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WO1998031765A1 - Composition adhesive et ses applications - Google Patents

Composition adhesive et ses applications Download PDF

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Publication number
WO1998031765A1
WO1998031765A1 PCT/JP1998/000136 JP9800136W WO9831765A1 WO 1998031765 A1 WO1998031765 A1 WO 1998031765A1 JP 9800136 W JP9800136 W JP 9800136W WO 9831765 A1 WO9831765 A1 WO 9831765A1
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WO
WIPO (PCT)
Prior art keywords
adhesive composition
weight
parts
compound
content
Prior art date
Application number
PCT/JP1998/000136
Other languages
English (en)
Japanese (ja)
Inventor
Kazuhiko Ishii
Kiyohisa Tokuda
Kenji Yoshida
Minoru Yokoshima
Original Assignee
Nippon Kayaku Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kayaku Kabushiki Kaisha filed Critical Nippon Kayaku Kabushiki Kaisha
Publication of WO1998031765A1 publication Critical patent/WO1998031765A1/fr

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Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
    • G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers

Definitions

  • the present invention relates to an energy ray-curable adhesive composition suitable for bonding opaque substrates such as optical disks (particularly DVD, MO) and IC cards, and applications thereof, namely, an adhesive, a bonding method, and a bonding method.
  • the present invention relates to a method for manufacturing an optical disk. Background art
  • the bonding method using heat has a problem that the base material is warped or deformed by heat.
  • hot-melt resins have poor thermal stability and poor weather resistance, making it difficult to use them in high-temperature environments.
  • the present inventors have conducted intensive studies to solve the above-mentioned problems. As a result, even an opaque substrate can be cured at room temperature, and has adhesiveness, warpage of a disk, anti-corrosion and deformation resistance of a recording film, and resistance to deformation.
  • the present invention has succeeded in providing an adhesive composition, an optical disk, and a method for producing the same, which are excellent in impact properties and the like. That is, the present invention relates to the inventions described in the following items 1 to 18. 1, energy beam polymerizable compound (A) with slow curing speed, energy beam with fast curing speed An adhesive composition comprising a polymerizable compound (B) and an energy ray polymerization initiator (C).
  • the adhesive composition according to the above item 1 or 2 further comprising a polyol compound (D) having at least two hydroxyl groups in a molecule.
  • An adhesive composition characterized in that the content of the component (C) is 0.01 to 4 parts by weight and the content of the component (E) is 1 to 60 parts by weight.
  • the glycidyl compound content is 10 to 30 parts by weight, based on the total amount of the compound, the alicyclic hydrocarbon epoxidized product and the (D) component, 100 parts by weight, and the alicyclic hydrocarbon epoxidized product.
  • the content of the component (D) is 10 to 40 parts by weight, and the content of the component (C ′) is 0.05 to 0.5 part by weight.
  • the adhesive on the application surface is irradiated with energy rays so that the residual ratio of epoxy groups in the composition is 50 to 95%, and then the coated surfaces or the coated surface and the adhesive composition are not coated.
  • a bonding method characterized in that the surface of one of the base materials is brought into close contact.
  • the adhesive composition of the present invention contains an energy ray polymerizable compound (A) having a slow curing rate, an energy ray polymerizable compound (B) having a fast curing rate, and an energy ray polymerization initiator (C).
  • the energy rays include light, ultraviolet rays, X-rays and electron beams, and ultraviolet rays are preferred.
  • a compound with a maximum heat generation time (elapsed time from the start of heat generation to the peak) in an optical DSC of an ordinary energy ray polymerizable compound within 0.5 minutes belongs to a “fast” one, and a material with a time longer than 0.5 minutes It belongs to the "slow” one. Even if it is slow, the maximum heat generation time is preferably within 10 minutes, more preferably within about 5 minutes.
  • the measurement of the light DSC in the present invention is usually performed using the following apparatus and sample.
  • Sample A composition obtained by adding 1 part by weight of a photopolymerization initiator to 100 parts by weight of an energy beam polymerizable compound.
  • UVI—6990 ⁇ See note * 1 in Table 2 below
  • a compound is also preferable in which the maximum exothermic time in optical DSC is within 0.5 minutes when other energy ray-polymerizable compounds are added and used together. Fast ”belongs to the compound.
  • Such compounds include, for example, compounds having an oxetane ring.
  • slow includes, for example, glycidyl compounds, and “fast” Examples thereof include, but are not limited to, epoxidized alicyclic hydrocarbons.
  • a typical example of the energy ray polymerizable compound (A) having a low curing rate used in the present invention is a glycidyl compound.
  • the glycidyl compound can be used without any particular limitation as long as it has a glycidyl group.
  • a compound having a molecular weight of 75 or more, preferably 85 or more is used. Although there is no particular upper limit for the molecular weight, it is usually at most 100,000, preferably at most 5,000, more preferably at most 3,000.
  • glycidyl ester compounds such as glycidyl ester of linoleic acid dimer and glycidyl ether compounds can be mentioned, and glycidyl ether compounds are preferable. These glycidyl compounds can be used alone or in combination of two or more.
  • Examples of the glycidyl ether compound include an aromatic glycidyl ether compound and an aliphatic glycidyl ether compound.
  • Examples of the aromatic glycidyl ether compounds include 1,2-epoxy-12-butyl-3-phenoxypropane, 1,2-epoxy-13-methyl-13-phenoxypropane, and 1,3-bis (2,3-epoxypropoxy) benzene, 1,2-epoxy-13-phenoxypropane, bisphenol A diglycidyl ether, bisphenol F diglycidyl ether, phenol novolak epoxy resin, cresol ⁇ Novolak type epoxy resin.
