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WO2001071865A1 - Module laser - Google Patents

Module laser Download PDF

Info

Publication number
WO2001071865A1
WO2001071865A1 PCT/DE2001/001066 DE0101066W WO0171865A1 WO 2001071865 A1 WO2001071865 A1 WO 2001071865A1 DE 0101066 W DE0101066 W DE 0101066W WO 0171865 A1 WO0171865 A1 WO 0171865A1
Authority
WO
WIPO (PCT)
Prior art keywords
laser
optical axis
laser module
coupling lens
lens
Prior art date
Application number
PCT/DE2001/001066
Other languages
German (de)
English (en)
Inventor
Franz Auracher
Original Assignee
Infineon Technologies Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies Ag filed Critical Infineon Technologies Ag
Publication of WO2001071865A1 publication Critical patent/WO2001071865A1/fr

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02251—Out-coupling of light using optical fibres
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4207—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms with optical elements reducing the sensitivity to optical feedback
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4226—Positioning means for moving the elements into alignment, e.g. alignment screws, deformation of the mount
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4237—Welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
    • H01S5/0064—Anti-reflection components, e.g. optical isolators

Definitions

  • the present invention relates to a laser module that can be used in optoelectronic communication systems.
  • Optical transmit and receive modules are often constructed as so-called coax modules.
  • an optoelectronic component is used as the transmitting and receiving unit, which in preferred embodiments is mounted on a carrier together with control components.
  • FIG. 1 an exemplary arrangement is shown in cross section.
  • a laser diode LD is attached to the carrier T, the radiation S of which is arranged in a suitable manner
  • Reflectors R as shown are once passed through a lens L in order to be coupled into a transmission system and on the other hand directed into a monitor diode MD so that the radiation power can be regulated and stabilized by means of a suitable feedback.
  • This arrangement is shown in an oblique plan view in FIG. 2, in which it can also be seen that the reflectors R can be formed by mirrored glass prisms or by ground or etched and mirrored silicon bodies, with the crystal lattice structure of the silicon being suitably aligned.
  • Such a transmitting or receiving component 2, as shown in FIG. 1, is also referred to in the arrangement shown there as a “laser submount”.
  • This laser submount is placed in a housing of a coaxial laser module or TO- The entire basic structure of such a module is shown in cross section in the attached FIG.
  • the transmitting or receiving component 2 is arranged in a housing 21, in which it is fastened in the position provided on the module base, for. B. is glued on.
  • the radiation generated, for example, by the laser diode passes through a window of the housing and enters a cylindrical intermediate piece 14 in order to be coupled into a glass fiber 18.
  • a photodiode can be present as the receiving component.
  • the beam path is then aligned in the same way, but oriented opposite to the arrow shown in FIG. 3.
  • an optical isolator 13 is often inserted into the beam path, here in the interior of the cylindrical intermediate piece 14, in order to suppress undesirable effects of reflected laser light on the laser.
  • Such an optical isolator essentially consists of a Faraday rotator between a linear polarizer and an analyzer. With this arrangement it is achieved that the light is linearly polarized and then the polarization direction is rotated by 45 °. After an undesired reflection and passing through the analyzer and the rotator again, the polarization direction of this reflected light is oriented at right angles to the transmission direction of the polarizer, so that the radiation is shielded by the polarizer.
  • a further lens 15, shown as a spherical lens in FIG. 3, can be fitted in the intermediate piece 14 in front of the glass fiber 18.
  • the glass fiber 18 is arranged in a capillary 17 of a flange 16, onto which a kink protection 19 is pushed. This flange
  • modules of this type have been used for applications in the low-cost range, typically for data rates of less than 1 Gbit / s and shorter transmission distances.
  • this structure technology for much higher data rates (up to 10 Gbit / s) in the low-cost range.
  • the components are operated with a suitable adaptation circuit.
  • butterfly housings on Peltier coolers coax laser modules are used for optical WDM transmission systems.
  • a higher optical output power and thus a higher coupling efficiency are often required than can be achieved with a conventional construction of the module.
  • the object of the present invention is to provide a laser module which, with a simple structure, enables a high coupling efficiency and is particularly suitable for the transmission of high data rates and / or longer transmission distances.
  • an optimally adjusted coupling lens preferably an aspherical lens
