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WO1999015585A1 - Composition de resine durcissable pour isolant, et isolant - Google Patents

Composition de resine durcissable pour isolant, et isolant Download PDF

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Publication number
WO1999015585A1
WO1999015585A1 PCT/JP1998/004276 JP9804276W WO9915585A1 WO 1999015585 A1 WO1999015585 A1 WO 1999015585A1 JP 9804276 W JP9804276 W JP 9804276W WO 9915585 A1 WO9915585 A1 WO 9915585A1
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WO
WIPO (PCT)
Prior art keywords
curable resin
carbon
group
curable
cyclic olefin
Prior art date
Application number
PCT/JP1998/004276
Other languages
English (en)
Japanese (ja)
Inventor
Munekazu Satake
Masahito Inoue
Takao Saito
Tomoharu Nakano
Original Assignee
Sanyo Chemical Industries, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Chemical Industries, Ltd. filed Critical Sanyo Chemical Industries, Ltd.
Publication of WO1999015585A1 publication Critical patent/WO1999015585A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/06—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polyethers, polyoxymethylenes or polyacetals
    • C08F283/065—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polyethers, polyoxymethylenes or polyacetals on to unsaturated polyethers, polyoxymethylenes or polyacetals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/06—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polyethers, polyoxymethylenes or polyacetals
    • C08F283/08—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polyethers, polyoxymethylenes or polyacetals on to polyphenylene oxides
    • C08F283/085—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polyethers, polyoxymethylenes or polyacetals on to polyphenylene oxides on to unsaturated polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02—Homopolymers or copolymers of hydrocarbons
    • C08L25/04—Homopolymers or copolymers of styrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