  • Examples of the aliphatic glycidyl ether compound include butylglycidyl ether, 1-aryloxy-1,2,3-epoxypropane, 1,4-butanedioldiglycidyl ether, triglycidyl ether of glycerol, and propylene glycol. Glycidyl ether, trimethylolpropane triglycidyl ether and the like.
  • Representative examples of the “energy beam polymerizable compound (B) having a high curing rate” used in the present invention include, for example, alicyclic ether compounds.
  • the alicyclic ether compound is a cyclic ether compound excluding the glycidyl compound, and examples thereof include an epoxide of an alicyclic hydrocarbon and a compound having an oxetane ring.
  • Examples of the epoxidized alicyclic hydrocarbon include a cycloaliphatic compound having an epoxy group (hereinafter, referred to as an alicyclic epoxy compound).
  • the alicyclic epoxy compound examples include, for example, an alicyclic epoxy compound having, on a 4- to 7-membered cyclic aliphatic group, an epoxy group sharing one side with these rings, and having a molecular weight of 52 or more, Preferably, it is 100 or more. Although there is no particular upper limit for the molecular weight, it is usually 500 or less.
  • the alicyclic epoxy compound preferably has 1 to 3 and more preferably 1 to 2 cycloaliphatic groups and epoxy groups, respectively, and preferably has 1 to 3 cycloaliphatic groups having an epoxy group. It has three, more preferably one or two.
  • the cycloaliphatic group may be directly bonded without using a crosslinking group, or may be bonded via a crosslinking group.
  • the cross-linking group may be a branched or unbranched hydrocarbon chain having about 1 to 10 carbon atoms, which may contain a hetero atom (other than a nitrogen atom) other than carbon, such as oxygen or sulfur. Hetero atoms (excluding nitrogen atoms) such as oxygen and sulfur other than carbon can be exemplified.
  • Specific compounds include, for example, compounds having one cycloaliphatic group having an epoxy group, compounds having no substituent on the ring other than the epoxy group, limonenedioxide, and 4-vinylcyclohexene monoamine.
  • Compounds having a plurality of cycloaliphatic groups having an epoxy group include, for example, (3,4-epoxycyclohexyl) methyl-1,4-epoxycyclohexanecarboxylate and bis (3,4-epoxycyclo).
  • Examples of alicyclic ether compounds having an oxetane ring include 3-methyl-3-hydroxymethyloxetane, 1,4-bis [(3-ethyl-3-oxenylmethoxy) methyl] benzene and the like. Is raised.
  • the above-mentioned polymer having an alicyclic ether group in a side chain is also included in the alicyclic ether compound in the present invention.
  • a polymer having such an alicyclic ether group in the side chain examples thereof include homopolymers of 4-vinylcyclohexene monooxide and copolymers of 4-vinylcyclohexene monooxide with other monomers having an unsaturated double bond. .
  • One or more of these alicyclic ether compounds (B) may be used in combination.
  • Table 1 shows a part of the measurement results of the optical D S C of representatives of the above compounds.
  • No. 1 to 5 (a): A composition obtained by adding 1 part by weight of a photopolymerization initiator to 100 parts by weight of an energy beam polymerizable compound
  • energy beam polymerizable compounds used bis- (3,4-epoxycyclohexyl) adipate
  • the energy beam polymerization initiator (C) for example, a photo-induced thione polymerization initiator can be mentioned.
  • the photodynamic thione polymerization initiator include, for example, 4,4'-bis [diphenylsulfonio] phenylsulfide-bis-hexafluoroantimonate and 4,4'-bis [diphenylsulfonate E) Phenylsulfide D-bis-hexafluorophosphate, 4,4-bis [di (?-Hydroxyethoxy) phenylsulfonio] phenylsulfido-bis-hexafluoroantimonate, 4,4'-bis
  • the photoinitiated thione polymerization initiator is usually used after being dissolved in lactone or propiocarbonate.
  • the components (A) to (C) constituting the composition suitable for the adhesive of the present invention are usually used in an amount of 10 to 95% by weight of the total of the three components. Preferably 1
  • the content of the component (C) is preferably 0.01 to 10% by weight, more preferably 0.05 to 5% by weight, still more preferably 0.05 to 1% by weight, Particularly preferably
  • component (B) 0.05 to 0.6% by weight, with the balance being component (B), with a preferred content of 4.
  • the adhesive composition of the present invention may further contain a compound (D) having at least two hydroxyl groups in a molecule, a filler (E), and / or a lactone compound (F).
  • a compound (D) having at least two hydroxyl groups in the molecule (D) ⁇
  • the lactone compound (F) is mainly used to adjust the curing speed and to increase the flexibility and adhesion of the film.
  • a compound (D) having at least two hydroxyl groups in the molecule is preferable.
  • the filler (E) is mainly used for imparting or improving the thixotropic property.
  • a compound having no acidic group other than a phenolic hydroxyl group is preferable.
  • a polyester polyol compound (D-2), a polyhydric prolactone polyol compound (D-3), a polyol compound having a phenolic hydroxyl group (D-4), and a polycarbonate polyol By using a compound (D) having at least two hydroxyl groups in the molecule, the formation of a film on the surface of the coating film after irradiation with energy rays can be more strongly suppressed, and the adhesion of the surface is not hindered. It is possible to obtain an adhesive having a non-uniform bonding surface. Further, a higher impact resistance can be imparted to an adhesive using the adhesive of the present invention.
  • Examples of the polyol compound (D_l) having no functional group other than the alcoholic hydroxyl group include ethylene glycol, propylene glycol, 1,4-butanediol, 1,3-butanediol, 1,9-nonanediol, and neopentyl.
  • Glycol tricyclo mouth decane dimethylol, cyclohexane dimethyl alcohol, trimethylol propane, glycerin, hydrogenated polybutene polyol, hydrogenated dimer diol, and other aliphatic polyols, diethylene glycol, tripropylene glycol, polyethylene glycol, Polypropylene glycol, polytetramethylene glycol, trimethylolpropane polyethoxytriol, glycerin polypropoxytriol, bisphenol A polyethoxydiol, bisphenol F polyethoxy Diol, an ether bond, such as Jitorimechiro one trimethylolpropane having one or two or more (poly) E one Teruporio - can be exemplified Le.
