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WO1998007565A1 - Assemblage a l'aide une feuille de materiau conducteur adhesive - Google Patents

Assemblage a l'aide une feuille de materiau conducteur adhesive Download PDF

Info

Publication number
WO1998007565A1
WO1998007565A1 PCT/US1997/014769 US9714769W WO9807565A1 WO 1998007565 A1 WO1998007565 A1 WO 1998007565A1 US 9714769 W US9714769 W US 9714769W WO 9807565 A1 WO9807565 A1 WO 9807565A1
Authority
WO
WIPO (PCT)
Prior art keywords
backing plate
conductive sheet
target
sputter target
sheet material
Prior art date
Application number
PCT/US1997/014769
Other languages
English (en)
Inventor
Mark J. Gore
Original Assignee
Tosoh Smd, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tosoh Smd, Inc. filed Critical Tosoh Smd, Inc.
Publication of WO1998007565A1 publication Critical patent/WO1998007565A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3435—Target holders (includes backing plates and endblocks)
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target

Definitions

  • the present invention relates to methods of bonding sputter targets to associated backing plate members and to the so-bonded target/backing plate assemblies. More particularly, the invention pertains to methods and assemblies wherein the sputter target is bonded to its associated backing plate member using a conductive adhesive sheet material.
  • Cathodic sputtering is widely used for the deposition of thin layers of material onto desired substrates. Basically, this process requires a gas ion bombardment of a target having a face formed of a desired material that is to be deposited as a thin film or layer on a substrate. Ion bombardment of the target not only causes atoms or molecules of the target material to be sputtered but also imparts considerable thermal energy to the target. Typically, this heat is dissipated by use of a cooling fluid circulated beneath or around a backing plate that is positioned in heat exchange relation with the target.
  • the target forms a part of a cathode assembly which together with an anode is placed in an evacuated chamber that contains an inert gas, preferably argon.
  • An inert gas preferably argon.
  • a high voltage electrical field is applied across the cathode and anode.
  • the inert gas is ionized by collision with the electrons ejected from the cathode.
  • Positively charged gas ions are attracted to the cathode and, upon impingement with the target surface, dislodge the target material.
  • the dislodged target materials traverse the evacuated enclosure and deposit as a thin film on the desired substrate that is normally located proximate to the anode.
  • the present invention provides a method for bonding sputtering targets to backing plate members using conductive double-sided adhesive sheet materials such as tape.
  • a commercially available conductive adhesive sheet material such as a tape having a pressure-sensitive-adhesive (PSA) on both upper and lower surfaces is utilized.
  • PSA pressure-sensitive-adhesive
  • the conductive sheet is cut or otherwise formed into the desired geometric shape to cover the target ⁇ acking interfacial area and is then applied to either the sputter target or backing plate.
  • the target is then positioned over, and pressed onto, the backing plate surface, thereby forming a bond between the target and backing plate.
  • Pressure may be applied to the bonded interface for an extended time to improve bond integrity.
  • the method of the invention creates a permanent bond between the sputter target and the backing plate which is both electrically and thermally conductive. No heating is required to bond the pressure-sensitive adhesive to the sputter target and to the backing plate.
  • the conductive double-sided adhesive sheet is less expensive than solder alloys and requires no skilled labor to apply.
  • the method is particularly useful for bonding ceramic sputter targets to metallic backing plates.
  • Sputter targets formed from ceramic materials such as indium-tin-oxide and nickel oxide which are difficult to "wet” with solder alloys bond readily with the conductive double-sided adhesive sheets after minimal surface preparation.
  • the invention provides a method for separating and replacing used sputter targets secured to backing plates with conductive sheet materials.
  • a solvent such as ethanol is introduced between the used sputter target and the backing plate to at least partially dissolve the adhesive on the conductive adhesive sheet.
  • the used sputter target is then separated from the backing plate.
  • a new sputter target is secured to the backing plate with a new conductive adhesive sheet.
  • FIG. 1 is a transverse cross-sectional view of a bonded target-backing plate assembly in accordance with the invention.
