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WO1998002848A1 - Procede et dispositif de production d'une carte a puce et carte a puce correspondante. - Google Patents

Procede et dispositif de production d'une carte a puce et carte a puce correspondante. Download PDF

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Publication number
WO1998002848A1
WO1998002848A1 PCT/DE1997/001344 DE9701344W WO9802848A1 WO 1998002848 A1 WO1998002848 A1 WO 1998002848A1 DE 9701344 W DE9701344 W DE 9701344W WO 9802848 A1 WO9802848 A1 WO 9802848A1
Authority
WO
WIPO (PCT)
Prior art keywords
base substrate
substrate material
chip
cover layer
coil
Prior art date
Application number
PCT/DE1997/001344
Other languages
German (de)
English (en)
Inventor
David Finn
Manfred Rietzler
Original Assignee
David Finn
Manfred Rietzler
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19634473A external-priority patent/DE19634473C2/de
Application filed by David Finn, Manfred Rietzler filed Critical David Finn
Priority to AU34336/97A priority Critical patent/AU3433697A/en
Publication of WO1998002848A1 publication Critical patent/WO1998002848A1/fr

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention bet rifft a process for the preparation of Chiptragern, in particular chip cards, according to the preamble of the on ⁇ claim 1., a Vorrichtu ng for performing the method for the manufacture ⁇ position of Chiptragern according to claim 20, and u nt one by the aforementioned method it Use of the aforementioned chip carrier which can be produced according to claim 22
  • chip carrier includes nu nts all Chipanord in which a unit of chip or a chip module is disposed on a substrate without limita ⁇ the Matertalbelvesheit of the substrate or the use effect with respect to the Chiptragern Also includes the notion ff "smart card” is merely an indication au fd ie card form the substrate without Restrict ä n ⁇ effect in terms of Mat ertalbelvesheit As materials for the substrate are beispielswei se in question, plastics, textiles, papers
  • the so-called "contact card” and a card body in cm dat recorded Ch ⁇ odule, d as a are treated with the Rheinobei substantially flat bundigeterrorismkon- t ak tflachenanordnuny au fwei st for receiving the chip module to the Corresponding recesses in the chip body or the card substrate are introduced in the chip module dimensions.
  • the recesses only extend over part of the height of the chip card, so that the recesses have a bottom on which the chip module can be placed in such a way that ultimately one Essentially, the outer contact surface arrangement of the chip module is flush with the card body.
  • milling methods are usually used which, owing to the small thickness of the card substrate, are precise and must therefore be controlled with a correspondingly great effort.
  • the known milling processes can only work at low feed speeds to ensure that the bottom of the milled recess is not broken during the milling process
  • the present invention is therefore based on the object of proposing a method which simplifies the production of a chip card
  • a method is proposed in which, starting from a base substrate material fed endlessly as roll material or as sheet material, a window opening is introduced into the base substrate material and subsequently the base substrate material is covered with a cover layer material and the base substrate material is loaded
  • the method proves to be particularly advantageous if the introduction of the window opening, the covering of the base substrate material with the cover layer material and the placement of the base substrate material overlaps with a clocked feed movement of the base substrate material. Due to the clocked feed movement, it is possible to carry out any number of machining operations. and carry out mounting processes in parallel in successive workstations without synchronization problems
  • the base substrate material is fixed in position by means of a raster positioning between two pushing cycles during a downtime of the base substrate material, in such a way that for position fixation in a work station a stationary latching device interacts with detent marks arranged on the base substrate material
  • the locking device is fixed independently of the actual feed movement, so that deviations in successive feed sections are not integrated and thus a consistently accurate positioning is made possible regardless of the number of work stations
  • a stop mark is generated on the base substrate material in a placement station after the window opening has been introduced and before the base substrate material has been fitted, the generation or control of synchronization of the successive workstations, based on a chip carrier length, only requires the generation of a single stop mark, which corresponds to each of the interacts with the stationary workstations assigned to the individual workstations
  • the base substrate material is equipped with a transponder unit having at least one coil and a chip module in such a way that at least the chip module is received by the window opening.
  • the base substrate material is fitted in accordance with the production of a possible embodiment of a chip card which enables contactless tapping
