[go: up one dir, main page]

WO1996028007B1 - Enceinte blindee pour dispositifs electroniques - Google Patents

Enceinte blindee pour dispositifs electroniques

Info

Publication number
WO1996028007B1
WO1996028007B1 PCT/US1996/002818 US9602818W WO9628007B1 WO 1996028007 B1 WO1996028007 B1 WO 1996028007B1 US 9602818 W US9602818 W US 9602818W WO 9628007 B1 WO9628007 B1 WO 9628007B1
Authority
WO
WIPO (PCT)
Prior art keywords
cover plate
shielding
assembly
major surface
shielding compound
Prior art date
Application number
PCT/US1996/002818
Other languages
English (en)
Other versions
WO1996028007A1 (fr
Filing date
Publication date
Priority claimed from US08/398,476 external-priority patent/US5566055A/en
Application filed filed Critical
Priority to JP8526957A priority Critical patent/JPH11502672A/ja
Priority to BR9607119A priority patent/BR9607119A/pt
Priority to DE69600696T priority patent/DE69600696T2/de
Priority to MXPA/A/1997/006573A priority patent/MXPA97006573A/xx
Priority to HK98103237.0A priority patent/HK1004853B/en
Priority to EP96907158A priority patent/EP0813805B1/fr
Priority to DK96907158T priority patent/DK0813805T3/da
Publication of WO1996028007A1 publication Critical patent/WO1996028007A1/fr
Publication of WO1996028007B1 publication Critical patent/WO1996028007B1/fr
Priority to NO974041A priority patent/NO974041L/no

Links

Abstract

Une plaque couvrante (18; 20) de protection contre les interférences électromagnétiques et les ondes radio, destinée à une enceinte (10) pour un dispositif électronique comporte une surface majeure (24) avec des parois (25) ou brides faisant saillie vers l'extérieur et fournissant des emplacements d'interface avec l'enceinte sous-jacente. Un composé de blindage (22) est prévu sur toute la plaque couvrante (18; 20) et également sur les parois (25) ou brides. Ce composé de blindage (22) est disposé en une couche relativement mince sur la surface majeure (24) de la plaque couvrante (18; 20) pour assurer la protection contre les interférences électromagnétiques et les ondes radio et en une couche plus épaisse aux emplacements des interfaces (25; 27), pour constituer des éléments d'étanchéité entre la plaque couvrante (18; 20) et l'enceinte sous-jacente et pour améliorer les transferts de chaleur et assurer une continuité électrique. Le composé de blindage (22) peut être réalisé sur la plaque couvrante (18; 20) par moulage sous pression. La plaque couvrante de blindage constitue un moyen simple et bon marché pour assurer une protection contre les interférences électromagnétiques et les ondes radio et également des joints d'étanchéité, et cela en utilisant un seul composé.
PCT/US1996/002818 1995-03-03 1996-03-01 Enceinte blindee pour dispositifs electroniques WO1996028007A1 (fr)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP8526957A JPH11502672A (ja) 1995-03-03 1996-03-01 エレクトロニクスのための遮蔽密閉箱
BR9607119A BR9607119A (pt) 1995-03-03 1996-03-01 Caixa protegida para componentes eletrónicos
DE69600696T DE69600696T2 (de) 1995-03-03 1996-03-01 Abgeschirmtes gehäuse für elektronik
MXPA/A/1997/006573A MXPA97006573A (en) 1995-03-03 1996-03-01 Armored enclosure for electroni
HK98103237.0A HK1004853B (en) 1995-03-03 1996-03-01 Shielded enclosure for electronics
EP96907158A EP0813805B1 (fr) 1995-03-03 1996-03-01 Enceinte blindee pour dispositifs electroniques
DK96907158T DK0813805T3 (da) 1995-03-03 1996-03-01 Skærmet indkapsling til elektroniske kredsløb
NO974041A NO974041L (no) 1995-03-03 1997-09-03 Skjermet innkapsling for elektroniske kretser

