[go: up one dir, main page]

WO2003019997A1 - Dissipateur thermique ameliore pour dispositifs d'alimentation montes en surface - Google Patents

Dissipateur thermique ameliore pour dispositifs d'alimentation montes en surface Download PDF

Info

Publication number
WO2003019997A1
WO2003019997A1 PCT/US2002/026737 US0226737W WO03019997A1 WO 2003019997 A1 WO2003019997 A1 WO 2003019997A1 US 0226737 W US0226737 W US 0226737W WO 03019997 A1 WO03019997 A1 WO 03019997A1
Authority
WO
WIPO (PCT)
Prior art keywords
pads
thermal transfer
circuit board
printed circuit
heat sink
Prior art date
Application number
PCT/US2002/026737
Other languages
English (en)
Inventor
Alexander Cook
Stephen D. Speck
James G. Campbell
Alexander Isurin
John K. Humphries
Original Assignee
Vanner, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vanner, Inc. filed Critical Vanner, Inc.
Publication of WO2003019997A1 publication Critical patent/WO2003019997A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0455—PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Definitions

  • the invention relates to the cooling of components mounted to printed circuit boards, more particularly to an improved method for cooling surface mounted power devices.
  • PCBs printed circuit boards
  • SMDs surface mounted devices
  • Through-hole electrical and electronic components have closely-pitched electrical contacts designed to be soldered directly to solder pads on the surface of the PCB.
  • through-hole devices have wire leads that are inserted into holes in the PCB, soldered to "lands,” then trimmed close to the PCB.
  • Surface mounted power devices such as, for example, metal oxide field effect transistors (“MOSFETs”), diodes, insulated gate bipolar transistors (“IGBTs”), and power resistors are capable of handling high voltages and currents. Power SMDs permit much higher component densities on PCBs by enabling the components to be mounted much closer together, facilitating the design of a wide variety of products.
  • MOSFETs metal oxide field effect transistors
  • IGBTs insulated gate bipolar transistors
  • power resistors are capable of handling high voltages and currents. Power SMDs permit much higher component densities on PCBs by enabling the components to be mounted much closer together, facilitating the design of
  • a typical byproduct of surface mounted power devices is heat. Industry experience has shown that excess heat is a primary cause of failure for electrical and electronic components.
  • the conventional PCBs to which surface mounted devices are attached are inherently poor thermal conductors. This limitation creates a need to provide a means for cooling surface mounted power devices.
  • conventional cooling techniques such as separate heat sink devices and cooling fans, tend to negate to a large extent the advantages to be realized with the use ofSMD.
  • a particular drawback of the higher component densities associated with surface mounted devices is the corresponding close concentration of heat-dissipating components such as surface mounted power devices. Power dissipation by a greater number of surface mounted power devices in a smaller space results in higher power densities for the PCB, increasing the total amount of heat generated. If this heat energy is not properly dissipated, the operating temperature of the surface mounted devices may rise above the levels recommended by the component manufacturers, adversely affecting circuit reliability, functionality, and performance.
  • the higher power densities associated with surface mounted power devices, coupled with the correspondingly smaller electrical enclosures compounds the need to dissipate heat being generated inside of an enclosure by surface mounted devices.
  • the art contains many means and methods of reducing the operating temperature . within an enclosure.
  • ventilation systems such as fans or even air conditioning systems may be employed to lower the internal temperature of enclosures.
  • this cooling means is not acceptable in many situations due to size, weight, cost, and power consumption constraints.
  • an alternative means for thermal transfer involving conduction, convection, and radiation is employed, commonly called “heat sinking" in the art.
  • a heat sink conducts thermal energy from a heat source to another location for dissipation, usually by convection and radiation to the ambient environment.
  • Heat sinks are typically made of a metal having high thermal conductivity, are somewhat more massive that the device being cooled, and may utilize "fins" to increase the overall surface area of the heat sink for improved dissipation of the thermal energy.
  • the exterior of an enclosure is used as a heat sink.
  • the means of thermal energy transfer to be employed for a particular need should be easily implementable and provide for ease of assembly and disassembly in relation to the circuit board and the components being cooled.
  • the labor and cost savings enjoyed by assembly of PCBs populated with surface mounted power devices should not be compromised by the need to add mechanically complex heat sinks.
  • some through-hole power devices such as power MOSFETs, IGBTs, fast recovery diodes, Schottky diodes, and power resistors are mechanically coupled to the enclosure within which the printed circuit card is mounted. The heat generated by these electrical components is transferred to the enclosure which, in turn, is mechanically coupled to an externally mounted heat sink.
