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WO1999048139A3 - Appareil de reduction de perte de chaleur - Google Patents

Appareil de reduction de perte de chaleur Download PDF

Info

Publication number
WO1999048139A3
WO1999048139A3 PCT/US1999/003979 US9903979W WO9948139A3 WO 1999048139 A3 WO1999048139 A3 WO 1999048139A3 US 9903979 W US9903979 W US 9903979W WO 9948139 A3 WO9948139 A3 WO 9948139A3
Authority
WO
WIPO (PCT)
Prior art keywords
thermal cycling
heat loss
perimeter
heat exchanger
sensor
Prior art date
Application number
PCT/US1999/003979
Other languages
English (en)
Other versions
WO1999048139A2 (fr
Inventor
Charles D Shaper
Khalid El-Awady
Hooman Bolandi
Peter Knoot
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of WO1999048139A2 publication Critical patent/WO1999048139A2/fr
Publication of WO1999048139A3 publication Critical patent/WO1999048139A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Yarns And Mechanical Finishing Of Yarns Or Ropes (AREA)
  • Apparatus Associated With Microorganisms And Enzymes (AREA)

Abstract

L'invention concerne un appareil de réduction d'une perte de chaleur autour du périmètre d'un substrat de matière pendant un cycle thermique. L'appareil de réduction de perte de chaleur comprend un appareil périphérique destiné à entourer le substrat. L'appareil repose sur le même plan que le substrat de matière pendant le cycle thermique et peut être formé de la même matière que le substrat. En outre, l'appareil peut se composer d'une pièce unique continue ou de plusieurs pièces périphériques.
PCT/US1999/003979 1998-03-18 1999-02-23 Appareil de reduction de perte de chaleur WO1999048139A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US4422298A 1998-03-18 1998-03-18
US09/044,222 1998-03-18

Publications (2)

Publication Number Publication Date
WO1999048139A2 WO1999048139A2 (fr) 1999-09-23
WO1999048139A3 true WO1999048139A3 (fr) 2000-03-09

Family

ID=21931158

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1999/003979 WO1999048139A2 (fr) 1998-03-18 1999-02-23 Appareil de reduction de perte de chaleur

Country Status (1)

Country Link
WO (1) WO1999048139A2 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8047643B2 (en) * 2008-09-03 2011-11-01 Xerox Corporation Temperature sensor mount for melt plate

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5084671A (en) * 1987-09-02 1992-01-28 Tokyo Electron Limited Electric probing-test machine having a cooling system
US5184398A (en) * 1991-08-30 1993-02-09 Texas Instruments Incorporated In-situ real-time sheet resistance measurement method
JPH0637049A (ja) * 1992-07-17 1994-02-10 Oki Electric Ind Co Ltd プラズマエッチング装置
EP0644578A2 (fr) * 1993-09-16 1995-03-22 Hitachi, Ltd. Méthode de tenir un substrat et système pour tenir un substrat
EP0723141A1 (fr) * 1995-01-17 1996-07-24 Applied Materials, Inc. Capteurs pour mesurer une température et procédés pour mesurer la température d'une pièce à traiter
US5620560A (en) * 1994-10-05 1997-04-15 Tokyo Electron Limited Method and apparatus for heat-treating substrate
EP0821403A2 (fr) * 1996-07-24 1998-01-28 Applied Materials, Inc. Support d'une plaquette semi-conductrice à masse thermique en gradient
WO1998005060A1 (fr) * 1996-07-31 1998-02-05 The Board Of Trustees Of The Leland Stanford Junior University Module multizone a cycles thermiques de cuisson/refroidissement brusque
EP0915499A2 (fr) * 1997-11-05 1999-05-12 Tokyo Electron Limited Support pour plaquette semiconductrice et chambre de stockage pour plaquette semiconductrice

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5084671A (en) * 1987-09-02 1992-01-28 Tokyo Electron Limited Electric probing-test machine having a cooling system
US5184398A (en) * 1991-08-30 1993-02-09 Texas Instruments Incorporated In-situ real-time sheet resistance measurement method
JPH0637049A (ja) * 1992-07-17 1994-02-10 Oki Electric Ind Co Ltd プラズマエッチング装置
EP0644578A2 (fr) * 1993-09-16 1995-03-22 Hitachi, Ltd. Méthode de tenir un substrat et système pour tenir un substrat
US5620560A (en) * 1994-10-05 1997-04-15 Tokyo Electron Limited Method and apparatus for heat-treating substrate
EP0723141A1 (fr) * 1995-01-17 1996-07-24 Applied Materials, Inc. Capteurs pour mesurer une température et procédés pour mesurer la température d'une pièce à traiter
EP0821403A2 (fr) * 1996-07-24 1998-01-28 Applied Materials, Inc. Support d'une plaquette semi-conductrice à masse thermique en gradient
WO1998005060A1 (fr) * 1996-07-31 1998-02-05 The Board Of Trustees Of The Leland Stanford Junior University Module multizone a cycles thermiques de cuisson/refroidissement brusque
EP0915499A2 (fr) * 1997-11-05 1999-05-12 Tokyo Electron Limited Support pour plaquette semiconductrice et chambre de stockage pour plaquette semiconductrice

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 018, no. 252 (E - 1547) 13 May 1994 (1994-05-13) *

Also Published As

Publication number Publication date
WO1999048139A2 (fr) 1999-09-23

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