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WO1996003466A1 - Compositions de pates ou d'encres d'imprimerie - Google Patents

Compositions de pates ou d'encres d'imprimerie Download PDF

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Publication number
WO1996003466A1
WO1996003466A1 PCT/GB1995/001763 GB9501763W WO9603466A1 WO 1996003466 A1 WO1996003466 A1 WO 1996003466A1 GB 9501763 W GB9501763 W GB 9501763W WO 9603466 A1 WO9603466 A1 WO 9603466A1
Authority
WO
WIPO (PCT)
Prior art keywords
paste
water
powdered
ink composition
glass
Prior art date
Application number
PCT/GB1995/001763
Other languages
English (en)
Inventor
John Francis Clifford
Jennifer Clare Watts
Original Assignee
Cookson Matthey Ceramics & Materials Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cookson Matthey Ceramics & Materials Limited filed Critical Cookson Matthey Ceramics & Materials Limited
Priority to AU30843/95A priority Critical patent/AU3084395A/en
Publication of WO1996003466A1 publication Critical patent/WO1996003466A1/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C03C8/16—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions with vehicle or suspending agents, e.g. slip
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Definitions

  • the present invention relates to water-based paste or ink compositions and, in particular, to water-based printable inks, such as decorative glass or ceramic printing inks or water-based pastes for use in the electronics industry such as thick film conductor pastes, thick film resistor pastes, dielectric pastes, die attach adhesive compositions and solder or sealing glass pastes.
  • the transient carrier vehicles which are commonly used in the preparation of pastes for the ceramics and electronics industries are typically based on volatile organic liquids with or without the inclusion therein of a thickener/binder, a rheological modifier to enhance thixotropy or pseudoplasticity, a surfactant and other common additives.
  • organic liquids which are commonly used are aliphatic alcohols and their esters, terpenes such as pine oil and terpineol, solutions of resins such as the polymethacrylates of lower alcohols and solutions of ethyl cellulose in solvents such as pine oil, glycol ethers and the like.
  • the present invention provides a water-based paste or ink composition which comprises at least one powdered or flaked material and a transient carrier vehicle which is an aqueous medium including therein at least one associative thickener (as hereinafter defined) , the amounts of the powdered or flaked material, the vehicle and any optional additives included in the composition being chosen so that the composition has an appropriate rheology for it to be dispensed, for example by syringe, screen printing, stencilling or K bar application, and the transient carrier vehicle being removable from the composition by heating or pyrolysis to leave no or substantially no residues.
  • a transient carrier vehicle which is an aqueous medium including therein at least one associative thickener (as hereinafter defined) , the amounts of the powdered or flaked material, the vehicle and any optional additives included in the composition being chosen so that the composition has an appropriate rheology for it to be dispensed, for example by syringe, screen printing, stencilling or K bar
  • the powdered or flaked material for use in the present invention will depend upon the particular composition. It will typically be a glass, ceramic, metal or metal oxide powder, or a mixture thereof, or precursors for these materials, for example organo etallic precursors thereof.
  • the powdered material may be a powdered coloured ceramic pigment and/or glass;
  • the powdered material may be an admixture of particles of a noble metal or noble metal alloy and a glass binder, or a mixture of nickel or copper or their alloys and a glass binder;
  • for thick film resistor pastes the powdered material may be a mixture of particles of a conductive material and a glass binder;
  • dielectric pastes the powdered material is typically a ceramic dielectric material;
  • the powdered material may be a mixture of a metal and a glass frit; and for an adhesive "solder glass” paste, the powdered material may be a single glass or a mixture of glass
  • compositions of the present invention may include therein other optional additives, such as organic compounds or waxes, provided that the additives will burn out to leave no or substantially no residue on heating or pyrolysis.
  • aqueous paste or ink composition may also include therein at least one dispersant (as hereinafter defined) .
  • dispersant a compound or composition which acts to maintain the particles in a suspension in a dispersed state in which they do not associate with other particles to form aggregates.
  • a dispersant acts by adsorbing on the particle surface, so altering the particle surface chemistry for minimum interparticle interaction.
  • the chemistry of dispersants is discussed in Surfactants ed. Th F Tadros, Academic Press, London 1984 and Industrial Applications of Surfactants, ed. D.R. Karsa, Special Publication No. 59, Royal Society of Chemistry, London 1987.
  • associative thickener hydrophobically modified polymers, for example, polyacrylate or polyurethane copolymers, which form aggregates or micelles in aqueous media and which exhibit shear thinning behaviour in aqueous media, i.e. have a higher viscosity at low shear rates than the viscosity at high shear rates.
  • associative thickeners The chemistry of associative thickeners is discussed in Polymers in Aqueous Media: Performance through Association, ed. J.E. Glass, Advances in Chemistry Series No. 223, American Chemical Society 1989.
