WO1996001498A1 - Integrated circuit device - Google Patents
Integrated circuit device Download PDFInfo
- Publication number
- WO1996001498A1 WO1996001498A1 PCT/JP1995/001326 JP9501326W WO9601498A1 WO 1996001498 A1 WO1996001498 A1 WO 1996001498A1 JP 9501326 W JP9501326 W JP 9501326W WO 9601498 A1 WO9601498 A1 WO 9601498A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- integrated circuit
- circuit device
- metal substrate
- wiring board
- cpu chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/18—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of the types provided for in two or more different main groups of the same subclass of H10B, H10D, H10F, H10H, H10K or H10N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1092—Plug-in assemblages of components, e.g. IC sockets with built-in components, e.g. intelligent sockets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1031—Surface mounted metallic connector elements
- H05K2201/10318—Surface mounted metallic pins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/1056—Metal over component, i.e. metal plate over component mounted on or embedded in PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
Definitions
- a conventional integrated circuit device includes a power supply, a CPU chip, a cache controller, a cache, and a single-layer circuit board on one side or both sides.
- the component parts consisting of memory, data buffer LSI and connector are mounted, and the desired component parts are electrically connected to each other.
- it had a radiator plate for radiating heat to the components individually, and a cooling fan was provided to the radiator plate.
- Reference numeral 5 denotes a plurality of substantially cross-shaped pin terminals that are metal-bonded on the conductive layer 3 via a high-temperature solder 6, and are electrically connected to the power supply 4 via the conductive layer 3 and are connected to the anode terminal. Or it is a cathode terminal.
- Reference numeral 7 denotes a multilayer circuit wiring board provided with the pin terminals 5 inserted therein, and at least the surface opposite to the metal substrate 1 has a data path, an address path, and a con- tact. It has a power line and a ground line (not shown), and at least the power line and the ground line have pin terminals. It is electrically connected to 5.
- the data subjected to various arithmetic processing by the CPU chip 8 is transferred from the layer circuit wiring board 7 to the cache controller 10 and the cache.
- the signal is transmitted to the memory unit 11, transmitted to the connector 12 via the multilayer circuit wiring board 7, and output to the outside.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
Claims
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP95923573A EP0717443B1 (en) | 1994-07-04 | 1995-07-03 | Integrated circuit device |
| DE69508046T DE69508046T2 (de) | 1994-07-04 | 1995-07-03 | Integrierte halbleiteranordnung |
| KR1019960701094A KR100208053B1 (ko) | 1994-07-04 | 1995-07-03 | 집적회로장치 |
| US08/596,343 US6303989B1 (en) | 1994-07-04 | 1995-07-30 | Integrated circuit device on metal board with CPU power converter |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15217794 | 1994-07-04 | ||
| JP6/152177 | 1994-07-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO1996001498A1 true WO1996001498A1 (en) | 1996-01-18 |
Family
ID=15534738
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP1995/001326 Ceased WO1996001498A1 (en) | 1994-07-04 | 1995-07-03 | Integrated circuit device |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6303989B1 (ja) |
| EP (1) | EP0717443B1 (ja) |
| KR (1) | KR100208053B1 (ja) |
| CN (1) | CN1037134C (ja) |
| DE (1) | DE69508046T2 (ja) |