  • Fig. 2 is a transverse cross-sectional view of a replacement target- conductive adhesive sheet combination in accordance with the invention.
  • a conductive adhesive sheet bonded target-backing plate assembly in accordance with the present invention.
  • Target 10 is superposed atop heat conductive backing plate 12.
  • the target comprises a face 11 from which material will be ejected during the sputtering process and a bottom or bonding side 15 adjacent the backing plate 12.
  • a peripheral flange 14 integral with backing plate 12 serves to mount the assembly as a cathode in an evacuated sputter coating chamber in accordance with well-known techniques.
  • a conductive sheet material 16 is provided for bonding the bottom surface 15 of the target 10 to the top surface 26 of the backing plate 12.
  • the sheet material 16 includes a substrate layer 18, which preferably comprises a matrix impregnated with electroconductive species throughout.
  • electroconductive species include carbonaceous particles, metal powder or flakes, or conductive ceramic particles.
  • carbonaceous materials which have found use in conductive substrates are carbon black and graphite particles. At present it is preferred to use carbon black particles as the electroconductive species in the substrate layer 18.
  • Electroconductive materials for use in the substrate layer 18 include particles or flakes of metals such as nickel, copper, gold and silver flakes, as well as particles of ceramics such titanium nitride and titanium carbide.
  • the matrix itself may be composed of electroconductive materials such as a graphite mesh or the like.
  • the matrix may be composed of a porous fabric-like matrix composed, for example, of glass or polymeric materials may be used.
  • Techniques for impregnating the electroconductive species in the matrix include dispersing the electroconductive species in a resin dispersant medium such as, for example, water soluble resins, or water dispersable anionic or cationic resins in latex form.
  • resin dispersant media include well known resins such as urethane resins, acrylic resins, polyester resins, polybutadiene resins and other synthetic resins.
  • the substrate 18 is interposed between upper and lower adhesive layers 20, 22.
  • the adhesive layers 20, 22 may be formed from any suitable pressure- sensitive-adhesive (PSA), as is well known in the art.
  • PSA pressure- sensitive-adhesive
  • the PSA is itself an electroconductive PSA.
  • a discussion of exemplary electrically conductive PSA's and formulations thereof may be found in U.S. Pat. No. 5,082,595, herein incorporated by reference. Additionally conductive adhesives are discussed in detail in the "Handbook of Adhesives", Third Edition, Skeist, 1990, pages 705-712.
  • the conductive sheet 16 of the preferred embodiment of the present invention is double-sided, electrically conductive, adhesive carbon tape, Part #AR- 8001 available from Adhesives Research, Inc. (Glen Rock, PA), or alternatively, double-sided, electrically conductive, adhesive carbon sheets, Part #STR-9180 available from Shinto Chemitron Co., Ltd. (Tokyo, JP).
  • the conductive sheet 16 has a thickness no greater than approximately 0.25mm, and, even more preferably, on the order of approximately 0.13mm.
  • the surfaces to be joined are cleaned using a solvent wipe or similar means wherein surface contamination in the form of particulates or oil films is removed.
  • the conductive sheet 16 is die cut or otherwise formed into a desired size and shape to closely match the size and shape of the target/backing plate interface.
  • the conductive sheet 16 is then applied to either the target 10 or the backing plate 12.
  • the conductive sheet 16 is applied the bottom surface
  • the conductive sheet 16 may be applied first to the top surface 26 of the backing plate member 12.
  • the conductive sheet 16 is die cut to a size and shape slightly smaller than the bottom surface 15 of the target 10 and the top surface 26 of the backing plate 12. Then, even if the conductive sheet 16 is misaligned slightly on the bottom surface 15 of the target 10 or the top surface 26 of the backing plate 12, no portion of the conductive sheet 16 will protrude beyond the sides of the target 10 and the backing plate 12. This minimizes the need to trim away a portion of the conductive sheet 16 after the bond is formed and helps to hide the conductive sheet 16 from the final user.
  • the target 10 is then positioned over, and pressed onto, the backing plate 12 so that the lower surface 22 of the conductive sheet 16 contacts the top surface 26 of the backing plate 12 and the upper surface 20 of the conductive sheet
  • sputter targets 10 contacts the bottom surface 15 of the target 10.
