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WO1996008338A1 - Procede et dispositif d'application d'un materiau de connexion sur une plage de connexion sur un substrat - Google Patents

Procede et dispositif d'application d'un materiau de connexion sur une plage de connexion sur un substrat Download PDF

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Publication number
WO1996008338A1
WO1996008338A1 PCT/DE1995/001239 DE9501239W WO9608338A1 WO 1996008338 A1 WO1996008338 A1 WO 1996008338A1 DE 9501239 W DE9501239 W DE 9501239W WO 9608338 A1 WO9608338 A1 WO 9608338A1
Authority
WO
WIPO (PCT)
Prior art keywords
connecting material
placing
connection surface
connection
placement
Prior art date
Application number
PCT/DE1995/001239
Other languages
German (de)
English (en)
Inventor
Joachim Eldring
Erik Jung
Elke Zakel
Original Assignee
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. filed Critical Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
Publication of WO1996008338A1 publication Critical patent/WO1996008338A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/06—Soldering, e.g. brazing, or unsoldering making use of vibrations, e.g. supersonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J2219/00274—Sequential or parallel reactions; Apparatus and devices for combinatorial chemistry or for making arrays; Chemical library technology
    • B01J2219/00277—Apparatus
    • B01J2219/00457—Dispensing or evacuation of the solid phase support
    • B01J2219/00459—Beads
    • B01J2219/00468—Beads by manipulation of individual beads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01061—Promethium [Pm]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases

Definitions

  • the present invention relates to a process for the applica tion ⁇ lumpy, in particular spherical Wireless Manager ⁇ TERIAL on a substrate pad, wherein the V erbin--making material for the singled orientation relative to the
  • Substrate pad for a subsequent Gottsvor ⁇ gear with the substrate pad in a Plaziereinrich ⁇ is arranged as well as a processing device according to the Oberbe ⁇ handle of claim 11.
  • a method for the application of solder balls is known from the BGA (Ball Grid Array) technique, be disposed at the solder balls in a predetermined distribution on the back of a chip carrier to a contact with a disposed on the side opposite ⁇ of the chip carrier chips enable.
  • BGA Bit Grid Array
  • the particular for application of the solder balls pads of the chip carrier prior to the application of the solder balls are wetted with a formed, for example, a tacky flux adhesion promoter and then applied, the solder balls in a vibration process to the back of the C hipdes so that few of the applied solder balls stick to the sticky pads. The remaining solder balls fall off the back of the chip carrier.
  • a placement device only serves to align the spherical connection material with the connection surfaces of the film carrier. Establishing the connection between the connecting material and the connecting surfaces, the connecting surfaces are lowered onto the connecting material arranged in the placement device in a defined relative arrangement and connected to the connecting material by backward application of a connecting tool under the influence of pressure and temperature.
  • the known method requires a further one Device which enables the placement device to be equipped with connecting material.
  • the present invention is therefore based on the object of creating a method and a device which enables reliable, automated application of solder balls to substrate connection surfaces with as little effort as possible.
  • the placing device serves not only to align the connecting material with respect to the substrate connecting surface as preparation for the subsequent connection, but also to handle the connecting material, namely for receiving and placing the same on the respective substrate connecting surface, and for Execution of the connection process itself.
  • the placing device serves both as a handling device and as a connecting device.
  • the connection material is thus picked up, placed and connected in the method according to the invention with one and the same device.
  • connection material has been picked up
  • the placement device is subjected to vibrations which are generated by ultrasound, for example.
  • This can result in incorrect alignment of the connection terials are corrected by the placement device after it has been received.
  • a vibration application for example an ultrasound application, can provide a remedy here by means of a vibration-induced separation.
  • a further advantageous type of separation is provided if the separation takes place in a separation device formed on a material reservoir before the connecting material is picked up by the placing device. This makes it possible to pick up the connecting material pieces already in the separated state by the placing device.
  • the placement device is subjected to ultrasound to center the piece of connecting material on the placement device.
  • no separate device is required for centering the connecting material pieces on the placing device.
  • the centering takes place at the same time as the separation; thus in one and the same working step.
  • the separation can take place in a particularly simple manner in the separation device if it is brought about by the influence of gravity.
  • This type of separation can be supported by an ultrasound application and / or an air flow.
  • the method can be carried out with a placement device which is used to hold a single piece of connecting material or to hold several pieces of connecting material defined in their relative arrangement.
  • the first application is, for example, in the placement of connecting material pieces on connection surfaces of a chip which is provided for contacting using the flip-chip method.
  • the second application is, for example, when the method for generating a ball grid array is used.
  • the so-called ball wedge bonding which is used conventionally for the electrical contacting of semiconductor elements with a substrate, is carried out by means of a wire bonding device which has a wire bonding capillary with a channel for feeding the bonding wire and a mouthpiece for producing the
  • Ball or wedge bonds When this wire bonding device is used conventionally, a ball (ball) is first produced by melting an end of the wire protruding from the mouthpiece, which ball is pressed against a connection surface with the mouthpiece of the wire bonding capillary under the action of pressure temperature and ultrasound to produce the ball bonds. The melting takes place by means of a so-called flame lance, which is designed as an electrode and is moved towards the end of the wire by means of a feed device. The formation of an arc between the electrode and the mouthpiece ensures the melting of the wire end. For sale 6 Binding with a further connection surface, the wire bond capillary is moved to the latter, the bond wire being pulled out of the wire bond capillary with the formation of a wire loop.
  • the bond wire is finally connected to the further connection surface by lowering the mouthpiece of the wire bond capillary onto the connection surface, the wedge bond being formed by squeezing the bond wire between the mouthpiece and the connection surface.
  • a predetermined breaking point is formed on the bond wire, at which it tears under tensile stress.
  • connection material is advantageously picked up in the wedge bond phase and the connection material is placed in the ball bond phase.
  • a vacuum source for generating a vacuum is connected to the mouthpiece of the wire bonding capillary serving as a placement device, so that it does not, as in the conventional wire bonding technology, for feeding the bonding wire , but serves to create a vacuum on the mouthpiece of the wire bond capillary.
  • the transfer of the wire bonding capillary from one connection surface to the next connection surface does not serve to form a wire loop, but rather to transport the piece of connecting material to the connection surface.
  • the lowering height of the wire bond capillary above the connecting material to be received is selected so that the connecting material can be taken up without deformation.
  • the ball-bond phase which serves to place and deform the connection material to produce a bond connection on the connection surface, the lowering height of the wire bond capillary is set approximately to the level of the connection surface.
  • the flame lance feed device can be advantageously used Use way for the infeed movement or reset movement of the separating device described above.
