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WO2001073844A1 - Module d'eclairage - Google Patents

Module d'eclairage Download PDF

Info

Publication number
WO2001073844A1
WO2001073844A1 PCT/EP2001/001948 EP0101948W WO0173844A1 WO 2001073844 A1 WO2001073844 A1 WO 2001073844A1 EP 0101948 W EP0101948 W EP 0101948W WO 0173844 A1 WO0173844 A1 WO 0173844A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductor tracks
light
carrier
module according
emitting diodes
Prior art date
Application number
PCT/EP2001/001948
Other languages
German (de)
English (en)
Inventor
Johannes Hackl
Michael Waldner
Thomas Scharfenberger
Original Assignee
Gebr. Swoboda Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gebr. Swoboda Gmbh filed Critical Gebr. Swoboda Gmbh
Publication of WO2001073844A1 publication Critical patent/WO2001073844A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/13—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H10H20/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape

Definitions

  • the invention relates to a luminaire module as a component for luminaires, with a carrier consisting of conductor tracks and insulating carrier material and with light-emitting diodes which are electrically connected to the conductor tracks.
  • Luminaire modules are already known in which light-emitting diodes are on one
  • Printed circuit boards are mounted, with printed conductors applied to the printed circuit board used for the electrical connection of the light-emitting diodes to an external power supply.
  • Such lamp modules are used in particular for the production of lamps for motor vehicles.
  • the luminance of known luminaire modules is limited by their ability to dissipate the heat generated in the light-emitting diodes.
  • the object of the invention is to provide a luminaire module that is inexpensive to manufacture with a simple structure and is improved with regard to the heat to be dissipated.
  • the invention solves the problem in that the conductor tracks have a material thickness and radiation area suitable for dissipating and radiating the heat generated in the light-emitting diodes. This simple measure allows the heat generated to be dissipated without additional cooling plates or similar devices.
  • the conductor tracks must be provided anyway for the electrical connection of the light-emitting diodes to a current source. Your design according to the invention requires no additional components and does not cause any significant additional costs. so that the lamp module according to the invention is simple and inexpensive to manufacture.
  • the conductor tracks have a material thickness of 0.1 mm to 0.8 mm, preferably 0.5 mm. With such a material thickness, the heat generated in the light-emitting diodes is generated by the Effectively derived conductor tracks.
  • the material thickness according to the invention is far above that of conductor tracks on ordinary printed circuit boards, the maximum thickness of which is limited to approximately 0.035 mm.
  • the conductor tracks have one or more sections serving as a radiation surface with dimensions of several mm to several cm. Such dimensions can be produced without any special additional effort. They significantly improve the radiation behavior and therefore contribute to cooling the luminaire module. Known conductor tracks on printed circuit boards usually do not have such dimensions.
  • the conductor tracks are punched out of a sheet of suitable thickness. This measure is particularly useful given the required strength. Conductor tracks on printed circuit boards cannot be produced in the thickness according to the invention.
  • the carrier material is brought into the required shape and at the same time firmly connected to the conductor tracks. If the carrier material is also still elastic, the resulting luminaire module can be bent into the desired shape or adapted to the specified shape of a luminaire housing. This is not possible with the known luminaire modules because the circuit boards used there do not have sufficient elasticity.
  • the carrier can also consist of a plastic frame that is connected to the conductor tracks e.g. is connected by riveting, gluing or locking.
  • the carrier material consist of a thermally conductive plastic.
  • the luminaire module according to the invention can be further improved by providing the carrier on its rear side facing away from the light-emitting diodes with molded anchor pins for fastening the luminaire module to a luminaire housing.
  • anchor pins can be integrally molded onto the carrier material during the extrusion coating of the conductor tracks without additional work steps being required.
  • required fasteners would have to be attached to the printed circuit board in the known light modules, which causes additional work steps and costs.
  • the luminaire module can be improved with regard to improved heat dissipation by providing the carrier with a cooling plate on its rear side facing away from the light-emitting diodes.
  • the heat sink can be overmolded in the same step without any additional effort when overmolding the conductor tracks.
  • a modified embodiment of the lamp module provides that, starting from the front side of the carrier provided with the light-emitting diodes, at least one conductor track is bent in a U-shape around a side edge of the carrier and extends as a cooling plate over at least part of the rear side of the carrier.
  • the conductor track provided for cooling is formed in one piece on the front of the lamp module and the cooling plate provided for additional cooling on the rear of the lamp module. A special attachment of the cooling plate on the back is therefore not absolutely necessary, but can still be provided if necessary.
