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WO1998015971A1 - Dispositif de prehension pour tranches - Google Patents

Dispositif de prehension pour tranches Download PDF

Info

Publication number
WO1998015971A1
WO1998015971A1 PCT/CH1997/000383 CH9700383W WO9815971A1 WO 1998015971 A1 WO1998015971 A1 WO 1998015971A1 CH 9700383 W CH9700383 W CH 9700383W WO 9815971 A1 WO9815971 A1 WO 9815971A1
Authority
WO
WIPO (PCT)
Prior art keywords
wafers
gripping
wafer
gripping device
container
Prior art date
Application number
PCT/CH1997/000383
Other languages
German (de)
English (en)
Inventor
Christian Balg
Bernhard Strasser
Jakob Blattner
Original Assignee
Stäubli Ag Pfäffikon
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CH02458/96A external-priority patent/CH697146A5/de
Application filed by Stäubli Ag Pfäffikon filed Critical Stäubli Ag Pfäffikon
Priority to AU44491/97A priority Critical patent/AU4449197A/en
Priority to DE19781101T priority patent/DE19781101D2/de
Publication of WO1998015971A1 publication Critical patent/WO1998015971A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Definitions

  • the present invention relates to a gripping device for wafers according to the preamble of claim 1, and a
  • a method for gripping and transporting wafers according to claim 14.
  • Clean room technology i.e. the processing zones must have a certain, defined purity with regard to these dirt particles.
  • intermediate storage i.e. the storage containers.
  • the wafers are held in rake-like holding devices, which can simply be removed from the cassettes. are retractable.
  • the holding devices are designed in such a way that the edge zones of the wafers are partially exposed so that the removal devices can attack this edge zone.
  • the wafers may only be touched by this device at their edge sections running perpendicular to the surface and in a narrowly limited area on the periphery of the rear side.
  • the object of the present invention was to create a gripping device which is horizontal can remove stored wafers from their container and feed them to a processing carrier in a pivoted position.
  • this object is achieved by the features of claim 1. Due to the construction of the gripping device according to the invention, horizontally stored wafers can be removed from their storage container, pivoted and fed to a processing carrier and positioned thereon. The requirements regarding the area of the wafer that is not to be touched by any objects are fully met, since the gripping means come into contact with the wafer practically only at the edge and not on the wafer surface. Nevertheless, the wafers are kept stable and can therefore advantageously also be pivoted into practically any position. This can advantageously be done completely automatically. The device can therefore be installed and operated in a closed area of a processing machine.
  • the gripping heads can be advantageously pivoted into their insertion position for insertion between the stacked wafers. In this position, they can be easily moved into the space between the wafer plates without touching the surfaces of the wafer plates.
  • Two gripping heads are preferably provided for each slice, which come together at a distance from each other to the edge region of a wafer. It is clear that for gripping a stack of, for example, 13 wafers, all gripping heads are advantageously moved together at the same time.
  • Such gripping devices according to the invention are preferably used in wafer processing plants.
  • the gripping device is raised slightly before the wafer stack is removed from its container, so that the wafers are released from their holders in the container. Damage to the wafer surfaces by the holders, which is avoided could arise if the wafers were simply pulled out and dragged over the holders.
  • Figure 1 schematically shows the view of a gripping device according to the invention before removing wafers from their container.
  • FIG. 2 shows the view according to FIG. 1 when the wafers are fed onto the processing carrier
  • FIG. 3 shows the longitudinal section through a region of a gripping device according to the invention
  • Fig. 4 is the supervision of the inventive
  • Fig. 5 shows the supervision of another according to the invention
  • FIG. 6 shows the longitudinal section through a region of a gripping device according to the invention for handling individual wafers
  • FIG. 7 shows the top view of the gripping device according to the invention according to FIG. 7.
  • a gripping device 1 according to the invention is shown on a movable and pivotable carrier 2.
  • the unprocessed wafers 3 are arranged horizontally, parallel to one another, in their container 4.
  • the Wafers 3 are stored in this container 4 in such a way that only the wafer wafer edges and possibly a narrow edge area of the underside of the wafer wafer are in contact with the holding elements in the container 4.