  • the device according to the invention has the features of claim 11.
  • the placing device in addition to receiving the connecting material, the placing device also serves to place and connect it to the substrate connection surface, which results in the advantages explained above in connection with the method according to the invention.
  • the placement device is designed as part of a wire bonding device. This makes it possible to reduce the effort for providing the device to a minimum, since essentially a conventional wire bonding device can be used.
  • the wire bonding capillary which in any case forms part of the conventional wire bonding device, can be used to form the placement device, with the proviso that the capillary is not used to feed a bonding wire to its mouthpiece, but rather to create a vacuum on the mouthpiece .
  • a modified conventional wire bonding device serves as an application device, with the proviso that instead of a wire bonding capillary, a placement device is used which is designed as a stem-shaped tool with an arrangement of receptacles for connecting material pieces, the receptacles having a Vacuum can be applied.
  • the placing device is used for the singular application of connecting material pieces; in the case of the second embodiment for the application of a plurality of pieces of connecting material which are in a defined relative arrangement.
  • a connecting material removal device is provided for separating pieces of connecting material, which device is combined with a flame lance delivery device of the wire bonding device. This makes it possible to design the placing device to be movable only in one axis and to feed the connecting material removal device to the placing device with a uniaxial movement for receiving the pieces of connecting material by the placing device.
  • connection material removal device is combined with a singling device, previously separated connection material pieces can be removed from the connection material device with the placement device.
  • a particularly simple design of the separating device is possible if it has a drop channel connecting a material reservoir to the connecting material removal device.
  • the mode of operation of the separating device can be supported by combining the separating device with an ultrasonic oscillating head.
  • FIG. 1 shows an application device with a placement device for the direct removal of connecting material pieces from a material reservoir
  • FIG. 2 shows the placing device used in the application device according to FIG. 1 in individual representation
  • FIG. 3 shows an alternative embodiment of a placement device that can be used in the application device according to FIG. 1;
  • Fig. 4 is a bottom view of that shown in Fig. 3 Placing device showing a relative arrangement of placed connecting material pieces made possible by means of this placing device;
  • FIG. 5 shows an application device in which the material reservoir is connected to a removal device via a feed device
  • FIG. 6 shows an application device in which a material preparation device formed from the material reservoir, the feed device and the removal device can be moved relative to the placement device via an infeed device.
  • an application device 10 for applying pieces of connecting material 11, which are spherical here, to a connecting surface 12 of a substrate, which is designed here as a chip 13.
  • the same application device 10 can also be used to equip connection areas of a chip carrier (not shown in more detail here) for producing a ball grid array or also to populate connection areas of a wafer (also not shown in more detail here), from which chips are then separated by being separated are producible.
  • the application device 10 shown in FIG. 1 has a placement device 14 designed as a wire bond capillary of a wire bond device, which takes connection pieces 11 for subsequent application on the connection surfaces 12 from a material reservoir 15 filled with connection material pieces 11.
  • the application device 10 essentially corresponds to a conventional wire bonding device of the type used in wire bonding technology for the production of wire contacts between a semiconductor and a further substrate in the ball wedge process.
  • the placement device 14 is lowered with its mouthpiece 16 into the material reservoir 15 from a starting position (not shown).
  • the lowering depth can be set by appropriate programming of the wire bond device or, as shown in FIG. 1, by a height stop 17. In any case, the lowering depth is selected such that the mouthpiece 16 is brought as close as possible to the connecting material pieces 11 without deformation, so that the connecting material pieces 11 adhere to the mouthpiece 16 by means of a vacuum acting on the mouthpiece 16 through a capillary channel 18.
  • the vacuum can be generated by a vacuum pump (not shown here) connected to the capillary channel 18, which is provided with a valve device (also not shown in more detail) for switching the vacuum on and off.
  • the flexibility of the mass of the connecting material pieces 11 present as bulk material in the material reservoir 15 also contributes to preventing deformation of the connecting material pieces 11 when they are picked up by the placing device 14.
  • the placing device 14 After the connecting material pieces 11 have been picked up by the placing device 14, the latter is moved into a transition position II which is elevated relative to the material reservoir 15 and which can correspond to the aforementioned starting position. Starting from this transitional position II, in a second phase there is an infeed movement in the direction of arrow 46 into a contacting starting position III, from which the placing device 14 finally in a third phase for placing or contacting the connecting material piece 11 on the connecting surface 12 in a contact position IV is lowered.
  • the lowering depth is in turn set by appropriate programming of the wire bonding device or, as shown in FIG. 1, by a corresponding height stop 19.
  • the lowering depth in the third phase is set such that a deformation of the connecting material piece 11 to form a bump-like contact metallization 20 shown in dash-dotted lines in FIG. 1 occurs on the connection surface 12.
  • the placing device 14 is subjected to pressure and temperature and, if an ultrasound wire bonding device is used, ultrasound is also applied, so that a connection between the connecting material piece 11 and the connection surface 12 is analogous to that known from wire bonding technology Friction welding process with the connection surfaces 12 of the substrate formed here as a chip 13 can take place.
  • connection between the connecting material piece 11 and the connecting surface 12 can take place in the ball mode, whereas the connection material pieces 11 can be picked up by the placing device 14 in the wedge mode can.
  • the automated method can be adopted from wire bonding technology to carry out the above-described application of connecting material pieces 11 on the connection areas 12 of the chip 13.
