WO1999047994A1

WO1999047994A1 - System for cooling device in computer

Info

Publication number: WO1999047994A1
Application number: PCT/KR1999/000118
Authority: WO
Inventors: Mok-Hyoung Lee; Kwang-Soon Lee; Ki-Oan Cheon
Original assignee: Lee Mok Hyoung; Lee Kwang Soon; Cheon Ki Oan
Priority date: 1998-03-16
Filing date: 1999-03-15
Publication date: 1999-09-23
Also published as: KR19980019402A; KR20010041932A; AU2857799A; CN1293774A; EP1062563A1; JP2002517894A

Abstract

A computer has a heat exchange surface (3) exposed to the surrounding, a device or element generating heat, and a cooling system for transferring the heat of the device or element via the heat exchange surface. The cooling system includes a first heat exchange container (4) and a second heat exchange container (6). The first heat exchange container is coupled to the device or element so as to be capable of transferring the heat from the device or element to the first heat exchange container. The second heat exchange container is coupled to the heat exchange surface so as to be capable of transferring the heat from the second heat exchange container to the heat exchange surface and disposed at a position higher than the first heat exchange. A first tube (7) and a second tube (8) connect between the first heat exchange container and the second heat exchange container. The first heat exchange container, second heat exchange container and tubes define an inner closed space in which a refrigeration medium is contained. The cooling the device or element is conducted by way of phase change and flow of the refrigeration medium.

Description

SYSTEM FOR COOLING DEVICE IN COMPUTER

Field of the Invention

The present invention is directed to a system for cooling electronic elements or devices, for example a central processing unit ("CPU") within a computer, more particularly to a cooling system having a configuration capable of reducing undesirable noise and introduction of dusts into the computer.

Background of the Invention

Recently, elements and devices within a PC, such as a CPU, graphic board and the like, have a higher processing speed. The higher the processing speed is, the more the heat is generated. The heat generated makes the temperature of the elements or devices to rise. Such temperature rising may cause the device to stop the operation or to erroneously operate.

For cooling these elements or devices, a typical cooling device is used. In case of the CPU, the heat radiation fin structure is mounted on the CPU. A cooling fan is installed on an end of the fin structure. The operation of the cooling fan results in airflow to passes around fins. Thus, the heat is transferred to the air within the computer. The computer also has a cooling fan secured to the back of a housing. The operation of this fan pulls out the air within the housing to outside of the housing. The air of the surrounding is introduced into the housing. Thus, the heat within the computer is transferred to the surrounding along with the air. Then, the temperature rising is prevented.

In the above cooling system, however, the operation of the fans results undesirable noise. The attempt to minimize such noise was not satisfactory. In addition, during introduction of the air into the housing, humidity and dusts may be introduced along with the air. These may cause the performance of the computer to deteriorate. To avoid the introduction of dusts, a filter should be provided. However, when the filter is blocked with the dusts, the load of the fan increases. This may cause the higher level of noise sound.

Summary of the Invention

Accordingly, it is an object of the present invention is to provide a cooling system having a low noise level, low possibility of mechanical trouble and no need of electric power. It is another object of the present invention to provide a cooling system having a configuration which allows the computer to avoid from an influence of the outer air environment.

The above and other objects of the present invention are accomplished by providing a cooling system for transferring heat from a device or element within a computer to the surrounding of the computer, the computer having a heat exchange surface exposed to the surrounding of the computer, the cooling system comprising: a first heat exchange container coupled to the device or element so as to be capable of transferring the heat from the device or element to the first heat exchange container; a second heat exchange container coupled to the heat exchange surface so as to be capable of transferring the heat from the second heat exchange container to the heat exchange surface and disposed at a position higher than the first heat exchange container; a first tube and a second tube connecting between the first heat exchange container and the second heat exchange container; the first heat exchange container, second heat exchange container and tubes defining an inner closed space in which a refrigeration medium is contained; and whereby the cooling of the device or element is accomplished by way of phase change and flow of the refrigeration medium.