  • Appropriate fixtures may be used to align the sputter target 10 with the backing plate 12. Although at this point the bonding operation is considered complete, pressure may be applied to the bonded system for an extended period of time after the initial joining to improve bond integrity. No heating is required; the target 10 and backing plate 12 preferably remain at ambient temperature through the process.
  • the bonding process described above is advantageously applied to the bonding of ceramic sputter targets 10 to metallic backing plates 12.
  • the bottom surfaces 15 of sputter targets 10 comprising ceramic materials such as carbon, indium-tin-oxide, nickel oxide, germanium oxide, indium oxide and silicon oxide often require costly preparation before bonding with solder alloys.
  • the facing surfaces 26 of backing plates 12 comprising metals such as copper, copper alloys, aluminum and aluminum alloys often require preparation as well prior to bonding with solder alloys compatible with the sputter targets 10.
  • Target assemblies comprising indium-tin-oxide sputter targets bonded to copper backing plates with die-cut, double-sided, electrically conductive adhesive carbon sheets, Part #STR-9180 available from Shinto Chemitron (Tokyo, Japan), have been used satisfactorily in low power CONMAG sputtering systems.
  • nickel oxide sputtering targets have been successfully bonded to copper backing plates using die- cut, double-sided electrically conductive adhesive carbon sheets. While carbon sputter targets have not yet been satisfactorily bonded to aluminum backing plates using conductive sheets, it is believed that successful bonds will be obtained by this method in the future.
  • the bond resulting from the present invention is flexible while providing excellent bonding strength.
  • the interface between the target 10 and backing plate 12 is viscous, allowing for a compliant layer at the interface which helps alleviate stresses resulting from thermal expansion due to heating during the sputtering process.
  • This resulting flexibility is advantageous when bonding materials having dissimilar thermal expansivities, such as metals and non-metals, thereby allowing for the selection of a target 10 and backing plate 12 from a wide range of available materials.
  • the process minimizes the need for extensive surface preparation other than cleaning or wiping of the facing surfaces 15, 26 of the sputter target 10 and the backing plate 12.
  • the conductive sheet 16 may be applied directly to a saw-cut backing plate surface, thereby eliminating the need for costly machine finishing. In fact, the roughness of a saw-cut surface enhances bond integrity. Nonetheless, conventional surface preparations, such as the deposition of a nickel anchoring layer on a copper backing plate, may improve the adhesion of the conductive sheet 16 to certain metal or ceramic materials. Yet another advantage of the process described above is the ease of separating and replacing a used sputter target 10 secured to a backing plate 12 by conductive sheet material 16.
  • a solvent such as ethanol is introduced between the sputter target 10 and the backing plate 12 to at least partially dissolve the adhesive 20, 22 on the conductive sheet material 16.
  • the sides of the sputter target 10 and the backing plate 12 are wiped with a sheet material (not shown) impregnated with the solvent so as to force the solvent between the sputter target 10 and the backing plate 12.
  • the target 10 and the backing plate 12 are pulled apart. Once the two are separated, the surface 26 of the backing plate 12 is wiped with the sheet material (not shown) impregnated with the solvent, as necessary, to remove the used conductive sheet material 16 and any residual adhesive from the surface 26.
  • a replacement sputter target is bonded to the surface 26 of the backing plate 12 with a replacement conductive sheet.
  • the replacement sputter target and the replacement conductive sheet are provided either separately or as a unit.
  • a preferred sputter target/conductive sheet combination or intermediate for use in the replacement of used sputter targets 10 includes a replacement sputter target 10' and a replacement conductive sheet 16'.
  • the replacement conductive sheet 16' which is preferably of the same structure as the conductive sheet 16 (Fig. 1), includes a conductive substrate 18' positioned between two adhesive layers 20' and 22'.
  • the adhesive layer 20' bonds the replacement conductive sheet 16' to the bottom surface 15' of the replacement sputter target 10'.
  • a release liner 28' covers the adhesive layer 22'.
  • the release liner 28' is stripped off the adhesive layer 22'.
  • the replacement sputter target 10' is then positioned over, and pressed onto, the backing plate 12 so that the adhesive layer 22' contacts the top surface 26 of the backing plate 12. Further pressure is applied to the replacement sputter target 10' and the backing plate 12 as needed to improve bond integrity.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

