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WO1993014618A1 - Appareil de moulage d'une grille de connexion et de puces disposees sur celle-ci - Google Patents

Appareil de moulage d'une grille de connexion et de puces disposees sur celle-ci Download PDF

Info

Publication number
WO1993014618A1
WO1993014618A1 PCT/EP1993/000073 EP9300073W WO9314618A1 WO 1993014618 A1 WO1993014618 A1 WO 1993014618A1 EP 9300073 W EP9300073 W EP 9300073W WO 9314618 A1 WO9314618 A1 WO 9314618A1
Authority
WO
WIPO (PCT)
Prior art keywords
lead frame
mould
pins
moulding
ejecting
Prior art date
Application number
PCT/EP1993/000073
Other languages
English (en)
Inventor
Henricus Bernardus Antonius Giesen
Original Assignee
Asm-Fico Tooling B.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asm-Fico Tooling B.V. filed Critical Asm-Fico Tooling B.V.
Publication of WO1993014618A1 publication Critical patent/WO1993014618A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C45/14073—Positioning or centering articles in the mould using means being retractable during injection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C2045/14852—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles incorporating articles with a data carrier, e.g. chips

Definitions

  • the invention relates to an apparatus for moulding with an encapsulating material, for instance plastic, a lead frame and chips arranged thereon, comprising mould halves enclosing a mould cavity, a feed runner for liquid moulding material, means for respectively opening and closing the mould halves and pins oriented to the lead frame, connected to the mould halves and movable in relation to the relevant mould half for exerting an ejecting force on the lead frame after moulding.
  • an apparatus lead frames and the chips arranged thereon are encapsulated with plastic. To this end the lead frame is clamped between both mould halves and the mould cavity is injected full of liquid plastic. After hardening the frame encapsulated with plastic is released from the mould by means of the ejecting pins.
  • the mould is opened in the known manner and the ejecting pins fulfil their original function, that is, releasing the moulded lead frame from the mould.
  • Such ejecting pins are preferably arranged on each of the mould halves.
  • the displacing means can be formed by an actuating member connected to a slide piece receiving the ejecting pins and standing under bias.
  • the bias can be derived from a coil spring.
  • the position of the ejecting pins on the lead frame is defined by a stop member.
  • This stop may be arranged on the mould half remote from the relevant mould half.
  • Fig. 1 shows a perspective view of the apparatus according to the invention
  • fig. 2 shows a cross sectional view of the apparatus along the line II-II in fig. 1
  • fig. 3 shows in perspective view a part of a lead frame already partially encapsulated in the apparatus according to fig. 1 and 2
  • fig. 4-7 show schematically the successive process steps of the apparatus according to the invention.
  • the apparatus 1 comprises mould halves 2 and 3 which enclose the mould cavity 4. Mould half 2 is stationary and mould half 3 is movable in relation to mould 2 as according to arrow PI and is guided therein by the guide rods 5 and 6. Mould half 3 is connected for this purpose to the pressure plate 7 using connecting pieces 8. Displaceable relative to each of the mould halves is an ejecting pin bed 9 respectively 18 which carries the ejecting pins 11, 12, respectively 13, 14 and 15.
  • the slide piece 9 for instance stands under bias of the coil spring 16 which confers on the slide piece 9 a bias force directed toward the mould space 4. Liquid moulding material is introduced via the runner 20
  • the mould half 3 opens the cavity space 4 because this mould half is moved downward according to arrow PI in the drawing as in fig. 1 and 2, the slide piece 9 is released whereby it is likewise moved down ⁇ ward relative to the mould half 2 under the influence of the bias force exerted by the spring 16, wherein the pins 11 and 12 fulfil their ejecting function by applying a force to the moulded lead frame.
  • the pins 11 and 12 fulfil their ejecting function by applying a force to the moulded lead frame.
  • the same function is subsequently fulfilled by the ejecting pins 13 and 15 in the other mould half.
  • the slide piece 9 is connected to the displacing means in the form of an actuating rod 17.
  • the actuating rod is designated here with the reference numeral 19.
  • the slide piece 9 is displaced in the direction of the mould cavity 4 such that the ejecting pins 11 and 12 come to lie against the lead frame.
  • the movement is bounded by a stop member (not drawn) on the other mould half 3. This is shown in fig. 3.
  • the lead frame is thus supported because it is clamped on the side edges by the mould halves 2 , 3 and because it is further centered by the ejecting pins referred to in the foregoing.
  • the liquid plastic which serves as encapsulating material is then supplied (fig. 4) through the runner 20.
  • the pins and the runner 14 are retracted in order to enable filling with plastic of the space formerly occupied thereby. This displacement takes place through operation of the actuating rods 17 and 19 (fig. 1) .
  • the movable mould half 3 is subsequently moved to the right in fig. 6 whereby the mould cavity is opened.
  • the slide piece 9 is also released, whereby it moves to the right under influence of the bias provided by spring 16, and the ejecting pins 11 and 12 can perform their releasing action.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

Appareil de moulage à l'aide d'une matière d'enrobage d'une grille de connexion et de puces disposées sur celle-ci, dans lequel la grille de connexion est non seulement soutenue dans la cavité de moulage délimitée par les demi-moules par le serrage des zones marginales de la grille de connexion, mais également centrée par des broches d'éjection. Les broches d'éjection servent à éjecter la grille de connexion de la cavité de moulage à la fin du cycle de moulage. On obtient un soutien supplémentaire en plaçant les broches sur la grille de connexion pendant le moulage. Peu avant la fin du cycle de moulage, on retire les broches de la grille afin de permettre le remplissage avec une matière plastique du volume préalablement occupé par les broches d'éjection.
PCT/EP1993/000073 1992-01-13 1993-01-11 Appareil de moulage d'une grille de connexion et de puces disposees sur celle-ci WO1993014618A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
BE9200028 1992-01-13
BE9200028 1992-01-13

