011-04-13 江苏省宜兴电子器件总厂 陶瓷外壳刻槽模具及用该模具加工无引线陶瓷外壳的方法
CN104080273A (zh) * 2014-07-04 2014-10-01 中国航天科技集团公司第五研究院第五一三研究所 Lccc陶瓷转接座

Also Published As

Publication number Publication date
GB8828691D0 (en) 1989-01-11
JPH01204379A (ja) 1989-08-16
IT8822889A0 (it) 1988-12-06

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