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/398,476 US5566055A (en) 1995-03-03 1995-03-03 Shieled enclosure for electronics
US08/398,476 1995-03-03

Publications (2)

Publication Number Publication Date
WO1996028007A1 WO1996028007A1 (fr) 1996-09-12
WO1996028007B1 true WO1996028007B1 (fr) 1996-11-21

Family

ID=23575519

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1996/002818 WO1996028007A1 (fr) 1995-03-03 1996-03-01 Enceinte blindee pour dispositifs electroniques

Country Status (12)

Country Link
US (1) US5566055A (fr)
EP (1) EP0813805B1 (fr)
JP (1) JPH11502672A (fr)
CN (1) CN1098622C (fr)
AT (1) ATE171589T1 (fr)
BR (1) BR9607119A (fr)
CA (1) CA2214434A1 (fr)
DE (1) DE69600696T2 (fr)
DK (1) DK0813805T3 (fr)
ES (1) ES2122803T3 (fr)
NO (1) NO974041L (fr)
WO (1) WO1996028007A1 (fr)

Families Citing this family (106)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5811050A (en) * 1994-06-06 1998-09-22 Gabower; John F. Electromagnetic interference shield for electronic devices
EP0727932B1 (fr) * 1994-11-28 1999-04-07 Kabushiki Kaisha Toshiba Boítier avec blindage électromagnétique
US5910524A (en) * 1995-01-20 1999-06-08 Parker-Hannifin Corporation Corrosion-resistant, form-in-place EMI shielding gasket
US5694300A (en) * 1996-04-01 1997-12-02 Northrop Grumman Corporation Electromagnetically channelized microwave integrated circuit
US5761053A (en) * 1996-05-08 1998-06-02 W. L. Gore & Associates, Inc. Faraday cage
US6619966B2 (en) * 1996-06-14 2003-09-16 Seiko Epson Corporation Card-shaped electronic apparatus
TW486238U (en) * 1996-08-18 2002-05-01 Helmut Kahl Shielding cap
US5717577A (en) * 1996-10-30 1998-02-10 Ericsson, Inc. Gasketed shield can for shielding emissions of electromagnetic energy
JPH10200288A (ja) * 1997-01-13 1998-07-31 Sony Corp 電磁シールド構造
US5847317A (en) * 1997-04-30 1998-12-08 Ericsson Inc. Plated rubber gasket for RF shielding
JP2894325B2 (ja) * 1997-06-25 1999-05-24 日本電気株式会社 電子回路のシールド構造
DE19728839C1 (de) * 1997-07-05 1998-09-03 Bosch Gmbh Robert Abschirmgehäuse für Mikrowellenschaltungen
US6121545A (en) * 1997-07-11 2000-09-19 Parker-Hannifin Corporation Low closure force EMI shielding spacer gasket
JP3331362B2 (ja) * 1997-11-07 2002-10-07 エヌイーシートーキン株式会社 電磁継電器
US6028266A (en) * 1998-04-06 2000-02-22 Asea Brown Boveri Inc. Low frequency EMF shield
US6534711B1 (en) * 1998-04-14 2003-03-18 The Goodyear Tire & Rubber Company Encapsulation package and method of packaging an electronic circuit module
US6094350A (en) * 1998-05-21 2000-07-25 Aml Communications, Inc. Feedforward amplifier manufacturing module
US6314000B1 (en) * 1998-08-27 2001-11-06 Lucent Technologies Inc. Enclosure for an RF assembly
US6052045A (en) * 1999-03-12 2000-04-18 Kearney-National, Inc. Electromechanical switching device package with controlled impedance environment
US6157546A (en) 1999-03-26 2000-12-05 Ericsson Inc. Shielding apparatus for electronic devices
DE19932544C1 (de) * 1999-07-13 2000-08-10 Bosch Gmbh Robert Abschirmgehäuse für Mikrowellenschaltungen
US6271465B1 (en) * 1999-08-31 2001-08-07 Nokia Mobile Phones Limited Low cost conformal EMI/RFI shield
BR0014718A (pt) * 1999-10-12 2003-07-15 Shielding For Electronics Inc Aparelho de confinamento de emi
CA2323853A1 (fr) * 1999-10-21 2001-04-21 National-Standard Company Boitiers de blindage a compartiments moules
US6259609B1 (en) 2000-03-15 2001-07-10 Arthur A. Kurz Shielding contactor construction
US20010033478A1 (en) * 2000-04-21 2001-10-25 Shielding For Electronics, Inc. EMI and RFI shielding for printed circuit boards
KR20020089526A (ko) * 2000-04-25 2002-11-29 지멘스 악티엔게젤샤프트 차폐실
JP2002094689A (ja) * 2000-06-07 2002-03-29 Sony Computer Entertainment Inc プログラム実行システム、プログラム実行装置、中継装置、および記録媒体
US6625025B1 (en) * 2000-07-10 2003-09-23 Nortel Networks Limited Component cooling in electronic devices
USRE38381E1 (en) 2000-07-21 2004-01-13 Kearney-National Inc. Inverted board mounted electromechanical device
US6768654B2 (en) * 2000-09-18 2004-07-27 Wavezero, Inc. Multi-layered structures and methods for manufacturing the multi-layered structures
US6426881B1 (en) 2000-10-04 2002-07-30 Arthur A. Kurz Shielding arrangement for inter-component shielding in electronic devices