Definitions

  • R 13 to R 21 each independently represent a hydrogen atom or an alkyl having 1 to 4 carbon atoms.
  • n represents an integer of 0 to 2.
  • a 6-membered ring may contain a carbon-carbon double bond.
  • R 22 to R 32 are each independently a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and n represents an integer of 0 to 2.
  • R 33 to R 36 are each independently a hydrogen atom or an alkyl having 1 to 4 carbon atoms.
  • Specific examples of the compound represented by the general formula (1) include, for example, 2-norporene, 1,4,5,8-dimethanone 1,2,3,4,4a, 5,8,8a 1,2,3,4,4a, 5,4-ethylidene hydronaphthalene, 5-ethylidene-1,2-norporene, 5-vinyl-2-norporene, 2-ethylidene 1,4,5,8 8, 8a-octahydronaphthalene and the like.
  • Specific examples of the compound represented by the general formula (2) include tetrahydroindene.
  • R 37 to R 44 each independently represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.
  • One of R 45 and R 46 represents an unsaturated hydrocarbon group having 2 to 4 carbon atoms, and the other represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.
  • R 37 to R 44 are preferably a hydrogen atom, a methyl group or an ethyl group.
  • No. One of R 45 and R 46 is preferably an ethylidene group or a vinylidene group, and the other is preferably a hydrogen atom, a methyl group or an ethyl group.
  • m is preferably 0 or 1 from the viewpoint of mechanical strength (tensile strength, tensile elongation, etc.).
  • Specific examples of the compound represented by the general formula (5) include, for example, 5-ethylidene-2-norbornene, 5-vinyl-2-norbornene, 2-ethylidene-1,4,5,8-dimetano 1, 2, 3, 4, 4a, 5, 8, 8a-octahydronaphthalene.
  • 5-ethylidene-2-norbornene and 2-ethylidene-1,4,5,8-dimethano-1,2,3,4,4a, 5,8,8a-octahydronaphthalene are preferred.
  • 5-ethylidene-12-norporene is more preferred.
  • the curable resin (A1) for the chloroplast in the present invention is at least one monomer selected from the group consisting of ⁇ -olefins having 2 to 20 carbon atoms, butadiene, cyclic olefins, styrene and (meth) acrylate.
  • This is a resin obtained by polymerizing the following. Specifically, for example, the following curable resins (All) to (A13).
  • Mono-curable resin A curable resin obtained by polymerizing butadiene and styrene.
  • the polymerization method of the anion polymerization may be a known method, and can be easily performed by using a polymerization initiator such as n-butyllithium.
  • the weight ratio of butadiene and styrene to be polymerized is usually 80 to 20 to 1Z99, preferably 70 to 30 to 1Z99. Further, a monomer of the third component such as (meth) acrylic acid ester may be copolymerized.
  • the number average molecular weight of the curable resin (AII) is usually from 2,000 to 100,000, preferably from 8,000 to 100,000.
  • the molecular weight per curable functional group in the curable resin (AII) is usually from 100 to 5,000, preferably from 100 to 3,000.
  • the resin thus obtained is thermoplastic and can be dissolved in hydrocarbon solvents such as toluene, decalin, and cyclohexane.
  • the curable resin (A 12) is selected from the group consisting of a cyclic olefin (al) having two or more carbon-carbon double bonds and a cyclic olefin (a 2) having one carbon-carbon double bond. Curable resin obtained by ring-opening polymerization of a cyclic olefin (a) having at least one carbon-carbon double bond.
  • Examples of the cyclic olefin (al) or (a 2) include, for example, the cyclic olefin (a 3) represented by the general formula (1) and the cyclic olefin (a 4) represented by the general formula (2) At least one member selected from the group consisting of, for example, a cyclic olefin (a 3) or (a 4) having two carbon-carbon double bonds as the cyclic olefin (al) The one having one carbon-carbon double bond can be selected as the cyclic olefin (a2).
  • the molecular weight per curable functional group in the curable resin (A12) is usually from 100 to 5,000, preferably from 100 to 3,000.
  • the curable resin (A13) is composed of ⁇ -olefin having 2 to 20 carbon atoms (b) and a cyclic olefin having two or more carbon-carbon double bonds (al), and optionally, carbon-carbon. It is a curable resin obtained by polymerizing a cyclic olefin (a 2) having one double bond.
  • Examples of the cyclic olefin (al) having two or more carbon-carbon double bonds that can be used here include the cyclic olefins represented by the aforementioned general formulas (3) to (5). .
  • the cyclic olefins having one carbon-carbon double bond (a 2) include, for example, cyclic olefins represented by the following general formula (6).
  • This curable resin (A13) can be obtained by the usual methods of thermal radical polymerization, photoradical polymerization, coordination anion polymerization with a zigzag-Natta catalyst, or coordination anion polymerization with a meta-mouth catalyst. .
  • it is obtained by a method of coordinating anion polymerization using a zirconate catalyst or a metallocene catalyst.
  • the ratio of (b) and (a1) is preferably from 90/10 to: L0Z90.
  • the curable resin (A13) in the present invention is obtained by polymerizing (b), (al) and (a2), the ⁇ -refined (b) and (cyclic) in (A13)