  • the hydrophobically modified polyacrylate associative thickeners used in the present invention are alkali swellable materials which are substantially insoluble in water at low pH, but which exhibit thickening on swelling or dissolution in aqueous media at higher degrees of ionization and which are stable at a pH of above 7.
  • the alkali swellable associative polymeric thickeners are generally terpolymers which comprise a carboxylic monomer, a hydrophobic monomer and an associative monomer.
  • Currently available materials generally have a molecular weight in the range of from 1000 to 10,000.
  • a particular class of such associative thickeners for use in the present invention are the hydrophobically modified acrylate polymers sold under the Trade Name Rheovis CR, CRX, CR2 and CR3 (from Allied Colloids) . Mixtures of associative thickeners may also be used, if desired.
  • the carboxylic functionality on the carboxylic monomer is provided by carboxylic acid or anhydride groups, examples of these groups being those derived from acrylic acid and methacrylic acid.
  • the associative monomer normally comprises a long chain hydrophilic segment which is terminated with a hydrophobe.
  • the hydrophilic segment preferably comprises a polyethoxy or poly(ethoxy/propoxy) chain situated between ethylenic unsaturation at one end of the molecule and a terminal hydrophobe at the other end of the molecule.
  • the associative monomers are generally made by coupling the hydroxyl end group of a conventional non-ionic surfactant to a monomer containing ethylenic unsaturation.
  • the hydrophobe on the associative monomer is the primary interactive component in the associative thickener.
  • the hydrophobic monomer as such can be omitted from the polymer if the associative monomer is able to impart the hydrophilic-hydrophobic balance to the thickener necessary for pH-dependent solubility.
  • the copolymer backbone of the associative thickener is predominantly hydrophilic since it contains sufficient carboxyl groups or anhydride groups to render the thickener water soluble at a high pH.
  • the mechanism by which the associative thickener acts is by the non-specific hydrophobic association of water-insoluble groups in water-soluble polymers.
  • the terminal hydrophobes on the ethoxylate or ethoxylate/propoxylate side chains are repelled from the hydrophilic portions of the molecule and are attracted to other terminal hydrophobes.
  • This intermolecular association of terminal hydrophobes of associative thickeners in aqueous solution may be regarded as micellization in a continuous network and the driving force for association is the increase in entropy resulting from the loss of water around the hydrophobes and the minimization of water-hydrophobe contacts.
  • hydrophobically modified polyurethane based associative thickener for use in the present invention is a non-ionic modified polyether urea polyurethane produced and sold by Rheox Inc. under the trade name Rheolate 200 Series, for example, Rheolate 244 or Rheolate 255. These copolymers are the reaction product of a diisocyanate with a diol and a hydrophobic capping agent.
  • the associative thickener is generally included in the compositions in an amount of from lpp to 10.0% by weight based on the total weight of solids, preferably 0.01 to 2.0% by weight based on the total weight of solids.
  • the associative polymeric thickeners are synthetic and are resistant to microbial degradation. The associative thickeners and dispersant, if present, burn out completely at temperatures of below 500°C leaving little or no residues.
  • dispersants which may be used in the present invention are any appropriate cationic anionic, non-ionic or amphoteric surfactants or mixtures thereof which act under the prevailing conditions as a dispersant.
  • the selection criteria and mode of use are as described in the literature.
  • An example of a non-ionic surfactant for use in the present invention is CT111, an acetylenic diol based material from Air Products.
  • anionic surfactants for use in the present invention are naphthalene sulfonic acid, or a derivative or salt thereof, poly(naphthalene sulfonate-co-formaldehyde) , and Dispex N40, a poly(acrylic acid) -sodium salt from Allied Colloids.
  • An example of a cationic surfactants for use in the present invention is cetyltrimethylammonium bromide.
  • An example of an amphoteric surfactant for use in the present invention is Mirataine JCHA, a sodium alkylamino propionate from Rhone Poulenc.
  • the dispersant is preferably included in the paste or ink formulation in an amount of from 1 ppm to 5% by weight based on the total weight of solids, more preferably 0.1 to 2% by weight based on the total weight of solids.
  • the amount of the powdered or flaked material in the compositions of the present invention will generally be in the range of from 25 to 95% by weight based on the total weight of the composition, more preferably in the range of from 40 to 90% by weight based on the total weight of the composition.
  • the amount of the vehicle will generally be in the range of from 75 to 5% by weight based on the total weight of the composition, more preferably in the range of from 60 to 10% by weight based on the total weight of the composition.
  • compositions of the present invention may additionally include therein one or more additives such as antifoamers, defoa ers, wetting and levelling agents and on occasions other water soluble polymers which also act as thickeners and binders. It is also frequently desirable to add a humectant such as glycerol to the compositions.