In accordance with another aspect of the present invention, it is provided a computer having a heat exchange surface exposed to the surrounding, a device or element generating heat, and a cooling system for transferring the heat of the device or element via the heat exchange surface to the surrounding of the computer, wherein: said cooling system including: a first heat exchange container coupled to the device or element so as to be capable of transferring the heat from the device or element to the first heat exchange container; a second heat exchange container coupled to the heat exchange surface so as to be capable of transferring the heat from the second heat exchange container to the heat exchange surface and disposed at a position higher than the first heat exchange container; a first tube and a second tube connecting between the first heat exchange container and the second heat exchange container; the first heat exchange container, second heat exchange container and tubes defining an inner closed space in which a refrigeration medium is contained; and whereby the cooling of the device or element is conducted by way of phase change and flow of the refrigeration medium.

The computer includes a power supply and a heat exchange surface. The power supply comprises an element generating heat, a heat conduct plate to which the heat generating element is attached, and the heat conduct plate being connected to the heat exchange surface. The computer includes a hard disk drive. The drive comprises a mechanism part, a circuitry disposed under the mechanism, and a heat conduct plate covering at least a portion of the circuitry

Brief Description of the Drawings

The above and other objects, advantages and features of the present invention will be apparent from the following description of preferred embodiments taken in conjunction with the accompanying drawings, wherein: Fig. 1 is an elevation sectional view of a computer structure having a cooling system in accordance with the present invention;

Fig. 2 is a perspective view of a cooling system in accordance with an embodiment of the present invention;

Fig. 3 is an enlarged sectional view taken along a line of A-A of Fig. 2; Fig. 4 is a sectional view taken along a line of B-B of Fig. 2;

Fig. 5 is a sectional view taken along a line of E-E of Fig. 4; Fig. 6 is a perspective view taken along a direction of an arrow C of Fig. 2; Fig. 7 is an enlarged sectional view of a first heat exchange container in accordance with another embodiment of the present invention; Fig. 8 is a perspective view a second heat exchange container and a heat conduct plate in accordance with a further embodiment of the present invention;

Fig. 9 is an enlarged sectional view taken along a line of F-F of Fig. 8; Fig. 10 is a perspective view a first heat exchange container in accordance with a further another embodiment of the present invention Fig. 11 is a sectional view taken along a line of G-G of Fig. 10; and

Fig. 12 is a perspective view of a heat conduct plate incorporated in a power supply of a computer.

Detailed Description of the Preferred Embodiments

It will be described preferred embodiments of the present invention below. For convenience of the description, a cooling system for a device of CPU of a personal computer will be described. It should be understood, however, that a cooling system of the present invention can be applied for cooling other device such as a graphic board, ICs, disk drives, control cards, and other electronic elements. Referring to Figs. 1 and 2, a computer has a CPU mounted on a main circuit board. To exchange the heat generated from the CPU 3, a first heat exchange container is attached to a top surface of the CPU 3. It is preferable that the first heat exchange container 4 has a wall with a shape corresponding to the top surface of the CPU 3. A second heat exchange container 6 is secured to and within a housing 1 of the PC. The second heat exchange container 6 is installed at a position higher than that of the first heat exchange container 4. Although it is depicted in Fig. 1 that the second heat exchange container 6 is attached to the rear portion of the computer, the present invention is not limited to this configuration. The container 6 may be secured to any other position where the heat is radiated effectively to the outside of the computer. The container 6 is coupled to a heat exchange surface for radiating the heat to the outside or surrounding of the computer.

A heat radiation fin structure 61 is attached to an outer surface of the second heat exchange container 6 so as to enlarge the surface area for heat exchange. The fin structure 61 has a plurality of fins. The fin structure may additionally have a heat conduction plate (not shown). The heat conduction plate is attached to the container 6. The heat conduction plate and fins can be manufactured integrally.