Publications (1)

Publication Number Publication Date
WO1993014618A1 true WO1993014618A1 (fr) 1993-07-22

Family

ID=3886090

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP1993/000073 WO1993014618A1 (fr) 1992-01-13 1993-01-11 Appareil de moulage d'une grille de connexion et de puces disposees sur celle-ci

Country Status (1)

Country Link
WO (1) WO1993014618A1 (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2287214A (en) * 1994-02-23 1995-09-13 Matsushita Electric Works Ltd Injection molding-in method of embedding a workpiece
WO1996000645A1 (fr) * 1994-06-29 1996-01-11 Itt Automotive Europe Gmbh Procede d'enrobage avec une paroi mince d'un circuit electronique aligne avec precision avec la paroi d'enveloppe et circuit electronique a cet effet
GB2401479A (en) * 2003-03-12 2004-11-10 Samsung Electronics Co Ltd Method of encapsulating semiconductor devices on a printed circuit board
WO2005104306A1 (fr) * 2004-04-24 2005-11-03 Robert Bosch Gmbh Procede pour realiser une grille decoupee enveloppee de plastique et grille decoupee enveloppee de plastique
WO2008113312A1 (fr) * 2007-03-19 2008-09-25 Conti Temic Microelectronic Gmbh Ensemble capteur
CH703121A1 (de) * 2010-05-10 2011-11-15 Weidmann Plastics Tech Ag Verfahren zum Herstellen eines ein flächiges elektronisches Element aufweisenden Kunststoffbehälters, Kunststoffbehälter hergestellt nach diesem Verfahren sowie Spritzgusswerkzeug zum Durchführen des Verfahrens.
CN109955431A (zh) * 2017-12-22 2019-07-02 汉达精密电子(昆山)有限公司 嵌件的定位安放结构

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2103534A (en) * 1981-07-28 1983-02-23 Omron Tateisi Electronics Co Locating inserts during mould filling
EP0257681A2 (fr) * 1986-08-27 1988-03-02 STMicroelectronics S.r.l. Procédé pour la fabrication de dispositifs à semi-conducteur encapsulés dans de la lumière plastique et dispositifs ainsi obtenus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2103534A (en) * 1981-07-28 1983-02-23 Omron Tateisi Electronics Co Locating inserts during mould filling
EP0257681A2 (fr) * 1986-08-27 1988-03-02 STMicroelectronics S.r.l. Procédé pour la fabrication de dispositifs à semi-conducteur encapsulés dans de la lumière plastique et dispositifs ainsi obtenus

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2287214A (en) * 1994-02-23 1995-09-13 Matsushita Electric Works Ltd Injection molding-in method of embedding a workpiece
US5639403A (en) * 1994-02-23 1997-06-17 Matsushita Electric Works, Ltd. Method of molding a resin article with an embedded workpiece
GB2287214B (en) * 1994-02-23 1998-04-01 Matsushita Electric Works Ltd Injection molding-in method of embedding a workpiece
WO1996000645A1 (fr) * 1994-06-29 1996-01-11 Itt Automotive Europe Gmbh Procede d'enrobage avec une paroi mince d'un circuit electronique aligne avec precision avec la paroi d'enveloppe et circuit electronique a cet effet
US6056909A (en) * 1994-06-29 2000-05-02 Itt Manufacturing Enterprises Inc. Casting mold for precisely aligning an electronic circuit with a cast wall and method of using same
GB2401479A (en) * 2003-03-12 2004-11-10 Samsung Electronics Co Ltd Method of encapsulating semiconductor devices on a printed circuit board
GB2401479B (en) * 2003-03-12 2005-09-28 Samsung Electronics Co Ltd Method of encapsulating semiconductor devices on a printed circuit board, and a printed circuit board for use in the method
WO2005104306A1 (fr) * 2004-04-24 2005-11-03 Robert Bosch Gmbh Procede pour realiser une grille decoupee enveloppee de plastique et grille decoupee enveloppee de plastique
WO2008113312A1 (fr) * 2007-03-19 2008-09-25 Conti Temic Microelectronic Gmbh Ensemble capteur
US8286469B2 (en) 2007-03-19 2012-10-16 Conti Temic Microelectronic Gmbh Insert molded electrical contact
CH703121A1 (de) * 2010-05-10 2011-11-15 Weidmann Plastics Tech Ag Verfahren zum Herstellen eines ein flächiges elektronisches Element aufweisenden Kunststoffbehälters, Kunststoffbehälter hergestellt nach diesem Verfahren sowie Spritzgusswerkzeug zum Durchführen des Verfahrens.
WO2011140666A1 (fr) * 2010-05-10 2011-11-17 Weidmann Plastics Technology Ag Procédé de fabrication d'un contenant en matière plastique renfermant un élément électronique plan, contenant en matière plastique fabriqué selon ce procédé et outil de moulage par injection pour la mise en œuvre du procédé
US9211665B2 (en) 2010-05-10 2015-12-15 Weidmann Medical Technology Ag Method for producing a plastic container having a planar electronic element, plastic container produced according to said method, and injection mold for carrying out the method
US9908271B2 (en) 2010-05-10 2018-03-06 Weidman Medical Technology AG Method for producing a plastic container having a two-dimensionally extending electronic element, plastic container produced according to said method and injection mold for carrying out the method
CN109955431A (zh) * 2017-12-22 2019-07-02 汉达精密电子(昆山)有限公司 嵌件的定位安放结构
CN109955431B (zh) * 2017-12-22 2021-09-14 汉达精密电子(昆山)有限公司 嵌件的定位安放结构

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