  • a preferred embodiment of the lamp module provides that the carrier is designed essentially in the form of a rectangle and the light-emitting diodes are arranged essentially in a row.
  • Such strip-shaped lamp modules with a row of light-emitting diodes only require two relatively easily designed conductor tracks that extend on both sides of the row of light emitting diodes over the length of the rectangle.
  • Most common lamp shapes can be assembled from the strip-shaped lamp modules.
  • the conductor tracks terminate at least on one narrow side of the carrier in one or more connecting pins which project laterally beyond the carrier material. This measure makes connection pins available without an additional work step, because the connection pins are produced without further effort when the conductor tracks are punched out. In contrast, special pins are to be attached to the circuit board in an additional step in known luminaire modules.
  • Luminaire modules in which the conductor track is connected to the light-emitting diodes by soldering can be further improved by providing an embossed notch between the area of the soldering point and the further course of the conductor track as a flow stop for the liquid solder.
  • solder has a tendency to spread over as large an area of the conductor track as possible. However, only the wetting of the area around the soldering point is desired. In order to prevent the solder from wetting other areas of the conductor track, it is known to cover the areas of the conductor track that are not to be wetted by a lacquer or a plastic coating. However, an additional operation is required to apply the lacquer, which increases the manufacturing costs.
  • the notch provided as a flow stop in the invention can be stamped in a simple manner when punching out the conductor track, without a special working step being necessary for this.
  • Another possibility is to simultaneously carry out a plastic coating that serves as a flow stop when the plastic is molded onto the conductor tracks.
  • the invention also includes a method for producing the luminaire module described above, which comprises the following method steps:
  • the conductor tracks are punched out of a metal sheet, leaving connecting webs for the preliminary mechanical connection of the conductor tracks.
  • the conductor tracks are partially extrusion-coated with plastic, thus creating a permanent mechanical connection between the conductor tracks, the conductor tracks remaining completely or partially free of plastic on the side provided for fastening the light-emitting diodes.
  • the connecting steps are removed, preferably by stamping, and the light-emitting diodes are attached to the conductor tracks, preferably soldered.
  • the invention also includes a method in which the connecting webs are removed after the light-emitting diodes have been attached.
  • the connecting webs initially ensure that the conductor tracks that are necessarily separated in the finished luminaire module are held together so that their later position is fixed to one another.
  • the temporary connecting webs can be removed, since the plastic as the carrier material now ensures a mechanical connection of the conductor tracks.
  • the conductor tracks must be free of plastic, at least in certain areas, so that they can come into electrical contact with the light-emitting diodes to be fastened thereon. As a rule, the heat radiation behavior of the conductor tracks is better, the larger the area uncovered by plastic.
  • the manufacturing method according to the invention is well suited on the one hand for the production of a lighting module according to the invention and on the other hand consists of a few simple process steps.
  • Known manufacturing methods for known lighting modules are not suitable for manufacturing the lighting modules according to the invention. This applies in particular to the Printed circuit board technology, which is unsuitable for producing the thick conductor tracks according to the invention.
  • the method according to the invention can be supplemented by a further method step in which the lamp modules are subsequently brought into a predetermined shape by bending.
  • conventional luminaire elements the variety of shapes of the luminaires to be equipped with them is limited, because the circuit boards of the luminaire elements cannot be bent significantly.
  • the present invention allows any curved surface elements to be produced which should be used in particular in exotic lamp shapes, for example designer lamps.
  • the light-emitting diodes are attached to the conductor tracks by SMD soldering technology, the conductor tracks first being provided with a solder paste, then being fitted with the light-emitting diodes, and the actual soldering being carried out by subsequently introducing the lamp module into a melting furnace.
  • SMD soldering technology allows the light-emitting diodes to be attached to the conductor track surface from one side without a hole to the other side or soldering on the other side being required. This is particularly advantageous here because the back of the conductor tracks is overmolded with plastic and is therefore difficult to access.
  • the manufacturing process can be improved even further by the fact that when the conductor tracks are encapsulated with plastic from the carrier material, anchor pins are formed for fastening the lamp module in a lamp housing. In this way, the anchor pins can be generated without a special process step.
  • the conductor tracks have lateral tabs which are bent over a side edge of the carrier and serve as fastening anchors for fastening the light module.