  • the through-hole power devices are provided with a mechanical means, such as a metallic tab with a hole, which enable the devices to be bolted to a heat sink or the side of an enclosure.
  • a mechanical means such as a metallic tab with a hole
  • coupling each of these devices to a heat sink via a bolt or screw is labor intensive.
  • surface mounted power devices such as power MOSFETs
  • What is needed is a cost effective means for providing a thermal path from surface mounted power devices within an enclosure to a heat dissipating means mounted outside of the enclosure.
  • the thermal transfer path should be easy to assemble without adding significantly to the cost or mechanical complexity of the design and provide for even cooling of all power SMDs..
  • the instant invention provides a method for addressing the problem of cooling surface mounted power devices using standard manufacturing techniques in a unique fashion.
  • a set of electrical contacts of a surface mounted power device are soldered to conductive solder pads.
  • the size and arrangement of the solder pads is usually recommended by the power device manufacturer, and often includes a solder pad for a metallic heat sink tab provided with many surface mounted power power devices. During the assembly process this tab is soldered to the solder pad, thus providing good thermal contact between the surface mounted power device and the solder pad to dissipate heat.
  • heat sinking of surface mounted power devices is accomplished by using thick copper solder pads having a large enough surface area to dissipate the heat, since the PCB is thermally isolated. However, this consumes space on the PCB and reduces the number of surface mounted power devices that can be placed on the PCB.
  • the present invention overcomes this limitation by providing thermal coupling of the surface mounted power devices to a remote heat sink by means of a number of plated-through holes which provide thermal conduction from the component side of the PCB to the side opposite thereto.
  • the opposite (“non-component") side of the PCB is provided with thermal transfer pads which are aligned with the solder pads on the component side of the PCB.
  • the solder pads and thermal transfer pads are connected together by densely arranged plated through holes.
  • the thermal transfer pads on the non-component side are thermally coupled to a heat sink, preferably in communication with the outside of the enclosure in which the PCB maybe mounted, i some applications and designs the external heat sink may provide part of the structure of an enclosure.
  • the external heat sink may be configured to be one or more sides of an enclosure.
  • solder pads and plated through holes may be located under the body of a surface mounted power device for cooling purposes. These plated through holes may be utilized in addition to plated through holes located at the electrical contacts, or with surface mounted devices not having a heat sink tab. A thermally conductive adhesive may optionally be provided between the body of the surface mounted power device and the plated through holes if desired, to further increase thermal conductivity.
  • a flexible thermal interface material may optionally be provided between the thermal transfer pads and the heat sink to promote more efficient heat transfer.
  • This flexible, non-electrically conductive material is commercially available in various thicknesses under such trade names as CHO-THERM ® , RAYCHEM ® , THERMALLOY ® , and BERQUISTTM.
  • the brace may be constructed from any rigid material such as aluminum.
  • Another feature of the invention is to provide for an apparatus for cooling surface mounted power devices, comprising a printed circuit board having a component side and a non-component side and a plurality of solder pads placed on said component side of said printed circuit board.
  • the solder pads are shaped to couple to a set of electrical contacts of a surface mounted power device.
  • a plurality of thermal transfer pads are placed on the non- component side of said printed circuit board, with the thermal transfer pads being aligned with said solder pads in parallel planes.
  • a plurality of plated through holes are located at the solder pads and extend therethrough the printed circuit board, and communicate with said solder pads and with said thermal transfer pads; and a thermally conductive heat sink, the heat sink being placed in proximity to said thermal transfer pads and configured to conduct heat away from the surface mounted power device.
  • Figure 1 is a partial plan view of the top, component side of a printed circuit board showing a series of solder pads and plated through holes according to one embodiment of the invention
  • Figure 2 is a partial plan view of the bottom, non-component side of a printed circuit board showing a series of thermal transfer pads and plated through holes according to one embodiment of the invention
  • Figure 3 is an exploded sectional view showing the stack-up of an embodiment of the heat sink assembly for a surface mounted power device