Fig. 1 shows that the housing has a hole and that a surface of the second heat exchange container 6 is exposed to the outside of the computer. Alternatively, in a modified embodiment, a second heat exchange container is secured to the inner surface of the housing not to be exposed to the outside of the computer. In this embodiment, the fin structure is mounted on the outer surface of the housing adjacent to the second heat exchange container. That is, the housing wall is interposed between the second heat exchange container and the fin structure. The housing is preferably constructed of a metal with a high heat conductivity. The fin structure may have an attachment area to the housing larger than that of the second heat exchange container, similarly to an embodiment depicted in Fig. 7.

Of course, the configuration of the housing without the fin structure may be used. In this case, the outer surface of the housing functions as a heat exchange surface for radiating the heat to the surrounding.

Referring to Figs. 1 and 2, the first and second heat exchange containers 4 and 6 are connected and communicate each other with a first tube 7 and a second tube 8. The first tube 7 and second tube 8 are connected to a side wall of the first heat exchange container 4. The first tube 7 and second tube 8 are connected to a bottom wall of the second heat exchange container 6. The heat is transferred from the CPU 3 to the first heat exchange container 4. The heat is then transferred to the outside of the housing 1 of the computer via the second heat exchange container 6. The tubes 7 and 8 can be constructed of metal, such as aluminum, copper and the like. It is found that the good cooling performance is achieved by using such the metal tube, when refrigerant of HCFC-123 is used.

Due to the configuration of the computer, the metal tube may cause an electrical problem, for example short. At this case, the tubes 7 and 8 may be constructed of high-density plastic resin. It is preferable that the material of the plastic resin tube is not soluble with the refrigerant and does not allow the refrigerant to permeate. A plastic resin tube, which is generally used in an air-conditioner or refrigerator, can be used.

Referring now to Figs. 1 and 12, a power supply 5 is secured at a rear portion of the housing 1. The power supply 5 has heat generating devices, such as a transformer PI, constant voltage IC P2 and the like. These heat generating devices PI and P2 are attached to a heat conduct plate 52 and finally connected to a heat radiating fin structure having a surface which is exposed to the outside of the computer. Due to the above configuration, it not necessary for the power supply 5 to have any conventional fan for cooling itself. In a modified embodiment, the power supply may be installed at a relatively low position.

In this embodiment, the heat generating elements are attached to a heat conduct plate. A first heat exchange container is secured to the plate. Alternatively, the device may be directly attached to the first heat exchange container.

Referring to Fig. 3 showing the inside configuration of the first heat exchange container 4, the first heat exchange container 4 has an outer wall 401 and an inner wall 41. The inner wall 41 has capillary construction. This capillary construction enlarges the surface area for heat transfer to provide a good heat exchange performance. The inner wall 41 with the capillary structure is manufactured by way of the sintering or powder metallurgy of copper powder.

Since the size of the first heat exchange container 4 may be limited by the size and location of the CPU or other adjacent parts, it is preferable that the surface area contacting to the refrigerant is enlarged. It is also preferable that the inner wall 41 covers the entire inner surface of the outer wall of the first heat exchange container 4 including a bottom wall contacting with the CPU 3. The refrigerant of liquid phase sink into the capillaries of the inner wall 41. This provides a good heat exchange. Instead of the sintered copper structure, the inner wall 41 is constructed of metal mesh or fabric.

The first heat exchange container 4 has an inlet formed on the container 4. The inlet 44 is connected to the first tube 7. The first heat exchange container 4 has an outlet 45 formed at a position higher than that of the inlet 44. The outlet 45 is connected to the second tube 8.

The outer wall 401 of the first heat exchange container 4 is preferably constructed of metal having a high heat conductivity, such as copper, aluminum and the like. Alternatively, the container may be configured so as to have a wall which is constructed of metal and a cover which is constructed of plastic resin such as nylon 6/6. In this case, the metal wall is contacted with the CPU.

