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WO2003010070A1 - Recipient - Google Patents

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Publication number
WO2003010070A1
WO2003010070A1 PCT/SG2001/000157 SG0100157W WO03010070A1 WO 2003010070 A1 WO2003010070 A1 WO 2003010070A1 SG 0100157 W SG0100157 W SG 0100157W WO 03010070 A1 WO03010070 A1 WO 03010070A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic device
container according
container
holding
tubular member
Prior art date
Application number
PCT/SG2001/000157
Other languages
English (en)
Other versions
WO2003010070A8 (fr
Inventor
Najib Khan Surattee
Original Assignee
Infineon Technologies Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies Ag filed Critical Infineon Technologies Ag
Priority to PCT/SG2001/000157 priority Critical patent/WO2003010070A1/fr
Publication of WO2003010070A1 publication Critical patent/WO2003010070A1/fr
Publication of WO2003010070A8 publication Critical patent/WO2003010070A8/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders

Definitions

  • the invention relates to a container, and especially a container for holding electronic devices.
  • quad flat plastic (QFP) packages are normally stored in open trays which are stacked on top of each other, or in recesses in a plastic molded tape wound into a reel, for storage and transportation.
  • QFP quad flat plastic
  • a container for an electronic device comprises a tubular member and a holding member, the holding member comprising a holding section adapted to receive an electronic device, and the holding member being adapted to be inserted into the tubular member when an electronic device is located in the holding section, in use.
  • a method of packaging an electronic device comprising locating an electronic device in a holding section of a holding member and inserting the holding member and electronic device into a tubular member.
  • the container further comprises blocking means to block the ends of the tubular member; at least one of the blocking means being removable from the tubular member.
  • the tubular member includes an engagement portion, which engages with a surface of an electronic device located in the holding section, when the holding member is inserted into the tubular member.
  • the holding member comprises a number of holding sections.
  • each holding section is adapted to receive one electronic device.
  • the holding member is elongate and the holding sections may be arranged in a one-dimensional array.
  • the electronic device is a semiconductor device, which may be encapsulated in a non-conductive material, such as a plastic material.
  • the semiconductor device may be of a type known as a quad flat plastic (QFP) package and can be a thin quad flat plastic (TQFP) package or a matrix quad flat plastic (MQFP) package.
  • QFP quad flat plastic
  • TQFP thin quad flat plastic
  • MQFP matrix quad flat plastic
  • the holding section includes support means to support the electronic device such that the electrical contacts of the electronic device are not in contact with the holding member.
  • the support means comprises a raised portion, which engages with the electronic device when the electronic device is inserted into the holding section.
  • the support means engages with the electrically insulating material.
  • the container is resistant to temperatures of at least 150°C for up to 24 hours or more.
  • the tubular member may comprise a substantially transparent portion and preferably, the transparent portion comprises the engagement portion, or a section of the engagement portion of the tubular member.
  • the holding section comp ⁇ ses recesses formed in the holding member and may be formed, for example, by molding of the holding member.
  • the holding member may be formed from a plastic material.
  • the surfaces of the tubular member and the holding member are sufficiently electrically conducting to minimise the retention of a static electrical charge on the surfaces.
  • Figure 1 is a perspective view of a tube
  • Figure 2 is a perspective view of a carrier
  • Figure 3 is a plan view of the carrier
  • Figure 4 is a cross-sectional view of the carrier along the line AA of Figure 3;
  • Figure 5 is an enlarged cross-sectional view of a holding section of the carrier with a QFP package located in the holding section.
  • Figure 1 shows a tube 1 which includes a transparent window section 2 which extends along the length of the tube 1.
  • the tube 1 includes a contact portion 3 on the internal section of the transparent window 2 which extends inwardly towards the center of the tube 1.
  • a pair of inwardly extending flanges 6, 7 which define a recess 8.
  • the tube 1 is manufactured from a modified PVC material, has electrically dissipative surfaces and is designed to be temperature resistant when exposed to temperatures of at least 150°C for up to 24 hours.
  • Figures 2 to 4 show a carrier 10 which is typically manufactured from black, dissipative polystyrene and is again designed to be temperature resistant when exposed to temperatures of up to at least 150°C for up to 24 hours.
  • the carrier 10 includes a number of holding sections in the form of molded recesses 11 located between opposite side flanges 12, 13. Each of the recesses 11 includes a raised section 14, which has an upwardly extending nib
  • the tube 1 and the carrier 10 in this example are designed to hold a QFP package and the dimensions of the tube 1 and carrier 10 are chosen accordingly.
  • Figure 5 shows a QFP package 20 located in a recess 11 on the carrier 10.
  • the QFP package 20 includes an encapsulated molded resin body 21 , in which is located a semiconductor chip (not shown) and electrical contact leads 22 extend from the molded resin body 21.
  • the molded resin body 21 has a lower surface 23 and an upper surface 25.
  • the lower surface 23 rests on the raised portion 14 and the nibs 15 engage with side walls 24 of the molded resin body 21.
  • the QFP package 20 is supported by the raised section 14 and nibs 15 such that the electrical contact leads 22 do not contact the carrier 10.
  • the nibs 15 prevent the QFP package 20 moving from side to side within the recess 11.
  • a QFP package 20 is inserted into each recess 11 in the carrier 10.
  • the side flanges 12, 13 of the carrier 10 are then engaged with the recesses 8 in the tube 1 , such that the upper surface 25 of the QFP package 20 faces towards the contact portion 3, and the carrier 10 is slid into the tube 1 with the flanges 12, 13 of the carrier 10 sliding within the recesses 8 defined by the flanges 6, 7.
  • the contact portion 3 is designed so that when the carrier 10 is inserted into the tube 1 with QFP packages 20 located in the recesses 11, the contact portion 3 contacts the surface 25 of the QFP packages 20 to prevent the QFP packages 20 moving upwardly off the raised portion 14 and the nibs 15.
  • the QFP packages 20 are held in position in the recesses 11 by the combination of the contact portion 3, the raised portion 14 and the nibs 15 which minimise movement of the QFP packages 20 within the recesses 11.
  • stoppers may be inserted into each end of the tube 1 to prevent or minimise movement of the carrier 10 within the tube 1 and to prevent the carrier 10 inadvertently sliding out of the tube 1 during transportation and handling.
  • An advantage of the invention is that it provides a more robust container for electronic devices and in particular, semiconductor devices such as QFP packages, than the conventional systems which use open trays or reels.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

