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WO1992005678A1 - Melange et procede de traitement de corps metalliques - Google Patents

Melange et procede de traitement de corps metalliques Download PDF

Info

Publication number
WO1992005678A1
WO1992005678A1 PCT/DE1991/000768 DE9100768W WO9205678A1 WO 1992005678 A1 WO1992005678 A1 WO 1992005678A1 DE 9100768 W DE9100768 W DE 9100768W WO 9205678 A1 WO9205678 A1 WO 9205678A1
Authority
WO
WIPO (PCT)
Prior art keywords
mixture
treatment
copper
metal bodies
metal
Prior art date
Application number
PCT/DE1991/000768
Other languages
German (de)
English (en)
Inventor
Walter Schellander
Original Assignee
Schering Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CH3099/90A external-priority patent/CH682616A5/de
Application filed by Schering Aktiengesellschaft filed Critical Schering Aktiengesellschaft
Publication of WO1992005678A1 publication Critical patent/WO1992005678A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/125—Inorganic compounds, e.g. silver salt
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Definitions

  • the invention relates to a mixture for the treatment of metal bodies and methods using the mixture and use of tragacanth for the treatment of printed circuit boards.
  • epoxy resin-glass fabric prepreg or another suitable insulator material is used as the insulating layer between the individual copper foils.
  • preg epoxy resin-glass fabric
  • the individual copper and insulator layers are processed in a heated laminating press to produce the finished multilayer printed circuit board.
  • Acid solutions for the treatment of printed circuit boards are already known from the prior art, for example from the documents US Pat. No. 4,956,035, JP 62-158 884 A and JP 63-453 95 A. These solutions have in common that they do not contain any tragacanth .
  • the object of the invention is to improve the adhesion between the metal conductors and the insulating layer, so that no delamination takes place in the area of the bore.
  • the mixture according to the invention contains at least: a) water (H 2 0) from 20 to 60 vol% b) hydrochloric acid (HCl) from 20 to 60 vol% c) iron trichloride (FeCl 3 ) 40% conc. From 5 to 30 vol% d ) Fine powdered tragacanth (DAB 7) from 0.5 to 2 g / liter
  • the new adhesion promoter is very easy to use. In order to ensure the best adhesion values, it should best be applied to the copper surfaces at room temperature using the immersion method. However, this can also be sprayed on or applied with another application method suitable for liquids.
  • the roughened copper surface can also be examined very simply qualitatively:
  • the etching removal can be measured with a beta scope or a permascope. Typical removal values are three to eight micrometers.
  • the quality of the micro roughness can be determined physically using the peel strength measurement.
  • the quality of the micro roughness can also be assessed optically under a scanning electron microscope.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

Mélange pour le traitement de corps métalliques, renfermant au moins de l'eau, de l'acide chlorhydrique, du trichlorure de fer et de la gomme adragante finement pulvérisée. Ce mélange corrosif rend la surface des couches de cuivre rugueuse. Lorsque celles-ci sont stratifiées avec des couches de tissu de verre isolantes, de manière à former des plaques de circuits imprimés, comprenant plusieurs couches, dites multicouches, on obtient une adhérence améliorée.
PCT/DE1991/000768 1990-09-26 1991-09-26 Melange et procede de traitement de corps metalliques WO1992005678A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CH3099/90A CH682616A5 (de) 1990-09-26 1990-09-26 Haftverbesserer.
CH3099/90-1 1990-09-26
DE4106632 1991-02-28
DEP4106632.4 1991-02-28

Publications (1)

Publication Number Publication Date
WO1992005678A1 true WO1992005678A1 (fr) 1992-04-02

Family

ID=25692175

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1991/000768 WO1992005678A1 (fr) 1990-09-26 1991-09-26 Melange et procede de traitement de corps metalliques

Country Status (1)

Country Link
WO (1) WO1992005678A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2562292B1 (fr) * 2011-08-26 2017-03-01 United Technologies Corporation Composition de décapage chimique et procédé

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4956035A (en) * 1989-08-01 1990-09-11 Rd Chemical Company Composition and process for promoting adhesion on metal surfaces

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4956035A (en) * 1989-08-01 1990-09-11 Rd Chemical Company Composition and process for promoting adhesion on metal surfaces

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN, Volume 11, No. 398, (C-466), 25 December 1987; & JP,A,62 158 884, (MITSUBISHI CHEM. IND. LTD.), 14 July 1987. *
WORLD PATENTS INDEX, Week 7809, DERWENT PUBLICATIONS LTD, LONDON GB, AN 78-16352A; & JP,A,50 148 254, (HODOGAYA CHEM. IND. KK), 27 November 1975. *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2562292B1 (fr) * 2011-08-26 2017-03-01 United Technologies Corporation Composition de décapage chimique et procédé

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