  • the wafer disks 3 are filled into these containers 4 and stored therein until they are fed to a further process step.
  • the gripping device 1 shown here now serves to bring the wafers 3 out of their container 4 and one
  • this processing carrier 5 is, for example, a construction of two rollers 5 ′ arranged parallel to one another, on which the round wafer plates 3, as will be explained below, can be placed vertically aligned.
  • the container 4 can now be moved to an emptying position, for example by means of a controlled means of transport.
  • the opening of the transport means is preferably in the
  • FIG. 2 shows schematically the positioning of the wafers 3 pivoted into the vertical position on the processing carrier 5.
  • the rollers 5 'of the processing carrier 5 are preferably designed such that the wafers 3 can be pushed between the rollers 5' from below, and then by rotating the rollers 5 'about their own axis, the wafers 3 with their disc edges onto the rollers 5'. can be brought to rest.
  • the rollers 5 ' have a circular cross section, which is flattened in a segment region, for example over 90 °.
  • the gripping device 1 By lowering the carrier 2, the gripping device 1 can now be moved out between the wafers 3 and the wafers 3 can be fed through the processing carrier 5 to a process stage.
  • the processed wafers 3 can be fed back into a container 4 by the gripping device 1 and then transported further.
  • this entire process can be automated and does not require any manual intervention, it can run completely in the clean room of the processing machine. This advantageously reduces the risk of contamination and thus also the rejection rate of the wafers 3 during the processing process in comparison to the manual feeding and removal of the wafers 3, and a higher processing rate can also be achieved.
  • gripping device 1 The structure of the gripping device 1 according to the invention can now be seen exactly from the example in FIG. 3, partly in longitudinal section.
  • gripping heads 6 are provided, which are arranged at one end of rods 7 which can be displaced longitudinally and rotated about their axis.
  • the gripping heads 6 have a slot 8, the slot width of which is slightly greater than the thickness of the wafer plates 3, and the lower cheek 8 ', which comes to lie against the underside of the wafer plate 3, is aligned at a flat angle with respect to the wafer plate surface.
  • a gripping head 6 can be pulled against the side edge of the corresponding wafer 3 by pulling back its rod 7 in the direction of the arrow. This movement can be generated by a corresponding movement of the entire gripping device 1.
  • the side edge of the wafer 3 comes into contact with the bottom of the slot 8. Due to the design of the slot 8 with the lower cheek arranged at an angle, the surface of the wafer 3 does not come into contact with the gripping means.
  • the upper gripping head 6 is designed for gripping a single wafer 3 and has a single slot 8.
  • This gripping head is advantageously used as a start or end gripper in the gripping device 1.
  • the gripping head 6 'shown below is designed for the simultaneous gripping of two wafers 3 and, in addition to the lower slot 8, has a second cutout 9.
  • This cutout 9 also has a cheek surface 9 ′ aligned at a flat angle with respect to the wafer surface and a vertical stop surface 9 ′′.
  • a holding rake 10 is provided as a counterpart to the gripping heads 6, 6 '. This now also has slots 11 for receiving the wafer 3.
  • These slits are essentially wedge-shaped, the lower slit surface preferably each having a short region 11 ′ aligned parallel to the surface of the pane.
  • the depth of this area is not greater than the width of the area on the underside of the wafer 3 which is permitted for such means.
  • the slots 11 could in principle also be designed in accordance with the slots of the gripping heads 6, 6 '. Due to the relative displacement of the rods 7 with respect to the holding rake 10, the wafer disks 3 are clamped reliably without a large force being applied. The clamping nevertheless ensures a secure hold of the wafers 3, which also allow these wafers 3 to be pivoted from the horizontal to the vertical position.
  • the pivoting is preferably carried out in such a way that the wafers for this purpose each lie with their lower side against the holding rake 10.
  • the gripping heads 6, 6 ' can be removed from the stop on the wafer edges by moving and rotating the rods 7, the wafers 3 maintaining their position through the design of the holding rake 10.
  • FIG 4 the supervision of a gripping device 1 according to Figure 3 is shown schematically.
  • a gripping head 6 is shown in the holding position, as described above.
  • the wafer 3 is clamped between the gripping head 6 and the holding rake 10.