  • the wire bonding capillary used as the placement device 14 is provided with an ultrasonic oscillating head, usually referred to as a transducer 21.
  • the transducer 21 is not only used, as is known from wire bonding technology, for ultrasound application of the wire bonding capillary when contacting the connecting surface in the friction welding process, but also for separating and centering the connecting material pieces 11 on the mouthpiece 16 of the placing device 14
  • the vacuum acting on the mouthpiece 16 when connecting material pieces 11 are received from the material reservoir 15 often results in the adhesion of several material pieces 11.
  • the placing device 14 is moved with an ultrasound pulse when it is transferred to the transition position II that has two positive effects.
  • excess connecting material pieces 11 are shaken off the mouthpiece 16
  • the relative movement of the remaining connecting material piece 11 relative to the mouthpiece 16 results in a quasi-automatic centering of the connecting material piece 11 with respect to the mouthpiece 16.
  • This also ensures that the subsequent placement of the connecting material piece 11 on the connection surface 12, the position of the connecting material piece 11 in a horizontal positioning plane 22 essentially coincides with the position of the placing device 14, so that there is no lateral displacement of the connecting material piece 11 relative to the connecting surface 12, with the result of incorrect contacts can come.
  • a time of one second has proven to be sufficient as the duration of the ultrasound pulse.
  • both the container serving as material reservoir 15 and the placing device are electrically conductive, so that electrostatic charging effects which lead to sticking Vietnamesesmaterial- pieces 11 on the mouthpiece 16, the placement means 14 can also lead after disconnection of the vacuum, from the outset been ⁇ be included.
  • FIG. 2 shows the placement device 14 used in the application device 10 and designed as a wire bond capillary in a single illustration.
  • the placement device 14 used in the aforementioned experiments was approximately 1.1 cm long and had an outer diameter of approximately 0.16 cm.
  • the capillary channel 18 had a diameter of 25 ⁇ m and the surface of the placing device was coated with a gold plating applied in a sputtering apparatus.
  • the connecting material pieces 11 used were designed as solder balls made of a eutectic lead-tin alloy with a diameter of 90 ⁇ m.
  • FIG. 3 shows, in an alternative embodiment, a placing device 22 which can be used in an identical manner to the placing device 14 shown in FIG. 1 as part of the application device 10, with the difference that the placing device 22 is used for placing and Contacting of a plurality of connecting material pieces 11 can take place simultaneously and while maintaining a predetermined relative positioning of the connecting material pieces 11.
  • the placing device 22 consists of a capillary part 23, the dimensions of which essentially correspond to the placing device 14 shown in FIG. 1, with a capillary channel 24, which is accommodated in a vacuum chamber 25 of a stamp plate receptacle 26 opens.
  • a stamp plate 27 with a bore arrangement 48 (FIG. 4) is arranged on the stamp plate receptacle 26 to form connecting material receptacles 28 for receiving individual connecting material pieces 11.
  • the connecting material pieces 11 adhere to the placement device 22 under the action of vacuum in the connecting material receptacles 28.
  • FIG. 4 shows, in addition to a bottom view of the placing device 22 with connecting material pieces 11 arranged in the connecting material receptacles 28, a distribution pattern 30 of the connecting material pieces 11 that can be achieved by means of the placing device 22 on a substrate 29.
  • This illustration clearly shows that the placement device 22 allows the design to be arbitrary Regularly or irregularly formed distribution pattern 30 is possible in accordance with corresponding connection surface arrangements.
  • the placement device 22 is therefore particularly suitable for creating ball grid arrays.
  • FIG. 5 shows an application device 31 with a material supply device 32 which, in addition to a material reservoir 15, has a material removal device 33 which is connected to the material reservoir 15 via a material feed device 34.
  • the application device 31 shown in FIG. 6 does not differ from the application device 10 shown in FIG. 1 of the material reservoir 15, regardless of the phase in which the placement device 14 is when the application method is carried out, it is possible to refill the material reservoir 15 with connecting material pieces 11 at any time without disturbing the method.
  • the material feed device 37 is at least partially designed as a drop channel 40, such that the connecting material pieces 11 enter the steeply arranged drop channel 40 under the influence of gravity from the material reservoir 15 and pass through this into a flat stowage piece 41 of the material feed device 37.
  • the material removal device 38 adjoins the stowage piece 41, which only offers space for receiving a connecting material piece 11.
  • the material supply device 36 can be actuated via an infeed device 43, execute an infeed movement in the direction of the placement device 14 and away from it. Due to the coupling of the material supply device 36 with the feed device 43, it is possible to design the placement device 14 to be movable only in the direction of a vertical feed axis 44 and the horizontal movement necessary for receiving a connecting material piece 11 from the material removal device 38 by the feed device 43 to perform.
  • the delivery device which is present anyway for the horizontal delivery of a flaming lance (not shown in detail here), can be used as the delivery device 43, so that the modified design of the application device shown in FIG 35 apart from the material supply device 36, no further devices are necessary in addition to the devices already present in a wire bonding device.
  • FIG. 6 also shows that, in order to support a smooth separation of connecting material pieces 11 in the individualizing device 39, it is possible to combine them with a transducer 45, in order in particular in the case of connecting material pieces which are not spherical, to be mutually compatible to prevent the pieces of connecting material from wedging and thus prevent the separation from being inhibited.
  • a further possibility of promoting the smooth separation of the connecting material pieces 11 in the separation device 39 is to direct an air flow through the material feed device 37, which can originate, for example, from an air nozzle arranged in the material reservoir 15 and not shown here, and through the material feed device 37 is directed toward the material removal device 38, taking along connecting material pieces 11.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