| WO (1) | WO1996001498A1 (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6584681B2 (en) | 1996-09-30 | 2003-07-01 | Infineon Technologies Ag | Method for producing a microelectronic component of sandwich construction |
Families Citing this family (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5864478A (en) * | 1996-06-28 | 1999-01-26 | Intel Corporation | Power pod/power delivery system |
| US6356448B1 (en) | 1999-11-02 | 2002-03-12 | Inceptechnologies, Inc. | Inter-circuit encapsulated packaging for power delivery |
| US6304450B1 (en) | 1999-07-15 | 2001-10-16 | Incep Technologies, Inc. | Inter-circuit encapsulated packaging |
| US6801431B2 (en) | 1999-07-15 | 2004-10-05 | Incep Technologies, Inc. | Integrated power delivery and cooling system for high power microprocessors |
| US20030156400A1 (en) * | 1999-07-15 | 2003-08-21 | Dibene Joseph Ted | Method and apparatus for providing power to a microprocessor with intergrated thermal and EMI management |
| US6556455B2 (en) | 1999-07-15 | 2003-04-29 | Incep Technologies, Inc. | Ultra-low impedance power interconnection system for electronic packages |
| US6623279B2 (en) | 1999-07-15 | 2003-09-23 | Incep Technologies, Inc. | Separable power delivery connector |
| US6947293B2 (en) | 1999-07-15 | 2005-09-20 | Incep Technologies | Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management |
| US6452113B2 (en) | 1999-07-15 | 2002-09-17 | Incep Technologies, Inc. | Apparatus for providing power to a microprocessor with integrated thermal and EMI management |
| US6847529B2 (en) | 1999-07-15 | 2005-01-25 | Incep Technologies, Inc. | Ultra-low impedance power interconnection system for electronic packages |
| US6618268B2 (en) | 1999-07-15 | 2003-09-09 | Incep Technologies, Inc. | Apparatus for delivering power to high performance electronic assemblies |
| US20030214800A1 (en) | 1999-07-15 | 2003-11-20 | Dibene Joseph Ted | System and method for processor power delivery and thermal management |
| US6741480B2 (en) | 1999-07-15 | 2004-05-25 | Incep Technologies, Inc. | Integrated power delivery with flex circuit interconnection for high density power circuits for integrated circuits and systems |
| US7085146B2 (en) | 1999-12-20 | 2006-08-01 | Synqor, Inc. | Flanged terminal pins for DC/DC converters |
| US6896526B2 (en) | 1999-12-20 | 2005-05-24 | Synqor, Inc. | Flanged terminal pins for DC/DC converters |
| MXPA02006173A (es) * | 1999-12-20 | 2003-09-25 | Synqor Inc | PATILLAS TERMINALES CON PESTAnA PARA CONVERTIDORES CC/CC. |
| MXPA02008042A (es) * | 2000-02-18 | 2004-09-06 | Incep Technologies Inc | Metodo y aparato para proporcionar energia a un microprocesador con manejo de interfase integrada termica y electromagnetica. |
| US6884086B1 (en) | 2000-09-28 | 2005-04-26 | Intel Corporation | System and method for connecting a power converter to a land grid array socket |
| US6360431B1 (en) * | 2000-09-29 | 2002-03-26 | Intel Corporation | Processor power delivery system |
| US7167379B2 (en) | 2001-02-16 | 2007-01-23 | Dibene Ii Joseph T | Micro-spring interconnect systems for low impedance high power applications |
| DE10107839A1 (de) * | 2001-02-16 | 2002-09-05 | Philips Corp Intellectual Pty | Anordnung mit einem auf einem Träger montierten integrierten Schaltkreis und einer Stromversorgungsbaugruppenanordnung |
| AU2003213618A1 (en) * | 2002-02-25 | 2003-09-09 | Molex Incorporated | Electrical connector equipped with filter |
| US6845013B2 (en) * | 2002-03-04 | 2005-01-18 | Incep Technologies, Inc. | Right-angle power interconnect electronic packaging assembly |
| JP4209130B2 (ja) * | 2002-04-09 | 2009-01-14 | 株式会社ザナヴィ・インフォマティクス | 多層モジュール基板 |
| AT500260A1 (de) * | 2003-05-08 | 2005-11-15 | Siemens Ag Oesterreich | Anordnung von leiterplatten |