Méthode pour relier les cibles (10) de pulvérisation cathodiques à des éléments plaques de fond (12) en utilisant une feuille de matériau (16) adhésif sur les deux faces. La feuille de matériau conducteur (16) est appliquée soir sur la cible (10) soit sur la plaque de fond (12). La cible (10) est ensuite placée et pressée sur la surface (26) de la plaque de fond, la feuille reliant la cible (10) et la plaque de fond (12). On peut appliquer de la pression sur les surfaces de contact assemblées pendant une période prolongée de manière à améliorer la qualité du collage. L'invention porte également sur les ensembles cible/plaque de fond (10, 12) assemblées par ce procédé ainsi que sur un procédé pour décoller et replacer la cible (10).
PCT/US1997/014769 1996-08-23 1997-08-22 Assemblage a l'aide une feuille de materiau conducteur adhesive WO1998007565A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US2430996P 1996-08-23 1996-08-23
US60/024,309 1996-08-23

Publications (1)

Publication Number Publication Date
WO1998007565A1 true WO1998007565A1 (fr) 1998-02-26

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ID=21819926

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1997/014769 WO1998007565A1 (fr) 1996-08-23 1997-08-22 Assemblage a l'aide une feuille de materiau conducteur adhesive

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WO (1) WO1998007565A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1650321A2 (fr) 2004-09-30 2006-04-26 Applied Films Corporation Système de pulvérisation.
JP2014029023A (ja) * 2013-07-09 2014-02-13 Tosoh Corp 導電性フィルムを用いたスパッタリングターゲット及びその製造方法
WO2015000577A1 (fr) * 2013-07-03 2015-01-08 Oerlikon Trading Ag, Trübbach Cible adaptée sur un dispositif de refroidissement indirect pourvue d'une plaque de refroidissement
CN117328025A (zh) * 2023-09-28 2024-01-02 河南东微电子材料有限公司 一种小尺寸靶材与背板的绑定方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5082595A (en) * 1990-01-31 1992-01-21 Adhesives Research, Inc. Method of making an electrically conductive pressure sensitive adhesive
US5116676A (en) * 1987-04-15 1992-05-26 Minnesota Mining And Manufacturing Company Removable pressure-sensitive adhesive tape
US5181671A (en) * 1990-07-25 1993-01-26 Fuji Photo Film Co., Ltd. Photographic film cassette
US5213868A (en) * 1991-08-13 1993-05-25 Chomerics, Inc. Thermally conductive interface materials and methods of using the same
US5522535A (en) * 1994-11-15 1996-06-04 Tosoh Smd, Inc. Methods and structural combinations providing for backing plate reuse in sputter target/backing plate assemblies

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5116676A (en) * 1987-04-15 1992-05-26 Minnesota Mining And Manufacturing Company Removable pressure-sensitive adhesive tape
US5082595A (en) * 1990-01-31 1992-01-21 Adhesives Research, Inc. Method of making an electrically conductive pressure sensitive adhesive
US5181671A (en) * 1990-07-25 1993-01-26 Fuji Photo Film Co., Ltd. Photographic film cassette
US5213868A (en) * 1991-08-13 1993-05-25 Chomerics, Inc. Thermally conductive interface materials and methods of using the same
US5522535A (en) * 1994-11-15 1996-06-04 Tosoh Smd, Inc. Methods and structural combinations providing for backing plate reuse in sputter target/backing plate assemblies

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1650321A2 (fr) 2004-09-30 2006-04-26 Applied Films Corporation Système de pulvérisation.
EP1650321A3 (fr) * 2004-09-30 2006-07-05 Applied Films Corporation Système de pulvérisation.
WO2015000577A1 (fr) * 2013-07-03 2015-01-08 Oerlikon Trading Ag, Trübbach Cible adaptée sur un dispositif de refroidissement indirect pourvue d'une plaque de refroidissement
CN105283577A (zh) * 2013-07-03 2016-01-27 欧瑞康表面处理解决方案股份公司特鲁巴赫 适应于间接冷却装置的具有冷却板的靶
KR20160029081A (ko) * 2013-07-03 2016-03-14 오엘리콘 썰피스 솔루션즈 아게, 츠르바크 간접 냉각 디바이스에 적응된 냉각 플레이트를 구비하는 타깃
US20160172166A1 (en) * 2013-07-03 2016-06-16 Oerlikon Surface Solutions Ag, Trübbach Target, adapted to an indirect cooling device, having a cooling plate
JP2016523315A (ja) * 2013-07-03 2016-08-08 エリコン サーフェス ソリューションズ アーゲー、 トリュープバッハ 冷却プレートを有する、間接冷却装置に適合するターゲット
US10636635B2 (en) 2013-07-03 2020-04-28 Oerlikon Surface Solutions Ag, Pfäffikon Target, adapted to an indirect cooling device, having a cooling plate
KR102274485B1 (ko) * 2013-07-03 2021-07-09 외를리콘 서피스 솔루션즈 아게, 페피콘 간접 냉각 디바이스에 적합한 냉각 플레이트를 구비하는 타깃
JP2014029023A (ja) * 2013-07-09 2014-02-13 Tosoh Corp 導電性フィルムを用いたスパッタリングターゲット及びその製造方法
CN117328025A (zh) * 2023-09-28 2024-01-02 河南东微电子材料有限公司 一种小尺寸靶材与背板的绑定方法

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