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WO1999043191A1 - Boitier blinde et son procede de fabrication - Google Patents

Boitier blinde et son procede de fabrication Download PDF

Info

Publication number
WO1999043191A1
WO1999043191A1 PCT/SE1999/000227 SE9900227W WO9943191A1 WO 1999043191 A1 WO1999043191 A1 WO 1999043191A1 SE 9900227 W SE9900227 W SE 9900227W WO 9943191 A1 WO9943191 A1 WO 9943191A1
Authority
WO
WIPO (PCT)
Prior art keywords
housing
layer
space
electromagnetic shielding
electrical conductivity
Prior art date
Application number
PCT/SE1999/000227
Other languages
English (en)
Inventor
Jonas Eklind
Original Assignee
Nolato Silikonteknik Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nolato Silikonteknik Ab filed Critical Nolato Silikonteknik Ab
Priority to AU32829/99A priority Critical patent/AU3282999A/en
Publication of WO1999043191A1 publication Critical patent/WO1999043191A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers

Definitions

  • the present invention relates to a housing for electromagnetic shielding and a method of making such a housing according to the preamble to appended claims 1 and 9. Moreover, the invention concerns use of a mouldable polymer material having electrical conductivity .
  • Electromagnetic shielding of electronic components is based on the principle of the Faraday cage, i.e. the electronics are shielded from electric fields in the surroundings, such as interference caused by radiofrequen- cies, by means of an electrically conductive casing. Thus the interference cannot penetrate the material of the conductive casing. Electromagnetic shielding of electric and electronic components is necessary in, for instance, apparatus for transmitting and/or receiving radio signals. Especially in connection with portable apparatus, such as mobile telephones, great demands are placed on the achievement of efficient shielding without making the construction unnecessarily heavy and unwieldy.
  • Shielding devices of the type mentioned by way of introduction usually have a body which is not electrically conductive, for instance a plastic body, and an electrically conductive layer which is applied to the body.
  • the layer is a conductive varnish.
  • this layer is mechanically sensitive and does not withstand the process temperatures that may occur in subsequent process steps of manufacture, for instance, arranging a seal on the housing.
  • Conductive varnishes further have environmental drawbacks, for instance related to solvents.
  • metal films are applied to the body. Such a solution, however, is disadvantageous since it can be used only for certain 2 simple geometric shapes, and the production method is complicated.
  • the body can also be coated with a metal by applying a very thin layer of metal to the surface of the body but this requires special equipment and is an expensive and complicated method. Moreover the metal layer is sensitive to mechanical action.
  • This housing is adapted to shield electronic components located in the housing.
  • the housing has an opening which is adapted to be directed towards a base.
  • an electrically conduc- tive seal of silicone material is applied in a pasty initial state from a nozzle.
  • This device suffers from the same drawbacks as those mentioned above in connection with devices which are entirely made of metal.
  • Similar seals that have been dispensed or moulded to engaging edges are also known in connection with shielding housings which comprise a body and a conductive layer applied thereto. Summary of the Invention
  • An object of the present invention is to provide a device for electromagnetic shielding which is improved in relation to the prior-art technique.
  • a specific object is to obviate or reduce the above drawbacks of the prior-art technique and provide a housing which at the same time has a good electromagnetic shielding capacity and a low weight.
  • a special object is to provide a shielding device which has reduced sensiti- 3 vity to mechanical action and in particular withstands scratching.
  • a further object is to provide a new and improved method of production, which permits a lower production cost and satisfies greater demands in respect of a satisfactory working environment and natural environment.
  • the housing has a body without any essential electrical conductivity and a polymer layer moulded thereto and having electrical conductivity.
  • the body defines a space and an opening which is adapted to be directed towards a base.
  • the moulded polymer layer forms an electromagnetic shielding which encloses the space.
  • the invention is based on the new knowledge that by using an electrically conductive, moulded polymer layer as surface-covering material, it is possible to obtain a layer with properties such as good mouldability, good resistance to scratching and low density while at the same time an efficient electromagnetic shielding of a space can be achieved.