L'invention concerne un récipient pour dispositif électronique (20) comportant un élément tubulaire (1) et un élément de retenue (10). Ledit élément de retenue (10) comporte une section de retenue (11) conçue pour recevoir un dispositif électronique (20), l'élément de retenue étant conçu pour s'insérer dans l'élément tubulaire (1) lorsque le dispositif électronique (20) se situe dans la section de retenue (11), à l'emploi.
PCT/SG2001/000157 2001-07-24 2001-07-24 Recipient WO2003010070A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/SG2001/000157 WO2003010070A1 (fr) 2001-07-24 2001-07-24 Recipient

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/SG2001/000157 WO2003010070A1 (fr) 2001-07-24 2001-07-24 Recipient

Publications (2)

Publication Number Publication Date
WO2003010070A1 true WO2003010070A1 (fr) 2003-02-06
WO2003010070A8 WO2003010070A8 (fr) 2004-04-22

Family

ID=20428973

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/SG2001/000157 WO2003010070A1 (fr) 2001-07-24 2001-07-24 Recipient

Country Status (1)

Country Link
WO (1) WO2003010070A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04173579A (ja) * 1990-10-23 1992-06-22 Fujitsu Ltd 半導体装置の梱包ケース
JPH04327166A (ja) * 1991-04-24 1992-11-16 Sony Corp プラスチック製収納器
JPH04339782A (ja) * 1991-05-02 1992-11-26 Hitachi Ltd マガジン
JPH07132990A (ja) * 1993-11-04 1995-05-23 Toyo Jushi Kk エンボステープ等の収納具

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04173579A (ja) * 1990-10-23 1992-06-22 Fujitsu Ltd 半導体装置の梱包ケース
JPH04327166A (ja) * 1991-04-24 1992-11-16 Sony Corp プラスチック製収納器
JPH04339782A (ja) * 1991-05-02 1992-11-26 Hitachi Ltd マガジン
JPH07132990A (ja) * 1993-11-04 1995-05-23 Toyo Jushi Kk エンボステープ等の収納具

Also Published As

Publication number Publication date
WO2003010070A8 (fr) 2004-04-22

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