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WO1997013274A1 - Support pour composants electroniques - Google Patents

Support pour composants electroniques Download PDF

Info

Publication number
WO1997013274A1
WO1997013274A1 PCT/GB1996/002259 GB9602259W WO9713274A1 WO 1997013274 A1 WO1997013274 A1 WO 1997013274A1 GB 9602259 W GB9602259 W GB 9602259W WO 9713274 A1 WO9713274 A1 WO 9713274A1
Authority
WO
WIPO (PCT)
Prior art keywords
support
layer
ceramic
dispersion
substrate
Prior art date
Application number
PCT/GB1996/002259
Other languages
English (en)
Inventor
Matthew John Holmes
Thomas Campbell Prentice
Keith Taylor Scott
Robin Michael Kurt Young
Original Assignee
Aea Technology Plc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aea Technology Plc filed Critical Aea Technology Plc
Priority to AU69382/96A priority Critical patent/AU6938296A/en
Publication of WO1997013274A1 publication Critical patent/WO1997013274A1/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/18—After-treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer

Definitions

  • the invention relates to a support for electronic components comprising an electrically isolating layer on a substrate and to a method of manufacturing such a suppor .
  • Metal matrix composites such as may be manufactured in accordance with the metnods described m patent application No. 96 11358.4, are particularly suitable as substrates. In addition to meeting the above mentioned requirements they have the further advantage of low density. However, being electrically conducting, it is necessary that they are provided with a thm electrically isolating layer between the surface of the substrate and semiconductor devices mounted thereon. Such an electrically isolating layer has to be capable of providing effective isolation which will not break down under the stress of the electrical voltages which may appear m use on the semiconductor devices.
  • electrically isolating layers comprise a ceramic such as alumina coated on to a substrate by a thermal spraying process such as plasma spraying or a high velocity oxyfuel process. The thickness of the ceramic coating is a compromise between the breakdown voltage which increases with increasing thickness and the desirability for a th coating to minimise thermal impedance between the electrical device and the heat sink.
  • the invention provides, in one of its aspects, a support for electronic components comprising a substrate, an electrically isolating ceramic iayei applied to the substrate by a thermal spraying process, voids at least at the exposed surface of the thermally sprayed ceramic layer having been sealed by the application thereto of a fine dispersion of a filler material heat treated to consolidate the filler material and the thermally sprayed ceramic layer.
  • the substrate comprises a metal matrix composite, preferably comprising a matrix of aluminium or aluminium alloy reinforced with particulate silicon carbide.
  • the said dispersion may conveniently comprise a fine dispersion of a polymeric plastics material or a precursor for a polymer or a polymeric ceramic material, which case the heat treatment is such as to polymerise the precursor.
  • the isolation layer will usually be required to withstand relatively high temperatures both further fabrication steps and use.
  • the said dispersion comprises a fine dispersion of a ceramic, a glass or a precursor for a ceramic or a glass and the heat treatment is carried out at a temperature which sinters the finely dispersed ceramic or fuses the glass as the case may be or converts the precursor to consolidated ceramic or fused glass.
  • the invention provides, in another of its aspects, a method of fabricating a support as aforesaid, which method comprises the steps of
  • fine dispersion we mean a dispersion of particles a sufficient proportion of which are small enough to enter into and fill up voids in the layer formed by the thermal spraying process.
  • the said dispersion may comprise a solution or sol of the said precursor.
  • Figure 1 is a diagrammatic part cross sectional view of a support illustrating a stage in the process of the method
  • Figure 2 is a similar cross sectional view at a later cage the process.
  • suostrate 11 is a metal matrix composite comprising a matrix of aluminium or aluminium alloy reinforced with particulate silicon carbide and made by the method of our patent application No. 96 11358.4.
  • Such composite is an excellent material for the production of packages for power handling semiconductors by virtue of its low mass, high thermal conductivity and low thermal expansion coefficient.
  • the thermal expansion coefficient in particular can be closely matched to that of alumina semiconductor substrates for improving overall device reliability during thermal cycling.
  • An electrically isolating layer on substrate 11 is formed by a three step process, the first step of which is illustrated in Figure 1 which shows a layer 12 of ceramic, alumina in this example, which has been applied by air plasma spraying.
  • a layer is porous containing numerous voids such as 13 which may include so called pin-hole voids.
  • adhesion of the layer 12 to the substrate 11 may be enhanced by Known chemical or mechanical pre-treatments of the substrate surface prior to theim ⁇ -- spraying.
  • a dispersion of a chemical precursor to a ceramic is then applied to the layer 12.
  • the dispersion is a boehmite sol, being a precursor for alumina.
  • the dispersion is infiltrated mto the voids in the layer 12.
  • This infiltration may be achieved by simple dipping relying upon capillary action to fill the voids.
  • a forced flow can be provided by a vacuum impregnation. Excess material is wiped from the coat g surface by a doctor blade or absorbent wiper.
  • the infiltrated coating is then baked at 300 - 400°C in order to convert the precursor to ceramic (alumina in the case of boehmite sol precursor) .
  • Figure 2 illustrates the final product with a thm surface layer of coat g shown at 14.
  • the following table shows experimental measurements made on two samples with a plasma sprayed layer 12 of alumina of respectively 60 microns and 210 microns thickness.
  • the table shows a series of readings of measured breakdown voltage using A) an indium foil contact and E) a direct surface measurement. All measurements are in kilovolts and for each sample, a series of measurements is shown for the stage illustrated m Figure 1 prior to any application of the sealing coatmg 14 and a correspondmg series of measurements for the final product as illustrated in Figure 2 (columns marked + ⁇ mpregnat ⁇ on) . Averages of the five readings are shown in the final ro.'. All values Al_O j Al 0, Al 0, AIA in KV 80 ⁇ m SO ⁇ m + 210 ⁇ m 210 ⁇ m +
  • the isolation layer made according to the foregomg example is readily treated by masking and thermal spraying for depositing circuit tracking on the isolation layer.
  • selective electropla ing can be used to provide the tracking.
  • Boehmite sol of available commercial and custom manufactured grades has been found to be particularly suitable as mfiltrant precursor.
  • other dispersions may be used and, dependmg upon the typical size of voids in the layer 12, may comprise a salt in solution or a sol having particle size up to 100 angstrom units. Desirable features for the dispersion are that it has a high concentration of the precursor and that the particle size is fine enough to achieve effective penetration of the pores in layer 12. It is important that the temperature required to convert the precursor to ceramic i ⁇ as low as practicable to avoid damage to the sues- race during tne baking step.
  • the dispersion may mclude wetting and dispersion agents to improve concentration and flow properties.
  • Alumina is particularly suitable as the ceramic for the first layer 12, but other ceramics may be utilised and the most appropriate thermal spraying process adopted for the deposition. Thus, we used air plasma sprayed alumina, but low pressure plasma spraying is also suitable.
  • a high velocity oxyfuel technique can be used to apply a ceramic layer of, for example, mullite, cordierite or zirconia.
  • An alumina sol or s-.lic ⁇ n sol is particularly suitable for forming the sealing layer 14.
  • other dispersions of ceramic precursors may be used.
  • sealing layer of polymeric material or of glass rather than ceramic is readily achieved by appropriate selection of precursor.
  • Application of ultrasound to the substrate durmg infiltration may be use ⁇ to improve the penetration of the fine dispersion into the first ceramic layer.
  • masking may be used to control the deposition upon the substrate of the first ceramic layer, the secondary sealing coat g, or both.
  • the manufacturing process described integrates effectively with the substrate fabrication process leading to a low overall system cost and good system performance as compared with conventional methods of achieving electrical isolation.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coating By Spraying Or Casting (AREA)