  • a further advantage that can be achieved by means of a housing according to the invention is that it is inexpensive and easy to produce.
  • the term "enclose” means that the layer which is arranged on the surface of the body forms a screen or a casing round the space and is shaped according to the body such that the space is shielded in all directions except towards the opening.
  • the layer can have, for instance, a net- or lattice-shaped extent. 4 According to a preferred embodiment, however, the entire body is covered with the layer to guarantee a reliable shielding in a wide frequency range.
  • the conduc- tive polymer layer is a flexible or compressible layer of material. This guarantees a particularly long service life and insensitivity to mechanical action.
  • the housing comprises an electrically conductive seal arranged on edges round the opening.
  • the seal serves on the one hand to seal against, for instance, dust and moisture and, on the other hand, to have an electromagnetically shielding effect.
  • the layer and the seal are preferably made of the same material and are in particular made in one piece.
  • an electromagnetically shielding layer and an electromagnetically shielding seal can be made in a single, common step of production.
  • great logistic advantages are achieved in the production, which guaran- tees a low production cost for the housing.
  • the layer is arranged on the inside of the body, which reduces the risk of the layer being mechanically affected.
  • the layer and the body are interconnected by mechanical engagement.
  • the solution involving mechanical engagement has, for instance, the advantage that the entire production process for applying the layer is carried out in a single operation, which reduces, inter alia, the production cost.
  • Fig. 1 is a perspective view of a housing according to a first embodiment of the present invention
  • Fig. 2 is a partial view in cross-section along line II-II in Fig. 1
  • Fig. 3 is a perspective view of a housing according to a second embodiment of the invention.
  • Fig. 4 is a partial view in cross-section along line IV-IV in Fig. 3. Description of Currently Preferred Embodiments of the Invention
  • Figs 1 and 2 illustrate a housing 1, which comprises a body 2 which internally defines a space 5, and an electrically conductive layer 3 arranged on the inside of the body 2.
  • the body 2 also defines an opening 6, which is adapted to be directed towards a base (not shown) , such as a printed circuit card, such that the housing 1 together with the base encloses the space 5 in all directions.
  • the housing 1 further comprises an electricaJly conductive seal 4 arranged on edges 7 surrounding the opening 6, as is best seen in Fig. 2. The surfaces of the edges 7 are adapted to engage the base by the intermediary of the seal 4.
  • the electrically conductive layer 3 comprises a moulded flexible polymer and can specifically comprise a silicone rubber with silver added, but it goes without saying that there are many different materials that may be used. Silicone, however, has the advantage of being strong and temperature stable. Moreover, silicone is well suited as seal material.
  • the body 2 is not electrically conductive and is preferably made of plastic but may also be made of wood or paper. When the body 2 is made of plastic, it may have a wall thickness in the range of 0.3-0.5 mm and, in certain designs, have wall thicknesses down to 0.1 mm. When making the housing 1, the layer 3 is moulded directly to the body 2.
  • an adhesive layer a primer
  • the body 2 is placed in a mould and then the layer 3 is moulded directly to the inside of the body 2 and is in this connection given the desired shape.
  • a great advantage of the invention is that the design and thickness of the conductive layer 3 can be controlled very accurately by the appearance of the mould while at the same time the layer can be made in a single production step. Typical layer thicknesses are in the order of 0.1-0.5 mm, but thicker as well as thinner designs of the layer are possible. Moreover, the thickness of the layer can vary over the surface.
  • FIGs 3 and 4 show a second embodiment of a housing 1' where the layer 3' is connected to the body 2' by mechanical engagement, see Fig. 4. Otherwise this embodiment corresponds to the one described above.
  • the body 2' has holes 9 of essentially conical longitudinal sec- tion. When moulding the layer 3 1 , these holes 9 are filled with the electrically conductive polymer in liquid state and, after curing, form gripping means 8 attaching the layer 3 ' to the body 2 ' .
  • a housing according to any one of the embodiments described above is well suited, in cooperation with a base, such as a printed circuit card, to shield electronics in, for instance, a mobile telephone.
  • the housing can be differently designed according to different applications.
  • an engagement between the polymer layer and the body can be effected by means of different designs.