  • Figure 4 is an exploded sectional view showing the stack-up of an alternate embodiment of the heat sink assembly for a surface mounted power device.
  • Figure 5 is a partial, isometric exploded view of one embodiment of the invention.
  • a component side 10 of a printed circuit board 12 is fabricated with a number of plated through holes 14 located at a set of solder pads 26.
  • the plated through holes 14 extend from the solder pads 26 on component side 10 of the printed circuit board 12 to a set of thermal transfer pads 42 on a non-component side 16 of the circuit board.
  • a surface mounted power device 18 is mounted to the component side 10 of printed circuit board 12 by positioning the surface mounted power device such that a tab 22 and a set of electrical contacts 24 of the surface mounted power device are centered over the set of solder pads 26.
  • the tab 22 and electrical contacts 24 are then soldered to the respective solder pads 26 in any conventional manner.
  • the solder pads 26 and thermal transfer pads 42 are continuous, electrically and thermally conductive areas shaped as desired to couple with a surface mounted power device 18.
  • the solder pads 26 and thermal transfer pads 42 may extend beyond the surface mounted power device 18, if desired.
  • Increasing the surface area of the solder pads 26 and thermal transfer pads 42, and increasing the number of plated through holes 14 reduces thermal impedance, thereby improving thermal transfer.
  • the solder pads 26, thermal transfer pads 42, and plated through holes 14 may also be used to form electrical connections to the surface mounted power device 18.
  • the surface area of the pads 26, 42 and the number of plated through holes 14 maybe sized to insure adequate current-carrying capacity for the surface mounted power device 18.
  • a number of plated through holes 44 may be located under the body 20 of the surface mounted power device 18.
  • the plated through holes 44 may include annular rings 28 on the component side 10 of the printed circuit board 12 for increased thermal conductivity between the body 20 and the plated through holes.
  • annular rings 36 may be located with the plated through holes 44 on the non-component side 16 of the printed circuit board 12. Solder pads 26 and thermal transfer pads 42 may optionally be used in place of the annular rings 28, 36.
  • portions of the solder pads 26, thermal transfer pads 42, and the annular rings 28, 36 may be coated with a "solder resist" or "solder mask.”
  • solder resist include wet film, dry film, and liquid photo-imageable film.
  • the solder resist may improve the flatness of the pads and annular rings, which is desired in order to increase the amount of surface area of the pads and annular rings in contact with adjoining surfaces, thereby reducing thermal impedance and increasing thermal conductivity.
  • portions of the plated through holes 14, 44 may contain a thermally conductive "filler” such as bismuth, indium, or solder to increase thermal conductivity.
  • a thermally conductive "filler” such as bismuth, indium, or solder to increase thermal conductivity.
  • the filler does not protrude above the annular rings 28,36 and pads 26,42.
  • Such protrusions can cause irregular contact between the annular rings 28,36, pads 26,42, and surfaces adjoining thereto, reducing area of contact and thus thermal conductivity.
  • Figure 3 shows an exploded section view of an embodiment of the heat sink assembly.
  • a tab 22 and/or electrical contacts 24 of a surface mounted power device 18 are soldered to the solder pads 26 on the component side 10 of a printed circuit board 12.
  • a number of plated through holes 14 are connected to the solder pads 26 and extend between the component side 10 and the non-component side 16 of the printed circuit board 12, connecting to the thermal transfer pads 42 on the non-component side of the printed circuit board.
  • a thermal interface material 30 may optionally be placed against the thermal transfer pads 42 to increase thermal conductivity.
  • Thermal interface material 30 is commercially available in various thicknesses under such trade names as CHO-THERM ® , RAYCHEM ® , THERMALLOY ® , and BERQUISTTM.
  • the thermal interface material 30 may also be formed from suitable ceramics, such as aluminum nitride.
  • Thermal interface material 30 may also optionally provide electrical insulation for the surface mounted power device 18, if needed.
  • a heat sink 32 is placed into contact with the thermal interface material 30 to carry away heat generated by the surface mounted power device 18 by conduction, convection, and radiation.
  • Figure 4 shows an exploded section view of an alternate embodiment of the heat sink assembly.
  • a number of plated through holes 44 are located on the printed circuit board 12 such that the plated through holes are positioned under the body 20 of a surface mounted power device 18.
  • a PCB-contacting surface 34 of the body 20 is placed into contact with the plated through holes 44.
  • a thermal adhesive 46 may optionally be placed between the PCB- contacting surface 34 and the plated through holes 44 to increase thermal conductivity, if desired.
  • the plated through holes 44 may include annular rings 28 on the component side 10 of printed circuit board 12.