  • the notches in FIG. 5, which are intended as a flow stop for liquid solder, can be formed in the conductor tracks when the conductor tracks are punched out, without an additional operation being necessary. This has a particularly favorable effect on the manufacturing costs.
  • the transport strips according to the invention allow the conductor tracks or the semi-finished luminaire modules to be easily transported through the various processing stations, with the fitting and adjustment of the objects to be treated being incredibly simple in the work stations. In an equally incredibly simple way, the transport strips are removed in the last working step when punching out the connecting webs, without additional effort being required for this.
  • the conductor tracks consist of several metal clips. This advantageously achieves that
  • Luminaire modules of any length with any number of LEDs can be manufactured. With conventional manufacturing methods, it was previously necessary to produce special punching tools for the production of luminaire modules of different lengths for each luminaire module. The associated costs and the loss of time in the production changeover are enormous. Because the conductor tracks can be assembled from several, usually similarly constructed, metal clips, it is possible to assemble the required conductor track length from several metal clips. Only a few punching tools are required for the different design of the metal clips. Theoretically, it is conceivable that the conductor tracks are assembled from identical metal clips, which results in a further reduction in the investment volume.
  • the carrier has indentations for receiving the metal clips. This measure ensures that the metal clips are exactly fixed in position after being applied to the carrier.
  • the indentations in the carrier are injected directly during the production of the carrier.
  • the carrier has connecting lugs. The metal clips are attached to the carrier during production. The connecting lugs additionally fix the metal clips and serve as an attachment aid.
  • the metal clips have fastening openings. Some of the fastening openings serve to receive the connecting lugs of the carrier, as a result of which the metal clips are additionally fixed on the carrier. It is provided that the connecting lugs are melted after the metal clips have been applied, so that the metal clips can no longer slide off the support even in the event of strong vibrations. This measure is necessary because the finished light modules are used in vehicles.
  • the carrier has openings, which are preferably congruent with at least some fastening openings in the metal brackets, it is possible to apply the finished luminaire module to any surface that has corresponding projections.
  • the carriers with the openings are advantageously placed on projections with a snap lock. This ensures that the carrier is fixed on the mounting surface.
  • the light-emitting diodes can be supplied with electrical energy
  • one light-emitting diode is connected in an electrically conductive manner to at least two metal clips.
  • An advantageous embodiment provides that the metal webs for dissipating and radiating the heat generated in the light-emitting diodes are punched out of a sheet of suitable material thickness. With this simple measure, the heat generated can not only be given off with the aid of the conductor tracks. The entire radiator area is significantly enlarged by the special design of the metal bars.
  • the metal webs have a material thickness of 0.1 mm to 0.8 mm, preferably 0.5 mm. This results in an effective heat release to the environment.
  • the light-emitting diodes are connected in series on one carrier half and the carrier halves are connected in parallel to one another. For example, it is possible to supply eight LEDs on a carrier with a voltage supply of 12 volts.
  • the invention also includes a further method for producing the prescribed lighting module, which comprises the following method steps:
  • the metal clips are punched out of a sheet.
  • the metal bars are also punched out of " a sheet.
  • the carrier is made of plastic, preferably injection molded.
  • the metal bars and the metal clips are applied to the carrier in such a way that an electrically conductive connection is created between certain metal clips and metal bars.
  • the LEDs are attached to the metal clips.
  • the method according to the invention makes it possible for the first time to produce luminaire modules of any length without having to produce expensive punching tools. As a result, it is possible to react to certain manufacturer specifications very quickly and inexpensively. If, for example, a very long lamp module is required, only a corresponding plastic carrier has to be injection molded. However, metal clips with the same dimensions as the metal clips of shorter luminaire modules can be used. By lining up the metal brackets and establishing an electrical connection between certain metal brackets and metal bars, a luminaire module of any length is created. Which metal clips are electrically connected to which metal webs depends on the desired electrical circuit of the lamp module. This process enables the manufacture of luminaire modules in a very simple manner with very few process steps.
  • the metal clips are applied to the carrier by laterally pushing prestressed metal clips.
  • the already clamped metal clips improve the fixation of the metal clips on the carrier.
  • the preloading of the metafl clamps can be done by a simple bending process. The preload is to be selected so that the metal clips adhere to the carrier due to the preload.
  • An advantageous embodiment of the method provides that the metal clips are applied by sliding them on and pressing them on, combined with at least one-sided heating, of the metal clips.
  • the metal clips do not necessarily have to be prestressed.