  • the base substrate material can be equipped with a chip module in such a way that the chip module is accommodated by the window opening.
  • the base substrate material is thereby fitted in accordance with the production of a chip card for the contact-based tap
  • the base substrate material is loaded with a spool in such a way that the spool wire ends of the spool coincide with one another
  • Connecting surfaces of the subsequently or previously applied chip module to establish a connection between the coil and the chip module and to form a transponder unit is another way of forming a so-called “contactless card”.
  • the covering of the base substrate material with the coil can be done by laying a coil wire
  • the coil is formed on the base substrate material or by equipping the base substrate material with a coil unit that has already been completely wound
  • connection between the coil and the chip module is not superimposed with the production of the covering layer between the coil wire ends of the coil and the contact surfaces of the chip module in the mounting station, the connection between the coil and the chip module can be made in a connecting station following this mounting station take place after the covering layer between the coil wire ends of the coil and the connection surfaces of the chip module has been previously produced in the assembly station
  • the mounting station following the window station is designed such that the base substrate material is equipped with a chip module receptacle in such a way that the chip module receptacle device is received by the window opening, the production of a chip card is made possible in which the chip module is protected from damage by the chip module receptacle device stiffening the chip card is arranged slotted in the chip card
  • Coil are seen in such a way that the wire wires of the coil in a Cover position with connecting surfaces of the chip holder subsequently applied or previously applied to establish a connection between the coil and the chip holder
  • connection between the coil and the chip holder is not already made in the assembly station, this can be carried out in a subsequent connection station
  • the chip module receptacle not only offers internal protection of the chip module against bending stress, but also through the possibility of integration that is created flush with the surface of the cover layer
  • the chip holder also provides external protection.
  • the arrangement of the chip holder in the window opening of the cover layer makes it possible to subsequently insert a chip module from the outside into a finished card holder - i.e. only after the lamination processes have ended
  • the cover layer material can be provided for synchronization with the clocked, advanced base substrate material with another congruent catch mark arranged with the catch mark of the base substrate material
  • the fixation can only be carried out as a pre-fi xing, the one Permanent fixation in a downstream laminating device follows
  • the pre-fixing makes it possible, in particular, that the permanent fixing that follows in the laminating device takes place only after the layer composite formed from the 5 base substrate material and at least one cover layer has been cut to pieces of card composite
  • Another object on which the invention is based is to propose a device for carrying out the above method according to one or more of claims 1 to 19, which enables particularly simple manufacture of chip carriers
  • the device has a device frame with a guide rail device running along the advance axis
  • a driver device which can be moved longitudinally and which interacts with a position fixing device which is arranged in a stationary manner on the device frame, such that the driver device is moved forward together with the fixed base substrate material in a forward movement cycle, the position fixing device.
  • the base substrate material at the end of the forward movement cycle is fixed in position and the driver device is returned in a jerky movement cycle in the released state
  • the device frame in a rack table has a cutout for carrying out a cover layer material arranged below the rack table against the base substrate material arranged above the rack table
  • Another task on which the invention is based is to propose a chip carrier that is as simple to manufacture as possible.
  • the chip carrier has a multi-layer structure consisting of a base substrate and at least two cover layers arranged on an upper side and a lower side of the base substrate, the base substrate having at least one base substrate opening which serves to form a receiving space
  • the cover layer opening is made smaller than the base substrate opening, in such a way that the receiving space formed in this way has an external retaining edge, a form-fit, secure reception of a chip module or the like in the receiving space is possible
  • chip modules can also be inserted flush with the surface of the upper cover layer in the receptacle, which are provided with an outer contact surface substrate that is larger than the chip unit of the chip module
  • a plurality of cover layers with different or the same size of cover layer openings are arranged one above the other in a common cover layer with the base substrate opening, chip modules or the like with a complex contour can be used, which have several preliminary and Can have jumps