  • the annular rings 28 may be any diameter, but are preferably as large a diameter as practical to maximize thermal conductivity between the annular rings 28 and the PCB-contacting surface 34.
  • the non-component side 16 of the printed circuit board 12 may likewise include annular rings 36 for improved thermal conductivity.
  • a solder pad 26 (not shown) shaped to match the PCB-contacting surface 34 may be used rather than annular rings 28 if desired.
  • a thermal transfer pad 42 (not shown) may be used in place of annular rings 36.
  • a thermal interface material 30 may be placed against the annular rings 36 to increase thermal conductivity. Thermal interface material 30 may also be employed to provide electrical insulation for the surface mounted power device 18, if needed. A heat sink 32 is placed into contact with the thermal interface material 30 to carry away heat generated by the surface mounted power device 18 by conduction, convection, and radiation.
  • FIG. 5 is a partial, exploded view of one embodiment of the invention.
  • Surface mounted power devices 18 are mounted to the component side 10 of the printed circuit board 12 such that the tabs 22 and electrical contacts 24 of the surface mounted power devices are placed into contact with the solder pads 26 and the plated through holes 14.
  • Thermal interface material 30 is shown placed against the thermal transfer pads 42 (not shown) on the non-component side 16 of the printed circuit board 12.
  • a brace 38 is shown as placed over the surface mounted power devices 18 and secured to a heat sink 32 by a plurality of screws 40 or other fastening means.
  • the brace 38 When the screws 40 are tightened, the brace 38 is placed into contact with the body 20 of the surface mounted power devices 18, pressing the thermal interface material 30 into intimate contact with the thermal transfer pads 42 (not shown) on the non-component side 16 of the printed circuit board 12, increasing thermal conductivity.
  • the thermal interface material 30 is also placed into contact with the heat sink 32, further increasing thermal conductivity.
  • thermal energy generated by the surface mounted power device 18 is conducted to the tab 22 and the electrical contacts 24.
  • the thermal energy is then conducted to the plated through holes 14, which further conduct the thermal energy to the thermal transfer pads 42.
  • the thermal energy is transferred to the heat sinlc 32 via thermal interface material 30, which serves to increase thermal conductivity between the heat sink and the thermal transfer pads 42.
  • Thermal interface material 30 may be used as an electrical insulator, if desired.
  • the thermal energy from the surface mounted power device 18 is drawn away in an efficient manner by a heat sinking means that is compatible with surface mounted power devices and does not require extensive mechanical coupling.
  • solder- filled plated through holes 14, 44 can actually improve the thermal conductivity, and thus the heat dissipation efficiency, of the invention.
  • excess solder accumulates at the plated through holes 14, 44 during the soldering process, this can adversely affect the thermal transfer from the plated through holes, through the thermal interface material 30 due to irregular contact between the thermal transfer pads 42 and the heat sink 32.
  • irregular contact can occur between the PCB-contacting surface 34 and the plated through holes 44.
  • larger-sized plated through holes 14, 44 tend to fill and ball up with solder and should be avoided unless using a thicker thermal interface material 30.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention se rapporte à un dissipateur thermique pour dispositifs d'alimentation montés en surface. Selon un mode de réalisation de l'invention, les contacts électriques d'un dispositif d'alimentation monté en surface sont soudés aux coussinets de soudure de la carte de circuit imprimé. La face opposée des éléments non-composants de la carte de circuit imprimé est dotée de coussinets de transfert thermique, lesquels sont alignés sur une surface parallèle aux coussinets de soudure de la face des éléments composants de la carte de circuit intégré. Les coussinets de soudure et les coussinets de transfert thermique sont reliés ensemble au moyen d'un certain nombre de trous métallisés qui forment une voie de transmission thermique. Les coussinets de transfert thermique sont disposés à proximité du dissipateur thermique de manière à favoriser une conductivité thermique élevée entre le dispositif d'alimentation monté en surface et le dissipateur thermique, ce qui permet à la chaleur générée par le dispositif d'alimentation monté en surface d'être conduite vers le dissipateur thermique puis répandue. Un matériau d'interface thermique peut servir à améliorer la conductivité thermique entre les coussinets de transfert thermique et le dissipateur thermique. Une entretoise peut également servir à appliquer une pression sur la carte de circuit imprimé et sur le dissipateur thermique afin de maximiser la conductivité et de faciliter le transfert de chaleur loin des dispositifs d'alimentation montés en surface.
PCT/US2002/026737 2001-08-22 2002-08-22 Dissipateur thermique ameliore pour dispositifs d'alimentation montes en surface WO2003019997A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US31426101P 2001-08-22 2001-08-22
US60/314,261 2001-08-22