  • the weight ratio (b) / [(a1) + (& 2>) of the sum of the olefin (a 1) and the cyclic olefin (a 2)] is preferably 90 10 to 10 90, more preferably 70Z3. If the blending amount of ⁇ -olefin (b) is less than 10, the mechanical strength (tensile elongation and tensile strength) of the resin after hardening is remarkably reduced. If it exceeds, the heat resistance is significantly reduced.
  • the weight ratio (a 1) / (a 2) of the cyclic olefin (a 1) and the cyclic olefin (a 2) is preferably 70 to 30 or less from the viewpoint of heat resistance, and the mechanical strength of the resin after curing. From the viewpoint of (tensile elongation and tensile strength), 10 to 90 or more is preferable, and therefore 70/30 to: L0 to 90 is preferable. More preferably, it is from 45 to 55 to 90.
  • the resin thus obtained is thermoplastic and can be dissolved in a hydrocarbon-based solvent such as toluene, decalin, and cyclohexane.
  • a second invention of the present invention is a polyphenylene having at least one curable functional group.
  • the curable resin for insulators (A2) which is an ether resin, wherein at least one of the curable functional groups is a hydrocarbon group having a carbon-carbon double bond.
  • the curable resin (A2) is produced, for example, by subjecting a polyphenylene ether-based resin (A2 ') as a raw material to a graft reaction with a monomer having two hydrocarbon groups having a carbon-carbon double bond. can do.
  • the curable resin (A1) is the curable resin described in the first aspect of the present invention, and the curable resin (A 2) is a curable resin that is suitable for the present invention.
  • the radical polymerization initiator ( ⁇ ) known thermal radical polymerization initiators, photoradical polymerization initiators, and these can be used in combination.
  • a thermal radical initiator is used among these radical polymerization initiators, the half-life temperature of 10 hours is usually at least 80, preferably at least 120, from the viewpoint of storage stability. It is.
  • Specific examples of such an initiator include, for example, t_butylperoxyacetate, t-butylperoxybenzoate, dicumylperoxide, t-butylcumylperoxide, 2,5-dimethyl- 2,5-di (t-butylvinyloxy) hexine-3, cumenehydride baroxide and the like.
  • radical polymerization initiators specific examples include benzoin alkyl ether, benzyldimethyl ketone, 1-hydroxycyclyl hexyl phenyl ketone, 2-hydroxy-12-methyl-1 —Phenylpropan-1-one, benzophenone, methylbenzoylformate, isopropylthioxanthone, and a mixture of two or more thereof.
  • a sensitizer can be used together with these photoradical initiators.
  • sensitizers include carbonyl compounds such as anthraquinone, 1,2-naphthoquinone, 1,4-naphthoquinone, benzanthrone, p, p'-tetramethyldiaminobenzozophenone, chloranil, nitrobenzene, p-dinitrobenzene, 2 Nitro compounds such as 12-fluorofluorene, aromatic hydrocarbons such as anthracene and chrysene, sulfur compounds such as diphenyl disulphide, nitroaline, 2-chloro-1-4-nitroaline, 5-nitro Examples thereof include nitrogen compounds such as 12-aminotoluene and tetracyanoethylene.
  • carbonyl compounds such as anthraquinone, 1,2-naphthoquinone, 1,4-naphthoquinone, benzanthrone, p, p'-tetramethyldiaminobenzozophenone, chloranil, nitro
  • the amount of the radical polymerization initiator used in the composition is usually 0 to 5% by weight. Preferably it is 0.01 to 4% by weight, more preferably 0.05 to 3% by weight. Use of more than 5% by weight has no effect of further improving the polymerization rate, and is uneconomical.
  • crosslinking agents (C), (meth) acrylates specifically, for example, alkyl (meth) acrylates such as ethyl methacrylate and propyl acrylate (the alkyl group has 1 to 1 carbon atoms) 18); Alkylene glycol (meth) acrylates such as methoxy-ethylene glycol monomethacrylate and ethylene glycol diacrylate; esters of phenol or ethylene oxide adduct of phenol with (meth) acrylic acid : Esters of polyhydric alcohols having 3 to 6 or more valences such as pentaerythritol (meth) acrylates, trimethylolpropane (meth) acrylates, etc. with (meth) acrylic acid. It is.
  • alkyl (meth) acrylates such as ethyl methacrylate and propyl acrylate (the alkyl group has 1 to 1 carbon atoms) 18
  • Alkylene glycol (meth) acrylates such as methoxy
  • crosslinking agents (C) can be used alone or in combination of two or more.
  • the curable resin ( ⁇ ) of the present invention itself is an unsaturated hydrocarbon having at least one carbon-carbon double bond, a part thereof may act as a crosslinking agent and react, Separately, it is desirable to use a crosslinking agent (C) from the viewpoint of physical properties such as heat resistance.
  • fillers such as glass fiber, calcium carbonate, and fluororesin beads can also be used as a mixture.
  • the mechanical properties tensile elongation and tensile strength
  • a method for improving mechanical properties there is a method such as adding glass fiber or carbon fiber.However, these methods have a disadvantage of adversely affecting the dielectric constant.
  • resin (A) is used in combination with polyolefin rubber, an insulator having excellent mechanical properties (tensile elongation and tensile strength) and dielectric constant can be obtained without adversely affecting the dielectric constant.