  • the receiving chamber serves to receive a receiving device for a chip module, for example a stiffening device
  • the receiving space of the chip carrier serves to receive a chip module with a chip unit contacted on a contact surface substrate
  • the two outer cover layers of the arrangement of the base substrate and at least two cover layers arranged on the base substrate are designed as 0 closed cover layers, which together with the base substrate and any further cover layers arranged on the base substrate form a laminate composite Process itself as a quasi-sealed unit that is sealed off from the outside, regardless of the composition of the internal structure.
  • 5 electronic components such as chip units, coils or other electronic components or assemblies suitable for populating a chip card, can be accommodated in the laminate composite closed surface through the outer, closed cover layers, the outer cover layers (1 itself as components, for example as a cover layer with integrated Keyboard or integrated display, for example in the form of a membrane keyboard or membrane display.
  • a particular advantage of the chip carrier constructed in this way is the possibility of using the laminate composite as a card insert in the production of chip cards with any desired top layers.
  • the designed top layers can then be laminated to the outer top layers of the chip carrier in a further coating process
  • the first laminating process that is to say the production of the laminate composite
  • essentially all unevenness that can arise from the integration of chip units, coils or other components in the base substrate is compensated for by the lamination of the outer, closed cover layers of the second lamination process, in which designed, for example printed, laminate layers are to be laminated on, an already essentially flat surface is available, so that distortions in the external appearance of the designed cover layers due to underlying unevenness can be largely excluded
  • the chip chip formed as a laminate with outer, closed cover layers thus virtually forms a "white card insert" which can be used as a chip card or can be further processed for further external design of the chip card
  • FIG. 2 a second process variant for producing a chip card
  • FIG. 3 shows a third process variant for producing a
  • Fig. 4 shows a fourth process variant for producing a
  • FIG. 5 is a plan view of the rack table of a device for producing a chip card
  • FIG. 6 is a side view of the rack table shown in FIG. 5,
  • FIG. 7 is a plan view of the rack table shown in FIG. 5, showing the card substrate sheet required on the rack table,
  • FIG. 8 shows a first exemplary embodiment of a chip card
  • FIG. 10 shows a third exemplary embodiment of a chip card
  • FIG. 1 shows a principle of a first method variant in the production of a chip carrier (not shown in the end) as a chip card from a card assembly 20, in which a transponder from a chip module (not shown here) from a chip module and one contacted with it by means of a transponder device 2 1 Coil implemented i st
  • the cut card assembly 20 produced at the end of the process sequence shown in FIG. 1 has a total of three material layers, namely a middle card substrate layer 22 and two cover layers 23 and 24 arranged on the top and bottom of the card substrate 22
  • the card substrate layer 22 is fed at the beginning of the process as an endless card substrate 26 rolled up by a card substrate roll 25.
  • the cover layers 23, 24 are supplied as an endless cover layer. mate ⁇ al 27 or 28 fed from a topsheet roll 29 or 30
  • the card substrate material 26 and the cover layer materials 27, 28 pass through different work stations.
  • the card substrate material 26 and the cover layer materials 27, 28 are explained in more detail below with reference to FIGS. 5, 6 and 7
  • a window opening is introduced 36 in the card substrate material 26
  • the window station 35 has a window punch 37 which, by means of a window stamp 38, introduces the window opening 36 into the card substrate material 26 held between two clamping jaws 39, 40 of the window punch 37.
  • a position mark which is designed here as a detent mark 41
  • the position mark 1 is shown in FIG. 1 Exemplary embodiment introduced by a ratchet punching device 43 in the layer composite 42 and consists of a simple through hole
  • the layer assembly 42 that has now been formed is transferred to an assembly phase 44.
  • the layer assembly 42 is moved forward by a feed stroke in the direction of production 89, the relative change in position of the layer assembly 42 being defined by a latching finger 45, which is shown in FIG of the merging phase 33 generated by the ratchet punch 43, designed as a through hole ratchet 41 intervenes
  • the distance a between the latching finger 45 and the latching punch device 43 corresponds to twice the distance c between the latching punch device 43 and the window punch 37 Halfway between the latching punch device 43 and the latching finger 45, ie at a distance b the transponder assembly device 21 is located to the latching finger 45.
  • the transponder assembly device 21 is thus positioned exactly above the window opening 36 made in the card substrate material 26 in the assembly phase 33.