US6348654B1 (en) 2000-10-12 2002-02-19 Parker-Hannifin Corporation Compound waveform gasket for low closure force EMI shielding applications
DE60116666T2 (de) * 2000-11-20 2006-11-16 Parker-Hannifin Corp., Cleveland Interferenzverringerung mittels leitender thermoplastischer verbundmaterialien
US6760230B2 (en) * 2001-02-28 2004-07-06 Andrew Corporation Compact, high efficiency, high isolation power amplifier
US6747879B2 (en) * 2001-02-28 2004-06-08 Andrew Corporation High power amplifier and chassis
US6965071B2 (en) * 2001-05-10 2005-11-15 Parker-Hannifin Corporation Thermal-sprayed metallic conformal coatings used as heat spreaders
EP1386527A1 (fr) 2001-05-10 2004-02-04 Parker Hannifin Corporation Fabrication d'une enveloppe electronique dotee d'une couche de protection metallisee
EP1386528B1 (fr) 2001-05-11 2005-10-05 Parker Hannifin Corporation Joint d'etancheite encoche pour applications de blindage contre les interferences electromagnetiques a faible force de fermeture
US6809254B2 (en) 2001-07-20 2004-10-26 Parker-Hannifin Corporation Electronics enclosure having an interior EMI shielding and cosmetic coating
EP1410707A1 (fr) * 2001-07-26 2004-04-21 Rosti, A/S Blindages pour composants equipant des cartes circuits
US20030091777A1 (en) * 2001-08-14 2003-05-15 Peter Jones Clean release tape for EMI shielding
WO2003030610A1 (fr) 2001-10-02 2003-04-10 Parker Hannifin Corporation Construction de joint d'etancheite statique contre les interferences electromagnetiques
US20050053008A1 (en) * 2002-03-04 2005-03-10 Griesing John Robert Wireless device isolation in a controlled RF test environment
US6724730B1 (en) 2002-03-04 2004-04-20 Azimuth Networks, Inc. Test system for simulating a wireless environment and method of using same
ATE373869T1 (de) * 2002-03-08 2007-10-15 Kearney National Inc Relaisformgehäuse zur oberflächenanbringung und verfahren zu seiner herstellung
DE10228981A1 (de) * 2002-06-28 2004-01-15 Automotive Lighting Reutlingen Gmbh Vorrichtung zur elektromagnetischen Abschirmung
DE10230304A1 (de) * 2002-07-05 2004-01-15 Valeo Schalter Und Sensoren Gmbh Verfahren zur Herstellung einer elektronischen Schaltung und elektronische Schaltung
US6785138B1 (en) 2002-09-05 2004-08-31 Added Communications Of Georgia, Inc. Repeater case for HDSL modules
JP4657927B2 (ja) * 2003-02-07 2011-03-23 ソニー エリクソン モバイル コミュニケーションズ， エービー シールドカン
EP1446000B1 (fr) * 2003-02-07 2011-11-09 Sony Ericsson Mobile Communications AB Capot de blindage pour composants électroniques sur un circuit imprimé
EP1445998B1 (fr) * 2003-02-07 2007-10-24 Sony Ericsson Mobile Communications AB Boîtier de blindage pour la protection de composants éléctroniques montés sur une carte de circuit imprimé
US7005573B2 (en) 2003-02-13 2006-02-28 Parker-Hannifin Corporation Composite EMI shield
US7326862B2 (en) * 2003-02-13 2008-02-05 Parker-Hannifin Corporation Combination metal and plastic EMI shield
US6982866B2 (en) * 2003-02-14 2006-01-03 Intel Corporation Lightweight robust enclosure design for a mobile computing system
US7248484B2 (en) * 2003-03-12 2007-07-24 Hewlett-Packard Development Company, L.P. Electro-magnetic suppressive structure
JP2004281248A (ja) * 2003-03-17 2004-10-07 Pioneer Electronic Corp 耐熱絶縁フィルム及び絶縁方法
TWI291322B (en) * 2003-05-20 2007-12-11 Laird Technologies Inc Method for manufacturing an EMI shielding element
DE10324411B4 (de) * 2003-05-28 2007-01-25 Kathrein-Werke Kg Elektronisches Gerät
TWI333805B (en) * 2003-10-03 2010-11-21 Osram Sylvania Inc Housing for electronic ballast
US20050237663A1 (en) * 2004-04-21 2005-10-27 Riospring, Inc. Insulator with pocket features
FR2870429B1 (fr) * 2004-05-11 2006-07-28 Sagem Dispositif de blindage pour module electronique radioelectrique
US6903910B1 (en) 2004-08-06 2005-06-07 Azijuth Networks, Inc. Shielded enclosure with user-installable interface modules
US7260998B2 (en) * 2005-03-18 2007-08-28 The Boeing Company Apparatuses and methods for structurally testing fasteners
US7170277B2 (en) * 2005-04-12 2007-01-30 Texas Instruments Incorporated Shield for tester load boards
US7491899B2 (en) * 2005-10-06 2009-02-17 Laird Technologies, Inc. EMI shields and related manufacturing methods
CN1972587B (zh) * 2005-11-25 2011-11-16 深圳富泰宏精密工业有限公司 电子装置的屏蔽构件及壳体组件
US20080080160A1 (en) * 2005-12-16 2008-04-03 Laird Technologies, Inc. Emi shielding assemblies