L'invention concerne un procédé et un dispositif d'application d'un matériau de connexion (11) en morceaux, notamment de forme sphérique, sur une plage de connexion (12) sur un substrat. Selon ce procédé, le matériau de connexion est logé dans une unité de positionnement (14) qui le place ensuite sur la plage de connexion. Avant le positionnement du matériau de connexion (11) par l'unité de positionnement (14), celui-ci est séparé en éléments individuels et centré par rapport à l'unité de positionnement.
PCT/DE1995/001239 1994-09-13 1995-09-08 Procede et dispositif d'application d'un materiau de connexion sur une plage de connexion sur un substrat WO1996008338A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DEP4432579.7 1994-09-13
DE4432579 1994-09-13

Publications (1)

Publication Number Publication Date
WO1996008338A1 true WO1996008338A1 (fr) 1996-03-21

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PCT/DE1995/001239 WO1996008338A1 (fr) 1994-09-13 1995-09-08 Procede et dispositif d'application d'un materiau de connexion sur une plage de connexion sur un substrat

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DE (1) DE19533171A1 (fr)
WO (1) WO1996008338A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1024893A4 (fr) * 1997-01-17 2000-08-09 Smithkline Beecham Corp Dispositif et procede pour trier des billes
US8330076B2 (en) 2007-07-13 2012-12-11 Pac Tech - Packaging Technologies Gmbh Method and device for removing solder material deposits from a substrate

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5992729A (en) * 1996-10-02 1999-11-30 Mcnc Tacking processes and systems for soldering
DE19818417C2 (de) * 1997-04-26 2003-12-18 Karlsruhe Forschzent Verfahren und Vorrichtung zur Entnahme von Mikrokörpern
DE10132567B4 (de) * 2001-07-10 2005-03-31 Pac Tech - Packaging Technologies Gmbh Verfahren und Vorrichtung zum Aufbringen eines Lötmittels auf ein Substrat
DE102009000892A1 (de) 2008-11-25 2010-06-17 Slv Halle Gmbh Verfahren zur Schichtapplikation folienförmiger Lotwerkstoffe mittels Ultraschallschweißen
US20140234959A1 (en) * 2011-05-06 2014-08-21 Patricia McGrath Method and device for removing particles from liquid and placing them into a holding device
DE102015211004B4 (de) * 2015-06-16 2020-11-12 Bayerische Motoren Werke Aktiengesellschaft Verfahren zum Aufschweißen eines Verbindungselements, insbesondere einer Kugel, auf ein Bauteil
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3357090A (en) * 1963-05-23 1967-12-12 Transitron Electronic Corp Vibratory welding tip and method of welding
FR2212207A1 (en) * 1972-12-29 1974-07-26 Thomson Csf Welding appts with two orifices - with suction device for bonding wire to miniature circuits
JPS594970A (ja) * 1982-07-01 1984-01-11 Matsuo Handa Kk 半田球供給装置
JPS61242759A (ja) * 1985-04-19 1986-10-29 Hitachi Ltd 成形はんだ塔載装置
JPH01244630A (ja) * 1988-03-26 1989-09-29 Nec Corp 半導体ペレットのボンディング方法
US5031821A (en) * 1988-08-19 1991-07-16 Hitachi, Ltd. Semiconductor integrated circuit device, method for producing or assembling same, and producing or assembling apparatus for use in the method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US357090A (en) * 1887-02-01 Type-writing machine
DE3631154A1 (de) * 1986-09-12 1988-03-24 Mtu Muenchen Gmbh Verfahren und vorrichtung zum fuegen von strukturbauteilen
US5284287A (en) * 1992-08-31 1994-02-08 Motorola, Inc. Method for attaching conductive balls to a substrate
SG54297A1 (en) * 1992-09-15 1998-11-16 Texas Instruments Inc Ball contact for flip-chip devices

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3357090A (en) * 1963-05-23 1967-12-12 Transitron Electronic Corp Vibratory welding tip and method of welding
FR2212207A1 (en) * 1972-12-29 1974-07-26 Thomson Csf Welding appts with two orifices - with suction device for bonding wire to miniature circuits
JPS594970A (ja) * 1982-07-01 1984-01-11 Matsuo Handa Kk 半田球供給装置
JPS61242759A (ja) * 1985-04-19 1986-10-29 Hitachi Ltd 成形はんだ塔載装置
JPH01244630A (ja) * 1988-03-26 1989-09-29 Nec Corp 半導体ペレットのボンディング方法
US5031821A (en) * 1988-08-19 1991-07-16 Hitachi, Ltd. Semiconductor integrated circuit device, method for producing or assembling same, and producing or assembling apparatus for use in the method

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 008, no. 087 (M - 291) 20 April 1984 (1984-04-20) *
PATENT ABSTRACTS OF JAPAN vol. 011, no. 090 (M - 573) 20 March 1987 (1987-03-20) *
PATENT ABSTRACTS OF JAPAN vol. 013, no. 581 (E - 865) 21 December 1989 (1989-12-21) *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1024893A4 (fr) * 1997-01-17 2000-08-09 Smithkline Beecham Corp Dispositif et procede pour trier des billes
US8330076B2 (en) 2007-07-13 2012-12-11 Pac Tech - Packaging Technologies Gmbh Method and device for removing solder material deposits from a substrate

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