  • the window opening 36 also forms as a result of the layer assembly 42 the cover layer material 27 covering the window opening 36 from below now has a recess 47 (FIG. 8) provided with a base 46 formed by the cover layer material 27.
  • the chip module 48 of the transponder 49 is inserted into this recess 47 such that the Coil 50 of transponder 49 rests on card substrate material 26
  • the locking fingers 45 from the Relativpo ⁇ sition of the layered composite 42 compared to the Transponderbestuckungsein- direction 21 securing stop mark 41 again successivebewegi and La ⁇ genverbund 42 in a further feed stroke in the direction of manufacture 89 advances the process, the layered composite is 42 together with the current supplied from above the card substrate material 26 upper Deckla ⁇ genetic material 28 in a further Northschreibungsphase 51
  • the layer composite 42 and the cover layer material 28 are detected and moved forward by the driver device 93.
  • the end point of the advance movement is defined again by the next engagement of the locking finger 45 in a locking mark following in the direction of production 89 during the advance movement in the merging phase the top side of the card substrate material 26 is covered with the cover layer material 28.
  • the card composite 20 can then be fed to a laminating process in order to connect the layers of the card composite 20 over the entire surface to form a chip card to accomplish
  • thermode device 54 designed for pre-fixing the card assembly can also be formed from an ultrasound or adhesive device.
  • the device designed as a window punch 37 with reference to the process variant shown in FIG. 1 for introducing the window openings into the card substrate material - likewise depending on the type of used material - can also be replaced, for example, by a mechanical cutting device or a high-frequency cutting device
  • FIGS. 2 and 3 further variants of the process are shown for producing a chip Karle, having coincident with the Darge in Fig. 1 ⁇ presented process variant at the beginning of a Georgiazenungsphase 33 and the end of a Georgiazenungsphase 51, however with regard empi Bestuckungsphasen 57 b / w 58 from the Darge in Fig. I ⁇ presented methods differ vai la ⁇ te
  • the method variants shown in FIGS. 2 and 3 serve to produce a chip card comparable to the chip card 59 shown in FIG. 8, in which, however, the coil 50 and the chip module 48 are not used as a coherent unit, ie as a transponder 49, but rather as individual elements subsequent connection can be implemented
  • the mounting phase 57 of the method variant shown in FIG. 2 is divided into three feed cycles, with the chip module 48 being inserted into the previously introduced window opening 36 in the card substrate material 26 during the downtime after the first feed cycle 62 in the following feed cycle
  • the standstill phase is by means of a laying device 60 movable relative to the fixedly positioned card substrate material 26, a coil wire, not shown here, is laid in coil form on the card substrate material 26 in such a way that the coil wire ends, not shown here, are brought into a covering position with contact surfaces of the chip module 48 accommodated in the window opening 36
  • a connecting device 61 is positioned above the window opening 36 in such a way that contacting of the ones in an Ub coverage position with the contact surfaces of the chip module 48 located Spuiendahendenden
  • the method variant shown in FIG. 3 differs in terms of its mounting phase 58 from that in the method variant shown in FIG. 2 insofar as the sequence of the mounting equipment 62 and the laying device 60 are interchanged
  • E i ne prepared according to the in Fig. 4 shown with process variant i Ch p badge 72 is shown in Fig. 10
  • the smart card 72 has a Card substrate layer 22, each with a top layer and a bottom surface of the card substrate layer 22 applied to the top layer 24 or 23 in the card substrate layer 22 formed from the card substrate material 26, the chip module receptacle 5 71 is inserted into the window opening 36, which in turn is in contact with one on the underside of the Card substrate material 26 applied by laying coil 73.
  • Coil 73 is covered by the lower cover layer 23 formed from cover layer material 27.To enable such an arrangement of coil 73 between card substrate material 26 and cover layer material I () 27, it can differ from that in FIG Fig.4 shown
  • the chip module receptacle 71 is provided with a offset flange 74 If the window opening 64 is appropriately dimensioned, an arrangement of a retaining rim 34 on the cover layer material 28 is achieved, which means that the chip module receptacle 71 is positively secured in one of the window openings 64 and 36 of the cover layer material 28 or the card substrate material 26 and the 5 lower cover layer material 27 recess formed is ensured 76 the chip module receiving 71 may be such that it is directly contacted with the coil 73 and an electrical connection of the Chipmo ⁇ duls 70 with the coil 73 via the chip module receiving 71 carried Alternatively, i However, it is also possible for the chip module 70, as shown in FIG. 10 0, to be in direct contact with the coil 73 with its connection surfaces 77, 78