USD549231S1 (en) 2005-12-16 2007-08-21 Laird Technologies, Inc. Cover for an EMI shield assembly
USD548738S1 (en) 2005-12-16 2007-08-14 Laird Technologies, Inc. EMI shield assembly
USD549706S1 (en) 2005-12-16 2007-08-28 Laird Technologies, Inc. Frame for an EMI shield assembly
US7288727B1 (en) * 2006-05-31 2007-10-30 Motorola, Inc. Shield frame for a radio frequency shielding assembly
US9237685B2 (en) 2006-08-18 2016-01-12 Delphi Technologies, Inc. Lightweight audio system for automotive applications and method
US8264856B2 (en) 2006-08-18 2012-09-11 Delphi Technologies, Inc. Lightweight audio system for automotive: applications and method
US7733659B2 (en) 2006-08-18 2010-06-08 Delphi Technologies, Inc. Lightweight audio system for automotive applications and method
US8305773B2 (en) * 2006-08-18 2012-11-06 Delphi Technologies, Inc. Lightweight audio system for automotive applications and method
US7534968B2 (en) * 2006-11-03 2009-05-19 Laird Technologies, Inc. Snap install EMI shields with protrusions and electrically-conductive members for attachment to substrates
US8004135B2 (en) * 2007-01-22 2011-08-23 Nidec Motor Corporation Electric motor and controller assembly with integrated sensor device
US8630092B2 (en) * 2007-04-26 2014-01-14 Ceramtec Gmbh Cooling box for components or circuits
US8999764B2 (en) 2007-08-10 2015-04-07 International Business Machines Corporation Ionizing radiation blocking in IC chip to reduce soft errors
US7504592B1 (en) 2007-08-31 2009-03-17 Laird Technologies, Inc. Electromagnetic interference shields and related manufacturing methods
US20090073654A1 (en) * 2007-09-14 2009-03-19 Beam James M Compact surface-mount heat exchanger
US20090116208A1 (en) * 2007-11-02 2009-05-07 Nokia Corporation Electronic device electrical shielding
US7772505B2 (en) * 2008-02-22 2010-08-10 Laird Technologies, Inc. Electromagnetic interference (EMI) shielding apparatus and related methods
US8169786B2 (en) * 2008-05-16 2012-05-01 Psion Teklogix Inc. Ruggedized housing and components for a handled device
US8208273B1 (en) * 2008-06-13 2012-06-26 Qualcomm, Incorporated RF shielded enclosure for automated testing
CN102165857B (zh) * 2008-09-26 2015-06-17 帕克-汉尼芬公司 导电泡沫电磁干扰防护罩
WO2010065035A1 (fr) * 2008-12-04 2010-06-10 Hewlett-Packard Development Company, L.P. Enveloppe stratifiée en carbone
KR101658821B1 (ko) * 2009-12-24 2016-10-04 삼성전자주식회사 휴대 단말기의 쉴드 캔
US9775531B2 (en) * 2010-06-09 2017-10-03 Techmedic Development International B.V. Sensor device, processing device, and measurement system for acquiring a biopotential
US9380357B2 (en) * 2010-10-28 2016-06-28 Afl Telecommunications Llc Universal network interface device base module
EP2684435B1 (fr) * 2011-03-11 2019-10-02 Aptiv Technologies Limited Ensemble enceinte de circuit électronique flexible
US9113549B2 (en) * 2011-12-01 2015-08-18 Triquint Semiconductor, Inc. Enclosure for a multi-channel modulator driver
JP5576542B1 (ja) * 2013-08-09 2014-08-20 太陽誘電株式会社 回路モジュール及び回路モジュールの製造方法
US10588248B1 (en) * 2014-10-24 2020-03-10 L-3 Communications Corp. Radial EMI and environmental gasket
US20160192544A1 (en) * 2014-12-26 2016-06-30 Intel Corporation Integrated thermal emi structure for electronic devices
US9596761B2 (en) * 2015-01-06 2017-03-14 Fujitsu Limited Different thermal zones in an opto-electronic module
USD773394S1 (en) * 2015-05-07 2016-12-06 General Electric Company Enclosure for electronic device
CN108781526A (zh) * 2016-03-16 2018-11-09 索尼互动娱乐股份有限公司 电子设备
US10446309B2 (en) 2016-04-20 2019-10-15 Vishay Dale Electronics, Llc Shielded inductor and method of manufacturing
US12127362B2 (en) * 2016-06-20 2024-10-22 Black & Decker Inc. Encapsulated printed circuit board and a method of encapsulating a printed circuit board
US11202396B2 (en) * 2017-05-19 2021-12-14 Rolls-Royce Corporation Additive manufacturing of engine control component
US10791658B2 (en) * 2018-08-31 2020-09-29 Hughes Network Systems, Llc Low noise amplifier shield
CN113597240A (zh) * 2020-04-30 2021-11-02 维沃移动通信有限公司 一种屏蔽盖组件及电子设备
US11832391B2 (en) * 2020-09-30 2023-11-28 Qualcomm Incorporated Terminal connection routing and method the same
CN113727593B (zh) * 2021-08-16 2024-07-16 北京超星未来科技有限公司 一种电子设备的电磁屏蔽装置及电子设备