| JP3896112B2 (ja) | 2003-12-25 | 2007-03-22 | エルピーダメモリ株式会社 | 半導体集積回路装置 |
| CN1316608C (zh) * | 2004-02-13 | 2007-05-16 | 上海三思科技发展有限公司 | 一种改善led温升的散热针结构 |
| KR101053587B1 (ko) * | 2004-06-04 | 2011-08-03 | 엘지전자 주식회사 | 세탁기의 원격제어용 기판 어셈블리 |
| US20060291180A1 (en) * | 2005-06-23 | 2006-12-28 | Inventec Corporation | PCI mezzanine card |
| DE102006022107A1 (de) * | 2006-05-11 | 2007-11-15 | Siemens Ag Österreich | Anordnung einer Leiterplatte und einem dazu in einem festen Abstand gehaltenen Kontaktträger |
| JP5106460B2 (ja) * | 2009-03-26 | 2012-12-26 | 新光電気工業株式会社 | 半導体装置及びその製造方法、並びに電子装置 |
| JP5533787B2 (ja) * | 2011-06-09 | 2014-06-25 | 株式会社豊田自動織機 | 放熱装置 |
| US20140211421A1 (en) * | 2013-01-29 | 2014-07-31 | Tyco Electronics Corporation | Circuit Board Assembly |
| US9142477B2 (en) * | 2013-03-08 | 2015-09-22 | Kabushiki Kaisha Toshiba | Semiconductor module |
| US10031864B2 (en) * | 2013-03-15 | 2018-07-24 | Seagate Technology Llc | Integrated circuit |
| US10331161B2 (en) * | 2014-12-24 | 2019-06-25 | Fujitsu Limited | Power supply board |
| CN208538435U (zh) * | 2018-08-01 | 2019-02-22 | 京东方科技集团股份有限公司 | 一种显示装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0487361A (ja) * | 1990-07-31 | 1992-03-19 | Sanyo Electric Co Ltd | 混成集積回路装置 |
| JPH06151702A (ja) * | 1992-11-09 | 1994-05-31 | Nec Corp | マルチチップモジュール |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4120041A (en) * | 1975-12-05 | 1978-10-10 | Sharp Kabushiki Kaisha | Semiconductor device for use in an electronic apparatus having a plurality of circuit boards |
| JPH0548000A (ja) * | 1991-08-13 | 1993-02-26 | Fujitsu Ltd | 半導体装置 |
| JPH05102390A (ja) * | 1991-10-08 | 1993-04-23 | Nec Corp | ハイブリツドic |
| JP2772184B2 (ja) * | 1991-11-07 | 1998-07-02 | 株式会社東芝 | 半導体装置 |
| JP2936855B2 (ja) * | 1991-12-26 | 1999-08-23 | 富士電機株式会社 | 電力用半導体装置 |
| US5222014A (en) * | 1992-03-02 | 1993-06-22 | Motorola, Inc. | Three-dimensional multi-chip pad array carrier |
| US5266912A (en) * | 1992-08-19 | 1993-11-30 | Micron Technology, Inc. | Inherently impedance matched multiple integrated circuit module |
| US5426263A (en) * | 1993-12-23 | 1995-06-20 | Motorola, Inc. | Electronic assembly having a double-sided leadless component |
| US5469330A (en) * | 1994-02-14 | 1995-11-21 | Karabatsos; Chris | Heat sink header assembly |
-
1995
- 1995-07-03 WO PCT/JP1995/001326 patent/WO1996001498A1/ja not_active Ceased
- 1995-07-03 EP EP95923573A patent/EP0717443B1/en not_active Expired - Lifetime
- 1995-07-03 DE DE69508046T patent/DE69508046T2/de not_active Expired - Fee Related
- 1995-07-03 KR KR1019960701094A patent/KR100208053B1/ko not_active Expired - Fee Related
- 1995-07-03 CN CN95190605A patent/CN1037134C/zh not_active Expired - Fee Related
- 1995-07-30 US US08/596,343 patent/US6303989B1/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0487361A (ja) * | 1990-07-31 | 1992-03-19 | Sanyo Electric Co Ltd | 混成集積回路装置 |
| JPH06151702A (ja) * | 1992-11-09 | 1994-05-31 | Nec Corp | マルチチップモジュール |
Non-Patent Citations (1)
| Title |
|---|
| See also references of EP0717443A4 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6584681B2 (en) | 1996-09-30 | 2003-07-01 | Infineon Technologies Ag | Method for producing a microelectronic component of sandwich construction |
Also Published As
| Publication number | Publication date |
|---|---|
| KR960705363A (ko) | 1996-10-09 |
| DE69508046T2 (de) | 1999-07-15 |
| CN1037134C (zh) | 1998-01-21 |
| DE69508046D1 (de) | 1999-04-08 |
| EP0717443A4 (en) | 1997-12-17 |
| EP0717443B1 (en) | 1999-03-03 |
| EP0717443A1 (en) | 1996-06-19 |
| CN1130441A (zh) | 1996-09-04 |
| KR100208053B1 (ko) | 1999-07-15 |
| US6303989B1 (en) | 2001-10-16 |
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