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

L'invention porte sur un boîtier constituant un blindage électromagnétique comportant un corps (2') pratiquement non conducteur englobant un espace (5) et présentant une ouverture (6) dirigée vers le bas. La surface du corps (2') est recouverte d'une couche électroconductrice (3') de polymère moulé constituant le blindage entourant l'espace (5). L'invention porte également sur la fabrication dudit boîtier et sur l'emploi d'un matériau plastique moulable électroconducteur pour former un blindage électromagnétique superficiel autour d'un espace.
PCT/SE1999/000227 1998-02-19 1999-02-18 Boitier blinde et son procede de fabrication WO1999043191A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU32829/99A AU3282999A (en) 1998-02-19 1999-02-18 Housing with shielding properties and method for making it

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE9800488-0 1998-02-19
SE9800488A SE9800488L (sv) 1998-02-19 1998-02-19 Skärmning

Publications (1)

Publication Number Publication Date
WO1999043191A1 true WO1999043191A1 (fr) 1999-08-26

Family

ID=20410227

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/SE1999/000227 WO1999043191A1 (fr) 1998-02-19 1999-02-18 Boitier blinde et son procede de fabrication

Country Status (3)

Country Link
AU (1) AU3282999A (fr)
SE (1) SE9800488L (fr)
WO (1) WO1999043191A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002043456A3 (fr) * 2000-11-20 2003-05-22 Parker Hannifin Inc Reduction des interferences par le biais de materiaux composites thermoplastiques conducteurs
US7005573B2 (en) 2003-02-13 2006-02-28 Parker-Hannifin Corporation Composite EMI shield
US7326862B2 (en) 2003-02-13 2008-02-05 Parker-Hannifin Corporation Combination metal and plastic EMI shield
US7714236B2 (en) * 2007-07-26 2010-05-11 Kabushiki Kaisha Toshiba Electric component
CN114080424A (zh) * 2019-07-04 2022-02-22 科德宝两合公司 用于制备屏蔽电磁辐射的构件的方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4585686A (en) * 1983-12-28 1986-04-29 Aron Kasei Co., Ltd. Two-layer structure molded by using thermoplastic resin
EP0180383A2 (fr) * 1984-10-26 1986-05-07 Aronkasei Co., Limited Méthode de fabrication pour boîtiers ayant une structure à deux couches
US4664971A (en) * 1981-12-30 1987-05-12 N.V. Bekaert S.A. Plastic article containing electrically conductive fibers
FR2619655A1 (fr) * 1987-08-21 1989-02-24 Mennecier Philippe Systeme de faradisation d'un equipement electrique base sur l'utilisation d'un polymere conducteur
EP0387419A2 (fr) * 1989-03-16 1990-09-19 Toyo Ink Manufacturing Co., Ltd. Composition de résine
EP0652696A1 (fr) * 1993-11-09 1995-05-10 AT&T Corp. Dispositif de blindage

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4664971A (en) * 1981-12-30 1987-05-12 N.V. Bekaert S.A. Plastic article containing electrically conductive fibers
US5397608A (en) * 1981-12-30 1995-03-14 Soens; Lode J. Plastic article containing electrically conductive fibers
US4585686A (en) * 1983-12-28 1986-04-29 Aron Kasei Co., Ltd. Two-layer structure molded by using thermoplastic resin
EP0180383A2 (fr) * 1984-10-26 1986-05-07 Aronkasei Co., Limited Méthode de fabrication pour boîtiers ayant une structure à deux couches
FR2619655A1 (fr) * 1987-08-21 1989-02-24 Mennecier Philippe Systeme de faradisation d'un equipement electrique base sur l'utilisation d'un polymere conducteur
EP0387419A2 (fr) * 1989-03-16 1990-09-19 Toyo Ink Manufacturing Co., Ltd. Composition de résine
EP0652696A1 (fr) * 1993-11-09 1995-05-10 AT&T Corp. Dispositif de blindage

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002043456A3 (fr) * 2000-11-20 2003-05-22 Parker Hannifin Inc Reduction des interferences par le biais de materiaux composites thermoplastiques conducteurs
US7005573B2 (en) 2003-02-13 2006-02-28 Parker-Hannifin Corporation Composite EMI shield
US7326862B2 (en) 2003-02-13 2008-02-05 Parker-Hannifin Corporation Combination metal and plastic EMI shield
US7714236B2 (en) * 2007-07-26 2010-05-11 Kabushiki Kaisha Toshiba Electric component
CN114080424A (zh) * 2019-07-04 2022-02-22 科德宝两合公司 用于制备屏蔽电磁辐射的构件的方法
EP3994965A1 (fr) * 2019-07-04 2022-05-11 Carl Freudenberg KG Procédé de fabrication d'un composant blindé vis-à-vis d'un rayonnement électromagnétique

Also Published As

Publication number Publication date
SE9800488L (sv) 1999-08-20
AU3282999A (en) 1999-09-06
SE9800488D0 (sv) 1998-02-19

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