  • the laser radiation emitted by the laser diode is collimated on the optical axis of the laser module or focused on a point or a short section of the optical axis.
  • the coupling lens used according to the invention is a component of the laser module which is mounted independently of a laser submount or a laser chip and can therefore be selected such that it has a high numerical aperture and good optical imaging properties which are etched into a silicon subcarrier Lens are not accessible.
  • the coupling lens is adjusted in the longitudinal direction of the laser beam and transversely thereto, so that the optical axis (typically axis of symmetry) of the coupling lens corresponds as closely as possible to the intended optical axis of the laser beam.
  • the optical axis of the laser beam in the laser module is defined by the position of the intended coupling of an external waveguide to the laser module.
  • the coupling lens is adjusted during assembly. ge of the laser module before the moving parts of the arrangement permanently z. B. be fixed by welding.
  • FIG. 1 shows a cross section of a laser submount according to the prior art described at the outset.
  • FIG. 2 shows the arrangement of FIG. 1 in an oblique plan view without an integrated lens.
  • FIG. 3 shows a cross section of a coax laser module from the prior art described at the beginning.
  • FIG. 4 shows an example of a laser module according to the invention.
  • FIG. 4 shows, as an example of a laser module according to the invention, a cross section of a coax laser module in which a laser chip mounting housing 2 (usually referred to as a laser submount) with a laser diode is located on a carrier 1 (TO carrier).
  • a laser chip mounting housing 2 usually referred to as a laser submount
  • TO carrier carrier 1
  • the laser module can also be constructed using a laser chip with a laser diode on a conventional - len subcarrier be constructed without radiation deflection.
  • Carrier 1 is then designed such that the subcarrier with the laser chip can be mounted perpendicular to the bottom of the carrier, so that the laser beam is emitted parallel to the optical axis OA of the laser module.
  • the component of the laser module provided with the laser diode has no integrated lens and can therefore have the structure shown in FIG. 2 in the example of a laser chip mounting housing.
  • This Housing has an intermediate ring 4 and a preferably cylindrical focusing element 5, in which the coupling lens 6 is inserted.
  • the coupling lens can be provided with its own holder 61 with which it is fastened in the focusing element 5.
  • the coupling lens 6 can instead be inserted directly into the focusing element 5.
  • a lens system ie a suitable combination of lenses, as is known per se from a large number of optical instruments, can be used as the coupling lens 6.
  • the coupling lens 6 is mounted so close to the laser diode that the emitted laser radiation is collimated on the optical axis OA of the laser module or is focused on a waveguide to be coupled (in particular a glass fiber).
  • An optical isolator 7, which is not absolutely necessary and which serves to avoid the effects of reflected laser light on the laser diode and has already been described above, can, as shown in FIG. 4, be arranged in the focusing element 5 in the beam path behind the coupling lens 6 or be mounted in the housing part 8 ,
  • This housing part 8 serves to mechanically stabilize the arrangement and to accommodate a further lens 9, which is not absolutely necessary but simplifies the coupling of an external waveguide, which is shown here as a spherical lens.
  • a spherical lens instead of a spherical lens, another lens shape or a lens system can be selected.
  • the housing part 8 can be omitted.
  • a glass fiber is used as the external waveguide, which is connected by means of a flange 10 for receiving the glass fiber or a connector.
  • the coupling lens does not have to be attached to a part of the laser module which can be displaced in the longitudinal direction of the optical axis.
  • the coupling lens is mounted in a part which is adjustable transversely to the direction of the laser radiation and which is in turn arranged on or in a further part which can be adjusted in the longitudinal direction of the laser radiation.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

Selon l'invention, une lentille de couplage (6) montée indépendamment d'une embase de laser (2), et présentant une ouverture numérique élevée et de bonnes propriétés de reproduction, collimate ou focalise le rayonnement laser émis par la diode laser sur l'axe optique (OA) du module laser. La lentille de couplage est orientée d'un certain angle par rapport à l'axe optique au moyen d'un anneau intermédiaire (4) du boîtier, et dans le sens longitudinal de l'axe optique au moyen d'un élément de focalisation (5) logé dans l'anneau intermédiaire, de manière que l'axe optique (typiquement l'axe de symétrie) de la lentille de couplage corresponde le plus précisément possible à l'axe optique du module laser.
PCT/DE2001/001066 2000-03-21 2001-03-20 Module laser WO2001071865A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10013932A DE10013932A1 (de) 2000-03-21 2000-03-21 Lasermodul
DE10013932.9 2000-03-21

