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WO1998000841A1 - Unite de disque dur a contact virtuel avec transducteur plan - Google Patents

Unite de disque dur a contact virtuel avec transducteur plan Download PDF

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Publication number
WO1998000841A1
WO1998000841A1 PCT/US1997/011408 US9711408W WO9800841A1 WO 1998000841 A1 WO1998000841 A1 WO 1998000841A1 US 9711408 W US9711408 W US 9711408W WO 9800841 A1 WO9800841 A1 WO 9800841A1
Authority
WO
WIPO (PCT)
Prior art keywords
disk
layer
pad
trailing
pads
Prior art date
Application number
PCT/US1997/011408
Other languages
English (en)
Inventor
Robert Hempstead
Keith R. Berding
William C. Cain
Harold J. Hamilton
Darren T. Imai
Dimitre A. Latev
Mark A. Lauer
Michael E. Mcaleavey
Alexander P. Payne
David D. Roberts
Original Assignee
Censtor Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Censtor Corporation filed Critical Censtor Corporation
Publication of WO1998000841A1 publication Critical patent/WO1998000841A1/fr

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/58—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed with provision for moving the head for the purpose of maintaining alignment of the head relative to the record carrier during transducing operation, e.g. to compensate for surface irregularities of the latter or for track following
    • G11B5/60—Fluid-dynamic spacing of heads from record-carriers
    • G11B5/6005—Specially adapted for spacing from a rotating disc using a fluid cushion
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127—Structure or manufacture of heads, e.g. inductive
    • G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
    • G11B5/3176—Structure of heads comprising at least in the transducing gap regions two magnetic thin films disposed respectively at both sides of the gaps
    • G11B5/3179—Structure of heads comprising at least in the transducing gap regions two magnetic thin films disposed respectively at both sides of the gaps the films being mainly disposed in parallel planes
    • G11B5/3183—Structure of heads comprising at least in the transducing gap regions two magnetic thin films disposed respectively at both sides of the gaps the films being mainly disposed in parallel planes intersecting the gap plane, e.g. "horizontal head structure"
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127—Structure or manufacture of heads, e.g. inductive
    • G11B5/33—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only
    • G11B5/39—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects
    • G11B5/3903—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects using magnetic thin film layers or their effects, the films being part of integrated structures
    • G11B5/3967—Composite structural arrangements of transducers, e.g. inductive write and magnetoresistive read
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/40—Protective measures on heads, e.g. against excessive temperature 