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1604822A (en) * 1977-04-22 1981-12-16 Beecham Group Ltd N-monosubstituted-9-amino-9-deoxyclavulanic acid derivative
US4227037A (en) * 1979-05-29 1980-10-07 Gulf & Western Manufacturing Company Shielded non-metallic container
US4545926A (en) * 1980-04-21 1985-10-08 Raychem Corporation Conductive polymer compositions and devices
US4678699A (en) * 1982-10-25 1987-07-07 Allied Corporation Stampable polymeric composite containing an EMI/RFI shielding layer
GB2187893B (en) * 1986-03-15 1988-11-30 Unisys Corp Shielded equipment enclosure
US4780575A (en) * 1987-05-14 1988-10-25 Flavin John W Electrically conductive elastomer composition
GB2252677A (en) * 1991-02-08 1992-08-12 Technophone Ltd RFI screened housing for electronic circuitry
US5166864A (en) * 1991-05-17 1992-11-24 Hughes Aircraft Company Protected circuit card assembly and process
US5160807A (en) * 1991-08-08 1992-11-03 Elsag International B.V. Method for RFI/EMI protection of electronic circuitry
US5185654A (en) * 1991-11-27 1993-02-09 Motorola, Inc. Electrostatic RF absorbant circuit carrier assembly and method for making the same
US5260513A (en) * 1992-05-06 1993-11-09 University Of Massachusetts Lowell Method for absorbing radiation
US5353200A (en) * 1993-02-24 1994-10-04 Rosemount Inc. Process transmitter with inner conductive cover for EMI shielding