  • additives such as antifoamers, defoa ers, wetting and levelling agents and on occasions other water soluble polymers which also act as thickeners and binders. It is also frequently desirable to add a humectant such as glycerol to the compositions.
  • a humectant such as glycerol
  • the amount of the powdered or flaked material, the vehicle and any optional additives included in the composition are chosen so that the composition has an appropriate rheology for it to be printed or dispensed by the chosen application method, e.g screen printing, stencilling, K bar application or using a syringe.
  • the main advantage of the vehicle system used in formulating the paste and ink compositions of the present invention is that it is a simple water-based system free of volatile organic compounds which is Theologically stable (e.g. does not exhibit any adverse reactions with glass frits such as boron gelling) and also has good burn out characteristics.
  • the present invention also includes within its scope a method for the preparation of the aqueous printable paste or ink compositions as defined herein which comprises mechanically mixing at least one powdered or flaked material with an aqueous medium containing at least one associative polymeric thickener, or mixing at least one powdered or flaked material with an aqueous medium and thereafter adding at least one associative polymeric thickener to the mixture.
  • the method of mixing may be any of those currently used, for example, triple roll milling.
  • the systems are designed to have a high viscosity at low shear and low viscosity at high shear - that is to shear thin.
  • the precise viscosities required will depend, for example, on the particulate materials present, the printing or dispensing equipment to be used, the application speed and desired shelf life of the product.
  • the grades and types of associative thickener being selected and/or blended accordingly to provide optimum performance.
  • the present invention also includes within the scope a method for the formation of a coating, film, joint, adhesive bond or decoration from a powdered or flaked material which method comprises using as a transient carrier for the powdered or flaked material an aqueous medium comprising an associative thickener (as hereinbefore defined) and removing the transient carrier vehicle by heating or pyrolysis to leave no or substantially no residues.
  • the present invention furthermore includes within its scope an electric circuit produced using a paste or ink composition of the invention, or an electronic component mounted using a paste or ink composition of the invention; a glass or ceramic article decorated using a paste or ink composition of the invention; or an item joined using a paste or ink composition of the invention.
  • a blue glass-ceramic pigment powder was blended with different weights of a 1% solution of an associative polymeric thickener, Rheovis CR, in order to form three inks A, B and C.
  • the tiles printed with inks A, B and C were fired up to 850°C using a ramp rate of 13°C/min, a dwell time of 10 minutes and a cooling rate of 13°C/min.
  • the fired coatings each showed good adherence, good gloss and good uniformity.
  • Example 1 The procedure of Example 1 was repeated using a dielectric lead magnesium niobium titanate (PMNT) . In order to reduce frothing, two drops of a dispersant were added to the composition.
  • PMNT dielectric lead magnesium niobium titanate
  • Example l To test adherence ink D was screen printed directly onto an alumina plate using the same conditions as in Example l. The plate was fired up to 1180°C. The fired surface was smooth, crack free and had good adherence.
  • a blue glass-ceramic pigment powder was blended with different weights of a 10% solution of a urethane associative thickener Rheolate 244 in order to form 3 inks.
  • the three inks were screen printed directly onto a glazed ceramic tile using a 200 mesh (75-77 ⁇ ) screen. Each of the inks printed satisfactorily, ink I giving the best print.
  • a blue glass-ceramic pigment powder was blended with different weights of a 10% solution of a urethane associative thickener Rheolate 255 in order to form 3 inks.
  • the three inks were screen printed directly onto a glazed tile using a 200 mesh (75-77 ⁇ ) screen. Each of the inks printed satisfactorily.
  • the tiles printed with inks J, K and L were fired up to 850°C using a ramp rate of 13°C/min, a dwell time of 10 minutes and a cooling rate of 13°C/min.
  • the fired coatings each showed good adherence, good gloss, good colour and good uniformity.
  • the sealing glass was found to have form a strong bond between the microscope slides.
  • additive 21 was added to 19 ml water and 0.25 ml of a 1% solution of Rheovis CRX, 0.5 ml of a viscosity point additive HA12P (Rohm & Haas) and 9g of powdered cyan enamel were added thereto.
  • the enamel was dispersed with mixing and the pH of the mixture adjusted to pH 9.5 to 10.5 by the addition of 1M NaOH solution, c) 13.5 ml of the wax emulsion prepared in step (a) was added to the enamel dispersion prepared in step (b) and the pH of the mixture readjusted to 9.5 to 10.5 by the addition of 1M NaOH solution.
  • the resulting ink paste was coated by a standard K-bar coating technique onto a 3 to lO ⁇ m thick polyester film and a glazed tile to form thin even coatings.
  • the tile was fired at 13°C/minute to 850°C, held for 15 minutes and furnace cooled, yielding a good adherent coating indicating no burn out problems.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)