Publications (1)

Publication Number Publication Date
WO2003019997A1 true WO2003019997A1 (fr) 2003-03-06

Family

ID=23219239

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/026737 WO2003019997A1 (fr) 2001-08-22 2002-08-22 Dissipateur thermique ameliore pour dispositifs d'alimentation montes en surface

Country Status (1)

Country Link
WO (1) WO2003019997A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2048921A3 (fr) * 2007-10-08 2010-11-24 Honeywell International Inc. Gestion thermique d'un trou dans une garniture
WO2019161970A1 (fr) * 2018-02-20 2019-08-29 Sew-Eurodrive Gmbh & Co. Kg Dispositif, en particulier bloc d'alimentation à découpage
WO2022037733A1 (fr) * 2020-08-17 2022-02-24 MGM COMPRO s.r.o. Regulateur de courant
CN114126366A (zh) * 2017-06-02 2022-03-01 中兴通讯股份有限公司 一种散热结构

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4628407A (en) * 1983-04-22 1986-12-09 Cray Research, Inc. Circuit module with enhanced heat transfer and distribution
JPH0258358A (ja) * 1988-08-24 1990-02-27 Ibiden Co Ltd 電子部品搭載用基板
DE4107312A1 (de) * 1991-03-07 1992-09-10 Telefunken Electronic Gmbh Montageanordnung von halbleiterbauelementen auf einer leiterplatte
US5375039A (en) * 1992-09-29 1994-12-20 Robert Bosch Gmbh Circuit board heat dissipation layering arrangement
DE19506664A1 (de) * 1995-02-25 1996-02-29 Bosch Gmbh Robert Elektrisches Gerät
DE19654353A1 (de) * 1996-12-24 1998-06-25 Bosch Gmbh Robert Montageanordnung eines Halbleiterbauelements auf einer Leiterplatte
EP0920055A2 (fr) * 1997-11-28 1999-06-02 Robert Bosch Gmbh Dispositif de refroidissement pour un composant générant de la chaleur sur un circuit imprimé
DE20100984U1 (de) * 2001-01-19 2001-05-03 Siemens AG, 80333 München Anordnung zur Entwärmung eines Bauelements
JP2001144449A (ja) * 1999-11-17 2001-05-25 Nec Corp 多層プリント配線板およびその放熱構造
US20010026441A1 (en) * 2000-03-29 2001-10-04 Rohm Co., Ltd. Printed wiring board having heat radiating means and method of manufacturing the same

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4628407A (en) * 1983-04-22 1986-12-09 Cray Research, Inc. Circuit module with enhanced heat transfer and distribution
JPH0258358A (ja) * 1988-08-24 1990-02-27 Ibiden Co Ltd 電子部品搭載用基板
DE4107312A1 (de) * 1991-03-07 1992-09-10 Telefunken Electronic Gmbh Montageanordnung von halbleiterbauelementen auf einer leiterplatte
US5375039A (en) * 1992-09-29 1994-12-20 Robert Bosch Gmbh Circuit board heat dissipation layering arrangement
DE19506664A1 (de) * 1995-02-25 1996-02-29 Bosch Gmbh Robert Elektrisches Gerät
DE19654353A1 (de) * 1996-12-24 1998-06-25 Bosch Gmbh Robert Montageanordnung eines Halbleiterbauelements auf einer Leiterplatte
EP0920055A2 (fr) * 1997-11-28 1999-06-02 Robert Bosch Gmbh Dispositif de refroidissement pour un composant générant de la chaleur sur un circuit imprimé
JP2001144449A (ja) * 1999-11-17 2001-05-25 Nec Corp 多層プリント配線板およびその放熱構造
US6335862B1 (en) * 1999-11-17 2002-01-01 Nec Corporation Multilayer printed wiring board provided with injection hole for thermally conductive filler
US20010026441A1 (en) * 2000-03-29 2001-10-04 Rohm Co., Ltd. Printed wiring board having heat radiating means and method of manufacturing the same
JP2001284748A (ja) * 2000-03-29 2001-10-12 Rohm Co Ltd 放熱手段を有するプリント配線板およびその製造方法
DE20100984U1 (de) * 2001-01-19 2001-05-03 Siemens AG, 80333 München Anordnung zur Entwärmung eines Bauelements

