WO1996005660A1 - Ensemble de transmission/reception par faisceaux hertziens - Google Patents
Ensemble de transmission/reception par faisceaux hertziens Download PDFInfo
- Publication number
- WO1996005660A1 WO1996005660A1 PCT/GB1995/001958 GB9501958W WO9605660A1 WO 1996005660 A1 WO1996005660 A1 WO 1996005660A1 GB 9501958 W GB9501958 W GB 9501958W WO 9605660 A1 WO9605660 A1 WO 9605660A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- microwave
- transmit
- mic
- receive assembly
- receive
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
- H04B1/403—Circuits using the same oscillator for generating both the transmitter frequency and the receiver local oscillator frequency
Definitions
- This invention relates to a microwave transmit/receive assembly, particularly for a microwave radio system.
- Microwave radio systems which use a common antenna for transmitting and receiving microwave signals.
- the microwave-frequency portions of the transmit/receive circuitry have involved several assemblies of relatively complex construction, interconnected by coaxial cables and/or waveguides.
- a microwave transmit/receive assembly which comprises a printed circuit board, a microwave integrated circuit (MIC) module mounted on the printed circuit board, and a microwave filter block, particularly an E-plane filter block, the MIC module comprising a metal base plate having a dielectric face layer which carries conductive tracks forming microstrip transmit and receiver circuitry, the MIC module including stripline-to- waveguide transitions for coupling signals between the MIC circuits and respective waveguide interfaces of the filter block.
- MIC microwave integrated circuit
- the filter block includes an interface to a common transmit/receive antenna.
- the filter block further comprises waveguide interfaces for signal connection to the MIC and metallic filter foils for processing of the microwave transmit and receive signals.
- the conductive paths on the baseplate preferably form microwave components e.g. attenuators, filters and mixers (for signal upconversion or downconversion) for processing the signals to be transmitted via the antenna and for processing the signals received via the antenna.
- Discrete components including active components such as unpackaged semiconductor transistors or diodes, or monolithic microwave integrated circuits (MMIC's) are preferably mounted to the baseplate.
- these components are located in respective apertures in the baseplate and held in position by resin or other composition which fills the space within the aperture and surrounding the component, the resin or other composition having been allowed or caused to set so as to bond the component in position.
- the assembly comprises additional circuitry carried on the printed circuit board (or PCB) , which is positioned face-to-face against the underside of the MIC baseplate. Connections between the circuits on the MIC and the circuits on the PCB are effected by hermetic transistor header feedthroughs which are secured in holes formed in the MIC baseplate: on the MIC side, bond wires link the MIC circuit tracks to respective conductors of the transistor header whilst, on the PCB side, the transistor header pins plug into through-holes or sockets in the PCB.
- the transistor header feedthroughs are inexpensive components but provide effective electrical connection between the MIC and PCB, particularly for the transfer of DC voltages and UHF and low microwave frequency signals.
- the microwave transmit/receive assembly in accordance with this invention involves close integration of transmit and receive circuits and of PCB, MIC, and E-plane assemblies.
- the interconnections between the E-plane filter block and MIC module, and between the MIC module and PCB are simple, inexpensive yet effective and reliable.
- all connections to or from the MIC module are via the inexpensive transistor header feedthroughs for signals below typically 3 Ghz, and via waveguide interfaces for higher frequencies.
- FIGURE 1 is a plan view of a microwave transmit/receive assembly in accordance with this invention, shown with a cover of the MIC module partially broken away to show details of the latter;
- FIGURE 2 is a sectional view through the transmit/receive assembly of Figure 1, shown with one of the main halves of the E-plane filter block partially broken away;
- FIGURE 3 is an end view of the transmit/receive assembly
- FIGURE 4 is an enlarged sectional view to show use of a transistor header to interconnect circuitry on the MIC with circuitry on a printed circuit board and also the mounting of a semiconductor device.
- a microwave transmit/receive assembly in accordance with this invention comprises a microwave integrated circuit module MIC mounted to an E-plane filter block E: a printed circuit board PCB carries additional circuitry and has a rectangular aperture 5 over which the MIC module sits, and through which the E-plane filter block projects.
- the MIC module comprises a metal baseplate B having a ptfe loaded low loss dielectric layer D carrying conductive microstrip tracks T forming microwave integrated circuitry as will be described.
- the baseplate B is formed with four apertures 1, 2, 3, 4 which provide microstrip-to-waveguide transitions: the MIC module is bolted to the end of the E- plane filter block so that the transition apertures 1 to 4 align with openings in the end of the filter block, these openings forming the input and output ports to waveguide channels of the filter block with choke grooves CH to provide high isolation between the waveguides.
- a backshort BS is mounted: in Figure 1, the backshort for transition aperture 4 is shown partly broken away to show the probe which projects across the transition aperture from the microstrip circuitry on the baseplate B.