Abstract

Composition de pâte ou d'encre à base aqueuse comprenant au moins un matériau en poudre ou en flocons et un véhicule transitoire qui est un milieu aqueux contenant au moins un épaississant associatif (défini ci-avant), les quantités du matériau en poudre ou en flocons, du véhicule et de tous additifs éventuels contenus dans la composition étant sélectionnées de telle manière que ladite composition présente une rhéologie appropriée permettant de l'appliquer ou de l'imprimer et le véhicule transitoire pouvant être supprimé de ladite composition par réchauffement ou par pyrolyse, de façon à ne laisser pratiquement aucun résidu.
PCT/GB1995/001763 1994-07-27 1995-07-26 Compositions de pates ou d'encres d'imprimerie WO1996003466A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU30843/95A AU3084395A (en) 1994-07-27 1995-07-26 Paste or printable ink compositions

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB9415075A GB9415075D0 (en) 1994-07-27 1994-07-27 Paste or printable ink compositions
GB9415075.2 1994-07-27

Publications (1)

Publication Number Publication Date
WO1996003466A1 true WO1996003466A1 (fr) 1996-02-08

Family

ID=10758910

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB1995/001763 WO1996003466A1 (fr) 1994-07-27 1995-07-26 Compositions de pates ou d'encres d'imprimerie

Country Status (3)

Country Link
AU (1) AU3084395A (fr)
GB (1) GB9415075D0 (fr)
WO (1) WO1996003466A1 (fr)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0843319A1 (fr) * 1996-11-14 1998-05-20 Degussa Aktiengesellschaft Pâte pour des couches âptes à être cuites
EP0889010A1 (fr) * 1997-06-30 1999-01-07 Fry's Metals, Inc. Pâte à souder du verre pour tubes à rayons cathodiques
WO1999015334A1 (fr) * 1997-09-22 1999-04-01 Telefonaktiebolaget Lm Ericsson (Publ) Procede de transfert d'une image sur une surface
US6090449A (en) * 1998-01-27 2000-07-18 Ferdinando; Peter G. Slow-drying aqueous-based coating materials and painting techniques for the use thereof
EP1116755A1 (fr) * 2000-01-10 2001-07-18 Sicpa Holding S.A. Composition de revêtement, de préférence d 'encre d'imprimerie pour marquage de sécurité, procédé de production pour une composition de revêtement et utilisation de vitro-céramique
WO2000020519A3 (fr) * 1998-10-07 2001-11-29 Bayer Ag Preparations contenant des oxydes inorganiques a fines particules
JP2002173597A (ja) * 2000-05-23 2002-06-21 Toray Ind Inc ペースト、ディスプレイ部材およびディスプレイ部材の製造方法
WO2005052071A1 (fr) * 2003-11-25 2005-06-09 Johnson Matthey Public Limited Company Composition d'encre d'impression numerique
US7238296B2 (en) * 2002-09-13 2007-07-03 Koa Kabushiki Kaisha Resistive composition, resistor using the same, and making method thereof
WO2011079402A1 (fr) * 2009-12-29 2011-07-07 Sawgrass Europe Sa Encre à rhéologie modifiée et procédé d'impression

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB857400A (en) * 1958-10-27 1960-12-29 Welwyn Electric Ltd Improvements in or relating to electrical resistors
GB1066800A (en) * 1962-11-15 1967-04-26 Tesla Np A method of producing silver suspensions
FR2022329A1 (fr) * 1968-10-30 1970-07-31 Corning Glass Works
EP0350414A1 (fr) * 1988-07-07 1990-01-10 Société COATEX, Société Anonyme Agent épaississant modificateur des caractéristiques rhéologiques de compositions aqueuses chargées et/ou pigmentées, blanches ou colorées
EP0392065A1 (fr) * 1989-04-14 1990-10-17 Union Carbide Corporation Systèmes de micro-composite et procédés de formation