  • polyester polyol compound (D-2) examples include the above-mentioned polyol compound (D-1) having no functional group other than the alcoholic hydroxyl group and a polybasic acid (for example, maleic acid, succinic acid, adipic acid) Terephthalic acid, isophthalic acid, hydrogenated dimer acid) or a reaction product thereof with an anhydride thereof.
  • a polybasic acid for example, maleic acid, succinic acid, adipic acid
  • Terephthalic acid Terephthalic acid, isophthalic acid, hydrogenated dimer acid
  • Examples of the polyforce prolactone polyol compound (D-3) include a reaction product of the above-mentioned polyol compound (D-1) having no functional group other than the alcoholic hydroxyl group and ⁇ -force prolactone, Alternatively, a reaction product of the polyol compound (D-1) having no functional group other than the alcoholic hydroxyl group, the polybasic acid or an anhydride thereof, and ⁇ -force prolactone can be used.
  • Examples of the polyol compound having a phenolic hydroxyl group (D-4) include compounds having at least two hydroxyl groups in a molecule, such as bisphenol, phenol novolak, and cresol novolak.
  • lactone compound (F) examples include £ -force prolactone, arptyrolactone, and (5-valerolactone). Preferred examples thereof include £ -force prolactone and arbutyrolactone. it can.
  • more preferred compounds include compounds having 2 to 5, more preferably 2 to 3, hydroxyl groups.
  • acidic compounds such as a polyol compound (D-1) having no functional group other than an alcoholic hydroxyl group and a polyfunctional prolactone polyol compound (D-3) can be used.
  • Polyols having no group can be mentioned.
  • a polyether polyol having two or more ether bonds is preferable.
  • polyprolactone polyol compounds (D-3) a reaction product of a polyol compound (D-1) having no functional group other than the alcoholic hydroxyl group and a protolactone is preferred. More preferred compounds include, for example, polytetramethylene glycol, polyprolactone diol, and polyprolactone triol.
  • a filler ( ⁇ ) can be further contained as necessary.
  • the filler (E) is mainly used for imparting or improving thixotropic properties. By using the filler (E), thixotropy is imparted or improved, and the suitability for screen printing of the adhesive composition of the present invention can be enhanced.
  • filler (E) examples include silicon dioxide, titanium dioxide, alumina, barium sulfate, kaolin, talc, clay, calcium carbonate, bentonite, glass fiber, carbon fiber, mica, and organic filler (eg, resin beads). And the like, known and commonly used fillers.
  • the use ratio of the components (D), (E) and (F) is as follows: the total amount of the components (A) to (C), and the component (D) , Preferably 0 to 60 parts, more preferably 0 to 50 parts, the component (F) is 0 to 60 parts, more preferably 0 to 50 parts, and the component (E) is (A) to (D), ( F)
  • the amount is preferably 0 to 60 parts, more preferably 0 to 40 parts, based on 100 parts of the total amount of the components.
  • the amount of the component (A), (B) and (D) is 100 parts by weight, and (A) is Preferably 5 to 50 parts by weight, more preferably 10 to 30 parts by weight, component (B) is preferably 5 to 90 parts by weight, more preferably 30 to 80 parts by weight, component (D) is preferably 5 to 90 parts by weight. 50 parts by weight, more preferably 10 to 40 parts by weight, and the component (C) is preferably 0.01 to 10 parts by weight, more preferably 0.05 to 1 part by weight, particularly preferably 0.05 to 0.5 parts by weight. ⁇ 0.5 parts by weight.
  • the amount used is preferably 1 to 6.0 parts by weight, more preferably 5 to 100 parts by weight based on the total amount of the components (A), (B) and (D). It is up to 40 parts by weight.
  • composition of the present invention may further contain, if necessary, a cationic polymerizable substance other than the components (I) and (II), a (meth) acrylate compound, an ultraviolet absorber, an antioxidant, a leveling agent, A foaming agent, a polymerization inhibitor and the like can be used in combination.
  • Cationic polymerizable substances other than the components (I) and (II) include, for example, ⁇ -butylvinyl ether, cyclohexyl vinyl ether, butanediol divinyl ether, triethylene glycol divinyl ether, and cyclohexyl.
  • the adhesive composition of the present invention can be prepared by mixing the above-mentioned components (A) to (E) and other components in an arbitrary order, or by mixing all of them together as appropriate.
  • the bonded body of the present invention is obtained by bonding two substrates through a cured product layer of the above adhesive composition.
  • the thickness of the cured product layer is preferably, for example, about 5 to 100 ⁇ m.
  • the substrate is not particularly limited, but from the viewpoint of fully utilizing the function of the above-mentioned adhesive composition, it is usually 28 2 ⁇ !
  • a substrate that does not transmit energy rays at a wavelength of up to 380 nm is preferable.
  • an optical disc substrate in which a recording layer made of a metal film such as aluminum is provided on a polycarbonate substrate is exemplified. .
  • the two substrates may be the same or different.
  • the adhesive composition described above is applied to one or both surfaces of two same or different base materials by spinning, screen printing, etc., to a thickness of 5 to 100 ⁇ m, It is preferably applied to a screen printing machine or the like so as to have a thickness of 5 to 50 m, more preferably 10 to 30 m, and the residual ratio of epoxy groups in the applied adhesive composition (infrared absorption spectrum)
  • the ratio of the amount of epoxy groups after irradiation with energy such as ultraviolet rays to the initial amount of epoxy groups quantified by a vector analysis method or the like is expressed as a percentage).
  • the residual ratio of the epoxy group is 95% or more, curing is not sufficiently performed, and when the residual ratio is 50% or less, adhesiveness is deteriorated.
  • the surfaces irradiated with energy rays such as ultraviolet rays on the two substrates or one coated surface and the uncoated surface of the other substrate are bonded together, for example, at room temperature (about 20 ° C) or heated ( It may be left for about 0.5 to 24 hours at about 20 to 50 ° C). Bonding is possible even if the standing time is 0.5 hours or less.