Publications (1)

Publication Number Publication Date
WO2001071865A1 true WO2001071865A1 (fr) 2001-09-27

Family

ID=7635738

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2001/001066 WO2001071865A1 (fr) 2000-03-21 2001-03-20 Module laser

Country Status (2)

Country Link
DE (1) DE10013932A1 (fr)
WO (1) WO2001071865A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7639155B2 (en) 2001-07-13 2009-12-29 Simu Method for transmitter and receiver matching

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011079942A1 (fr) 2009-12-28 2011-07-07 Hyperion Core, Inc. Optimisation de boucles et de sections de circulation de données
EP2591422A1 (fr) 2010-07-09 2013-05-15 Martin Vorbach Dispositif et procédé de traitement de données
US20140351563A1 (en) 2011-12-16 2014-11-27 Hyperion Core Inc. Advanced processor architecture
CN214957798U (zh) * 2021-04-15 2021-11-30 王子硕 一种预防疲劳驾驶激光发射装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5783081A (en) * 1980-11-10 1982-05-24 Nippon Telegr & Teleph Corp <Ntt> Semiconductor laser module for single mode optical fiber
JPS6319609A (ja) * 1986-07-14 1988-01-27 Oki Electric Ind Co Ltd 光結合器
DE3705408C1 (en) * 1987-02-20 1988-08-11 Ant Nachrichtentech Device for optically coupling an element which emits light to an element which receives light
EP0345874A1 (fr) * 1988-06-06 1989-12-13 Koninklijke Philips Electronics N.V. Dispositif opto-électrique muni d'un accouplement entre une fibre de transmission optique et une diode laser semiconductrice
EP0455939A2 (fr) * 1990-05-07 1991-11-13 Corning Incorporated Méthode et module pour le couplage d'une diode émettrice de lumière
JPH04116508A (ja) * 1990-09-07 1992-04-17 Nec Corp 半導体レーザモジユール

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4022076A1 (de) * 1990-07-10 1992-01-16 Siemens Ag Vorrichtung zur uebertragung von licht
US5537503A (en) * 1993-10-25 1996-07-16 Matsushita Electric Industrial Co., Ltd. Optical semiconductor module and method of fabricating the same
JPH10332990A (ja) * 1997-05-28 1998-12-18 Asahi Optical Co Ltd 発光素子と光ファイバーのカップリング構造

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5783081A (en) * 1980-11-10 1982-05-24 Nippon Telegr & Teleph Corp <Ntt> Semiconductor laser module for single mode optical fiber
JPS6319609A (ja) * 1986-07-14 1988-01-27 Oki Electric Ind Co Ltd 光結合器
DE3705408C1 (en) * 1987-02-20 1988-08-11 Ant Nachrichtentech Device for optically coupling an element which emits light to an element which receives light
EP0345874A1 (fr) * 1988-06-06 1989-12-13 Koninklijke Philips Electronics N.V. Dispositif opto-électrique muni d'un accouplement entre une fibre de transmission optique et une diode laser semiconductrice
EP0455939A2 (fr) * 1990-05-07 1991-11-13 Corning Incorporated Méthode et module pour le couplage d'une diode émettrice de lumière
JPH04116508A (ja) * 1990-09-07 1992-04-17 Nec Corp 半導体レーザモジユール

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 006, no. 164 (E - 127) 27 August 1982 (1982-08-27) *
PATENT ABSTRACTS OF JAPAN vol. 012, no. 226 (P - 722) 28 June 1988 (1988-06-28) *
PATENT ABSTRACTS OF JAPAN vol. 016, no. 371 (P - 1399) 10 August 1992 (1992-08-10) *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7639155B2 (en) 2001-07-13 2009-12-29 Simu Method for transmitter and receiver matching

Also Published As

Publication number Publication date
DE10013932A1 (de) 2001-10-04

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