Abstract

Ce support pour composants électroniques comprend un substrat (11) que l'on a recouvert d'une couche de revêtement isolante électriquement en appliquant une première couche (12) céramique à l'aide d'un procédé de vaporisation thermique. On bouche les vides (13) de la première couche céramique en appliquant une dispersion fine d'un matériau de charge, puis en traitant à la chaleur afin de consolider la couche (12, 14) isolante rendue hermétique.
PCT/GB1996/002259 1995-09-29 1996-09-13 Support pour composants electroniques WO1997013274A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU69382/96A AU6938296A (en) 1995-09-29 1996-09-13 A support for electronic components

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB9519888.3A GB9519888D0 (en) 1995-09-29 1995-09-29 Electrically isolating coating layers
GB9519888.3 1995-09-29

Publications (1)

Publication Number Publication Date
WO1997013274A1 true WO1997013274A1 (fr) 1997-04-10

Family

ID=10781482

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB1996/002259 WO1997013274A1 (fr) 1995-09-29 1996-09-13 Support pour composants electroniques

Country Status (3)

Country Link
AU (1) AU6938296A (fr)
GB (2) GB9519888D0 (fr)
WO (1) WO1997013274A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19752195A1 (de) * 1997-11-25 1999-06-17 Siemens Ag Halbleiterelement mit einer Tragevorrichtung und einem Zuleitungsrahmen und einem damit verbundenen Halbleiterchip
WO2007140494A1 (fr) * 2006-06-07 2007-12-13 Ab Mikroelektronik Gesellschaft Mit Beschränkter Haftung Support de circuit
WO2007140495A3 (fr) * 2006-06-07 2008-10-09 Mikroelektronik Ges Mit Beschr Procédé de fabrication d'un support de circuit
CN102017342A (zh) * 2008-04-02 2011-04-13 科特克表面调质处理有限责任公司 包括圆柱形基体和介电辊子涂层的电晕辊以及用于制造这种电晕辊的方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001040544A1 (fr) * 1999-11-30 2001-06-07 Gotek Gmbh Corps moule comportant une couche de protection impregnee
DE10052247A1 (de) * 2000-10-21 2002-04-25 Hella Kg Hueck & Co Schaltungsstrukturen auf thermisch gespritzten Schichten
EP1253213A3 (fr) * 2001-04-23 2004-04-07 Sulzer Markets and Technology AG Procédé de fabrication d'une couche céramique ayant des fonctions électriques ou électrochimiques
ITMO20060322A1 (it) * 2006-10-12 2008-04-13 Maria Prudenziati Tecnica innovativa per il miglioramento delle caratteristiche dielettriche e di anticorrosione di ricoprimenti ottenuti con tecnologie thermal spray, aps, hvof e analoghe, in particolare di riporti isolanti quali ad es. a1203.
FR2967289B1 (fr) * 2010-11-10 2013-08-23 Valeo Sys Controle Moteur Sas Equipement electrique comportant un circuit electronique et procede de fabrication d'un tel equipement