Similar Documents

Publication Publication Date Title
WO1996028007B1 (fr) Enceinte blindee pour dispositifs electroniques
US5566055A (en) Shieled enclosure for electronics
US6178318B1 (en) Shielding housing and a method of producing a shielding housing
US6121545A (en) Low closure force EMI shielding spacer gasket
US3752899A (en) Shielding and gasketing material
US4567317A (en) EMI/RFI Protected enclosure
US7910839B2 (en) Electro-conductive contact structure for enclosure sealing in housings
EP1325675B1 (fr) Joint a forme d'onde composee destine a des applications de blindage contre les interferences electromagnetiques, necessitant une faible force de fermeture
US5107071A (en) Sealing and shielding structure
CA2200136A1 (fr) Methode de protection de composants de circuit electronique et ensembles utilisant un boitier souple metallise
RU94041203A (ru) Экранирующий элемент и способ его изготовления
AU3705497A (en) Process for shielding an electric or electronic circuit and shielding cap
EP1386528B1 (fr) Joint d'etancheite encoche pour applications de blindage contre les interferences electromagnetiques a faible force de fermeture
JP2010084832A (ja) 密封装置および密封構造
US6173970B1 (en) Gasket and method of making a gasket
JP2001160697A (ja) 屋外用電子機器
HK1004853B (en) Shielded enclosure for electronics
JP2001345569A (ja) 高圧開閉器用制御機器の収納構造
RU97116264A (ru) Экранированный кожух для электронных схем
MXPA97006573A (en) Armored enclosure for electroni
WO1998015162A1 (fr) Joint d'etancheite statique procurant blindage emi et etancheite vis a vis de l'environnement