- the MIC module further comprises a covering lid C, the rim of which fits onto a recessed ledge running around the periphery of the baseplate B and is bonded to it to provide a hermetic seal for the assembly: the lid C also has internal partitions P which fit into corresponding grooves formed in the top side of the baseplate B in order to provide isolation between circuit elements.
- the MIC module baseplate B is formed with a number of circular holes into each of which a transistor header (e.g. T072 style) is bonded, as shown for transistor header TH in Figure 4.
- a transistor header e.g. T072 style
- bond wires W link the MIC circuit tracks to the individual conductors of the transistor header
- the transistor header pins plug into sockets S formed through the PCB and which link to the PCB tracks T 1 .
- the various transistor headers (shown for example at TH1, TH2 .... in Figure 1) are used to transfer DC voltages and UHF or low microwave frequency signals between the PCB and MIC.
- the MIC module carries circuits for processing signals to be transmitted and for processing received signals, in stripline form.
- Various semiconductor chips M are also mounted to the MIC baseplate, and bonded to the tracking T with wire links W.
- Figures 2 and 3 show the E-plane filter block, which is formed of two main halves 10,12 bolted together with filter foils clamped between them:
- Figure 2 shows the filter block with one half broken away, to show the waveguide channels and the filter foils FL3 , FL4 , FL5.
- the diplexer port 14 is, in use, connected to the common transmit/receive antenna of the microwave radio system.
Landscapes
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Microwave Amplifiers (AREA)
Abstract
Ensemble de transmission/réception par faisceaux hertziens qui comporte un module de circuit intégré pour micro-ondes (MIC) monté sur un bloc filtre à plan E (E). Le module MIC comprend une plaque de base métallique (B) dotée d'une couche diélectrique (D) portant des pistes conductrices (T) microruban qui forment un circuit intégré pour micro-ondes destiné à la transmission et à la réception de signaux. La plaquette de circuit imprimé (PCB) porte des circuits supplémentaires et le module MIC et la PCB sont connectés à l'aide d'embases de transistor (TH). Par conséquent, la construction dudit ensemble de transmission/réception par faisceaux hertziens est relativement simple et peu onéreuse parce qu'il n'est plus nécessaire de recourir à plusieurs ensembles complexes qui doivent être connectés, par exemple, par un câble coaxial.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU32299/95A AU3229995A (en) | 1994-08-17 | 1995-08-17 | Microwave transmit/receive assembly |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB9416638A GB2292484B (en) | 1994-08-17 | 1994-08-17 | Microwave transmit/receive assembly |
GB9416638.6 | 1994-08-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1996005660A1 true WO1996005660A1 (fr) | 1996-02-22 |
Family
ID=10759992
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/GB1995/001958 WO1996005660A1 (fr) | 1994-08-17 | 1995-08-17 | Ensemble de transmission/reception par faisceaux hertziens |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU3229995A (fr) |
GB (1) | GB2292484B (fr) |
WO (1) | WO1996005660A1 (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7683827B2 (en) | 2004-12-15 | 2010-03-23 | Valeo Radar Systems, Inc. | System and method for reducing the effect of a radar interference signal |
US7603097B2 (en) | 2004-12-30 | 2009-10-13 | Valeo Radar Systems, Inc. | Vehicle radar sensor assembly |
US7680464B2 (en) * | 2004-12-30 | 2010-03-16 | Valeo Radar Systems, Inc. | Waveguide—printed wiring board (PWB) interconnection |
US9653796B2 (en) | 2013-12-16 | 2017-05-16 | Valeo Radar Systems, Inc. | Structure and technique for antenna decoupling in a vehicle mounted sensor |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5202648A (en) * | 1991-12-09 | 1993-04-13 | The Boeing Company | Hermetic waveguide-to-microstrip transition module |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2606936B1 (fr) * | 1986-04-07 | 1991-07-19 | Motorola Inc | Appareil de combinaison d'emetteurs en ceramique muni d'un troncon d'accord de longueur electrique variable et d'une interface a boucles de couplage |
-
1994
- 1994-08-17 GB GB9416638A patent/GB2292484B/en not_active Expired - Fee Related
-
1995
- 1995-08-17 AU AU32299/95A patent/AU3229995A/en not_active Abandoned
- 1995-08-17 WO PCT/GB1995/001958 patent/WO1996005660A1/fr active Application Filing
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5202648A (en) * | 1991-12-09 | 1993-04-13 | The Boeing Company | Hermetic waveguide-to-microstrip transition module |
Non-Patent Citations (1)
Title |
---|
K. OGAWA ET AL.: "A 50 GHz GaAs FET MIC transmitter/receiver using hermetic miniature probe transitions", IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, vol. 37, no. 9, NEW YORK US, pages 1434 - 1441, XP000038627 * |
Also Published As
Publication number | Publication date |
---|---|
AU3229995A (en) | 1996-03-07 |
GB2292484A (en) | 1996-02-21 |
GB9416638D0 (en) | 1994-10-12 |
GB2292484B (en) | 1997-09-17 |
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