As can be seen in Figs. 4 and 5, the second heat exchange container 6 has a heat conduct plate 601 and a cover 602. A plurality of fins 62 is mounted on the plate 601 in parallel to each other. The fins extend within the second heat exchange container 6. This configuration provides the enlarged area of the heat exchange surface to provide the good heat transfer. The fin structure 61 is attached to an outer surface of the heat conduct plate 601 to provide the enlarged area of the heat transfer to the surrounding of the computer. The fin structure 61 has a plurality of fins arranged in parallel each other. The heat conduct plate 601 of the second heat exchange container 6 and the fin structure 61 is preferably constructed of metal with the high heat conductivity. The cover 602 may be constructed of metal or plastic material such as nylon.

The second heat exchange container 6 has an outlet 63 formed on a bottom wall. The outlet 63 is connected to the first tube 7 so that the refrigerant of liquid phase flows out. The second heat exchange container 6 has an inlet 64 formed on the bottom wall. The second tube 8 extends through the inlet 64 to a position higher than the outlet 63. It is preferable that the end of the second tube 8 is higher than the level L of the refrigerant of liquid phase contained within the container 6. (See Fig. 5.)

The first heat exchange container 4 and second heat exchange container 6 are sealed to prevent leakage of the refrigerant or introduction of the air. To provide complete sealing of the containers 4 and 6, the wall and the cover of the containers 4 and 6 may be impregnated with plastic resin material, when required. The plastic material is preferably a kind of high-density plastic resin through which the refrigerant cannot permeate. In addition, the plastic material without chemical reaction with the refrigerant is preferably selected. The connecting portions of the tubes 7 and 8 to the containers 4 and 6 are sealed so that the refrigerant cannot leak and the air cannot be introduced. In Figs. 2 to 5, it is shown that the tubes 7 and 8 are directly coupled with the walls of the containers 4 and 6. Alternatively, conventional tube fittings can be used for coupling the tubes 7 and 8 with the walls of the containers 4 and 6 under the condition that the fittings provide good sealing. It is preferable that the refrigerant used in the present invention is not harmful for human body or dangerous. In addition, it is preferable that the refrigerant is hard to react chemically with the parts of the cooling system. A refrigerant of HCFC-123 is preferably used as the refrigerant of the present invention. HCFC-123 is available from Dupont in U.S. as the name of Suva 123. The container 4 or 6 has a valve for putting the refrigerant into the cooling system. Describing the putting process of the refrigerant, first, the containers 4 and 6 and the tubes 7 and 8 are connected and sealed to form an inner closed space isolated from the outside. Subsequently, the air is removed from the inner space via the valve. The refrigerant is then put into the inner space through the valve. As can be seen in Fig. 6, in order to prevent the overheat of the second heat exchange container 6 due to the sudden temperature rising of the surrounding, a fan 9 may be provided under the fin structure 61. The fan 9 has a switch 91, such as bimetal switch. The switch 91 drives the fan by turning on or off in pursuant to the temperature. The fan 9 can be small in comparison with a fan used in conventional cooling system of the computer. This is because of the heat radiation performance which is effectively enhanced by simply generating the airflow which passes around the fin structure. In addition, the configuration depicted in Fig. 6 is useful under the environment where the floating matters, such as dusts, are plentiful. Considering that the floating matters cannot be introduced within the computer, this configuration is also advantageous in comparison with the conventional cooling system. Referring to Figs. 1 and Fig. 5, the operation of the cooling system in accordance with the embodiment of the present invention will be discussed. The phase of the refrigerant is changed from liquid to gas or from gas to liquid by way of heat exchange accomplished within the containers of the cooling system according to the present invention. Due to density difference of the phases of the refrigerant and potential difference of the first heat exchange container 4 and second heat exchange container 6, the refrigerant is circulated as discussed in detail.

