WO1996036964A1

WO1996036964A1 - Magnetic head assembly, assembling therefor, assembling apparatus therefor, and magnetic disk apparatus

Info

Publication number: WO1996036964A1
Application number: PCT/JP1996/001280
Authority: WO
Inventors: Yasuo Amano; Naotake Ebinuma; Koji Serizawa; Ichiro Miyano; Naoki Maeda; Yukimori Umakoshi; Osamu Narisawa; Shuichi Sugahara
Original assignee: Hitachi, Ltd.
Priority date: 1995-05-16
Filing date: 1996-05-15
Publication date: 1996-11-21
Also published as: JPH08315343A

Abstract

To provide an economical magnetic head assembly of the type in which a magnetic head slider and a suspension are connected by conductive wires in such a manner as to absorb extension and contraction, a work (50) is constituted from a magnetic head slider (11) equipped with a connection terminal circuit pattern (15), and a suspension (14) equipped with a wiring pattern (31) and a connection terminal circuit pattern (41). Both connection terminal circuit patterns are connected by wire bonding and flexible portions A and B are disposed at a part of the suspension (14) so that the wirings (43) between both connection terminal circuit patterns (15 and 41) absorb extension and contraction of the wirings (43).

Description

Description Magnetic head assembly, method for assembling the same, apparatus for assembling the same, and magnetic disk apparatus

The present invention relates to a magnetic head assembly, a method for assembling the same, a device for assembling the same, and a magnetic disk drive. Background art

. Magnetic disk drives are used as indispensable devices for computers and word processors, but in recent years, as the amount of information has increased, higher storage capacity, higher performance, and smaller size have been required. The magnetic disk device is composed of a magnetic disk unit and a magnetic head unit. As performance and size are reduced, the magnetic head unit is also required to have higher precision and smaller size. .

A magnetic disk device is an information storage device, which has at least one rotating disk having concentric data tracks containing information, and a magnetic disk for reading data from each track or writing data to each track. A head slider; and an actuator for holding the magnetic head slider, moving to a desired track, and positioning a magnetic head portion during a read or write operation.

In the present specification, a magnetic head assembly body that has not been subjected to bonding is referred to as a work, that is, a work is a thin film magnetic transducer and a first connection terminal circuit pattern formed on an end surface perpendicular to the air bearing surface. A magnetic head slider provided with a wiring pattern and a suspension provided with a second connection terminal circuit pattern at an end thereof; The magnetic head slider is so suspended that the surface of the thin-film magnetic conversion element is orthogonal to the surface of the thin film magnetic conversion element and the end of the second connection terminal circuit pattern surface in the lateral direction of suspension is parallel to the surface of the thin-film magnetic conversion element. It is configured above.

A conventional magnetic head assembly used for the magnetic head section will be described with reference to FIGS. 13 to 20. FIG.

FIG. 13 is a perspective view of a conventional magnetic head assembly, and FIG. 14 is an enlarged view of a magnetic head slider of the magnetic head assembly of FIG.

In FIGS. 13 and 14, 11 is a magnetic head slider, 12 is a core slider, 13 is a thin-film magnetic transducer, 14 is a suspension, 15 is a connection terminal circuit pattern, and 16 is a lead wire. , 17 is a protective tube, 18 is a flexible member, ■ 19 is a floating surface, and 50 is a work.

The magnetic head slider 11 of the magnetic head assembly used in the magnetic disk device is composed of, for example, a core slider 12 made of ceramic and a thin-film magnetic transducer 13, and the lower surface thereof is a floating surface 19.

The suspension member of the magnetic head slider 11 is composed of a flat suspension 14 and a flexible member 18. One end of the suspension 14 is connected to an actuator arm (not shown), and the other end is connected. The magnetic head slider 11 is connected to the bending member 18 for supporting the same. The suspension member 14 acts as an elastic panel that presses the top surface 19 of the magnetic head slider 11 against the disk surface, while the flexure member 18 acts as the magnetic head slider 11. When the flying surface 19 rides on an air cushion between the flying surface 19 and the rotating disk, the magnetic head slider 11 gives flexibility. The magnetic head slider 11 is fixed to the flexible member 18 with an adhesive or the like.

Circuit connection terminal pattern 1 provided on the magnetic head slider 1 1 5 and a magnetic disk main body (not shown) are connected by a lead wire 16, and the detected electrical signal from the thin-film magnetic transducer 13 is sent to the lead wire 16 via the circuit connection terminal pattern 15, It is transmitted to the magnetic disk body. The lead wire 16 is coated with an insulating material such as a resin to electrically insulate the metal suspension 14 and is further passed through a protective tube 17 such as a pineal tube for mechanical protection. It is fixed to.

The protective tube 17 is fixed to the suspension 14 by mechanical means such as caulking.

Since there is no protective tube 17 between the connection terminal circuit pattern 15 and the protective tube 1, the lead wire 16 is insulated by the insulating coating. The connection between the connection terminal circuit pattern 15 and the lead wire 16 is made by soldering or ultrasonic bonding.

In recent years, as the size and performance of magnetic disk devices have been reduced, the magnetic head slider 11 has also been required to be smaller and have higher performance. Accordingly, it is required that the mounting space of the lead wire 16 be as small as possible in the direction perpendicular to the suspension 14. Conventionally, since the lead wire 16 from the magnetic head slider 11 to the protection tube 17 fixed to the tip of the suspension 14 is formed in a predetermined shape, the lead wire 16 is in the plane of the suspension 14. In addition to this, mounting space is required in the vertical direction, which has been a bottleneck for downsizing the equipment.

Further, the miniaturization of the magnetic head slider 11 and the miniaturization of the mounting space of the lead wire 16 have progressed to such an extent that the rigidity and elasticity of the lead wire 16 cannot be ignored. In other words, the magnetic head slider 11 uses the elastic force of the suspension 14 to follow the magnetic disk while absorbing a slight runout of the disk while floating slightly above the surface of the disk. However, the miniaturization of the magnetic head slider 11 and the suspension 14 reduces the force.