Definitions

  • the present invention relates to disk drives having transducers in close proximity
  • the air separation between the transducer and the media has
  • transducer designed for perpendicular recording. To avoid destructive wear and to minimize variations in the head-disk separation the head is mounted on the trailing edge
  • transducer formed on a tail-dragging end pad while leading pads remain aloft.
  • poletips next to the tail-dragging corner so that the spacing between the poletips and
  • planar transducers in which the thin films extend
  • planar transducers preclude the
  • poletips located adjacent to a trailing corner of a slider due to the horizontal extension of the other transducer layers well beyond the poletips. Since the poletips of a
  • planar transducer must be spaced from the trailing corner, sliding that corner on the disk
  • An object of the present invention is to combine the efficiency of a planar head
  • a pair of air-bearing side pads are located on the disk-facing side
  • the slider is formed, along with thousands of other sliders, by deposition and
  • An extra metal layer may be formed between
  • the substrate and the strata to provide for thermal expansion and contraction of the
  • metal may be formed on the strata side of the substrate to control substrate crown and
  • the strata i ⁇ sulative material, preferably alumina. Unlike conventional sliders, the strata
  • the wafer providing an efficient, mass production operation that is less costly and more
  • RIE reactive ion etching
  • IBE ion beam etching
  • amagnetic gap between the poletips are composed of amorphous diamond-like carbon (DLC). which provides a superior material for interaction with the disk surface.
  • DLC amorphous diamond-like carbon
  • surface is also preferably composed primarily of carbon, including a hard carbon overcoat
  • hydrocarbon or fluorocarbon lubricant that may be hydrogenated or nitrogenated.
  • planar transducer is also constructed to allow for a microscopic amount of
  • planar transducer of the present invention has yokes which approach each other at a large
  • At least one of the magnetic yokes is formed as a gently curving layer to form a
  • a high magnetic saturation layer may be formed adjoining
  • Such a high Bs layer optionally formed along the leading edge as well.
  • the magnetic yoke is constructed so as to saturate elsewhere in the magnetic
  • a magnetoresistive (MR) element may
  • FIG. I is a bottom view of a disk-facing side of a virtual contact slider of the
  • FIG. 2 is a side view of the slider of FIG. 1 , operating with the poletips of the
  • FIG. 3 is a bottom view of a disk-facing side of a negative pressure virtual contact
  • FIG. 4 is a bottom view of a disk-facing side of a virtual contact slider of the
  • present invention having a shelf adjoining separate curved side rails.
  • FIG. 5 A is a perspective view of a wafer used for the construction of thousands of
  • FIG. 5B is a perspective view of a wafer used for the construction of thousands of
  • FIG. 6 is a cross-sectional view of some initial steps in constructing a planar
  • FIG. 7 is a top view of the planar transducer of FIG. 6.
  • FIG. 8 is a cross -sect ion a I view of some subsequent steps in constructing the
  • planar transducer of FIG. 6 including the formation of a second yoke layer and a second
  • FIG. 9 is a cross-sectional view of the construction of a pedestal that elevates the
  • FIG. 10 is a cross-sectional view of the formation of a pair of pole layers
  • FIG. 1 1 is a cross-sectional view of the etching of the pole layers of FIG. 10 into a
  • FIG. 12 is a top view of the etching poletips of FIG. 1 1.
  • FIG. 13 is a cross-sectional view of the construction of a DLC pad encasing the
  • FIG. 14 is a top view of a disk-facing side of a wafer with an array of sliders to be
  • FIG. 15 is a top view of a disk-facing side of a wafer with an array of sliders
  • FIG. 16 is a cross-sectional view of an angled, rotating etching of a DLC pad to
  • FIG. 17 is a top view of some initial steps in the construction of a
  • FIG. 18 is a cross-sectional view of some additional steps in the construction of
  • FIG. 19 is a cross-sectional view of the magnetoresistive embodiment of FIGs. 17
  • a slider 20 is shown from a perspective displaying a
  • disk-facing surface 22 which includes a pair of laterally disposed pads or rails 25 and 28,
  • the slider 20 is designed to interact with a
  • a pair of poletips 44 are exposed on a trailing edge
  • the poletips 44 project from near the center of a planar
  • transducer region 46 which is formed within the surface 22 and asymmetrically covered
  • the slider is operationally positioned adjacent to a magnetic
  • transducer region 46 with the poletips 44 exposed near the trailing end of the pad allows
  • poletips to be closer to the disk 50 than the remainder of the tilted, disk-facing surface
  • poletips 44 are encased by the DLC pad 30 on a trailing side as well as a leading side to
  • pad and poletips are designed to afford a limited amount of wear consistent with a
  • the slider 20 is held by gimbal flexure members 53 which are
  • the slider shown in FIG. I may have a disk facing surface which extends laterally
  • the pads 25 and 28 may each
  • the trailing pad may have a disk-facing area of about 0.013 mm " , although these figures may vary significantly.
  • portions of pads 25, 28 and 30 are generally coplanar and have an elevation that differs
  • the transducer region 46 may have a shallower recess than the
  • the ramps or steps 38 and 40 have an elevation