  • the curable resin composition (D) of the present invention may be a solution of the curable resin composition as a use form. This can be achieved by blending a predetermined component into a solution obtained by subjecting the curable resin (A) of the present invention to solution polymerization or a product obtained by performing bulk polymerization and then dissolving in a solvent. Solvent and No particular limitation is imposed on the solvent as long as it can dissolve the curable resin (A) and the polymerization initiator (B).
  • toluene, xylene, ethylbenzene, trimethylbenzene, chlorobenzene, Decalin, pentane, hexane, cyclohexane, heptane, tetralin, methylcyclohexane, diethylene glycol dimethyl ether and the like can be used.
  • the curable resin composition (D) of the present invention may be formed into a film or a pellet.
  • a solution obtained by previously dissolving the curable resin composition (D) in a solvent eg, hydrocarbons such as cyclohexane, toluene, and pentane
  • a support film such as PE, PP, PET, and fluororesin. It is obtained by coating on top and removing the solvent by drying.
  • the thickness of the film is not particularly limited, it is generally 10 to 500 m, preferably 10 to 70 m, and more preferably 10 to 30 m.
  • the pellets can be obtained, for example, by subjecting the curable resin composition (D) to injection molding or extrusion molding into a rod shape by a general method, and then cutting it into a pellet shape.
  • the average particle size of the pellets is not particularly limited, but is usually 0.1 to 2 mm, preferably 0.1 to 0.5 mm.
  • the insulator of the present invention can be obtained by curing the curable resin composition (D) by radical polymerization. It is preferably an insulator having a cured Tg of 130 or more. If T g is less than 130, heat resistance will decrease.
  • the dielectric constant of the insulator of the present invention is preferably 3.0 or less.
  • This green body can be obtained by subjecting the curable resin composition (D) of the third invention to, if necessary, a drying prebaking or the like, followed by heating and curing or light irradiation to polymerize. this At this time, heat resistance and solvent resistance are imparted.
  • Insulators obtained by radical polymerization of the curable resin composition (D) of the present invention include, for example, electronic devices such as semiconductor devices, light emitting diodes, and various memories, hybrid ICs, MCMs, printed circuit boards, and display devices. It is used as an overcoat material for parts, etc. or as an interlayer insulating material.
  • an insulating thin film obtained is usually water absorption 1% 0.1 or less, the dielectric constant of the insulation resistance 10 15 ⁇ 10 17 QZcm, 1 MH z, dielectric loss tangent, respectively from 2.2 to 3.0, 0 It is about 000 1 to 0.01, and has lower water absorption and better electrical insulation such as low dielectric constant than the conventionally used insulating materials such as epoxy resin and polyimide resin.
  • a polyimide resin generally has a dielectric constant of 3.5 or more and a water absorption of 1% or more, compared with a thin film interlayer insulating film formed of the insulator of the present invention.
  • the following polymerization was performed in a glove box replaced with nitrogen.
  • 100 g of hexane was charged into a 50-Om 1 four-necked flask equipped with a stirrer and a temperature controller, and the temperature was adjusted to -20 with stirring.
  • a hexane solution of n-butyllithium (catalyst concentration 2. Ommo 1) was charged there.
  • Butadiene (35 g) was gradually dropped over 60 minutes, and then aged for 60 minutes. Further, styrene (65 g) was added dropwise over 60 minutes, and then aged for 120 minutes.
  • the reaction product is added dropwise to 3 kg of isobucobanol while stirring, and the precipitate is distilled under a reduced pressure of 1 OO: and 1 OmmHg in a reduced pressure drier to obtain a crosslinking agent of the present invention.
  • 15 g of a polymer (B-1) was obtained.
  • the number average molecular weight was 2500.
  • One part by weight of oxide (“Park Mill H” manufactured by NOF Corporation) was dissolved in 100 parts by weight of hexane.
  • the obtained resin composition solution was applied using a bar coater onto a board having copper wiring formed on a 0.5 mm thick glass filler-containing epoxy board, and dried at 100 for 60 minutes. After polymerization for 1 hour at 180 ° C., an overcoat film having a thickness of 30 was obtained.
  • Example 2 Polymerization was performed using the solution of the resin composition described above, a sample was prepared according to JIS K6911, and electrical characteristics (dielectric constant, dielectric loss tangent, insulation resistance) were measured. Further, Tg was measured by the DSC method. In addition, the film thickness of the overlap described in the examples was measured at 10 points, and the maximum and minimum values were shown. Table 1 shows the results.
  • Example 2
  • hexane solution of getyl aluminum chloride (catalyst concentration 0.2 mmo 1)
  • hexane solution of oxy 3 vanadium chloride catalyst concentration 0.02 mrno 1