The heat is generated from the CPU 3. The heat is transferred to first heat exchange container 4 and then to the refrigerant in the capillary of the container 4. The phase of the refrigerant is changed from liquid to gas. The evaporated refrigerant gas flows through the second tube 8 to the second heat exchange container 6. The heat contained in the gaseous refrigerant within the second heat exchange container 6 is transferred to the outside of the computer via the heat conduct plate 601 and the fin structure 61. During this process, the phase of the refrigerant is changed from gas to liquid. The liquefied refrigerant is collected to a bottom portion of the second heat exchange container 6.

When the refrigerant is initially put into the inner space of the cooling system, volume of the refrigerant is controlled so that the level L of the refrigerant should not be higher than the intermediate of the second heat exchange container 6. If not, the heat exchange surface area may be insufficient. The liquefied refrigerant flows from the second heat exchange container 6 through the first tube 7 to the first heat exchange container 4 by way of gravity of the liquefied refrigerant.

Thus, the circulation of the refrigerant is completed. The returned liquid refrigerant is then changed into gas again by way of heat transfer from the CPU 3.

As above, the heat generated from the CPU 3 can be transferred to the outside of the computer. Thus, the temperature of the CPU 3 is maintained so that the CPU 3 operates properly. The temperature to be maintained can be controlled by varying the surface area of the fin structure. The surface area of the fin structure 61 may be decided through consideration of the temperature of the surrounding of the computer.

As depicted in Fig. 7, a first heat exchange container 4a in accordance with another embodiment has a plurality of heat exchange fins 42. The fins 42 are installed at a wall contacting to the CPU 3 to be arranged in parallel.

The heat exchange fins 42 have holes. The distal ends of the fins 42 are spaced from the opposing wall 49 of the container 4a. This configuration allows the refrigerant to flow well.

The first heat exchange container 4a has an inlet 44a connected with the first tube 7. The inlet 44a is formed on a side wall. The liquid refrigerant flows into the container 4a through the inlet

44a. The first heat exchange container 4a has an outlet 45a connected with the second tube 8.

The outlet 45a is formed on a top wall 49 opposing to the bottom wall contacting to the CPU.

The gaseous refrigerant flows out through the outlet 45a.

As shown in Figs. 8 and 9, a second heat exchange container 6a in accordance with a further embodiment has a plurality of fins 62a. The fins 62a installed within the container 6a to be arranged in parallel each other. The fins 62a provide the enlarged surface of heat exchange.

The container 6a has a heat conduct plate 66a. The heat conduct plate 66a expands beyond a cover of the container 6a. A fin structure 61a having a plurality of fins is mounted on the heat conduct plate 66a. The second heat exchange container 6a has an inlet 64a and an outlet 63a. The configuration of the inlet 64a, outlet 63a and the connecting structure of the tubes 7 and 8 are similar to the embodiment described above with reference to Fig. 6.

Figs. 10 and 11 depict a first heat exchange container 4b in accordance with a further another embodiment of the present invention. The first heat exchange container 4b can be attached to a CPU 3b installed on a main board arranged vertically. Alternatively, the first heat exchange container 4b can be also attached to a CPU installed on a main board arranged horizontally. That is, the first heat exchange container 4b depicted in Figs. 10 and 11 can be attached to the CPU having any orientation of the installation.

As show in Fig. 10, the first tube 7 and the second tube 8 is connected to the top wall the first heat exchange container 4b. The first heat exchange container 4b has a valve 46 for putting into the refrigerant. As described above, it is preferable that the air is removed from the inner space of the cooling system before the refrigerant is introduced through the valve 46.

Referring to Fig. 11, the first heat exchange container 4b has an oudet 44b connected to the second tube 8. This outlet 44b may have a slit shape. The first tube 7 extends beyond the top wall of the first heat exchange container 4b to the inside of the first heat exchange container 4b. Thus, a distal end 7b of the first tube 7 is lower than the outlet 44b, when the first heat exchange container 4b is mounted vertically as shown in Figs. 10 and 11.