  • the arrangement of the chip module 70 in the chip module receptacle 71 enables simple implementation. lo ren of Ch i pmoduls 70 in the smart card 72 from above this case, the Implement i augmentation after completion of the IC card 72, ie after the e i ngangs erw ä agreements referred to lamination of the layered composite 53, or already be done even before advantageous as particularly the in Fig.
  • W i e shows Fig.9 is a bundige arrangement of a chip module executed here with a different outer contour 79 without the use e i ner Ch i pmodulfact 71 possible this purpose
  • the smart card 80 includes a layered composite 53 from the card substrate material 26, the lower Decklagenmate ⁇ al 27 and the upper cover layer material 28 , in which the upper cover layer material 28 is provided with a relatively large window opening 64 and the card substrate material 26 with a relatively small window opening 36, both of which are arranged concentrically.
  • FIG. 5 shows the rack table 85 in the region of the assembly of the card substrate material 26 shown in FIG. 5 as an endless film with a cover layer material 27 also indicated in FIG. 5 with a dashed line, which is shown from below through a feed opening 87 in the rack table 85 in the direction of the card substrate material 26.
  • a punch cutout 88 shown in FIG. 5 to the left of the feed cutout 87 enables the arrangement of a stationary window punch 37 above the punch cutout 88 in accordance with the representation of the method variants in FIGS can be used to remove the punching waste
  • Rail guide device 92 running in the production direction and having two guide rails 90, 91 has a driver device 93.
  • the driver device 93 has a plurality of driver tongs 95 which are connected to one another with a rigid coupling member 94 and are guided such that they can be moved along the guide rail 90 or 91 96 connected, which when driving the one coupling member 94 via a spindle drive 97 ensures that the second coupling member 94 moves accordingly.
  • the spindle drive 97 has two end stops 98, 99 which define the feed path
  • the driving tongs 95 of the driving device 93 take the contact substrate material 26 or the layer composite 42 in a left end stop position of the spindle drive 97 and move this up to Reaching the right end stop 99 before reaching the right end stop 99, the card substrate material 26 or the layer composite 42 is in the position defined by moving the locking finger 45 into the locking mark 41 (FIG. 1), then fixed, the driver tongs 95 loosen and move back until the left end stop 98 is reached against the manufacturing direction 98.
  • the driver tongs 95 again grip the card substrate material 26 or the layer composite 42 and move the card substrate material 26 or the layer composite 42 after loosening the engagement between the locking finger 45 and the locking mark 41 by the same distance until the right end stop 99 is repeatedly reached
  • FIG. 7 shows a top view of the frame 85 in the area of the tianponder equipment 21 already mentioned in connection with the method variant explained in FIG. 1.
  • the transponder equipment 21 is on a portal 100 spanning the rail guide device 92 A guide rail 101 is arranged, which enables the transponder assembly 21 to be moved along the guide rail 101 and transversely to the production assembly 89.
  • the transponder assembly 21 is pivotable about a pivot axis 102 arranged parallel to the production direction 89 formed with a winding head 103 arranged transversely to the pivot axis 102
  • the winding head 103 is used on the one hand to produce a wire coil in a winding process, and on the other hand to connect the coil wire ends of the wire coil (not shown here in more detail) to a chip module accommodated in the winding head Fig. 7 alignment shown with a parallel to the guide rail 101 of the portal 100 winding axis 104 on After completion of the transponder unit in the winding head 103, this is moved along the portal 100 and pivoted about its pivot axis 102 so that the winding axis 104 is now perpendicular to the plane or top surface of in direction 89 Aligned on the card substrate material 26 required by the frame 85 Starting from this position, the winding head 103 is lowered in the direction of the surface of the card substrate material 26 by means of a lifting device, not shown here, which is integrally formed on the transponder embossing device 21 by the action of pressure and / or Temperature, the coil 50 of the transponder unit 49 is then embedded in the surface of the card substrate material 26 such that the
  • the card substrate material 26 is designed in the form of ready-made card substrate sheets 105 with a benefit division implemented here as a benefit of 21.
  • Each card substrate sheet 105 enables the production of a total of 21 chip cards 59 (FIG. 8) snapshot of a chip card production shown, the winding head 103 is in a
  • a corresponding device can be designed to be particularly compact as a table device.
  • the device is particularly suitable for producing chip carriers designed as ID cards, e.g. personal ID cards, in which the base substrate and the cover layers Can consist of paper
  • the base substrate and the cover layers can consist of paper
  • a filler can consist of a foaming plastic with an adhesive effect