On the other hand, the vinyl tube 17 and the lead wire 16 are fixed in a predetermined shape, and generate a force in a direction opposite to the elastic force of the suspension 14. As described above, as miniaturization progresses, the force in the opposite direction cannot be ignored.

Therefore, a structure using a composite structure or a laminated structure in which an electrical insulating layer is provided on the surface of the suspension 14, patterned electrical leads are formed thereon, and an insulating layer is provided thereon is proposed. Have been.

A conventional example of the composite structure or the laminated structure will be described with reference to FIG. ■, '

FIG. 15 is a perspective view of a conventional magnetic hybrid assembly of a composite structure. ■■ ■■ ■ ■ ■ ■

As shown in FIG. 15, the electric leads ₃パターン patterned on the suspension 14 are wired from one end of the suspension 14 to a portion connected to the magnetic head slider 11.

An example of a method for mechanically connecting and electrically connecting the suspension 14 and the magnetic head slider 11 will be described with reference to FIGS. 16 and 17. FIG. :. ■.

FIG. ₆ is an enlarged view of an electrical connection portion of the magnetic head slider shown in FIG. 5; FIG. 17 is a perspective view showing the non-floating surface of the magnetic head slider not shown in FIG. 15;

In FIGS. 16 and 17, in FIG. 16, reference numeral 15a denotes a wiring pattern, 32 denotes a base of the suspension 14, 33 denotes an anti-floating surface, 34 denotes a first electrically insulating layer, and 35 denotes a The conductor layer, 36 is a connection terminal, 3.7 is a solder pole, and 341 is a first electrically insulating layer. In the present embodiment, a wiring pattern 15a is provided on the surface opposite to the flying surface 19 of the magnetic head slider 11, that is, on the anti-flying surface 33.

As shown in FIGS. 16 and 17, a first electrical insulating layer 34 is provided on a base 14 of a suspension 14 and a conductive layer 35 patterned thereon, and further thereon. Then, a second electrically insulating layer 341 is formed. The first and second insulating layers 34, 341 are formed of a polyimide layer, and the patterned conductor layer 35 is formed of a vapor-deposited copper film.

Note that the second insulating layer 341 was not formed in a portion where electrical connection with the magnetic head slider 11 was made, and the conductor layer 35 was exposed, and the connection terminal portion 36 was not formed. Is formed. A solder pole 37 is arranged at a connection portion between the terminal portion 36 and the wiring pattern 15a of the magnetic head slider 11, and is heated and melted for electrical connection.

Furthermore, _c first 8 diagram for explaining another example of the magnetic head slider 1 1 of the connection method is an enlarged view of another example of the electrical connection portion of the head assembly to magnetically shown in the first 5 Figure .

In this example, a suspension 14 having wiring patterned in the same manner as in the example of FIG. 16 is used, and the structure is almost the same as that of the example of FIG. In the figure, the same reference numerals as those in FIG. 16 denote the same parts, and a description thereof will be omitted, but only a new reference numeral will be described. 38 is an adhesive.

In the present embodiment, the mechanical connection between the magnetic head slider 11 and the suspension 14 is connected by an adhesive 38. Further, the electrical connection is made between the connection terminal pattern 15 on the same surface as the magnetic element 13 of the magnetic head slider 11 and the terminal portion 36 provided on the suspension 14 as described in FIG. 16 described above. As shown, the solder poles 37 are fused and connected.

For example, there is a technique described in Japanese Patent Application Laid-Open No. Sho. As described above, recently, as magnetic disk devices have become smaller and more precise, the magnetic head has also been required to be smaller and more precise.

At present, a magnetic head having a smaller size, a width of l mm, a length of 1.2 mm, and a thickness of 0.3 mm is being studied.

As described above, as the miniaturization proceeds, three problems newly arise in the connection structure using the composite structure or the laminated structure. The first of the above three problems is that the magnetic head is mechanically attached and mechanically connected at the time of electrical connection. For example, as shown in FIG. 18, a solder hole 3 is provided between the connection terminal pattern 15 located on the thin film magnetic transducer surface of the magnetic head slider 11 and the terminal portion 36 on the suspension 14. In the case of connection, a problem arises that stress is applied to the magnetic head slider 11 due to contraction and expansion of the connection member during curing, and the shape is deformed.

Further details will be described in detail. The magnetic head slider 11 is attached to the substrate 32 of the suspension 14 via the first electrically insulating layer 34, the conductor layer 35, and the second electrically insulating layer 34 1, and the adhesive 3 When the adhesive is mechanically connected at 8, the anti-floating surface 33 of the magnetic head slider 11 contracts more than the floating surface 19 due to the contraction of the adhesive during curing. As a result, the slider surface 1 of the magnetic head 1 has its flying surface 19 deformed in a convex shape with respect to the upper side. The convex shape greatly affects the performance when the magnetic head slider 11 flies above the magnetic disk, that is, the flying characteristics. At present, the height of the convex shape is managed by adjusting the application amount of the adhesive 38, adjusting the bonding area of the suspension 14 and the like. Conversely, a concave shape will damage the magnetic disk.

As described above, the connection terminal pattern 15 located on the thin-film magnetic transducer surface of the magnetic head slider 11 and the connection terminal portion 3 provided on the suspension 14 An experimental result of the above-mentioned convex shape based on connection between 6 and 6 will be described. FIG. 19 is a diagram showing a convex shape deformation amount when a low melting point solder is used for a connection member. As shown in the figure, it can be seen that, after soldering, the convex shape deformation amount is deformed in a decreasing direction. Its amount is between 10 nm and 40 nm.

The low solder used was a tin- and bismuth-based solder with a melting point of about 14 O'C. This low melting point solder has a property of expanding about 3% when it is solidified. <The expansion force at the time of solidification is the direction in which the thin-film magnetic transducer of the magnetic head slider 11 is pushed and the direction in which the convex shape is reduced. To work.

This will be described in detail with reference to FIG.

FIG. 20 is a diagram showing the amount of convex deformation when a conductive adhesive (silver epoxy-based) is used. As shown in FIG. 20, it can be seen that the convex shape is deformed in the direction of increasing the contrary to the case of FIG.