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0048992A2 (fr) * 1980-09-30 1982-04-07 Kabushiki Kaisha Toshiba Plaquette de circuit imprimé et son procédé de fabrication
US4340635A (en) * 1980-12-15 1982-07-20 Coors Porcelain Company Ceramic substrate for fine-line electrical circuitry
EP0115412A2 (fr) * 1983-01-27 1984-08-08 United Kingdom Atomic Energy Authority Revêtement pour substrat électrique
EP0346038A1 (fr) * 1988-06-09 1989-12-13 Advanced Composite Materials Corporation Composite ternaire avec une matrice métallique

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4328285A (en) * 1980-07-21 1982-05-04 General Electric Company Method of coating a superalloy substrate, coating compositions, and composites obtained therefrom
EP0217991A1 (fr) * 1985-10-04 1987-04-15 Repco Limited Revêtement céramique
US4576874A (en) * 1984-10-03 1986-03-18 Westinghouse Electric Corp. Spalling and corrosion resistant ceramic coating for land and marine combustion turbines
DE3631536A1 (de) * 1986-09-17 1988-03-24 Bayer Ag Gasdichte plasmagespritzte keramikkoerper sowie verfahren zu deren herstellung
JPH089765B2 (ja) * 1988-04-15 1996-01-31 三菱重工業株式会社 セラミツク溶射材の封孔処理方法
CH692481A5 (de) * 1988-10-21 2002-07-15 Hort Revetements S A Verfahren zum Aufbringen einer Fluorpolymer-Schicht auf eine Oberfläche eines Gegenstands und Gegenstand beschichtet nach dem Verfahren.
JP2647482B2 (ja) * 1989-02-15 1997-08-27 中部電力株式会社 セラミック溶射皮膜の封孔処理方法
JP2612983B2 (ja) * 1991-11-06 1997-05-21 朝日化学工業株式会社 溶融金属に対して耐食性を有するロール
GB2269392A (en) * 1992-08-06 1994-02-09 Monitor Coatings & Eng Coating of components with final impregnation with chromia or phosphate forming compound
DE4303135C2 (de) * 1993-02-04 1997-06-05 Mtu Muenchen Gmbh Wärmedämmschicht aus Keramik auf Metallbauteilen und Verfahren zu ihrer Herstellung
US6490891B1 (en) * 1997-09-03 2002-12-10 Robert W. Stringer Draw bolt assemblies

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0048992A2 (fr) * 1980-09-30 1982-04-07 Kabushiki Kaisha Toshiba Plaquette de circuit imprimé et son procédé de fabrication
US4340635A (en) * 1980-12-15 1982-07-20 Coors Porcelain Company Ceramic substrate for fine-line electrical circuitry
EP0115412A2 (fr) * 1983-01-27 1984-08-08 United Kingdom Atomic Energy Authority Revêtement pour substrat électrique
EP0346038A1 (fr) * 1988-06-09 1989-12-13 Advanced Composite Materials Corporation Composite ternaire avec une matrice métallique

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19752195A1 (de) * 1997-11-25 1999-06-17 Siemens Ag Halbleiterelement mit einer Tragevorrichtung und einem Zuleitungsrahmen und einem damit verbundenen Halbleiterchip
WO2007140494A1 (fr) * 2006-06-07 2007-12-13 Ab Mikroelektronik Gesellschaft Mit Beschränkter Haftung Support de circuit
WO2007140495A3 (fr) * 2006-06-07 2008-10-09 Mikroelektronik Ges Mit Beschr Procédé de fabrication d'un support de circuit
US8134083B2 (en) 2006-06-07 2012-03-13 Ab Mikroelektronik Gesselschaft Mit Beschrankter Haftung Circuit carrier
CN102017342A (zh) * 2008-04-02 2011-04-13 科特克表面调质处理有限责任公司 包括圆柱形基体和介电辊子涂层的电晕辊以及用于制造这种电晕辊的方法

Also Published As

Publication number Publication date
GB9519888D0 (en) 1995-11-29
AU6938296A (en) 1997-04-28
GB9619236D0 (en) 1996-10-23
GB2305672A (en) 1997-04-16

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