The outlet 44b is offset from the first tube 7. Thus, even though the first heat exchange container 4b is installed horizontally so that the wall 402 contacting to the CPU becomes a bottom, the outlet 44b locates at a higher position than the end 71 of the first tube 7. The above configuration of the outlet 44b and the first tube 7 allows the first heat exchange container 4b to be applied even though the CPU is installed horizontally.

In the cooling system in accordance with the above embodiments, the heat generated from CPU 3 is transferred to the refrigerant in the first heat exchange container 4, 4a and 4b. The refrigerant is evaporated and flows toward the second heat exchange container 6 and 6a. The heat is transferred to the outside by way of heat transfer or radiation via the second heat exchange container 6 and 6a. The gaseous refrigerant is liquefied and flows downwardly toward the heat exchange container 4, 4a and 4b.

Thus, mechanically operated devices or apparatus are unnecessary in the cooling system in accordance with the present invention, which may cause undesirable noise sound. In addition, the introduction of the air within the computer is unnecessary in the cooling system in accordance with the present invention. Thus, the cooling system in accordance with the present invention avoids the introduction of humidity and floating matters, which may cause fatal influence to the devices such as electric elements, circuitry, disk drives or the like. Further, since mechanically operated devices or apparatus are unnecessary in the cooling system in accordance with the present invention, deterioration or disorder due to long time operation can be avoided. The cooling system in accordance with the present invention can be operated without the electrical power or energy supplied from the outside, the power consumption of the computer can be reduced. In the above embodiments, the cooling system is described to cool the CPU. It is understood, however, that the cooling system can cool any other devices. For example, the cooling system in accordance with the present invention may be used for cooling a hard disk drive mounted within the computer. The hard disk typically has a plurality of disks, mechanically operated parts, such as a disk drive motor, head mechanism or the like, and a circuit board. The circuit board has elements generating heat and typically disposed at the bottom portion of the hard disk drive. To apply the cooling system in accordance with the present invention to the hard disk drive, the hard disk drive has a heat conduct plate positioned under the circuit board. The heat conduct plate is constructed of metal with high heat conductivity such as aluminum or copper. The heat conduct plate covers entirely the bottom of the hard disk drive. Alternatively, the heat conduct plate may cover partially the bottom of the hard disk drive. The heat conduct plate may extends horizontally beyond a cover of the hard disk drive. A first heat exchange container is attached to the heat conduct plate.

The cooling system in accordance with the present invention may be used also for cooling devices within the power supply, as described above. In the above embodiments, it is described the cooling system having a single first heat exchange container and a single second heat exchange container which are connected each other. Alternatively, the cooling system may includes a single second heat exchange container and a plurality of the first heat exchange containers attached to the devices, such as a CPU, graphic board, elements in a power supply, a hard disk drive and the like. In addition, it should be understood that the cooling system has a plurality of the second heat exchange containers. A single or a plurality of the first heat exchange containers can be connected to each second heat exchange containers.

Although the invention has been shown and described with respect to the exemplary embodiments, it should be understood that various changes, modifications and additions might be made without departing from the spirit and scope of the invention.

Claims

1. A cooling system for transferring the heat generated from devices within a computer, the computer having a heat exchange surface exposed to the surrounding of the computer, the system comprising: a first heat exchange container coupled to the device so as to be capable of transferring the heat from the device to the first heat exchange container; a second heat exchange container coupled to the heat exchange surface so as to be capable of transferring the heat from the second heat exchange container to the heat exchange surface, and being disposed at a position higher than the first heat exchange container; a first tube and a second tube connecting between the first heat exchange container and the second heat exchange container; the first heat exchange container, second heat exchange container and tubes defining a inner closed space in which a refrigeration medium is contained; and whereby the cooling of the device is conducted by way of phase change and flow of the refrigeration medium.

2. The cooling system of Claim 1, wherein said heat exchange surface is an outer surface of a housing of the computer.

3. The cooling system of Claim 1 or 2, wherein said first heat exchange container has a heat transfer structure having the enlarged surface area.