  • Ramps 38 and 40 may be formed by lapping, while an alternate embodiment
  • steps 38 and 40 may be formed by 1BE.
  • RIE is typically used to form the deeper
  • FIG. 3 shows a slider 55 having a contoured disk-facing surface 58 formed by
  • the slider 55 has a single, generally U-shaped lifting pad 60 and a trailing
  • the trailing central pad 62 has a generally oblong shape, with a flat trailing edge
  • slider 55 to be skewed relative to the flow of air from the disk, as is common with sliders positioned by a pivoting, rotary actuator, without significantly altering the upward tilt of
  • the pads 60 and 62 differ in elevation from recessed
  • step 70 has an elevation that differs
  • negative pressure region 72 Either before or after the creation of negative pressure
  • a shallower, curving ramp or step 70 may be formed by etching of the leading
  • the step or ramp 70 optionally extending to the leading edge 66, while
  • region 75 similar to that described with reference to FIG. I is symmetrically disposed
  • FIG. 4 shows a slider 77 that has a pair of curved, air-bearing side pads 79 and 80
  • central pad 82 encompasses a pair of poletips 85 which protrude from the center of a
  • I I planar transducer 88 but which are asymmetrically oriented relative to the central pad.
  • the DLC of the disk facing surface of this embodiment has been etched to form a step 90
  • the pads 79, 80 and 82 may have a height of between 1 ⁇ m and 5 ⁇ m
  • the step 90 may have an elevation in a range between
  • the curving borders of the pads and step 92 present relatively smooth surfaces
  • poletips has a trailing edge which extends only about 10 ⁇ m behind the poletips.
  • this extension may range from less than 5 ⁇ m to more than 20 ⁇ m, so that little spacing
  • the pads 79. 80 and 82 is hard yet amorphous, so that it is resistant to chipping as well as
  • the DLC layer has been constructed, as will be described below, in a
  • the DLC layer is primarily formed of carbon, although the DLC may
  • the DLC disk-contacting pads of the present invention are particularly suited for
  • the disk overcoat contains
  • the lubricant preferably includes hydrocarbons or fluorocarbons.
  • a process for making the planar, virtual contact slider of the present invention is
  • FIG. 5A in which a wafer substrate 100 typically four to ten
  • each transducer preferably formed for each transducer to provide leads to that element separate from the
  • the wafer 100 is preferably composed of pressed and sintered alumina
  • sliders may alternatively be formed of other known wafer materials, such as silicon
  • Si silicon nitride
  • SiC silicon carbide
  • AITiC aluminum titanium carbide
  • the holes are formed by patterning masks and etching or laser ablating to remove
  • the holes 102 are formed as silicon carbide, an insulative oxide or nitride coating is then formed.
  • the holes 102 are
  • conductive material preferably copper or gold, is deposited in and about the holes 102 by
  • a pair of metal layers 95 and 96 are
  • the layer 95 may thereafter be bonded to or formed into part of a gimbal
  • the metal layer 96 between the substrate 98 and the strata can be
  • the electrical leads exposed at an edge of a slider can be bonded to wire leads,
  • thermal compensation layer may be glued or otherwise adhered to the surface of the slider
  • the layer may also extend to form part of the suspension for the slider, and may be patterned to form gimbal members, the gimbal members optionally being connected to the
  • transducer leads so as to carry signals between the transducer and the drive electronics.
  • FIGs. 6 and 7 which focus on the formation of a single
  • a plateau 1 12 may be formed by a variety of methods of
  • alumina which is to form the plateau 1 12 having a thickness of about 8 ⁇ m - 12 ⁇ m is
  • alumina is then chemically etched with a solution of I IF diluted to 15% by volume,
  • a reactive ion etch preferably
  • a mask then covers the etch stop and
  • a bottom yoke layer 1 15 for the transducer is then formed of plated permalloy
  • the yoke atop a sputtered seed layer by window frame plating, the yoke extending at both ends.
  • the resist 1 17 then being baked, which causes it to flow slightly and then harden, resulting
  • photoresist layer 1 19 is then deposited and removed from atop the plateau 1 12 and an end
  • a NiFeMo or Ti/Cu seed layer is then sputtered, then covered with another
  • photoresist layer which is patterned with a pair of spirals, and then electroplated with
  • patterned spiral resist is then removed as is the seed layer between coils, to leave the coil
  • the stud providing an electrical lead between the coil layer 122 and
  • a second coil layer 130 Deposition of a layer 125 of alumina on and about the coil 122
  • etch-stop layer 127 of SiC is then deposited to cover alumina layer 125, masked and patterned by IBE to remain atop the
  • top yoke 140 top yoke 140.
  • Another coil layer 130 is then formed by electroplating and patterning and
  • insulative alumina layer 133 which is lapped flat.
  • yet another etch-stop layer 135 of SiC is
  • alumina forms a pedestal 137 having sloping sides, after which the etch stop 135 not
  • pedestal 137 is removed. Apertures in a photoresist are then formed over the ends of yoke 1 15, allowing another etch to produce sloping sides of alumina layer 133
  • first pole layer 146 of NiFe is then formed by window frame plating of permalloy or other
  • SiC or Si is then deposited, which has an essentially vertical section 152 formed on the
  • section 152 is formed by sputtering in a vacuum chamber while positioning the platform