  • the pressing serves to fix the metal clips on the carrier.
  • the at least one-sided heating of the metal clips ensures that the carrier material located under the metal clip melts This creates an undercut with simultaneous pressing, thereby improving the adhesion of the metal clips to the carrier.
  • connection lugs can be melted simultaneously with the at least one-sided heating of the metal plates during the slide-on process.
  • the light-emitting diodes are attached to the metal clamps by soldering technology, for example SMD soldering technology, the metal clamps first being provided with a solder paste, then being equipped with the light-emitting diodes and the actual soldering being carried out by subsequently introducing the light module in a melting furnace.
  • soldering technology for example SMD soldering technology
  • the metal clamps first being provided with a solder paste, then being equipped with the light-emitting diodes and the actual soldering being carried out by subsequently introducing the light module in a melting furnace.
  • the SMD soldering technology allows the light-emitting diodes to be attached to the metal plates from one side without having to drill to the other side or soldering on the other side. This is of particular advantage here because the back of the metal plate rests on the carrier and is therefore difficult to access.
  • the light-emitting diodes are soldered to the metal clips in the same process step as the metal bars to the metal clips.
  • the required solder paste is applied in one work step and then soldered in a soldering oven. This saves production time.
  • Figure 1 is a perspective view of an inventive
  • Luminaire module with a view of the front
  • Figure 2 the same lamp module with a view of the back
  • Figure 3 an intermediate product in the manufacture of the invention
  • Luminaire module namely a sheet metal strip, from which two lateral perforated transport strips and the conductor tracks are already punched out;
  • Figure 4 is a view of another intermediate, in which the
  • Conductor tracks are equipped with LEDs and overmolded with plastic; • - -.
  • FIG. 5 two views of the lamp modules, made up of several
  • FIG. 6 a detailed representation of the lamp module from metal brackets in
  • FIG. 7 a detailed representation of the lamp module from metal brackets in
  • the luminaire module according to the invention shown in FIG. 1 has two essentially strip-shaped conductor tracks 1, 2, which extend over the entire length of the essentially rectangular luminaire module.
  • the conductor tracks 1, 2 are held together mechanically by a carrier material 3.
  • Conductor tracks 1, 2 and the carrier material 3 together form a carrier 4 for four light-emitting diodes 5, which are arranged in a row on the front side of the lamp module shown in FIG. 1 and are fastened to the conductor tracks 1, 2 by soldering.
  • the light-emitting diodes are fastened using SMD soldering technology, in which the conductor tracks 1, 2 are first provided with a solder paste, then with the light-emitting diodes 5 equipped and then heated by the infrared radiation of a melting furnace, not shown, so that the solder paste melts and connect to the conductor tracks 1, 2 on the one hand and the connection contacts 6, 7 of the LEDs 5 on the other.
  • SMD soldering technology in which the conductor tracks 1, 2 are first provided with a solder paste, then with the light-emitting diodes 5 equipped and then heated by the infrared radiation of a melting furnace, not shown, so that the solder paste melts and connect to the conductor tracks 1, 2 on the one hand and the connection contacts 6, 7 of the LEDs 5 on the other.
  • soldering methods such as vapor phase soldering, can also be used.
  • the conductor tracks 1, 2 have a material thickness 8 of 0.5 mm, as a result of which they absorb the heat generated in the LEDs 5 during operation and can dissipate them particularly well. The heat is therefore rapidly distributed over relatively large areas of the conductor tracks 1, 2.
  • the conductor tracks 1, 2 have relatively large surfaces with dimensions 9, which are in the range between a few mm and cm. A typical width 9 of a conductor track 1, 2 is approximately 1 cm. Because of the large areas, the heat derived from the conductor tracks 1, 2 can be effectively emitted to the environment by radiation.
  • the conductor tracks 1, 2 thus serve not only to supply power to the light-emitting diodes 5, but also as a radiator to radiate the waste heat.
  • the side of the conductor tracks 1, 2 provided with the light-emitting diodes 5 remains free for better heat radiation.
  • the conductor tracks 1, 2 are encapsulated by the carrier material 3 only from the rear.
  • the conductor tracks 1, 2 protrude beyond the narrow sides 10, 11 of the lamp module and form projections 14, 15 which are used to fasten the
  • Luminaire module are determined in a lamp, not shown.
  • the projection 14 is provided with three even further projecting connection pins 16, which serve for the electrical connection of the conductor track 1. The same applies to the two projecting connection pins 17 of the projection 15 with respect to the conductor track 2.
  • the carrier 4 of the lamp module is provided on its rear side with four anchor pins 18 which are molded into the carrier material 3.
  • the anchor pins 18 also serve to attach the Luminaire module in a lamp, not shown, and are intended to snap into corresponding openings in the lamp housing. Bent tabs 12 of the conductor tracks 1, 2 have the same function.
  • the carrier material 3 consists of a thermally particularly conductive plastic, which is also elastic. This makes it possible to bend the luminaire module to remove it from its essentially strip-shaped straight basic shape