4. The cooling system of Claim 3, wherein said heat transfer structure is a metal member having capillary structure.

5. The cooling system of Claim 3, wherein said heat transfer structure is constructed of a metal fabric or mesh.

6. The cooling system of Claim 3, wherein said heat transfer structure has a plurality of fins, the fins being attached to a wall contacting to the device of the computer in parallel each other.

7. The cooling system of anyone of Claims 1 to 6, wherein said first heat exchange container has a wall contacting to the device of the computer and a cover, the wall being constructed of metal and the cover being constructed of plastic material.

8. The cooling system of anyone of Claims 1 to 7, wherein said first heat exchange container has an inlet and an outlet; the first tube has an end extending into the first heat exchange container through the inlet of the first heat exchange container; the second tube communicates with the outlet; and the outlet of the first heat exchange container is disposed at a position higher than the end of the first tube.

9. The cooling system of Claim 1 or 2, wherein said second heat exchange container has a wall coupled with the heat exchange surface of the computer and a cover, the wall being constructed of metal and the cover being constructed of plastic material.

10. The cooling system of Claim 1 or 9, wherein said second heat exchange container has a heat transfer structure having an enlarged heat transfer surface within the second heat exchange container.

11. The cooling system of anyone of Claims 1, 2, and 8 to 10, wherein said second heat exchange container has an inlet and an outlet; the second tube has an end extending into the first heat exchange container through the inlet of the second heat exchange container; the first tube communicates with the outlet; and the end of the second tube is disposed at a position higher than the outlet of the second heat exchange container.

12. The cooling system of Claim 1 or 2, further comprising a heat transfer structure having the enlarged heat exchange surface area.

13. The cooling system of Claim 12, wherein said heat transfer structure has a fan device for causing the airflow around the heat transfer structure .

14. The cooling system of anyone of Claims 1, 2, 8 and 11, wherein said first and second tubes are constructed of metal.

15. The cooling system of anyone of Claims 1, 2, 8 and 11, wherein said first and second tubes are constructed of plastic material.

16. The cooling system of anyone of Claims 1 to 15, wherein said refrigeration medium is HCFC-123.

17. The cooling system of anyone of Claims 1 to 15, wherein said device of the computer is a CPU.

18. The cooling system of anyone of Claims 1 to 15, wherein said device of the computer is a hard disk drive, the hard disk drive having a mechanism, a circuitry disposed under the mechanism, and a heat conduct plate covering at least a portion of the circuitry; and wherein the first heat exchange container is coupled to the heat conduct plate.

19. The cooling system of anyone of Claim 1 to 15, wherein said device of the computer is an element within a power supply of the computer.

20. A computer having a heat exchange surface exposed to the surrounding, a device generating heat, and a cooling system for transferring the heat of the device via the heat exchange surface, wherein: said cooling system including: a first heat exchange container coupled to the device so as to be capable of transferring the heat from the device to the first heat exchange container; a second heat exchange container coupled to the heat exchange surface so as to be capable of transferring the heat from the second heat exchange container to the heat exchange surface, and being disposed at a position higher than the first heat exchange; a first tube and a second tube connecting between the first heat exchange container and the second heat exchange container; the first heat exchange container, second heat exchange container and tubes defining an inner closed space in which a refrigeration medium is contained; and whereby the cooling of the device is conducted by way of phase change and flow of the refrigeration medium.

21. The computer of Claim 20, further comprising a power supply including a heat generating element and a heat conduct plate to which the heat generating element is attached, and the heat conduct plate being connected to the heat exchange surface.

22. A power supply used in a computer with a heat exchange surface comprising: a device generating heat; a heat conduct plate to which the heat generating device is attached; and the heat conduct plate being connected to the heat exchange surface.

23. A hard disk drive comprising: a mechanism part; a circuitry disposed under the mechanism; and a heat conduct plate covering at least a portion of the circuitry.