Since the epoxy adhesive hardens and shrinks when it is solidified in the opposite direction to the case of the low melting point solder, the direction in which the thin film magnetic transducer surface of the magnetic head slider 11 is pulled, the direction in which the convex shape increases. This is because the contraction force is applied to

As can be seen from the above experimental results, regardless of the expansion force and the contraction force, when stress is applied to the thin film magnetic transducer surface of the magnetic head slider 11, the air bearing surface 19 of the magnetic head slider 11 It is clear that the surface shape changes.

The second of the three issues is the thermal issue.

With miniaturization and higher precision, the heat-resistant temperature of magnetic heads tends to decrease. The heat-resistant temperature of the magnetic head currently under study is said to be approximately 15 CTC. Therefore, the commonly used eutectic solder cannot be used in the connection method by soldering because the melting temperature is 18 CTC. —On the other hand, the use of a low melting point solder as described above solves the above-mentioned temperature problem, but has a problem of poor reliability depending on the use condition.

The third issue is the problem of assembly costs.

The example described in FIG. 16 is an example in which an electrical connection terminal pattern 15 a is provided on the anti-floating surface 33 of the magnetic head slider 11, and the mechanical connection and the electrical connection are simultaneously performed. .

The structure of the magnetic head slider 11 shown in FIG. 17 is described above. Due to the assembling process, the electrical connection pattern 15 is formed on the same surface as the thin-film magnetic transducer 13 in many cases. Since the magnetic heads are manufactured at the same time, it is simple and cheap.

On the other hand, as shown in Fig. 17, the formation of the connection terminal pattern 15a on the anti-floating surface 33 is performed by forming a single piece of magnetic slider and then depositing a pattern from the thin-film magnetic conversion element surface. For example, there was a problem that the assembly cost would be extremely expensive.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems of the prior art, and has a low mechanical stress at the time of mechanically attaching and electrically connecting a magnetic head slider, at a low temperature and at a low stress. Provided are a magnetic head assembly, an assembling method, an assembling apparatus, and an assembling apparatus, and a magnetic disk apparatus capable of performing electrical contact on a thin film magnetic transducer surface of a magnetic head slider without problems and at low cost. That is the purpose. Disclosure of the invention

In order to achieve the above object, a magnetic head assembly according to the present invention comprises a magnetic head slider provided with a first connection terminal circuit pattern, a wiring pattern and a second connection terminal circuit pattern. A wire is formed from the provided suspension and a wire is arranged between the first and second connection terminal circuit patterns. In the wired magnetic head assembly, a bending function part is provided in a part of the suspension, and the wiring between the first and second connection terminal circuit patterns is configured to absorb expansion and contraction of the wiring. It is characterized by

The magnetic head assembly according to the preceding claim, wherein a discard pad is provided on the same plane as the first circuit connection terminal pattern and at a position outside the magnetic head slider, and the discard pad is disposed with the first circuit connection terminal pattern. Wire bonding is performed between the pads, the wire is cut between the first circuit connection terminal pattern and the discarded pad, and the wire is bent at a right angle to form a work, and the second circuit connection terminal pattern is formed. The present invention is characterized in that the wire is formed by edge bonding.

The magnetic head assembly according to any one of the preceding items, wherein the wiring between the first and second connection terminal circuit patterns has a diameter of 10 to 70πι for a gold wire and a diameter of 10 to 30 for a aluminum wire. m, copper wire is characterized by being wired overhead with conductive wires having a diameter in the range of 10 to 40 m.

The magnetic head assembly according to any one of Items I, wherein the wiring between the first and second connection terminal circuit patterns has slack.

The magnetic head assembly according to any one of the preceding items, wherein the second connection terminal circuit pattern is located closer to the magnetic head than the bending function portion. .

The configuration of the method for assembling a magnetic head assembly according to the present invention is the method for assembling a magnetic head assembly according to any one of the preceding items, wherein: First wire bonding is performed, and then, the work is rotated 90 degrees so that the second connection terminal circuit pattern is on the upper side, and second wire bonding is performed, It is characterized by wiring.

The structure of the magnetic head assembly assembling apparatus according to the present invention is a magnetic head assembly comprising: a fixing means for fixing a work; and a wire wiring means for bonding a magnetic head slider and a suspension of the work to each other. In the assembling apparatus, a first wire bonding is provided on a first connection terminal circuit pattern of the magnetic head slider, and the first wire bonding includes the first connection terminal circuit pattern and a second connection terminal circuit pattern on the suspension. The workpiece is rotated 90 degrees around the intersection on a vertical line on each surface as a center of rotation, and a second wire bonding is provided on the second connection terminal circuit pattern to enable wire wiring. It features a child. Another configuration of the apparatus for assembling a magnetic head assembly according to the present invention includes a fixing means for fixing a magnetic head slider, and a metal tape used for a discard pad positioned on the same plane as a magnetic element surface of the magnetic head slider. A magnetic head assembly assembling device comprising: a positioning means for causing the magnetic tape to wind up the metal tape; and a circuit connection terminal pattern of a magnetic head slider on the fixing means and the positioned metal mold. Wire bonding means for bonding between the discard pads of the attached tape; cutting means for cutting the bonding wire between the pattern and the discard pad; and fixing means with the magnetic head slider fixed. Rotating means for rotating the magnetic head slider by 90 degrees around an intersection line between the magnetic head slider surface and the discard pad surface; It is characterized in that it comprises a bonding means for © edge-bonding and the other end of the wire which is a bonding on the circuit connection terminal pattern of the suspension.

The configuration of the magnetic disk drive according to the present invention includes at least one rotating disk having concentric data tracks containing information mounted on a housing, and a magnetic head for reading or writing data from the data tracks. Do An assembly, a device circuit unit for operating the assembly, and a magnetic disk device configured to control the device circuit unit via an interface. The magnetic head assembly according to claim 1, A magnetic head assembly according to any one of claims 5 to 10 is characterized.

The function of each of the above technical means is as follows.

