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WO1996004095A1 - Appareil de soudure - Google Patents

Appareil de soudure Download PDF

Info

Publication number
WO1996004095A1
WO1996004095A1 PCT/JP1995/001540 JP9501540W WO9604095A1 WO 1996004095 A1 WO1996004095 A1 WO 1996004095A1 JP 9501540 W JP9501540 W JP 9501540W WO 9604095 A1 WO9604095 A1 WO 9604095A1
Authority
WO
WIPO (PCT)
Prior art keywords
soldering
nitrogen gas
oxygen
zone
gas curtain
Prior art date
Application number
PCT/JP1995/001540
Other languages
English (en)
Inventor
Toshiaki Yamasaki
Yoshiaki Yoshida
Original Assignee
Teisan Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teisan Kabushiki Kaisha filed Critical Teisan Kabushiki Kaisha
Publication of WO1996004095A1 publication Critical patent/WO1996004095A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/012—Soldering with the use of hot gas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Definitions

  • the present invention relates to a soldering apparatus, and, in particular, to a soldering apparatus for soldering printed boards having electronic parts attached thereon, after a flux is applied thereto.
  • CFC chlorofluorocarbon
  • a first method entails actually changing the washing system and the second entails a non-washing.
  • the method of changing the washing system the following methodologies are known. First, on soldering, a water-soluble flux may be used, and water-washing may be effected.
  • a conventional flux may be used, and on washing, water admixed with a saponifying agent or another organic solvent, such as an alcohol, may be used.
  • a substitute freon may be used which does not adversely affect the ozone layer.
  • methods for automatically soldering printed boards may be classified into two systems, a flow system or a reflow system.
  • the inside of the soldering apparatus is deactivated by nitrogen gas to restrict the oxygen content therein, with the result that excellent soldering can be realized even with a flux having a poor soldering feature, by preventing reoxidation in the inside of the apparatus.
  • the wettability of the solder is controlled by changing the quantity of the solder used and the quantity of the activator contained therein.
  • wettability of a solder refers to the ability of the solder to conform to the soldering surface of parts when the activating temperature of a flux and the dissolving temperature of a solder are balanced.
  • the present invention provides a soldering apparatus having a preheating zone and a soldering zone, whereby a relatively constant level of oxygen concentration may be maintained in the furnace atmosphere.
  • the present invention provides a soldering apparatus, the use of which avoids the formation of flux residues on printed boards.
  • a soldering apparatus which contains: a preheating zone and a soldering zone, which are adjacent to each other; conveyor means for articles to be soldered, which passes through these two zones; means for introducing nitrogen gas containing oxygen into the preheating zone as an atmospheric gas; means for introducing nitrogen into the soldering zone as an atmospheric gas; and means for forming a first nitrogen gas curtain and a second nitrogen gas curtain between both preheating and soldering zones and on the exit side of the soldering zone, respectively.
  • FIG. 1 is an explanatory longitudinal sectional view of the soldering apparatus according to the present invention.
  • FIG. 2 is an explanatory plane view of the soldering apparatus according to the present invention.
  • FIG. 3 is a perspective view of the duct in the soldering apparatus according to the present invention.
  • FIG. 4 is an explanatory view of the atmosphere gas supply unit used in the soldering apparatus according to the present invention.
  • the present invention is predicated upon each of these discoveries.
  • the soldering apparatus is contained in a housing and is generally characterized by a preheating zone and a soldering zone, which are adjacent to each other; a conveyor means for articles to be soldered, which passes through these two zones; means for introducing nitrogen gas containing oxygen into the preheating zone as an atmospheric gas; a means for introducing nitrogen gas into the soldering zone as an atmospheric gas; and means for forming a first nitrogen gas curtain and a second nitrogen gas curtain between both the preheating and soldering zones and on the exit side of said soldering zone, respectively.
  • Each of the first and second nitrogen gas curtain forming means of the present invention contain a double pipe composed of an outer pipe and an inner pipe, each having a slit extending in its axial direction, and the respective slits are positioned on the sides opposite to each other.
  • the slit of the second nitrogen gas curtain forming means forms a nitrogen gas curtain inclined at an angle of about 15° to 90° downward from the horizontal plane toward the direction of the preheating zone.
  • the means for introducing the nitrogen gas containing oxygen of the present invention includes a means for measuring the quantity of oxygen in the preheating zone and regulating said quantity of oxygen in accordance with the kind of a flux used in the soldering.
  • the reference numeral (1) designates an automatic soldering mechanism for carrying out the soldering of printed circuit assemblies after a flux is applied on their soldering surface.