  • 30 g of dicyclopentadiene 55 g of norbornene and 15 g of 1-hexene were charged and polymerized for 120 minutes.
  • Example 8 50 parts by weight of the copolymer (A-4) obtained in the same manner as in Example 5 was dissolved in 50 parts by weight of hexane. This solution was coated on a PET film having a thickness of 25 jtm and dried at 80 for 30 minutes. This film was thermocompression-bonded on the same substrate as in Example 1 under the conditions of 12 O, 4 kg weight / cm 2 , and only the PET film was peeled off. When this was polymerized at 180 for 1 hour, an overcoat film having a thickness of 30 ⁇ m was obtained. Evaluation was performed in the same manner as in Example 1. The results are shown in Table 1. Example 8
  • Example 5 50 parts by weight of the copolymer (A-5) obtained in the same manner as in Example 6 was dissolved in 50 parts by weight of hexane. The solution was coated on a 25 Atm thick PET film and dried at 80 for 30 minutes. This film was thermocompression-bonded on the same substrate as in Example 1 under the conditions of 12 Ot, 4 kg weight, Zcm 2 , and only the PET film was peeled off. When this was polymerized at 18 Ot: for 1 hour, an overcoat film having a thickness of 30 / xm was obtained. Evaluation was performed in the same manner as in Example 1. The results are shown in Table 1.
  • Example 9 2.3 0.0009 1 50 21 to 43 Comparative Example 1 3.8 0.0100 200 24 to 38
  • the insulating layers obtained in Examples 1 to 9 of the present invention are excellent in electrical properties such as dielectric constant and dielectric loss tangent.
  • the glass transition temperature (Tg) is sufficiently high and the heat resistance is excellent.
  • Comparative Example 1 only those having poor electrical characteristics were obtained.
  • Example 11 10 g of the copolymer (A-7) obtained in Example 11 was dissolved in 90 g of toluene and charged in the same apparatus as in Example 10. To this, 0.05 g of Raney nickel catalyst was added, and hydrogen was bubbled through the liquid at a rate of 1 LZmin for 180 minutes. The solution was filtered through a 200-mesh wire gauze, dropped into 2 kg of methanol with stirring, and the precipitate was distilled off in a vacuum dryer at 80 under a reduced pressure of 1 OmmHg. Thus, 9 g of a hydrogenated copolymer (A-8) was obtained. IR confirmed that 50% of the double bonds had disappeared.
  • Example 13 99 parts by weight of this copolymer and 1 part by weight of cumene hydroperoxide were dissolved in 300 parts by weight of toluene. When this solution was applied and polymerized in the same manner as in Example 1, an overcoat film having a thickness of 30 ⁇ was obtained. Evaluation was performed in the same manner as in Example 1. The results are shown in Table 2.
  • Example 13 99 parts by weight of this copolymer and 1 part by weight of cumene hydroperoxide were dissolved in 300 parts by weight of toluene. When this solution was applied and polymerized in the same manner as in Example 1, an overcoat film having a thickness of 30 ⁇ was obtained. Evaluation was performed in the same manner as in Example 1. The results are shown in Table 2. Example 13
  • Example 2 80 parts by weight of the polymer (A-6) obtained in Example 10, 19 parts by weight of liquid polybutadiene and 1 part by weight of cumene hydroperoxide were dissolved in 300 parts by weight of toluene. When this solution was applied and polymerized in the same manner as in Example 1, an overcoat film having a thickness of 30 m was obtained. Evaluation was performed in the same manner as in Example 1. The results are shown in Table 2.
  • Example 1 0 2.4 0.0009 210 350 1 Example 1 1 2.3 0.0006 200 450 3 Example 1 2 2.3 0.0005 190 480 4 Example 1 3 2.3 0.0006 1 70 700 8 Comparative example 2 2. 4 0.0018 135 420 4
  • the insulating layers obtained in Examples 10 to 13 of the present invention have excellent electrical properties such as dielectric constant and dielectric loss tangent, and also have excellent heat resistance due to sufficiently high Tg. In addition, it can be seen that in Example 13 in which the polyolefin rubber was added, the mechanical properties were also improved. In Comparative Example 2, the dielectric loss tangent and T g are insufficient. Industrial applicability
  • the insulator obtained by subjecting the curable resin composition of the present invention to radical polymerization has excellent heat resistance, solvent resistance, low water absorption, electrical insulation, low dielectric constant, adhesion, chemical resistance, workability, and the like.
  • a thin film can be formed.
  • it is suitable for a curable resin composition and an insulator constituting an overcoat material or an interlayer insulating material used for a circuit board used for various electric devices, electronic components, and semiconductor elements.
  • the curable resin composition and the insulator of the present invention are not limited to the use in the technical field as described above, and have excellent heat resistance, solvent resistance, low water absorption, and electrical insulation as described above. Utilizing properties such as low dielectric constant and chemical resistance, it can be used in various fields, and it is an excellent material that can be used especially for forming thin films.