A magnetic head assembly comprising a magnetic head slider and a suspension, wherein a connection of a thin film magnetic transducer surface of the magnetic head slider is provided. By connecting the terminal circuit pattern and the connection terminal circuit pattern on the suspension with a rigid conductive wire such as gold, aluminum or copper wire to absorb expansion and contraction, a magnetic head slider and suspension can be formed. Since no stress is applied to the magnetic head slider via the conductive wire, the magnetic head slider can be connected to the magnetic head slider without being deformed. .

Further, since the suspension is provided with the flexure function portion, the connection terminal circuit pattern of the suspension and the magnetic head slider do not relatively move, so that the suspension can be connected to the magnetic head slider without being deformed.

Further, since the conductive wire expands and contracts and absorbs a change in the distance between the connecting portions due to a difference in linear expansion between the magnetic head slider and the suspension, the stress is not applied to the magnetic head slider. It can be connected to the head slider without deformation.

According to the configuration of the invention relating to the magnetic head assembly described in claim 2, by providing the discard pad, it is possible to perform connection at a narrow pitch and at a low temperature by performing edge bonding.

According to the configuration of the invention relating to the magnetic head assembly according to claim 3, Since the overhead wire is provided by the conductive wire, the stress due to the difference in linear expansion between the magnetic head slider and the suspension is determined by the longitudinal elastic modulus of the conductive wire, so that the stress can be reduced.

According to the configuration of the invention of the magnetic head assembly according to claim 4, since the conductive wire is connected with a slack, the stress due to a difference in linear expansion between the magnetic head slider and the suspension is reduced by the conductive force. Since the stress is determined by the bending elastic modulus of the wire, the stress can be reduced.

According to the configuration of the invention relating to the magnetic head assembly according to claim 5, the vibration of the suspension can be reduced by setting the circuit connection terminal pattern of the suspension closer to the magnetic head slider than the flexure function part. Since there is no change in the distance between the joints due to vibration, the conductive wire is not deformed.

In other words, when the magnetic head slider travels while flying above the magnetic disk, the magnetic head slider applies a force in a direction to press the magnetic head slider against the magnetic disk, and the magnetic head slider is moved between the floating surface and the magnetic disk. Apply force in the direction of floating with the air cushion between the disk and the other side. Therefore, the irregularities and runout of the magnetic disk are absorbed by the flexure function of the suspension, and there is no cutting of the wire or deformation of the magnetic head slider. According to the configuration of the invention of the method for assembling a magnetic head assembly according to claim 6, the magnetic head assembly according to the above can be assembled in a thin film process for assembling a magnetic head element, and at low cost. I can make it.

According to the structure of the invention of the apparatus for assembling a magnetic head assembly according to claims 7 and 8, the first wire bonding is performed on the circuit connection terminal pattern on the surface of the magnetic conversion element, and the second wiring is mounted on the suspension. Wire bonding, and a wire with looseness between them can be formed, and the intersection point on the vertical line of each bonding is set as the center of rotation, so if the position of the first wire bonding is determined, The position of the second wire bonding can be determined. BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is a perspective view of a main part of a magnetic head assembly according to the present invention, FIG. 2 is a schematic explanatory view of a manufacturing apparatus of the magnetic head assembly of FIG. 1, and FIG. FIG. 2 is an explanatory view of a bonding connection in the magnetic head assembly manufacturing apparatus of FIG. 2, FIG. 4 is an enlarged view of a bonding connection portion of FIG. 3, and FIG. 5 is a drawing of FIG. FIG. 6 is a diagram showing the amount of deformation of the air bearing surface due to bonding; FIG. 6 is a perspective view of a main part of a magnetic head assembly according to another embodiment of the present invention; FIG. FIG. 8 is an enlarged view of a bonding connection portion of the head assembly. FIG. 8 is a structural view of a rotating jig of an assembling apparatus used for bonding the magnetic head assembly of FIG. 6, and FIG. FIG. 8 is an explanatory view of bonding by a rotating jig of the assembling apparatus shown in FIG. 8; Fig. 11 is a model diagram of a head slider that is a simple beam. 13 is a perspective view of a conventional magnetic head assembly, and FIG. 14 is a perspective view of a conventional magnetic head assembly; FIG. 13 is a magnetic head assembly of the magnetic head assembly of FIG. FIG. 15 is an enlarged view of a slider. FIG. 15 is a perspective view of a conventional magnetic head assembly of a composite structure. FIG. 16 is a perspective view of the magnetic head assembly shown in FIG. FIG. 17 is an enlarged view of an electric connection portion, FIG. 17 is a perspective view showing a non-floating surface of the magnetic head slider shown in FIG. 15, and FIG. 18 is a magnetic head shown in FIG. FIG. 19 is an enlarged view of another example of the electrical connection part of the assembly, and FIG. FIG. 20 is a diagram showing a convex shape 窣 shape amount when a solder is used, and FIG. 20 is a diagram showing a convex shape deformation amount when a conductive adhesive (silver epoxy resin) is used. . Four

BEST MODE FOR CARRYING OUT THE INVENTION

Embodiments of the present invention will be described with reference to FIGS. 1 to 12. In the following embodiments, a description will be given of a magnetic head assembly that presses a floating surface against a lower surface of a magnetic disk surface.

(Example 1)

An embodiment of the magnetic head assembly according to the present invention will be described with reference to FIG. FIG. 1 is a perspective view of a main part of a magnetic head assembly according to the present invention, in which (a) is a perspective view showing a state before assembling, and (b) is a partially enlarged view after assembling. In the figure, the same reference numerals as those in FIG. 15 denote the same parts, and a description thereof will be omitted, and only new reference numerals will be described.

In FIG. 1, A is the both sides of the tip of the suspension 14, B is the center of the tip of the suspension 14, C is the inner garden of the tip of the suspension 14, 40 is a connection terminal circuit pattern with the magnetic disk main body, Reference numeral 41 denotes a connection terminal circuit pattern with the magnetic head slider 11.