  • the gripping head 6 can also preferably be positioned in a predetermined position resulting from the exact diameter of the wafer 3. This prevents the wafer 3 due to the
  • the rods 7 can be made by means of hydraulic, pneumatic or electrical drive means.
  • a gripping head 6 ' is also shown in a pivoted position.
  • the rod 7 is displaced away from the holding rake 10 in the direction of the arrow and then rotated by 90 °. It is now possible to move the holding head 6 'between two adjacent disks 3. This will be when the
  • Gripping device 1 is required in the container 4 for the removal of the wafers 3 and later also when the gripping device 1 is withdrawn from the processing carrier 5 or. when moving out of the container 4 at the end of the machining process.
  • FIG. 4 also schematically shows two different possibilities for arranging the holding rake 10.
  • the upper area of FIG. 4 for example, there is a one on the side of rod 7
  • Holding rake 10 shown. However, this can also be arranged between the rods 7, as shown as 10 '.
  • the holding rake 10 can be in one or more parts, and the rods 7 can next to the Holding rake 10 or be arranged in recesses through the holding rake 10.
  • FIGS. 5 to 7 show two further exemplary embodiments of gripping devices according to the invention, some of which correspond to the gripping device shown in FIGS. 1 to 4. In order to avoid repetitions, only the differences between the exemplary embodiments are discussed in the following.
  • the gripping device shown in FIG. 5 is a multiple gripper in which the structural design of its two-part holding rake 10 and 10 ', the rods 7 and the gripping heads 6, 6' is essentially that shown in FIGS. 3 and 4 Components corresponds.
  • a gripping device 16 is arranged between the two rods 7 in this gripping device, which is longitudinally displaceable in a direction parallel to the longitudinal axes of the rods 7.
  • the counterholder 16 is also located on a side opposite the gripper heads 6, 6 ' with respect to the wafer 3.
  • the counter holder 16 each has a slot for receiving the wafers 3 (not shown, the width of the individual slots being greater than the thickness of the wafers 3, so that the wafer surfaces do not come into contact with the counter holder 16.
  • the rods 7 are also moved between the wafers by a feed movement of the gripping device 1 along their longitudinal axes and parallel to the wafer surfaces in such a way that the gripping heads are located behind the wafers 3.
  • the gripping heads are then rotated through 90 ° and the gripping device is retracted until the wafers rest in the slots 8, 9 on the gripping heads 6, 6 '.
  • the counter-holder 16 is advanced in the direction of the gripping heads 6, 6 'until the wafers 3 also lie in their slots with their circumference.
  • the appropriately designed profile of the slots in the counter-holder 16 ensures that the wafer surfaces are not damaged.
  • Gripping device 1 can be raised slightly so that they no longer lie in the container. The wafers are then moved out of the container by a removal movement in the direction of arrow 17.
  • the holding rakes 10, 10 ' are used, which are moved towards the wafers 3 with a feed movement parallel to the rods 7.
  • the wafers 3 lie in the slots 11 of the holding rakes 10, 10 'in the manner already described above.
  • the wafers 3 are pivoted into the vertical position and in the manner already described in connection with FIGS. 1 to 4 Machining carrier 5 positioned.
  • the processed wafers with the gripping device can be arranged in a container again in the reverse order of the method steps.
  • the present invention can also be used for the handling of individual wafers, as is required when processing individual wafers 3. 5 and 6, a corresponding exemplary embodiment is shown in which a slot 11 of the holding rake 10 is provided with inclined surfaces 12, 13.
  • the gripping head 6 provided for a single disk likewise has inclined slot surfaces 14, 15.
  • the counter holder has an elastomeric stop surface 16 ′, which is oriented essentially at right angles to the surface of the wafer 3. This measure contributes to the fact that the wafer 3 can be removed from the container and inserted into the holding rake 10 without the gripping heads 6 starting to oscillate.
  • the counter-holder 16 preferably remains in abutment against the wafer even during the pivoting movement of the gripping device, as a result of which rapid pivoting movements while at the same time avoiding undesired ones
  • Vibration movements of the wafer can be achieved.
  • the gripping device has no holding rakes for a construction which is as complex as possible. The entire handling of the
  • Wafers - from gripping the wafer in a container to positioning it on a processing carrier - are then only carried out with the two gripping heads 6 and the counter-holder 16.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