  • a method according to the invention for producing the luminaire module described above begins with the production of the conductor tracks 1, 2, which are punched out from an “endless” sheet metal strip.
  • the conductor tracks 1, 2 are also provisionally connected to one another with a plurality of connecting webs 22 in order to provide a mechanical one
  • the connecting webs 22 are removed in a later process step, as a result of which the conductor tracks 1, 2 are separated electrically but also mechanically.
  • the pairs of conductor tracks 1, 2 connected by the transport strips 20, 21 to form a chain are moved by means of the transport strips 20, 21 through the further processing stations which are in the. individual are not shown here, transported.
  • the conductor tracks 1, 2 are extrusion-coated with a plastic serving as carrier material 3.
  • a permanent mechanical connection is established between the conductor tracks 1, 2.
  • the side of the conductor tracks 1, 2 provided for the assembly with the light-emitting diodes 5 remains free of plastic.
  • the state of manufacture after the overmolding of the conductor tracks 1, 2 with the carrier material 3 is shown.
  • the notches 23 are embossed into the conductor tracks 1, 2 during the first stamping process. They serve as a flow stop for the liquid solder in the subsequent work step.
  • the conductor tracks 1, 2 are equipped with the light-emitting diodes 5 and these are soldered on.
  • the associated production state is shown in the upper part of Figure 4.
  • the connecting webs 22 between the printed circuit boards 1, 2 are then punched out in a further processing station, not shown, and the transport strips 20, 21 are removed.
  • Two modified conductor tracks 24, 25 differ from the above-mentioned conductor tracks 1, 2 in that they have lateral extensions 26, 27 which extend into the otherwise free spaces between successive ones
  • the extensions 26, 27 are designed in one piece with the modified conductor tracks 24, 25 and are produced together with these in the first stamping process. They serve as additional cooling plates for the rear of the finished luminaire module.
  • the further production takes place essentially as already described, but is followed by a further work step after the work steps described above, which consists in bending the extensions 26, 27 in accordance with the arrows 28, 29 shown in FIG. 3, so that they cover the back of the lamp module.
  • This embodiment has the advantage that the heat generated in the LEDs 5 from the conductor tracks 24, 25 not only on the front of the
  • Luminaire module but is also emitted on the back.
  • the cooling effect can be significantly improved.
  • Another improvement The cooling effect could be that the rear extensions 26, 27 of the conductor tracks 24, 25 are in thermal contact with the luminaire housing and thus effective heat dissipation can take place.
  • the conductor tracks 1, 2 are composed of a plurality of metal clips 30.
  • the metal clips have different configurations in this exemplary embodiment.
  • the metal clips 30 are applied to a carrier 4 made of plastic.
  • the metal plates have openings 31. Connection lugs 32 of the carrier 4 are partially passed through these openings 31. This results in the metal clips 30 being fixed on the carrier 4.
  • FIG. 6 shows a top view of a lamp module according to the invention.
  • indentations 33 can be clearly seen on the carrier 4. These serve to hold the metal clips 30 and ensure that the metal clips 30 are adequately fixed on the carrier 4.
  • the carrier also has 4 openings 34.
  • openings 34 are congruent with some openings 31 on the metal plates 30. They serve to accommodate protrusions on surfaces on which the finished luminaire modules are attached.
  • projections, not shown, with snap locks is expedient in order to make it simple
  • the metal clips 30 are applied to the carrier 4 by being pushed laterally.
  • a possible variant is that the metal clips 30 a
  • Link tabs penetrate some openings 31 in the metal plate.
  • An undercut is produced by heating the metal clips 30 on at least one side.
  • the connecting tabs can be melted by heating after the metal plates have been pushed on. As a result, the metal clips 30 are fixed on the carrier 4.
  • the metal clips are connected to one another in an electrically conductive manner. Which metal clips are connected to which metal bars depends on the desired electrical circuit. All possible variations are conceivable.
  • the metal webs have a material thickness of 0.5 mm. They therefore not only serve to conduct the electrical current but at the same time act as a radiator for dissipating the heat generated during the operation of the light-emitting diodes 5.
  • the light-emitting diodes 5 are electrically conductively connected to at least two metal clips 30.
  • the light-emitting diodes 5 are attached to the metal clips 30, for example, by SMD soldering technology.
  • solder paste for fastening the metal bars 35 and the light-emitting diodes 5 is applied with great advantage in one working step, whereupon the light-emitting diodes 5 are soldered together with metal clips 30 and metal bars 35 with metal clips 30 in one process step.
  • FIG. 7 shows the lamp module from FIG. 6 from the bottom view.
  • the openings 31 in the metal clips 30 can also be clearly seen here.
  • the metal webs 35 are applied to the carrier 4 in the bottom view shown in FIG.
  • a heating of the underside of the metal clamps 30 shown here is not provided when the metal clamps 30 are pushed onto the carrier 4, since an undercut on the underside of the carrier 4 is not desirable, since this side should lie as flat as possible on the fastening surface.