As shown in FIG. 1 (a), an electric lead 31 which is a patterned wiring on the upper surface of a metallic suspension 14 and a magnetic disk main body (not shown) at one end. A connection terminal circuit pattern 40 for electrical connection (hereinafter referred to as the magnetic disk side) and another inner end portion C at one end of the terminal C are connection terminals for electrical connection to the magnetic head slider 11. A circuit pattern 41 (hereinafter referred to as a distal end side) is provided, and the electric lead 31 connects the two connection terminal circuit patterns 40 and 41.

The connection terminal circuit patterns 40 and 41 are, for example, vapor-deposited or fitted with gold or the like, the surface thereof is exposed, and the other portions are covered with an insulating layer.

The suspension 14 drives the magnetic head slider 11 by its panel force. A pressing force is generated to press the magnetic disk surface (not shown), and when the magnetic head slider 11 travels on the magnetic disk surface, an air cushion is formed between both surfaces. With this air cushion, the magnetic head slider 11 travels while floating.

During this traveling, in order to travel on the disk surface with high accuracy, the deflection angle in the circumferential direction of the disk, that is, in the traveling direction, is absorbed by both side portions A at the front end side of the suspension 14 and the deflection in the direction perpendicular to the traveling direction. The angle is absorbed at the center B on the distal end side of the suspension 14. In other words, the tip side inner court part C of the suspension 14 moves in the same manner as the magnetic head slider 11, and its position does not change relatively. In other words, it works the same as the flexure 18 of the prior art.

The magnetic head slider 11 will be described in detail with reference to FIG. 1 (b). The magnetic head slider 11 is formed by forming a wafer from a material such as silicon carbide, alumina, or alumina titanium carbide as a base material, and forming a thin film magnetic layer on the wafer in the same process as the IC manufacturing process. The conversion element 13 and a connection terminal circuit pattern 15 for electrical connection with the thin-film magnetic conversion element 13 on the same plane as the thin-film magnetic conversion element 13 (hereinafter, simply referred to as a magnetic head element surface). Are formed in four places. In the manufacturing process, the thin-film magnetic transducer 13 and the connection terminal circuit pattern 15 are simultaneously formed in a plurality (approximately 100 or more).

Next, the wafer including the plurality of thin-film magnetic transducers 13 and the connection terminal circuit patterns 55 is formed so as to include the thin-film magnetic transducers と 13 and the four connection terminal circuit patterns 515. Then, cutting is performed so as to form one rectangular member on a surface orthogonal to the magnetic head element surface. Two surfaces of a rectangular member continuous with the cut surface and orthogonal to the magnetic head element surface are polished as a floating surface 19 and an anti-floating surface 33, respectively. Finally, the floating surface 1 9 In order to improve the characteristics, minute irregularities are formed by sputtering or the like.

The magnetic head of this embodiment uses alumina titanium carpite as a base material. When the size of the magnetic head is raised with the air bearing surface facing upward, the front surface of the magnetic head element surface has a width of about lm ni. It has a height of 0.3 mm and a length of 11.2 mm. The width of one of the circuit connection patterns 1'5 on the magnetic head element surface is about 130.

In such a magnetic head slider 11, the anti-floating surface 33 is arranged such that the magnetic head element surface is orthogonal to the tip inner yard C of the suspension 14 and parallel to the tip end side. It is fixed to the inner courtyard C with adhesive.

In this state, the connection terminal circuit pattern 15 and the connection terminal circuit pattern 41 are connected to each other by a gold wire 43 so that the connection terminal circuit pattern 15 is first bonded. 1 is the second bonding, which is connected in the air.

At this time, the aerial connection line is arranged so as to change its direction at a right angle, with each vertical axis intersection of the connection terminal circuit pattern 15 and the connection terminal circuit pattern 41 as a bending point. The thickness of the gold wire used for the connection is 25 m in diameter. Thus, the magnetic head slider 11 is formed.

(Example 2)

Next, another embodiment of the present invention will be described with reference to FIG.

FIG. 2 illustrates an apparatus for assembling the magnetic head assembly of FIG.

The assembling apparatus shown in FIG. 2 includes a rotating jig on the left side of the figure, a pole bonding apparatus on the right side of the figure, and a common base.

In the rotary jig, reference numeral 44 denotes a rotary actuator for rotational driving, 50 denotes a member in which a magnetic head slider 11 is mounted on a suspension 14. 7

Reference numeral 51 denotes a fixed block for fixing the work 50, 52 denotes a rotating block, 59 denotes a mounting base, and D denotes a rotation center axis of the rotary actuator 44.

In the pole bonding apparatus, 53 is an ultrasonic pole bonding portion, 54 is a horn, 55 is a gold wire of a bonding material, 56 is a spool, 57 is a cabillary, and 58 is a lever.

As shown in the drawing, the work 50 is fixed to the work fixing block 51 by vacuum suction or a fixing claw (neither is shown in detail). Although not shown in detail, the connection terminal circuit pattern 15 of the magnetic head slider 11 is located upward.

The work fixing block 51 is fixed to a rotation block 52, and the rotation block 52 is connected to a rotary actuator 44. The rotary actuator 44 rotates the rotary block 52 90 degrees about a rotation center axis D.

In the extension of the rotation center axis D, although not shown, an intersection or a position between the bonding position of the connection terminal circuit pattern 15 of the magnetic head slider 11 and the bonding position of the connection terminal circuit pattern 41 on the suspension 14 is provided. are doing.

The work fixing block 5: 1 is provided with a heating means (not shown) for heating to about 150 ° C. Further, a mounting base 59 is provided on the rotating block 52.

The rotating jig thus configured is fixed to a mounting frame 59, and is fixed to a common frame 60 for the mounting frame 59 and the ultrasonic pole bonding portion 53.

On the other hand, the ultrasonic pole bonding portion 53 is a general device, and transmits vibration from an ultrasonic vibrator (not shown) in the upward direction of the work 50. Horn 54 is arranged. At the tip of the horn 54, a capillary 57 is located. In this embodiment, the gold wire 55 of the bonding material is introduced from the spool 56 into the cavity 57. The horn 54 is configured to move up and down by a lever 58 provided below the pole bonding portion 53.