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

L'invention concerne un procédé et un dispositif pour produire unporteur de puce (80) multicouche comprenant un substrat (22) de base recouvert d'au moins deux couches (23, 24), respectivement appliquées sur sa face supérieure et sa face inférieure. Le substrat de base possède au moins un orifice (36) destiné à former un logement (84). L'invention concerne également un porteur de puce (80) conçu selon l'invention.
PCT/DE1997/001344 1996-07-11 1997-06-27 Procede et dispositif de production d'une carte a puce et carte a puce correspondante. WO1998002848A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU34336/97A AU3433697A (en) 1996-07-11 1997-06-27 Method and device for manufacturing a chip card as well as chip card

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE19627997 1996-07-11
DE19627997.6 1996-07-11
DE19634473.5 1996-08-27
DE19634473A DE19634473C2 (de) 1996-07-11 1996-08-27 Verfahren zur Herstellung einer Chipkarte

Publications (1)

Publication Number Publication Date
WO1998002848A1 true WO1998002848A1 (fr) 1998-01-22

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1997/001344 WO1998002848A1 (fr) 1996-07-11 1997-06-27 Procede et dispositif de production d'une carte a puce et carte a puce correspondante.

Country Status (2)

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AU (1) AU3433697A (fr)
WO (1) WO1998002848A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0858050A3 (fr) * 1997-02-07 2001-03-28 Keylink Gestao e Investimentos Lda Procédé pour la fabrication en continu de cartes porteuses de microchip et cartes obtenues par ce procédé
DE102004006457A1 (de) * 2004-02-04 2005-08-25 Bielomatik Leuze Gmbh + Co Kg Verfahren und Vorrichtung zum kontinuierlichen Herstellen elektronischer Folienbauteile
US7847698B2 (en) 2001-04-26 2010-12-07 Arjowiggins Security SAS Cover incorporating a radio frequency identification device
US7872579B2 (en) 2004-04-14 2011-01-18 Arjowiggins Security Structure including an electronic device, in particular for fabricating a security document or a document of value
CN105980076A (zh) * 2014-01-13 2016-09-28 梅尔泽机械制造有限公司 用于加工基材的方法和设备

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Publication number Priority date Publication date Assignee Title
EP0212506A2 (fr) * 1985-08-09 1987-03-04 Oldenbourg, R. Procédé de fabrication d'une carte d'identité et carte d'dentité
EP0249266A1 (fr) * 1986-05-30 1987-12-16 Papier-Plastic-Coating Groningen B.V. Carte de données, procédé et dispositif pour sa fabrication
EP0706152A2 (fr) * 1994-11-03 1996-04-10 Fela Holding AG Carte à puce et méthode pour sa fabrication

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0212506A2 (fr) * 1985-08-09 1987-03-04 Oldenbourg, R. Procédé de fabrication d'une carte d'identité et carte d'dentité
EP0249266A1 (fr) * 1986-05-30 1987-12-16 Papier-Plastic-Coating Groningen B.V. Carte de données, procédé et dispositif pour sa fabrication
EP0706152A2 (fr) * 1994-11-03 1996-04-10 Fela Holding AG Carte à puce et méthode pour sa fabrication

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0858050A3 (fr) * 1997-02-07 2001-03-28 Keylink Gestao e Investimentos Lda Procédé pour la fabrication en continu de cartes porteuses de microchip et cartes obtenues par ce procédé
US7847698B2 (en) 2001-04-26 2010-12-07 Arjowiggins Security SAS Cover incorporating a radio frequency identification device
US7940185B2 (en) 2001-04-26 2011-05-10 Arjowiggins Security SAS Cover incorporating a radiofrequency identification device
DE102004006457A1 (de) * 2004-02-04 2005-08-25 Bielomatik Leuze Gmbh + Co Kg Verfahren und Vorrichtung zum kontinuierlichen Herstellen elektronischer Folienbauteile
US7872579B2 (en) 2004-04-14 2011-01-18 Arjowiggins Security Structure including an electronic device, in particular for fabricating a security document or a document of value
US8144016B2 (en) 2004-04-14 2012-03-27 Arjowiggins Security Structure including an electronic device, in particular for fabricating a security document or a document of value
CN105980076A (zh) * 2014-01-13 2016-09-28 梅尔泽机械制造有限公司 用于加工基材的方法和设备

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