  • the optical disk of the present invention is obtained by bonding a substrate for an optical disk to another substrate via a cured product layer of the adhesive composition.
  • the thickness of the cured product layer is, for example, 5 to 100 m The degree is preferred.
  • An optical disc substrate is, for example, a substrate made of polycarbonate and provided with a recording layer made of a metal sputter film or the like, and does not normally transmit energy rays at a wavelength of 280 nm to 380 nm. Things.
  • Other substrates include, for example, optical disk substrates.
  • Examples of the optical disk of the present invention include MO (magneto-optical disk) and DVD (digital versital or video disk). Of these, double-sided reading type M0 and DVD and single-sided double-layer reading type DVD need to adhere non-transparent substrates to each other, in that the performance of the adhesive composition of the present invention is fully utilized. preferable.
  • the following may be performed. That is, a protective layer (usually obtained by curing an ultraviolet-curable resin composition) on the recording layer of an opaque optical disk having a recording layer made of a metal such as aluminum or the like, or on the recording layer. ),
  • the adhesive composition (in this case, also referred to as the adhesive composition for optical discs) is applied to a thickness of 5 to 100 mm using a spin coater or a screen printing machine.
  • the remaining epoxy group in the applied adhesive composition (the epoxy group after irradiation with ultraviolet rays relative to the initial amount of epoxy groups determined by infrared absorption spectrum analysis, etc.) Is usually 50 to 95%, preferably 60 to 90%, and is irradiated with energy rays such as ultraviolet rays.
  • the residual ratio of the epoxy group is 95% or more, curing is not sufficiently performed, and when the residual ratio is 50% or less, adhesiveness is deteriorated.
  • the coated surfaces are adhered to each other, for example, at a room temperature (about 20 ° C) or a heated state (about 20 to 50 ° C) for 0.5 to 24 hours.
  • the composition is cured, and the optical disk of the present invention can be obtained.
  • the curing speed of the adhesive composition is high, bonding is possible even when the standing time is 0.5 hour or less.
  • a starting coil manufactured from an opaque substrate and a copper wire or the like coated with an IC chip and / or a polymer such as polyimide is provided via a cured film layer of the adhesive composition of the present invention.
  • Opaque substrates include, for example, sheets of polyvinyl chloride, polyethylene terephthalate, and polycarbonate containing a white pigment. This IC force is bonded to the opaque substrate and IC chip in the same manner as above. Manufactured.
  • An IC card in which an opaque substrate and an IC chip are bonded is called a contact IC card, and an IC card in which an opaque substrate is bonded to an IC chip and a launch coil is called a non-contact IC card.
  • an adhesive composition of the present invention (in Table 2, numerical values are parts by weight).
  • the prepared adhesive composition is applied to a recording layer of an optical disc substrate having an aluminum vapor-deposited film as a recording layer by a screen printing method so as to have a thickness of 20 ⁇ m, and ultraviolet rays are applied to the coated surface.
  • UV rays were applied so as to be 80% (Examples 1 to 3) and 90% (Examples 4 to 7), then the coated surfaces were stuck together and left at about 25 ° C for 24 hours. Then, a test piece (optical disk) was obtained.
  • UVI-6990 ⁇ 1 1.0 2.0 0.5 0.5 0.5
  • PLAXEL 205 Polycaprolactonediol manufactured by Daicel Chemical Industries, Ltd.
  • Table 3 shows the evaluation results obtained above.
  • the adhesives (for example, optical disks) using the adhesive composition and the bonding method (for example, optical disk manufacturing method) of the present invention are all excellent in adhesiveness and durability.
  • the adhesives (for example, optical disks) using the adhesive composition and the bonding method (for example, optical disk manufacturing method) of the present invention are all excellent in adhesiveness and durability.
  • the adhesive composition of the present invention was prepared in the same manner as described above (in Table 4, the numerical values are parts by weight).
  • the prepared adhesive composition is applied on a recording layer of an optical disc substrate having an aluminum vapor-deposited film as a recording layer to a thickness of 20 m by a screen printing method, and the applied surface is irradiated with ultraviolet rays.
  • the residual ratio of epoxy groups in each composition (based on the amount of epoxy groups at the initial stage of the coated surface, as determined by UV absorption spectroscopy) UV light is applied so that the ratio of the epoxy groups after irradiation with UV light is 80%), and the coated surfaces are stuck together and left at about 25 ° C for 24 hours. Test pieces (optical discs) were obtained.
  • test pieces were all excellent in curability, difficulty in peeling (beer value (g / cm)), durability and the like.
  • the composition and the bonding method suitable for the adhesive of the present invention provide an adhesive having excellent curability, excellent adhesiveness and durability, and a higher impact resistance by using the component (D) or the component (F). It can be used for manufacturing excellent optical discs because it has characteristics such as the ability to be imparted. Since the formation of a film on the surface of the coating film after irradiation with energy rays can be suppressed more strongly, and the adhesiveness of the surface is not hindered, an adhesive having a non-uniform bonded surface can be obtained. Further, the adhesive of the present invention further imparts or improves thixotropy by using a filler (E), and can improve the screen printability of the adhesive composition of the present invention.
  • a filler (E) can improve the screen printability of the adhesive composition of the present invention.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