A method for bonding a magnetic head assembly by the present assembling apparatus will be described. FIG. 3 is an explanatory view of bonding connection by the assembling apparatus of FIG. In the figures, the same reference numerals as those in FIGS. 1 and 2 denote the same parts, and a detailed description thereof will be omitted.

As shown in FIG. 3 (a), first, the magnetic head slider 11 bonded on the suspension 14 is connected to the horn 54 because the connection terminal circuit pattern 15 is positioned upward as described above. The held capillaries 57 are lowered, and the first bonding is performed on the connection terminal circuit pattern 15.

Next, as shown in FIG. 3 (b), the lowered cable carrier 57 is raised to extend the bonding wire. 'Next, as shown in Fig. 3 (c), with the bonding wire extended and without changing the position of the cable 57, the bonding position of the connection terminal circuit pattern 15 and the suspension 14 The work 50 is rotated 90 degrees around the intersection with the bonding position of the connection terminal circuit pattern 41 on the tip side.

Next, as shown in FIG. 3 (d), the cable carrier 57 is lowered again, and the second bonding is performed on the surrounding terminal circuit pattern 41.

As shown in FIG. 3 (e), after the completion of the second bonding, the cable 17 is raised again to complete one wiring.

If the above process is repeated four times, the four heads on the magnetic head slider 11 The connection terminal circuit pattern 15 and the connection terminal circuit pattern 41 on the suspension 14 are electrically connected.

Further details will be described with reference to FIG.

FIG. 4 is an enlarged view of the bonding connection according to FIG. In the figure, the same reference numerals as those in FIG. Reference numeral 32 denotes a stainless steel plate base, reference numeral 34 denotes an insulating layer, and reference numeral 38 denotes an adhesive.

The suspension 14 is composed of a stainless steel plate base 32, and the magnetic head slider 11 is fixed to the base 32 with an adhesive 38 via an insulating layer 34.

The connection terminal circuit pattern 15 of the magnetic head slider 11 is used as a first bonding, the connection terminal circuit pattern 41 on the distal end side of the suspension 14 is used as a second bonding, and gold wires 43 are used. The two patterns 15 and 41 are connected.

The path of the gold wire 43 is drawn out from the first bonding so as to be orthogonal to the magnetic head element surface, and is bent at a right angle so as to be orthogonal to the connection terminal circuit pattern 41 on the way. The bonding has been completed and the above connection has been completed.

With such a structure, since the stress due to this connection is absorbed by the gold wire 43, it hardly reaches the magnetic head slider 11.

With reference to FIG. 5, the deformation amount of the flying surface 19 of the magnetic head slider 11 according to the present embodiment will be described. FIG. 5 is a diagram showing the amount of deformation of the flying surface due to the bonding of FIG.

FIG. 5 shows the deformation amount (nm) of the air bearing surface before and after connection on the vertical axis, and the deformation amount can be suppressed to 5 nm or less, which is not a problem. In the end, the terminal circuit pattern 4 1 on the tip of the suspension 14 4 is magnetic Since it is the same as on a flexible member that does not move with the head slider 11, no stress is applied to the gold wire 43.

Roughly, this bonding method can be connected at room temperature to 15 (low TC level), so it does not apply thermal stress to the magnetic head. In addition, the magnetic head element surface and the connection terminal circuit pattern 15 Therefore, it can be manufactured using only the same process as the IC process, so it is inexpensive.

(Example 3)

Still another embodiment of the present invention will be described with reference to FIG. 6 and FIG. FIG. 6 is a perspective view of a main part of a magnetic head assembly according to another embodiment of the present invention, and FIG. 7 is an enlarged view of a bonding connection portion of the magnetic head assembly of FIG. 1 are the same as those in FIG. Only new codes will be described. 6 1 is an aluminum wire.

The structure of the work 50 including the magnetic head slider 11 and the suspension 14 is almost the same as that of [Example 1] in FIG. In this embodiment, the aluminum wire 61 is edge-bonded to the same plane as the connection terminal circuit pattern 15 of the magnetic head slider 11, that is, the edge bonding is performed on the magnetic head element surface, and the aluminum wire 61 is formed on the wiring pattern 41 of the suspension 14. (4) Edge bonding is performed, and an arc shape with a radius of curvature having both points of the connection terminal circuit pattern 15 and the connection terminal circuit pattern 41 as tangent lines is maintained.

The above connection method will be described with reference to FIGS.

FIG. 8 is a structural view of a rotating jig of an assembly apparatus used for bonding the magnetic head assembly of FIG.

In Fig. 8, 1 1 is a magnetic head, 6 2 is a lower block, 6 3 is an upper holding block, 6 4 is a rotary actuator, 6 5 is a stand block, 6 6 is gold-plated tape, 6 7 is a take-up reel, 68 is a ゥ edge tool, 69 is a 7 Lumi wire, and 70 is a wire cutter. In the rotating jig shown in FIG. 8, the lower block 62 has a rectangular shape, and is an oblique cross section from one upper side of one surface in the longitudinal direction of the rectangular shape to a predetermined position below the facing surface. Is provided.

The gantry block 65 has a shape in which a quadrangular pyramid protrudes from one surface in the longitudinal direction of the rectangular parallelepiped, the upper surface of the rectangular pyramid is continuous with the upper surface of the rectangular solid, and the side surface of the rectangular pyramid is It is configured to be continuous with each of the other two surfaces of the rectangular body orthogonal to the surface on which the quadrangular pyramid is protruded.

Therefore, the slope of the quadrangular pyramid is formed from the upper surface of the rectangular body to a predetermined position of the quadrangular pyramid protruding surface in the longitudinal direction of the rectangular body. The oblique section of the lower block 62 and the upright surface connected thereto come into contact with the inclined surface of the quadrangular pyramid protruding from the gantry block 65 and the upright surface connected thereto.

The magnetic head slider 11 is fixed by one surface in the longitudinal direction of the lower block 62 and the upper holding block 63 so that the magnetic element surface faces upward.