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)

Abstract

L'invention concerne une composition de résine durcissable utilisable comme revêtement ou dans un revêtement, ou bien comme isolant entre laminés ou dans cet isolant, s'agissant des circuits imprimés. Ladite composition (D) pour isolants comprend (A1) une résine durcissable obtenue par polymérisation d'au moins un monomère choisi parmi le groupe dans lequel on trouve les alpha-oléfines C2-20, le butadiène, les cyclo-oléfines, le styrène et les méth(acrylates) et ayant au moins une double liaison carbone-carbone et/ou (A2) une résine d'éther de polyphénylène comportant au moins une double liaison carbone-carbone, (B) un initiateur de polymérisation radicalaire, et (C) au moins un élément choisi parmi le groupe des agents de réticulation ayant chacun une double liaison carbone-carbone. La composition peut former une fine pellicule isolante offrant d'excellentes caractéristiques dans les domaines suivants: résistance thermique, résistance aux solvants, isolation électrique, adhésion serrée, résistance chimique, aptitude au traitement, etc., moyennant une réduction de l'absorption d'eau et de la permettivité.
PCT/JP1998/004276 1997-09-24 1998-09-24 Composition de resine durcissable pour isolant, et isolant WO1999015585A1 (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP9/278074 1997-09-24
JP27807497 1997-09-24
JP9/331110 1997-11-13
JP33111097 1997-11-13
JP10858498 1998-04-03
JP10/108584 1998-04-03

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002030167A1 (fr) * 2000-09-29 2002-04-11 Zeon Corporation Procede de fabrication d'un substrat de circuit
WO2002059176A1 (fr) * 2001-01-25 2002-08-01 Sanyo Chemical Industries, Ltd Resine durcissable, matiere resineuse durcissable, pellicule durcissable et isolant electrique
WO2003020780A1 (fr) * 2001-08-30 2003-03-13 General Electric Company Copolymeres tridimensionnels de resines de polyphenylene ether et de resines styreniques
WO2019026839A1 (fr) * 2017-08-01 2019-02-07 ポリプラスチックス株式会社 Copolymère et procédé de production de copolymère

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JPH04175320A (ja) * 1990-11-08 1992-06-23 Mitsui Petrochem Ind Ltd オレフィン系重合体組成物
JPH05505833A (ja) * 1990-02-14 1993-08-26 エルフ　アトケム　ソシエテ　アノニム 官能性多元ブロックマクロモノマーと、その製造方法

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JPH05505833A (ja) * 1990-02-14 1993-08-26 エルフ　アトケム　ソシエテ　アノニム 官能性多元ブロックマクロモノマーと、その製造方法
JPH0491110A (ja) * 1990-08-07 1992-03-24 Asahi Chem Ind Co Ltd オーバーコート材
JPH04175320A (ja) * 1990-11-08 1992-06-23 Mitsui Petrochem Ind Ltd オレフィン系重合体組成物

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002030167A1 (fr) * 2000-09-29 2002-04-11 Zeon Corporation Procede de fabrication d'un substrat de circuit
WO2002059176A1 (fr) * 2001-01-25 2002-08-01 Sanyo Chemical Industries, Ltd Resine durcissable, matiere resineuse durcissable, pellicule durcissable et isolant electrique
WO2003020780A1 (fr) * 2001-08-30 2003-03-13 General Electric Company Copolymeres tridimensionnels de resines de polyphenylene ether et de resines styreniques
WO2019026839A1 (fr) * 2017-08-01 2019-02-07 ポリプラスチックス株式会社 Copolymère et procédé de production de copolymère
JP6491804B1 (ja) * 2017-08-01 2019-03-27 ポリプラスチックス株式会社 共重合体及び共重合体の製造方法

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