Composition adhésive durcissable en cuisson électronique actinique pour fixer mutuellement les substrats opaques des disques optiques (en particulier du type vidéodisque numérique (DVD) et magnéto-optique (MO)), les cartes pour circuits intégrés et autres applications, à savoir articles assemblés par fixation, procédés de fixation et procédé de fabrication des disques optiques. Plus précisément, composition adhésive à composée photopolymérisable en mode cationique (A) ayant une faible vitesse de durcissement, à composé photopolymérisable en mode cationique (B) ayant une grande vitesse de durcissement, et à initiateur de photopolymérisation cationique (C). On décrit un procédé de fixation qui consiste à enduire la surface d'au moins un des deux substrats avec ladite composition, à irradier la surface enduite par émission actinique de sorte que le contenu des groupes époxy résiduels sur la surface enduite oscille généralement entre 50 et 95 %, et à mettre mutuellement les surfaces enduites en contact étroit. On décrit enfin un procédé de fabrication pour disques optiques.
PCT/JP1998/000136 1997-01-20 1998-01-16 Composition adhesive et ses applications WO1998031765A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP1964797 1997-01-20
JP9/19647 1997-01-20
JP9/166677 1997-06-10
JP16667797 1997-06-10

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WO1998031765A1 true WO1998031765A1 (fr) 1998-07-23