  • uniform formation on a vertical edge can be accomplished by rotating or transporting the
  • the layer 150 is then
  • amagnetic layer 150 immediately before or after the formation of amagnetic layer 150, a similarly formed
  • a layer of high magnetic saturation material such as FeAl(N) may be formed for allowing high flux transmission along the trailing side of the gap 152, while a similar high B s layer
  • a second pole layer 155 is formed by
  • first and second poles plated on top of the first pole layer 146 are then removed by lapping, for which layer 150 may serve as a lap-stop, to leave a planar surface 157 including the first and second pole
  • the etching is done by IBE with the ion beam directed at a preselected angle ⁇ to the surface of the pole layers 146 and 155, while the wafer is
  • IBE also forms a tapered skirt 168 of the poletips 164 and 166, the skirt 168 acting as an
  • the skirt 168 allows the DLC that wraps around the poletips
  • the photoresist mask 160 has an etch rate that is similar to
  • the pole layer 155 and the mask 160 are etched a similar amount, as shown by dashed line
  • Pole layer 146 is partially shielded from the angled IBE by the mask 160,
  • layer 155 will have a non-etched portion adjacent to an opposite end of the
  • ⁇ may be changed to further control the shaping of the poletips 44. for example to
  • angled IBE is continued for an appropriate time to create a pair of poletips 164 and 166
  • An adhesion layer 180 of Si is deposited to a thickness of about 1000 A atop
  • a layer 182 of DLC is then deposited by
  • the pads 25, 28 and 30 are then lapped to expose the poletips 164 and 166.
  • the DLC may be lapped prior to the formation of the pads 25, 28
  • FIG. 14 shows a view of the disk-facing surface of the wafer, in which side pads
  • the sliders may all face in the same direction, rather than in the mirrored rows of leading
  • etching mask is then formed that covers all but the leading ends of pads 25 and 28 for
  • the etching mask may be a photoresist or may be formed by
  • NiFe mask is
  • steps rather than ramps which may be formed by IBE or RIE. like step 90 of FIG. 4.
  • Such steps may have an elevation offset
  • an angled IBE can be performed with a greater part of the leading end of the ramp exposed, to create a
  • FIG. 16 details the creation of steps or ramps on the leading, inner or outer edges
  • a silicon layer 212 is sputtered atop the wafer to protect the poletips, which are not
  • NiFe layer 215 a shown in this figure, followed by a nickel-iron layer 215. Atop the NiFe layer 215 a
  • photoresist not shown, is patterned to leave openings over leading edge 217 of the pad
  • An IBE etch may
  • RIE etch using O 2 plasma may be employed for a limited time, so that the step has a
  • FIG. 17 shows an embodiment of the virtual contact slider with a
  • MR magnetoresistive
  • MR sensor 250 and first yoke layer sections 253 and 255 of the magnetic loop are shown in FIG. 17 as they appear during construction of the yoke prior to the
  • the MR stripe 250 is formed first, atop either an insulative
  • insulative material such as silicon nitride or nonconductive silicon carbide, before or after
  • photoresist and ion beam etched to define a generally rectangular shape extending about 5
  • the IBE that defines the outline of the MR stripe 250 may
  • Permalloy layer as a seed layer for the yokes and conductive leads that will be formed
  • conductive pattern is formed which provides a pair of conductive leads 260 and 262 to
  • the leads having respective slanted edges 265 and 268 which are
  • leads 260 and 262 and conductive bar 270 are so much more electrically conductive than the MR stripe 250 that an electrical current between leads 260 and 262 in sections
  • the magnetoresistance of the MR stripe 250 varies depending upon an angle ⁇
  • stripe 250 is rotated in a direction more parallel with current arrows 280 so that the
  • nitride has been traversed with thousands of leads as described above, and then polished
  • construction may begin with the formation of an MR layer
  • alumina 302 should be deposited and polished to
  • nitride etch stop layer may optionally be deposited, lapped and cleaned atop a nitride etch stop layer and then
  • an MR layer 250 of Permalloy is formed in the presence of a magnetic field by
  • FIG. 18 A photoresist is then distributed atop that film and patterned to protect MR
  • Permalloy layer may be retained as a seed layer for electroplating yoke layers 253 and
  • the Permalloy layer including MR stripe 250 is first covered with a photoresist
  • a protective layer 310 of alumina is deposited
  • a photoresist is then distributed atop layer 310 and
  • Another photoresist layer is then patterned to cover a central portion of the
  • Permalloy that created the MR stripe 250 is not used as a seed layer for the yokes and
  • a NiFe seed layer 313 is then sputtered to a thickness of about 1000 A. whereupon a solvent is applied to remove the resist and to lift off any seed layer 313
  • This photoresist lift-off process avoids the need for etching or
  • insulation layer 310 avoids damage to that layer and the MR elements below.
  • Top yoke sections 253 and 255 are then formed by window frame plating with gap left
  • interconnect leads 303 and 307 is then plated through a photoresist mask, then a layer 322
  • yoke layers 253 and 255 A Ti/Cu or MoNiFe seed layer is then sputtered and masked
  • the finished planar transducer including MR element 250 built in thin-film
  • trailing central pad 30 which is formed of DLC that may be I ⁇ m to 1 ⁇ m thick, and extends behind poletips 44 by 5 ⁇ m