L'invention concerne un dispositif de préhension (1) pour prélever et transporter plusieurs tranches (3) espacées parallèlement qui sont stockées dans un récipient (4). Ce dispositif comporte un râtelier (10) et plusieurs têtes de préhension (6; 6') se déplaçant et tournant par rapport à ce dernier. Ces têtes (6; 6') peuvent passer d'une position de pivotement entre les tranches (3) à une autre position de pivotement. Dans cette position, les têtes de préhension (6; 6') peuvent être amenées contre les bords de la tranche (3), venir en butée contre ceux-ci et pousser simultanément les bords opposés des flancs de tranche (3) dans la fente (11) du râtelier (10). Ainsi, toutes les tranches (3) se trouvant dans le récipient (4) peuvent être simultanément saisies de manière fiable, extraites du récipient (4) puis soumises à un pivotement. Après pivotement, les tranches (3) désormais en position verticale peuvent être placées sur un support de traitement (5).
PCT/CH1997/000383 1996-10-09 1997-10-08 Dispositif de prehension pour tranches WO1998015971A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AU44491/97A AU4449197A (en) 1996-10-09 1997-10-08 Wafer gripping device
DE19781101T DE19781101D2 (de) 1996-10-09 1997-10-08 Greifvorrichtung für Wafer

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CH02458/96A CH697146A5 (de) 1996-10-09 1996-10-09 Greifvorrichtung zur Handhabung von Wafern.
CH2458/96 1996-10-09
US08/889,150 1997-07-07
US08/889,150 US6092971A (en) 1996-10-09 1997-07-07 Wafer gripping device adapted to swivel wafers taken from a horizontal position in a storage container

Publications (1)

Publication Number Publication Date
WO1998015971A1 true WO1998015971A1 (fr) 1998-04-16

Family

ID=25690499

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CH1997/000383 WO1998015971A1 (fr) 1996-10-09 1997-10-08 Dispositif de prehension pour tranches

Country Status (4)

Country Link
KR (1) KR100521725B1 (fr)
AU (1) AU4449197A (fr)
DE (1) DE19781101D2 (fr)
WO (1) WO1998015971A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100564544B1 (ko) * 1999-01-14 2006-03-28 삼성전자주식회사 웨이퍼 적재용 보트
DE19981278B4 (de) * 1998-07-09 2020-01-09 Murata Machinery, Ltd. Vorrichtung und Verfahren zur Bereitstellung eines vollständigen Waferstapels

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102620419B1 (ko) 2021-09-03 2024-01-02 이현오 전자부품 소자 운반용 절연 그리퍼

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5183370A (en) * 1989-12-29 1993-02-02 Commissariat A L'energie Atomique Apparatus for placing or storing flat articles in a cassette with intermediate racks
US5615988A (en) * 1995-07-07 1997-04-01 Pri Automation, Inc. Wafer transfer system having rotational capability

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5183370A (en) * 1989-12-29 1993-02-02 Commissariat A L'energie Atomique Apparatus for placing or storing flat articles in a cassette with intermediate racks
US5615988A (en) * 1995-07-07 1997-04-01 Pri Automation, Inc. Wafer transfer system having rotational capability

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19981278B4 (de) * 1998-07-09 2020-01-09 Murata Machinery, Ltd. Vorrichtung und Verfahren zur Bereitstellung eines vollständigen Waferstapels
KR100564544B1 (ko) * 1999-01-14 2006-03-28 삼성전자주식회사 웨이퍼 적재용 보트

Also Published As

Publication number Publication date
KR100521725B1 (ko) 2005-10-17
AU4449197A (en) 1998-05-05
KR20000048997A (ko) 2000-07-25
DE19781101D2 (de) 1999-12-02

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