  • Reference numeral (2) designates a conveyor belt for articles to be soldered such as printed boards coated with a flux.
  • Reference numeral (3) designates a housing.
  • Reference numeral (4) designates a preheater, and reference numeral (5) designates a jet type solder tank.
  • Reference numeral (6) designates a molten solder basin
  • reference numeral (7) designates the upper portion (hood) of a structural front member disposed just above a preheating zone having said preheater (4)
  • Reference numeral (8) designates the upper portion (hood) of a structural center member disposed just above a soldering zone opposed to said solder tank (5).
  • Reference numeral (9) designates an entrance for conveyance of the printed boards formed upstream of said soldering zone, and reference numeral (10) designates an exit for conveyance of the printed boards formed downstream of said soldering zone.
  • a given flow rate of nitrogen gas in which a preferred amount of oxygen gas, for example, oxygen gas in a fine amount of about
  • a nitrogen gas curtain gushing duct Between hoods (7) and (8) is disposed a nitrogen gas curtain gushing duct (15), and between the portion of the exit (10) for the printed board in hood (8) and the upper portion (hood) (16) of a structural rear member is also disposed nitrogen gas curtain gushing duct (17) .
  • nitrogen gas for example, at about 12.5 Nm 3 /h, is released vertically downwards under a pressure, for example, of about 3.5 kg/cm 2 , so as to form a gas curtain, and through the gas curtain gushing duct (17), nitrogen gas is also released at an angle inclined about 15°-90° downward from the horizontal plane towards exit (10) in said hood (8), so as to form a gas curtain.
  • Each of gas curtain gushing ducts (15) and (17) of the present invention contains a double pipe composed of an outer pipe (19) having a slit opening (18) in its axial direction and an inner pipe (21) also having a siit opening (20) in its axial direction, as shown in Figure 3, and the outer and inner pipes (19) and (21) are arranged so that their slit openings (18) and (20) are at 180 c -angled positions different from each other.
  • outer pipe (19) of ducts (15) and (17) is arranged so that the direction of its slit opening (18) is perpendicular to the conveying direction of said printed boards.
  • a nitrogen atmosphere gas containing oxygen which is released from release pipe (11) into the duct (7) of the present invention, may be prepared as described below with reference to Figure 4.
  • FIG. 4 shows an atmospheric gas supply unit used in the soldering apparatus according to the present invention.
  • the nitrogen atmosphere gas containing a fine amount of oxygen gas to be supplied to the release pipe (11) is introduced thereinto through a flow meter G4 and a pipe line H, after its mixing ratio is determined by a combination of anyone of pipe lines El, E2 and E3 connected with an oxygen gas source (not shown) by way of plural flow meters Gl - G3, which are different in flow rate and each has a stop valve DI, D2 or D3 inserted therein, and a pipe line C connected to a nitrogen gas source (not shown) .
  • nitrogen gas is introduced from pipe line (F) through flow meter G5 and a pipe line J.
  • nitrogen gas whose flow rate is regulated for example, to a flow rate of about 12.5 Nm 3 /h by means of a flow meter G6, is sent out under a pressure of about 3.5 kg/cm 2 , so as to form a gas curtain, thereby intercepting the nitrogen atmosphere gas containing a fine amount of oxygen blown in the preheating zone and the nitrogen atmosphere gas blown in the soldering zone.
  • nitrogen gas whose flow rate is regulated by means of a flow meter G7 is sent out.
  • reference letter K designates a mixer
  • L designates an oxygen analyzer
  • M designates a recorder
  • a soldering apparatus comprising: preheating zone and a soldering zone, which are adjacent to each other; conveyor means for articles to be soldered, which passes through said two zones; means for introducing nitrogen gas containing oxygen into said preheating zone as an atmospheric gas; means for introducing nitrogen gas into the soldering zone as an atmospheric gas; and means for forming a first nitrogen gas curtain and a second nitrogen gas curtain between both said pre ⁇ heating and soldering zones and on the exit side of said soldering zone, respectively.
  • said first and second nitrogen gas curtain forming means comprise a double pipe composed of an outer pipe and an inner pipe, each having a slit extending in its axial direction, and the respective slits are positioned on the sides opposite to each other.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Appareil de soudure comportant une zone de préchauffage et une zone de soudage contiguës, des moyen de convoyage des articles à souder à travers lesdites zones, des moyens d'injection d'azote oxygéné servant d'atmosphère dans la zone de préchauffage, des moyens d'injection d'azote servant d'atmosphère dans la zone de soudage, et des moyens de formation d'un premier et d'un second rideau d'azote respectivement disposés entre les susdites zones et à la sortie de la zone de soudage.
PCT/JP1995/001540 1994-08-04 1995-08-03 Appareil de soudure WO1996004095A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP6/201556 1994-08-04
JP6201556A JPH0846346A (ja) 1994-08-04 1994-08-04 はんだ付け装置