The lower block 62 and the upper holding block 63 have a structure that can be rotated 90 degrees with respect to the gantry block 65 by a rotary actuator 64 while holding the magnetic head slider 11. I have.

Further, on the upper surface of the gantry block 65, a tape 66 that is gold-plated is positioned in parallel with the magnetic head slider 11, and is wound on a take-up reel 67. Further, this rotating jig is attached to a common mount (not shown) together with an ultrasonic bonder (not shown) to form an assembling apparatus.

On the horn (not shown) of the ultrasonic bonder, an edge tool 68, an aluminum wire 69, and a cutter 70 for cutting the wire 69 are provided on the magnetic element surface of the magnetic head slider 11 described above. Position at right angles to Have been.

Next, with reference to FIG. 9, the bonding of the above assembling apparatus by the rotating jig will be described. FIG. 9 is an explanatory view of bonding by a rotating jig of the assembling apparatus of FIG. FIG. 9 is a view of the rotary odor of the assembling apparatus shown in FIG. 8 as viewed from the direction of the arrow shown in the drawing. As described above, the magnetic head slider 11 has the lower block 6 2 and the upper holding block 6 3. The upper holding block 63 is omitted for simplicity of illustration.

First, as shown in Fig. 9 (a), the connection between the circuit pattern 15 of the magnetic head slider 11 and the gold-plated tape 66 is made with aluminum wire 69 as a bonding material and with an edge tool 68. Ultrasonic bonding. The bonded gold-plated tape 66 is later discarded as a discard pad.

Next, the aluminum wire 69 is cut with a cutter 70 between the discard pad and the connection terminal circuit pattern 15 and near the discard pad. The connection step is performed for all of the connection terminal circuit patterns 15 of the magnetic head slider 11. In this embodiment, there are four places.

Next, as shown in FIG. 9 (b), the gold-plated tape 66, which is a discard pad, is wound around the take-up reel 67. With this winding, the aluminum wire portion on the second bonding side bonded to the discard pad is also wound on the winding reel 67.

Next, as shown in FIG. 9 (c), with the magnetic head slider 11 fixed, the lower block 62 is connected to the mounting block 65 by the connection terminal circuit of the magnetic head slider 11 Rotate 90 degrees around the side of the gold-plated tape 66 of pattern 15. With this rotation, the aluminum wire 69 is bent 90 ° and plastically deformed. Next, as shown in FIG. 9 (d), when the magnetic head slider 11 is removed from the bonding apparatus in this state, the aluminum wire 69 is bonded on one side to the terminal pattern 15 of the magnetic head slider 11, 90 degrees bent Take out as a single item in a bent state.

Next, as shown in FIG. 9 (e), the aluminum wire 69 is positioned such that one end of the aluminum wire 69 is placed on the connection terminal circuit pattern 41 on the suspension 14 in a state of this single piece, and is bonded. Fix with agent 38.

Next, as shown in FIG. 9 (f), bonding is again performed from above the connection terminal circuit pattern 41 of the suspension 14 with the ゥ edge tool 68. In this embodiment, an aluminum wire is used, but a gold wire, a copper wire, or a wire gold-plated to copper can be similarly connected.

In this way, as in [Embodiment 1], electrical connection between both connection terminal circuit patterns on the right-angled surface is possible without applying stress to the magnetic head slider 11.

Hereinafter, in the above [Example 1] and [Example 3], the case where the wiring wire is not slackened and the case where the wiring wire is slacked will be discussed in detail. As described above, the flying surface 19 of the magnetic head slider 11 travels while flying above the surface of the magnetic disk via the air cushion, and the flying amount is also referred to as a number ηιη. Therefore, the surface accuracy of this air bearing surface is required to be very high.

Increasingly, due to the miniaturization of magnetic heads, the flying surface is required to have high accuracy. In particular, changes in surface accuracy due to environmental changes due to changes in temperature, temperature, etc. after assembly and adjustment must be minimized.

The rigidity of the magnetic head slider used in the present embodiment will be examined as a simple beam. . ■ FIG. 10 is a model diagram in which the magnetic head slider is a simple beam. In FIG. 10, (a) is a side view of a magnetic head beam, and (b) is a cross-sectional view of a magnetic head simple beam. b is head beam width to the magnetic, specifically ^{1/1 0 3 (mm)} , h is head beam height to magnetic, in particular ^{3 1 0 4 (mm),} L is , the length of Uz de beams to magnetic, specifically 1. 2Z10 ³ (mm), E is Young's modulus of the magnetic head support, 40 X ¹ 0 1. (Poisson's ratio), the allowable amount of deflection Y of the magnetic head is 5 nm, and the load W (N, Newton) is calculated from the following [Equation 1].

WL ³

… [Equation 1] b h

Where 〖-2: second moment

As a result of the calculation, the load W must not be applied with a force greater than 1Z10 ¹ , that is, 0.125 (N).

Next, a model in the case where the connection terminal circuit patterns are wired without loosening with wires will be described with reference to FIG. FIG. 11 is a model diagram of a wire wiring without slack in bonding of a magnetic head slider. In FIG. 11, 71 is a magnetic head slider, 72 is a suspension, 73 is a wire, 74 is an adhesive, c is the length of the wire 73 in the longitudinal direction of the support plate panel 2, d Is the vertical length of the wire 73 to the support panel 72.

If the wire is wired without slack, the linear expansion coefficient of each part will differ due to environmental temperature changes, so a tensile or compressive force will be applied to the wire 73, and a force in the direction perpendicular to the magnetic head 71, that is, the load W This affects the shape accuracy of the air bearing surface of the magnetic head 71. Here, the elastic coefficient and linear expansion coefficient of each material are shown in [Table 1].

【table 1】

In Fig. 11, the magnetic head slider 71 and the suspension 72 are made of alumina titanium carbide, stainless steel, and the wire 73 is made of gold, copper, and aluminum.c = d = 1.5 / 10 Cm ], environmental temperature difference 6 0 ° C, load W is, 1 Z 1 0 ¹ (N), the allowable amount of deflection change amount Y and 5 nm, follow the above [equation 1], the diameter of the wire 7 3 Calculated. However, I in [Equation 1] is as follows.