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)

Abstract

Un tiroir (20) d'unité de disque dur, qui comporte un transducteur plan (46) en contact avec un disque rigide (50) tournant durant la mise en mémoire et l'extraction des informations, comprend un substrat et une couche formée sur une face du substrat côté disque, comportant un transducteur (46), des coussinets pneumatiques latéraux (25, 28) et un coussinet central arrière (30). Le transducteur comporte une paire de cornes polaires (44) apparentes dans une partie arrière du coussinet central arrière (30). Durant le fonctionnement, le tiroir (20) s'incline légèrement, de façon à placer les cornes polaires (44) plus près de la surface (48) du disque que de l'extrémité arrière (35) du tiroir (20). Les coussinets (25, 28) en contact avec le disque, à l'exception de la pointe des cornes polaires, sont constitués d'un carbone amorphe de type diamant. Le transducteur (46) contient un circuit magnétique principalement plan mais présentant des zones inclinées, de façon à former une boucle perméable très efficace du point de vue magnétique.
PCT/US1997/011408 1996-06-28 1997-06-26 Unite de disque dur a contact virtuel avec transducteur plan WO1998000841A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US67328196A 1996-06-28 1996-06-28
US08/673,281 1996-06-28

Publications (1)

Publication Number Publication Date
WO1998000841A1 true WO1998000841A1 (fr) 1998-01-08

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1997/011408 WO1998000841A1 (fr) 1996-06-28 1997-06-26 Unite de disque dur a contact virtuel avec transducteur plan

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Country Link
WO (1) WO1998000841A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6452752B1 (en) * 1997-08-15 2002-09-17 Seagate Technology Llc Slider for disc storage system
US6735049B1 (en) 2002-03-28 2004-05-11 Mark A. Lauer Electromagnetic heads, flexures and gimbals formed on and from a wafer substrate
JP2019076327A (ja) * 2017-10-23 2019-05-23 株式会社塚田メディカル・リサーチ 薬液注入容器

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5198934A (en) * 1985-07-19 1993-03-30 Kabushiki Kaisha Toshiba Magnetic disk device including a slider provided with a solid protecting layer which determines the distance between a magnetic gap and a magnetic disk recording device
US5486963A (en) * 1992-08-19 1996-01-23 International Business Machines Corporation Integrated transducer-suspension structure for longitudinal recording
US5513056A (en) * 1993-03-18 1996-04-30 Matsushita Electric Industrial Co., Ltd. Magnetic head slider
US5550692A (en) * 1994-09-29 1996-08-27 Seagate Technology, Inc. Proximity recording air bearing slider design with waist offset
US5587858A (en) * 1993-11-10 1996-12-24 International Business Machines Corporation Negative pressure slider with optimized leading pocket for profile control
US5587857A (en) * 1994-10-18 1996-12-24 International Business Machines Corporation Silicon chip with an integrated magnetoresistive head mounted on a slider

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5198934A (en) * 1985-07-19 1993-03-30 Kabushiki Kaisha Toshiba Magnetic disk device including a slider provided with a solid protecting layer which determines the distance between a magnetic gap and a magnetic disk recording device
US5486963A (en) * 1992-08-19 1996-01-23 International Business Machines Corporation Integrated transducer-suspension structure for longitudinal recording
US5513056A (en) * 1993-03-18 1996-04-30 Matsushita Electric Industrial Co., Ltd. Magnetic head slider
US5587858A (en) * 1993-11-10 1996-12-24 International Business Machines Corporation Negative pressure slider with optimized leading pocket for profile control
US5550692A (en) * 1994-09-29 1996-08-27 Seagate Technology, Inc. Proximity recording air bearing slider design with waist offset
US5587857A (en) * 1994-10-18 1996-12-24 International Business Machines Corporation Silicon chip with an integrated magnetoresistive head mounted on a slider

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6452752B1 (en) * 1997-08-15 2002-09-17 Seagate Technology Llc Slider for disc storage system
US7617588B1 (en) 1999-11-09 2009-11-17 Lauer Mark A Method for making a device
US6735049B1 (en) 2002-03-28 2004-05-11 Mark A. Lauer Electromagnetic heads, flexures and gimbals formed on and from a wafer substrate
JP2019076327A (ja) * 2017-10-23 2019-05-23 株式会社塚田メディカル・リサーチ 薬液注入容器
JP7025748B2 (ja) 2017-10-23 2022-02-25 株式会社塚田メディカル・リサーチ 薬液注入容器

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