Publications (1)

Publication Number Publication Date
WO1996004095A1 true WO1996004095A1 (fr) 1996-02-15

Family

ID=16443011

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP1995/001540 WO1996004095A1 (fr) 1994-08-04 1995-08-03 Appareil de soudure

Country Status (2)

Country Link
JP (1) JPH0846346A (fr)
WO (1) WO1996004095A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19624182A1 (de) * 1996-06-18 1998-01-02 Goetz Thomas Schutzgaskammer zum flußmittelfreien Hartlöten
FR2757650A1 (fr) * 1996-12-20 1998-06-26 Air Liquide Procede d'alimentation en gaz d'une enceinte et methode de regulation de la teneur en un element donne de l'atmosphere d'une telle enceinte
DE19723894A1 (de) * 1997-06-06 1998-12-10 Seho Systemtechnik Gmbh Prozeßkammer zur thermischen Behandlung von Oberflächen mit einem Prozeßgas

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1990003864A1 (fr) * 1988-10-07 1990-04-19 Hollis Automation, Inc. Systeme de soudage simultane a jet de fluide ameliore
DE4136806A1 (de) * 1991-11-08 1993-05-13 Ernst Hohnerlein Loettunnel
US5364011A (en) * 1993-04-05 1994-11-15 Ford Motor Company Micro soldering system for electronic components

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10275046A (ja) * 1997-03-31 1998-10-13 Toshiba Corp 単語入力装置及び方法
JP5731281B2 (ja) * 2011-05-31 2015-06-10 Kddi株式会社 文字入力装置およびプログラム

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1990003864A1 (fr) * 1988-10-07 1990-04-19 Hollis Automation, Inc. Systeme de soudage simultane a jet de fluide ameliore
DE4136806A1 (de) * 1991-11-08 1993-05-13 Ernst Hohnerlein Loettunnel
US5364011A (en) * 1993-04-05 1994-11-15 Ford Motor Company Micro soldering system for electronic components

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19624182A1 (de) * 1996-06-18 1998-01-02 Goetz Thomas Schutzgaskammer zum flußmittelfreien Hartlöten
FR2757650A1 (fr) * 1996-12-20 1998-06-26 Air Liquide Procede d'alimentation en gaz d'une enceinte et methode de regulation de la teneur en un element donne de l'atmosphere d'une telle enceinte
WO1998028102A1 (fr) * 1996-12-20 1998-07-02 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Procede d'alimentation en gaz d'une enceinte et methode de regulation de la teneur en un element donne de l'atmosphere d'une telle enceinte
US6074203A (en) * 1996-12-20 2000-06-13 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Method for supplying gas to a chamber and method for regulating the content of a given element in the atmosphere of such a chamber
DE19723894A1 (de) * 1997-06-06 1998-12-10 Seho Systemtechnik Gmbh Prozeßkammer zur thermischen Behandlung von Oberflächen mit einem Prozeßgas

Also Published As

Publication number Publication date
JPH0846346A (ja) 1996-02-16

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