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
"APPLYING THERMAL TRANSFER COMPOUND UNDER QUADPACKS", RESEARCH DISCLOSURE, KENNETH MASON PUBLICATIONS, HAMPSHIRE, GB, NR. 319, PAGE(S) 886, ISSN: 0374-4353, XP000160179 *
PATENT ABSTRACTS OF JAPAN vol. 014, no. 225 (E - 0927) 14 May 1990 (1990-05-14) *
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 22 9 March 2001 (2001-03-09) *
PATENT ABSTRACTS OF JAPAN vol. 2002, no. 02 2 April 2002 (2002-04-02) *

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2048921A3 (fr) * 2007-10-08 2010-11-24 Honeywell International Inc. Gestion thermique d'un trou dans une garniture
US8112884B2 (en) 2007-10-08 2012-02-14 Honeywell International Inc. Method for providing an efficient thermal transfer through a printed circuit board
CN114126366A (zh) * 2017-06-02 2022-03-01 中兴通讯股份有限公司 一种散热结构
CN114126366B (zh) * 2017-06-02 2023-03-14 中兴通讯股份有限公司 一种散热结构
WO2019161970A1 (fr) * 2018-02-20 2019-08-29 Sew-Eurodrive Gmbh & Co. Kg Dispositif, en particulier bloc d'alimentation à découpage
WO2022037733A1 (fr) * 2020-08-17 2022-02-24 MGM COMPRO s.r.o. Regulateur de courant
EP4197295A4 (fr) * 2020-08-17 2024-08-21 MGM Compro S.r.o. Regulateur de courant

Similar Documents

Publication Publication Date Title
US20040037044A1 (en) Heat sink for surface mounted power devices
US7646093B2 (en) Thermal management of dies on a secondary side of a package
US5513070A (en) Dissipation of heat through keyboard using a heat pipe
US6922340B2 (en) Stack up assembly
US7742307B2 (en) High performance power device
US5920458A (en) Enhanced cooling of a heat dissipating circuit element
EP0836227A2 (fr) Substrat conducteur de chaleur monté dans un trou de circuit imprimé pour le transfert de chaleur de circuit intégré vers le radiateur
US20030198022A1 (en) Power converter package with enhanced thermal management
JP2004215491A (ja) パワーコンバータ・パッケージ及び温度管理
SK287825B6 (sk) An electronic device
FI88452C (fi) Konstruktion foer att foerbaettra avkylning av en effekttransistor
JPH1093280A (ja) 電磁エネルギ封入特性及び熱除去特性を有する電子装置エンクロージャ
US6097603A (en) Heat sink for direct attachment to surface mount electronic device packages
US7265983B2 (en) Power unit comprising a heat sink, and assembly method
JP2022022924A (ja) 放熱端子付きプリント基板と及び放熱用ヒートシンク
US6778398B2 (en) Thermal-conductive substrate package
EP3533303B1 (fr) Module de puissance
CN204834602U (zh) 大功率半导体和散热器的组装结构
WO2003019997A1 (fr) Dissipateur thermique ameliore pour dispositifs d'alimentation montes en surface
JPH05259669A (ja) 印刷配線基板の放熱構造
US6359784B1 (en) Package for an electrical apparatus and method of manufacturing therefore
CN119181678B (zh) 封装结构
US9431317B2 (en) Power doubler amplifier module with improved solder coverage between a heat sink and a thermal pad of a circuit package
CN117219594A (zh) 散热结构、具有散热结构的表贴式功率器件及封装方法
JP2007043011A (ja) 電子機器の放熱構造

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ OM PH PL PT RO RU SD SE SG SI SK SL TJ TM TN TR TT TZ UA UG UZ VC VN YU ZA ZM ZW

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BY BZ CA CH CN CO CR CU CZ DE DM DZ EC EE ES FI GB GD GE GH HR HU ID IL IN IS JP KE KG KP KR LC LK LR LS LT LU LV MA MD MG MN MW MX MZ NO NZ OM PH PL PT RU SD SE SG SI SK SL TJ TM TN TR TZ UA UG UZ VC VN YU ZA ZM

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LU MC NL PT SE SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

Kind code of ref document: A1

Designated state(s): GH GM KE LS MW MZ SD SL SZ UG ZM ZW AM AZ BY KG KZ RU TJ TM AT BE BG CH CY CZ DK EE ES FI FR GB GR IE IT LU MC PT SE SK TR BF BJ CF CG CI GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: JP

WWW Wipo information: withdrawn in national office

Country of ref document: JP