I = π (diameter of wire 7 3) ⁴ Ζ64

The calculation shows that the diameter is 67 μιη for gold, 39 μπι for copper, and 29 for aluminum.

Therefore, when the wire 73 is wired without slack, if the material constant of Table 1 and the wire diameter described above are used, the change in the surface accuracy of the air bearing surface of the magnetic head slider 71 will be 5 It can be smaller than nm. However, if the wire diameter of the wire 73 is 10 m or less, the workability is poor, and it is not suitable for mass production. Next, when the wire is slack as in [Example 1] and [Example 3], the force exerted on the magnetic head slider by the temperature change due to the temperature change is not the pulling force of the wire but the bending. Will be applied. The case where a bending force is applied will be described with reference to FIG. FIG. 12 is a model diagram of wire wiring having slack in bonding of a magnetic head slider.

In FIG. 12, the same reference numerals as those in FIG. 11 denote the same parts, and a description thereof will not be repeated.

The wire wiring shown in FIG. 12 (a) can be approximated to a tough beam as shown in FIG. 12 (b).

Calculate the bending force according to the following [Equation 2].

W = ^{wYI 1} … [Equation 2]

In this case, the sign of [Equation 2] is the same as that of FIG. 10 and [Equation 1], and the description is omitted. In this example, the load force was 3.5 1Z10 ⁴ compared to the case where the copper wire was used without wire slack, as shown in Fig. 11, using the wire diameter 39 of copper wire. [N] was 1.4%, which indicates that the effect of the wiring having the slack was great. This is not limited to copper wire, but similar results can be obtained for other wire materials. Industrial applicability

As described above, according to the configuration of the present invention, the magnetic head slider and the connection terminal circuits respectively provided on the suspension positioned at right angles to the magnetic head slider The pattern is wired with conductive wires to absorb expansion and contraction, and the connection terminal circuit pattern on the suspension is positioned on a member with a flexure function, so that electrical connection can be made without applying stress to the magnetic head slider In addition, the amount of deformation of the wiring wire due to the stress on the magnetic head slider caused by the difference in the linear expansion coefficient due to the temperature change is reduced, and no thermal stress is applied because bonding is performed at a low temperature. Since it can be manufactured in the same process as the IC process, an inexpensive magnetic head assembly, an assembling method, an assembling apparatus, and a magnetic disk device can be provided.

Claims

The scope of the claims

1. A work is formed from a magnetic head slider provided with a first connection terminal circuit pattern and a suspension provided with a wiring pattern and a second connection terminal circuit pattern, and the first and second connection terminal circuits are formed. In a magnetic head assembly in which patterns are electrically connected, a flexure function section is provided on the suspension, and wiring between the first and second connection terminal circuit patterns absorbs expansion and contraction of the wiring. A magnetic head assembly comprising:

2. The magnetic head assembly according to claim 1,

A discard pad is provided on the same plane as the first circuit connection terminal pattern and at a position outside the magnetic head slider, and wire bonding is performed between the first circuit connection terminal pattern and the discard pad. A wire is cut between the one circuit connection terminal pattern and the discarded pad, the wire is bent at a right angle, a work is formed, and the wire and the second circuit connection terminal pattern are edge-bonded. A magnetic head assembly characterized by the following.

The magnetic head assembly according to claim 1, wherein the wiring between the first and second connection terminal circuit patterns is a gold wire having a diameter of 10 to 70 m, aluminum. A magnetic head assembly characterized by being wired overhead by a conductive wire having a diameter of 10 to 30 το. For a wire and a diameter of 10 to 40 m for a copper wire.

3. The magnetic head assembly according to claim 1, wherein the wiring between the first and second connection terminal circuit patterns has slack. Three-dimensional.

The magnetic head assembly according to claim 1 or 2, A magnetic head assembly, wherein the second 'connection terminal circuit pattern is located closer to the magnetic head slider than the bending function portion.

6. In the method of assembling a magnetic head assembly, the work is positioned with the first connection terminal circuit pattern facing upward, the first wire ponding is performed, and then the work is connected to the second connection terminal. A method for assembling a magnetic head assembly, comprising rotating the circuit pattern by 90 degrees so that the circuit pattern is on the upper side, performing second wire bonding, and wiring.

7. An assembling apparatus for a magnetic head assembly, comprising: fixing means for fixing a work; and wire wiring means for bonding the magnetic head slider of the work and the ⁰ suspension. The first connection terminal of the magnetic head slider. A first wire bonding is provided on the circuit pattern, and an intersection on a line perpendicular to each surface including the first connection terminal circuit pattern and the second connection terminal circuit pattern on the suspension is defined as a rotation center 5, The magnetic head assembly assembling apparatus, wherein the work is rotated by 90 degrees, a second wire bonding is provided on the second connection terminal circuit pattern, and a wire can be wired. .

8. Fixing means for fixing the magnetic head slider, positioning means for positioning the metal tape used for the discard pad on the same plane as the magnetic element surface of the magnetic head slider, and winding means for winding the metal tape A magnetic head assembly assembling apparatus, comprising: bonding between a first connection terminal circuit pattern of the fixed magnetic head slider and a discarded pad of the positioned metal-coated tape. Wire bonding means; cutting means for cutting the wire between the circuit pattern and the discard pad; and fixing means for fixing the magnetic head slider while intersecting the magnetic head slider surface with the discard pad surface. 90 degrees around the axis A rotating means for rotating the magnetic head slider, and a bonding means for edge bonding the other end of the wire of the magnetic head slider onto a second connection terminal circuit pattern of the suspension. apparatus.

9. At least one rotating disk with concentric data tracks containing information mounted on the housing, a magnetic head assembly for reading or writing data from said data tracks, and a device for operating these In a magnetic disk device configured such that a circuit unit and the device circuit unit are controlled via an interface, the magnetic head assembly may be provided as described in claim 1 to claim 5, A magnetic disk drive comprising any one of a magnetic head assembly.