Landscapes

  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

L'invention concerne un module d'éclairage conçu comme élément de luminaire et comportant un support (4), constitué de pistes conductrices (1, 2) et d'un matériau support (3) isolant, et des diodes électroluminescentes (5), reliées électriquement aux pistes conductrices (1, 2). L'invention vise à évacuer de manière efficace la chaleur des diodes électroluminescentes, afin d'augmenter la luminance. A cet effet, les pistes conductrices (1, 2) ont une épaisseur de matériau (8) et une surface de rayonnement suffisantes pour évacuer et dissiper la chaleur générée dans les diodes électroluminescentes (5).
PCT/EP2001/001948 2000-03-24 2001-02-21 Module d'eclairage WO2001073844A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10014804.2 2000-03-24
DE10014804A DE10014804A1 (de) 2000-03-24 2000-03-24 Leuchtenmodul

Publications (1)

Publication Number Publication Date
WO2001073844A1 true WO2001073844A1 (fr) 2001-10-04

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Application Number Title Priority Date Filing Date
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DE (1) DE10014804A1 (fr)
WO (1) WO2001073844A1 (fr)

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US7414269B2 (en) 2003-05-30 2008-08-19 Osram Opto Semiconductors Gmbh Housing for a radiation-emitting component, method for the production thereof, and radiation-emitting component
US8210715B2 (en) 2009-12-09 2012-07-03 Tyco Electronics Corporation Socket assembly with a thermal management structure
US8235549B2 (en) 2009-12-09 2012-08-07 Tyco Electronics Corporation Solid state lighting assembly
US8241044B2 (en) 2009-12-09 2012-08-14 Tyco Electronics Corporation LED socket assembly
DE202012005899U1 (de) * 2012-06-16 2013-09-17 Ruco-Licht Gmbh Beleuchtungsvorrichtung
US8568001B2 (en) 2012-02-03 2013-10-29 Tyco Electronics Corporation LED socket assembly
CN103672802A (zh) * 2012-09-20 2014-03-26 欧司朗有限公司 用于制造发光装置的方法
WO2014063975A1 (fr) * 2012-10-24 2014-05-01 Osram Gmbh Dispositif d'éclairage pourvu d'un corps de refroidissement et au moins d'une source lumineuse semi-conductrice
US8845130B2 (en) 2009-12-09 2014-09-30 Tyco Electronics Corporation LED socket assembly
US8878454B2 (en) 2009-12-09 2014-11-04 Tyco Electronics Corporation Solid state lighting system
CN104197281A (zh) * 2014-07-25 2014-12-10 厦门市瀚锋光电科技有限公司 一种布光均匀的光源
US9249955B2 (en) 2011-09-26 2016-02-02 Ideal Industries, Inc. Device for securing a source of LED light to a heat sink surface
US9423119B2 (en) 2011-09-26 2016-08-23 Ideal Industries, Inc. Device for securing a source of LED light to a heat sink surface
US9429309B2 (en) 2011-09-26 2016-08-30 Ideal Industries, Inc. Device for securing a source of LED light to a heat sink surface

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