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Publication number Priority date Publication date Assignee Title
WO2011104127A1 (fr) 2010-02-24 2011-09-01 Basf Se Acides latents et leur utilisation
WO2016124493A1 (fr) 2015-02-02 2016-08-11 Basf Se Acides latents et leur utilisation
CN110746921A (zh) * 2019-11-21 2020-02-04 佛山科学技术学院 一种混凝土与金属粘结的强力胶水

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JPS6449144A (en) * 1987-08-19 1989-02-23 Ricoh Kk Optical information recording medium
JPH03134075A (ja) * 1983-03-29 1991-06-07 Union Carbide Chem & Plast Co Inc 紫外線により硬化される相似被覆剤
JPH04266985A (ja) * 1991-02-20 1992-09-22 Yokohama Rubber Co Ltd:The 光硬化性接着組成物

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JPS6051770A (ja) * 1983-08-31 1985-03-23 Toyo Ink Mfg Co Ltd 光学用接着剤
JPS6217729A (ja) * 1985-07-16 1987-01-26 Mitsui Toatsu Chem Inc 液晶封止用セルの製造方法
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JPS6449144A (en) * 1987-08-19 1989-02-23 Ricoh Kk Optical information recording medium
JPH04266985A (ja) * 1991-02-20 1992-09-22 Yokohama Rubber Co Ltd:The 光硬化性接着組成物

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011104127A1 (fr) 2010-02-24 2011-09-01 Basf Se Acides latents et leur utilisation
WO2016124493A1 (fr) 2015-02-02 2016-08-11 Basf Se Acides latents et leur utilisation
US9994538B2 (en) 2015-02-02 2018-06-12 Basf Se Latent acids and their use
CN110746921A (zh) * 2019-11-21 2020-02-04 佛山科学技术学院 一种混凝土与金属粘结的强力胶水

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