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB857400A (en) * 1958-10-27 1960-12-29 Welwyn Electric Ltd Improvements in or relating to electrical resistors
GB1066800A (en) * 1962-11-15 1967-04-26 Tesla Np A method of producing silver suspensions
FR2022329A1 (fr) * 1968-10-30 1970-07-31 Corning Glass Works
EP0350414A1 (fr) * 1988-07-07 1990-01-10 Société COATEX, Société Anonyme Agent épaississant modificateur des caractéristiques rhéologiques de compositions aqueuses chargées et/ou pigmentées, blanches ou colorées
EP0392065A1 (fr) * 1989-04-14 1990-10-17 Union Carbide Corporation Systèmes de micro-composite et procédés de formation

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100529478B1 (ko) * 1996-11-14 2006-02-03 데엠체체 데구사 메탈스 카탈리스츠 세르덱 아게 소성층용 페이스트
DE19647044A1 (de) * 1996-11-14 1998-05-20 Degussa Paste für Einbrennschichten
US5882549A (en) * 1996-11-14 1999-03-16 Degussa Aktiengesellschaft Pastes for fired-on layers
EP0843319A1 (fr) * 1996-11-14 1998-05-20 Degussa Aktiengesellschaft Pâte pour des couches âptes à être cuites
EP0889010A1 (fr) * 1997-06-30 1999-01-07 Fry's Metals, Inc. Pâte à souder du verre pour tubes à rayons cathodiques
US6183871B1 (en) 1997-06-30 2001-02-06 Fry's Metals, Inc. Sealing glass paste for cathode ray tubes
WO1999015334A1 (fr) * 1997-09-22 1999-04-01 Telefonaktiebolaget Lm Ericsson (Publ) Procede de transfert d'une image sur une surface
US6158341A (en) * 1997-09-22 2000-12-12 Telefonaktiebolaget L M Ericsson (Publ) Method for transferring a picture to a surface
CN1325255C (zh) * 1997-09-22 2007-07-11 艾利森电话股份有限公司 将导电图象转印到表面的方法和装置
US6090449A (en) * 1998-01-27 2000-07-18 Ferdinando; Peter G. Slow-drying aqueous-based coating materials and painting techniques for the use thereof
WO2000020519A3 (fr) * 1998-10-07 2001-11-29 Bayer Ag Preparations contenant des oxydes inorganiques a fines particules
CZ303368B6 (cs) * 2000-01-10 2012-08-15 Sicpa Holding Sa Povlaková kompozice, výhodne tiskarská barva, pro bezpecnostní aplikace, zpusob výroby povlakové kompozice a použití sklokeramických materiálu
US6613137B2 (en) 2000-01-10 2003-09-02 Sicpa Holding S.A. Coating composition, preferably printing ink for security applications, method for producing a coating composition and use of glass ceramics
AU776197B2 (en) * 2000-01-10 2004-09-02 Sicpa Holding Sa Coating composition, preferably printing ink for security applications, method for producing a coating composition and use of glass ceramics
EP1116755A1 (fr) * 2000-01-10 2001-07-18 Sicpa Holding S.A. Composition de revêtement, de préférence d 'encre d'imprimerie pour marquage de sécurité, procédé de production pour une composition de revêtement et utilisation de vitro-céramique
WO2001051571A3 (fr) * 2000-01-10 2002-03-07 Sicpa Holding Sa Composition de revetement, de preference encre d'impression pour applications de securite, procede de production d'une composition de revetement et utilisation de composites a matrice vitroceramique
JP2002173597A (ja) * 2000-05-23 2002-06-21 Toray Ind Inc ペースト、ディスプレイ部材およびディスプレイ部材の製造方法
US7238296B2 (en) * 2002-09-13 2007-07-03 Koa Kabushiki Kaisha Resistive composition, resistor using the same, and making method thereof
WO2005052071A1 (fr) * 2003-11-25 2005-06-09 Johnson Matthey Public Limited Company Composition d'encre d'impression numerique
WO2011079402A1 (fr) * 2009-12-29 2011-07-07 Sawgrass Europe Sa Encre à rhéologie modifiée et procédé d'impression
CN102753629A (zh) * 2009-12-29 2012-10-24 索格拉斯欧洲股份有限公司 流变改性的油墨和印刷方法
AU2010339037B2 (en) * 2009-12-29 2014-12-18 Jk Group S.P.A. Rheology modified ink and printing process
US9758687B2 (en) 2009-12-29 2017-09-12 Mickael Mheidle Rheology modified ink and printing process

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